Heat dissipation device of controller and control method of heat dissipation device

Abstract

The invention provides a heat dissipation device of a controller and a control method of the heat dissipation device. The heat dissipation device comprises a fan, a circuit board with double-sided layout and a shell, a plurality of baffle plates are arranged on the upper and lower surfaces of the circuit board, the baffle plates form heat dissipation channels on the upper and lower surfaces of the circuit board, and an air inlet fan and an air outlet fan are respectively arranged on the shell corresponding to two ends of the heat dissipation channels. Through the arrangement, the controller is simple in structure, air flows into the controller through cooperation of the air inlet fan and the air outlet fan to achieve heat exchange in the controller so as to dissipate heat of the controller, meanwhile, the heat dissipation channels are additionally formed in the upper and lower surfaces of the circuit board to guide and adjust air flow, and dead corners are effectively reduced; heat is uniformly taken away through the surface of the electronic component, and the heat dissipation efficiency and the heat dissipation effect are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of controller heat dissipation, and in particular to a heat dissipation device of a controller and a control method thereof. Background Art

[0002] With the growing demand for functional diversity and performance improvement in today's market, more and more electronic components are integrated in the controller, and power consumption also increases accordingly, which leads to the aggravation of the heat dissipation problem. If the heat generated by high-power electronic components is not dissipated in time, it will affect the life and reliability of the electronic components, and even cause system failure. In the prior art, active or passive heat dissipation methods are usually used to dissipate heat for this heat dissipation problem; however, there are few heat dissipation solutions for the problem that double-sided circuit boards generate more heat. Application No. CN202111512076.9 discloses a heat dissipation method for double-sided circuit boards, which dissipates heat to the controller by using a dual heat dissipation method of water cooling and a radiator. However, the overall heat dissipation structure is complex, costly, inefficient, and has high power consumption in long-term use. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings and deficiencies of the prior art and to provide a heat dissipation device for a controller and a control method thereof.

[0004] The technical solution adopted by the present invention is as follows: it includes a fan, a double-sided circuit board and a shell; the fan includes an air inlet fan and an air outlet fan, there are multiple baffles on the upper and lower sides of the circuit board, the baffles form S-shaped heat dissipation channels on the upper and lower sides of the circuit board, and the air inlet fan and the air outlet fan are respectively provided at the two ends of the corresponding heat dissipation channels on the shell.

[0005] Preferably, the housing comprises an upper cover plate and a lower cover plate, the upper cover plate is a heat dissipation plate, and the heat dissipation plate is a honeycomb structure.

[0006] Preferably, a dustproof plate is provided on the outside of the air inlet fan, and a waterproof and breathable membrane is provided between the dustproof plate and the air inlet fan.

[0007] Preferably, an optimization model for determining the position and length of the baffle is also included.

[0008] Preferably, it also includes electronic components, and the electronic components include:

[0009] A data acquisition module, including a first sensor for measuring component temperature, a second sensor for measuring ambient temperature, embedded software for measuring component power consumption, and a database for storing component packaging information;

[0010] A data preprocessing module is used to process the data collected by the data collection module;

[0011] Temperature prediction module, used to predict the temperature of components;

[0012] The heat dissipation strategy module generates a corresponding heat dissipation strategy based on the predicted temperature;

[0013] An actuator for executing a heat dissipation strategy;

[0014] The system feedback module is used to adjust the temperature prediction module and the heat dissipation strategy module.

[0015] Preferably, S1, collecting key data of temperature, ambient temperature, power consumption and packaging information of components in the controller through a data acquisition module;

[0016] S2, through the data preprocessing module, the key data collected by S1 is processed, the erroneous data is eliminated, the format of the remaining data is unified, and after the data is unified, the effective data of the temperature and power consumption of the relevant components are extracted;

[0017] S3, input the valid data extracted in S2 into the temperature prediction module and predict the temperature value at a future time point, and then output the predicted temperature value;

[0018] S4, collect the predicted temperature value of S3 and input it into the heat dissipation strategy module, and send the heat dissipation instruction in time;

[0019] S5, the actuator receives the heat dissipation instruction and executes corresponding heat dissipation measures on the fan;

[0020] S6, the system feedback module monitors in real time the actual temperature collected by S1 and the heat dissipation effect after the actuator executes the heat dissipation instruction. When the actual temperature does not match the predicted temperature value or the heat dissipation effect is not good, the temperature prediction module or the heat dissipation strategy module will be adjusted.

