MOS (Metal Oxide Semiconductor) tube packaging equipment with automatic detection function and MOS tube packaging detection method

Abstract

The invention relates to the technical field of semiconductor element packaging, in particular to MOS (Metal Oxide Semiconductor) tube packaging equipment with an automatic detection function and an MOS tube packaging detection method. The MOS tube packaging equipment comprises a feeding device which comprises a first mounting base, a stacking mechanism, a material box connection mechanism and a first air blowing mechanism; the distance separation device comprises a distance separation material channel and a plurality of ejector rods; the multi-station gluing platform comprises a first rotating disc, a first bottom plate, a material taking mechanism, a gluing mechanism and a first element temporary storage mechanism, the material taking mechanism, the gluing mechanism and the first element temporary storage mechanism are installed on the first bottom plate, and the first rotating disc rotates relative to the first bottom plate; the plate placing device is used for placing the MOS tubes on the drying jig; the drying device is used for drying the MOS tube on the drying jig; the multi-station detection device is used for detecting the MOS tube; and the disc taking device is used for taking out the MOS tube from the drying jig and then transporting the MOS tube to the multi-station detection device. According to the invention, the packaging quality of the MOS tube can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor element packaging, and in particular to a MOS tube packaging device with an automatic detection function and a MOS tube packaging detection method. Background Art

[0002] For semiconductor components such as MOS tubes, the quality of packaging has an important impact on the quality of the final product of the semiconductor device. In order to improve the efficiency of packaging, batch packaging is often used for packaging semiconductor components. However, due to the large number of semiconductor components in batch processing, the position of semiconductor components is not accurate, resulting in reduced accuracy of packaging, which affects the packaging quality of semiconductor components such as MOS tubes. Summary of the invention

[0003] In view of this, the present invention provides a MOS tube packaging device with automatic detection function and a MOS tube packaging detection method, which are used to solve the technical problem that the existing MOS tube packaging device has an inaccurate placement position during batch packaging processing.

[0004] The technical solution adopted by the present invention is:

[0005] In a first aspect, the present invention provides a MOS tube packaging device having an automatic detection function, comprising:

[0006] A feeding device, comprising a first mounting base, a stacking mechanism, a material box docking mechanism and a first air blowing mechanism, wherein the stacking device and the material box docking mechanism are mounted on the first mounting base, the stacking mechanism is used to stack material boxes, the material boxes are used to store MOS tubes, and the material box docking mechanism is used to move and flip the material boxes in the stacking mechanism to a position where they are docked with the first air blowing mechanism;

[0007] The spacing device comprises a long spacing channel and a plurality of ejector rods, wherein one end of the spacing channel away from the material box docking mechanism is connected to the first air blowing mechanism, and the spacing channel is provided with openings of the same number as the ejector rods at equal intervals, and the ejector rods correspond to the openings one by one, and the ejector rods move up and down along the axial direction of the clamping hole, and an in-place detection sensor corresponding to the openings one by one is arranged below the spacing channel, and the in-place detection sensor corresponding to each opening is located on the side of the opening away from the first air blowing mechanism, and when the in-place detection sensor corresponding to the opening detects that the MOS tube reaches a predetermined position, the ejector rod in the opening extends out of the opening;

[0008] A multi-station gluing platform comprises a first turntable, a first bottom plate, a material taking mechanism, a gluing mechanism and a first component buffer mechanism, wherein the material taking mechanism, the gluing mechanism and the first component buffer mechanism are mounted on the first bottom plate, and the first turntable rotates relative to the first bottom plate;

[0009] A tray placement device is used to place the MOS tubes on the drying fixture;

[0010] A drying device, used to dry the MOS tube on the drying fixture;

[0011] Multi-station inspection device, used to inspect the MOS tube after gluing;

[0012] The tray taking device is used to take the MOS tube out of the drying fixture and transport it to the multi-station detection device.

[0013] In a second aspect, the present invention provides a MOS tube packaging detection method, which uses the MOS tube packaging device with automatic detection function described in the first aspect to perform detection, and the method comprises the following steps:

[0014] Transport the MOS tube to the front inspection station to inspect the front of the MOS tube;

[0015] Transport the MOS tubes that have passed the front inspection to the first elimination station;

[0016] If the MOS tube fails the front inspection, the MOS tube is discharged from the second fixture module into the unqualified product silo;

[0017] If the front side of the MOS tube passes the inspection, the MOS tube that has passed the front side inspection will be transported to the back side compact station to inspect the back side of the MOS tube;

[0018] If the MOS tube fails the back surface inspection, the MOS tube is discharged from the second fixture module into the unqualified product silo;

[0019] If the back side of the MOS tube passes the inspection, the MOS tube will be transported to the feeding station.

[0020] Beneficial effect: The MOS tube packaging equipment with automatic detection function of the present invention arranges the MOS tubes at equal intervals using the spacing device before packaging. The in-place detection sensor detects the in-place status of the MOS tubes, and when it is detected that the previous MOS tube reaches the predetermined position, the next push rod is extended from the opening, so that the next MOS tube is accurately restricted to the position where the next push rod extends. After the above operation, the MOS tubes can be accurately arranged at equal intervals on the spacing channel, so that the MOS tubes can be placed in the correct position during the subsequent large-scale packaging process, thereby improving the packaging quality while increasing production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings required for use in the embodiment of the present invention will be briefly introduced below. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work, and these are all within the protection scope of the present invention.

[0022] Figure 1 It is a schematic diagram of the three-dimensional structure of the MOS tube packaging device with automatic detection function of the present invention;

[0023] Figure 2 It is a schematic diagram of the three-dimensional structure of the spacing device in the present invention;

[0024] Figure 3 It is a schematic diagram of the three-dimensional structure of the feeding device in the present invention;

[0025] Figure 4 It is a schematic diagram of the three-dimensional structure of the first stacking assembly in the present invention;

[0026] Figure 5 It is a schematic diagram of the three-dimensional structure of the material box translation mechanism in the present invention;

[0027] Figure 6 It is a schematic diagram of the three-dimensional structure of the material box receiving plate of the present invention when it is in the material stacking position;

[0028] Figure 7 It is a schematic diagram of the three-dimensional structure of the material box receiving plate of the present invention when it is in the docking position;

[0029] Figure 8 It is a schematic diagram of the three-dimensional structure of the material box turning mechanism in the present invention;

[0030] Fig. 9 It is a schematic diagram of the three-dimensional structure of the downward pressing component in the present invention;

[0031] Fig.10 It is a schematic diagram of the three-dimensional structure of the auxiliary unloading device of the present invention;

[0032] Fig.11 It is a schematic diagram of the three-dimensional structure of the multi-station gluing platform of the present invention;

[0033] Fig.12 It is a schematic structural diagram of the first rotating disk in the present invention;

[0034] Fig.13 It is a structural schematic diagram of the first fixture module in the present invention;

[0035] Fig.14 A top view of the turntable and ejection mechanism of the present invention;

[0036] Fig.15 It is a schematic diagram of the three-dimensional structure of the plate-stirring device of the present invention;

[0037] Fig.16 It is a three-dimensional structural schematic diagram of the material taking mechanism in the present invention;

[0038] Fig.17 A top view of the multi-station detection device of the present invention;

[0039] Fig.18 It is a schematic diagram of the three-dimensional structure of the loading module in the present invention;

[0040] Fig.19 It is a schematic diagram of the three-dimensional structure of the front detection mechanism in the present invention;

[0041] Fig. 20 It is a schematic diagram of the three-dimensional structure of the image acquisition module mounting seat in the present invention;

[0042] Fig.21 It is a structural schematic diagram of the first exclusion mechanism in the present invention;

[0043] Fig. 22 It is a schematic diagram of the structure of the feeding assembly in the present invention;

[0044] Fig.23 It is a schematic diagram of the three-dimensional structure of the shell insertion device in the present invention.

[0045] Parts and their numbers in the figure:

