Modularized heat conduction unit, supercomputing module and supercomputing center

Abstract

The invention relates to the technical field of supercomputing center heat dissipation, and discloses a modular heat conduction unit, a supercomputing module and a supercomputing center, the heat conduction unit comprises a heat conduction plate and at least one heat absorption assembly, the interior of the heat conduction plate is a cavity, the heat absorption assembly comprises a heat absorption block and a coil pipe, and the heat absorption block is fixed in the cavity; at least one of the upper surface and the lower surface of the heat absorption block protrudes out of the surface of the heat conduction plate to serve as a heat conduction face of the heat conduction unit, a flow channel used for containing a heat absorption medium is formed in the heat absorption block, and a flow channel inlet, a flow channel outlet and a filling port are formed in the heat absorption block. One end of the coil pipe is communicated with the runner inlet, and the other end is communicated with the runner outlet; the cavity is filled with a heat-conducting medium, the heat-conducting plate is provided with a heat-conducting medium inlet and a heat-conducting medium outlet, the heat-conducting medium inlet and the heat-conducting medium outlet are communicated with the cavity, and the modularized heat-conducting unit is simple in structure, easy to assemble and good in heat dissipation effect.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of a supercomputing center, and in particular to a modular heat conduction unit, a supercomputing module and a supercomputing center. Background Art

[0002] A supercomputing center is a data center based on supercomputers or large-scale computing clusters. It has the characteristics of high performance, high reliability, high availability and high scalability. It can provide large-scale computing, storage and network services to meet the different needs of users and has been widely used in fields such as artificial intelligence, scientific computing and data analysis.

[0003] In actual use, the supercomputing center consumes a lot of electricity because it needs to perform a lot of calculations. Correspondingly, its operation will also generate a lot of heat. For integrated circuits, if the temperature is too high, it will affect the normal use of the circuit and the performance of the circuit. Therefore, it is necessary to dissipate the heat generated by the operation of the supercomputing center in time to achieve cooling.

[0004] At present, most supercomputing centers are fixed. In this case, we can choose to build supercomputing centers in mountains or underwater, so as to take advantage of the lower natural temperature in the mountains and underwater to facilitate heat dissipation. However, this shortcoming limits the convenience of supercomputing centers. For some occasions that need to be used at any time or on the move, this implementation solution obviously cannot meet the requirements.

[0005] In response to the demand for convenient or mobile use, although some solutions for vehicle-mounted supercomputing centers have emerged in the prior art, the implementation method is to use the carrying space of the vehicle to build the supercomputing center. When it needs to be moved for use, the vehicle can be driven to the corresponding location. In this solution, the heat dissipation structure of the supercomputing center still adopts the traditional air-cooling or water-cooling structure, and the heat dissipation component and the supercomputing PCB unit of the supercomputing center are still an integrated design solution, that is, the vehicle-mounted supercomputing center is a supercomputing center that has been designed, and the vehicle can only realize the movement of the supercomputing center as a whole. The supercomputing PCB unit and its heat dissipation structure are fixed and cannot be disassembled. It is impossible to adjust the heat dissipation component attached to the supercomputing PCB unit according to demand, and it is also impossible to adjust the number of supercomputing PCB units, and thus it is impossible to adjust the assembly scale of the supercomputing center according to application requirements. Summary of the invention

[0006] In view of the shortcomings of the background technology, the present invention provides a heat conduction module and a supercomputing center. The technical problem to be solved is that there is currently a lack of a device that can dissipate heat for a movable supercomputing center, and due to the slow heat dissipation, the supercomputing center is difficult to expand and has low computing power.

[0007] To solve the above technical problems, in the first aspect, the present invention provides a heat conduction unit, comprising a heat conduction plate and at least one heat absorption component; the interior of the heat conduction plate is a cavity; the heat absorption component comprises a heat absorption block and a coil, the heat absorption block is fixed in the cavity, at least one of the upper and lower surfaces of the heat absorption block protrudes from the surface of the heat conduction plate as the heat conduction surface of the heat conduction unit, a flow channel for accommodating a heat absorption medium is provided inside the heat absorption block, a flow channel inlet and a flow channel outlet are provided on the heat absorption block, the coil is located in the cavity, one end of the coil is connected to the flow channel inlet, and the other end is connected to the flow channel outlet; the cavity is filled with a heat conduction medium, and a heat conduction medium inlet and a heat conduction medium outlet are provided on the side wall of the heat conduction plate.