[0021] Preferably, the first sensor and the second sensor collect data at a fixed frequency.

[0022] Preferably, the temperature prediction module includes a temperature prediction model applicable to time series, and the temperature prediction model is SVR.

[0023] Preferably, the heat dissipation strategy module includes a PID control module, which receives the predicted temperature value from the SVR, the set target temperature value and the actual temperature value from the valid data, calculates the fan speed adjustment amount according to the above three temperature values, and adjusts the fan speed in real time.

[0024] Preferably, a fan speed threshold is provided in the PID control module to control the maximum or minimum speed of the fan.

[0025] The beneficial effects of the present invention are as follows: the present invention has a simple structure, and the air is flowed into the controller through the cooperation of the air inlet fan and the air outlet fan to realize the heat exchange inside the controller so that the controller dissipates heat. At the same time, heat dissipation channels are added on the upper and lower surfaces of the circuit board to guide and regulate air flow, effectively reducing dead angles, and evenly taking away heat through the surface of electronic components, thereby improving heat dissipation efficiency and heat dissipation effect, and at the same time reducing the circuit board's dependence on high-end heat dissipation materials and larger heat dissipation systems, thereby reducing overall design and manufacturing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, without paying creative labor, other drawings obtained based on these drawings still belong to the scope of the present invention.

[0027] Figure 1 It is a schematic structural diagram of the heat dissipation device of the present invention;

[0028] Figure 2 is an exploded schematic diagram of the heat dissipation device of the present invention;

[0029] Figure 3 It is a schematic diagram of the heat dissipation channel structure of the present invention;

[0030] Figure 4 is a schematic diagram of an explosion of the air inlet fan of the present invention;

[0031] Figure 5 is a flow chart of the heat dissipation control method of the present invention;

[0032] Figure 6 This is the working flow diagram of the heat dissipation strategy module;

[0033] In the figure, 1-fan, 2-circuit board, 3-baffle, 31-heat dissipation channel, 11-wind fan, 12-air outlet fan, 41-upper cover plate, 42-lower cover plate, 110-dustproof plate, 111-waterproof breathable membrane. DETAILED DESCRIPTION

[0034] In order to make the objectives, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below with reference to the accompanying drawings.

[0035] It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are for distinguishing two non-identical entities with the same name or non-identical parameters. It can be seen that "first" and "second" are only for the convenience of expression and should not be understood as limitations on the embodiments of the present invention. The subsequent embodiments will not explain this one by one.

[0036] The directions and positions mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "inside", "outside", "top", "bottom", "side", etc., are only for reference to the directions or positions of the drawings. Therefore, the directions and positions used are for explaining and understanding the present invention, but not for limiting the scope of protection of the present invention.

[0037] To solve the above problems, Figures 1 to 6 As shown, the embodiment of the present application provides a heat dissipation device of a controller and a control method thereof. The device comprises a fan 1, a double-sided circuit board 2 and a housing; the fan 1 comprises an air inlet fan 11 and an air outlet fan 12, a plurality of baffles 3 are provided on both the upper and lower surfaces of the circuit board 2, the baffles 3 form an S-shaped heat dissipation channel 31 on both the upper and lower surfaces of the circuit board 2, and the air inlet fan 11 and the air outlet fan 12 are provided at both ends of the housing corresponding to the heat dissipation channel 31.

