A semiconductor radiator with water cooling function
By designing the combined structure of the outer cold head assembly and the inner cold head assembly in the semiconductor radiator, the combination of the flow tank, guide tank and extrusion components is used to solve the problems of water droplet condensation and impurity accumulation, and achieve more efficient heat dissipation and longer service life.
Patent Information
- Application Number
- CN202411759138.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-03
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2044-12-03
AI Technical Summary
During operation, existing semiconductor radiators are prone to water droplets condensation into electrical appliances, resulting in damage; at the same time, the accumulation of impurities in the cold head leads to blockage of the waterway, reducing the heat dissipation effect.
A semiconductor radiator with water cooling function is designed, using a structure that combines the outer cooling head assembly and the inner cooling head assembly. Through the design of the flow tank and the guide tank, the extrusion components driven by gravity and fan are used to ensure the smooth discharge of condensate water. ; At the same time, the annular waterway and cleaning brush structure in the inner cooling head assembly can effectively clean up impurities in the coolant.
It effectively avoids damage caused by the entry of water droplets into the electrical appliances, ensuring the normal operation of the radiator; at the same time, through the function of the cleaning brush, the waterway is blocked and the heat dissipation effect is improved.
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Figure CN119233614B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of heat dissipation, and in particular to a semiconductor heat sink with a water cooling function. Background Art
[0002] The radiator is a device used to reduce the heat generated by the machine when it is running, so as to dissipate heat and cool the machine to increase the life of the machine. It is a layer of good heat-conducting medium attached to the heat-generating device, so the quality of the radiator directly affects the life of the running machine.
[0003] The existing publication number is: CN207231273U, a semiconductor-based water pipe radiator, including a base, a side wall, a mounting groove, a connecting rod, a heat dissipation elbow, a through hole, a fan and a buckle. The beneficial effects of this patent document are: the mounting grooves on the same side of the side wall are opened at different heights, so that the heat dissipation elbow is installed at different heights, which increases the heat dissipation space. The heat dissipation elbow is made of semiconductor material and has a good heat conduction effect, which improves the heat dissipation rate. The heat dissipation elbow is an S-shaped water pipe, which increases the heat dissipation area of the heat dissipation elbow and can dissipate heat well. The through hole transmits the hot air gathered by the fan to the top of the base, which can centrally dissipate the heat generated by the heat generating element. The buckle connects the radiator to the heat generating element through a buckle, which is easy to install on various heat generating elements and has good practicality.
[0004] The existing semiconductor radiators mainly have the following problems
[0005] 1. When the existing radiator is working, water droplets will condense on the surface where the radiator contacts the electrical appliance, causing the water droplets to enter the electrical appliance and damage the electrical appliance;
[0006] 2. After a traditional radiator has been used for too long, impurities will appear in the cold head of the radiator, causing the water channels in the cold head to be blocked, thereby reducing the heat dissipation effect. Summary of the invention
[0007] The object of the present invention is to provide a semiconductor heat sink with water cooling function to solve the problems raised in the above background technology.
[0008] In order to achieve the above-mentioned invention object, the present invention adopts the following technical scheme:
[0009] Provided is a semiconductor radiator with a water cooling function, comprising a shell, a water cooling component and a condensed water treatment mechanism are fixedly connected to the inner cavity of the shell, a fan is fixedly connected to the shell, and the fan is fixedly connected to one end of a crankshaft;
[0010] The condensate treatment mechanism comprises:
[0011] An external cold head assembly, the external cold head assembly is fixedly connected to the outer shell, the external cold head assembly is fixedly connected to the cooling side of the semiconductor refrigeration plate, and the heat generating side of the semiconductor refrigeration plate is fixedly connected to the internal cold head assembly; wherein
[0012] The external cold head assembly includes:
[0013] A first external cold head, one side of the first external cold head is fixedly connected to a side of a semiconductor refrigeration plate for cooling, the other side of the first external cold head is fixedly connected to a side of a second external cold head, a water flow groove 1 inclined downward and inward is provided at the lower end of the side of the first external cold head fixedly connected to the second external cold head, a condensate outlet is provided at a position corresponding to the water flow groove 1 on the other side of the first external cold head, the condensate outlet is fixedly connected to one end of a hose, the other end of the hose is fixedly connected to a first extrusion assembly, and a second extrusion assembly is also fixedly connected to the inner cavity of the shell; wherein
[0014] The second external cooling head is provided with a plurality of guide grooves, and a water flow groove 2 is provided at the lower end of the guide groove, which is inclined downward and inward, and the water flow groove 2 corresponds to the outer side position of the water flow groove 1; and
[0015] The inner cold head assembly comprises:
[0016] An inner cold head body, one side of the inner cold head body is fixedly connected to the side of the semiconductor refrigeration plate that generates heat, the other side of the inner cold head body is fixedly connected to an annular water channel, the inner cold head body is fixedly connected to a protective shell, a cleaning brush is rotatably connected to the protective shell, push plates are fixedly connected to both ends of the cleaning brush, and a coolant inlet is opened on the outer side of the protective shell.
