Electronic device including antenna structure using movable housing

Abstract

An electronic device according to one embodiment includes: a first housing including a first plate having an opening; a second housing including a second plate spaced apart from the first plate, and coupled to the first housing to be movable relative to the first housing in a first direction or in a second direction opposite to the first direction; and a wireless communication circuit operatively connected to the second board. The second housing includes: an opening formed in the second plate; and a slit formed from an edge of the opening along a surface of the second plate. Other various embodiments are possible.

Description

Technical Field

[0001] Various embodiments of the present invention are directed to electronic devices including antenna structures using a removable housing. Background Art

[0002] An electronic device may communicate with an external electronic device using an antenna for wireless communication. An electronic device such as a smart phone, a tablet computer, or a notebook computer may include multiple antennas for various types of communication with an external electronic device. The electronic device may provide a structure that improves the space efficiency of the arrangement of multiple antennas. Summary of the invention

[0003] Technical issues

[0004] In order to achieve portability and usability of electronic devices, flexible devices capable of providing large-screen displays are being developed. The flexible device may include a structure for providing a state change of the electronic device. Because the structure for providing a state change of the electronic device is included, the installation space for setting an antenna inside the electronic device may be insufficient.

[0005] Various embodiments of the present invention may provide a structure including an antenna structure using a portion of a housing of an electronic device.

[0006] The technical problems to be solved in this document are not limited to the above-mentioned technical problems, and other technical problems not mentioned here will be clearly understood by ordinary technicians in the field to which the present disclosure belongs from the following description.

[0007] Technical Solution

[0008] According to an embodiment, an electronic device may include: a first housing including a first plate including an opening; a second housing including a second plate spaced apart from the first plate and coupled to the first housing to be movable relative to the first housing in a first direction or a second direction opposite to the first direction; and a wireless communication circuit operatively connected to the second plate. According to an embodiment, the second housing may include an opening formed in the second plate and a slit formed from the periphery of the opening along the surface of the second plate. According to an embodiment, an overlapping area of ​​the second plate and the first plate in a first state movable in a first direction among the first direction and the second direction may be smaller than an overlapping area of ​​the second plate and the first plate in a second state movable in a second direction among the first direction and the second direction. According to an embodiment, the wireless communication circuit may communicate with an external electronic device in a specified frequency band through the first plate and the second plate.

[0009] According to an embodiment, an electronic device may include: a first housing including a first plate including an opening; a second housing including a second plate spaced apart from the first plate and coupled to the first housing to be movable relative to the first housing in a first direction or a second direction opposite to the first direction; and a wireless communication circuit operatively connected to the second plate. According to an embodiment, the first housing may include an opening formed in the second plate and a slit formed along a surface of the second plate from a position corresponding to the periphery of the opening. According to an embodiment, an overlapping area of ​​the second plate and the first plate in a first state movable in a first direction among the first and second directions may be smaller than an overlapping area of ​​the second plate and the first plate in a second state movable in a second direction among the first and second directions. According to an embodiment, the wireless communication circuit may communicate with an external electronic device in a specified frequency band through the first and second plates.

[0010] Beneficial Effects

[0011] The electronic device according to the embodiment may use the first and second plates formed of metal included in the first and second cases as antenna radiators.

[0012] According to the embodiment, segmentation may be reduced by using an inner panel as an antenna radiator instead of using a side surface of a case as a segmented antenna, thereby improving aesthetics.

[0013] Effects that can be obtained from the present disclosure are not limited to the above-mentioned effects, and any other effects not mentioned herein will be clearly understood from the following description by those having ordinary skill in the art to which the present disclosure pertains. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0015] Figure 2 is a block diagram of an electronic device for supporting traditional network communication and 5G network communication according to various embodiments.

[0016] Figure 3a is a front view of a first state of the electronic device according to the embodiment.

[0017] Figure 3b is a rear view of the electronic device in a first state according to the embodiment.

[0018] Figure 3c is a front view of the electronic device in a second state according to the embodiment.

[0019] Figure 3d is a rear view of the electronic device in the second state according to the embodiment.

[0020] Figure 4ais an exploded perspective view of an electronic device according to an embodiment.

[0021] Figure 4b It is shown along Figure 3a A cross-sectional view of an example of an electronic device according to an embodiment cut along line AA′.

[0022] Figure 5a A first state in which the rear plate of the electronic device is omitted according to the embodiment is shown.

[0023] Figure 5b A second state in which the rear plate of the electronic device is omitted according to the embodiment is shown.

[0024] Figure 5c Antenna performance in a case where a board including an opening of an electronic device operates as an antenna according to an embodiment is shown.

[0025] Figure 5d Antenna performance is shown in the case where overlapping panels of an electronic device operate as an antenna according to an embodiment.

[0026] Figure 6 is cut along line BB' according to the embodiment Figure 5a A cross-sectional view of an electronic device.

[0027] Figure 7a is a graph illustrating a gain of an antenna using a first board and a second board when the electronic device is in a first state according to an embodiment.

[0028] Figure 7b A magnetic field distribution in a first frequency band of an antenna using a first board and a second board when the electronic device is in a first state according to an embodiment is shown.

[0029] Figure 7c A current distribution of an antenna using a first board and a second board in a second frequency band when the electronic device is in a first state according to an embodiment is shown.

[0030] Figure 8a is a graph illustrating a gain of an antenna using a first board and a second board when the electronic device is in a first state according to an embodiment.

[0031] Figure 8b Magnetic field distribution of an antenna using a first board and a second board in a third frequency band when the electronic device is in a second state according to an embodiment is shown.

[0032] Figure 8c A current distribution of an antenna using a first board and a second board in a fourth frequency band when the electronic device is in a second state according to an embodiment is shown.

[0033] Figure 9aA gain of an antenna operated by a portion of a conductive portion included in a case when the electronic device does not include a connection member according to an embodiment is shown.

[0034] Figure 9b A gain of an antenna operated by a portion of a conductive portion included in a case when the electronic device includes a connecting member according to an embodiment is shown.

[0035] Fig.10 A transmission line disposed inside an electronic device is shown.

[0036] Fig.11 It is along Figure 5a Figure 2 shows the extended portion of the cut along line C-C'.

[0037] Fig.12 is an example of deforming the overlapping area between the first plate and the second plate.

[0038] Fig.13 is an example of adjusting the position of the slit formed on the first plate.

[0039] Fig.14a and Fig.14b is an example of adjusting the position of the contact provided between the first plate and the second plate.

[0040] Fig.15 , Fig.16 and Fig.17 is a graph for describing an example of adjusting the resonant frequency of an antenna of an electronic device according to an embodiment. DETAILED DESCRIPTION

[0041] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0042] Reference Figure 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one component (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single component (eg, display module 160).

[0043] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the obtained data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that can operate independently of the main processor 121 or in conjunction with the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121 or to be dedicated to a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

[0044] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 instead of the main processor 121 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. For example, such learning can be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0045] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0046] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0047] The input module 150 may receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0048] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing multimedia or playing records. The receiver may be used to receive incoming calls. Depending on the embodiment, the receiver may be implemented as a separate part from the speaker, or as part of the speaker.

[0049] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display module 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0050] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0051] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a user's state) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0052] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0053] The connection end 178 may include a connector, via which the electronic device 101 may be physically connected to an external electronic device (e.g., the electronic device 102). According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0054] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation recognizable by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0055] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0056] The power management module 188 may manage power supplied to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0057] The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0058] The communication module 190 can support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors that can operate independently of the processor 120 (e.g., an application processor (AP)) and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate via a first network 198 (e.g., a short-range communication network such as Bluetooth TM , Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-distance communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN)))) to communicate with an external electronic device. These various types of communication modules can be implemented as a single component (e.g., a single chip), or can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can use user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196 to identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199).

[0059] The wireless communication module 192 can support 5G networks and next-generation communication technologies (e.g., new radio (NR) access technology) after the 4G network. NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 can support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0060] The antenna module 197 may send a signal or power to the outside of the electronic device 101 (e.g., an external electronic device), or receive a signal or power from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). Then, a signal or power may be sent or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0061] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, an RFIC, and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or is adjacent to the first surface and is capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or is adjacent to the second surface and is capable of transmitting or receiving signals of the specified high frequency band.

[0062] At least some of the above components can be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0063] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic devices 102 or 104 may be a device of the same type or a different type as the electronic device 101. According to an embodiment, all or some operations to be run in the electronic device 101 may be run in one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should automatically perform a function or service or should perform a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service instead of running the function or service, or the electronic device 101 may request the one or more external electronic devices to perform at least part of the function or service in addition to running the function or service. The one or more external electronic devices that receive the request may perform the requested at least part of the function or service, or perform another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request when the result is further processed or when the result is not further processed. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0064] Figure 2 is a block diagram 200 of an electronic device 101 for supporting both traditional network communications and 5G network communications according to various embodiments.

[0065] Reference Figure 2, the electronic device 101 may include a first communication processor 212, a second communication processor 214, a first radio frequency integrated circuit (RFIC) 222, a second RFIC 224 and a third RFIC 226, a fourth RFIC 228, a first radio frequency front end (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module 244 and an antenna 248. The electronic device 101 may further include a processor 120 and a memory 130. The second network 199 may include a first cellular network 292 and a second cellular network 294. According to another embodiment, the electronic device 101 may further include Figure 1 The second network 199 may further include at least one of the components shown in the figure. According to an embodiment, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and the second RFFE 234 may constitute at least a part of the wireless communication module 192. According to another embodiment, the fourth RFIC 228 may be omitted or may be included as a part of the third RFIC 226.

[0066] The first communication processor 212 may support the establishment of a communication channel of a frequency band to be used for wireless communication with the first cellular network 292 and a traditional network communication through the established communication channel. According to various embodiments, the first cellular network 292 may be a traditional network including a second generation (2G), a third generation (3G), a fourth generation (4G) and / or a long term evolution (LTE) network. The second communication processor 214 may support the establishment of a communication channel corresponding to a specified frequency band (e.g., approximately 6 GHz to 60 GHz) among the frequency bands to be used for wireless communication with the second cellular network 294 and a 5G network communication through the established communication channel. According to various embodiments, the second cellular network 294 may be a 5G network defined by 3GPP. In addition, according to an embodiment, the first communication processor 212 or the second communication processor 214 may support the establishment of a communication channel corresponding to another specified frequency band (e.g., approximately 6 GHz or less) among the frequency bands to be used for wireless communication with the second cellular network 294 and a 5G network communication through the established communication channel. According to an embodiment, the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be implemented in a single chip or a single package. Figure 1 The processor 120, the coprocessor 123, or the communication module 190 are formed in a single chip or a single package.