[0046] Feeding device 1, first mounting base 1-1, stacking mechanism 1-2, first stacking limiting assembly 1-21, second stacking limiting assembly 1-22, limiting bottom plate 1-221, first limiting side plate 1-222, second limiting side plate 1-223, limiting back plate 1-224, material box docking mechanism 1-3, material box translation mechanism 1-31, material box offset driving device 1-311, material box receiving plate 1-312, material box receiving groove 1-3121, extension part 1-3122, receiving fixed plate 1-3123, width adjustment plate 1-3124, baffle 1-3125, material box flipping mechanism 1-32, fixing assembly 1-321, upper limit member 1-3211, flipping driving assembly 1-322, first connecting rod 1-3221 , the second connecting rod 1-3222, the cylinder 1-3223, the flip support 1-3221, the lower limit part 1-32211, the support connection part 1-32212, the pressing assembly 1-3222, the pressing plate 1-32221, the first pressing limit plate 1-32222, the second pressing limit plate 1-32223, the protrusion 1-32224, the pressing drive assembly 1-3223, the first supporting vertical plate 1-32231, the first supporting horizontal plate 1-32232, the pressing drive 1-32233, the empty box receiving bin 1-4, the auxiliary unloading device 1-5, the cantilever connecting beam 1-51, the oscillator 1-52, the material box 1-6, the first air blowing mechanism 1-7, the spacing device 2, the spacing material channel 2-1, the first material channel plate 2-11, The second material channel plate 2-12, the material channel groove 2-13, the push rod 2-2, the opening 2-3, the stopper 2-4, the multi-station gluing platform 3, the first bottom plate 3-10, the first turntable 3-21, the main part 3-211, the raised part 3-212, the ejection mechanism 3-22, the middle connecting plate 3-221, the pusher 3-222, the pusher part 3-2221, the first fixture module 3-23, the placement groove 3-231, the ejection groove 3-232, the connecting groove 3-233, the material taking mechanism 3-30, the gluing mechanism 3-40, the first component buffer mechanism 3-50, the fourth drive device 3-51, the material storage plate 3-52, the swing device 4, the first support frame 4-10, the second support frame 4-20, the first drive device 4-30, the second Driving device 4-40, material taking and releasing mechanism 4-50, first connecting member 4-51, third driving device 4-52, first mounting frame 4-53, extension part 4-531, mounting part 4-532, picking member 4-54, drying fixture 4-70, drying fixture conveying mechanism 4-80, drying device 5, disc taking device 6, multi-station detection device 7, second bottom plate 7-1, detection hole 7-11, second turntable 7-2, second fixture module 7-21, feeding module 7-3, feeding electric cylinder 7-31, feeding push rod 7-32, second component buffer mechanism 7-33, front detection mechanism 7-4, first image acquisition module 7-41, image acquisition module mounting seat 7-42, fixed plate 7-421, first movable plate 7-422,The first force-bearing structure 7-4221, the middle plate 7-423, the second movable plate 7-424, the second force-bearing structure 7-4241, the first guide rail 7-425, the second guide rail 7-426, the first cylinder 7-427, the second cylinder 7-428, the mounting bracket 7-43, the first removal mechanism 7-5, the first ejector rod 7-51, the first ejector mechanism 7-52, the first bin 7-53, the reverse side detection mechanism 7-6, the second removal mechanism 7-7, the second bin 7-73, the feeding mechanism 7-8, the guide member 7-81, the first slide 7-811, the second slide 7-812, the first pusher assembly 7-82, the second pusher assembly 7-83, the shell entry device 8, the second air blowing mechanism 8-1, the shell entry channel 8-2, and the MOS tube 9. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. In the description of the present invention, it should be understood that the orientation or position relationship indicated by the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. If there is no conflict, the embodiments of the present invention and the various features in the embodiments can be combined with each other, all within the scope of protection of the present invention.

[0048] Example 1

[0049] like Figure 1 As shown, the present invention provides a MOS tube packaging device with automatic detection function, including a feeding device 1, a spacing device 2, a multi-station gluing platform 3, a plate swinging device 4, a drying device 5, a plate taking device 6 and a multi-station detection device 7:

[0050] Gluing the pins of the MOS tube 9 (metal-oxide-semiconductor field-effect transistor) is an important step in the packaging process of the MOS tube 9. In this embodiment, the feeding device 1 is used to quickly transport the MOS tube 9 contained in the material box 1-6 to the spacing device 2 for equidistant arrangement, and then the equidistantly arranged MOS tube 9 is transported to the multi-station gluing platform 3 for gluing treatment, and then the MOS tube 9 is accurately placed in the drying fixture 4-70 by the plate-placing device 4, and then the drying fixture 4-70 is transported to the drying device 5 for drying. The field effect light after drying is transported to the multi-station detection device 7 through the plate-taking device 6 for one-by-one detection to eliminate unqualified products.

[0051] For easy transportation, the plate-staging device 4 and the plate-removing device 6 can be arranged on opposite sides of the drying device 5, the multi-station gluing platform 3 is arranged in front of the plate-staging device 4, the loading device 1 is arranged in front of the spacing device 2, and the multi-station detection device 7 is arranged in front of the plate-removing device 6.

[0052] The feeding device 1 includes a first mounting base 1-1, a stacking mechanism 1-2, a material box docking mechanism and a first air blowing mechanism 1-7. The stacking device and the material box docking mechanism are mounted on the first mounting base 1-1. The stacking mechanism is used to stack material boxes. The material box 1-6 is used to store MOS tubes 9. The material box docking mechanism moves and flips the material box 1-6 in the stacking mechanism to a position where it docks with the first air blowing mechanism 1-7. After the MOS tube 9 in the material box 1-6 enters the air blowing mechanism 1-7, the air blowing mechanism 1-7 blows the MOS tube into the spaced material channel 2-1 by introducing compressed air. The air blowing mechanism 1-7 can adopt the air blowing mechanism in the prior art.

[0053] like Figure 2 As shown, the spacing device 2 of this embodiment includes a long strip spacing channel 2-1 and a plurality of push rods 2-2. The end of the spacing channel 2-1 away from the material box docking mechanism is connected to the first air blowing mechanism. The spacing channel 2-1 is provided with openings 2-3 with the same number as the push rods 2-2 at equal intervals. The push rods 2-2 correspond to the openings 2-3 one by one. The push rods 2-2 move up and down along the axial direction of the openings 2-32-3. In-place detection sensors corresponding to the openings 2-3 one by one are arranged below the spacing channel 2-1. The in-place detection sensor corresponding to each opening 2-3 is located on the side of the opening 2-3 away from the first air blowing mechanism. When the in-place detection sensor corresponding to the opening 2-3 detects that the MOS tube has reached a predetermined position, the push rod 2-2 in the opening 2-3 extends out from the opening 2-3.

[0054] In specific implementation, a stopper 2-4 can be provided at one end of the spacing device 2 away from the first air blowing mechanism, and an opening 2-3 can be provided at every preset distance (the distance between two adjacent MOS tubes after the MOS tubes are arranged at equal intervals) behind the stopper, and a push rod 2-2 is provided in each opening 2-3, and each push rod 2-2 is driven by a cylinder. In the initial state, all push rods 2-2 retract into the opening 2-3. When the first MOS tube is blown by the air transmission to the position abutting against the stopper, the in-place detection sensor closest to the stopper (the in-place detection sensor corresponding to the first opening 2-3) detects that the first MOS tube is in place, and at this time, the push rod 2-2 in the first opening 2-3 extends out from the first opening 2-3. The second MOS tube is blown to a position where it abuts against the push rod 2-2 in the first opening 2-3. At this time, the position detection sensor corresponding to the second opening 2-3 detects that the second MOS tube has reached a predetermined position. At this time, the push rod 2-2 in the second opening 2-3 extends from the second opening 2-3 to limit the position of the third MOS tube. Similarly, under the action of the push rod 2-2, the next MOS tube is always separated from the previous MOS tube by a preset distance, thereby realizing equal spacing of multiple MOS tubes.

[0055] In this embodiment, the distance channel 2-1 includes a first channel plate 2-11 and a second channel plate 2-12, wherein the first channel plate 2-11 and the second channel plate 2-12 enclose a long channel groove 2-13, and the width of the channel groove 2-13 is consistent with the width of the MOS tube. The spacing between the first channel plate 2-11 and the second channel plate 2-12 can be adjusted, and the width of the channel groove 2-13 can be adjusted by adjusting the spacing between the two channel plates, so that the width of the channel groove 2-13 can be flexibly adjusted according to the width of the MOS tube.

[0056] like Figure 3 As shown, in this embodiment, the stacking mechanism 1-2 is installed on the first mounting base 1-1, and can be installed on the first mounting substrate during implementation. The stacking mechanism 1-2 includes a first stacking limiting assembly 1-21 and a second stacking limiting assembly 1-22 arranged along a first direction;

[0057] The first stacking limit assembly 1-21 and the second stacking limit assembly 1-22 together form a semi-open stacking bin. The material boxes 1-6 containing MOS tubes 9 are stacked from bottom to top in the aforementioned stacking bin. The width and height of the material box 1-6 need to match the width and height of the field effect, so that the MOS tubes can only be arranged in a row in the material box 1-6 along the length direction of the material box 1-6. When stacking, the length direction of the material box is parallel to the first direction.

[0058] The length of the material stacking bin surrounded by the first material stacking limiting assembly 1 - 21 and the second material stacking limiting assembly 1 - 22 is the same as or slightly larger than the length of the material box 1 - 6 .

[0059] This embodiment also includes a silo length adjustment device, which includes a silo drive electric cylinder, and the output end of the silo drive electric cylinder is connected to the first stacking limit assembly 1-21 or the second stacking limit assembly 1-22. The silo drive electric cylinder drives the first stacking limit assembly 1-21 or the first stacking limit assembly 1-21 to move along the first direction. Under the drive of the silo drive electric cylinder, the distance between the first stacking limit assembly 1-21 and the second stacking limit assembly 1-22 can be adjusted, so that the length of the silo can be flexibly adjusted according to the length of the material box 1-6, so that the material boxes 1-6 of different lengths can be stacked.

[0060] like Figure 4 As shown, the first stacking limiting assembly 1-21 includes a limiting bottom plate 1-221, a first limiting side plate 1-222, a second limiting side plate 1-223 and a limiting back plate 1-224, the limiting bottom plate 1-221 is horizontally arranged, and the first limiting side plate 1-222 and the second limiting side plate 1-223 are parallel to the first direction, the first limiting side plate 1-222, the second limiting side plate 1-223 and the limiting back plate 1-224 are vertically arranged, and the limiting back plate 1-224 is perpendicular to the first direction, and the first limiting side plate 1-222 and the second limiting side plate 1-223 are located at the limiting bottom plate 1-221. Above the first limiting side plate 1-222, the limiting back plate 1-224 is connected to the first limiting side plate 1-222 on the side of the first limiting side plate 1-222 away from the second stacking limiting assembly 1-22, and the limiting back plate 1-224 is connected to the second limiting side plate on the side of the second limiting side plate 1-223 away from the first stacking limiting assembly 1-21, the distance between the first limiting side plate 1-222 and the second limiting side plate 1-223 is the width of a material box 1-6, and the bottom of the first limiting side plate 1-222 and the second limiting side plate are separated from the upper surface of the limiting bottom plate 1-221 by the height of a material box 1-6 in the vertical direction.