[0017] Furthermore, an air inlet groove is provided on the upper end of the second outer cold head on the side fixedly connected to the first outer cold head, a first air inlet port is provided on the upper end of the air inlet groove, a plurality of second air inlets are provided on the lower end of the air inlet groove, the plurality of second air inlets lead to the upper end of the guide groove, and a hose opening is provided on the upper end of the first outer cold head; and
[0018] The first extrusion assembly comprises:
[0019] An active rod, one end of which is rotatably connected to the other end of the crankshaft, the other end of which is rotatably connected to a right-angle driven rod, the right-angle driven rod is fixedly connected to one end of a first extrusion rod, the other end of the first extrusion rod is fixedly connected to a piston 1, a condensate drainage box is fixedly connected inside the shell, the piston 1 is slidably connected inside the condensate drainage box, one side of the condensate drainage box is fixedly connected to one end of a one-way valve 1, the other end of the one-way valve 1 is fixedly connected to one end of a hose, the other end of the hose is fixedly connected to a condensate outlet, the lower end of the condensate drainage box is fixedly connected to one end of a second one-way valve, the other end of the second one-way valve is fixedly connected to one end of the hose, and the other end of the hose leads to the outside of the shell; and
[0020] The second extrusion assembly comprises:
[0021] a second extrusion rod, one end of the second extrusion rod is fixedly connected to the right-angle driven rod, the other end of the second extrusion rod is fixedly connected to a second piston, an extrusion barrel is fixedly connected to the shell, the second piston is slidably connected to the extrusion barrel, an air outlet is opened at the lower end of the extrusion barrel, one end of a hose is fixedly connected to the air outlet, the hose passes through the hose opening, and the other end of the hose is fixedly connected to the first air inlet; and
[0022] The water cooling assembly comprises:
[0023] A radiator, the radiator is fixedly connected in the inner cavity of the shell, a water cooling box is also fixedly connected in the inner cavity of the shell, one end of the radiator is fixedly connected to one end of a hose, the other end of the hose is fixedly connected to the lower end of the water cooling box, the other end of the radiator is fixedly connected to one end of another hose, the other end of the hose is fixedly connected to the coolant inlet, a piston three is slidably connected in the water cooling box, the upper end of the piston three is fixedly connected to one end of a third extrusion rod, the other end of the third extrusion rod is fixedly connected to a right-angle follower rod.
[0024] Compared with the prior art, one or more of the above technical solutions have the following beneficial effects:
[0025] 1. The electrical appliance is fixed on the outside of the second outer cold head. When the electrical appliance needs to be cooled, the device is working, and condensed water will appear on the outside of the second outer cold head. It will flow downward along the guide groove under the action of gravity. The fan drives the crankshaft to rotate, thereby making the second extrusion assembly work, blowing downward the small water droplets in the guide groove that are not easy to flow down, so that the small water droplets gather and are more likely to roll down to the second water flow groove. Since the second water flow groove is inclined downward inward and corresponds to the position of the water flow groove, under the action of gravity, the water droplets roll along the second water flow groove and the first water flow groove to the condensed water outlet, and then pass through the hose into the first extrusion assembly. The fan drives the crankshaft to rotate, thereby driving the first extrusion assembly to work, and squeezing the condensed water in the first extrusion assembly to the outside of the device, so as to avoid damage to the electrical appliance caused by water droplets entering the electrical appliance.
