Universal common-mode testing machine for PCB (Printed Circuit Board)

Abstract

The invention relates to the technical field of automation equipment, in particular to a PCB universal common-mode testing machine which comprises a testing machine body, and the testing machine body comprises a feeding mechanism, a first material moving mechanism, a testing mechanism, a second material moving mechanism, a rotating moving mechanism, a marking mechanism and a rack. The feeding mechanism, the first material moving mechanism, the testing mechanism, the second material moving mechanism, the rotary moving mechanism and the marking mechanism are connected to the rack. The feeding mechanism is arranged on one side of the second material moving mechanism. The first material moving mechanism is arranged above the second material moving mechanism; the testing mechanism is arranged in front of the second material moving mechanism; the second material moving mechanism is arranged on one side of the rotary moving mechanism; the marking mechanism is arranged on one side of the rotating and moving mechanism. The invention aims to provide the PCB universal common-mode test machine which replaces manual detection and improves the efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of automation equipment, and in particular to a universal common mode tester for PCB. Background Art

[0002] As China's aging population intensifies and the labor force continues to decrease, automation equipment is the inevitable choice for enterprises to reduce labor costs. Automation is a high-tech company specializing in the research, development, production and sales of intelligent automatic control, digitalization, networked controllers and sensors. Its numerous functional modules and perfect embedded solutions can meet the personalized needs of many users to the greatest extent. The company's products have a variety of series of products to meet customer needs. Automation equipment is composed of a combination of vibration plates.

[0003] After the circuit board production process, it needs to be tested. Traditional testing is done through manual testing, which is labor-intensive, high cost for the enterprise, and low sales. Summary of the invention

[0004] Based on this, the object of the present invention is to provide a universal common mode tester for PCB that can replace manual detection and improve efficiency.

[0005] The present invention adopts the following technical solution:

[0006] A universal common mode tester for PCB comprises a tester body, wherein the tester body comprises a feeding mechanism, a first material moving mechanism, a testing mechanism, a second material moving mechanism, a rotating and moving mechanism, a marking mechanism and a frame; the feeding mechanism, the first material moving mechanism, the testing mechanism, the second material moving mechanism, the rotating and moving mechanism and the marking mechanism are respectively connected to the frame; the feeding mechanism is arranged at one side of the second material moving mechanism; the first material moving mechanism is arranged above the second material moving mechanism; the testing mechanism is arranged in front of the second material moving mechanism; the second material moving mechanism is arranged at one side of the rotating and moving mechanism; the marking mechanism is arranged at one side of the rotating and moving mechanism.

[0007] A further improvement to the above technical solution is that the loading mechanism includes a loading pallet, a loading lifting assembly and a loading fixing assembly, the loading pallet is connected to the loading lifting assembly, and the loading pallet is used to lift the PCB panel or the tray with PCB single boards; the loading lifting assembly is used to drive the loading pallet to rise and fall; the loading fixing assembly is arranged on the outside of the loading pallet, and the loading fixing assembly includes a fixed outer plate, and a plurality of loading positioning cylinders connected to the top of the fixed outer plate, and a loading slot for the loading pallet to pass through is opened in the center of the fixed outer plate.

[0008] A further improvement to the above technical solution is that the first material moving mechanism includes a plurality of material picking components and a material picking X-axis transmission module, and the plurality of material picking components are movably connected to the material picking X-axis transmission module;

[0009] The material picking assembly includes a grabbing and lifting cylinder, a grabbing frame and a number of grabbing elements. The output end of the grabbing and lifting cylinder is connected to the grabbing frame, and the bottom of the grabbing frame is connected to the several grabbing elements. The grabbing elements are used to grab and move PCB panels or trays with PCB boards from a loading mechanism; the material picking X-axis transmission module is used to drive the translation of several material picking assemblies.

