Sample processing system, image generation device, and image generation method

Abstract

Provided is a sample processing system capable of easily determining appropriate processing conditions. The sample processing system includes: a sample processing device that processes a sample by irradiating the sample with an ion beam; and an image generation device that generates a prediction image when the sample is processed using the sample processing device under the set processing conditions, the prediction image including information on the distribution of the irradiation direction of the ion beam.

Description

Technical Field

[0001] The present invention relates to a sample processing system, an image generating device and an image generating method. Background Art

[0002] As a sample processing device that processes a sample using an ion beam, a cross-section polisher (registered trademark) is known. As a processing method using such a sample processing device, a plane milling method is known that uses the sputtering phenomenon when an ion beam is irradiated at an extremely shallow angle to the sample surface to produce a smooth plane.

[0003] For example, Patent Document 1 discloses an ion milling device, characterized in that it includes an ion gun that irradiates an ion beam to a rotating sample, and a sample rotating device that positions and rotates the sample in a manner that the rotation center of the sample is within the irradiation plane of the ion beam, and on the sample surface, the rotation center of the sample is offset from the position of the center of the ion beam by a specified distance. By thus offsetting the center of the ion beam from the rotation center of the sample, it is possible to irradiate a wide area of ​​the sample with the ion beam from a variety of irradiation directions compared to a case where the center of the ion beam is consistent with the rotation center of the sample. As a result, a wide area of ​​the sample can be smoothly etched.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 3-36285 Summary of the invention

[0007] Problem that the invention aims to solve

[0008] However, the irradiation direction of the ion beam during processing changes in a complex manner depending on processing conditions such as the rotation speed of the sample and the distance between the center of the ion beam and the rotation center of the sample. Therefore, it is difficult to determine appropriate processing conditions.

[0009] Solutions for solving problems

[0010] One embodiment of the sample processing system of the present invention comprises:

[0011] a sample processing device for processing the sample by irradiating the sample with an ion beam; and

[0012] an image generating device for generating a predicted image when the sample is processed using the sample processing device under the set processing conditions,

[0013] The predicted image includes information on the distribution of the irradiation direction of the ion beam.

[0014] In such a sample processing device, a predicted image when the sample is processed under the set processing conditions can be obtained, so appropriate processing conditions can be easily determined.

[0015] An embodiment of the image generating device of the present invention comprises:

[0016] an image generating unit that generates a predicted image when the sample is processed under set processing conditions using a sample processing device that processes the sample by irradiating the sample with an ion beam; and

[0017] a display control unit that causes the predicted image to be displayed,

[0018] The predicted image includes information on the distribution of the irradiation direction of the ion beam.

[0019] In such an image generating device, it is possible to generate a predicted image when a sample is processed under set processing conditions, and therefore it is possible to easily determine appropriate processing conditions.

[0020] One embodiment of the image generation method of the present invention comprises:

[0021] a step of generating a predicted image when the sample is processed under set processing conditions using a sample processing device that processes the sample by irradiating the sample with an ion beam; and

[0022] a step of displaying the predicted image,

[0023] The predicted image includes information on the distribution of the irradiation direction of the ion beam.

[0024] In such an image generation method, a predicted image when a sample is processed under set processing conditions can be generated, so appropriate processing conditions can be easily determined. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a diagram showing the configuration of a sample processing system according to the first embodiment.

[0026] Figure 2 It is a diagram showing the configuration of a sample processing system according to the first embodiment.

[0027] Figure 3 The figure schematically shows a sample supported by a sample stage.

[0028] Figure 4 It is a diagram showing the structure of an image generating device.

[0029] Figure 5This is a flowchart showing an example of an image generation method for generating a predicted image.

[0030] Figure 6 FIG. 1 is a diagram schematically showing an example of a GUI of an image generating device.

[0031] Figure 7 are the ion beam image before and after correction.

[0032] Figure 8 This is a diagram for explaining the process of generating a predicted image at the first time point.

[0033] Fig. 9 This is a diagram for explaining the process of generating a predicted image at the first time point.

[0034] Fig.10 This is a diagram for explaining a method of calculating the irradiation position of the ion beam at the second time.

[0035] Fig.11 This is a diagram for explaining a method of calculating the irradiation position of the ion beam at the second time.

[0036] Fig.12 A diagram for explaining the component decomposition of a vector.

[0037] Fig.13 This is a diagram showing a state where irradiation intensity distribution images are superimposed every 1 second.

[0038] Fig.14 It is a diagram showing an ion beam irradiation intensity distribution image.

[0039] Fig.15 It is a graph showing the brightness curve of each irradiation intensity distribution image.

[0040] Fig.16 It is a diagram showing a vector component distribution image.

[0041] Fig.17 It is a coordinate diagram showing the brightness curve of each vector component distribution image.

[0042] Fig.18 This is a diagram for explaining an example of a method for displaying a predicted image.

[0043] Fig.19 This is a diagram for explaining an example of a method for displaying a predicted image.

[0044] Fig. 20 This is a diagram for explaining an example of a method for displaying a predicted image.

[0045] Fig.21 This is a diagram for explaining an example of a method for displaying a predicted image.

[0046] Fig. 22 This is a diagram for explaining an example of a method for displaying a predicted image.

[0047] Fig.23 This is a flowchart showing an example of image generation processing by the image generation device.

[0048] Fig.24 It is a diagram showing the configuration of an ion source of a sample processing system according to a second embodiment.

[0049] Fig.25 A diagram showing an example of a predicted image.

[0050] Fig.26 This is a diagram schematically showing a state where a sample having a laminated structure is subjected to plane milling.

[0051] Fig. 27 A diagram showing an example of a predicted image.

[0052] Fig.28 It is a diagram showing the configuration of a sample processing system according to a third embodiment.

[0053] Fig.29 It is a diagram showing the configuration of a sample processing system according to a third embodiment.

[0054] Fig.30 This is a diagram for explaining the relationship between the distance between the rotation center and the swing center of the sample and the irradiation range of the ion beam.

[0055] Fig.31 It is a diagram showing the configuration of a sample processing system according to a fourth embodiment.

[0056] Fig.32 It is a diagram showing the configuration of a sample processing system according to a fourth embodiment.

[0057] Fig.33 It is a diagram showing the configuration of a sample processing system according to a fifth embodiment.

[0058] Fig.34 It is a diagram showing the configuration of a sample processing system according to a fifth embodiment.

[0059] Fig.35 FIG. 1 is a diagram showing an example of an irradiation direction distribution image.

[0060] Fig.36 FIG. 1 is a diagram showing an example of an irradiation direction distribution image.

[0061] Fig.37 FIG. 1 is a diagram showing an example of an irradiation direction distribution image.

[0062] Fig.38 It is a diagram schematically showing a predicted image at the first time point.

[0063] Fig.39 It is a diagram schematically showing a predicted image at the second time point.

[0064] Description of Reference Numerals

[0065] 2...Sample processing system, 4...GUI screen, 6...Slider, 8...Check box, 11...Anode, 12...Cathode, 13...Extraction electrode, 14...Focusing electrode, 20...Tilt mechanism, 22...Rotation mechanism, 24...Swing mechanism, 24a...Swing table, 24b...Drive device, 26...Z stage, 28...XY stage, 100...Sample processing device, 110...Ion source, 112...Ion source control circuit, 120...Sample Stage, 130…alignment camera, 140…processing observation camera, 150…chamber, 160…chamber door, 162…observation window, 170…control unit, 180…ion source moving mechanism, 190…swing moving mechanism, 192…flange, 200…image generating device, 210…processing unit, 212…image generating unit, 214…display control unit, 220…input unit, 230…display unit, 240…storage unit. DETAILED DESCRIPTION

[0066] Hereinafter, preferred embodiments of the present invention will be described in detail using the accompanying drawings. Moreover, the embodiments described below are not intended to unduly limit the contents of the present invention as described in the claims. In addition, all the structures described below are not necessarily essential components of the present invention.

[0067] 1. First Implementation Method

[0068] 1.1. Sample processing system

[0069] First, a sample processing system according to a first embodiment will be described with reference to the drawings. Figure 1 and Figure 2 It is a diagram showing the configuration of a sample processing system 2 according to the first embodiment.

[0070] exist Figure 1 and Figure 2 In the figure, as three axes orthogonal to each other, the X axis, the Y axis, and the Z axis are shown. The X direction includes the +X direction as one direction along the X axis, and the -X direction as the other direction along the X axis. The Y direction includes the +Y direction as one direction along the Y axis, and the -Y direction as the other direction along the Y axis. The Z direction includes the +Z direction as one direction along the Z axis, and the -Z direction as the other direction along the Z axis.

[0071] like Figure 1 and Figure 2 As shown, the sample processing system 2 includes a sample processing device 100 and an image generating device 200. Figure 2 In the figure, for convenience, the illustration of the image generating device 200 is omitted.