[0038] It can be understood that the air inlet fan 11 draws air into the circuit board 2, the air passes through the heat dissipation channel 31 and takes away the heat in the controller, and finally is discharged from the controller from the air outlet fan 12; the air inlet fan 11, the air outlet fan 12 and the heat dissipation channel 31 constitute a simple air cooling structure, and the baffles 3 located on the upper and lower surfaces of the circuit board 2 are connected to the outer casing, which improves the strength of the baffle 3 and is not easy to tilt when the air volume is large.

[0039] The pins of the circuit board 2 and the electronic components are the locations where heat consumption is often generated during the operation of the controller. The air inlet fan 11 and the air outlet fan 12 can dissipate heat at this location. Through the above settings, the present invention has a good heat dissipation effect for this heat, and at the same time, a simple structure is adopted to enable the upper and lower surfaces of the circuit board 2 to have a good heat dissipation effect at the same time.

[0040] The air inlet fan 11 is an axial flow fan. It can be understood that the axial flow fan can ensure a large air volume and is suitable for use in a low resistance environment.

[0041] The heat dissipation channel 31 is an S-shaped channel. The use effect of the S-shaped channel is directly related to the position and length of the baffle 3, and the optimization model determines the position and length of the baffle 3. The present invention is an S-shaped channel for guiding and regulating air flow, effectively reducing dead angles, and evenly taking away heat through the surface of electronic components. At the same time, it blocks the connection between the air inlet fan 11 and the air outlet fan 12, so that the air can take away more heat in the heat dissipation channel 31, and has a good heat dissipation effect.

[0042] It can be understood that the optimization model uses finite element analysis software to establish a thermal model of the circuit board 2, and the thermal model parameters include data such as the geometric dimensions, material properties and heat source distribution of the circuit board 2; at the same time, the response surface method is used to explore the relationship between the position and length information of the baffle 3 and the temperature distribution of the circuit board 2, and multiple groups of baffle 3 position and length data are set for data simulation analysis; by analyzing multiple groups of simulation results obtained from the simulation experiment, the temperature distribution on the circuit board 2 under different baffle 3 configurations is obtained, and a response surface model is constructed based on the temperature distribution; the response surface model uses a mathematical optimization algorithm to find the baffle 3 configuration that can minimize temperature non-uniformity, that is, to find the optimal baffle 3 position and length.

[0043] Through the above settings, the temperature uniformity of the circuit board 2 is optimized to ensure uniform temperature distribution inside the controller, so as to improve the heat dissipation efficiency and avoid local overheating. The optimal position and length of the baffle 3 are determined to maximize the heat dissipation efficiency and reduce the thermal resistance while maintaining the compactness and cost-effectiveness of the structure.

[0044] The housing includes an upper cover plate 41 and a lower cover plate 42, wherein the upper cover plate 41 is a heat sink having a honeycomb structure. It is understandable that the heat sink cooperates with the air cooling structure to enhance the heat dissipation effect of the present invention. The design of the internal air duct can ensure that the airflow covers the key heat source more evenly and efficiently, improves the heat exchange efficiency, and thus more effectively transfers heat from the heat source to the external environment. The system failure rate caused by overheating is reduced, and the reliability and stability of the entire controller system are improved. Through effective thermal management and temperature control, it is possible to avoid electronic components being in a high temperature state for a long time, thereby reducing thermal stress and extending the service life of electronic components.

[0045] A dustproof plate 110 is provided on the outside of the air inlet fan 11. A waterproof breathable membrane 111 is provided between the dustproof plate 110 and the air inlet fan 11. It is understood that the waterproof breathable membrane 111 blocks moisture from entering. Since the controller includes various electronic components and a circuit board 2, the waterproof breathable membrane 111 allows the controller to work safely in a water-immersed state for a short period of time.

[0046] Also included are electronic components, the electronic components comprising:

[0047] A data acquisition module, including a first sensor for measuring component temperature, a second sensor for measuring ambient temperature, embedded software for measuring component power consumption, and a database for storing component packaging information;

[0048] A data preprocessing module is used to process the data collected by the data collection module;

[0049] Temperature prediction module, used to predict the temperature of components;

[0050] The heat dissipation strategy module generates a corresponding heat dissipation strategy based on the predicted temperature;

[0051] An actuator for executing a heat dissipation strategy;

[0052] The system feedback module is used to adjust the temperature prediction module and the heat dissipation strategy module.