[0010] A further improvement to the above technical solution is that the test mechanism includes a test bracket, a material pressing assembly connected to the test bracket, an upper test assembly arranged on one side of the material pressing assembly, a lower test assembly arranged below the upper test assembly, and a common mode tester electrically connected to the upper test assembly and the lower test assembly respectively;

[0011] The pressing assembly includes a first pressing cylinder, a second pressing cylinder connected to the bottom of the first pressing cylinder, and a pressing soft glue connected to the second pressing cylinder; the first pressing cylinder is connected to an upper barcode scanning gun;

[0012] The upper test assembly includes an upper test cylinder and an upper test probe connected to the upper test cylinder;

[0013] The lower test assembly includes a lower test cylinder, a test circuit board connected to the lower test cylinder, a lower test probe connected to the test circuit board, and a test magnetic core arranged on one side of the lower test probe, wherein the test magnetic core is arranged correspondingly below the pressing soft glue; a lower barcode scanning gun is arranged on one side of the lower test assembly;

[0014] The common mode tester is connected to the inside of the rack.

[0015] A further improvement to the above technical solution is that the second material shifting mechanism includes a material shifting pallet, a material shifting Z-axis transmission module connected to the material shifting pallet, a material shifting X-axis transmission module connected to the material shifting Z-axis transmission module, and a material shifting Y-axis transmission module connected to the material shifting X-axis transmission module; the material shifting pallet is used to store PCB panels or trays with PCB single boards, and the material shifting pallet is connected to a number of material shifting positioning cylinders.

[0016] A further improvement to the above technical solution is that the rotating and moving mechanism includes a mobile transmission module, a rotating cylinder movably connected to the mobile transmission module, and a rotating platform connected to the top of the rotating cylinder. The rotating platform is correspondingly arranged below the marking mechanism, and the rotating platform is used to store PCB panels or trays with PCB boards.

[0017] A further improvement to the above technical solution is that the marking mechanism includes a laser marking machine and a marking lifting component connected to the laser marking machine, and the marking lifting component is used to drive the laser marking machine to rise and fall.

[0018] A further improvement to the above technical solution is that the testing machine body also includes a good product storage mechanism and a bad product storage mechanism, the good product storage mechanism is arranged on one side of the rotating and moving mechanism, and the bad product storage mechanism is arranged on one side of the good product storage mechanism.

[0019] A further improvement to the above technical solution is that the good product storage mechanism includes a good product baffle, a good product pallet, a good product lifting assembly and a good product full material sensor, the good product baffle is arranged around the outside of the good product pallet, the good product pallet is connected to the good product lifting assembly, the good product lifting assembly is used to drive the good product pallet to rise and fall, and the good product full material sensor is installed above the good product baffle.

[0020] A further improvement to the above technical solution is that the defective material storage mechanism includes a defective baffle, a defective pallet, a defective lifting assembly and a defective material full sensor, the defective baffle is arranged around the outside of the defective pallet, the defective pallet is connected to the defective lifting assembly, the defective lifting assembly is used to drive the defective pallet to rise and fall, and the defective material full sensor is installed above the defective baffle.

[0021] The beneficial effects of the present invention are:

[0022] The present invention is provided with a feeding mechanism, a first feeding mechanism, a testing mechanism, a second feeding mechanism, a rotating and moving mechanism, and a marking mechanism. The feeding mechanism is used for feeding PCB boards. The first feeding mechanism is used for grabbing the PCB board from the feeding mechanism and moving it to the second moving mechanism. The second moving mechanism moves the PCB board to the testing mechanism for common mode testing. After the test is completed, the first feeding mechanism moves the PCB board to the rotating and moving mechanism. The rotating and moving mechanism moves the PCB board to the marking mechanism. After the marking is completed, the good products and the bad products are screened out. The first feeding mechanism then moves the good products and the bad products to the good product storage mechanism and the bad product storage mechanism respectively, so as to replace manual testing. The equipment has high detection efficiency and low labor intensity, and can greatly reduce the production cost of the enterprise. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of a universal common mode tester for PCB of the present invention;

[0024] Figure 2 for Figure 1 Top view of the PCB universal common mode tester;

[0025] Figure 3 for Figure 1A structural diagram of a feeding mechanism of a PCB universal common mode test machine;

[0026] Figure 4 for Figure 1 The schematic diagram of the structure of the PCB single board and tray of the PCB universal common mode tester;