[0072] (1) Sample processing equipment

[0073] The sample processing device 100 irradiates the sample S with an ion beam IB to process the sample S. The sample processing device 100 is used, for example, to prepare samples for electron microscopes such as a scanning electron microscope (SEM), a transmission electron microscope (TEM), and a scanning transmission electron microscope (STEM). In addition, the sample processing device 100 is also used to prepare samples for analysis devices other than electron microscopes, such as an electron probe microanalyzer (EPMA) and an Auger microprobe.

[0074] The sample processing apparatus 100 can process the sample S by plane milling to create a smooth plane by utilizing the sputtering phenomenon when the ion beam IB is irradiated at a very shallow angle to the surface of the sample S. Hereinafter, the case where the sample S is processed by plane milling using the sample processing apparatus 100 will be described.

[0075] like Figure 1 and Figure 2 As shown, the sample processing device 100 includes an ion source 110, a sample stage 120, a positioning camera 130, a processing observation camera 140, a chamber 150, a chamber door 160, and a control unit 170. Figure 1 The figure shows a state where the chamber door 160 is closed and the sample stage 120 is pushed into the chamber 150. Figure 2 The figure shows a state where the chamber door 160 is opened and the sample stage 120 is pulled out from the chamber 150 .

[0076] The ion source 110 generates an ion beam and irradiates the generated ion beam IB to the sample S. The ion source 110 is installed at an upper portion of the chamber 150 .

[0077] The sample stage 120 supports the sample S. The sample stage 120 includes a tilt mechanism 20, a rotation mechanism 22, a swing mechanism 24, a Z stage 26, and an XY stage 28. Figure 1 and Figure 2 In the example shown, an XY stage 28 is arranged on a swing table 24a of the swing mechanism 24. A Z stage 26 is arranged on the XY stage 28. The Z stage 26 is provided with a tilt mechanism 20, and a rotating mechanism 22 is supported by the tilt mechanism 20 so as to be tiltable. A sample S is provided on the rotating mechanism 22.

[0078] Figure 3Schematically shows the sample S supported by the sample stage 120. Figure 3 , a top view of the surface Sa of the sample S and a cross-sectional view including the center of the sample S are shown.

[0079] The tilting mechanism 20 tilts the sample S. By tilting the sample S using the tilting mechanism 20, the irradiation angle α (incident angle) of the ion beam IB relative to the surface Sa of the sample S can be adjusted. The tilting mechanism 20 tilts the sample S by tilting the rotating mechanism 22. The tilting mechanism 20 includes: an axis member that supports the rotating mechanism 22 so that it can tilt; and a support portion that supports the axis member. The tilting mechanism 20 can also tilt the sample S using a drive device such as a motor.

[0080] The rotating mechanism 22 rotates the sample S with the axis A as the rotation axis. The axis A is perpendicular to the surface Sa of the sample S. By tilting the rotating mechanism 22 using the tilting mechanism 20, the axis A is also tilted. Therefore, even if the sample S is tilted using the tilting mechanism 20, the axis A is always perpendicular to the surface Sa of the sample S. The rotation center RC of the sample S when the sample S is rotated by the rotating mechanism 22 is the position of the intersection of the surface Sa of the sample S and the axis A. The rotating mechanism 22 includes: a sample table, which fixes the sample S; and a driving device such as a motor, which rotates the sample table.

[0081] The swing mechanism 24 swings the sample S. That is, the swing mechanism 24 makes the sample S reciprocate on the circumference (reciprocating circular motion). The swing mechanism 24 swings the tilt mechanism 20, the rotation mechanism 22, the Z stage 26 and the XY stage 28 as a whole. The axis B serving as the swing axis is parallel to the Y axis. The swing center SC of the sample S is the position of the intersection of the surface Sa of the sample S and the axis B. The swing center SC can be set at any position on the surface Sa of the sample S. By moving the sample S using the Z stage 26 or the XY stage 28, the position of the swing center SC can be moved. The swing mechanism 24 includes a swinging worktable 24a and a driving device 24b such as a motor that swings the swinging worktable 24a.

[0082] The Z stage 26 moves the sample S in the Z direction. The Z stage 26 can be used to adjust the position of the sample S in the Z direction, that is, the height of the sample S. The Z stage 26 moves the sample S in the Z direction by moving the tilting mechanism 20 in the Z direction. The Z stage 26 moves the tilting mechanism 20 and the rotating mechanism 22 in the Z direction as a whole. By moving the sample S in the Z direction using the Z stage 26, the distance D between the rotation center RC and the swing center SC can be adjusted. That is, in the sample processing device 100, the distance D is variable. The Z stage 26 moves the sample S in the Z direction using a driving device such as a motor. Alternatively, the sample S may be moved in the Z direction by manually operating the Z stage 26.

[0083] The XY stage 28 moves the sample S in the X direction and the Y direction. The XY stage 28 can be used to adjust the position of the sample S in the X direction and the Y direction. The XY stage 28 moves the sample S in the X direction and the Y direction by moving the Z stage 26 in the X direction and the Y direction. The XY stage 28 moves the tilt mechanism 20, the rotation mechanism 22 and the Z stage 26 as a whole. The XY stage 28 can adjust the distance B between the center BC of the ion beam IB and the rotation center RC. That is, in the sample processing device 100, the distance B is variable. The XY stage 28 uses a driving device such as a motor to move the sample S in the X direction and the Y direction. In addition, the XY stage 28 can be manually operated to move the sample S in the X direction and the Y direction.

[0084] The alignment camera 130 is a camera for determining the position of the optical axis of the ion beam IB. For example, when the chamber door 160 is opened and the sample stage 120 is pulled out of the chamber 150, the center of the field of view of the alignment camera 130 becomes the position of the optical axis of the ion beam IB when the chamber door 160 is closed and the sample stage 120 is pushed into the chamber 150. When the chamber door 160 is closed, the alignment camera 130 is arranged at a retreat position away from the ion source 110.

[0085] The processing observation camera 140 is a camera for observing the sample S being processed. The optical axis of the processing observation camera 140 is parallel to the Y axis. The processing observation camera 140 is arranged outside the cavity 150. The processing observation camera 140 can observe the sample S in the cavity 150 through the observation window 162 provided in the cavity 150.

[0086] The sample stage 120 is accommodated in the chamber 150. In the sample processing apparatus 100, the sample S is irradiated with the ion beam IB in the chamber 150. The chamber 150 can be maintained in a reduced pressure state by a vacuum pump (not shown).

[0087] The cavity door 160 hermetically seals the cavity 150. The sample carrier 120 is mounted on the cavity door 160. The cavity door 160 can slide relative to the cavity 150, and the cavity door 160 can be opened and closed by sliding the cavity door 160. Therefore, the cavity door 160 can be closed to push the sample carrier 120 into the cavity 150, or the cavity door 160 can be opened to pull the sample carrier 120 out of the cavity 150.

[0088] The control unit 170 controls each unit of the sample processing device 100. The control unit 170 controls the ion source 110, for example, via the ion source control circuit 112. The ion source control circuit 112 converts a control signal from the control unit 170 into a drive signal for driving the ion source 110 and outputs the drive signal to the ion source 110. In addition, the control unit 170 controls, for example, the sample stage 120. When the processing conditions are set by the user, the control unit 170 operates the ion source 110 and the sample stage 120 according to the processing conditions.

[0089] When using the sample processing device 100 and processing the sample S by the plane milling method, the energy of the ion beam IB (the acceleration voltage of the ion beam), the irradiation angle α of the ion beam IB, the rotation speed of the sample S, the swing angle range of the sample S, the swing speed of the sample S, the distance B between the rotation center RC of the sample S and the center BC of the ion beam IB, the distance D between the rotation center RC of the sample S and the swing center SC, and the processing time are set as processing conditions.

[0090] In the sample processing device 100, when the processing conditions are set, the control unit 170 controls the ion source 110 and the sample stage 120 according to the processing conditions. Specifically, the control unit 170 controls the acceleration voltage of the ion source 110 according to the energy of the set ion beam IB. In addition, the control unit 170 controls the tilt mechanism 20 according to the set irradiation angle α of the ion beam IB. In addition, the control unit 170 controls the rotation mechanism 22 according to the set rotation speed. In addition, the control unit 170 controls the swing mechanism 24 according to the set swing angle range and swing speed. In addition, the control unit 170 controls the XY stage 28 according to the set distance B between the rotation center RC of the sample S and the center BC of the ion beam IB. In addition, the control unit 170 controls the Z stage 26 according to the set distance D between the rotation center RC of the sample S and the swing center SC.

[0091] As a result, in the sample processing device 100, the distance B between the rotation center RC of the sample S and the center BC of the ion beam IB becomes the set distance, and the distance D between the rotation center RC of the sample S and the swing center SC becomes the set distance. In addition, the inclination angle of the sample S is the angle at which the ion beam IB is incident on the surface Sa of the sample S at the set irradiation angle α. In addition, the ion beam IB is irradiated to the sample S from the ion source 110 with the set energy (acceleration voltage). The ion beam IB is incident on the surface Sa of the sample S at the set irradiation angle α. At this time, the sample S rotates with the rotation center RC as the center at the set rotation speed, and swings with the swing center SC as the center at the set swing speed within the set swing angle range. The control unit 170 causes the ion source 110 to irradiate the ion beam IB for the set processing time. As a result, the sample S can be processed under the set processing conditions.