[0067] When transmitting, the first RFIC 222 may convert the baseband signal generated by the first communication processor 212 into a radio frequency (RF) signal of about 700 MHz to about 3 GHz used in the first cellular network 292 (e.g., a legacy network). When receiving, the RF signal may be obtained from the first cellular network 292 (e.g., a legacy network) through an antenna (e.g., the first antenna module 242) and may be pre-processed by an RFFE (e.g., the first RFFE 232). The first RFIC 222 may convert the pre-processed RF signal into a baseband signal for processing by the first communication processor 212.

[0068] When transmitting, the second RFIC 224 may convert the baseband signal generated by the first communication processor 212 or the second communication processor 214 into an RF signal (hereinafter referred to as a 5Gsub6 RF signal) of the Sub6 frequency band (e.g., about 6 GHz or less) used in the second cellular network 294 (e.g., a 5G network). When receiving, the 5G SUB6 RF signal may be obtained from the second cellular network 294 (e.g., a 5G network) through an antenna (e.g., the second antenna module 244) and may be pre-processed by an RFFE (e.g., the second RFFE 234). The second RFIC 224 may convert the pre-processed 5G Sub6 RF signal into a baseband signal to be processed by a corresponding one of the first communication processor 212 or the second communication processor 214.

[0069] The third RFIC 226 may convert the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter referred to as a 5G Above6 RF signal) of a 5G Above6 frequency band (e.g., about 6 GHz to about 60 GHz) to be used in the second cellular network 294 (e.g., a 5G network). Upon reception, the 5G Above6 RF signal may be obtained from the second cellular network 294 (e.g., a 5G network) through an antenna (e.g., antenna 248) and may be pre-processed by the third RFFE 236. For example, the third RFFE 236 may perform pre-processing of the signal by using a phase shifter 238. The third RFIC 226 may convert the pre-processed 5G Above6 RF signal into a baseband signal to be processed by the second communication processor 214. According to an embodiment, the third RFFE 236 may be formed as a part of the third RFIC 226.

[0070] According to an embodiment, the electronic device 101 may include a fourth RFIC 228 that is separate from the third RFIC 226 or at least as a part of the third RFIC 226. In this case, the fourth RFIC 228 may convert the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter, referred to as an intermediate frequency (IF) signal) of an intermediate frequency band (e.g., about 9 GHz to about 11 GHz), and then send the IF signal to the third RFIC 226. The third RFIC 226 may convert the IF signal into a 5G Above 6 RF signal. When receiving, the 5G Above 6 RF signal may be received from the second cellular network 294 (e.g., a 5G network) through an antenna (e.g., antenna 248) and may be converted into an IF signal by the third RFIC 226. The fourth RFIC 228 may convert the IF signal into a baseband signal to be processed by the second communication processor 214.

[0071] According to an embodiment, the first RFIC 222 and the second RFIC 224 may be implemented as at least a portion of a single chip or a single package. According to an embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as at least a portion of a single chip or a single package. According to an embodiment, at least one of the first antenna module 242 or the second antenna module 244 may be omitted or combined with another antenna module to process RF signals of multiple corresponding frequency bands.

[0072] According to an embodiment, the third RFIC 226 and the antenna 248 may be arranged on the same substrate to form a third antenna module 246. For example, the wireless communication module 192 or the processor 120 may be arranged on a first substrate (e.g., a main PCB). In this case, the third RFIC 226 may be arranged in a partial area (e.g., a lower surface) of a second substrate (e.g., a sub-PCB) separated from the first substrate, and the antenna 248 may be arranged in another partial area (e.g., an upper surface) to form a third antenna module 246. According to an embodiment, the antenna 248 may include, for example, an antenna array that can be used for beamforming. By arranging the third RFIC 226 and the antenna 248 on the same substrate, the length of the transmission line between them can be reduced. For example, this can reduce the loss (e.g., attenuation) of signals in a high frequency band (e.g., about 6 GHz to about 60 GHz) for 5G network communications through a transmission line. Therefore, the electronic device 101 can improve the quality or speed of communication with the second cellular network 294 (e.g., a 5G network).

[0073] The second cellular network 294 (e.g., a 5G network) can operate independently of the first cellular network 292 (e.g., a traditional network) (e.g., independent networking (SA)), or be operated to be connected to the first cellular network 292 (e.g., a traditional network) (e.g., non-independent networking (NSA)). For example, in a 5G network, there may be only an access network (e.g., a 5G radio access network (RAN) or a next generation RAN (NG RAN)) without a core network (e.g., a next generation core (NGC)). In this case, after accessing the access network of the 5G network, the electronic device 101 can access an external network (e.g., the Internet) under the control of the core network (e.g., the evolved packet core (EPC)) of the traditional network. Protocol information for communication with the traditional network (e.g., LTE protocol information) or protocol information for communication with the 5G network (e.g., new radio (NR) protocol information) can be stored in the memory 230 and can be accessed by other components (e.g., the processor 120, the first communication processor 212, or the second communication processor 214).

[0074] Figure 3a is a front view of a first state of the electronic device according to the embodiment, Figure 3b is a rear view of the first state of the electronic device according to the embodiment, Figure 3c is a front view of a second state of the electronic device according to the embodiment, Figure 3d is a rear view of the electronic device in the second state according to the embodiment.

[0075] Reference Figure 3a , Figure 3b , Figure 3c and Figure 3d According to the electronic device 300 of the embodiment (for example, Figure 1 The electronic device 101 may include a first housing 310, a second housing 320, and a display 330 (eg, Figure 1 display module 160) and camera 340 (e.g., Figure 1Camera module 180). According to an embodiment, the second housing 320 may be slidable relative to the first housing 310. For example, the second housing 320 may be movable relative to the first housing 310 in a first direction (e.g., +y direction) within a specified distance. When the second housing 320 moves in the first direction, the distance between the side surface 320a of the second housing 320 facing the first direction and the first housing 310 may increase. For another example, the second housing 320 may be movable relative to the first housing 310 in a second direction (e.g., -y direction) opposite to the first direction within a specified distance. When the second housing 320 moves in the second direction, the distance between the side surface 320a of the second housing 320 facing the first direction and the first housing 310 may decrease. According to an embodiment, the second housing 320 may reciprocate linearly relative to the first housing 310 by sliding relative to the first housing 310. For example, at least a portion of the second housing 320 may be inserted into the first housing 310 or may be withdrawn from the first housing 310.

[0076] According to an embodiment, the electronic device 300 may be referred to as a “slidable electronic device” because the second housing 320 is designed to be slidable relative to the first housing 310. According to an embodiment, the electronic device 300 may be referred to as a “rollable electronic device” because at least a portion of the display 330 is designed to be rolled inside the second housing 320 (or the first housing 310) based on the sliding movement of the second housing 320.

[0077] According to an embodiment, the first state of the electronic device 300 may be defined as a state in which the second housing 320 moves in the second direction (e.g., a retracted state or a slid-in state). For example, in the first state of the electronic device 300, it may be substantially immovable in the second direction. In the first state of the electronic device 300, the distance between the side surface 320a of the second housing 320 and the first housing 310 may not be reduced. For another example, in the first state of the electronic device 300, a portion of the second housing 320 may not be insertable. According to an embodiment, the first state of the electronic device 300 may be a state in which the second area 330b of the display 330 is not visually exposed to the outside of the electronic device 300. For example, in the first state of the electronic device 300, the second area 330b of the display 330 may be located in an internal space (not shown) formed by the first housing 310 and / or the second housing 320 of the electronic device 300, and may not be visible outside the electronic device 300.

[0078] According to an embodiment, the second state of the electronic device 300 may be defined as a state in which the second housing 320 moves in the first direction (e.g., a pulled-out state or a slid-out state). For example, in the second state of the electronic device 300, the second housing 320 may be substantially immovable in the first direction. In the second state of the electronic device 300, the distance between the side surface 320a of the second housing 320 and the first housing 310 may not increase. For another example, in the second state of the electronic device 300, a portion of the second housing 320 may not be pulled out from the first housing 310. According to an embodiment, the second state of the electronic device 300 may be a state in which the second area 330b of the display 330 is visually exposed to the outside of the electronic device 300. For example, in the second state of the electronic device 300, the second area 330b of the display 330 may be pulled out from the internal space of the electronic device 300 and visible outside the electronic device 300.

[0079] According to an embodiment, when the second housing 320 moves from the first housing 310 in the first direction, at least a portion of the second housing 320 and / or the second area 330b of the display 330 may be pulled out from the first housing 310 by a pulled-out length d1 corresponding to the moving distance of the second housing 320. According to an embodiment, the second housing 320 may reciprocate within a specified distance d2. According to an embodiment, the pulled-out length d1 may have a size of about 0 to the specified distance d2.

[0080] According to an embodiment, the state of the electronic device 300 may be convertible between the second state and / or the first state by manual operation of a user or automatic operation of a drive module (not shown) provided inside the first housing 310 or the second housing 320. According to an embodiment, the operation of the drive module may be triggered based on user input. According to an embodiment, the user input for triggering the operation of the drive module may include a touch input, a force touch input, and / or a gesture input through the display 330. According to another embodiment, the user input for triggering the operation of the drive module may include a sound input (voice input) or an input of a physical button exposed to the outside of the first housing 310 or the second housing 320. According to an embodiment, the drive module may be driven in a semi-automatic manner in which the operation is triggered when a manual operation by an external force of the user is detected.

[0081] According to an embodiment, the first state of the electronic device 300 may be referred to as a first shape, and the second state of the electronic device 300 may be referred to as a second shape. For example, the first shape may include a normal state, a reduced state, or a closed state, and the second shape may include an open state. According to an embodiment, the electronic device 300 may form a third state (e.g., an intermediate state), which is a state between the first state and the second state. For example, the third state may be referred to as a third shape, and the third shape may include a free stop state.