[0027] Figure 5 for Figure 1 A structural schematic diagram of a first material moving mechanism of a PCB universal common mode testing machine;

[0028] Figure 6 for Figure 1 A structural schematic diagram of a testing mechanism and a second material transfer mechanism of a PCB universal common mode testing machine;

[0029] Figure 7 for Figure 6 A schematic diagram of the structure of the test mechanism of the PCB universal common mode tester;

[0030] Figure 8 for Figure 7 A partial enlarged view of circle A of the test mechanism;

[0031] Fig. 9 for Figure 6 A structural schematic diagram of a second material transfer mechanism of a PCB universal common mode test machine;

[0032] Fig.10 for Figure 1 The structural diagram of the rotating and moving mechanism and the marking mechanism of the PCB universal common mode test machine;

[0033] Fig.11 for Figure 1 Schematic diagram of the structure of the good product storage mechanism and the bad product storage mechanism of the PCB universal common mode test machine.

[0034] The numbers in the figure are:

[0035] 10. Test machine body; 11. Rack; 12. PCB panel; 13. PCB single board; 14. Tray;

[0036] 20. Feeding mechanism; 21. Feeding support plate; 22. Feeding lifting assembly; 23. Feeding fixing assembly; 24. Fixed outer plate; 25. Feeding positioning cylinder; 26. Feeding slot;

[0037] 30. First material moving mechanism; 31. Material picking assembly; 311. Grasping lifting cylinder; 312. Grasping frame; 313. Grasping element; 32. Material picking X-axis transmission module; 33. Air pressure monitoring meter;

[0038] 40. Test mechanism; 41. Test bracket; 42. Pressing assembly; 421. First pressing cylinder; 422. Second pressing cylinder; 423. Pressing soft glue; 43. Upper test assembly; 431. Upper test cylinder; 44. Lower test assembly; 441. Lower test cylinder; 442. Test circuit board; 443. Lower test probe; 444. Test core; 45. Common mode tester; 46. Upper barcode scanner; 47. Lower barcode scanner;

[0039] 50. Second material transfer mechanism; 51. Material transfer support plate; 52. Material transfer Z-axis transmission module; 53. Material transfer X-axis transmission module; 54. Material transfer Y-axis transmission module; 55. Material transfer positioning cylinder;

[0040] 60. Rotating moving mechanism; 61. Moving transmission module; 62. Rotating cylinder; 63. Rotating platform;

[0041] 70. Marking mechanism; 71. Laser marking machine; 72. Marking lifting assembly;

[0042] 80. Good product storage mechanism; 81. Good product baffle; 82. Good product support plate; 83. Good product lifting assembly; 84. Good product full material sensor;

[0043] 90. Defective material storage mechanism; 91. Defective baffle; 92. Defective pallet; 93. Defective lifting assembly; 94. Defective full material sensor. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] In the description of the present invention, it should be noted that the terms "vertical direction", "up", "down", "horizontal", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, "first", "second", "third", and "fourth" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0046] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] like Figures 1 to 10 As shown, an embodiment of the present invention relates to a universal common mode tester for PCB, including a tester body 10, wherein the tester body 10 includes a loading mechanism 20, a first material moving mechanism 30, a testing mechanism 40, a second material moving mechanism 50, a rotating and moving mechanism 60, a marking mechanism 70 and a frame 11; the loading mechanism 20, the first material moving mechanism 30, the testing mechanism 40, the second material moving mechanism 50, the rotating and moving mechanism 60, and the marking mechanism 70 are respectively connected to the frame 11; the loading mechanism 20 is arranged on one side of the second material moving mechanism 50; the first material moving mechanism 30 is arranged above the second material moving mechanism 50; the testing mechanism 40 is arranged in front of the second material moving mechanism 50; the second material moving mechanism 50 is arranged on one side of the rotating and moving mechanism 60; and the marking mechanism 70 is arranged on one side of the rotating and moving mechanism 60.