[0092] Alternatively, the user may manually operate the sample stage 120 to adjust the tilt angle of the sample S, the distance B between the rotation center RC of the sample S and the center BC of the ion beam IB, the distance D between the rotation center RC of the sample S and the swing center SC, and the like.

[0093] (2) Image Generating Device

[0094] Figure 4 2 is a diagram showing the structure of the image generating device 200. Figure 4 As shown, the image generating device 200 includes a processing unit 210 , an input unit 220 , a display unit 230 , and a storage unit 240 .

[0095] The input unit 220 is used to allow the user to input operation information, and output the input operation information to the processing unit 210. The function of the input unit 220 can be realized by an input device such as a keyboard, a mouse, a button, a touch panel, etc.

[0096] The display unit 230 displays an image generated by the processing unit 210. The function of the display unit 230 can be realized by a liquid crystal display (LCD), a touch panel that also functions as the input unit 220, or the like.

[0097] The storage unit 240 stores programs and various data for causing the computer to function as each unit of the processing unit 210. The storage unit 240 also functions as a work area for the processing unit 210. The function of the storage unit 240 can be realized by a hard disk and a RAM (Random Access Memory).

[0098] The functions of the processing unit 210 can be realized by executing a program on hardware such as various processors (CPU, DSP, etc.). The processing unit 210 includes an image generating unit 212 and a display control unit 214 .

[0099] The image generation unit 212 generates a predicted image when the sample S is processed using the sample processing device 100 under the set processing conditions. The predicted image includes information on the irradiation intensity of the ion beam IB and information on the irradiation direction of the ion beam IB when the sample S is processed under the set processing conditions. That is, it is possible to know from the predicted image which position of the sample S is irradiated with which degree of irradiation intensity of the ion beam IB from which irradiation direction. The image generation unit 212 generates a predicted image by performing simulation based on the set processing conditions.

[0100] The display control unit 214 causes the display unit 230 to display the predicted image generated by the image generating unit 212 .

[0101] 1.2. Image Generation Method

[0102] Next, a method for generating a predicted image will be described. Figure 5 This is a flowchart showing an example of an image generation method for generating a predicted image.

[0103] 1.2.1. Processing Condition Acquisition Step S10

[0104] First, the image generation unit 212 acquires information on processing conditions. The image generation unit 212 receives information on processing conditions input by the user via the input unit 220 to acquire information on processing conditions.

[0105] Figure 6 This is a diagram schematically showing an example of a GUI (Graphical User Interface) screen 4 of the image generating device 200 .

[0106] like Figure 6 As shown, the GUI screen 4 includes: a processing condition setting section G2, which is used to set processing conditions; a sample image display section G4, which visualizes the processing conditions to display the positional relationship between the sample S and the ion beam IB; and a predicted image display section G6, which displays the generated predicted image.

[0107] The processing condition setting section G2 is provided with sliders for setting various parameters of the processing conditions. Specifically, the processing condition setting section G2 is provided with a slider for setting the energy (Energy) of the ion beam IB, a slider for setting the irradiation angle α (Angle) of the ion beam IB, a slider for setting the swing angle range (Swing) of the sample S, a slider for setting the distance B (Eccent) between the rotation center RC of the sample S and the center BC of the ion beam IB, a slider for setting the distance D (Distance) between the rotation center RC of the sample S and the swing center SC, and a slider for setting the processing time (Time). Although not shown in the figure, a slider for setting the swing speed of the sample S may also be provided in the processing condition setting section G2.

[0108] In addition, the GUI element for setting the parameter is not limited to the slider. For example, an input field for directly inputting a parameter as a numerical value may be arranged in the processing condition setting part G2.

[0109] The display of the processing condition setting unit G2 is, for example, the same display as the GUI for setting processing conditions in the sample processing device 100. Therefore, after confirming the predicted image generated by the image generating device 200 and determining the processing conditions, it is easy to input various parameters in the GUI of the sample processing device 100.

[0110] The sample image display section G4 displays an image of the sample S corresponding to the set processing conditions. Specifically, an image of the sample S reflecting the tilt angle of the sample S (irradiation angle of the ion beam IB), the distance B between the rotation center RC of the sample S and the center BC of the ion beam IB, and the distance D between the rotation center RC of the sample S and the swing center SC is displayed.

[0111] Here, in the sample processing device 100, the distance B is adjusted while viewing the alignment camera 130. Therefore, the distance between the rotation center RC of the sample S when viewed from the alignment camera 130 and the center BC of the ion beam IB calculated based on the tilt angle of the sample S and the distance B is displayed on the sample image display unit G4.

[0112] The generated predicted image is displayed in the predicted image display unit G6. The image of the sample before processing and the predicted image are displayed in a superimposed manner in the predicted image display unit G6. The predicted image display unit G6 is provided with a slider 6 for setting the transparency when the predicted image is superimposed on the image of the sample before processing. In addition, a check box 8 is provided for displaying the image of the sample before processing by superimposing only half of the predicted image. The details of the display method of the predicted image in the predicted image display unit G6 will be described later.

[0113] 1.2.2. Ion beam information acquisition step S20

[0114] Next, the image generation unit 212 obtains information about the ion beam IB. The information about the ion beam IB is, for example, information about the distribution of the brightness of the ion beam IB when the sample S is irradiated with the ion beam IB of the set energy at the set irradiation angle α. The information about the distribution of the brightness of the ion beam IB can be obtained, for example, from an ion beam image obtained by photographing a test sample that emits light due to the irradiation of the ion beam. The following describes a method for obtaining an ion beam image.

[0115] First, a glass sample is prepared as a sample to emit light by irradiation with an ion beam. Figure 2 As shown, the chamber door 160 is opened to pull out the sample stage 120 from the chamber 150, and the glass sample is mounted on the sample stage 120. Next, the tilting mechanism 20 is used to adjust the tilting angle of the glass sample so that the irradiation angle α of the ion beam IB becomes the irradiation angle set as the processing condition. Next, while observing the glass sample with the alignment camera 130, the XY stage 28 is operated to align the glass sample so that the glass sample is located at the irradiation position of the ion beam IB.

[0116] Next, if Figure 1 As shown, the chamber door 160 is closed and the sample stage 120 is pushed into the chamber 150. Next, the chamber 150 is evacuated. Next, the energy (acceleration voltage) of the ion beam IB is set, and the ion beam IB is irradiated to the glass sample. At this time, the rotating mechanism 22 and the swinging mechanism 24 are not operated, and the glass sample is set to a stationary state.

[0117] Next, the glass sample irradiated with the ion beam IB is photographed by the processing observation camera 140. Thus, an ion beam image can be obtained. In addition, at this time, the current of the ion beam IB is measured.

[0118] The captured ion beam image is an image captured from an oblique direction at an inclination angle of the glass sample with respect to the surface of the glass sample. Therefore, the captured ion beam image is stretched at a magnification corresponding to the inclination angle so as to become an image captured from a direction perpendicular to the surface of the glass sample. Thus, the ion beam image becomes an image captured from a direction perpendicular to the surface of the glass sample. The ion beam image is, for example, an image of grayscale corresponding to the brightness of each pixel and the irradiation intensity of the ion beam IB.

[0119] Figure 7The ion beam image Ia before correction and the ion beam image Ib after correction are shown. The ion beam image Ia is taken by tilting the glass sample by 80°. Here, since 1 / sin(80°)=1.0154, the ion beam image Ia is stretched 1.0154 times in the longitudinal direction corresponding to the tilt direction of the glass sample. Thus, the ion beam image Ib can be obtained.

[0120] 1.2.3. Step S30 of generating predicted images at each time

[0121] (1) First Moment

[0122] Next, a prediction image at the first time is generated. The first time is the time to start processing. Figure 8 and Fig. 9 This is a diagram for explaining the process of generating a predicted image at the first time point.

[0123] First, if Figure 8 As shown, the ion beam image Ib is arranged at a distance B between the set rotation center RC and the center BC of the ion beam IB, and the irradiation intensity distribution image Ib-1 at the first moment is generated. The irradiation intensity distribution image Ib-1 at the first moment is an image showing the distribution of the irradiation intensity of the ion beam IB at the first moment. Figure 8 In the irradiation intensity distribution image Ib-1 shown, the irradiation intensity of the ion beam IB is expressed by brightness.

[0124] Next, the vector components are decomposed for each pixel of the irradiation intensity distribution image Ib-1 at the first moment to generate a radial component image Ir-1 representing the intensity distribution of the radial component of the ion beam IB, and a rotational component image In-1 representing the intensity distribution of the rotational component of the ion beam IB.