[0008] In a certain embodiment of the first aspect, an inner sealing plate and an end cover are sequentially provided outwardly on one side of the heat absorption block, and the two ends of the coil pass through the end cover and the inner sealing plate in sequence and are connected to the flow channel inlet and the flow channel outlet respectively.

[0009] In a certain embodiment of the first aspect, a filling port is provided on the side of the heat absorbing block facing away from the coil, and a second end cover is matchedly installed on the side.

[0010] In a certain embodiment of the first aspect, two layers of heat absorbing blocks are provided in the heat absorption group, the upper surface of the heat absorbing block located in the upper layer protrudes from the upper surface of the heat conducting plate as the upper heat conducting surface, and the lower surface of the heat absorbing block located in the lower layer protrudes from the lower surface of the heat conducting plate as the lower heat conducting surface.

[0011] The above modular heat conduction unit has the following beneficial effects:

[0012] 1. The heat absorbing medium in the heat absorbing block in the modular heat conduction unit is used to quickly absorb heat from the structure to be dissipated. After the heat absorption is completed, the heat absorbing block quickly transfers the absorbed heat to the heat conducting medium in the cavity, thereby realizing rapid heat absorption and heat conduction;

[0013] 2. The modular heat conduction unit itself can be used in combination with the supercomputing PCB unit of the supercomputing center. When the supercomputing PCB unit needs to be cooled, the modular heat conduction unit only needs to be attached to the supercomputing PCB unit so that the heat conduction surface of the heat conduction unit contacts the chip that needs to be cooled in the supercomputing PCB unit. The number and position of the heat absorption blocks in the heat conduction unit can be designed according to the number and position of the chips that need to be cooled, so that they correspond one to one and match the heat conduction. The heat conduction unit itself is modular in design and can be attached or removed at any time.

[0014] In a second aspect, the present invention provides a supercomputing module, comprising a module box, a modular heat-conducting unit and a PCB unit with a supercomputing function, wherein the modular heat-conducting unit and the PCB unit are stacked in the module box, the lower surface of the heat-absorbing block in the modular heat-conducting unit protrudes from the surface of the heat-conducting plate as a heat-conducting surface, and is in contact with the heating surface of the PCB unit, the number of heat-absorbing blocks in the modular heat-conducting unit is consistent with the number of heating chips in the PCB unit and the positions correspond, an input connector and an output connector are provided on the side of the module box, the input connector is connected to the inlet of the heat-conducting medium, the output connector is connected to the outlet of the heat-conducting medium, and the electrical interface of the PCB unit extends outside the module box.

[0015] The above-mentioned supercomputing module has the following beneficial effects:

[0016] The supercomputing module is built using modular thermal conduction units and PCB units. The supercomputing module can be used independently according to needs. All water and electrical interfaces of the supercomputing module itself are located outside the module box. When in use, you only need to connect the relevant interfaces to external pipes, drive equipment, power supply, etc.

[0017] In a third aspect, the present invention provides a supercomputing module of another structure, comprising a module box, a modular heat-conducting unit and two PCB units with supercomputing functions, wherein the modular heat-conducting unit and the two PCB units are stacked in the module box and the two PCB units are respectively located above and below the modular heat-conducting unit, the upper and lower surfaces of the heat-absorbing block in the modular heat-conducting unit both protrude from the surface of the heat-conducting plate as heat-conducting surfaces, and the two heat-conducting surfaces are respectively attached to the heating surfaces of the two PCB units, the number of heat-absorbing blocks in the modular heat-conducting unit is consistent with the number of heating chips in the PCB unit and the positions correspond, an input connector and an output connector are provided on the side of the module box, the input connector is connected to the inlet of the heat-conducting medium, the output connector is connected to the outlet of the heat-conducting medium, and the electrical interface of the PCB unit extends outside the module box.

[0018] The above-mentioned supercomputing module has the following beneficial effects:

[0019] The supercomputing module is constructed using a modular heat-conducting unit and two PCB units. The supercomputing module itself can be used independently according to needs. The module internally adopts a sandwich structure in which a modular heat-conducting unit is shared by two PCB units, which greatly saves the space required for installation. All water and electrical interfaces of the supercomputing module itself are located outside the module box. When in use, you only need to connect the relevant interfaces to external pipes, drive equipment, power supply, etc.