[0061] The first limiting side plate 1-222, the second limiting side plate 1-223 and the limiting back plate 1-224 form a "C" structure, which is open at one end, open at the top, and limited at the bottom by the limiting bottom plate 1-221. This structure is convenient for stacking materials from the top of the stacking bin, and can regulate the shape of the stack, so that the material boxes 1-6 are neatly stacked in a row from low to high.

[0062] Since the bottom of the first limiting side plate 1-222 and the second limiting side plate 1-223 are separated from the upper surface of the limiting bottom plate 1-221 by the height of a material box 1-6 in the vertical direction, a gap is left below the first stacking assembly, and the gap just allows a material box 1-6 to move horizontally from the inside of the silo to the outside of the silo. The second stacking limiting assembly 1-22 of this embodiment adopts the same structure as the first stacking limiting assembly 1-21, and the first stacking limiting assembly 1-21 and the second stacking limiting assembly 1-22 are arranged opposite to each other, that is, the opening ends of the two stacking assemblies face each other.

[0063] In this embodiment, the first limiting side plate 1-222 also includes an extension portion parallel to the limiting back plate 1-224, the extension portion is located on the side of the first limiting side plate 1-222 away from the second limiting side plate 1-223, the extension portion is connected to the limiting back plate 1-224, and the spacing distance between the extension portion and the limiting back plate 1-224 along the second direction is adjustable. After adopting the above structure, the spacing distance between the first limiting side plate 1-222 and the second limiting side plate is adjusted by adjusting the spacing distance between the extension portion and the limiting back plate 1-224 along the second direction, so that the width of the silo can be flexibly adjusted to accommodate material boxes 1-6 of different widths. Figure 3 As shown, in this embodiment, the material box docking mechanism 1-3 is installed on the first mounting base 1-1, and the material box docking mechanism 1-3 includes a material box translation mechanism 1-31 and a material box flipping mechanism 1-32. The material box translation mechanism 1-31 is used to translate the material box 1-6 from the stacking position to the docking position, and the material box flipping mechanism 1-32 is used to flip the material box 1-6 in a horizontal state to a preset angle;

[0064] like Figure 3 As shown, the preset angle refers to the angle at which the MOS tubes in the material box 1-6 can slide down along the material box 1-6 to the material outlet of the material box 1-6 under the action of gravity, and slide from the material outlet to the first air blowing mechanism. At this angle, one end of the material box 1-6 outlet is at the lowest position, and the end away from the outlet is at the highest position, so that all the MOS tubes in the material box 1-6 can slide into the air blowing mechanism.

[0065] like Figure 5As shown, in this embodiment, the material box offset mechanism 1-31 includes a material box offset driving device 1-311 and a material box receiving plate 1-312, the output end of the material box translation driving device is connected to the material box receiving plate 1-312, and a material box receiving groove 1-3121 is arranged on the material box receiving plate 1-312, the height of the upper surface of the material box receiving plate 1-312 is the same as the height of the bottom of the first limiting side plate 1-222, the material box receiving groove 1-3121 is formed by the upper surface of the material box receiving plate 1-312 being recessed downward, the width of the material box receiving groove 1-3121 is the same as the width of a material box, and the depth of the material box receiving groove 1-3121 is the same as the height of a material box, and the material box receiving plate 1-312, driven by the material box translation driving device, moves back and forth between the stacking position and the docking position along a direction perpendicular to the first limiting side plate 1-222.

[0066] like Figure 5 and Figure 6 As shown, since the width of the material box receiving groove 1-3121 is the same as the width of a material box, and the depth of the material box receiving groove 1-3121 is the same as the height of a material box, when the material box receiving groove 1-3121 is located directly above the stack of material boxes stacked in the stacking mechanism 1-2, a material box just falls into the material box receiving groove 1-3121, and the material box adjacent to the material box just happens to be outside the material box receiving groove 1-3121, so that only one material box is located in the material box receiving groove 1-3121 at a time. Since the height of the upper surface of the material box receiving plate 1-312 is the same as the height of the bottom of the first limiting side plate 1-222, when the material box at the bottom of the material box stack falls into the material box receiving groove 1-3121, the material boxes adjacent to the material box are flush with the upper surface of the material box receiving plate 1-312.

[0067] like Figure 6 As shown, in the initial state, the material box receiving plate 1-312 is located at the stacking position, and the material box receiving groove 1-3121 is just located below the material box stack, and the material box at the bottom of the material box stack falls into the material box receiving groove 1-3121. Since the length of the material box receiving plate 1-312 is less than the length of the material box, the material box will be exposed outside the material box receiving plate 1-312. In specific implementation, the length of the material box receiving plate 1-312 can be made less than the spacing distance between the first material stacking limit assembly 1-21 and the second material stacking assembly 1-22. In this way, a part of the material box at the bottom is in a suspended state, which can reduce the friction when the material box is offset, so that the material box can be quickly moved from the silo position to the docking position.

[0068] Since the bottom of the first limiting side plate 1-222 and the second limiting side plate 1-223 are separated from the upper surface of the limiting bottom plate 1-221 by the height of a material box in the vertical direction, the two ends of the material box that falls into the material box receiving groove 1-3121 are not blocked by the first limiting side plate 1-222 and the second limiting side plate 1-223, while the material box 1-6 adjacent to the material box 1-6 is blocked by the first limiting side plate 1-222 and the second limiting side plate.

[0069] like Figure 7 As shown, when the material box offset driving mechanism pushes the material box receiving plate 1-312 to move from the stacking position to the docking position, the material box that falls into the material box receiving groove 1-3121 moves along with the material box receiving plate 1-312 from the gap formed between the limiting bottom plate 1-221 and the first limiting side plate 1-222 and the second limiting side plate 1-223 toward the outside of the material bin. Since the height of the material box adjacent to the bottom material box is higher than the height of the gap formed between the limiting bottom plate 1-221 and the first limiting side plate 1-222 and the second limiting side plate 1-223, the material box is restricted by the first limiting side plate 1-222 and the second limiting side plate 1-223 and will not move with the bottom material box. Since the height of the upper surface of the material box receiving plate 1-312 is the same as the height of the bottom of the first limiting side plate 1-222, when the material box receiving groove 1-3121 is moved away from directly below the material bin, the bottom of the material box adjacent to the bottom layer of the material box is received by the lower surface of the material box receiving plate 1-312, keeping the height unchanged. In this way, during the movement of the material box receiving groove 1-3121 to the docking position, the material box stack can be stably maintained in the original stacking shape.

[0070] like Figure 3 and Figure 7As shown, when the material box receiving groove 1-3121 moves to the docking position, the material box in the material box receiving groove 1-3121 is flipped by the material box flipping mechanism 1-32 and detached from the material box receiving groove 1-3121. At this time, the material box receiving groove 1-3121 is in an empty state without a material box. Then the material box offset driving mechanism pushes the material box receiving plate 1-312 back from the docking position to the stacking position. During the pushing back process, the bottom material box of the stack is received on the upper surface of the material box receiving groove 1-3121. The bottom of the material box is one material box height away from the limiting bottom plate 1-221, so it is just limited by the first limiting side plate 1-222 and the second limiting side plate 1-223 and will not move. When the material box receiving plate 1-312 is pushed back to the docking position, the material box receiving groove 1-3121 returns to the bottom of the material box at the bottom of the material box stack, and the material box at the bottom can fall into the material box receiving groove 1-3121. In this embodiment, the material boxes stacked in the stacking mechanism 1-2 can be transported from bottom to top to the docking position one by one by repeatedly moving the material box receiving plate 1-312 back and forth between the stacking position and the docking position. Not only is the action simple and reliable, but also new material boxes can be continuously stacked from above the stacking mechanism 1-2 during the movement of the material box receiving plate 1-312, which will not affect the automatic feeding operation, so the operation of conveying the material boxes will not be stopped due to stacking, so the production efficiency is significantly improved.

[0071] After unloading, the material box needs to be removed. If it is removed manually, the efficiency is low. Figure 7 As shown, the loading device in this embodiment also includes an empty box receiving bin 1-4, and the empty box receiving bin 1-4 is arranged at the side wall of the edge of the first mounting base 1-1, and the opening of the empty box receiving bin 1-4 is located at a height below the upper surface of the limiting bottom plate 1-221, and an extension portion 1-3122 is provided on the material box receiving plate 1-312 on the side of the material box receiving groove 1-3121 facing the empty box receiving bin 1-4, and the width of the extension portion 1-3122 is greater than the distance between the end of the material box facing the empty box receiving bin 1-4 and the side wall on which the empty box receiving bin 1-4 is installed when the material box receiving groove 1-3121 is in the docking position.