[0125] Specifically, first, in each pixel of the irradiation intensity distribution image Ib-1, the brightness S el The vector with the length of ion beam IB as the direction is separated into the radial component S with the rotation center RC as the center. el The component S of cosξ and the rotation direction el sinξ. Here, angle ξ is the angle between the radial direction and the irradiation direction of the ion beam in each pixel. Fig. 9 In FIG. 1 , the irradiation direction of the ion beam IB is shown by arrow C. From the radial components of each pixel thus obtained, a radial component image Ir-1 is generated in which the magnitude of the radial component is represented by brightness. In addition, from the rotational components of each pixel, a rotational component image In-1 is generated in which the magnitude of the rotational component is represented by brightness.

[0126] Next, the radius component image Ir-1 and the rotation component image In-1 are superimposed together to generate a vector component distribution image Irn-1 representing the distribution of the irradiation intensity in the radial direction and the irradiation intensity in the rotation direction of the ion beam at the first moment. Specifically, in each corresponding pixel of the radius component image Ir-1 and the rotation component image In-1, the brightness value is added with the radial direction being positive and the rotation direction being negative.

[0127] For example, the radial component image Ir-1 is set to a 256-grayscale image, and the rotation component image In-1 is set to a 256-grayscale image, and the radial direction is positive and the rotation direction is negative. The image of 512 grayscale is added. When the 512 grayscale image is output as a 256-grayscale image, the brightness equivalent to zero is set to the middle 128th grayscale, and on this basis, the larger value of the absolute value of the maximum value and the minimum value is used for normalization.

[0128] Thus, in the vector component distribution image Irn-1, the portion brighter than the intermediate color indicates that the intensity of the ion beam in the radial direction is large, and the portion darker than the intermediate color indicates that the intensity of the ion beam in the rotational direction is large. In this way, the irradiation intensity of the ion beam IB in the radial direction and the irradiation intensity of the ion beam IB in the rotational direction can be visualized. In the vector component distribution image Irn-1, it can be said that the portion brighter than the intermediate color is prone to produce processing stripes in the radial direction, and the portion darker than the intermediate color is prone to produce processing stripes in the rotational direction.

[0129] In this way, the irradiation intensity distribution image Ib-1 and the vector component distribution image Irn-1 can be generated as the predicted images at the first time point.

[0130] (2) Second Moment

[0131] (2-1) Ion beam irradiation position (swing)

[0132] Next, at the second time, the irradiation position of the ion beam IB that has moved due to the swing of the sample S, that is, the position of the center BC is obtained. The second time is a time after the first time. The second time is, for example, one second after the first time.

[0133] Fig.10 This is a diagram for explaining a method of calculating the irradiation position of the ion beam IB that has moved due to the swing of the sample at the second time.

[0134] First, the rotation angle β of the ion beam IB that is rotated by oscillating the sample S during the period from the first time to the second time is obtained. The rotation angle β can be obtained from the oscillation speed, the oscillation angle, and the elapsed time.

[0135] Next, the coordinates (xl, yl) of the center BC of the ion beam IB at the second moment are calculated using the rotation angle β of the ion beam caused by the swing, the distance D between the swing center SC and the rotation center RC, and the distance B between the rotation center RC and the center BC, and the calculation result is converted into a polar coordinate system and set as the coordinates (r, θ1). The coordinates (r, θ1) of the center BC can be obtained by the following calculation formula.

[0136] x1=(D+B)sinβ

[0137] y1=D-(D+B)cosβ

[0138] r=(x1 2 +y1 2 ) 1 / 2

[0139] θ1=tan -1 (y1 / x1)

[0140] Using these calculation formulas, the coordinates (r, θ1) of the center BC of the ion beam IB moved by the oscillation are obtained at the second time.

[0141] (2-2) Ion beam irradiation position at the second time (rotation)

[0142] Next, at the second time point, the irradiation position of the ion beam IB that has moved due to the rotation is obtained. Fig.11 This is a diagram for explaining a method of calculating the irradiation position of the ion beam IB that has moved due to the rotation of the sample at the second time.

[0143] First, the rotation angle γ of the ion beam IB that is rotated by rotating the sample S during the period from the first time to the second time is obtained. The rotation angle γ can be obtained from the rotation speed and the elapsed time.

[0144] Next, the coordinates (x2, y2) of the center BC of the ion beam IB at the second moment are obtained. Here, first, after adding the rotation angle γ to the angle θ1 to make the coordinates of the center BC (r, θ2), the coordinates (r, θ2) are converted into orthogonal coordinates (x2, y2). The rotation angle φ of the ion beam IB at the second moment can be obtained by adding the rotation angle β to the rotation angle γ. The coordinates (x2, y2) of the center BC can be obtained by the following calculation formula.

[0145] r=(x2 2 +y2 2 ) 1 / 2

[0146] θ2=θ1+γ

[0147] φ=β+γ

[0148] Using these calculation formulas, the coordinates (x2, y2) of the center BC of the ion beam IB at the second time are obtained.

[0149] (2-3) Component decomposition of vector

[0150] Next, the ion beam image Ib is configured at the coordinates (x2, y2) of the center BC of the ion beam IB to generate the irradiation intensity distribution image Ib-2 at the second moment. Next, the vector component is decomposed for each pixel of the irradiation intensity distribution image Ib-2 at the second moment to generate the radius component image Ir-2 and the rotation component image In-2 at the second moment.

[0151] Fig.12 A diagram for explaining the component decomposition of a vector.

[0152] In the pixel at coordinate (x3, y3), the brightness S el The vector with the size of as the length and the irradiation direction of the ion beam IB as the direction is separated into a radial component Sr and a rotational component Sn centered on the rotation center RC. At the second moment, the radial component Sr and the rotational component Sn in the pixel of the coordinate (x3, y3) can be calculated by the following calculation formula.

[0153] Ψ=tan -1 (y3 / x3)

[0154] ξ=Ψ+(π / 2-φ)

[0155] Sr=|S el cosξ|

[0156] Sn=|S el sinξ|

[0157] By using the above calculation formula, the radial component Sr and the rotational component Sn can be obtained at the coordinate (x3, y3). For other pixels of the irradiation intensity distribution image Ib-2, the radial component Sr and the rotational component Sn can also be obtained using the above formula. In this way, the radial component image Ir-2 and the rotational component image In-2 can be generated.

[0158] Next, the radial component image Ir-2 and the rotation component image In-2 are superimposed to generate a vector component distribution image Irn-2 representing the distribution of the irradiation intensity in the radial direction and the irradiation intensity in the rotation direction of the ion beam at the second moment. In this way, the irradiation intensity distribution image Ib-2 and the vector component distribution image Irn-2 can be generated as a predicted image at the second moment.

[0159] At each time point after the second time point until the end of the machining time, the irradiation intensity distribution image and the vector component distribution image are generated in the same manner as in the case of the second time point.

[0160] 1.2.4. Step S40 of adding predicted images at each time

[0161] The irradiation intensity distribution images at each moment from the first moment to the nth moment after the processing time have passed are added together to generate an irradiation intensity distribution image representing the distribution of the irradiation intensity of the ion beam IB after the set processing time has passed. Specifically, the brightness values ​​of the corresponding pixels of the irradiation intensity distribution images from the first moment to the nth moment are added together to generate an irradiation intensity distribution image after the set processing time has passed. Fig.13 This is an image showing a state where the irradiation intensity distribution images from the first time to the ninth time are superimposed. In addition, the interval between each time is 1 second.

[0162] Similarly, the vector component distribution images at each time from the first time to the nth time are added together to generate a vector component distribution image showing the distribution of the irradiation intensity in the radial direction and the distribution of the irradiation intensity in the rotational direction of the ion beam IB after the set processing time has passed.

[0163] Through the above steps, it is possible to generate an irradiation intensity distribution image and a vector component distribution image as predicted images when the sample S is processed under the set processing conditions.

[0164] 1.3. Predicting Images

[0165] 1.3.1. Irradiation intensity distribution image

[0166] Fig.14 1 is a diagram showing an irradiation intensity distribution image showing the distribution of the irradiation intensity of the ion beam IB on the sample S when the sample S is processed under the set processing conditions. Fig.14 , four irradiation intensity distribution images generated by changing the processing conditions are shown.

[0167] Specifically, in Fig.14 , there are shown the irradiation intensity distribution images obtained under the processing conditions where the irradiation angle α of the ion beam IB is set to 80° and there is no swing, the irradiation intensity distribution image obtained under the processing conditions where the irradiation angle α is set to 80° and the swing angle is set to -30° to +30°, the irradiation intensity distribution image obtained under the processing conditions where the irradiation angle α is set to 85° and there is no swing, and the irradiation intensity distribution image obtained under the processing conditions where the irradiation angle α is set to 85° and the swing angle is set to -30° to +30°. In each irradiation intensity distribution image, the other processing conditions are the same. In addition, Fig.14In each of the irradiation intensity distribution images shown, the brightness is normalized at the maximum brightness.