[0020] In a fourth aspect, the present invention also provides a supercomputing module of a third structure, comprising a module box, two modular heat-conducting units and two PCB units with supercomputing functions, wherein the two modular heat-conducting units and the two PCB units are stacked in the module box, the two PCB units are located in the middle of the module box, and the two modular heat-conducting units are respectively located above and below the two PCB units. Only one surface of the heat-absorbing block in the modular heat-conducting unit protrudes from the surface of the heat-conducting plate as a heat-conducting surface. The heat-conducting surfaces of the two modular heat-conducting units are respectively fitted with the heating surfaces of the two PCB units. The number of heat-absorbing blocks in the two modular heat-conducting units is respectively consistent with the number of heating chips in the two PCB units and the positions correspond. An input connector and an output connector are provided on the side of the module box, the input connector is connected to the inlet of the heat-conducting medium, and the output connector is connected to the outlet of the heat-conducting medium. The electrical interface of the PCB unit extends outside the module box.

[0021] The above-mentioned supercomputing module has the following beneficial effects:

[0022] The supercomputing module is constructed using two modular heat conduction units and two PCB units. The supercomputing module itself can be used independently according to needs, and the two modular heat conduction units and two PCB units are built back to back, which can further ensure the thermal conductivity efficiency. All water and electrical interfaces of the supercomputing module itself are located outside the module box. When in use, you only need to connect the relevant interfaces to external pipes, drive equipment, power supply, etc.

[0023] In the fifth aspect, the present invention also provides a supercomputing module of the fourth structure, including a module box, a modular heat-conducting unit and two PCB units with supercomputing functions, wherein the modular heat-conducting unit and the two PCB units are stacked in the module box, and the two PCB units are respectively located above and below the modular heat-conducting unit, the upper heat-conducting surface and the lower heat-conducting surface of the modular heat-conducting unit are respectively bonded to the heating surfaces of the two PCB units, the number of upper heat-absorbing blocks in the heat-conducting unit is respectively consistent with the number of heating chips in the upper PCB unit and the positions correspond, the number of lower heat-absorbing blocks in the modular heat-conducting unit is respectively consistent with the number of heating chips in the lower PCB unit and the positions correspond, an input connector and an output connector are provided on the side of the module box, the input connector is connected to the inlet of the heat-conducting medium, the output connector is connected to the outlet of the heat-conducting medium, and the electrical interface of the PCB unit extends outside the module box.

[0024] The above-mentioned supercomputing module has the following beneficial effects:

[0025] A supercomputing module is constructed using a heat-conducting unit and two PCB units. The supercomputing module itself can be used independently as needed, and two layers of heat-conducting blocks are arranged inside one heat-conducting unit. When a sandwich structure is adopted, the heat dissipation effect of the two PCB units can be fully guaranteed. All water channels and electrical interfaces of the supercomputing module itself are located outside the module box. When in use, you only need to connect the relevant interfaces to external pipes, drive equipment, power supply, etc.

[0026] In a sixth aspect, based on any one of the aforementioned supercomputing modules, the present invention provides a supercomputing center, comprising a supercomputing device consisting of a cooling device and at least one supercomputing module, the cooling device comprising a circulating pump, an expansion liquid tank and a cooling pipe group, the output connector of the supercomputing module is connected to the input connector via the cooling pipe group, the expansion liquid tank and the circulating pump in sequence to form a cooling circuit.

[0027] The above-mentioned supercomputing center has the following beneficial effects:

[0028] The supercomputing center described in the present invention is composed of supercomputing modules. Based on the modular structure of the supercomputing modules themselves and the modular structure of the heat transfer unit, the supercomputing center can be built and assembled as needed, so that it can meet the application needs of different occasions anytime and anywhere, and has convenience and easy scalability; and on the basis of the heat transfer unit structure of the supercomputing module, a cooling device is added to form a cooling circuit to cool and dissipate the heat transfer medium in the heat transfer unit, thereby further ensuring the heat dissipation effect.

[0029] In a certain embodiment of the sixth aspect, it also includes a mobile vehicle, on which a cooling room and a supercomputing room isolated from each other are provided, the cooling device is located in the cooling room, and the supercomputing device is provided in the supercomputing room.

[0030] The above-mentioned supercomputing center has the following beneficial effects: the mobility of the supercomputing center is achieved through the mobile vehicle; and the cooling device is isolated from the supercomputing device through the on-board space, thereby ensuring the isolation and concentration of heat energy in each space, avoiding mutual influence, and further improving the heat dissipation effect of the supercomputing center. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a structural schematic diagram of Example 1;

[0032] Figure 2 It is a structural schematic diagram of Example 1;

[0033] Figure 3 It is a structural schematic diagram of Example 2;

[0034] Figure 4 It is a structural schematic diagram of Example 2;

[0035] Figure 5 It is a structural schematic diagram of Example 3;

[0036] Figure 6 It is a structural schematic diagram of Example 4;

[0037] Figure 7 It is a structural schematic diagram of Example 5;

[0038] Figure 8 It is a structural schematic diagram of Example 6;

[0039] Fig. 9 This is a schematic diagram of the structure of Example 6. DETAILED DESCRIPTION

[0040] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention.