[0053] It can be understood that the first sensor and the second sensor are both temperature sensors; the data acquisition module collects key data such as the temperature of the components, ambient temperature, power consumption of the components, packaging information, etc. and transmits it to the data processing center in the data preprocessing module, and performs necessary preprocessing on the data so that the subsequent predicted temperature value can be more accurate; the fixed measurement frequency of the first sensor and the second sensor can ensure the stable input of temperature data and avoid control imbalance caused by uneven data acquisition.

[0054] Preprocessing includes data cleaning, data standardization and feature engineering. Data cleaning is used to handle missing values, duplicate data and outliers. Data standardization: converting data into a format recognizable by the model. For example, converting temperature from Celsius to the unit used in model training so that it conforms to a specific distribution or range, which helps improve the performance and convergence speed of the model. Feature engineering is used to extract or construct features that are helpful for prediction from the converted data, such as temperature change rate, power consumption change rate, etc.

[0055] A method for controlling heat dissipation of a controller, comprising:

[0056] S1. The key data such as the temperature of the components in the controller, the ambient temperature, the power consumption of the components, and the packaging information are collected through the data acquisition module. It can be understood that the temperature of the components and the ambient temperature have an impact on the heat generation of the controller, and the power consumption of the components and the packaging information are both factors that affect the heat generation of the controller when it is working.

[0057] When the power consumption of an electronic component is greater than a preset rated power consumption, heat dissipation measures may be taken to dissipate the heat of the electronic component to avoid damage to the electronic component.

[0058] S2, through the data preprocessing module, the key data collected by S1 is processed, the erroneous data is eliminated, the format of the remaining data is unified, and after the data is unified, the valid data such as the temperature and power consumption of the relevant components are extracted.

[0059] It is understandable that the process of eliminating error information in the present invention includes missing value processing, outlier processing, duplicate data removal, consistency check, and format conversion. When missing values ​​are detected in the data set, the missing values ​​are processed by deleting the records containing the missing values ​​or interpolating the mean / median / near value or predicting the missing values ​​using a machine learning algorithm.

[0060] When outliers are detected in a dataset, statistical methods (e.g., Z-score, IQR rule) or machine learning algorithms (e.g., Isolation Forest, Local Outlier Factor) can be used to detect and handle outliers.

[0061] When duplicate values ​​are detected in a dataset, remove the duplicate records in the dataset to avoid introducing bias in data analysis or modeling.

[0062] The outliers are data points that deviate significantly from the rest of the data set.

[0063] S3. Input the valid data extracted by S2 into the temperature prediction module to predict the temperature at a future time point, and output the predicted temperature value; it can be understood that the temperature prediction of the controller at a future time point can ensure that the controller is within the temperature range under normal operation, avoiding control damage due to excessive temperature.

[0064] S4, collect the temperature value predicted by S3 and input it into the heat dissipation strategy module, and send the heat dissipation instruction in time;

[0065] S5, the actuator receives the heat dissipation instruction and executes corresponding heat dissipation measures on fan 1;

[0066] S6, the system feedback module monitors in real time the actual temperature collected by S1 and the heat dissipation effect after the actuator executes the heat dissipation instruction. When the actual temperature does not match the predicted temperature value or the heat dissipation effect is not good, the temperature prediction module or the heat dissipation strategy module will be adjusted.

[0067] It is understandable that the temperature of components, ambient temperature and other key data are monitored in real time so that the execution of heat dissipation instructions can be adjusted in real time. When the actual temperature does not match the predicted temperature value, the predicted temperature value of the temperature prediction module or the execution of heat dissipation measures may be deviated, and the temperature prediction module and the heat dissipation strategy module are adjusted in time, and the model parameters are adjusted or the model is retrained to improve the prediction accuracy.