[0082] According to an embodiment, the display 330 may be visible (or visual) from the outside through the front direction (e.g., -z direction) of the electronic device 300 to display visual information to the user. For example, the display 330 may include a flexible display. According to an embodiment, at least a portion of the display 330 may be disposed in the second housing 320, and may be drawn out from an internal space (not shown) of the electronic device 300 or inserted into the internal space of the electronic device 300 according to the movement of the second housing 320. The internal space of the electronic device 300 may represent a space within the first housing 310 and the second housing 320 formed by the coupling of the first housing 310 and the second housing 320. For example, in the first state of the electronic device 300, at least a portion of the display 330 may be inserted by being rolled into the internal space of the electronic device 300. When the second housing 320 moves in the first direction in a state where at least a portion of the display 330 is inserted into the internal space of the electronic device 300, at least a portion of the display 330 may be drawn out from the internal space of the electronic device 300. For another example, when the second housing 320 moves in the second direction, at least a portion of the display 330 may be inserted into the internal space of the electronic device 300 by being rolled into the electronic device 300. As at least a portion of the display 330 is pulled out or inserted, the area of ​​the display 330 visible outside the electronic device 300 may expand or shrink. According to an embodiment, the display 330 may include a first area 330a and / or a second area 330b.

[0083] According to an embodiment, the first area 330a of the display 330 may represent such an area of ​​the display 330 that is fixedly visible outside the electronic device 300 regardless of whether the electronic device 300 is in the second state or the first state. For example, the first area 330a may represent a partial area of ​​the display 330 that is not rolled into the internal space of the electronic device 300. According to an embodiment, when the second shell 320 moves, the first area 330a may move together with the second shell 320. For example, when the second shell 320 moves in the first direction or the second direction, the first area 330a may move on the front surface of the electronic device 300 together with the second shell 320 in the first direction or the second direction.

[0084] According to an embodiment, the second area 330b of the display 330 may be inserted into the internal space of the electronic device 300 or pulled out from the internal space of the electronic device 300 according to the movement of the second shell 320. For example, in the first state of the electronic device 300, at least a portion of the second area 330b of the display 330 may be in a state of being inserted into the internal space of the electronic device 300 in a curled state. The second area 330b of the display 330 may be inserted into the internal space of the electronic device 300 in the first state of the electronic device 300 and may not be visible from the outside. For another example, in the second state of the electronic device 300, the second area 330b of the display 330 may be in a state of being pulled out from the internal space of the electronic device 300. In the second state, the second area 330b of the display 330 may be visible to the outside of the electronic device 300.

[0085] According to an embodiment, in the first state of the electronic device 300, the area of ​​the display 330 visible from the outside of the electronic device 300 may include only the first area 330a of the display 330. The area of ​​the display 330 visible from the outside of the electronic device 300 in the second state of the electronic device 300 may include at least a portion of the second area 330b of the display 330 and the first area 330a.

[0086] According to an embodiment, the first housing 310 of the electronic device 300 may include a first support member 311 surrounding an inner space of the first housing 310, a rear plate 312 covering a rear surface of the first support member 311, and a first side member 314 covering at least a portion of a periphery of the first support member 311. According to an embodiment, the first support member 311 may be formed integrally with the first side member 314. The first support member 311 may extend from at least a portion of a surface of the first side member 314 facing the inside of the electronic device 300 to the inside of the electronic device 300. According to an embodiment, the first support member 311 and the first side member 314 may be formed integrally or be formed of the same material.

[0087] According to an embodiment, the second housing 320 of the electronic device 300 may include a second supporting member 321 and a second side member 329 covering the inner space of the electronic device 300 .

[0088] According to an embodiment, the second side member 329 may form at least a portion of a side surface of the second housing 320. The second support member 321 may support an electronic device (e.g., a camera 340 and / or a printed circuit board 324) disposed in the second housing 320. The second side member 329 may cover at least a portion of the second support member 321. According to an embodiment, the second support member 321 may be formed integrally with the second side member 329. The second support member 321 may extend from at least a portion of a surface of the second side member 324 facing the interior of the second housing 320 to the interior of the second housing 320. According to an embodiment, the second support member 321 and the second side member 329 may be formed integrally or be formed of the same material.

[0089] According to an embodiment, the second support member 321 may include a first cover region 321a of the second support member 321 that is not inserted into the first housing 310 and a second cover region 321b that is inserted into or withdrawn from the first housing 310. The first cover region 321a of the second support member 321 may always be visible, regardless of whether the electronic device 300 is in the second state or the first state. According to an embodiment, at least a portion of the first cover region 321a of the second support member 321 may form a side surface 320a of the second housing 320. According to an embodiment, the second cover region 321b of the second housing 320 may not be visible in the first state, but may be visible in the second state.

[0090] The camera 340 may obtain an image of an object based on receiving light from the outside of the electronic device 300. According to an embodiment, the camera 340 may include one or more lenses, an image sensor, and / or an image signal processor. According to an embodiment, the camera 340 may be disposed on the second housing 320 to face the rear surface of the electronic device 300, which is opposite to the front surface of the first area 330a of the electronic device 300 where the display 330 is disposed. For example, the camera 340 may be disposed on the second support member 321 of the second housing 320, and when the electronic device 300 is in the first state, the camera 340 may be visible from the outside of the electronic device 300 through the opening 311a formed in the first support member 311. For another example, the camera 340 may be disposed on the second support member 321 of the second housing 320, and when the electronic device 300 is in the first state, the camera 340 is not visible outside the electronic device 300 by being covered by the first support member 311 and / or the back plate 312.

[0091] According to an embodiment, the camera 340 may include a plurality of cameras. For example, the camera 340 may include a wide-angle camera, an ultra-wide-angle camera, a telephoto camera, a proximity camera, and / or a depth camera. However, the camera 340 is not necessarily limited to including a plurality of cameras, and may include one camera.

[0092] According to an embodiment, the camera 340 may further include a camera (not shown) directed toward the front surface of the first area 330a of the electronic device 300 where the display 330 is disposed. When the camera 340 faces the front surface of the electronic device 300, the camera 340 may be an under-display camera (UDC) disposed below the display 330 (e.g., in the +z direction of the display 330), but is not limited thereto.

[0093] According to an embodiment, the electronic device 300 may include a sensor module (not shown) and / or a camera module (not shown) disposed below the display 330. The sensor module may detect the external environment based on information (e.g., light) received by penetrating the display 330. According to an embodiment, the sensor module may include at least one of a receiver, a proximity sensor, an ultrasonic sensor, a gesture sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, a motor encoder, or an indicator. According to an embodiment, at least some sensor modules of the electronic device 300 may be visually exposed to the outside through a partial area of ​​the display 330. According to an embodiment, the electronic device 300 may use a sensor module to detect a withdrawal length (e.g., a length d1). According to an embodiment, the electronic device 300 may generate withdrawal information about the withdrawal degree detected by the sensor. For example, the electronic device 300 may use the withdrawal information to detect and / or check the withdrawal degree of the second housing 320. According to an embodiment, the withdrawal information may include information about the withdrawal length of the second housing 320.

[0094] According to the embodiment, the coupling form of the first housing 310 and the second housing 320 is not limited to Figure 3a , Figure 3b , Figure 3c and Figure 3d The shapes and connections shown are shown, and can be implemented by other shapes or combinations and / or connections of components.

[0095] Figure 4a is an exploded perspective view of an electronic device according to an embodiment, Figure 4b It is shown along Figure 3a A cross-sectional view of an example of an electronic device according to an embodiment cut along line AA′.

[0096] Reference Figure 4a and Figure 4b , the electronic device 300 according to the embodiment may include a first housing 310, a second housing 320, a display 330, a camera 340, a battery 350 (eg, Figure 1According to an embodiment, the first housing 310 and the second housing 320 may be coupled to each other to form an internal space 301 of the electronic device 300. For example, in the first state of the electronic device 300, the second area 330b of the display 330 may be accommodated in the internal space 301.

[0097] According to an embodiment, the first housing 310 may include a first support member 311, a rear plate 312, and / or a third support member 313. According to an embodiment, the first support member 311, the rear plate 312, and the third support member 313 included in the first housing 310 may be coupled to each other, and may not move when the second housing 320 moves relative to the first housing 310. According to an embodiment, the first support member 311 may form at least a portion of the outer surface of the electronic device 300. For example, the first support member 311 may form at least a portion of the side surface of the electronic device 300, and may form at least a portion of the rear surface of the electronic device 300. According to an embodiment, the first support member 311 may provide a surface on which the rear plate 312 is mounted. The rear plate 312 may be mounted on the surface of the first support member 311.

[0098] According to an embodiment, the third support member 313 may support internal components of the electronic device 300. For example, the third support member 313 may accommodate a battery 350 and a motor 361 of a drive unit 360. The battery 350 and the motor 361 may be accommodated in at least one of a recess or a hole included in the third support member 313. According to an embodiment, the third support member 313 may be surrounded by the first support member 311. For example, in the first state of the electronic device 300, a surface 313a of the third support member 313 on which the battery 350 is disposed may face the first support member 311 and / or the second region 330b of the display 330. For another example, in the first state of the electronic device 300, another surface 313b of the third support member 313 facing in a direction opposite to the surface 313a of the third support member 313 may face the first region 330a of the display 330 or the second support member 321. For example, the third support member 313 may include aluminum as a material, but is not limited thereto.

[0099] According to an embodiment, the second housing 320 may include a second support member 321, a back cover 322, and / or a slide cover 323. According to an embodiment, the second support member 321, the back cover 322, and the slide cover 323 may be coupled to each other and may move together with the second housing 320 when the second housing 320 moves relative to the first housing 310. The second support member 321 may support internal components of the electronic device 300. For example, electronic components (e.g., Figure 1A printed circuit board 324 and / or a camera 340 of a processor 120 of the second support member 321 may be disposed on a surface 321c of the second support member 321 facing the inner space 301. When the electronic device 300 is in the first state, another surface 321d of the second support member 321 facing the direction opposite to the surface 321c of the second support member 321 may face the first area 330a of the display 330. According to an embodiment, a back cover 322 may be coupled to the second support member 321 to protect components of the electronic device 300 disposed on the second support member 321. For example, the back cover 322 may cover a portion of the surface 321c of the second support member 321. According to an embodiment, a slide cover 323 may be disposed on the back cover 322 to form an outer surface of the electronic device 300 together with the back plate 312 and the first support member 311. The slide cover 323 may be coupled to a surface of the back cover 322 or the second support member 321 to protect the back cover 322 and / or the second support member 321.