[0072] When the material box receiving plate 1-312 is pushed back to the stacking position, the docking position is just vacant. At this time, the empty material box after unloading is flipped to the docking position by the flipping mechanism. When the material box receiving plate 1-312 moves from the stacking position to the docking position, since the extension portion 1-3122 of the material box receiving plate 1-312 is located on the side of the material box receiving slot 1-3121 facing the empty box receiving bin 1-4, the material box receiving slot 1-3121 reaches the docking position. The front extension 1-3122 will first contact the empty material box, and push the empty material box toward the empty box receiving bin 1-4 during the movement. Since the width of the extension 1-3122 is greater than the distance between the end of the material box facing the empty box receiving bin 1-4 and the side wall of the empty box receiving bin 1-4 when the material box receiving groove 1-3121 is in the docking position, the empty material box can be pushed into the empty box receiving bin 1-4 before the receiving groove moves to the docking position. After the present embodiment adopts the aforementioned structure, the empty material box can be moved from the docking position to the receiving bin while the material box is docked while the material box is docked, while the material box offset mechanism 1-31 maintains the original action unchanged, ensuring that the material box docking and the empty material box removal process are completed simultaneously in one action and do not affect each other. Therefore, the action is simple and reliable, the cost is low, and there is no need to increase the process, which is more efficient.

[0073] like Figure 5 As shown, in this embodiment, the material box receiving plate 1-312 includes a receiving fixed plate 1-3123 and a width adjustment plate 1-3124, and a receiving groove is provided on the receiving fixed plate 1-3123, and the depth of the receiving groove is the same as the height of the material box, and the height of the width adjustment plate 1-3124 is the same as the height of the material box. The width adjustment plate 1-3124 includes a baffle 1-3125 arranged along a first direction, and the baffle 1-3125 is located in the receiving groove, and the baffle 1-3125 moves relative to the receiving groove along a second direction.

[0074] Since the depth of the receiving groove is the same as the height of the material box, and the height of the width adjustment plate 1-3124 is the same as the height of the material box, the present embodiment can utilize the receiving groove of the receiving fixing package and the baffle 1-3125 of the width adjustment plate 1-3124 to jointly form a material box receiving groove 1-3121 with adjustable width. The width of the material box receiving groove 1-3121 is adjusted by moving the baffle 1-3125 along the second direction so that the width of the material box receiving groove 1-3121 is consistent with the maintaining width of the currently conveyed material box.

[0075] like Figure 8As shown, the material box flipping mechanism 1-32 includes a fixing component 1-321 and a flipping drive component 1-322, the fixing component 1-321 is rotatably connected to the first mounting base 1-1, the flipping drive component 1-322 is used to drive the fixing component 1-321 to rotate relative to the first mounting base 1-1, the fixing component 1-321 includes a flipping support 1-3221, a pressing component 1-3221 and a pressing drive component 1-3223, the pressing drive component 1-3223 is installed on the flipping support 1-3221, the pressing drive component 1-3223 drives the pressing component 1-3221 to press down to fix the material box between the flipping support 1-3221 and the pressing component 1-3221, and the flipping drive component 1-322 is used to drive the fixing component 1-321 to rotate to flip the material box from the docking position to the unloading position.

[0076] The unloading position refers to the position where the material box is at a preset angle and the discharge port of the material box is docked with the entrance of the first air blowing mechanism. When the material box is in this position, the MOS tube in the material box can slide down to the discharge port of the material box under the action of gravity, and slide from the discharge port into the first air blowing mechanism. When the material box translation mechanism 1-31 offsets the material box to the docking position, the downward pressing drive component 1-3223 drives the downward pressing component 1-3221 to press down, and the material box is fixed between the flip support 1-3221 and the downward pressing component 1-3221. Then the flipping drive component 1-322 flips the fixing component 1-321 and the material box together, so that the material box flips to the unloading position. However, after the material box completes unloading, the flipping drive component 1-322 flips the empty material box to the docking position again, and the empty material box is at a horizontal angle. The downward pressing driving member drives the downward pressing assembly 1-3221 to lift up, so that the empty material box can be pushed into the empty box receiving bin 1-4 by the extension portion 1-3122 of the material box receiving plate 1-312.

[0077] like Fig. 9 As shown, in this embodiment, the flip support member 1-3221 includes a lower limit portion 1-32211 and two support connection portions 1-32212, and the two support connection portions 1-32212 are arranged at one end of the lower limit portion 1-32211 away from the lower pressure assembly 1-3221, and the two support connection portions 1-32212 are rotatably connected to the frame, and the fixed assembly 1-321 also includes a "U"-shaped upper limit member 1-3211, one end of the upper limit member 1-3211 is connected to one of the support connection portions 1-32212, and the other end is connected to the other support connection portion 1-32212, and the spacing distance between the upper limit member 1-3211 and the lower limit portion 1-32211 is greater than the height of one material box and less than the height of two material boxes.

[0078] After adopting the above-mentioned structure, the lower limit part 1-32211, the two supporting connecting parts 1-32212 and the upper limit part 1-3211 form a semi-enclosed structure with one end open. The open end of the semi-enclosed structure can form a notch on the side with a spacing distance greater than the height of one material box and less than the height of two material boxes. After the lower pressing component 1-3221 is lifted, the material box can enter the semi-enclosed structure from the side of the semi-enclosed structure through the notch position under the push of the material box receiving plate 1-312, and the semi-enclosed structure limits the material box.

[0079] In this embodiment, the downward pressure drive component 1-3223 includes a first supporting vertical plate 1-32231, a first supporting horizontal plate 1-32232 and a downward pressure driver 1-32233, one end of the first supporting vertical plate 1-32231 is connected to an end of the upper limiting member 1-3211 away from the supporting connection part 1-32212 at the top of the limiting member, one end of the first supporting horizontal plate 1-32232 is connected to the first supporting vertical plate 1-32231, and the other opposite end is suspended, the downward pressure driver 1-32233 is installed on the first supporting horizontal plate 1-32232, and the output end of the downward pressure driver 1-32233 is connected to the downward pressure component 1-3221.

[0080] The downward pressing driver 1-32233 of this embodiment is suspended on the first supporting horizontal plate 1-32232. On the one hand, it does not affect the entry and exit of the side of the material box. On the other hand, it can facilitate the downward pressing component 1-3221 to press the material box without affecting the movement of the material box receiving plate 1-312.

[0081] In this embodiment, the pressing assembly 1-3221 includes a pressing plate 1-32221, a first pressing limit plate 1-32222 and a second pressing limit plate 1-32223. The first pressing limit plate 1-32222 and the second pressing limit plate 1-32223 are installed on the side of the pressing plate 1-32221 facing the lower limit portion 1-32211. The distance between the first lower limit plate 1-32222 and the second lower limit plate 1-32223 is greater than the width of the material box. The middle part of the pressing plate 1-32221 forms a strip-shaped protrusion 1-32224 toward the lower limit portion 1-32211. When the pressing plate 1-32221 is pressed down When the material box is at the fixing position, the strip-shaped protrusion 1-32224 abuts against the top of the material box. When the fixing component 1-321 is flipped to the docking position, the upper surface of the lower limit part 1-32211 is flush with the upper surface of the material box receiving plate 1-312, and the lower pressure plate 1-32221 moves to a position where the distance between the lower limit part 1-32211 is greater than the height of the material box. Driven by the material box receiving plate 1-312, at least a part of the material box is penetrated from the side of the lower limit part 1-32211 to the space between the limit member and the lower limit part 1-32211 in the vertical direction and between the first lower pressure limit plate 1-32222 and the second lower pressure limit plate in the horizontal direction.

[0082] Since when the fixing component 1-321 is flipped to the docking position, the upper surface of the lower limit part 1-32211 is flush with the upper surface of the material box receiving plate 1-312. Therefore, when at least a part of the material box is driven by the material box receiving plate 1-312 to penetrate from the side of the lower limit part 1-32211 to the position between the limit member and the lower limit part 1-32211 in the vertical direction, one end of the material box is just on the upper surface of the lower limit part 1-32211. Therefore, when the pressing component 1-3221 and the lower limit part 1-32211 clamp the material box, the material box will not shake up and down. When the lower pressure plate 1-32221 presses down on the high material box fixing position, the first lower pressure limit plate 1-32222 and the second lower pressure limit plate limit the left and right sides of the material box to prevent it from moving left and right and sliding out of the fixed component 1-321. At the same time, the lower pressure plate 1-32221 and the lower limit plate clamp the material box up and down to prevent it from sliding up and down. The material box is limited in multiple directions in the fixed component 1-321 by simple actions at the same time, and the efficiency of automatic feeding is further improved.

[0083] like Fig.10As shown, the loading device in this embodiment also includes an auxiliary unloading device 1-5, and the auxiliary unloading device 1-5 includes a cantilever connecting beam 1-51 and an oscillator 1-52. One end of the cantilever connecting beam 1-51 is connected to the downward pressure driving component 1-3223, and the other end is suspended. The oscillator is installed at the suspended end of the cantilever connecting beam 1-51. In this embodiment, the oscillator 1-52 is installed on the cantilever connecting beam 1-51, and the oscillator 1-52 is used to vibrate the material box below at the unloading angle. During the vibration of the material box, the MOS tube in the material box can slide to the next process more smoothly.