[0041] Example 1

[0042] like Figure 1 As shown, a modular heat conduction unit comprises a heat conduction plate 1 and at least one heat absorption component 2; the heat conduction plate 1 has a cavity 11 inside, the cavity 11 is filled with a heat conduction medium, the heat conduction plate 1 is provided with a heat conduction medium inlet and a heat conduction medium outlet, and the heat conduction medium inlet and the heat conduction medium outlet are connected with the cavity 11; the heat absorption component 2 comprises a heat absorption block 21 and a coil 22, the heat absorption block 21 is fixed in the cavity 11, at least one of the upper and lower surfaces of the heat absorption block 21 protrudes from the surface of the heat conduction plate 1 as the heat conduction surface of the heat conduction unit, a flow channel for accommodating the heat absorption medium is provided inside the heat absorption block 21, a flow channel inlet 23 and a flow channel outlet 24 are provided on one side of the heat absorption block 21, and a filling port matched with a plugging member is provided on the other side, and the filling port is used to fill the heat absorption medium into the flow channel, the coil 22 is located in the cavity, and one end of the coil 22 is connected with the flow channel inlet 23, and the other end is connected with the flow channel outlet 24; wherein:

[0043] When setting the heat absorbing component 2:

[0044] (1) The heat absorbing block 21 can be provided as one layer or two layers;

[0045] (2) The number and distribution of the heat absorbing blocks 21 in each layer can be selected according to the needs, and the number of the coils 22 matches the number of the heat absorbing blocks 21;

[0046] (3) Figure 1As shown, when the heat absorbing blocks 21 of each layer are distributed in an array, the heat absorbing blocks 21 of two adjacent columns are preferably arranged face to face, so that the coils 22 matching the heat absorbing tubes 21 are located between the two columns of heat absorbing blocks 21, and at the same time, the flow channel inlet 23 and the flow channel outlet 24 of each heat absorbing block 21 are preferably arranged in layers up and down and located on one side of the heat absorbing block 21, so that the connected coils 22 are located on one side of the heat absorbing block 21, so that when the coils 22 connected to the heat absorbing blocks 21 of two adjacent columns are located in the middle, they can be staggered to save space.

[0047] (4) Figure 2 As shown, the structure of the heat absorbing block 21 can be set as follows: an inner sealing plate 25 and an end cover 26 are sequentially provided outwardly on one side of the heat absorbing block 21, and both ends of the coil 22 are respectively connected with the flow channel inlet 23 and the flow channel outlet 24 after passing through the end cover 26 and the inner sealing plate 25 in sequence, and the filling port is set on the side of the heat absorbing block 21 away from the coil 22, and the side is matched with a second end cover 27.

[0048] (5) Figure 2 As shown, when two layers of heat absorbing blocks 21 are provided, the upper surface of the heat absorbing block 21 located in the upper layer protrudes from the upper surface of the heat conducting plate 1 as the upper heat conducting surface, and the lower surface of the heat absorbing block 21 located in the lower layer protrudes from the lower surface of the heat conducting plate 1 as the lower heat conducting surface. The main body parts of the two layers of heat absorbing blocks 21 can be integrally formed, and the upper and lower parts can be matched with their own inner sealing plates 25, end covers 26 and second end covers 27 respectively.

[0049] When setting the heat conducting plate 1:

[0050] like Figure 1 As shown, the heat conducting plate 1 itself can adopt a structure with at least one side being transparent, so that the heat absorbing component in the cavity can be observed, which is convenient for the management and use of the heat absorbing component.

[0051] A handle may be provided on the outside of the heat conducting plate to facilitate taking the modular heat conducting unit.

[0052] The shape and thickness of the heat conducting plate are not limited, and the direction and thickness can be designed according to the application, as long as it can match the structure to be cooled.

[0053] When implementing this embodiment, the sealing performance between the protruding surface of the heat absorbing block and the heat conducting plate should be fully considered, so that when the protruding surface of the heat absorbing block is exposed from the heat conducting plate, the gap between the two will not cause leakage of the heat conducting medium in the cavity.