[0100] According to an embodiment, when the electronic device 300 is in the first state, the display 330 may be bent by at least partially rolling into the internal space 301. According to an embodiment, the display 330 may cover at least a portion of the third support member 313 and at least a portion of the second support member 321. For example, when the electronic device 300 is in the first state, the display 330 may cover another surface 321d of the second support member 321, pass between the second support member 321 and the first support member 311, and extend toward the internal space 301. At least a portion of the display 330 may surround at least a portion of the third support member 313 after passing between the second support member 321 and the first support member 311. The display 330 may cover the surface 313a of the third support member 313 within the internal space 301. According to an embodiment, when the second housing 320 moves in the first direction, the second region 330b of the display 330 may be drawn out of the internal space 301. For example, as the second housing 320 moves in the second direction, the display 330 may be withdrawn from the internal space 301 by passing between the second supporting member 321 and the first supporting member 311 .

[0101] According to an embodiment, the electronic device 300 may include a support rod 331 and a guide rail 332 supporting the display 330. For example, the support rod 331 may include a plurality of rods coupled to each other, and may be manufactured in a shape corresponding to the shape of the second region 330b of the display 330. According to an embodiment, as the display 330 moves, the support rod 331 may move with the display 330. According to an embodiment, in a first state in which the second region 330b of the display 330 is rolled up in the internal space 301, the support rod 331 may be rolled up in the internal space 301 together with the second region 330b of the display 330. As the second housing 320 moves in the first direction, the support rod 331 may move together with the second region 330b of the display 330. According to an embodiment, the guide rail 332 may guide the movement of the support rod 331. For example, as the display 330 moves, the support rod 331 may move along the guide rail 332 coupled to the third support member 313. According to an embodiment, the guide rail 332 may be coupled to the third support member 313 or the first support member 311. For example, the guide rail 332 may include a plurality of guide rails 332 spaced apart from each other at two peripheries of the third support member 313 spaced apart from each other in a third direction (eg, +x direction) perpendicular to the first direction.

[0102] According to an embodiment, the driving unit 360 may provide a driving force to the second housing 320 so that the second housing 320 may move relative to the first housing 310. According to an embodiment, the driving unit 360 may include a motor 361, a pinion gear 362, and / or a rack gear 363. The motor 361 may receive power from the battery 350 and provide a driving force to the second housing 320. According to an embodiment, the motor 361 may be disposed in the first housing 310 and may not move when the second housing 320 moves relative to the first housing 310. For example, the motor 361 may be disposed in a recess formed in the third support member 313. According to an embodiment, the pinion gear 362 may be coupled to the motor 361 and may rotate by a driving force provided from the motor 361. According to an embodiment, the rack gear 363 is meshed with the pinion gear 362 and may move according to the rotation of the pinion gear 362. For example, the rack gear 363 may reciprocate linearly in the first direction or the second direction according to the rotation of the pinion gear 362. According to an embodiment, the rack gear 363 may be disposed in the second housing 320. For example, the rack gear 363 may be coupled to the second supporting member 321 included in the second housing 320. According to an embodiment, the rack gear 363 may be movable within the operation space 313p formed in the third supporting member 313.

[0103] According to an embodiment, when the pinion 362 is rotated in the first rotation direction (e.g., Figure 4bWhen the rack gear 363 rotates in the first direction (for example, clockwise in the +y direction), the rack gear 363 can move in the first direction (for example, the +y direction). When the rack gear 363 moves in the first direction, the second housing 320 coupled to the rack gear 363 can move in the first direction. As the second housing 320 moves in the first direction, the area of ​​the display 330 visible from the outside of the electronic device 300 can expand. When the pinion 362 rotates in the second rotation direction (for example, clockwise in the +y direction), the rack gear 363 can move in the first direction (for example, the +y direction). Figure 4b When the rack gear 363 rotates in the second direction (for example, counterclockwise in the middle), the rack gear 363 may move in the second direction (for example, the -y direction). When the rack gear 363 moves in the second direction, the second housing 320 coupled to the rack gear 363 may move in the second direction. As the second housing 320 moves in the second direction, the area of ​​the display 330 visible from the outside of the electronic device 300 may decrease.

[0104] In the above description, it has been described that the motor 361 and the pinion gear 362 are disposed in the first housing 310, and the rack gear 363 is disposed in the second housing 320, but the embodiment may not be limited thereto. According to the embodiment, the motor 361 and the pinion gear 362 may be disposed in the second housing 320, and the rack gear 363 may be disposed in the first housing 310.

[0105] Figure 5a A first state in which the rear plate of the electronic device is omitted according to the embodiment is shown. Figure 5b A second state in which the rear plate of the electronic device is omitted according to the embodiment is shown.

[0106] Reference Figure 5a and Figure 5b , the electronic device 300 may include a first shell 310 and a second shell 320 .

[0107] According to an embodiment, the first housing 310 may be a fixed housing of the electronic device 300 and may accommodate a portion of the second housing 320. The first housing 310 may be referred to as an outer housing. The second housing 320 may be referred to as an inner housing.

[0108] According to an embodiment, the second housing 320 may linearly reciprocate relative to the first housing 310. The second housing 320 may be coupled to the first housing 310 to be movable relative to the first housing 310 in a first direction (+y direction) or a second direction (-y direction) opposite to the first direction (+y direction).

[0109] According to an embodiment, the interior of the first housing 310 and the interior of the second housing 320 may be connected to each other. As the second housing 320 moves, the space formed by the first housing 310 and the second housing 320 may change. Components of the electronic device 300 may be disposed in the space formed by the first housing 310 and the second housing 320. For example, the components may include a display 330 (e.g., Figure 3a A portion of the display 330) (e.g., Figure 3c The second area 330b), a battery, a drive unit (eg, Figure 4a The first printed circuit board 324 may be disposed in the second housing 320. The second printed circuit board 530 may be disposed in the first housing 310.

[0110] According to an embodiment, the first housing 310 may include a first support member 311. The first housing 310 may include a first plate 501 having an opening 510 formed on a surface of the first support member 311. For example, the opening 510 may overlap with a wireless charging circuit 590 provided in the first housing 310 or the second housing 320. The wireless charging circuit 590 may be provided on the second plate 502 of the second housing 320 to overlap with the opening 510 in the first state. For another example, the wireless charging circuit 590 may be provided on a dielectric filling the opening 510 formed in the first plate 501.

[0111] In an embodiment, the second housing 320 may have a second plate 502 parallel to the first plate 501. The first plate 501 and the second plate 502 may include a conductive member. For example, the first plate 501 and the second plate 502 may be conductive plates. The first plate 501 and the second plate 502 may operate as an antenna by interacting with each other. For example, the second plate 502 may be electrically coupled to the first plate 501 by a current applied to the first plate 501.

[0112] According to an embodiment, the first board 501 and the second board 502 operating as antennas may be electrically connected to the wireless communication circuit. The first printed circuit board 324 may be electrically connected to the second printed circuit board 530. The second printed circuit board 530 may include an extension portion 540 extending toward the slit 520. The second printed circuit board 530 may be electrically connected to the slit 520 formed in the first board 501 through the extension portion 540. The extension portion 540 may include a portion of a signal line of the second printed circuit board 530. The extension portion 540 may be a flexible printed circuit board extending from the second printed circuit board 530. According to an embodiment, the extension portion 540 may be formed separately from the second printed circuit board 530 and coupled to the second printed circuit board 530.

[0113] According to an embodiment, a portion of the conductive member included in the extension portion 540 may be at least partially removed from the power supply region 546. For example, another conductive member other than the signal line within the extension region 540, such as a ground layer, may be removed from the power supply region 546 of the extension region 540.

[0114] According to an embodiment, the slit 520 of the first board 501 has been described as being fed in the power supply area 546 by the extension portion 540 extending from the second printed circuit board 530, but is not limited thereto. For example, the slit 520 may be fed from a cable electrically connecting the first printed circuit board 324 and the second printed circuit board 530 or another printed circuit board. For another example, the slit 520 may not be formed in the first board 501, but may be formed in the second board 502. Power may be supplied to the slit formed in the second board 502. The slit may be fed from a cable electrically connecting the first printed circuit board 324 and the second printed circuit board 530 or another printed circuit board.

[0115] According to an embodiment, the second printed circuit board 530 may be disposed on the first plate 501 of the first housing 310. For example, the second printed circuit board 530 may be disposed between the first plate 501 and the rear plate 312. The second printed circuit board 530 may be disposed adjacent to the lower portion of the electronic device 300. The second printed circuit board 530 may be disposed adjacent to the periphery of the first housing 310. The first housing 310 may include a first periphery 310a parallel to the direction in which the second housing 320 moves, a second periphery 310b facing the first periphery 310a, a third periphery 310c extending from one end of the first periphery 310a to one end of the second periphery 310b in a direction perpendicular to the first periphery 310a, and a fourth periphery 310d extending from the other end of the first periphery 310a to the other end of the second periphery 310b. The second printed circuit board 530 may be disposed closer to the fourth periphery 310d than to the third periphery 310c of the first housing 310.

[0116] According to an embodiment, the second printed circuit board 530 may be connected to the first printed circuit board 324 through an additional board or cable. In an embodiment, the second printed circuit board 530 may supply power to the slit 520 through an extension portion 540, which is spaced apart from the first periphery 310a on the first board 501 and extends to the power supply area 546 along the first periphery 310a. For example, the extension portion 540 may extend along the periphery of the opening 510 formed in the first board 501, and supply power through a portion overlapping with the slit 520. According to an embodiment, the slit 520 may extend from a periphery of the opening 510 facing the first direction along the first direction. For example, the slit 520 may extend from a periphery of the opening 510 parallel to the third periphery 310c along the first direction. The length or width of the slit 520 may vary based on the supported frequency band.

[0117] According to an embodiment, the first plate 501 including the conductive member may include an opening 510 and a slit 520. The first plate 501 may be fed through the slit 520. The first plate 501 overlapping the second plate 502 may be coupled to the second plate 502 by feeding through the slit 520. The first plate 501 and the second plate 502 coupled to each other may operate as antenna radiators. For example, the first plate 501 and the second plate 502 may be spaced apart in parallel with each other and may operate similarly to a cavity antenna in the overlapping region 550A.