[0026] 2. When the device is working, the coolant enters the annular water channel from the coolant inlet to cool down the high temperature side of the inner side of the semiconductor refrigeration plate. During this process, the coolant impacts the push plate, which drives the cleaning brush to rotate on the protective shell to clean the annular water channel to avoid accumulation of impurities in the annular water channel causing blockage and affecting the cooling effect.
[0027] 3. The right-angle follower rod drives the third extrusion rod and piston three to move up and down. When piston three moves downward, the coolant in the water cooling box enters the radiator through the hose and then enters the annular water channel from the coolant inlet. When the piston moves upward, under the action of negative pressure, the coolant enters the radiator from the water channel through the hose, and then flows back from the radiator to the water cooling box. By cooling the side with high temperature of the semiconductor refrigeration plate, the state of the semiconductor refrigeration plate is more stable and the cooling effect is better. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] The accompanying drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.
[0029] In addition, the terms "installed", "set", "provided with", "connected", "connected", and "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0030] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention;
[0031] Figure 2 It is a schematic diagram of the overall three-dimensional structure of the present invention;
[0032] Figure 3 It is a schematic diagram of the overall three-dimensional structure of the external cold head assembly of the present invention;
[0033] Figure 4 It is a right view of the overall three-dimensional structure of the first external cold head of the present invention;
[0034] Figure 5 It is a left view of the overall three-dimensional structure of the first external cold head of the present invention;
[0035] Figure 6 It is a schematic diagram of the overall three-dimensional structure of the second external cold head of the present invention;
[0036] Figure 7 It is a schematic diagram of the overall three-dimensional structure of the internal cold head assembly of the present invention;
[0037] Figure 8 It is a schematic diagram of the overall three-dimensional structure of the first extrusion assembly of the present invention;
[0038] Fig. 9 It is a schematic diagram of the overall three-dimensional structure of the second extrusion assembly of the present invention;
[0039] Fig.10 It is a schematic diagram of the overall three-dimensional structure of the water cooling box of the present invention;
[0040] Fig.11 It is a front view of the overall three-dimensional structure of the first extrusion assembly of the present invention;
[0041] In the accompanying drawings, the components represented by the reference numerals are listed as follows:
[0042] 1. Casing; 11. Fan; 12. Crankshaft;
[0043] 2. Water cooling assembly; 21. Radiator; 22. Water cooling box; 23. Piston three; 24. Third extrusion rod;
[0044] 3. Condensate treatment mechanism; 31. External cold head assembly; 311. First external cold head; 3111. Water flow groove 1; 3112. Condensate outlet; 3113. Hose opening; 312. Second external cold head; 3121. Guide groove; 3122. Water flow groove 2; 3123. Air inlet groove; 3124. First air inlet; 3125. Second air inlet; 32. Semiconductor cooling sheet; 33. Internal cold head assembly; 331. Internal cold head body; 332. Protection Shell; 3321, coolant inlet; 333, cleaning brush; 334, push plate; 3311, annular water channel; 34, first extrusion assembly; 341, active rod; 342, right-angle driven rod; 343, first extrusion rod; 344, piston one; 345, condensate drain box; 346, one-way valve one; 347, one-way valve two; 35, second extrusion assembly; 351, second extrusion rod; 352, piston two; 353, extrusion barrel; 354, air outlet. DETAILED DESCRIPTION
[0045] In order to enable those skilled in the art to better understand the solution of the present application, the following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application.