[0084] In this embodiment, the flipping drive assembly 1-322 includes a first connecting rod 1-3221, a second connecting rod 1-3222 and a cylinder 1-3223, the cylinder 1-3223 is fixed on the first mounting base 1-1, the output end of the cylinder 1-3223 is connected to the first connecting rod 1-3221, the end of the first connecting rod 1-3221 away from the cylinder 1-3223 is rotatably connected to the second connecting rod 1-3222, the end of the second connecting rod 1-3222 away from the first connecting rod 1-3221 is rotatably connected to the fixed assembly 1-321, and the rotation axis of the rotation connection between the second connecting rod 1-3222 and the fixed assembly 1-321 coincides with the rotation axis of the rotation connection between the fixed assembly 1-321 and the first mounting base 1-1. The output end of the cylinder 1-3223 drives the first connecting rod 1-3221 to rotate, the first connecting rod 1-3221 drives the second connecting rod 1-3222 to rotate, and the second connecting rod 1-3222 drives the fixed assembly 1-321 to rotate, thereby realizing the flipping of the flipping mechanism.

[0085] like Fig.11 As shown, the multi-station gluing platform 3 in this embodiment includes a first turntable 3-21, a first bottom plate 3-10, a material taking mechanism 3-30, a gluing mechanism 3-40 and a first component buffer mechanism 3-50, wherein the material taking mechanism 3-30, the gluing mechanism 3-40 and the first component buffer mechanism 3-50 are mounted on the first bottom plate 3-10, and the first turntable 3-21 rotates relative to the first bottom plate 3-10;

[0086] like Fig.12 As shown, in the multi-station gluing platform, the first turntable 3-21 is rotatably connected to the first base plate 3-10, and four first fixture modules 3-23 are arranged on the first turntable 3-21. The four first fixture modules 3-23 are arranged at an arc interval of π / 2 along the circumferential direction of the first turntable, and the first fixture module 3-23 is used to limit the positions of multiple MOS tubes 9 arranged in a straight line.

[0087] The first turntable 3 - 21 drives the four first fixture modules 3 - 23 to rotate to different working positions by rotating, so as to perform different operations on the MOS tubes 9 restricted on the first fixture modules.

[0088] The material picking mechanism is arranged at the material discharging station, and the material picking mechanism is used to place the MOS tube on the first fixture module; wherein the material picking mechanism 3-30 can adopt a robot, and the robot picks up all the MOS tubes 9 from the spacing device at one time, and then places the MOS tubes 9 into the first fixture module 3-23.

[0089] The gluing mechanism is arranged at the gluing station, and the gluing mechanism 3-40 is used to glue the pins of the MOS tube 9; the gluing mechanism 3-40 can adopt the gluing mechanism 3-40 in the prior art.

[0090] The first component buffer mechanism 3-50 is set at the storage station, and is used to temporarily store the MOS tube 9 after gluing; the gluing station and the storage station are set at an interval of arc π along the circumferential direction of the first turntable, the discharge station and the gluing station are set at an interval of arc π / 2 along the circumferential direction of the first turntable, and the discharge station and the storage station are set at an interval of arc π / 2 along the circumferential direction of the first turntable; a push-out mechanism is set above the first turntable, and the push-out mechanism is used to push the MOS tube in the first fixture module on the storage station into the first component buffer mechanism. The first turntable 3-21 passes through the aforementioned discharge station, gluing station and storage station in sequence during one rotation.

[0091] The first component cache mechanism 3-50 includes a fourth drive device 3-51 and a material storage plate 3-52, the material storage plate 3-52 is connected to the output end of the fourth drive device 3-51, the fourth drive device 3-51 is used to drive the material storage plate 3-52 to move along the second direction, and the material storage plate 3-52 is provided with a plurality of material storage slots along the second direction. This embodiment can make the first component cache mechanism 3-50 temporarily store the MOS tube after the gluing process in the previous process, and the material taking mechanism can take out the MOS tube from the storage mechanism, so that the first component cache mechanism 3-50 forms a buffer between the gluing and the panning process, which can reduce the mutual influence between the two processes. Since the gluing station and the material storage station are spaced by an arc π along the circumferential direction of the first turntable 3-21, the gluing station and the material storage station are on opposite sides, so that the gluing operation and the discharge operation can not affect each other.

[0092] like Fig.12As shown, the first turntable 3-21 includes a main part 3-211 with a square cross-section and four raised parts 3-212 with a rectangular cross-section, the raised parts 3-212 are formed by four sides of the main part 3-211 protruding outward, and the four first fixture modules 3-23 are respectively arranged at one end of the raised part 3-212 away from the main part 3-211.

[0093] The four protrusions 3-212 protrude in four different directions, and a first fixture module 3-23 is installed at the end of each protrusion. In this way, at least four workstations can be formed on the first turntable 3-21. Since the four protrusions are in different directions, the operations between the workstations can be non-interfering with each other, thereby making full use of the spatial layout of each workstation and improving the operability of each workstation.

[0094] like Fig.13 As shown, a plurality of spaced placement grooves 3-231 are provided on the first fixture module 3-23, and the placement grooves 3-231 are used to place the MOS tube 9. The placement grooves 3-231 pass through one end of the first fixture module 3-23 facing away from the main body 3-211.

[0095] The spacing between the placement grooves 3-231 is the same as the spacing between adjacent push rods in the spacing device. In this embodiment, the spacing between the MOS tubes 9 can be limited by the spacing between the placement grooves 3-231. Since the placement grooves 3-231 pass through the end of the first fixture module 3-23 that faces away from the main body 3-211, the MOS tube 9 can be easily taken out from the end of the placement groove 3-231 that faces away from the main body 3-211. Side walls are set on three sides of the placement groove 3-231, and one side is open, so that the position of the MOS tube 9 is limited by the three sides, and a channel for the MOS tube 9 to be discharged from the first fixture module 3-23 is reserved through the opening.

[0096] In this embodiment, a connecting groove 3-233 is provided on the first fixture module 3-23, and the connecting groove 3-233 connects two adjacent placement grooves 3-231 on the side of the placement groove 3-231 facing the main part 3-211. The connecting groove 3-233 is also provided with an ejection groove 3-232 corresponding to the placement groove 3-231 on the side facing away from the placement groove 3-231, and the ejection groove 3-232 is connected with the corresponding placement groove 3-231 through the connecting groove 3-233.

[0097] The aforementioned ejection groove 3-232 allows the ejection mechanism 3-22 to extend into the back of the placement groove 3-231 and abut against the MOS tube 9 in the placement groove 3-231, thereby ejecting the MOS tube 9 from the placement groove 3-231. Since the connecting groove 3-233 is provided at the back of the placement groove 3-231, the positions of the two sides of the bottom of the MOS tube 9 are not restricted by the placement groove 3-231, so that the placement groove 3-231 can be used to limit the MOS tube 9, and the friction force on the two sides of the bottom of the MOS tube 9 can be reduced, so that the ejection mechanism 3-22 can quickly eject the MOS tube 9 from the placement groove 3-231.

[0098] like Fig.14 As shown, in this embodiment, the ejection mechanism 3-22 includes an ejection drive device, an intermediate connecting plate 3-221 and a pusher 3-222, the intermediate connecting plate 3-221 is connected to the drive device and the pusher 3-222 respectively, the drive device and the intermediate connecting plate 3-221 are located on the side of the ejection slot 3-232 away from the placement slot 3-231, the pusher 3-222 is provided with a pusher portion that is the same in number and corresponding in position as the connecting slots 3-233 on the first fixture module 3-23, the pusher portion enters the placement slot 3-231 from the ejection slot 3-232 under the drive of the drive device, and ejects the MOS tube 9 from the placement slot 3-231. The drive device pushes the intermediate connecting plate 3-221 to move, the intermediate connecting plate 3-221 drives the pusher 3-222 to move, the pusher portion 3-2221 on the pusher 3-222 is inserted into the placement slot 3-231, and ejects the MOS tube 9 in the placement slot 3-231.

[0099] In this embodiment, the ejection drive device adopts an electric cylinder, and the sliding block of the electric cylinder is connected to the middle connecting plate 3-221. Fig.15 As shown, in this embodiment, the plate-staggering device 4 includes a first support frame 4-10, a second support frame 4-20, a first drive device 4-30, a second drive device 4-40 and a material-taking and discharging mechanism 4-50. The first support frame 4-10 is straddled on the drying jig conveying mechanism 4-80. The MOS tube after gluing needs to be placed on the drying jig 4-70, and the drying jig 4-70 conveying mechanism transports the drying jig 4-70 with the MOS tube placed to the drying equipment for drying treatment. Before the MOS tube is staggered, the drying jig 4-70 conveying mechanism first transports the drying jig 4-70 to the staggering station. The drying jig conveying mechanism 4-80 transports the drying jig 4-70 along the second direction, and the first support frame 4-10 straddles the drying jig conveying mechanism 4-80 along the first direction.

[0100] The second support frame 4-20 is straddled on the drying jig conveying mechanism 4-80, and the second support frame 4-20 also straddles the drying jig 4-70 conveying mechanism along the first direction.

[0101] The first support frame 4-10 and the second support frame 4-20 are arranged along a second direction, and the second direction is perpendicular to the first direction.

[0102] In this embodiment, the first driving device 4-30 is installed on the first supporting frame 4-10, and the output end of the first driving device 4-30 is used to drive the load to move linearly along the first direction;

[0103] In this embodiment, the second driving device 4-40 and the material taking and placing mechanism 4-50 as the load of the output end of the first driving device 4-30 move along the first direction under the drive of the first driving device 4-30. The material taking and placing mechanism 4-50 is connected to the output end of the second driving device 4-40.