[0168] Fig.15 It is a graph showing the brightness profile of each irradiation intensity distribution image. Fig.15 The 4 brightness curves shown are Fig.14 The brightness curve on the center line of each illumination intensity distribution image shown in FIG. Fig.15 In each brightness curve shown, the current value of the ion beam is normalized by the total brightness of the irradiation intensity distribution image and converted into current density, and then the depth direction component of the sample of the ion beam irradiated at the irradiation angle α is multiplied as a coefficient. Fig.15 The vertical axis of the coordinate diagram shown corresponds to the machining depth.

[0169] from Fig.14 The four illumination intensity distribution images shown and Fig.15 As can be seen from the four brightness curves shown, by oscillating the sample S, a wider smooth area can be formed near the center of the sample S, compared with the case where there is no oscillation.

[0170] 1.3.2. Vector component distribution image

[0171] Fig.16 1 is a diagram showing a vector component distribution image showing the distribution of the irradiation intensity in the radial direction and the irradiation intensity in the rotational direction of the ion beam IB on the sample S when the sample S is processed under the set processing conditions. Fig.16 , four vector component distribution images generated by changing the processing conditions are shown.

[0172] exist Fig.16 In the vector component distribution images shown, the brightness is normalized to the maximum brightness. Fig.16 In the distribution images of each vector component shown, the portion brighter than the intermediate color indicates that the irradiation intensity of the ion beam in the radial direction is large, and the portion darker than the intermediate color indicates that the irradiation intensity of the ion beam in the rotational direction is large. That is, the portion brighter than the intermediate color is prone to produce processing stripes in the radial direction, and the portion darker than the intermediate color is prone to produce processing stripes in the rotational direction.

[0173] Fig.17 It is a coordinate diagram showing the brightness curve of each vector component distribution image. Fig.17 The 4 brightness curves shown are Fig.16 The brightness curve of the center line of the distribution image of each vector component shown in FIG. Fig.17In each brightness curve shown, if the intensity shown on the vertical axis is positive, it means that the irradiation intensity of the ion beam in the radial direction is large, and if the intensity shown on the vertical axis is negative, it means that the irradiation intensity of the ion beam in the rotation direction is large. That is, if the intensity is positive, it is easy to generate processing stripes in the radial direction, and if the intensity is negative, it is easy to generate processing stripes in the rotation direction.

[0174] from Fig.16 The four vector component distribution images and Fig.17 From the four brightness curves shown, when the sample S is not swung, the area formed near the center of the sample S where the ion beam is irradiated from the rotation direction and the radial direction is narrow, and the irradiation intensity of the ion beam in the radial direction is large in the area outside the vicinity of the center. In other words, when the sample S is not swung, the area near the center of the sample S where processing fringes are not easily generated is narrow, and processing fringes in the radial direction are easily generated in the area outside the vicinity of the center.

[0175] In contrast, when the sample S is swung, the area irradiated with the ion beam in both the rotational direction and the radial direction is widened near the center of the sample S, and the intensity of the ion beam is small in both the radial direction and the rotational direction even in the area other than the vicinity of the center. That is, when the sample S is swung, a smooth area with little influence of processing streaks can be widely formed near the center of the sample S, compared with the case where the sample S is not swung.

[0176] 1.3.3. Display method

[0177] exist Fig.16 In the vector component distribution image shown, the distribution of the irradiation direction of the ion beam IB is represented by making the irradiation intensity of the ion beam IB in the radial direction brighter than the intermediate color and making the irradiation intensity of the ion beam in the rotation direction darker than the intermediate color. In addition, the representation method of the distribution of the irradiation direction of the ion beam IB is not limited to this.

[0178] For example, the distribution of the irradiation direction of the ion beam IB can also be represented by color. Specifically, the irradiation intensity in the radial direction can be represented by cyan (green + blue), and the irradiation intensity in the rotational direction can be represented by red. In this display method, when the irradiation intensity in the radial direction is the same as the irradiation intensity in the rotational direction, the chromaticity disappears and becomes grayscale, so the same information as the irradiation intensity distribution image can be represented in the vector component distribution image. That is, in this display method, the intensity distribution and the irradiation direction distribution of the ion beam IB can be represented by one image. In addition, the combination of colors is not limited to cyan and red, but can also be a combination of magenta (red + blue) and green, or a combination of yellow (red + green) and blue.

[0179] 1.3.4. Correction of predicted images

[0180] In the above Fig.15 In the brightness curve shown, the brightness of the irradiation intensity distribution image is corrected by a coefficient equivalent to the current density and the irradiation angle, but the brightness of the irradiation intensity distribution image can also be corrected by the processing depth of the sample actually processed under the same processing conditions to create a brightness curve. In this way, the vertical axis of the brightness curve can be expressed in terms of processing depth.

[0181] Furthermore, since the milling rate also varies depending on the energy of the ion beam or the material constituting the sample, the brightness of the irradiation intensity distribution image can also be corrected according to the processing conditions or the sample set by the user.

[0182] 1.4. Display

[0183] In the image generating device 200, the display control unit 214 causes the display unit 230 to display the predicted image. For example, the display control unit 214 causes the display unit 230 to display the predicted image. Figure 6 The predicted image display unit G6 of the GUI screen 4 shown displays a predicted image.

[0184] Fig.18 FIG. 1 is a diagram for explaining an example of a method for displaying a predicted image. Fig.18 As shown, the image of the sample S before processing and the vector component distribution image are displayed in a superimposed manner. Furthermore, the position shown by the horizontal axis of the brightness curve is aligned with the position of the image of the sample S. The image of the sample S before processing is, for example, an image taken by the alignment camera 130 or the processing observation camera 140.

[0185] In addition, Fig.18 In the example shown, the vertical axis of the brightness curve is converted to processing depth. Fig.18 The brightness curve shown includes a curve of processing depth and a curve of a component in the radial direction.

[0186] Fig.19 is a diagram for explaining an example of a method for displaying a predicted image. Fig.19 In the example shown, the image of the sample S before processing and the left half of the vector component distribution image are displayed in a superimposed manner.

[0187] Fig. 20 is a diagram for explaining an example of a method for displaying a predicted image. Fig. 20 In the example shown, the image of the processed sample S and the vector component distribution image are displayed superimposed. Fig. 20In the example shown, the image of the processed sample S is displayed superimposed on the left half of the vector component distribution image. The brightness curve is displayed such that the position indicated by the horizontal axis of the brightness curve is aligned with the position of the image of the sample S.

[0188] Fig.21 is a diagram for explaining an example of a method for displaying a predicted image. Fig.21 In the example shown, the brightness of the irradiation intensity distribution image is corrected to the processing depth, and displayed as a three-dimensional coordinate graph indicating the position on the sample S and the processing depth at the position.

[0189] Fig. 22 is a diagram for explaining an example of a method for displaying a predicted image. Fig. 22 In the example shown, both an image in which the image of the sample S before processing and the vector component distribution image are superimposed and displayed, and a three-dimensional coordinate graph indicating positions on the sample S and processing depths at the positions are displayed.

[0190] 1.5. Image generation and processing

[0191] Fig.23 : is a flowchart showing an example of the image generation process of the image generation device 200 .

[0192] First, the image generation unit 212 obtains information on the set processing conditions (S100). The processing conditions are set, for example, by inputting the processing conditions on the GUI screen 4. The image generation unit 212 obtains information on the processing conditions input by the user to the GUI screen 4 via the input unit 220. In addition, the image generation unit 212 may also obtain information on the processing conditions from the control unit 170.

[0193] The processing conditions include the energy of the ion beam IB (acceleration voltage of the ion beam), the irradiation angle α of the ion beam IB, the rotation speed of the sample S, the swing angle range of the sample S, the swing speed of the sample S, the distance B between the rotation center RC of the sample S and the center BC of the ion beam IB, the distance D between the rotation center RC of the sample S and the swing center SC, and the processing time. The information of the processing conditions is stored in the storage unit 240.

[0194] Next, the image generation unit 212 obtains information on the ion beam IB (S102). For example, the image generation unit 212 obtains Figure 6 The ion beam image Ib shown is information of the ion beam IB. The ion beam image Ib is stored in the storage unit 240, for example.

[0195] Next, the image generator 212 generates a predicted image at the first moment based on the processing conditions and the information of the ion beam IB (S104). The image generator 212 generates the irradiation intensity distribution image Ib-1 and the vector component distribution image Irn-1 as the predicted image at the first moment by the method described in the above step S30.

[0196] Next, the image generation unit 212 generates a predicted image at the mth moment based on the processing conditions (S106). Here, it is assumed that m=2, and the image generation unit 212 generates a predicted image at the second moment. The image generation unit 212 generates the irradiation intensity distribution image Ib-2 and the vector component distribution image Irn-2 as the predicted image at the second moment by the method described in the above step S30.