[0118] According to an embodiment, in Figure 5a In the first state where the second housing 320 is inserted into the first housing 310, the first plate 501 and the second plate 502 may overlap in a wider area than in the second state. Figure 5b In the second state in which the second housing 320 is drawn out from the first housing 310 , the first plate 501 and the second plate 502 may overlap in a narrower region than in the first state.

[0119] According to an embodiment, in the first state, the overlap area 550A of the first plate 501 and the second plate 502 may operate as an antenna and may have a wider radiation volume than in the second state. In the first state of the electronic device 300, at least one processor (e.g., Figure 1 processor 120, Figure 2 The first communication processor 212 or the second communication processor 214) can communicate with the external electronic device in the first frequency band lower than the second state through the first board 501 and the second board 502 operating as antennas.

[0120] According to an embodiment, in the second state, the overlap region 550B of the first plate 501 and the second plate 502 may operate as an antenna and may have a narrower radiation volume than in the first state. In the second state of the electronic device 300, at least one processor (e.g., Figure 1 processor 120, Figure 2 The first communication processor 212 or the second communication processor 214) can communicate with an external electronic device in a second frequency band higher than the first state through the overlapping area 550B of the first board 501 and the second board 502 operating as an antenna.

[0121] The electronic device 300 according to the above embodiment can reduce the antenna module components by providing an antenna using overlapping housings. By reducing the components mounted on the electronic device 300, the utilization rate of the internal space can be improved.

[0122] Figure 5c Antenna performance in a case where a board including an opening of an electronic device operates as an antenna according to an embodiment is shown. Figure 5d Antenna performance is shown in the case where overlapping panels of an electronic device operate as an antenna according to an embodiment.

[0123] Reference Figure 5c , it is assumed that only the first plate 501 including the opening 510 operates as an antenna. The first plate 501 may operate as a slot antenna. The first plate 501 may be fed in the form of spanning the opening 510 of the first plate 501 .

[0124] When only the first board 501 operates as an antenna, the antenna may include a first resonant frequency 501A and a second resonant frequency 501B. The first resonant frequency 501A may be about 1800 MHz, and the second resonant frequency 501B may be about 3800 MHz.

[0125] Reference Figure 5d , when the first plate 501 and the second plate 502 overlap each other, it is assumed that the first plate 501 and the second plate 502 operate as antennas. The first plate 501 and the second plate 502 may operate as cavity antennas. At a specific frequency, the first plate 501 may operate as a slot antenna through an opening formed in the first plate 501.

[0126] When the first plate 501 and the second plate 502 operate as an antenna, the antenna may include a plurality of resonant frequencies 502A, 502B, 502C, 502D, and 502E. The first resonant frequency 502A may be about 1000 MHz, the second resonant frequency 502B may be about 2800 MHz, the third resonant frequency 502C may be about 3700 MHz, the fourth resonant frequency 502D may be about 4000 MHz, and the fifth resonant frequency 502E may be about 4700 MHz.

[0127] According to an embodiment, the first resonant frequency 502A, the second resonant frequency 502B, the fourth resonant frequency 502D, and the fifth resonant frequency 502E may be determined by cavity resonance generated by the first plate 501 and the second plate 502 disposed in parallel with each other. According to an embodiment, the third resonant frequency 502D may be determined by a slot resonance generated by an opening of the first plate 501. Figure 5d The third resonant frequency 502D can be related to Figure 5c The second resonant frequency 501B is substantially the same.

[0128] Figure 6 is cut along line BB' according to the embodiment Figure 5a A cross-sectional view of an electronic device.

[0129] Reference Figure 6, may include a connection member 580 connecting the first plate 501 and the second plate 502. The connection member 580 may adjust the grounding position of the first plate 501 and the second plate 502.

[0130] According to an embodiment, a connection member 580 connected to a ground portion of the electronic device 300 may be provided in the second housing 320 movable relative to the first housing 310. The connection member 580 may reduce the influence of an antenna located at a lower end (e.g., a second direction) of the electronic device 300. For example, since the connection member 580 may be connected to the ground portion, current flow may not occur in an area located around the first plate 501, the second plate 502, and the connection member 580. When the antenna including the conductive portion is driven, parasitic resonance that may occur in the first plate 501 and the second plate may be reduced.

[0131] According to an embodiment, the connection member 580 of the electronic device 300 may be a grounding portion of the first plate 501 and the second plate 502. According to the position of the connection member 580, the electrical length of the first plate 501 and the second plate 502 operating as antennas may be adjusted. According to an embodiment, the connection member 580 may be disposed in an area including a periphery perpendicular to the periphery of the opening 510 in which the slit 520 is formed. The connection member 580 may be plural and may include a first connection member and a second connection member. For example, the connection member 580 may include a first connection member and a second connection member, the first connection member being disposed between the first plate and the second plate in an area including a second periphery among the peripheries perpendicular to the peripheries of the opening in which the slit is formed, and the second connection member being disposed between the first plate and the second plate in an area including a third periphery facing the second periphery.

[0132] According to the above embodiment, the electronic device 300 can reduce the influence caused by the antenna disposed at the bottom of the electronic device 300 by disposing a connection member 580 between the first plate 501 and the second plate 502. The connection member 580 can adjust the resonant frequency by adjusting the electrical length of the first plate 501 and the second plate 502.

[0133] Figure 7a is a graph illustrating a gain of an antenna using a first board and a second board when the electronic device is in a first state according to an embodiment. Figure 7b A magnetic field distribution in a first frequency band of an antenna using a first board and a second board when the electronic device is in a first state according to an embodiment is shown. Figure 7c A current distribution of an antenna using a first board and a second board in a second frequency band when the electronic device is in a first state according to an embodiment is shown.

[0134] Reference Figure 7a, a graph 701 shows the gain of an antenna using an overlapping region 550A of a first plate 501 and a second plate 502 in a first state in which the second housing 320 is inserted into the first housing 310. In the first state, the overlapping region 550A may have a first resonant frequency 701a and a second resonant frequency 701b. The first resonant frequency 701a may be about 1000 MHz, and the second resonant frequency 701b may be about 1600 MHz.

[0135] Reference Figure 7b , when the electronic device 300 of the second housing 320 inserted into the first housing 310 is in the first state, the magnetic field distribution at the first resonant frequency 701a when the overlapping area 550A operates as an antenna is shown. The magnetic field may be distributed in the first area 710 and the second area 720, the first area 710 extending downward along the first periphery 310a along the left side of the third periphery 310c relative to the slit 520, and the second area 720 extending downward along the second periphery 310b along the right side of the third periphery 310c relative to the slit 520. The contrast between the first area 710 and the second area 720 may indicate the strength of the magnetic field.

[0136] According to an embodiment, in the first state, when a current in a frequency band including the first resonant frequency 701a flows to the overlapping region 550A, the intensity of the magnetic field in the first region 710 may be less than the intensity of the magnetic field flowing in the second region 720. In the overlapping region 550A, the second region 720 may be an antenna operating at the first resonant frequency 701a. According to an embodiment, when looking at the distribution of the magnetic field, the region in which the actual magnetic field is highly distributed may represent a region operating as an antenna. The second region 720 in which the magnetic field is highly distributed may be a region operating as an antenna. The second region 720 in which the magnetic field is highly distributed may be a region in which a large amount of surface current flows during power supply.

[0137] Reference Figure 7c , when the electronic device 300 where the second housing 320 is inserted into the first housing 310 is in the first state, the surface magnetic field distribution at the second resonance frequency 701b when the overlapping area 550A operates as an antenna is shown.

[0138] According to an embodiment, in the first state, when a current in a frequency band including the second resonant frequency 701b flows to the overlapping region 550A, the magnetic field distributed in the first region 710 may be greater than the magnetic field distributed in the second region 720. In the overlapping region 550, the first region 710 may be an antenna operating at the second resonant frequency 701b. The first region 710 in which the magnetic field is highly distributed may be a region through which a large amount of surface current flows during power supply.

[0139] According to an embodiment, the overlap region 550A may be divided into a left region and a right region with respect to the slit 520 and operate.

[0140] Reference Figure 7b and Figure 7c , in the first state, the first region 710 of the overlapping region 550A may have an area narrower than that of the second region 720 .

[0141] Figure 8a is a graph illustrating a gain of an antenna using a first board and a second board when the electronic device is in a second state according to an embodiment. Figure 8b Magnetic field distribution of an antenna using a first board and a second board in a third frequency band when the electronic device is in a second state according to an embodiment is shown. Figure 8c A current distribution of an antenna using a first board and a second board in a fourth frequency band when the electronic device is in a second state according to an embodiment is shown.

[0142] Reference Figure 8a , a graph 801 shows the gain of the antenna using the overlapping region 550B of the first plate 501 and the second plate 502 in the second state where the second housing 320 is pulled out to the first housing 310. In the second state, the overlapping region 550B may have a third resonant frequency 801a and a fourth resonant frequency 801b. The third resonant frequency 801a may be about 1200MHz, and the fourth resonant frequency 801b may be about 2500MHz.

[0143] Reference Figure 8b , when the electronic device 300 in which the second housing 320 is drawn out to the first housing 310 is in the second state, the magnetic field distribution at the first resonant frequency 801a when the overlapping region 550B operates as an antenna is shown. The current may flow in the third region 810 extending along the left side of the third periphery 310c relative to the slit 520 and extending downward along the first periphery 310a, and may flow in the fourth region 820 extending along the right side of the third periphery 310c relative to the slit 520 and extending downward along the second periphery 310b. The contrast between the third region 810 and the fourth region 820 may indicate the strength of the magnetic field.

[0144] According to an embodiment, in the second state, when a current in a frequency band including the third resonant frequency 801a flows to the overlapping region 550B, the intensity of the magnetic field distributed in the third region 810 may be smaller than the intensity of the magnetic field distributed in the fourth region 820. In the overlapping region 550B, the fourth region 820 may be an antenna operating at the third resonant frequency 801a.

[0145] Reference Figure 8c, when the electronic device 300 in which the second housing 320 is drawn out to the first housing 310 is in the second state, the magnetic field distribution at the fourth resonant frequency 801b when the overlapping area 550B operates as an antenna is shown.