[0046] Reference Figure 1-6 As shown, a semiconductor heat sink with water cooling function comprises a shell 1, a water cooling component 2 and a condensed water treatment mechanism 3 are fixedly connected to the inner cavity of the shell 1, a fan 11 is fixedly connected to the shell 1, and the fan 11 is fixedly connected to one end of a crankshaft 12; wherein
[0047] The condensate treatment mechanism 3 includes:
[0048] An external cold head assembly 31, wherein the external cold head assembly 31 is fixedly connected to the housing 1, the external cold head assembly 31 is fixedly connected to a cooling side of a semiconductor cooling sheet 32, and the heat generating side of the semiconductor cooling sheet 32 is fixedly connected to an internal cold head assembly 33; and
[0049] The external cold head assembly 31 includes:
[0050] A first external cold head 311, one side of the first external cold head 311 is fixedly connected to a side of the semiconductor refrigeration plate 32 for cooling, and the other side of the first external cold head 311 is fixedly connected to a side of the second external cold head 312, a water flow groove 3111 inclined downward and inward is provided at the lower end of the side of the first external cold head 311 that is fixedly connected to the second external cold head 312, a condensate outlet 3112 is provided at a position corresponding to the water flow groove 3111 on the other side of the first external cold head 311, the condensate outlet 3112 is fixedly connected to one end of the hose, and the other end of the hose is fixedly connected to the first extrusion assembly 34, and a second extrusion assembly 35 is also fixedly connected to the inner cavity of the shell 1; wherein
[0051] The second outer cold head 312 is provided with a plurality of guide grooves 3121, and a second water flow groove 3122 inclined downward inward is provided at the lower end of the guide groove 3121, and the second water flow groove 3122 corresponds to the outer side position of the first water flow groove 3111; and
[0052] Reference Figure 7 As shown, the inner cold head assembly 33 includes:
[0053] An inner cold head body 331, one side of the inner cold head body 331 is fixedly connected to the side of the semiconductor refrigeration plate 32 that generates heat, the other side of the inner cold head body 331 is fixedly connected to an annular water channel 3311, a protective shell 332 is fixedly connected to the inner cold head body 331, a cleaning brush 333 is rotatably connected to the protective shell 332, push plates 334 are fixedly connected to both ends of the cleaning brush 333, and a coolant inlet 3321 is opened on the outer side of the protective shell 332; and
[0054] An air inlet groove 3123 is provided at the upper end of the second outer cold head 312 fixedly connected to the first outer cold head 311, a first air inlet port 3124 is provided at the upper end of the air inlet groove 3123, a plurality of second air inlets 3125 are provided at the lower end of the air inlet groove 3123, and the plurality of second air inlets 3125 lead to the upper end of the guide groove 3121, and a hose through hole 3113 is provided at the upper end of the first outer cold head 311; and
[0055] Reference Figure 8 and 11As shown, the first extrusion assembly 34 includes: an active rod 341, one end of the active rod 341 is rotatably connected to the other end of the crankshaft 12, the other end of the active rod 341 is rotatably connected to the right-angle driven rod 342, the right-angle driven rod 342 is fixedly connected to one end of the first extrusion rod 343, the other end of the first extrusion rod 343 is fixedly connected to a piston 1 344, a condensate drainage box 345 is fixedly connected in the shell 1, the piston 1 344 is slidably connected in the condensate drainage box 345, one side of the condensate drainage box 345 is fixedly connected to one end of a one-way valve 1 346, the other end of the one-way valve 1 346 is fixedly connected to one end of a hose, the other end of the hose is fixedly connected to a condensate outlet 3112, the lower end of the condensate drainage box 345 is fixedly connected to one end of a one-way valve 2 347, the other end of the one-way valve 2 347 is fixedly connected to one end of the hose, and the other end of the hose leads to the outside of the shell 1;
[0056] Reference Fig. 9 As shown, the second extrusion assembly 35 includes:
[0057] A second extrusion rod 351, one end of which is fixedly connected to the right-angle driven rod 342, the other end of which is fixedly connected to a second piston 352, a squeezing barrel 353 is fixedly connected to the housing 1, the second piston 352 is slidably connected to the squeezing barrel 353, an air outlet 354 is provided at the lower end of the squeezing barrel 353, one end of a hose is fixedly connected to the air outlet 354, the hose passes through the hose opening 3113, and the other end of the hose is fixedly connected to the first air inlet 3124; and
[0058] Reference Fig.10 As shown, the water cooling component 2 includes:
[0059] The radiator 21 is fixedly connected in the inner cavity of the shell 1, and a water cooling box 22 is also fixedly connected in the inner cavity of the shell 1, one end of the radiator 21 is fixedly connected to one end of a hose, and the other end of the hose is fixedly connected to the lower end of the water cooling box 22, the other end of the radiator 21 is fixedly connected to one end of another hose, and the other end of the hose is fixedly connected to the coolant inlet 3321, and a piston three 23 is slidably connected in the water cooling box 22, the upper end of the piston three 23 is fixedly connected to one end of the third extrusion rod 24, and the other end of the third extrusion rod 24 is fixedly connected to the right-angle driven rod 342.