[0197] Next, the image generation unit 212 adds the predicted image at the first moment to the predicted image at the second moment (S108). Specifically, the irradiation intensity distribution image Ib-1 is added to the irradiation intensity distribution image Ib-2, and the vector component distribution image Irn-1 is added to the vector component distribution image Irn-2. In this way, a predicted image can be generated when processing is performed from the first moment to the second moment.

[0198] Next, the image generating unit 212 determines whether or not a predicted image at the n-th time point has been generated ( S110 ).

[0199] When the image generation unit 212 determines that the predicted image at the nth time has not been generated (No in S110), it sets m=2+1=3, returns to the process S106, and generates the predicted image at the third time (S106). Then, the image generation unit 212 adds the predicted image at the third time to the predicted image when the processing is performed from the first time to the second time (S108). In this way, the predicted image when the processing is performed from the first time to the third time can be generated.

[0200] The image generating unit 212 repeatedly performs the process S106 of generating a predicted image at the mth moment, the process S108 of adding the predicted image at the mth moment to the predicted image processed from the 1st moment to the m-1th moment, and the process S110 of determining whether the predicted image at the nth moment has been generated, until the predicted image at the nth moment is generated.

[0201] When the image generation unit 212 determines that the predicted image at the nth time has been generated (Yes in S110), the display control unit 214 causes the generated predicted image to be displayed on the display unit 230. The display control unit 214 causes the predicted image display unit G6 of the GUI screen 4 to display the generated predicted image through the above-mentioned Figure 14 to Figure 22 The display control unit 214 may also display the predicted image by using any of the display methods shown in the figure. Figure 14 to Figure 22 The display method selected by the user among the displayed display methods causes the predicted image to be displayed on the display unit 230 .

[0202] Through the above-described processing, it is possible to display a predicted image when the sample is processed under the set processing conditions.

[0203] 1.6. Effect

[0204] The sample processing system 2 includes: a sample processing device 100 that irradiates the sample S with an ion beam IB to process the sample S; and an image generation device 200 that generates a predicted image when the sample S is processed under the set processing conditions using the sample processing device 100. Therefore, in the sample processing system 2, a predicted image when the sample S is processed under the set processing conditions can be obtained, so that appropriate processing conditions can be easily determined.

[0205] Furthermore, in the sample processing system 2, the generated prediction image includes information on the distribution of the irradiation direction of the ion beam IB. Therefore, it is possible to predict in which region and in which direction the processing stripes formed by processing the sample S will be generated. For example, in the sample S, processing stripes along the irradiation direction of the ion beam IB may be generated in a region irradiated with the ion beam IB only from one direction.

[0206] In the sample processing system 2, the sample processing device 100 includes: an ion source 110 that irradiates the sample S with an ion beam IB; and a sample stage 120 that has a tilting mechanism 20 that tilts the sample S and a rotating mechanism 22 that rotates the sample S, and the processing conditions include the tilt angle of the sample S and the rotation speed of the sample S. Therefore, in the sample processing system 2, a predicted image that takes the tilt angle and the rotation speed into consideration can be generated, so the conditions of the tilt angle of the sample S and the conditions of the rotation speed of the sample S can be easily determined.

[0207] In the sample processing system 2, the sample stage 120 has a swing mechanism 24 for swinging the sample S, and the swing center SC of the sample S and the rotation center RC of the sample S are at different positions, and the processing conditions include the distance D between the rotation center RC and the swing center SC. Therefore, in the sample processing system 2, the sample S can be swung while rotating the sample S, so that the area irradiated with the ion beam IB can be expanded in the surface Sa of the sample S. Moreover, in the surface Sa of the sample S, the area irradiated with the ion beam IB from multiple directions can be expanded. In addition, in the sample processing system 2, a predicted image taking the distance D into consideration can be generated, so the condition of the distance D can be easily determined.

[0208] In the sample processing system 2, the distance D between the rotation center RC of the sample S and the swing center SC of the sample S is variable. In the sample processing system 2, a predicted image considering the distance D can be generated, so the condition of the distance D can be easily determined.

[0209] In the sample processing system 2, the distance between the center BC of the ion beam IB on the sample S and the rotation center RC of the sample S is variable, and the processing condition includes the distance B between the center BC and the rotation center RC. Therefore, in the sample processing system 2, the area irradiated with the ion beam IB can be expanded in the surface Sa of the sample S. Moreover, in the sample processing system 2, a predicted image considering the distance B can be generated, so the condition of the distance B can be easily determined.

[0210] In the sample processing system 2, the image generation device 200 calculates the irradiation direction of the ion beam IB at each moment in the processing based on the processing conditions, and generates a predicted image based on the irradiation direction of the ion beam IB at each moment. Therefore, in the sample processing system 2, a predicted image containing information on the distribution of the irradiation direction of the ion beam IB can be generated.

[0211] In the sample processing system 2, the image generating device 200 separates the vector representing the irradiation direction and irradiation intensity of the ion beam IB into a radial component and a rotational component with the rotation center RC of the sample S as the center at each moment. In addition, the image generating device 200 generates a predicted image including information on the distribution of the intensity of the ion beam IB in the radial direction and information on the distribution of the intensity of the ion beam IB in the rotational direction based on the radial component at each moment and the rotational component at each moment. Therefore, in the sample processing system 2, it is possible to know from the predicted image the area on the surface Sa of the sample S where processing stripes in the radial direction are likely to be generated and the area where processing stripes in the rotational direction are likely to be generated.

[0212] In the sample processing system 2 , the image generating device 200 displays the predicted image superimposed on the image of the sample S before processing. Therefore, in the sample processing system 2 , which region of the sample S will be processed and how by processing can be displayed in an easily understandable manner.

[0213] In the sample processing system 2, the image generating device 200 displays the irradiation direction of the ion beam in color in the predicted image. Therefore, the image generating device 200 can display the distribution of the irradiation direction of the ion beam in the predicted image in an easily understandable manner.

[0214] In the sample processing system 2, the prediction image includes information on the distribution of the ion beam irradiation intensity. Therefore, in the sample processing system 2, it is possible to know which region of the sample S will be processed to which depth when the sample S is processed under the set processing conditions.

[0215] In the sample processing system 2, the predicted image includes information on the distribution of the irradiation intensity of the ion beam IB in the radial direction with the rotation center RC of the sample S as the center, and information on the distribution of the irradiation intensity of the ion beam IB in the rotation direction with the rotation center RC of the sample S as the center. Therefore, in the sample processing system 2, it is possible to know the area on the surface Sa of the sample S where processing stripes in the radial direction are likely to be generated and the area where processing stripes in the rotation direction are likely to be generated when the sample S is processed under the set processing conditions.

[0216] The image generating device 200 includes: an image generating unit 212 that generates a predicted image when the sample S is processed by the sample processing device 100 that processes the sample S by irradiating the sample S with an ion beam under the set processing conditions; and a display control unit 214 that displays the predicted image. In addition, the predicted image includes information on the distribution of the irradiation direction of the ion beam IB. Therefore, in the image generating device 200, a predicted image can be generated when the sample S is processed under the set processing conditions, so the processing conditions can be easily determined.

[0217] The image generation method of the sample processing system 2 includes: a step of generating a predicted image when the sample processing device 100 processes the sample S by irradiating the sample S with an ion beam IB under set processing conditions; and a step of displaying the predicted image. In addition, the predicted image includes information on the distribution of the irradiation direction of the ion beam IB. Therefore, in the image generation method of the sample processing system 2, a predicted image can be obtained when the sample S is processed under the set processing conditions, so that appropriate processing conditions can be easily determined.

[0218] 2. Second Implementation Method

[0219] Next, a sample processing system according to a second embodiment will be described with reference to the drawings. Fig.24 1 is a diagram showing the configuration of the ion source 110 of the sample processing system of the second embodiment. In the sample processing system of the second embodiment, components having the same functions as those of the components of the sample processing system 2 of the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

[0220] The ion source 110 is a Penning type ion source. Fig.24 As shown, the ion source 110 includes an anode 11 , a cathode 12 , an extraction electrode 13 and a focusing electrode 14 .

[0221] The anode 11 is cylindrical. The space inside the anode 11 becomes an ionization chamber for generating ions. Although not shown, a gas is introduced into the ionization chamber from a gas supply unit. The gas introduced into the ionization chamber is, for example, argon gas.

[0222] The cathode 12 emits electrons. The cathode 12 also constitutes a pole piece that generates a magnetic field in the ionization chamber. Electrons emitted from the cathode 12 perform cyclotron motion due to the magnetic field generated by the pole piece. A discharge voltage is applied between the anode 11 and the cathode 12 to cause discharge.

[0223] The extraction electrode 13 extracts ions generated in the ionization chamber. The ions are accelerated by the electric field formed by the extraction electrode 13 and are released from the ion source 110 as an ion beam IB. An acceleration voltage is applied between the anode 11 and the extraction electrode 13 to accelerate the ions.