[0146] According to an embodiment, in the first state, when a current in a frequency band including the fourth resonant frequency 801b flows to the overlapping region 550B, the intensity of the magnetic field distributed in the third region 810 may be greater than the intensity of the magnetic field distributed in the fourth region 820. In the overlapping region 550B, the third region 810 may be an antenna operating at the fourth resonant frequency 801b. According to an embodiment, the overlapping region 550A may be divided into a left region and a right region with respect to the slit 520 and operate.

[0147] Reference Figure 8b and Figure 8c , in the second state, the third region 810 in the overlapping region 550B may have an area narrower than that of the fourth region 820. Because the radiation volume of the fourth region 820 is larger than the radiation volume of the third region 810, the third resonant frequency 801a at which the fourth region 820 operates as an antenna may be lower than the fourth resonant frequency 801b at which the third region 810 operates as an antenna.

[0148] In the electronic device 300 according to the embodiment, as the area of ​​the overlapping region 500A or 500B changes according to the state of the electronic device 300, the frequency band of the resonant frequency may change. According to the embodiment, the frequency band including the second resonant frequency 701b in the first state of the electronic device 300 may overlap with the frequency band including the third resonant frequency 801a in the second state of the electronic device 300. By tuning the overlapping region 550A or 550B so that the second resonant frequency 701b coincides with the third resonant frequency 801a, the electronic device 300 can provide an antenna using the second resonant frequency 701b or the third resonant frequency 801a regardless of the change in the state of the electronic device 300.

[0149] Figure 9a A gain of an antenna operated by a portion of a conductive portion included in a case when the electronic device does not include a connection member according to an embodiment is shown. Figure 9b A gain of an antenna operated by a portion of a conductive portion included in a case when the electronic device includes a connecting member according to an embodiment is shown.

[0150] Figure 9a The graph 901 and Figure 9b The graph 902 indicates that when using a device included in an electronic device (e.g., Figure 5a The housing of the electronic device 300 (eg, Figure 5aThe antenna is operated by using the conductive portion of the side surface of the first housing 310) due to the overlap area of ​​the first plate 501 and the second plate 502. For example, the antenna can be located at the fourth periphery (for example, Figure 8b The antenna includes a conductive portion in the side surface at the fourth periphery 310d). The antenna may be referred to as a lower antenna.

[0151] Reference Figure 9a , graph 901 indicates that when there is no configuration provided on the first plate (eg, Figure 6 The first plate 501 and the second plate (eg, Figure 6 The gain of the antenna when the connecting member 580 is between the second plate 502).

[0152] Referring to the graph 901, it can be seen that an additional parasitic resonance 911 occurs in the first region 910 having the resonant frequency. The parasitic resonance 911 may be generated by the interaction between the overlap region 550A or 550B and the lower antenna. Figure 6 The connection member 580 may be disposed close to a periphery (e.g., fourth periphery 310d) where the lower antenna is located among the peripheries of the first housing 310. The connection member 580 may block parasitic resonance generated between the first plate 501 and the second plate 502. The resonant length of the overlap region 550A or 550B between the first plate 501 and the second plate 502 may be determined based on the position of the connection member 580.

[0153] Reference Figure 9b , a graph 902 indicates the gain of the lower antenna when there is a connection member 580 disposed between the first board 501 and the second board 502 .

[0154] Referring to the graph 902, it can be seen that, unlike the graph 901, the parasitic resonance 911 is removed in the first region 910 having the resonant frequency. The connecting member 580 may connect the regions of the first plate 501 and the second plate 502 connected to the connecting member 580 to the ground region. In the region connected to the connecting member 580 connected to the ground region, the potential difference between the first plate 501 and the second plate 502 is reduced, so the current flow may be reduced. The first plate 501 and the second plate 502 in the region connected to the connecting member 580 where the current flow is reduced may reduce the interaction with the lower antenna. By the reduced interaction, the parasitic resonance generated in the lower antenna may be reduced.

[0155] Fig.10 A transmission line disposed inside an electronic device is shown. Fig.11 It is along Figure 5a Figure 2 shows the extended portion of the cut along line C-C'.

[0156] Reference Fig.10 , the electronic device 300 may include a first printed circuit board 324, a second printed circuit board 530, and / or a third printed circuit board 1010. In an embodiment, the first printed circuit board 324 may be disposed in the second housing 320. As another example, the second printed circuit board 530 and the third printed circuit board 1010 may be disposed in the first housing 310. The electronic device 300 may include a flexible printed circuit board or a cable electrically connecting the first printed circuit board 324, the second printed circuit board 530, and the third printed circuit board 1010. For example, the electronic device 300 may include a flexible printed circuit board 1020, extension portions 540 and 1030 (e.g., forming a conductive path) that form a conductive path. Figure 5a The extension portions 540 and 1030 may be referred to as flexible printed circuit boards. For example, the extension portions 540 and 1030 may include a portion of a signal line of the second printed circuit board 530. The extension portions 540 and 1030 may be flexible printed circuit boards extending from the second printed circuit board 530. According to an embodiment, the extension portion 540 may provide a conductive path extending from the second printed circuit board 530 to the slit 520. The extension portion 1030 may provide a conductive path extending from the second printed circuit board 530 to the third printed circuit board 1010. According to an embodiment, the extension portions 540 and 1030 may be formed separately from the second printed circuit board 530 and coupled to the second printed circuit board 530.

[0157] According to an embodiment, the second shell 320 may be movable in a first direction (+y direction) or a second direction (-y direction) relative to the first shell 310. The distance between the second printed circuit board 530 and the third printed circuit board 1010 disposed in the first shell 310 and the first printed circuit board 324 disposed in the second shell 320 may be changed according to the movement of the second shell 320. A flexible printed circuit board may be provided for connecting the first printed circuit board 324 disposed in the second shell 320 with the second printed circuit board 530 and / or the third printed circuit board 1010 disposed in the first shell 310. In an embodiment, the flexible printed circuit board 1020 may connect the first printed circuit board 324 and the third printed circuit board 1010. For example, one end of the flexible printed circuit board 1020 may be connected to the first printed circuit board 324, and the other end of the flexible printed circuit board 1020 may be connected to the third printed circuit board 1010. In the embodiment, the flexible printed circuit board 1020 may connect the first printed circuit board 324 and the third printed circuit board 1010. Fig.10 In the first state shown, the flexible printed circuit board 1020 may be disposed in a folded state between the first printed circuit board 324 and the third printed circuit board 1010. When the electronic device 300 is in the second state, the flexible printed circuit board 1020 may be disposed in an unfolded state between the first printed circuit board 324 and the third printed circuit board 1010.

[0158] According to an embodiment, the second extension portion 1030 may electrically connect the second printed circuit board 530 and the third printed circuit board 1010. The first extension portion 540 may extend from the second printed circuit board 530 along the first perimeter 310a, extend in a direction parallel to the third perimeter 310c, and extend to the slit 520. In an embodiment, the second printed circuit board 530 may be electrically connected to an antenna disposed at the fourth perimeter 310d of the first housing 310. For example, the second printed circuit board 530 may be disposed at the lower end of the first housing 310 (e.g., an area facing the fourth perimeter 310d) for signal transmission to a lower antenna using a conductive portion of the fourth perimeter 310d as an antenna. The third printed circuit board 1010 may be connected to the second extension portion 1030 to electrically connect an electrical material located in the first housing 310 and an electrical material located in the second housing 320.

[0159] According to an embodiment, the slit 520 may be powered through the first extension portion 540. For example, the slit 520 may be electrically connected to the second printed circuit board 530 through the first extension portion 540. The second printed circuit board 530 may be electrically connected to the third printed circuit board 1010 through the second extension portion 1030. The third printed circuit board 1010 may be electrically connected to the first printed circuit board 324 through the flexible printed circuit board 1020. A wireless communication signal may be transmitted from the flexible printed circuit board 1020, the third printed circuit board 1010, the second extension portion 1030, the second printed circuit board 530, and the first extension portion 540, including at least one processor (e.g., Figure 1 processor 120, Figure 2 The first printed circuit board 324 of the wireless communication circuit of the communication processor 212 or the second communication processor 214 supplies power to the slot 520.

[0160] The above embodiment has described that the slit 520 is formed in the first housing 310, but is not limited thereto. The slit 520 may be formed in the second metal plate 502 of the second housing 320 to feed from the first printed circuit board 324. For example, the slit formed in the conductive portion (e.g., the second plate 502) of the second housing 320 may be fed by a conductive path extending from the first printed circuit board 324. The second plate 502 may be fed from the first printed circuit board 324 and coupled to the first plate 501, so that the overlapping area between the first plate 501 and the second plate 502 may be used as an antenna radiator. According to an embodiment, the conductive path extending from the first printed circuit board 324 may be electrically connected to the second plate 502, and a data signal may be transmitted from the wireless communication circuit included in the first printed circuit board 324 to the second plate.

[0161] Reference Fig.11 , showing that the extension portion 540 is in the power supply area (e.g., Figure 5a The extension portion 540 may include a layer 1120 including the signal line 1101 and a ground layer 1110. The extension portion 540 may further include non-conductive layers 1130 and 1140 disposed in the layer 1120 including the signal line 1101 and the ground layer 1110.

[0162] According to an embodiment, the non-conductive layers 1130 and 1140 may include a first non-conductive layer 1130 and a second non-conductive layer 1140. The first non-conductive layer 1130 may be disposed on the layer 1120 including the signal line 1101 disposed in the second non-conductive layer 1140. The ground layer 1110 may be disposed on the first non-conductive layer 1130. The ground layer 1110 and the signal line 1101 may include a conductive material. The conductive material may be a metal such as copper, gold, or silver.

[0163] According to an embodiment, the first non-conductive layer 1130 and / or a portion 1111 of the ground layer 1110 may be removed. For example, in the region 1119 corresponding to the slot 520, the portion 1111 of the ground layer 1110 may be removed so as to supply power to the slot 520 through the signal line 1101. For example, other conductive members such as the ground layer 1110 other than the layer 1120 including the signal line 1101 within the extension region 540 may be removed from the region 1190 corresponding to the slot 520.

[0164] According to an embodiment, the extension portion 540 may be fixed and grounded in the power supply region 546 in which the slit 520 is provided by the adhesive member 1180. The adhesive member 1180 may be a conductive tape including a conductive material.