[0048] Furthermore, if Figure 3 As shown, the loading mechanism 20 includes a loading pallet 21, a loading lifting assembly 22 and a loading fixing assembly 23. The loading pallet 21 is connected to the loading lifting assembly 22, and the loading pallet 21 is used to lift the PCB panel 12 or the tray 14 with the PCB single board 13; the loading lifting assembly 22 is used to drive the loading pallet 21 to rise and fall; the loading fixing assembly 23 is arranged on the outside of the loading pallet 21, and the loading fixing assembly 23 includes a fixed outer plate 24, and a plurality of loading positioning cylinders 25 connected to the top of the fixed outer plate 24, and a loading slot 26 for the loading pallet 21 to pass through is opened in the center of the fixed outer plate 24. Specifically, the loading lifting component 22 adopts the existing lifting device to drive the loading pallet 21 to rise and fall, so that the first material moving mechanism 30 can grab the PCB panel 12 or the tray 14 with the PCB single board 13. At the same time, a loading fixing component 23 is set, and the PCB panel 12 or the tray 14 with the PCB single board 13 is fixed by a plurality of loading positioning cylinders 25 so that the first material moving mechanism 30 can grab it, thereby improving the grabbing accuracy. At the same time, the fixing position can also be adjusted according to the size of the product. It has a wide range of applications and strong practicality.

[0049] Furthermore, if Figure 5As shown, the first material moving mechanism 30 includes a plurality of material picking components 31 and a material picking X-axis transmission module 32, wherein the plurality of material picking components 31 are movably connected to the material picking X-axis transmission module 32; specifically, the material picking component 31 grabs the product and moves it to a set position through the material picking X-axis transmission module 32, and the degree of automation is high;

[0050] The material picking component 31 includes a grabbing and lifting cylinder 311, a grabbing frame 312 and a plurality of grabbing elements 313. The output end of the grabbing and lifting cylinder 311 is connected to the grabbing frame 312, and the bottom of the grabbing frame 312 is connected to the plurality of grabbing elements 313. The grabbing elements 313 are used to grab and move the PCB panels 12 or the tray 14 with the PCB single board 13 from the loading mechanism 20; the material picking X-axis transmission module 32 is used to drive the plurality of material picking components 31 to translate. Specifically, the number of grabbing elements 313 is set to be multiple, and is set to be a vacuum suction cup, and the number of grabbing elements 313 is expanded according to the product size; the grabbing and lifting cylinder 311 is set to adjust the height position of the grabbing element 313 according to the working height; and an air pressure monitoring meter 33 connected to the material picking component 31 is also provided to monitor whether the grabbing element 313 is leaking, and to alarm when the air pressure is insufficient.

[0051] Furthermore, if Figures 6 to 8 As shown, the testing mechanism 40 includes a testing bracket 41, a pressing component 42 connected to the testing bracket 41, an upper testing component 43 arranged on one side of the pressing component 42, a lower testing component 44 arranged below the upper testing component 43, and a common mode tester 45 electrically connected to the upper testing component 43 and the lower testing component 44 respectively; the pressing component 42 includes a first pressing cylinder 421, a second pressing cylinder 422 connected below the first pressing cylinder 421, and a pressing soft glue 423 connected to the second pressing cylinder 422; the first pressing cylinder 421 is connected to an upper barcode scanning gun 46; the upper testing component 43 includes an upper testing cylinder 431, a second pressing cylinder 422 connected below the first pressing cylinder 421, and a pressing soft glue 423 connected to the second pressing cylinder 422; the first pressing cylinder 421 is connected to an upper barcode scanning gun 46; the upper testing component 43 includes an upper testing cylinder 431, a second pressing cylinder 422 connected below the first pressing cylinder 421, and a pressing soft glue 423 connected to the second pressing cylinder 422; the first pressing cylinder 421 is connected to a upper barcode scanning gun 46; the upper testing component 43 includes an upper testing cylinder 431, a second pressing cylinder 432 connected below the first pressing cylinder 421, and a pressing soft glue 423 connected to the second pressing cylinder 422; the first pressing cylinder 421 is connected to a second barcode scanning gun 46; the upper testing component 43 includes an upper testing cylinder 431, a second testing ... An upper test probe (not shown in the figure) on the upper test cylinder 431; the lower test component 44 includes a lower test cylinder 441, a test circuit board 442 connected to the lower test cylinder 441, a lower test probe 443 connected to the test circuit board 442, and a test core 444 arranged on one side of the lower test probe 443, the test core 444 is arranged correspondingly below the pressing soft glue 423, the test circuit board 442 is respectively connected to the lower test probe 443 and the test core 444, and is connected to the common mode tester 45; a lower barcode scanner 47 is provided on one side of the lower test component 44; the common mode tester 45 is connected to the inside of the frame 11.