[0060] The electrical appliance is fixed on the outside of the second outer cold head 312. When the electrical appliance needs to be cooled, the device is working, and condensed water will appear on the outside of the second outer cold head 312. Under the action of gravity, it flows downward along the guide groove 3121. The fan 11 drives the crankshaft 12 to rotate, thereby making the second extrusion assembly 35 work, blowing downward the small water droplets in the guide groove 3121 that are not easy to flow down, so that the small water droplets gather and are more likely to roll down to the second water flow groove 3122. Since the second water flow groove 3122 is inclined downward inward and corresponds to the position of the water flow groove, under the action of gravity, the water droplets roll down along the second water flow groove 3122 and the first water flow groove 3111 to the condensed water outlet 3112, and then pass through the hose into the first extrusion assembly 34. The fan 11 drives the crankshaft 12 to rotate, thereby driving the first extrusion assembly 34 to work, and the condensed water in the first extrusion assembly 34 is squeezed out to the outside of the device.
[0061] When the device is working, the coolant enters the annular water channel 3311 from the coolant inlet 3321 to cool down the side of the semiconductor cooling plate 32 with a high temperature. In this process, the coolant impacts the push plate 334, thereby driving the cleaning brush 333 to rotate on the protective shell 332 to clean the annular water channel 3311.
[0062] The gas enters the first air inlet 3124 through the hose, enters the air inlet groove 3123 through the first air inlet 3124, and is blown out from the second air inlet 3125, blowing the small water droplets that are not easy to roll down to the bottom of the guide groove 3121. Under the action of gravity, the water droplets roll from the second water flow groove 3122 to the first water flow groove 3111, and then flow into the first extrusion assembly 34 from the condensed water outlet 3112;
[0063] Since one end of the active rod 341 is rotationally connected to the crankshaft 12, and the other end of the active rod 341 is rotationally connected to the right-angle driven rod 342, the piston 1 344 is slidably connected in the condensate drainage box 345, when the crankshaft 12 rotates, the right-angle driven rod 342, the first extrusion rod 343 and the piston 1 344 are driven to move up and down through the active rod 341. When the piston 1 344 moves upward, the one-way valve 1 346 opens and the one-way valve 2 347 closes. At this time, the condensate enters the condensate drainage box 345. When the piston 1 344 moves downward, the one-way valve 1 346 closes and the one-way valve 2 347 opens. At this time, the condensate is discharged out of the device under the extrusion of the piston.
[0064] When the right-angle follower rod 342 moves up and down, since the second extrusion rod 351 is fixedly connected to the right-angle follower rod 342, and the second piston 352 is slidably connected in the extrusion barrel 353, the second extrusion rod 351 and the second piston 352 are driven to move up and down by the right-angle follower rod 342. When the second piston 352 moves downward, the gas in the extrusion barrel 353 enters the hose from the gas outlet 354, and then enters the first gas inlet 3124 through the hose.
[0065] The third extrusion rod 24 and the piston three 23 are driven to move up and down by the right-angle follower rod 342. When the piston three 23 moves downward, the coolant in the water cooling box 22 enters the radiator 21 through the hose and then enters the annular water channel 3311 from the coolant inlet 3321. When the piston moves upward, under the action of negative pressure, the coolant enters the radiator 21 from the water channel through the hose and then flows back from the radiator 21 to the water cooling box 22.
[0066] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a mechanical connection or an electrical connection, or it can be the internal communication of two elements, it can be a direct connection, or it can be an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.