[0165] Fig.12 is an example of deforming the overlapping area between the first plate and the second plate. Fig.13 is an example of adjusting the position of the slit formed on the first plate. Fig.14a and Fig.14b is an example of adjusting the position of the contact provided between the first plate and the second plate.

[0166] Reference Fig.12 , the electronic device may include a first housing 310 and a second housing 320 movably coupled to the first housing 310 .

[0167] According to an embodiment, the first plate 501 of the first housing 310 and the second plate 502 of the second housing 320 may overlap each other. The overlapping area 1201 of the first plate 501 and the second plate 502 in the first state may be different from the overlapping area 1202 of the first plate 501 and the second plate 502 in the second state.

[0168] According to an embodiment, the second housing 320 can move a specified distance da relative to the first housing 310. The specified distance da may be the maximum distance that the second housing 320 can move. The specified distance da may be the distance when the second housing 320 moves from the first state to the second state. The overlapping area 1201 in the first state and the overlapping area 1202 in the second state may be determined by the specified distance da.

[0169] According to an embodiment, when the specified distance da is determined, the overlapping region 1201 in the first state may be determined by the width or length of the second plate 502 of the second shell 320. For example, when the length l2 of the second plate 502 of the second shell 320 overlapping the first plate 501 is longer, the area of ​​the overlapping region 1201 in the first state may increase, and when the length l2 of the second plate 502 of the second shell 320 overlapping the first plate 501 is shorter, the area of ​​the overlapping region 1201 in the first state may decrease.

[0170] According to an embodiment, when the specified distance da is determined, the overlapping region 1202 in the second state may be determined by the width or length of the second plate 502 of the second shell 320. For example, when the length l2 of the second plate 502 of the second shell 320 overlapping the first plate 501 is longer, the area of ​​the overlapping region 1202 in the second state may increase, and when the length l2 of the second plate 502 of the second shell 320 overlapping the first plate 501 is shorter, the area of ​​the overlapping region 1202 in the second state may decrease.

[0171] According to an embodiment, because the overlapping area in the first state is relatively larger than the overlapping area in the second state, the influence of the length l2 of the second plate 502 on the resonance frequency may be relatively small.

[0172] Figure 5a The length l can be compared Fig.12 The electrical length of the antenna can be determined based on the opening in the second state (e.g., Figure 5a The overlap length S2 between the opening 510 of the second plate 502 is determined. Figure 5b The overlap area S1 between the opening 510 and the second plate 502 may be relatively wider than Fig.12 The overlap area S2 between the opening 510 and the second plate 502. Figure 5b The second plate 502 may have a Fig.12 The second board 502 has high antenna gain and can ensure the electrical length of the resonant frequency.

[0173] According to an embodiment, by adjusting the area of ​​the overlapping region 1202 in the second state, one of the resonance frequencies of the overlapping region 1201 in the first state may be matched with one of the resonance frequencies of the overlapping region 1202 in the second state.

[0174] Reference Fig.13 , the electronic device 1300 may include a first housing 310 and a second housing 320. The first plate 501 of the first housing 310 may include a first opening 510 and a slit 1320. The slit 1320 may be a slit for feeding power to the overlapping area when the overlapping area of ​​the first plate 501 and the second plate 502 operates as an antenna. By adjusting the position of the slit 1320, the resonant frequency in the first state and the resonant frequency in the second state can be adjusted. The slit 1320 whose position has been adjusted can be removed by removing the slit 1320 from the second printed circuit board 530 (for example, Figure 5b The extension portion 1331 or 1332 extending from the second printed circuit board 530 of the embodiment of the present invention is fed. The extension portion 1331 or 1332 may extend to the slit 1320 along the periphery of the opening 510.

[0175] According to an embodiment, by adjusting the feeding point in the overlapping area in the second state, one of the resonant frequencies in the overlapping area in the first state may be matched with one of the resonant frequencies in the overlapping area in the second state.

[0176] Reference Fig.14a , the electronic device 1400 may include a first housing 310 and a second housing 320. By adjusting a connecting member (eg, Figure 6 By adjusting the position of the connecting member 580), the radiation volume of the antenna can be adjusted in the overlapping area in the second state.

[0177] According to an embodiment, the electronic device 1400 may include a connection member 580 disposed at each of the first positions 1410a and 1410b in the first state. The connection member 580 may be disposed between the first plate 501 and the second plate 502. When the second housing 320 moves to the second state, the connection member 580 may be located at each of the second positions 1420a and 1420b.

[0178] According to an embodiment, the electronic device 1400 may have a first radiation area 1401a in the second state by the connection member 580 provided at each of the second positions 1420a and 1420b. The first radiation area 1401a may be an area capable of radiating electromagnetic waves to the outside when the electronic device is in the second state and the overlapping space of the first plate 501 and the second plate 502 is used as an antenna radiator.

[0179] Reference Fig.14b, the electronic device 1400 may include a connection member 580 disposed at each of the third positions 1430a and 1430b in the first state. The connection member 580 may be disposed between the first plate 501 and the second plate 502. When the second housing 320 moves to the second state, the connection member 580 may be located at each of the fourth positions 1440a and 1440b.

[0180] According to an embodiment, the electronic device 1400 may have the second radiation area 1401 b by the connection member 580 disposed at each of the fourth positions 1440 a and 1440 b in the second state.

[0181] Reference Fig.14a and Fig.14b , the second radiation area 1401b may have a wider radiation volume than the first radiation area 1401a. According to an embodiment, when the electronic device 1400 is in the second state, the resonant frequency generated by the first radiation area 1401a having a narrower radiation volume than the second radiation area 1401b may be higher. The electronic device 1400 may adjust the position of the connection member 580 to adjust the radiation volume.

[0182] According to the above-described embodiments, the electronic devices 1200, 1300, and 1400 can adjust the resonant frequency of the overlapping area by adjusting the position of the slit, the overlapping area between the first plate 501 and the second plate 502, or the position of the connecting member 580. Through the adjusted resonant frequency, the electronic devices 1200, 1300, and 1400 can provide an antenna having a constant frequency regardless of a state change of the electronic device.

[0183] Fig.15 , Fig.16 and Fig.17 is a graph for describing an example of adjusting the resonant frequency of an antenna of an electronic device according to an embodiment.

[0184] Fig.15 , Fig.16 and Fig.17 An example of adjusting the frequency of the electronic device in the second state is shown.

[0185] Electronic devices (e.g. Figure 5a The electronic device 300 can be configured to: Figure 5a The first plate 501 and the second plate (eg, Figure 5a The resonant frequency can be adjusted by adjusting the overlapping area of ​​the second plate 502. For another example, the electronic device 300 can adjust the resonant frequency by adjusting the slit for power supply (for example, Figure 5aFor another example, the electronic device 300 can adjust the resonant frequency by adjusting the position of the connecting member (eg, Figure 6 The resonant frequency is adjusted by the position of the connecting member 580).

[0186] Fig.15 Graph 1500 shows the gain when the area where the first plate 501 and the second plate 502 overlap in the first state operates as an antenna. Referring to graph 1500, in the first state, the area where the first plate 501 and the second plate 502 overlap may include a first resonant frequency 1510, a second resonant frequency 1520, and a third resonant frequency 1530.

[0187] Fig.16 Graph 1600 shows a gain when the area where the first plate 501 and the second plate 502 overlap in the second state operates as an antenna. Referring to graph 1600, in the second state, the area where the first plate 501 and the second plate 502 overlap may include a fourth resonant frequency 1610 and a fifth resonant frequency 1620.

[0188] According to an embodiment, the first plate 501 and the second plate 502 arranged to overlap may be a cavity antenna operated by interaction. The antenna operated by the interaction between the first plate 501 and the second plate 502 may have a plurality of resonant frequencies. In the overlapping region of the first plate 501 and the second plate 502, the resonant frequency may be moved according to the conversion of the first state and the second state. The first resonant frequency 1510 in the first state may be lower than the fourth resonant frequency 1610 in the second state. In the electronic device, since the overlapping region between the first plate 501 and the second plate 502 in the first state is wider than that in the second state, the first resonant frequency 1510 in the first state may be lower than the fourth resonant frequency 1610 in the second state.

[0189] Reference Fig.17 , in the graph 1700, the second resonant frequency 1520 in the first state may at least partially overlap with the fourth resonant frequency 1610 in the second state. By adjusting the size of the overlapping area between the first plate 501 and the second plate 502, adjusting the position of the slit 520, or adjusting the position of the connecting member 580 between the first plate and the second plate, the second resonant frequency 1520 in the first state may be adjusted to at least partially overlap with the fourth resonant frequency 1610 in the second state. For example, the second resonant frequency 1520 in the first state and the fourth resonant frequency 1610 in the second state may be set to about 1600 MHz, which is the first target resonant frequency 1710.

[0190] According to an embodiment, in the graph 1700, the third resonant frequency 1530 in the first state may at least partially overlap with the fifth resonant frequency 1520 in the second state. The third resonant frequency 1530 in the first state may be adjusted to at least partially overlap with the fifth resonant frequency 1620 in the second state by adjusting the area of ​​the overlapping region of the first plate 501 and the second plate 502, adjusting the position of the slit 520, or adjusting the position of the connecting member 580 between the first plate 501 and the second plate 502. For example, the third resonant frequency 1530 in the first state and the fifth resonant frequency 1620 in the second state may be set to about 3000 MHz, which is the second target resonant frequency 1720.

[0191] According to an embodiment, at least one of the resonant frequencies in the first state and at least one of the resonant frequencies in the second state may be adjusted to overlap by adjusting the size of the overlapping area between the first plate 501 and the second plate 502, adjusting the position of the slit 520, or adjusting the position of the connecting member 580 between the first plate 501 and the second plate 502. Since the first plate 501 and the second plate 502 operate as antennas in a frequency band including resonant frequencies overlapping each other regardless of the state of the electronic device 1200, 1300, or 1400, the electronic device 1200, 1300, or 1400 may communicate with an external electronic device in a designated frequency band regardless of the state.

[0192] The electronic device according to the above embodiment can provide such an antenna that can operate in the same frequency band regardless of the state of the electronic device. The electronic device can provide an antenna without a separate antenna module by using the overlapping first and second boards as antennas. By reducing the number of antenna modules, the electronic device can install another electronic component in the ensured internal space and improve the utilization rate of the internal space.