[0054] Example 2

[0055] like Figure 3-4 As shown, a supercomputing module includes a module box 3, a modular heat conduction unit and a PCB unit 4 with a supercomputing function, wherein the modular heat conduction unit and the PCB unit 4 are stacked in the module box 3;

[0056] The modular heat-conducting unit adopts the design idea in Example 1, and selects a structure in which a plurality of heat-absorbing components 2 are arranged in a single layer inside the modular heat-conducting unit. The lower surface of the heat-absorbing block 21 in the heat-absorbing component 2 protrudes from the surface of the heat-conducting plate 1 as a heat-conducting surface, and is in contact with the heating surface of the PCB unit 4 located below. The number of heat-absorbing blocks 21 in the modular heat-conducting unit is consistent with the number of heating chips 41 in the PCB unit 4 and the positions correspond. An input connector 31 and an output connector 32 are provided on the side of the module box 3. The input connector 31 is connected to the inlet of the heat-conducting medium, and the output connector 32 is connected to the outlet of the heat-conducting medium. The electrical interface of the PCB unit 4 extends to the outside of the module box 3.

[0057] When this embodiment is implemented, a handle 33 may be provided on the outside of the module box 3 to facilitate the movement of the supercomputing module.

[0058] When this embodiment is implemented, the module box can be designed as a groove-shaped structure, and the module heat conduction unit is used as the cover of the module box to reduce the manufacturing cost and save space.

[0059] Example 3

[0060] like Figure 5 As shown, a supercomputing module includes a module box 3, a modular heat-conducting unit and two PCB units 4 with supercomputing functions, wherein the modular heat-conducting unit and the two PCB units 4 are stacked in the module box 3 and the two PCB units 4 are respectively located above and below the modular heat-conducting unit;

[0061] The modular heat-conducting unit adopts the design idea in Example 1, and selects a structure in which a single layer of several heat-absorbing components 2 are arranged inside the modular heat-conducting unit. The upper and lower surfaces of the heat-absorbing blocks in the heat-absorbing components 2 protrude from the surface of the heat-conducting plate 1 as heat-conducting surfaces, and the two heat-conducting surfaces are respectively attached to the heating surfaces of the two PCB units 4. The number of heat-absorbing blocks in the modular heat-conducting unit is consistent with the number of heating chips 41 in the PCB unit 4 and the positions correspond. An input connector and an output connector are provided on the side of the module box 3. The input connector is connected to the inlet of the heat-conducting medium, and the output connector is connected to the outlet of the heat-conducting medium. The electrical interface of the PCB unit 4 extends to the outside of the module box 3.

[0062] When this embodiment is implemented, a handle may be provided on the outside of the module box 3 to facilitate the movement of the supercomputing module.

[0063] Example 4

[0064] like Figure 6As shown, a supercomputing module includes a module box 3, two modular heat-conducting units and two PCB units 4 with supercomputing functions, the two modular heat-conducting units and the two PCB units 4 are stacked in the module box 3, the two PCB units 4 are located in the middle of the module box 3, and the two modular heat-conducting units are respectively located above and below the two PCB units 4;

[0065] The modular heat-conducting unit adopts the design idea in Example 1, and selects a structure in which a single layer of several heat-absorbing components 2 are arranged inside the modular heat-conducting unit. The lower surface of the heat-absorbing block in the modular heat-conducting unit located on the upper layer protrudes from the surface of the heat-conducting plate as the lower heat-conducting surface, and the upper surface of the heat-absorbing block in the modular heat-conducting unit located on the lower layer protrudes from the surface of the heat-conducting plate as the upper heat-conducting surface. The heating surface of the PCB unit 4 located on the upper layer faces upward and is in contact with the lower heat-conducting surface, and the heating surface of the PCB unit 4 located on the lower layer faces downward and is in contact with the upper heat-conducting surface. The number of heat-absorbing blocks in the two modular heat-conducting units is consistent with the number of heating chips 41 in the two PCB units 4 and the positions correspond. An input connector and an output connector are provided on the side of the module box 3. The input connector is connected to the inlet of the heat-conducting medium, and the output connector is connected to the outlet of the heat-conducting medium. The electrical interface of the PCB unit 4 extends to the outside of the module box 3.

[0066] When this embodiment is implemented, a handle 33 may be provided on the outside of the module box 3 to facilitate the movement of the supercomputing module.

[0067] When this embodiment is implemented, the heat transfer medium inlet and heat transfer medium outlet of each of the two modular heat transfer units can be connected through pipelines or other feasible methods, and finally converge at the input connector and output connector of the module box, and are connected to the input connector and output connector respectively, thereby minimizing the number of connectors outside the module box.