[0224] The focusing electrode 14 is disposed between the cathode 12 and the extraction electrode 13. The focusing electrode 14 is an electrode for controlling the spatial profile of the ion beam IB. Here, the spatial profile of the ion beam IB refers to the spatial intensity distribution of the ion beam IB.

[0225] In the ion source 110, an ion beam IB having uniform intensity can be obtained by controlling a focus voltage applied to the focus electrode 14. That is, in the ion source 110, an ion beam IB having a spatial characteristic close to a parallel beam can be emitted.

[0226] In the sample processing system 2, processing conditions include a discharge voltage, a focus voltage, and a flow rate of a gas introduced into an ionization chamber.

[0227] Fig.25 This is an example of a predicted image generated by the sample processing system 2 according to the second embodiment.

[0228] In the ion source 110, an ion beam IB with uniform intensity can be obtained. Fig.25 As shown, a wide area in the center of the sample S can be flattened, and a wide range can be milled.

[0229] Fig.26 1 is a diagram schematically showing a state where plane milling is performed on a sample S having a laminated structure. When the sample S is plane milled, a region that is milled to be flat and a region that is milled to be tapered are formed in the sample S. Fig.26The regions A and A' shown are milled flat. In contrast, the regions B and B' are milled into a conical shape. The angles of the cones in regions B and B' are different, so the amount of information that can be obtained is different. Specifically, the angle of the cone in region B' is smaller than that in region B, so the state of each layer can be confirmed.

[0230] Fig. 27 This is an example of a predicted image generated by the sample processing system 2 according to the second embodiment.

[0231] exist Fig. 27 , a brightness curve P1, a brightness curve P2, a brightness curve P3, and a brightness curve P4 are shown. The brightness curve P1 is a brightness curve obtained under the processing conditions that the intensity of the ion beam IB is made uniform using the focusing electrode 14, the irradiation angle α of the ion beam IB is set to 80°, and there is no swing. The brightness curve P2 is a brightness curve obtained under the processing conditions that the intensity of the ion beam IB is made uniform using the focusing electrode 14, the irradiation angle α of the ion beam IB is set to 80°, and the swing angle is set to -30° to +30°. The brightness curve P3 is a brightness curve obtained as a comparative example under the processing conditions that the focusing electrode is not used, the irradiation angle α of the ion beam IB is set to 80°, and there is no swing. The brightness curve P4 is a brightness curve obtained as a comparative example under the processing conditions that the focusing electrode is not used, the irradiation angle α of the ion beam IB is set to 80°, and the swing angle is set to -30° to +30°.

[0232] from Fig. 27 The difference in the region of the tapered shape can be seen from the brightness curve shown. Specifically, it can be seen that under the processing conditions of the brightness curve P2, the tapered angle becomes smaller as in the region B'.

[0233] 3. Third Implementation Method

[0234] Next, a sample processing system according to a third embodiment will be described with reference to the drawings. Fig.28 and Fig.29 1 is a diagram showing the configuration of a sample processing system 2 according to a third embodiment. In the sample processing system according to the third embodiment, components having the same functions as those of the components of the sample processing system 2 according to the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

[0235] like Fig.28 and Fig.29 As shown, the sample processing device 100 includes an ion source moving mechanism 180 that moves the ion source 110 in the Z direction.

[0236] The ion source moving mechanism 180 moves the ion source 110 in the Z direction. By moving the ion source 110 in the Z direction using the ion source moving mechanism 180, the distance between the ion source 110 and the sample S can be adjusted. Fig.28 In the process, the ion source 110 is moved along the +Z direction. Fig.29 In the process, the ion source 110 is moved along the -Z direction.

[0237] Fig.30 1 is a diagram for explaining the relationship between the distance D between the rotation center RC and the swing center SC of the sample S and the irradiation range of the ion beam IB. Fig.30 As shown, the longer the distance D is, the larger the irradiation range W of the ion beam IB can be.

[0238] However, when the Z stage 26 is used to move the sample S in the -Z direction to increase the distance D while the ion source 110 is fixed, the distance between the ion source 110 and the sample S increases. As a result, the irradiation intensity of the ion beam IB decreases, and the processing rate decreases.

[0239] In the sample processing system 2, when the Z stage 26 moves the sample S in the -Z direction to increase the distance D, the ion source 110 can be moved by the ion source moving mechanism 180 by the same distance in the -Z direction. Thus, the distance D can be increased without changing the distance between the sample S and the ion source 110.

[0240] As described above, in the sample processing system 2 , since the sample processing apparatus 100 includes the ion source moving mechanism 180 that moves the ion source 110 , the distance D can be changed without changing the distance between the sample S and the ion source 110 .

[0241] 4. Fourth Implementation Method

[0242] Next, a sample processing system according to a fourth embodiment will be described with reference to the drawings. Fig.31 and Fig.32 1 is a diagram showing the configuration of a sample processing system 2 according to a fourth embodiment. In the sample processing system according to the fourth embodiment, components having the same functions as those of the components of the sample processing system 2 according to the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

[0243] In the sample processing system 2 of the third embodiment described above, Fig.29 and Fig.30 As shown, since the sample processing apparatus 100 includes the ion source moving mechanism 180 , the distance D can be changed without changing the distance between the sample S and the ion source 110 .

[0244] In contrast, in the sample processing system 2 of the fourth embodiment, as shown in FIG. Fig.31 and Fig.32 As shown, the sample processing device 100 includes the swing movement mechanism 190 that moves the swing mechanism 24 , and therefore the distance D between the sample S and the ion source 110 can be changed without changing the distance.

[0245] The swing mechanism 190 includes: a chamber door 160 equipped with the swing mechanism 24 ; and a flange 192 that supports the chamber door 160 to be movable. The flange 192 is fixed to the chamber 150 .

[0246] like Fig.31 and Fig.32 As shown, the chamber door 160 can move in the Z direction. For example, by moving the chamber door 160 in the +Z direction, the swing mechanism 24 moves in the +Z direction. As a result, the distance D between the rotation center RC and the swing center SC of the sample S can be increased. At this time, the Z stage 26 is used to move the sample S in the -Z direction by the same distance as the swing mechanism 24. As a result, the distance D can be increased without changing the distance between the sample S and the ion source 110.

[0247] As described above, in the sample processing system 2 , since the swing movement mechanism 190 that moves the swing mechanism 24 is included, the distance D can be changed without changing the distance between the sample S and the ion source 110 .

[0248] 5. Fifth Implementation Method

[0249] Next, a sample processing system according to a fifth embodiment will be described with reference to the drawings. Fig.33 and Fig.34 1 is a diagram showing the configuration of a sample processing system 2 according to a fifth embodiment. In the sample processing system according to the fifth embodiment, components having the same functions as those of the components of the sample processing system 2 according to the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

[0250] In the sample processing system 2, as Fig.33 and Fig.34 As shown, the swing mechanism 24 includes a swing table 24a and a driving device 24b for swinging the swing table 24a. The swing mechanism 24 is disposed in the chamber 150. The swing mechanism 24 is disposed on the XY stage 28.

[0251] The driving device 24b can move on the XY stage 28. By moving the driving device 24b, the axis B serving as the swing axis can be moved. This makes it possible to adjust the distance between the ion source 110 and the axis B. The driving device 24b includes, for example, a vacuum compatible motor.

[0252] A tilting mechanism 20 is disposed on the swinging table 24a, and a rotating mechanism 22 to which the sample S is fixed is disposed on the tilting mechanism 20. The tilting mechanism 20 is configured to be movable along the Y direction on the swinging table 24a. By moving the tilting mechanism 20 along the Y direction, the distance between the ion source 110 and the sample S can be adjusted. In the sample processing system 2, the ion source 110 is mounted on the side wall of the -Y side in the chamber 150.

[0253] For example, by moving the driving device 24b of the swing mechanism 24 in the -Y direction, the axis B serving as the swing axis is moved in the -Y direction to increase the distance D between the swing center SC and the rotation center RC. At this time, the sample S is moved in the +Y direction by the same distance as the axis B using the XY stage 28. Thus, the distance D can be increased without changing the distance between the sample S and the ion source 110.

[0254] As described above, in the sample processing system 2 , since the swing mechanism 24 can move in the Y direction, the distance D can be changed without changing the distance between the sample S and the ion source 110 .

[0255] 6. Sixth Implementation Method

[0256] 6.1. Sample processing system

[0257] Next, a sample processing system according to a sixth embodiment will be described with reference to the accompanying drawings. Figure 1 and Figure 2 The sample processing system 2 of the first embodiment shown is the same, and the description thereof is omitted.

[0258] Image Generation Method

[0259] In the sample processing system 2 of the first embodiment described above, the image generating device 200 generates Fig.14 and Fig.15 The irradiation intensity distribution image shown, and Fig.16 and Fig.17 The vector component distribution image of the ion beam IB is shown as a predicted image.