[0193] According to the above-mentioned embodiment, an electronic device (for example, Figure 5a The electronic device 300 may include: a first housing (eg, Figure 5a The first housing 310 includes an opening (eg, Figure 5a The first plate (eg, Figure 5a a first plate 501); a second housing (eg, Figure 5a The second housing 320 includes a second plate (eg, Figure 5a The second housing 502 is connected to the first housing so as to be movable relative to the first housing in a first direction or a second direction opposite to the first direction; and a wireless communication circuit operatively connected to the second housing, the second housing may include an opening formed in the second housing and a slit formed from the periphery of the opening along a surface of the second housing (e.g., Figure 5aThe overlapping area of ​​the second plate and the first plate in the first state movable in the first direction between the first direction and the second direction (eg, Figure 5a The area 550A) may be larger than the overlapping area (eg, Figure 5a The area 550B) is wide, and the wireless communication circuit can communicate with the external electronic device in the designated frequency band through the first board and the second board.

[0194] According to an embodiment, the second plate may interact with the first plate through an electric current applied to the first plate.

[0195] According to an embodiment, the wireless communication circuit may be mounted on a printed circuit board in the second housing.

[0196] According to an embodiment, the electronic device may further include an extension portion (eg, Figure 5a An extension portion 540) extends along the periphery of the opening formed in the first plate and is fed by an end connected to the slit.

[0197] According to an embodiment, the extension portion may include a transmission line electrically connected to the first board and transmitting a data signal from the wireless communication circuit to the first board, and a conductive layer electrically connected to the first board and connected to a ground portion of the electronic device.

[0198] According to an embodiment, the transmission line may face the slot at an end.

[0199] According to an embodiment, the conductive layer may be segmented in a region corresponding to the slit.The conductive layer may be removed in a region corresponding to the slit.

[0200] According to an embodiment, the slit may extend from a periphery facing the first direction and along the first direction.

[0201] According to an embodiment, the slit may extend from a periphery perpendicular to the first direction and in a direction perpendicular to the first direction.

[0202] According to an embodiment, it may further include a first connecting member and a second connecting member, the first connecting member being arranged between the first plate and the second plate in an area including a second periphery among the peripheries perpendicular to the first periphery of the opening in which the slit is formed, and the second connecting member being arranged between the first plate and the second plate in an area including a third periphery facing the second periphery.

[0203] According to an embodiment, the designated frequency band may be determined based on an electrical path connected from the slit to the first connection member along the first periphery and the second periphery in the overlapping region of the first and second plates when the first housing is viewed from above in the second state.

[0204] According to an embodiment, the designated frequency band may be determined based on an electrical path extending from the slit to the second connection member along the first periphery and the third periphery in the overlapping region of the first and second plates when the first housing is viewed from above in the first state.

[0205] According to an embodiment, the electronic device may further include a second printed circuit board (eg, Fig.10 A first printed circuit board 324 in the first housing), a third printed circuit board in the first housing (eg, Fig.10 A third printed circuit board 1010), a first flexible printed circuit board (eg, Fig.10 The first flexible printed circuit board 1020 of the embodiment of the present invention is provided, and a second flexible printed circuit board (eg, a second extending portion 1030) electrically connecting the second printed circuit board and the third printed circuit board.

[0206] According to an embodiment, the wireless communication circuit may transmit the data signal to the slit through the first printed circuit board, the first flexible printed circuit board, the third printed circuit board, the second flexible printed circuit board, and the second printed circuit board.

[0207] According to an embodiment, in the first state, the first plate and the second plate may have a first resonant frequency in a first frequency band and a second resonant frequency in a second frequency band higher than the first resonant frequency band.

[0208] According to an embodiment, in the second state, the first plate and the second plate may have a third resonant frequency in a third frequency band and a fourth resonant frequency in a fourth frequency band higher than the third frequency band.

[0209] According to an embodiment, the designated frequency band may be a frequency band where the second frequency band and the third frequency band overlap.

[0210] According to an embodiment, the electronic device may further include a wireless charging circuit (eg, Figure 5a Wireless charging circuit 590).

[0211] According to an embodiment, an electronic device (eg, Figure 5a The electronic device 300 may include: a first housing (eg, Figure 5a The first housing 310 includes an opening (eg, Figure 5a The first plate (eg, Figure 5a a first plate 501); a second housing (eg, Figure 5a The second housing 320 includes a second plate (eg, Figure 5aThe first housing may include a second plate 502 and a second plate 503 and connected to the first housing to be movable relative to the first housing in a first direction or a second direction opposite to the first direction; and a wireless communication circuit operatively connected to the second plate. The first housing may include an opening formed in the second plate and a slit (e.g., Figure 5a The overlapping area of ​​the second plate and the first plate in the first state movable in the first direction between the first direction and the second direction may be wider than the overlapping area of ​​the second plate and the first plate in the second state movable in the second direction between the first direction and the second direction.

[0212] According to an embodiment, the wireless communication circuit may communicate with an external electronic device in a designated frequency band through the first board and the second board.

[0213] According to an embodiment, the first board may be electrically connected to the second board by power applied to the second board through the slit.

[0214] According to an embodiment, it may further include a wireless charging circuit on the second board exposed to the outside of the first housing through the opening in the first state.

[0215] According to an embodiment, the wireless communication circuit may be provided on a printed circuit board in the second housing.

[0216] According to an embodiment, it may further include an extension portion in the second housing, the extension portion being fed through an end portion connected to the slit.

[0217] According to an embodiment, the extending portion may include a transmission line that is electrically connected to the second board and transmits the data signal from the wireless communication circuit to the second board, and a conductive layer that is electrically connected to the second board.

[0218] According to an embodiment, the transmission line may be exposed at an end portion toward the slit.

[0219] According to an embodiment, the conductive layer is segmented in regions corresponding to the slits.

[0220] According to an embodiment, it may further include a first connecting member and a second connecting member, the first connecting member being arranged between the first plate and the second plate in an area including a second periphery among the peripheries perpendicular to the first periphery of the opening in which the slit is formed, and the second connecting member being arranged between the first plate and the second plate in an area including a third periphery facing the second periphery.

[0221] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0222] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each phrase in the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding phrase in the phrase. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being "combined with" or "connected with" another element (e.g., a second element) when the terms "operably" or "communicatively" are used or when the terms "operably" or "communicatively" are not used, it means that the element can be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0223] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities, and some entities in the multiple entities may be separately arranged in different components. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

Claims

1. An electronic device, comprising: A first housing including a first plate including an opening and a slit, the slit being formed from a periphery of the opening along a surface of the first plate; a second housing including a second plate spaced apart from the first plate and at least partially overlapping the opening, and coupled to the first housing to be movable relative to the first housing in a first direction or a second direction opposite to the first direction; a wireless communication circuit electrically connected to the second board; as well as a first printed circuit board electrically connected to the wireless communication circuit and extending along the periphery of the opening formed in the first board so as to be fed through an end connected to the slit; Wherein, the wireless communication circuit is configured to communicate with an external electronic device in a designated frequency band through the first board and the second board.

2. The electronic device according to claim 1, wherein: The second plate is electrically connected to the first plate by a current applied to the first plate through the slit.

3. The electronic device according to claim 1, wherein: The wireless communication circuit is disposed on another printed circuit board in the second housing.

4. The electronic device according to claim 1, wherein: An overlapping area of ​​the second plate and the first plate in a slide-in state movable in the first direction between the first and second directions is wider than an overlapping area of ​​the second plate and the first plate in a slide-out state movable in the second direction between the first and second directions.

5. The electronic device according to claim 1, wherein: The extensions include: a transmission line connected to the first board and transmitting a data signal from the wireless communication circuit to the first board; and a conductive layer connected to the first plate; wherein a portion of the transmission line overlaps the slit when looking at the slit, and The conductive layer is spaced apart from a region corresponding to the slit and overlaps the first plate except for the slit.

6. The electronic device according to claim 5, wherein: The conductive layer is segmented in the region corresponding to the slit.

7. The electronic device according to claim 1, wherein: The slit extends from a periphery facing the first direction and along the first direction.

8. The electronic device according to claim 1, wherein: The slit extends from a periphery perpendicular to the first direction and in a direction perpendicular to the first direction.

9. The electronic device according to claim 1, further comprising: a first connecting member disposed between the first plate and the second plate in an area including a second periphery among peripheries perpendicular to a first periphery of the opening in which the slit is formed; as well as A second connection member is provided between the first plate and the second plate in a region including a third periphery facing the second periphery.

10. The electronic device according to claim 9, wherein: The designated frequency band is determined based on an electrical path extending from the slit to the first connection member along the first periphery and the second periphery in the overlapping region of the first plate and the second plate when the first housing is viewed from above in the second state.

11. The electronic device according to claim 10, wherein: The designated frequency band is determined based on an electrical path extending from the slit to the second connection member along the first periphery and the third periphery in the overlapping region of the first plate and the second plate when the first housing is viewed from above in the first state.

12. The electronic device according to claim 1, further comprising: a second printed circuit board disposed in the second housing, wherein the wireless communication circuit is disposed on the second printed circuit board; a third printed circuit board disposed in the first housing; a first flexible printed circuit board, electrically connecting the first printed circuit board and the third printed circuit board; as well as a second flexible printed circuit board, electrically connecting the second printed circuit board and the third printed circuit board; The wireless communication circuit transmits data signals to the slit through the first printed circuit board, the first flexible printed circuit board, the third printed circuit board, the second flexible printed circuit board and the second printed circuit board.

13. The electronic device according to claim 1, wherein: In the first state, the first plate and the second plate have a first resonant frequency in a first frequency band and a second resonant frequency in a second frequency band higher than the first frequency band, and Wherein, in the second state, the first plate and the second plate have a third resonant frequency in a third frequency band and a fourth resonant frequency in a fourth frequency band higher than the third frequency band.

14. The electronic device according to claim 13, wherein: The designated frequency band is a frequency band where the second frequency band and the third frequency band overlap. 15 . The electronic device according to claim 1 , further comprising a wireless charging circuit on the second board, wherein in the first state, the wireless charging circuit is exposed to the outside of the first housing through the opening.

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