[0052] Specifically, the second material moving mechanism 50 moves the product between the upper test component 43 and the lower test component 44. At this time, the upper barcode scanning gun 46 and the lower barcode scanning gun 47 scan the product respectively, and the pressing soft glue 423 descends under the action of the first pressing cylinder 421 and the second pressing cylinder 422, and presses the product. The upper test probe (not shown in the figure) of the upper test component 43 is connected to the top of the product, and the test core 444 and the lower test probe 443 of the lower test component 44 are connected to the bottom of the product, and the test core 444 is fixed. Common mode testing is performed through the common mode tester 45 to realize automated testing and improve efficiency.

[0053] Furthermore, if Fig. 9 As shown, the second material moving mechanism 50 includes a material moving pallet 51, a material moving Z-axis transmission module 52 connected to the material moving pallet 51, a material moving X-axis transmission module 53 connected to the material moving Z-axis transmission module 52, and a material moving Y-axis transmission module 54 connected to the material moving X-axis transmission module 53; the material moving pallet 51 is used to store the PCB panels 12 or the tray 14 with the PCB single board 13, and the material moving pallet 51 is connected to a plurality of material moving positioning cylinders 55. Specifically, the position of the material moving pallet 51 is adjusted through the material moving Z-axis transmission module 52, the material moving X-axis transmission module 53, and the material moving Y-axis transmission module 54, so that it is moved to between the upper test assembly 43 and the lower test assembly 44 for testing, replacing manual testing, and the equipment detection efficiency is high.

[0054] Furthermore, if Fig.10 As shown, the rotating mechanism 60 includes a mobile transmission module 61, a rotary cylinder 62 movably connected to the mobile transmission module 61, and a rotary platform 63 connected to the upper part of the rotary cylinder 62. The rotary platform 63 is correspondingly arranged below the marking mechanism 70, and the rotary platform 63 is used to store the PCB panels 12 or the tray 14 with the PCB single board 13. Specifically, the mobile transmission module 61 is used to move the rotary platform 63 to the laser marking position; the setting of the rotary cylinder 62 can be rotated and adjusted according to the marking position of different products, which is highly practical.

[0055] Furthermore, if Fig.10 As shown, the marking mechanism 70 includes a laser marking machine 71 and a marking lifting assembly 72 connected to the laser marking machine 71, and the marking lifting assembly 72 is used to drive the laser marking machine 71 to rise and fall. Specifically, the laser marking machine 71 adopts the existing laser marking machine 71; the marking lifting assembly 72 adopts the existing hand-cranked height adjustment device, which is convenient for adjusting the height of the laser marking machine 71 according to actual needs and has a wide range of applications.

[0056] Furthermore, if Figure 1 and Fig.11As shown, the test machine body 10 further includes a good product storage mechanism 80 and a bad product storage mechanism 90. The good product storage mechanism 80 is arranged on one side of the rotating and moving mechanism 60, and the bad product storage mechanism 90 is arranged on one side of the good product storage mechanism 80. Specifically, the marking position of the product is detected by using existing technologies such as industrial cameras to distinguish good products from bad products, and the good products and bad products are transferred to the good product storage mechanism 80 and the bad product storage mechanism 90 through the first material transfer mechanism 30 to complete the unloading.