[0068] Example 5

[0069] like Figure 7 As shown, a supercomputing module includes a module box 3, a modular heat conduction unit and two PCB units 4 with supercomputing functions;

[0070] The modular heat conduction unit and the two PCB units 4 are stacked in the module box 3, and the two PCB units 4 are respectively located above and below the heat conduction unit;

[0071] The modular heat-conducting unit adopts the design idea in Example 1, and selects the heat-absorbing component 2 inside the modular heat-conducting unit as a double-layer structure in which a plurality of heat-absorbing blocks are arranged. The upper surface of the heat-absorbing block located in the upper layer protrudes from the upper surface of the heat-conducting plate as the upper heat-conducting surface, and the lower surface of the heat-absorbing block located in the lower layer protrudes from the lower surface of the heat-conducting plate as the lower heat-conducting surface. The heating surface of the PCB unit located in the upper layer faces downward and is in contact with the upper heat-conducting surface, and the heating surface of the PCB unit located in the lower layer faces upward and is in contact with the lower heat-conducting surface. The number of upper-layer heat-absorbing blocks in the modular heat-conducting unit is respectively consistent with the number of heating chips in the upper-layer PCB unit 4 and the positions correspond. The number of lower-layer heat-absorbing blocks in the modular heat-conducting unit is respectively consistent with the number of heating chips in the lower-layer PCB unit 4 and the positions correspond. An input connector and an output connector are provided on the side of the module box 3. The input connector is connected to the inlet of the heat-conducting medium, and the output connector is connected to the outlet of the heat-conducting medium. The electrical interface of the PCB unit 4 extends to the outside of the module box 3.

[0072] It should be noted that Figure 7 The modular heat conduction unit is a simplified schematic diagram. In actual implementation, it is sufficient as long as the heat absorption blocks 21 can be arranged in two layers in the heat conduction plate 1.

[0073] When this embodiment is implemented, a handle 33 may be provided on the outside of the module box 3 to facilitate the movement of the supercomputing module.

[0074] Example 6

[0075] like Figure 8 As shown, a supercomputing center includes a cooling device 5 and a supercomputing device 6 consisting of at least one supercomputing module; the cooling device 5 includes a circulating pump 51, an expansion liquid tank 52 and a cooling pipe group 53, and the output connector 32 of the supercomputing module is connected to the input connector 31 through the cooling pipe group 53, the expansion liquid tank 52 and the circulating pump 51 in sequence to form a cooling circuit; wherein:

[0076] When setting up a supercomputing device, it is best to set the supercomputing module vertically, that is, the PCB unit and the heat conduction plate are placed vertically; the supercomputing module can be set up in multiple layers and columns.

[0077] The cooling tube group can adopt the coil stacking method, or can adopt other heat transfer tube group setting methods in the heat exchange field.

[0078] In this embodiment, the heat-conducting medium is introduced into the cooling tube group through the circulation pump 51, and then introduced back into the heat-conducting plate, so as to realize the circulation flow of the heat-conducting medium in the cooling circuit, and then the heat-conducting medium takes away the heat energy of the PCB unit absorbed by the heat-absorbing medium, and exchanges heat with the external environment, finally realizing the cooling of the PCB unit.

[0079] When this embodiment is actually used, in some cases, a fan assembly 54 may be further provided to cool the cooling pipe group 53 by air, thereby accelerating the heat exchange between the heat-conducting medium and the external environment.

[0080] In addition, further, in this embodiment, the present invention may also include a temperature detection unit and a control unit. The temperature detection unit is used to detect the temperature of the cooling pipe group 53 and send a temperature detection signal to the control unit. The control unit controls the rotation speed of the circulation pump 51 and the flow rate of the cooling air provided by the fan assembly 54 based on the temperature detection signal.

[0081] In actual use, the rotation speed of the circulation pump 51 and the flow rate of the cooling air provided by the fan assembly 54 can be controlled by detecting the temperature of the cooling tube group 53. When the temperature of the cooling tube group 53 is high, the rotation speed of the circulation pump 51 and the flow rate of the cooling air provided by the fan assembly 54 can be increased. This can increase the flow rate of the heat-conducting medium, transfer the heat absorbed by the heat-absorbing medium more quickly, and reduce the temperature of the heat-conducting medium in the cooling tube group 53 more quickly, thereby achieving faster cooling.