[0068] The temperature sensor collects data at a fixed frequency.

[0069] It is understandable that collecting data at a fixed frequency by the sensor can not only ensure the accuracy of the temperature data, but also reduce the frequency of use of the sensor, extend its service life and reduce the heat generated by the controller.

[0070] The temperature prediction module includes a prediction model suitable for time series, the prediction model is SVR, and the prediction model includes data preparation, kernel function selection, parameter tuning and model output.

[0071] Data preparation includes collecting and processing valid data, determining input features and corresponding target values ​​based on the valid data, and improving the effectiveness and efficiency of data analysis and predictive model construction by processing the input features and corresponding target values ​​through data standardization or normalization.

[0072] The input features include ambient temperature, power consumption of components, and fan speed, and the corresponding target values ​​are actual temperatures of the components.

[0073] The kernel function is selected as the RBF kernel function, which can be used to solve most nonlinear problems. It can be understood that the SVR model implements the fitting of nonlinear data through the RBF kernel function.

[0074] The parameter tuning uses cross-validation and other techniques to find the optimal parameter combination of C (regularization parameter), epsilon (slack variable) and gamma (RBF kernel parameter) to optimize the prediction accuracy of the model.

[0075] Through the above settings, the SVR model outputs continuous temperature prediction values, which can be directly used in subsequent heat dissipation control strategies.

[0076] The heat dissipation strategy module includes a PID control module, which receives the predicted temperature value from the prediction module, the set target temperature value and the actual temperature value from the valid data, calculates the wind speed adjustment amount of fan 1 according to the above temperature values, and adjusts the wind speed of fan 1 in real time.

[0077] It is understandable that the target temperature value is an ideal operating temperature range set by the system designer based on the temperature characteristics of the components, and is compared with the predicted temperature value in the heat dissipation strategy module, and finally the PID controller adjusts the fan speed according to the comparison result. The heat dissipation strategy module receives the predicted temperature value, the actual temperature value and the target temperature value, and calculates the temperature error (predicted temperature value / actual temperature value-target temperature value) as an input value to the PID controller, and the PID controller calculates the speed adjustment amount of the fan 1 through the PID control algorithm, thereby adjusting the wind speed of the fan 1.

[0078] The PID control algorithm first initializes the three parameters of PID (Kp, Ki and Kd). Kp determines the amplitude of the response, Ki affects the correction of the accumulated error, and Kd adjusts the response speed of the system. It can be understood that the heat dissipation strategy module introduces the PID control algorithm; P (proportional): processes the current temperature error and adjusts the fan speed linearly according to the size of the error; I (integral): accumulates past errors and corrects the steady-state error of the system; D (differential): predicts future temperature change trends, smoothes the response of fan 1, and prevents over-adjustment; and realizes real-time adjustment of the wind speed of fan 1.

[0079] The PID control module sets a wind speed threshold of the fan 1 to control the maximum or minimum speed of the fan 1 .

[0080] When the predicted temperature value exceeds the set maximum target temperature, the PID controller increases the speed of fan 1 to the maximum to quickly reduce the temperature.

[0081] When the predicted temperature value is within the target temperature range, the PID controller dynamically adjusts the speed of Fan 1 according to the temperature change to ensure that the temperature remains within the ideal range without large fluctuations.

[0082] When the predicted temperature value is lower than the set minimum target temperature, Fan 1 will gradually slow down to the minimum speed to avoid unnecessary energy consumption.

[0083] The heat dissipation strategy module monitors the temperature change in real time and adjusts the Kp, Ki, and Kd parameters of the PID controller according to the actual effect. It is understandable that the PID parameters are adjusted according to the feedback to optimize the control effect. When the deviation between the predicted temperature value and the actual temperature value is too large, it is necessary to retrain the SVR model or adjust the data processing flow so that the present invention can respond to temperature changes more flexibly.