[0057] Furthermore, if Fig.11 As shown, the good product storage mechanism 80 includes a good product baffle 81, a good product pallet 82, a good product lifting assembly 83 and a good product full material sensor 84, the good product baffle 81 is arranged around the outside of the good product pallet 82, the good product pallet 82 is connected to the good product lifting assembly 83, the good product lifting assembly 83 is used to drive the good product pallet 82 to rise and fall, and the good product full material sensor 84 is installed above the good product baffle 81; specifically, the good product baffle 81 is used to limit the position of the good product pallet 82, the good product pallet 82 is used to lift the products, the good product lifting assembly 83 is used to adjust the height of the good product pallet 82 according to the number of products to store the products, and the good product full material sensor 84 is used to detect the number of good products. When it is detected that the material is full, an automatic alarm is issued to prompt the material to be taken.

[0058] like Fig.11 As shown, the defective material storage mechanism 90 includes a defective baffle 91, a defective pallet 92, a defective lifting assembly 93 and a defective full material sensor 94. The defective baffle 91 is arranged around the outside of the defective pallet 92, the defective pallet 92 is connected to the defective lifting assembly 93, the defective lifting assembly 93 is used to drive the defective pallet 92 to rise and fall, and the defective full material sensor 94 is installed above the defective baffle 91. Specifically, the defective baffle 91 is used to limit the position of the defective product pallet 82, the defective pallet 92 is used to lift the product, the defective lifting assembly 93 is used to adjust the height of the defective pallet 92 according to the number of products to store the products, and the defective full material sensor 94 is used to detect the number of defective products. When the full material is detected, an automatic alarm is issued to prompt the material to be taken.

[0059] The workflow of the present invention is:

[0060] The PCB panel 12 or the tray 14 with the PCB single board 13 is placed in the loading mechanism 20, and the first material moving mechanism 30 grabs the PCB panel 12 or the tray 14 with the PCB single board 13 to the second material moving mechanism 50; the second material moving mechanism 50 moves the PCB panel 12 or the tray 14 with the PCB single board 13 to the testing mechanism 40 for common mode testing; after the test is completed, the first material moving mechanism 30 grabs the PCB panel 12 or the tray 14 with the PCB single board 13 to the rotating moving mechanism 60, and The PCB panel 12 or the tray 14 with the PCB single board 13 is moved to the marking mechanism 70 through the rotating and moving mechanism 60, and the marking mechanism 70 performs data laser engraving; after the marking is completed, the first material moving mechanism 30 grabs the PCB panel 12 or the tray 14 with the PCB single board 13 from the rotating and moving mechanism 60 to the good material storage mechanism 80 or the bad material storage mechanism 90, and when the good material full sensor 84 or the bad material full sensor 94 of the good material storage mechanism 80 or the bad material storage mechanism 90 detects that the material is full, an automatic alarm is given to prompt the material to be taken. Specifically, the overall test method is reasonably designed, effectively replaces manual detection, improves detection efficiency, reduces manual labor intensity, and reduces production costs.

[0061] The above only expresses the preferred technical solution of the present invention, and its description is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, and the present invention is also intended to include these modifications and modifications.

Claims

1. A universal common mode tester for PCB, characterized in that: The test machine comprises a testing machine body, which comprises a feeding mechanism, a first material moving mechanism, a testing mechanism, a second material moving mechanism, a rotating and moving mechanism, a marking mechanism and a frame; the feeding mechanism, the first material moving mechanism, the testing mechanism, the second material moving mechanism, the rotating and moving mechanism and the marking mechanism are respectively connected to the frame; the feeding mechanism is arranged at one side of the second material moving mechanism; the first material moving mechanism is arranged above the second material moving mechanism; the testing mechanism is arranged in front of the second material moving mechanism; The second material moving mechanism is arranged on one side of the rotating and moving mechanism; and the marking mechanism is arranged on one side of the rotating and moving mechanism.

2. The PCB universal common mode tester according to claim 1, characterized in that: The feeding mechanism includes a feeding pallet, a feeding lifting assembly and a feeding fixing assembly. The feeding pallet is connected to the feeding lifting assembly, and is used to lift the PCB panel or a tray with a PCB single board; the feeding lifting assembly is used to drive the feeding pallet to rise and fall; the feeding fixing assembly is arranged on the outside of the feeding pallet, and includes a fixed outer plate and a plurality of feeding positioning cylinders connected to the top of the fixed outer plate, and a feeding slot for the feeding pallet to pass through is opened in the center of the fixed outer plate.