[0067] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A semiconductor radiator with water cooling function, characterized in that: It comprises a shell (1), a water cooling assembly (2) and a condensed water treatment mechanism (3) are fixedly connected to the inner cavity of the shell (1), a fan (11) is fixedly connected to the shell (1), and the fan (11) is fixedly connected to one end of a crankshaft (12); wherein The condensate treatment mechanism (3) comprises: An external cold head assembly (31), the external cold head assembly (31) being fixedly connected to the outer shell (1), the external cold head assembly (31) being fixedly connected to a cooling side of a semiconductor cooling sheet (32), and the heat generating side of the semiconductor cooling sheet (32) being fixedly connected to an internal cold head assembly (33); and The external cold head assembly (31) comprises: A first external cold head (311), one side of the first external cold head (311) is fixedly connected to a cooling side of a semiconductor refrigeration plate (32), the other side of the first external cold head (311) is fixedly connected to a side of a second external cold head (312), a water flow groove (3111) inclined inwardly and downwardly is provided at the lower end of the side of the first external cold head (311) that is fixedly connected to the second external cold head (312), a condensate outlet (3112) is provided at a position corresponding to the water flow groove (3111) on the other side of the first external cold head (311), the condensate outlet (3112) is fixedly connected to one end of a hose, the other end of the hose is fixedly connected to a first extrusion assembly (34), and a second extrusion assembly (35) is also fixedly connected to the inner cavity of the shell (1); wherein The second outer cold head (312) is provided with a plurality of guide grooves (3121), the lower end of the guide groove (3121) is provided with a second water flow groove (3122) inclined inwardly and downwardly, and the second water flow groove (3122) corresponds to the outer side position of the first water flow groove (3111); and The inner cold head assembly (33) comprises: An inner cold head body (331), one side of the inner cold head body (331) is fixedly connected to a side of a semiconductor cooling plate (32) that generates heat, the other side of the inner cold head body (331) is fixedly connected to an annular water channel (3311), a protective shell (332) is fixedly connected to the inner cold head body (331), a cleaning brush (333) is rotatably connected to the protective shell (332), push plates (334) are fixedly connected to both ends of the cleaning brush (333), and a cooling liquid inlet (3321) is provided on the outer side of the protective shell (332); and An air inlet groove (3123) is provided at the upper end of the second external cold head (312) on the side fixedly connected to the first external cold head (311), a first air inlet port (3124) is provided at the upper end of the air inlet groove (3123), a plurality of second air inlets (3125) are provided at the lower end of the air inlet groove (3123), the plurality of second air inlets (3125) lead to the upper end of the guide groove (3121), and a hose through hole (3113) is provided at the upper end of the first external cold head (311); and The first extrusion component (34) comprises: An active rod (341), one end of the active rod (341) being rotatably connected to the other end of the crankshaft (12), the other end of the active rod (341) being rotatably connected to a right-angle driven rod (342), the right-angle driven rod (342) being fixedly connected to one end of a first extrusion rod (343), the other end of the first extrusion rod (343) being fixedly connected to a piston 1 (344), a condensate drain box (345) being fixedly connected to the housing (1), and the piston 1 (344) being slidably connected to the condensate drain box. Inside the water tank (345), one side of the condensate water drainage tank (345) is fixedly connected to one end of a first one-way valve (346), the other end of the first one-way valve (346) is fixedly connected to one end of a hose, the other end of the hose is fixedly connected to a condensate water outlet (3112), the lower end of the condensate water drainage tank (345) is fixedly connected to one end of a second one-way valve (347), the other end of the second one-way valve (347) is fixedly connected to one end of the hose, and the other end of the hose leads to the outside of the housing (1); and The second extrusion assembly (35) comprises: a second extrusion rod (351), one end of the second extrusion rod (351) being fixedly connected to the right-angle driven rod (342), the other end of the second extrusion rod (351) being fixedly connected to a second piston (352), a squeezing barrel (353) being fixedly connected inside the housing (1), the second piston (352) being slidably connected inside the squeezing barrel (353), an air outlet (354) being provided at the lower end of the squeezing barrel (353), one end of a hose being fixedly connected to the air outlet (354), the hose passing through the hose through-hole (3113), and the other end of the hose being fixedly connected to the first air inlet (3124); and The water cooling component (2) comprises: A radiator (21), the radiator (21) being fixedly connected to the inner cavity of the outer shell (1), a water cooling box (22) being also fixedly connected to the inner cavity of the outer shell (1), one end of the radiator (21) being fixedly connected to one end of a hose, the other end of the hose being fixedly connected to the lower end of the water cooling box (22), the other end of the radiator (21) being fixedly connected to one end of another hose, the other end of the hose being fixedly connected to a coolant inlet (3321), a piston three (23) being slidably connected in the water cooling box (22), the upper end of the piston three (23) being fixedly connected to one end of a third extrusion rod (24), the other end of the third extrusion rod (24) being fixedly connected to a right-angle driven rod (342).
Citation Information
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CN207231273U
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