[0260] On the other hand, the image generating device 200 may generate an irradiation direction distribution image indicating only the distribution of the irradiation direction of the ion beam IB as a predicted image.

[0261] Figure 35 to Figure 37 is a diagram showing an example of an irradiation direction distribution image. Figure 35 to Figure 37 , a diagram for explaining processing conditions and an irradiation direction distribution image are shown respectively.

[0262] Fig.35This is an irradiation direction distribution image when machining is performed under machining conditions in which the rotation center RC coincides with the center BC of the ion beam IB. Fig.36 This is an irradiation direction distribution image when machining is performed under machining conditions in which the rotation center RC coincides with the center BC of the ion beam IB and the rotation center RC is offset from the swing center SC. Fig.37 This is an irradiation direction distribution image when machining is performed under machining conditions in which the rotation center RC is offset from the center BC of the ion beam IB and the rotation center RC is offset from the swing center SC.

[0263] from Figure 35 to Figure 37 As can be seen from the irradiation direction distribution image shown, by shifting the rotation center RC from the center BC of the ion beam IB and shifting the rotation center RC from the swing center SC, the area irradiated with the ion beam IB from multiple directions can be expanded.

[0264] 6.3. Image generation process

[0265] Reference Fig.23 The image generation process of the image generation device 200 will be described with reference to the flowchart shown in FIG. 1. The process of generating an irradiation direction distribution image will be described below. In addition, descriptions of the same points as the above-mentioned image generation process will be omitted.

[0266] First, the image generating unit 212 acquires information on processing conditions ( S100 ).

[0267] Next, the image generation unit 212 obtains information on the ion beam IB (S102). Figure 7 The ion beam image Ib shown is used as information of the ion beam IB. In addition, here, in the ion beam image Ib, it is sufficient as long as the information of the diameter of the beam can be obtained. Therefore, as a processing condition, as long as the information of the diameter of the ion beam IB can be obtained, the ion beam image Ib may not be obtained.

[0268] Next, the image generating unit 212 generates an irradiation direction distribution image at the first time as a predicted image at the first time based on the processing conditions and the information of the ion beam IB ( S104 ).

[0269] Fig.38 Schematically shows the irradiation direction distribution image I-1 at the first moment. Fig.38 As shown, in the irradiation direction distribution image I-1, an arrow indicating the irradiation direction of the ion beam IB at the first moment is drawn inside the outline of the ion beam IB. Thus, the irradiation direction distribution image I-1 includes information on the irradiation direction of the ion beam IB, but does not include information on the irradiation intensity of the ion beam IB.

[0270] Next, the image generating unit 212 generates an irradiation direction distribution image at the mth time based on the processing conditions ( S106 ).

[0271] Fig.39 1 is a diagram schematically showing an example of the irradiation direction distribution image I-2 at the second time. The irradiation position and irradiation direction of the ion beam IB at the second time can be calculated in the same manner as in the process S106 in the first embodiment described above.

[0272] Next, the image generator 212 adds the irradiation direction distribution image I-1 and the irradiation direction distribution image I-2 (S108). For example, the irradiation direction distribution image I-1 and the irradiation direction distribution image I-2 are superimposed. Next, the image generator 212 determines whether a predicted image at the nth time has been generated (S110).

[0273] The image generating unit 212 repeatedly performs the process S106 of generating the irradiation direction distribution image at the mth moment, the process S108 of adding the irradiation direction distribution image at the mth moment to the irradiation direction distribution image during processing from the 1st moment to the m-1th moment, and the process S110 of determining whether the irradiation direction distribution image at the nth moment is generated, until the irradiation direction distribution image at the nth moment is generated.

[0274] When the image generation unit 212 determines that the irradiation direction distribution image at the nth time has been generated (Yes in S110), the display control unit 214 causes the display unit 230 to display the generated irradiation direction distribution image. For example, the display control unit 214 causes the display unit 230 to display the generated irradiation direction distribution image. Figure 35 to Figure 37 An irradiation direction distribution image in which the irradiation directions are indicated by arrows as shown is displayed on the display unit 230. In addition, the method of displaying the irradiation directions is not particularly limited, and for example, the irradiation directions may be indicated by colors.

[0275] Through the above-described processing, it is possible to display an irradiation direction distribution image when the sample is processed under the set processing conditions.

[0276] 6.4. Effect

[0277] In the sample processing system 2 of the sixth embodiment, since the predicted image includes information on the distribution of the irradiation direction of the ion beam IB irradiated during processing, it is possible to predict, like the sample processing system 2 of the first embodiment, in which area of ​​the sample S and in which direction the processing stripes formed by processing on the sample S will be generated.

[0278] 7. Others

[0279] In addition, the present invention is not limited to the above-described embodiment, and can be implemented with various modifications within the scope of the gist of the present invention.

[0280] In the above-mentioned first to sixth embodiments, the sample processing device 100 is described as rotating the sample S and swinging the sample S, but the operation of the sample processing device 100 is not limited to this. For example, the sample processing device 100 may rotate the sample S while sliding the sample S along an axis orthogonal to the optical axis of the ion beam IB. In addition, for example, in the sample processing device 100, the sample S may be moved along the X-axis and the Y-axis orthogonal to the optical axis of the ion beam IB to scan the surface Sa of the sample S using the ion beam IB.

[0281] The above-mentioned embodiments and modifications are merely examples, and the present invention is not limited to these examples. For example, each embodiment and each modification can be combined as appropriate.

[0282] The present invention is not limited to the above-mentioned embodiments, and various modifications can be further made. For example, the present invention includes a configuration that is substantially the same as the configuration described in the embodiment. The so-called substantially the same configuration refers to, for example, a configuration with the same function, method and result, or a configuration with the same purpose and effect. In addition, the present invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that has the same effect as the configuration described in the embodiment, or a configuration that can achieve the same purpose. In addition, the present invention includes a configuration in which a known technology is added to the configuration described in the embodiment.

Claims

1. A sample processing system, characterized in that: Include: a sample processing device for processing the sample by irradiating the sample with an ion beam; and an image generating device for generating a predicted image when the sample is processed using the sample processing device under the set processing conditions, The predicted image includes information on the distribution of the irradiation direction of the ion beam.

2. The sample processing system according to claim 1, wherein: The sample processing device comprises: an ion source that irradiates the sample with the ion beam; and a sample stage having a tilting mechanism for tilting the sample and a rotating mechanism for rotating the sample, The processing conditions include an inclination angle of the sample and a rotation speed of the sample.

3. The sample processing system according to claim 2, wherein: The sample stage has a swing mechanism for swinging the sample. The oscillation center of the sample is at a different position from the rotation center of the sample, The processing conditions include a distance between a rotation center of the sample and a swing center of the sample.

4. The sample processing system according to claim 3, wherein: The distance between the rotation center of the specimen and the oscillation center of the specimen is variable.

5. The sample processing system according to claim 2, wherein: The distance between the center of the ion beam on the sample and the center of rotation of the sample is variable, The processing conditions include a distance between a center of the ion beam and a rotation center of the sample.

6. The sample processing system according to any one of claims 2 to 5, wherein: The image generating device calculating the irradiation direction of the ion beam at each time point during processing based on the processing conditions, The predicted image is generated based on the irradiation direction of the ion beam at each time point.

7. The sample processing system according to claim 6, wherein: The image generating device At each of the above-mentioned moments, the vector representing the irradiation direction and the irradiation intensity of the ion beam is separated into a radial component and a rotational component with the rotation center of the sample as the center. The predicted image including information on the distribution of the intensity of the ion beam in the radial direction and information on the distribution of the intensity of the ion beam in the rotational direction is generated based on the component in the radial direction at each time and the component in the rotational direction at each time.

8. The sample processing system according to any one of claims 1 to 5, wherein: The image generating device displays the predicted image in a superimposed manner on the image of the sample before processing.

9. The sample processing system according to any one of claims 1 to 5, wherein: The image generating device indicates the irradiation direction of the ion beam by color in the predicted image.

10. The sample processing system according to any one of claims 1 to 5, wherein: The predicted image includes information on the distribution of the irradiation intensity of the ion beam.

11. The sample processing system according to any one of claims 2 to 5, wherein: The predicted image includes information on the distribution of the ion beam's irradiation intensity in a radial direction about the rotation center of the sample, and information on the distribution of the ion beam's irradiation intensity in a rotation direction about the rotation center of the sample.

12. An image generating device, characterized in that: Include: an image generating unit that generates a predicted image when the sample is processed under set processing conditions using a sample processing device that processes the sample by irradiating the sample with an ion beam; and a display control unit that causes the predicted image to be displayed, The predicted image includes information on the distribution of the irradiation direction of the ion beam.

13. An image generation method, characterized in that: Include: a step of generating a predicted image when the sample is processed under set processing conditions using a sample processing device that processes the sample by irradiating the sample with an ion beam; and a step of displaying the predicted image, The predicted image includes information on the distribution of the irradiation direction of the ion beam.

Images