[0084] The heat dissipation strategy module adjusts the PID parameters in real time according to different workloads and environmental conditions to adapt to dynamic changes, thereby improving the adaptability and flexibility of the system and ensuring good heat dissipation performance in various environments.

[0085] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of the present invention. Therefore, equivalent changes made according to the claims of the present invention are still within the scope of the present invention.

Claims

1. A heat dissipation device for a controller, characterized in that: The invention comprises a fan (1), a double-sided circuit board (2) and a housing; the fan comprises an air inlet fan (11) and an air outlet fan (12); a plurality of baffles (3) are provided on both the upper and lower surfaces of the circuit board (2); the baffles (3) form S-shaped heat dissipation channels (31) on both the upper and lower surfaces of the circuit board (2); and the housing is provided with an air inlet fan (11) and an air outlet fan (12) at both ends of the heat dissipation channel (31), respectively.

2. The heat dissipation device of the controller according to claim 1, characterized in that: The housing comprises an upper cover plate (41) and a lower cover plate (42); the upper cover plate (41) is a heat dissipation plate, and the heat dissipation plate is a honeycomb structure.

3. The heat dissipation device of the controller according to claim 1, characterized in that: A dustproof plate (110) is provided on the outside of the air inlet fan (11), and a waterproof and breathable membrane (111) is provided between the dustproof plate (110) and the air inlet fan (11).

4. The heat dissipation device of the controller according to claim 1, characterized in that: Also included is an optimization model for determining the position and length of the baffle (3).

5. The heat dissipation device of the controller according to claim 1, characterized in that: Also included are electronic components, the electronic components comprising: A data acquisition module, including a first sensor for measuring component temperature, a second sensor for measuring ambient temperature, embedded software for measuring component power consumption, and a database for storing component packaging information; A data preprocessing module is used to process the data collected by the data collection module; Temperature prediction module, used to predict the temperature of components; The heat dissipation strategy module generates a corresponding heat dissipation strategy based on the predicted temperature; An actuator for executing a heat dissipation strategy; The system feedback module is used to adjust the temperature prediction module and the heat dissipation strategy module.

6. The heat dissipation control method of the heat dissipation device of the controller as claimed in claim 5, characterized in that: include: S1. Collect key data such as temperature, ambient temperature, power consumption and packaging information of components in the controller through the data acquisition module; S2, through the data preprocessing module, the key data collected by S1 is processed, the erroneous data is eliminated, the format of the remaining data is unified, and after the data is unified, the effective data of the temperature and power consumption of the relevant components are extracted; S3, input the valid data extracted in S2 into the temperature prediction module and predict the temperature value at a future time point, and then output the predicted temperature value; S4, collect the predicted temperature value of S3 and input it into the heat dissipation strategy module, and send the heat dissipation instruction in time; S5, the actuator receives the heat dissipation instruction and executes corresponding heat dissipation measures on the fan (1); S6, the system feedback module monitors in real time the actual temperature collected by S1 and the heat dissipation effect after the actuator executes the heat dissipation instruction. When the actual temperature does not match the predicted temperature value or the heat dissipation effect is not good, the temperature prediction module or the heat dissipation strategy module will be adjusted.

7. The controller heat dissipation control method according to claim 6, characterized in that: The first sensor and the second sensor collect data at a fixed frequency.

8. The controller heat dissipation control method according to claim 6, characterized in that: The temperature prediction module includes a temperature prediction model suitable for time series, and the temperature prediction model is SVR.

9. The controller heat dissipation control method according to claim 6, characterized in that: The heat dissipation strategy module includes a PID control module, which receives a predicted temperature value from the SVR, a set target temperature value, and an actual temperature value from valid data, calculates a speed adjustment amount of the fan (1) based on the above three temperature values, and adjusts the wind speed of the fan (1) in real time.

10. The controller heat dissipation control method according to claim 9, characterized in that: The PID control module sets a wind speed threshold of the fan (1) to control the maximum or minimum speed of the fan (1).

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