[0082] In addition, in this embodiment, Fig. 9 As shown, a mobile vehicle 7 may also be included, on which a cooling chamber 71 and a supercomputing chamber 72 isolated from each other are provided, the cooling device 5 is located in the cooling chamber 71 , and the supercomputing device 6 is located in the supercomputing chamber 72 .

[0083] The mobility of the supercomputing center is achieved through the mobile vehicle; and the cooling device is isolated from the supercomputing device through the vehicle space, ensuring the isolation and concentration of heat energy in each space, avoiding mutual influence, and further improving the heat dissipation effect of the supercomputing center. And it has been verified by experiments that when the modular heat conduction unit described in the present invention is used, almost no heat is generated in the indoor space of the supercomputing room, and most of the heat generated by the PCB unit is directly introduced into the cooling circuit through the heat conduction unit, so that the space of the supercomputing room is basically in a constant temperature state.

[0084] To sum up, the modular heat-conducting unit described in the present invention can be arbitrarily matched with the supercomputing PCB unit to form a portable supercomputing module. When it is necessary to build a supercomputing center, the number of supercomputing modules can be selected according to actual needs; each supercomputing module can select any one of the methods given in Examples 2-5, or other combinations. When other combinations are adopted, it is sufficient to ensure that the heat-conducting surface of the modular heat-conducting unit can match and fit the number and position of the heat-generating surface of the chip in the PCB unit; and different design schemes can be adopted inside different supercomputing modules, and it is not required that all supercomputing modules are exactly the same.

[0085] From the above description, it can be seen that the supercomputing center design scheme proposed in the present invention can conveniently realize the free modular combination construction of the supercomputing center. Users can use the modular heat conduction unit and the supercomputing module composed of it to build a supercomputing device anytime and anywhere according to their needs. Finally, they only need to connect the electrical interface and pipeline interface of the supercomputing device with the external control device, power supply, and medium source, thereby fully realizing the convenient combination function.

[0086] The above is based on the present invention as an inspiration. Through the above description, relevant staff can make various changes and modifications without departing from the technical idea of ​​this invention. The technical scope of this invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A modular heat transfer unit, characterized in that: It comprises a heat conducting plate (1) and at least one heat absorbing component (2); The interior of the heat conducting plate (1) is a cavity (11); The heat absorption assembly (2) comprises a heat absorption block (21) and a coil (22); the heat absorption block (21) is fixed in the cavity (11); at least one of the upper and lower surfaces of the heat absorption block (21) protrudes from the surface of the heat conduction plate (1) as a heat conduction surface of the heat conduction unit; a flow channel for accommodating a heat absorption medium is provided inside the heat absorption block (21); a flow channel inlet (23) and a flow channel outlet (24) are provided on the heat absorption block (21); the coil (22) is located in the cavity; one end of the coil (22) is connected to the flow channel inlet (23), and the other end is connected to the flow channel outlet (24); The cavity (11) is filled with a heat-conducting medium, and a heat-conducting medium inlet and a heat-conducting medium outlet are provided on the heat-conducting plate (1), and the heat-conducting medium inlet and the heat-conducting medium outlet are in communication with the cavity (11).

2. A modular heat transfer unit according to claim 1, characterized in that: An inner sealing plate (25) and an end cover (26) are sequentially provided outwardly on one side of the heat absorbing block (21); and two ends of the coil (22) pass through the end cover (26) and the inner sealing plate (25) in sequence and are respectively connected to the flow channel inlet (23) and the flow channel outlet (24).

3. A modular heat transfer unit according to claim 2, characterized in that: A filling port is provided on the side of the heat absorbing block (21) facing away from the coil (22), and a second end cover (27) is matched and mounted on the side.

4. A modular heat transfer unit according to claim 1, characterized in that: The heat absorption assembly (2) is provided with two layers of heat absorption blocks (21), the upper surface of the heat absorption block located in the upper layer protrudes from the upper surface of the heat conduction plate (1) as an upper heat conduction surface, and the lower surface of the heat absorption block located in the lower layer protrudes from the lower surface of the heat conduction plate (1) as a lower heat conduction surface.

5. A supercomputing module comprising the modular heat conduction unit according to claim 1, characterized in that: The invention comprises a module box (3), a modular heat conduction unit and a PCB unit (4) with a supercomputing function, wherein the modular heat conduction unit and the PCB unit (4) are stacked and arranged in the module box (3); the lower surface of the heat absorption block (21) in the modular heat conduction unit protrudes from the surface of the heat conduction plate as a heat conduction surface and fits with the heating surface of the PCB unit (4); the number of the heat absorption blocks (21) in the modular heat conduction unit is consistent with the number of the heating chips (41) in the PCB unit (4) and the positions are corresponding; an input connector (31) and an output connector (32) are provided on the side of the module box (3); the input connector (31) is connected to the inlet of the heat conduction medium, and the output connector (32) is connected to the outlet of the heat conduction medium; the electrical interface of the PCB unit (4) extends to the outside of the module box (3).