[0104] In this embodiment, one end of the second drive device 4-40 is connected to the output end of the first drive device 4-30, and the other end is slidably connected to the first support frame 4-10. The output end of the second drive device 4-40 is used to drive the load to move linearly along the second direction; the second drive device 4-40 uses the second support frame 4-20 and the first drive device 4-30 installed on the first support frame 4-10 as supports at both ends, so that the second drive device 4-40 can be arranged above the drying fixture 4-70 along the second direction. Since one end of the second drive device 4-40 is connected to the output end of the first drive device 4-30, and the other end is slidably connected to the first support frame 4-10, the second drive device 4-40 can stably move linearly along the first direction under the support of the two support frames and the drive of the second drive device 4-40. The material taking and releasing mechanism 4-50, as the load at the output end of the second drive device 4-40, moves linearly along the second direction under the drive of the second drive device 4-40. The material picking and unloading mechanism 4-50 is used to pick up the MOS tube that has been glued from the first component buffer mechanism, and after moving to a predetermined position under the drive of the first drive device 4-30 and the second drive device 4-40, the picked MOS tube is placed in the set position of the drying fixture 4-70.

[0105] like Fig.16As shown, the material taking and releasing mechanism 4-50 includes a first connecting member 4-51, a third driving device 4-52, a first mounting frame 4-53 and a plurality of picking members 4-54, the first connecting member 4-51 is connected to the output end of the second driving device 4-40, the third driving device 4-52 is installed on the first connecting member 4-51, the first mounting frame 4-53 is connected to the output end of the third driving device 4-52, the third driving device 4-52 is used to drive the first mounting frame 4-53 to move along a third direction, the third direction is a direction perpendicular to both the first direction and the second direction, the plurality of picking members 4-54 are installed on the first mounting frame 4-53, and the plurality of picking members 4-54 are arranged along the second direction.

[0106] The picking member 4-54 is used to pick up the MOS tube 9, and each picking member 4-54 is used to pick up one MOS tube 9. The pick-up and unplacing mechanism 4-50 is driven by the first driving device 4-30 and the second driving device 4-40 to move above the MOS tube picking position, and then the third driving device 4-52 drives the first connecting member 4-51 to move downward and drives the first mounting frame 4-53 to move downward, and each picking member 4-54 installed on the first mounting frame 4-53 also moves downward synchronously with the first mounting frame 4-53 until the picking member 4-54 moves to the picking position to pick up the MOS tube. At this time, the third driving device 4-52 drives the first mounting frame 4-53 to move upward and drives each picking member 4-54 to move to the set height, and then the pick-up and discharge mechanism 4-50 is driven by the first driving device 4-30 and the second driving device 4-40 to move above the position where the MOS tube is placed on the drying fixture 4-70. At this time, the third driving device 4-52 drives the first connecting member 4-51 to move downward and drives the first mounting frame 4-53 to move downward. Each picking member 4-54 installed on the first mounting frame 4-53 also moves downward synchronously with the first mounting frame 4-53 until the picking member 4-54 moves to the placement position and the picking member places the MOS tube on the drying fixture 4-70. Since several picking members 4-54 are arranged along the second direction, the pick-up and discharge mechanism 4-50 can pick up multiple MOS tubes at one time and place these multiple MOS tubes on the drying fixture 4-70 at the same time, thereby further improving the production efficiency.

[0107] like Fig.16As shown, in this embodiment, the first mounting frame 4-53 includes a strip-shaped extension portion 4-531 extending along the first direction and a strip-shaped mounting portion 4-532 extending along the second direction, the middle portion of the mounting portion 4-532 is connected to the extension portion 4-531, and the mounting portion 4-532 is provided with a plurality of mounting holes arranged along the second direction, and the pick-up member 4-54 is mounted on the mounting holes. The first mounting frame 4-53 is formed into a "T"-shaped structure by the extension portion 4-531 and the mounting portion 4-532, so that the mounting portion 4-532 is in a direction away from the third driving device 4-52, so that the pick-up member 4-54 and the driving device do not affect each other, which can improve the reliability of picking and placing materials. The strip-shaped mounting portion 4-532 extending along the second direction can be installed with multiple picking members along the second direction, thereby increasing the number of MOS tubes 9 that can be picked up and placed at one time without occupying too much operating space.

[0108] In this embodiment, the picking member 4-54 includes a hollow suction head and a suction cup arranged at one end of the suction head, and the end of the suction head away from the suction cup is connected to the negative pressure device, and the end of the picking member 4-54 with the suction cup penetrates from the top of the mounting portion 4-532 to the bottom of the mounting portion 4-532. When it is necessary to pick up the MOS tube, the negative pressure device can be used to form a negative pressure on the suction cup connected to the suction head, and the negative pressure on the suction cup is used to adsorb the MOS tube onto the picking member 4-54. When it is necessary to place the MOS tube on the drying jig 4-70, the suction head is disconnected from the negative pressure device, and the MOS tube is released by the suction cup to the drying jig 4-70.

[0109] like Fig.17 As shown, the multi-station detection device 7 in this embodiment includes a second base plate 7-1, a second turntable 7-2, a loading module 7-3, a front detection mechanism 7-4, a first exclusion mechanism 7-5, a back detection mechanism 7-6, a second exclusion mechanism 7-7 and a feeding mechanism 7-8.

[0110] The second turntable 7-2 is rotatably connected to the second bottom plate 7-1, and a plurality of second fixture modules 7-21 are arranged on the second turntable 7-2. The second fixture modules 7-21 are arranged at equal intervals along the circumferential direction of the turntable, and the second fixture modules 7-21 are used to define the position of the MOS tube 9;

[0111] The MOS tube 9 to be inspected is placed on the second jig module 7-21. During the inspection process, the second turntable 7-2 rotates around its axis driven by a motor, driving the second jig module 7-21 on the second turntable 7-2 to rotate around the axis of the second turntable 7-2, so that the second jig module 7-21 reaches different workstations.

[0112] The loading module 7-3 in this embodiment is located at the loading station, and the loading module 7-3 is used to feed the MOS tube 9 processed in the previous link into one of the second fixture modules 7-21; when a second fixture module 7-21 rotates to the loading station, the loading module 7-3 moves the MOS tube 9 processed in the previous link to this second fixture module 7-21. The front detection mechanism 7-4 is located at the front detection station, and the front detection mechanism 7-4 is used to detect the front of the MOS tube 9; the first exclusion mechanism 7-5 is located at the first exclusion station, and the first exclusion mechanism 7-5 is used to discharge the MOS tube 9 that fails the front detection into the first bin 7-53; after the MOS tube 9 is detected by the front detection mechanism 7-4, if the MOS tube 9 is found to be unqualified during the detection process, the first exclusion mechanism 7-5 discharges the MOS tube 9 from the second fixture module 7-21 into the first bin 7-53. If the front detection is qualified, the first exclusion mechanism 7-5 does not perform the exclusion action, and the MOS tube 9 remains in the second fixture module 7-21 and moves to the next station as the second turntable 7-2 rotates.

[0113] In this embodiment, the back side detection mechanism 7-6 is located at the back side detection station, and the back side detection mechanism 7-6 is used to detect the back side of the MOS tube 9; the second exclusion mechanism 7-7 is located at the second exclusion station, and the second exclusion mechanism 7-7 is used to discharge the MOS tube 9 that fails the back side detection into the second material bin 7-73;

[0114] After the MOS tube 9 is inspected by the back side inspection mechanism 7-6, if the MOS tube 9 is found to be unqualified during the inspection process, the second exclusion mechanism 7-7 discharges the MOS tube 9 from the second fixture module 7-21 into the second silo 7-73. If the back side inspection is qualified, the second exclusion mechanism 7-7 does not perform the exclusion action, and the MOS tube 9 remains in the second fixture module 7-21 and moves to the next station with the rotation of the second turntable 7-2. After the MOS tube 9 is inspected on both the front and back sides, only products with qualified inspections on both sides can be sent to the next station, and the remaining unqualified MOS tubes 9 are excluded from the silo.

[0115] In this embodiment, the feeding mechanism 7-8 is used to send the MOS tube 9 that has completed the inspection to the next process link; the loading station, the front inspection station, the first exclusion station, the back inspection station and the second exclusion station are arranged in sequence along the circumferential direction of the second turntable 7-2. During the rotation of the second turntable 7-2, the second fixture module 7-21 passes through the loading station, the front inspection station, the first exclusion station, the back inspection station and the second exclusion station in sequence.

[0116] like Fig.18As shown, in this embodiment, the first loading module 7-3 includes a loading electric cylinder 7-31 and a loading push rod 7-32, the loading push rod 7-32 is connected to the output end of the loading electric cylinder 7-31, and the loading push rod 7-32 is driven by the loading electric cylinder 7-31 to push the MOS tube into the second fixture module 7-21 facing the loading station. Fig.18 As shown, the MOS tube 9 is arranged in advance in the buffer slot of the second component buffer mechanism 7-33, and a guide slot is set at the end of the buffer slot, which is connected to the buffer slot and one end faces the second fixture module 7-21 facing the loading station, and the loading module 7-3 is located at the end of the guide slot facing away from the second fixture module 7-21. The loading push rod 7-32 is driven by the loading electric cylinder 7-31 to push forward in the direction of the second fixture module 7-21, and along the guide slot, the MOS tube is pushed from the second component buffer mechanism 7-33 to the second fixture module 7-21, thereby completing the loading process of the MOS tube 9 to be tested.

[0117] like Fig.19 As shown, in this embodiment, the front detection mechanism 7-4 includes a first image acquisition module 7-41, an image acquisition module mounting seat 7-42, and a mounting bracket 7-43. The mounting bracket 7-43 is fixedly connected to the base plate, and the image acquisition module mounting seat 7-42 is installed on the mounting bracket 7-43. The image acquisition module is located directly above the front detection station.