3. The PCB universal common mode tester according to claim 1, characterized in that: The first material moving mechanism comprises a plurality of material picking components and a material picking X-axis transmission module, wherein the plurality of material picking components are movably connected to the material picking X-axis transmission module; The material picking assembly includes a grabbing and lifting cylinder, a grabbing frame and a number of grabbing elements. The output end of the grabbing and lifting cylinder is connected to the grabbing frame, and the bottom of the grabbing frame is connected to the several grabbing elements. The grabbing elements are used to grab and move PCB panels or trays with PCB boards from a loading mechanism; the material picking X-axis transmission module is used to drive the translation of several material picking assemblies.

4. The PCB universal common mode tester according to claim 1, characterized in that: The testing mechanism includes a testing support, a material pressing assembly connected to the testing support, an upper testing assembly arranged on one side of the material pressing assembly, a lower testing assembly arranged below the upper testing assembly, and a common mode tester electrically connected to the upper testing assembly and the lower testing assembly respectively; The pressing assembly includes a first pressing cylinder, a second pressing cylinder connected to the bottom of the first pressing cylinder, and a pressing soft glue connected to the second pressing cylinder; the first pressing cylinder is connected to an upper barcode scanning gun; The upper test assembly includes an upper test cylinder and an upper test probe connected to the upper test cylinder; The lower test assembly includes a lower test cylinder, a test circuit board connected to the lower test cylinder, a lower test probe connected to the test circuit board, and a test magnetic core arranged on one side of the lower test probe, wherein the test magnetic core is arranged correspondingly below the pressing soft glue; a lower barcode scanning gun is arranged on one side of the lower test assembly; The common mode tester is connected to the inside of the rack.

5. The PCB universal common mode tester according to claim 1, characterized in that: The second material moving mechanism comprises a material moving support plate, a material moving Z-axis transmission module connected to the material moving support plate, a material moving X-axis transmission module connected to the material moving Z-axis transmission module, and a material moving Y-axis transmission module connected to the material moving X-axis transmission module; The material transfer pallet is used to store PCB panels or a tray with PCB single boards, and the material transfer pallet is connected to a plurality of material transfer positioning cylinders.

6. The PCB universal common mode tester according to claim 1, characterized in that: The rotating and moving mechanism includes a moving transmission module, a rotating cylinder movably connected to the moving transmission module, and a rotating platform connected to the top of the rotating cylinder. The rotating platform is correspondingly arranged below the marking mechanism, and the rotating platform is used to store PCB panels or trays with PCB single boards.

7. The PCB universal common mode tester according to claim 1, characterized in that: The marking mechanism comprises a laser marking machine and a marking lifting component connected to the laser marking machine, wherein the marking lifting component is used to drive the laser marking machine to rise and fall.

8. The PCB universal common mode tester according to claim 1, characterized in that: The testing machine body further comprises a good product storage mechanism and a bad product storage mechanism. The good product storage mechanism is arranged on one side of the rotating and moving mechanism, and the bad product storage mechanism is arranged on one side of the good product storage mechanism.

9. The PCB universal common mode tester according to claim 8, characterized in that: The good product storage mechanism includes a good product baffle, a good product pallet, a good product lifting assembly and a good product full material sensor. The good product baffle is arranged around the outside of the good product pallet, the good product pallet is connected to the good product lifting assembly, the good product lifting assembly is used to drive the good product pallet to rise and fall, and the good product full material sensor is installed above the good product baffle.

10. The PCB universal common mode tester according to claim 8, characterized in that: The defective material storage mechanism includes a defective baffle, a defective pallet, a defective lifting assembly and a defective material full sensor. The defective baffle is arranged around the outside of the defective pallet, the defective pallet is connected to the defective lifting assembly, the defective lifting assembly is used to drive the defective pallet to rise and fall, and the defective material full sensor is installed above the defective baffle.

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