6. A supercomputing module comprising the modular heat conduction unit according to claim 1, characterized in that: The invention comprises a module box (3), a modular heat conduction unit and two PCB units (4) with supercomputing functions, wherein the modular heat conduction unit and the two PCB units (4) are stacked in the module box (3) and the two PCB units (4) are respectively located above and below the modular heat conduction unit, the upper and lower surfaces of a heat absorption block (21) in the modular heat conduction unit both protrude from the surface of a heat conduction plate (1) as heat conduction surfaces, and the two heat conduction surfaces are respectively in contact with the heating surfaces of the two PCB units (4), the number of the heat absorption blocks (21) in the modular heat conduction unit is consistent with the number of the heating chips (41) in the PCB unit (4) and the positions are corresponding, the side surface of the module box (3) is provided with an input connector (31) and an output connector (32), the input connector (31) is connected to a heat conduction medium inlet, and the output connector (32) is connected to a heat conduction medium outlet, and the electrical interface of the PCB unit (4) extends outside the module box (3).

7. A supercomputing module comprising the modular heat conduction unit according to claim 1, characterized in that: The invention comprises a module box (3), two modular heat-conducting units and two PCB units (4) with supercomputing functions, wherein the two modular heat-conducting units and the two PCB units (4) are stacked and arranged in the module box (3), the two PCB units (4) are located in the middle of the module box (3), the two modular heat-conducting units are located above and below the two PCB units (4), respectively, the heat-absorbing block in the modular heat-conducting unit has only one surface protruding from the surface of the heat-conducting plate as a heat-conducting surface, and the heat-conducting properties of the two modular heat-conducting units are The surfaces are respectively in contact with the heating surfaces of the two PCB units (4); the number of heat absorbing blocks (21) in the two modular heat-conducting units is respectively consistent with the number of heating chips (41) in the two PCB units (4) and the positions are corresponding; an input connector (31) and an output connector (32) are provided on the side of the module box (3); the input connector (31) is connected to the inlet of the heat-conducting medium, and the output connector (32) is connected to the outlet of the heat-conducting medium; and the electrical interface of the PCB unit (4) extends to the outside of the module box (3).

8. A supercomputing module comprising the modular heat conduction unit according to claim 4, characterized in that: The invention comprises a module box (3), a modular heat-conducting unit and two PCB units (4) with supercomputing functions, wherein the modular heat-conducting unit and the two PCB units (4) are stacked and arranged in the module box (3), and the two PCB units (4) are respectively located above and below the modular heat-conducting unit, and the upper heat-conducting surface and the lower heat-conducting surface of the modular heat-conducting unit are respectively in contact with the heating surfaces of the two PCB units (4), the number of upper heat-absorbing blocks (21) in the modular heat-conducting unit is respectively consistent with the number of heating chips in the upper PCB unit (4) and the positions correspond, and the number of lower heat-absorbing blocks (21) in the modular heat-conducting unit is respectively consistent with the number of heating chips in the lower PCB unit (4) and the positions correspond, and the side of the module box is provided with an input connector and an output connector, the input connector (31) is connected to a heat-conducting medium inlet, and the output connector (32) is connected to a heat-conducting medium outlet, and the electrical interface of the PCB unit (4) extends to the outside of the module box (3).

9. A supercomputing center based on the supercomputing module according to any one of claims 5 to 8, characterized in that: A supercomputing device (6) comprising a cooling device (5) and at least one supercomputing module, wherein the cooling device (5) comprises a circulation pump (51), an expansion liquid tank (52), and a cooling pipe group (53); an output connector (32) of the supercomputing module is connected to an input connector (31) via the cooling pipe group (53), the expansion liquid tank (52), and the circulation pump (51) in sequence, thereby forming a cooling circuit.

10. The supercomputing center according to claim 9, characterized in that: It also comprises a mobile vehicle (7), wherein the mobile vehicle (7) is provided with a cooling chamber (71) and a supercomputing chamber (72) which are isolated from each other, the cooling device (5) is located in the cooling chamber (71), and the supercomputing device (6) is located in the supercomputing chamber (72).

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