[0118] like Fig. 20As shown, the acquisition module mounting seat 7-42 includes a fixed plate 7-421, a first movable plate 7-422, an intermediate plate 7-423 and a second movable plate 7-424. The fixed plate 7-421, the first movable plate 7-422, the intermediate plate 7-423 and the second movable plate 7-424 are rectangular parallelepiped structures. The lengths and widths of the fixed plate 7-421, the first movable plate 7-422, the intermediate plate 7-423 and the second movable plate 7-424 are the same. The second movable plates 7-424 are stacked in sequence along the height direction, and a first slide groove extending in the vertical direction is provided on the side of the first movable plate 7-422 facing the fixed plate 7-421, and a first guide rail 7-425 is provided on the side of the fixed plate 7-421 facing the first movable plate 7-422, and the guide rail is located on the inner side of the first slide groove, and a first mounting frame extending toward the first movable plate 7-422 is provided on one side of the fixed plate 7-421, and a first cylinder 7-427 is installed on the first mounting frame. The side wall is provided with a first force-bearing structure 7-4221 extending outward, the output end of the first cylinder 7-427 is connected to the first force-bearing structure 7-4221, the first cylinder 7-427 pushes the first movable plate 7-422 along a first direction, the intermediate plate 7-423 is fixedly connected to the first movable plate 7-422, the side of the intermediate plate 7-423 facing the second movable plate 7-424 is provided with a second guide rail 7-426 extending in a horizontal direction, and the side of the second movable plate 7-424 facing the intermediate plate 7-423 is provided with a second guide rail 7-426 extending in a horizontal direction. A second slide groove extends in the horizontal direction, and a second mounting frame extending toward the second movable plate 7-424 is arranged on the middle plate 7-423, and a second cylinder 7-428 is installed on the second mounting frame. The side wall of the second movable plate 7-424 is provided with a second force-bearing structure 7-4241 extending outward, and the output end of the second cylinder 7-428 is connected to the first force-bearing structure 7-4221, and the second cylinder 7-428 pushes the second movable plate 7-424 along the second direction, and the image acquisition module is fixedly connected to the second movable plate 7-424.

[0119] After adopting the aforementioned driving structure, the image acquisition module can be driven to move in the vertical direction by driving the first cylinder 7-427 to extend and retract, and the image acquisition module can be driven to move in the horizontal direction by driving the second cylinder 7-428 to extend and retract. The first cylinder 7-427 and the second cylinder 7-428 work together to drive the image acquisition module to perform two-dimensional movement. This embodiment adopts a structural form in which multiple flat plates are stacked, which can achieve driving the image acquisition module to perform two-dimensional movement with a smaller volume. When the MOS tube 9 rotates from the loading station to the front detection station with the second fixture module 7-21, the first image acquisition module 7-41 collects the image of the front of the MOS tube 9, and detects the front of the MOS tube 9 based on the collected image, and feeds back the detection result to the control system of the detection device. The method of using image to detect the MOS tube 9 can adopt the existing technology.

[0120] like Fig.21 As shown, in this embodiment, the first exclusion mechanism 7-5 includes a first push rod 7-51 and a first push mechanism 7-52, the first push mechanism 7-52 is installed on the mounting substrate 7-9, and the first push rod 7-51 is driven by the first push mechanism 7-52 to push the MOS tube out of the second fixture module 7-21. The reverse side detection mechanism 7-6 is installed below the second bottom plate 7-1, and the reverse side detection mechanism 7-6 includes a second image acquisition module, and a detection hole 7-11 is opened on the second bottom plate 7-1, and the detection hole 7-11 is located directly above the second image acquisition module.

[0121] When the MOS tube 9 rotates from the loading station to the reverse side detection station with the second fixture module 7-21, the second image acquisition module acquires the image of the reverse side of the MOS tube 9 through the detection hole 7-11, and detects the reverse side of the MOS tube 9 according to the acquired image, and feeds back the detection result to the control system of the detection device. The method of using the image to detect the MOS tube 9 can adopt the existing technology. The second exclusion mechanism 7-7 can adopt the same structure as the first exclusion mechanism.

[0122] like Fig. 22As shown, the feeding mechanism 7-8 includes a material guide 7-81, a first material pusher assembly 7-82 and a second material pusher assembly 7-83, the first material pusher assembly 7-82 is mounted on the mounting base plate 7-9, the second material pusher assembly 7-83 is mounted on the second base plate 7-1, the material guide 7-81 includes a first slide 7-811 and a second slide 7-812, the first slide 7-811 is directly opposite to the second fixture module 7-21 at the feeding station, the second slide 7-812 is located on the side of the first slide 7-811 away from the second fixture module 7-21, and the second The slide 7-812 is perpendicular to the first slide 7-811, and the second slide 7-812 is connected to the first slide 7-811 on the side of the first slide 7-811 away from the second fixture module 7-21. The first pushing assembly 7-82 pushes the MOS tube 9 located in the second fixture module 7-21 into the second slide 7-812 via the first slide 7-811 along the extension direction of the first slide 7-811, and the second pushing assembly 7-83 is used to push the MOS tube 9 located in the second slide 7-812 to the next link along the extension direction of the second slide 7-812.

[0123] After the MOS tube 9 rotates to the feeding station with the second fixture module 7-21, the MOS tube 9 faces the first slideway 7-811, and the first pusher assembly 7-82 first pushes the MOS tube from the second fixture module 7-21 into the first slideway 7-811, and then pushes the MOS tube into the second slideway 7-812 along the first slideway 7-811. When the MOS tube 9 enters the second slideway 7-812, the second pusher assembly 7-83 pushes the MOS tube into the second air blowing mechanism along the second slideway 7-812.

[0124] In this embodiment, the first pusher assembly 7-82 includes a first electric cylinder and a first pusher rod, the first pusher rod is connected to the output end of the first electric cylinder, the first pusher assembly 7-82 is located on the side of the second fixture module 7-21 away from the material guide 7-81, and the first pusher rod is driven by the first electric cylinder to move from the side of the second fixture module 7-21 away from the material guide 7-81 to the direction close to the second slideway 7-812. The moving direction of the first pusher rod is the same as the extension direction of the first slideway 7-811.

[0125] The second pusher assembly 7-83 includes a second electric cylinder and a second pusher rod, the second pusher rod is connected to the output end of the second electric cylinder, the second pusher assembly 7-83 is located on the side of the second fixture module 7-21 away from the material guide 7-81, and the second pusher rod is driven by the second electric cylinder to move from the side of the second fixture module 7-21 away from the material guide 7-81 to the direction close to the second slideway 7-812. The moving direction of the second pusher rod is the same as the extension direction of the first slideway.

[0126] like Fig.23 As shown, the MOS tube packaging equipment with automatic detection function in this embodiment also includes a shell insertion device 8, and the shell insertion device 8 includes a second air blowing mechanism 8-1 and a shell insertion channel 8-2. The second air blowing mechanism 8-1 uses air flow to blow the MOS tube that has passed the inspection into the shell insertion channel 8-2. A material box 1-6 is arranged at one end of the shell insertion channel 8-2 away from the second air blowing mechanism, and the opening of the material box 1-6 is connected to the end of the shell insertion channel 8-2.

[0127] Example 2

[0128] This embodiment further provides a MOS tube packaging detection method, which uses the MOS tube packaging device with automatic detection function described in the first aspect to perform detection, and the method includes the following steps:

[0129] S1: transport the MOS tube to the front inspection station to inspect the front of the MOS tube;

[0130] In specific implementation, the front side of the MOS tube can be inspected using the CCD above the front side inspection station.

[0131] S2: transporting the MOS tubes that have passed the front inspection to the first exclusion station;

[0132] S3: If the MOS tube fails the front inspection, the MOS tube is discharged from the second fixture module into the unqualified product silo;

[0133] In this embodiment, a defective product silo is provided below the first elimination station to collect defective MOS tubes after positive inspection.

[0134] S4: If the front side inspection of the MOS tube is qualified, the MOS tube that has passed the front side inspection is transported to the back side inspection station to inspect the back side of the MOS tube;

[0135] S5: If the back side inspection of the MOS tube fails, the MOS tube is discharged from the second fixture module into the unqualified product silo;

[0136] In this embodiment, a defective product silo is provided below the second elimination station to collect defective MOS tubes after positive inspection.

[0137] S6: If the back side of the MOS tube passes the inspection, the MOS tube is transported to the feeding station.

[0138] If both the front and back side inspections of the MOS tube are qualified, the MOS tube can be transported to the feeding station for the post-inspection process.

[0139] The above is only a specific implementation of the present invention. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the system, module and unit described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the protection scope of the present invention is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be covered within the protection scope of the present invention.

Claims

1. MOS tube packaging equipment with automatic detection function, characterized in that: include: A feeding device, comprising a first mounting base, a stacking mechanism, a material box docking mechanism and a first air blowing mechanism, wherein the stacking device and the material box docking mechanism are mounted on the first mounting base, the stacking mechanism is used to stack material boxes, the material boxes are used to store MOS tubes, and the material box docking mechanism is used to move and flip the material boxes in the stacking mechanism to a position where they are docked with the first air blowing mechanism; The spacing device comprises a long spacing channel and a plurality of ejector rods, wherein one end of the spacing channel away from the material box docking mechanism is connected to the first air blowing mechanism, and the spacing channel is provided with openings of the same number as the ejector rods at equal intervals, and the ejector rods correspond to the openings one by one, and the ejector rods move up and down along the axial direction of the openings, and an in-place detection sensor corresponding to the openings one by one is arranged below the spacing channel, and the in-place detection sensor corresponding to each opening is located on a side of the opening away from the first air blowing mechanism, and when the in-place detection sensor corresponding to the opening detects that the MOS tube reaches a predetermined position, the ejector rod in the opening extends out of the opening; A multi-station gluing platform comprises a first turntable, a first bottom plate, a material taking mechanism, a gluing mechanism and a first component buffer mechanism, wherein the material taking mechanism, the gluing mechanism and the first component buffer mechanism are mounted on the first bottom plate, and the first turntable rotates relative to the first bottom plate; A tray placement device is used to place the MOS tubes on the drying fixture; A drying device, used to dry the MOS tube on the drying fixture; Multi-station inspection device, used to inspect the MOS tube after gluing; The tray taking device is used to take the MOS tube out of the drying fixture and transport it to the multi-station detection device.

2. The MOS tube packaging device with automatic detection function according to claim 1, characterized in that: The stacking mechanism comprises a first stacking limit assembly and a second stacking limit assembly arranged along the first direction, the first stacking limit assembly comprises a limit bottom plate, a first limit side plate, a second limit side plate and a limit back plate, the limit bottom plate is horizontally arranged, the first limit side plate and the second limit side plate are parallel to the first direction, the first limit side plate, the second limit side plate and the limit back plate are vertically arranged, the limit back plate is perpendicular to the first direction, the first limit side plate and the second limit side plate are located above the limit bottom plate, the limit back plate is connected to the first limit side plate on the side of the first limit side plate away from the second stacking limit assembly, the limit back plate is connected to the second limit side plate on the side of the second limit side plate away from the first stacking limit assembly, the spacing between the first limit side plate and the second limit side plate is the width of a material box, and the bottoms of the first limit side plate and the second limit side plate are separated from the upper surface of the limit bottom plate by the height of a material box in the vertical direction.

3. The MOS tube packaging device with automatic detection function according to claim 2, characterized in that: The material box offset mechanism includes a material box offset driving device and a material box receiving plate, the output end of the material box translation driving device is connected to the material box receiving plate, the material box receiving plate is provided with a material box receiving groove, the height of the upper surface of the material box receiving plate is the same as the height of the bottom of the first limiting side plate and the second limiting side plate, the material box receiving groove is formed by the upper surface of the material box receiving plate being recessed downward, the width of the material box receiving groove is the same as the width of a material box, the depth of the material box receiving groove is the same as the height of a material box, and the material box receiving plate, driven by the material box translation driving device, moves back and forth between the stacking position and the discharging position along a direction perpendicular to the first limiting side plate.

4. The MOS tube packaging device with automatic detection function according to claim 2, characterized in that: The loading device also includes an empty box receiving bin, which is arranged at the side wall of the edge of the first mounting base, and the opening of the empty box receiving bin is located at a height below the upper surface of the limiting bottom plate, and an extension portion is provided on the side of the material box receiving groove facing the empty box receiving bin on the material box receiving plate, and the width of the extension portion is greater than the distance between the end of the material box facing the empty box receiving bin and the side wall where the empty box receiving bin is installed when the material box receiving groove is in the docking position.

5. The MOS tube packaging device with automatic detection function according to claim 4, characterized in that: The material box flipping mechanism includes a fixing component and a flipping drive component, the fixing component is rotatably connected to the first mounting base, the fixing component includes a flipping support, a pressing component and a pressing drive component, the pressing drive component is installed on the flipping support, the pressing drive component drives the pressing component to press down to fix the material box between the flipping support and the pressing component, and the flipping drive component is used to drive the fixing component to rotate to flip the material box from the docking position to the unloading position.

6. The MOS tube packaging equipment with automatic detection function according to claim 1, characterized in that: Four fixture modules are arranged on the first turntable, and the four fixture modules are arranged at an interval of π / 2 in the circumferential direction of the first turntable, and the fixture modules are used to limit the positions of a plurality of MOS tubes arranged in a straight line; The material picking mechanism is arranged at the material discharging station, and the material picking mechanism is used to place the MOS tube on the jig module, the gluing mechanism is arranged at the gluing station, and the first component buffer mechanism is arranged at the material storage station, and is used to temporarily store the MOS tube after gluing; the gluing station and the material storage station are arranged at an interval of arc π along the circumferential direction of the first turntable, the material discharging station and the gluing station are arranged at an interval of arc π / 2 along the circumferential direction of the first turntable, and the material discharging station and the material storage station are arranged at an interval of arc π / 2 along the circumferential direction of the first turntable; an ejection mechanism is arranged above the first turntable, and the ejection mechanism is used to push the MOS tube in the jig module on the material storage station into the material storage mechanism.

7. The MOS tube packaging equipment with automatic detection function according to claim 1, characterized in that: The swing plate device comprises a first support frame, a second support frame, a first drive device, a second drive device and a material taking and placing mechanism: The first support frame is straddled on the drying jig conveying mechanism; The second support frame is straddled on the drying jig conveying mechanism; The first driving device is installed on the first supporting frame, and the output end of the first driving device is used to drive the load to move linearly along the first direction; One end of the second driving device is connected to the output end of the first driving device, and the other end thereof is slidably connected to the second support frame, and the output end of the second driving device is used to drive the load to move linearly along the second direction; The material taking and placing mechanism is connected to the output end of the second driving device; The first support frame and the second support frame are arranged along a second direction, and the second direction is perpendicular to the first direction.

8. The MOS tube packaging device with automatic detection function according to any one of claims 1 to 7, characterized in that: The multi-station detection device includes a second bottom plate, a second turntable, a loading module, a front detection mechanism, a first exclusion mechanism, a back detection mechanism, a second exclusion mechanism and a feeding mechanism; The second turntable is rotatably connected to the second bottom plate, and a plurality of fixture modules are arranged on the second turntable. The fixture modules are arranged at equal intervals along the circumferential direction of the turntable, and the fixture modules are used to limit the position of the MOS tube; The loading module is located at the loading station, and is used to feed the MOS tube processed in the previous link into one of the fixture modules; The front detection mechanism is located at the front detection station, and the front detection mechanism is used to detect the front of the MOS tube; The first exclusion mechanism is located at the first exclusion station, and is used to discharge the MOS tubes that fail the front inspection into the first silo; The back side detection mechanism is located at the back side detection station, and is used to detect the back side of the MOS tube; The second exclusion mechanism is located at the second exclusion station, and is used to discharge the MOS tubes that fail the back surface inspection into the second silo; The feeding mechanism is used to send the MOS tube that has completed the inspection to the next process link; The loading station, the front detection station, the first exclusion station, the back detection station and the second exclusion station are arranged in sequence along the circumferential direction of the second turntable.

9. The MOS tube packaging device with automatic detection function according to claim 8, characterized in that: The front detection mechanism includes an image acquisition module, an acquisition module mounting seat and a mounting bracket, the acquisition module mounting seat is mounted on the mounting bracket, the image acquisition module is mounted on the acquisition module mounting seat, the acquisition module mounting seat includes a fixed plate, a first movable plate, an intermediate plate and a second movable plate, the fixed plate, the first movable plate, the intermediate plate and the second movable plate are rectangular structures, the lengths and widths of the fixed plate, the first movable plate, the intermediate plate and the second movable plate are the same, the fixed plate, the first movable plate, the intermediate plate and the second movable plate are stacked in sequence along the height direction, a first slide groove extending in a vertical direction is provided on a side of the first movable plate facing the fixed plate, a first guide rail is provided on a side of the fixed plate facing the first movable plate, the guide rail is located on the inner side of the first slide groove, and one side of the fixed plate is provided with a first mounting plate extending in the direction of the first movable plate. The cam is provided with a first cylinder, the side wall of the first movable plate is provided with a first force-bearing structure extending outward, the output end of the first cylinder is connected to the first force-bearing structure, the first cylinder pushes the first movable plate along a first direction, the middle plate is fixedly connected to the first movable plate, the side of the middle plate facing the second movable plate is provided with a second guide rail extending in a horizontal direction, the side of the second movable plate layer facing the middle plate is provided with a second slide groove extending in a horizontal direction, the middle plate is provided with a second mounting frame extending in the direction of the second movable plate, the second mounting frame is provided with a second cylinder, the side wall of the second movable plate is provided with a second force-bearing structure extending outward, the output end of the second cylinder is connected due to the first force-bearing structure, the second cylinder pushes the second movable plate along the second direction, and the image acquisition module is fixedly connected to the second movable plate.

10. MOS tube packaging detection method, characterized in that: The MOS tube packaging device with automatic detection function described in any one of claims 1 to 9 is used for detection, and the method comprises the following steps: The MOS tube is transported to the front inspection station to inspect the front of the MOS tube; Transport the MOS tubes that have passed the front inspection to the first elimination station; If the MOS tube fails the front inspection, the MOS tube is discharged from the second fixture module into the unqualified product silo; If the front side inspection of the MOS tube is qualified, the MOS tube that has passed the front side inspection is transported to the back side inspection station to inspect the back side of the MOS tube; If the MOS tube fails the back surface inspection, the MOS tube is discharged from the second fixture module into the unqualified product silo; If the back side of the MOS tube passes the inspection, the MOS tube will be transported to the feeding station.

Images