Chip wide-temperature test system, control method thereof and electronic equipment

Abstract

The invention discloses a chip wide-temperature testing system, a control method thereof and electronic equipment, and relates to the technical field of chip testing. The test box comprises a plurality of test plates, each test plate comprises a test bottom plate provided with a heat insulation layer, and a plurality of test stations are arranged in the heat insulation layer; the test station comprises a test sub-plate, an isolation chamber which is arranged between the test sub-plate and the test bottom plate and is provided with a heat insulation film on the bottom surface, and a heat exchange tube and a temperature sensor which are arranged in the isolation chamber; the test daughter board comprises a non-test surface and a test surface; the non-test surface is arranged in the isolation cavity and is provided with a plurality of non-test elements; the test surface is arranged outside the isolation cavity and is provided with a to-be-tested chip; the temperature control device comprises a controller, and a high-temperature medium box and a low-temperature medium box which are arranged in parallel; a first delivery valve is arranged between the high-temperature medium box and the heat exchange tube, and a second delivery valve is arranged between the low-temperature medium box and the heat exchange tube; a flow rate regulating valve is arranged on the conveying pipeline; and the reliability of the wide-temperature test of the chip can be improved.

Description

Technical Field

[0001] The present application relates to the field of chip testing technology, and in particular to a chip wide temperature testing system and a control method and electronic equipment thereof. Background Art

[0002] In the process of chip processing and testing, before each chip leaves the factory, the performance parameters of the chip need to be tested in different ambient temperatures. Among them, some chips have high-speed interfaces with the CPU, which have strict restrictions on signal line length, impedance, etc. For such chips, in order to meet the signal integrity requirements, other devices such as the CPU and the chip must be implemented on a PCB board, and the two must be placed as close as possible. When it is necessary to perform a wide temperature test on a chip placed on the same PCB board as other devices such as the CPU, the PCB board can only be placed in the test box together. When the test environment temperature in the test box exceeds the reliable temperature range in which other devices such as the CPU can work normally, the performance of other devices such as the CPU will deteriorate, interfering with the wide temperature test of the chip, resulting in reduced reliability of the wide temperature test of the chip. Summary of the invention

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a chip wide temperature test system and a control method thereof, and an electronic device, which can improve the reliability of the chip wide temperature test.

[0004] In a first aspect, an embodiment of the present application provides a chip wide temperature test system, comprising:

[0005] A test box, comprising: a plurality of test boards, each of the test boards comprising a test base plate provided with a heat insulation layer, a plurality of test stations being provided in the heat insulation layer; the test stations comprising: a test sub-board, an isolation chamber provided between the test sub-board and the test base plate and provided with a heat insulation film on the bottom surface, a heat exchange tube and a temperature sensor provided in the isolation chamber; the test sub-board comprising: a non-test surface provided with a plurality of non-test elements in the isolation chamber, and a test surface provided with a chip to be tested outside the isolation chamber;

[0006] The temperature control device comprises: a controller, a high temperature medium box and a low temperature medium box arranged in parallel; a temperature control loop is formed between the high temperature medium box, the low temperature medium box and the heat exchange tube through a delivery pipe and a return pipe; a first delivery valve is arranged between the high temperature medium box and the heat exchange tube, and a second delivery valve is arranged between the low temperature medium box and the heat exchange tube; a flow rate regulating valve is arranged on the delivery pipe;

[0007] The controller is respectively connected to the temperature sensor, the test box, the first delivery valve, the second delivery valve, and the flow rate regulating valve for communication;

[0008] The controller is used to: control the opening and closing states of the first delivery valve and the second delivery valve according to the test verification mode performed in the test box, and deliver fluid media of different temperatures to the isolation chamber so that the chamber temperature reaches a target temperature range in which the non-test element can work normally; and control the opening of the flow rate regulating valve according to the acquired chamber temperature to adjust the flow rate of the fluid medium.

[0009] In a second aspect, an embodiment of the present application provides a control method for a chip wide temperature test system, which is applied to a controller of a chip wide temperature test system as described in any one of the embodiments of the first aspect; the chip wide temperature test system further includes: a test box and a temperature control device, the test box includes: a test sub-board, an isolation chamber, and a temperature sensor; the test sub-board includes: a non-test surface in the isolation chamber; the temperature control device includes: a high temperature medium box, a low temperature medium box, a first delivery valve, a second delivery valve, and a flow rate regulating valve;

[0010] The control method comprises:

[0011] According to the test verification mode performed in the test box, the opening and closing states of the first delivery valve and the second delivery valve are controlled to deliver fluid media of different temperatures to the isolation chamber so that the chamber temperature reaches a target temperature range in which the non-test element can work normally;

[0012] According to the acquired chamber temperature, the opening of the flow rate regulating valve is controlled to adjust the flow rate of the fluid medium.

[0013] In a third aspect, an embodiment of the present application provides an electronic device comprising at least one processor and a memory for communicating with the at least one processor; the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute a control method for a chip wide temperature testing system as described in any one of the second aspects.

[0014] The embodiment of the present application includes: a chip wide temperature test system includes: a test box and a temperature control device, wherein the test box includes: a plurality of test base plates provided with a heat insulation layer, a plurality of test stations are provided in the heat insulation layer; the test stations include: a test sub-board, an isolation chamber provided between the test sub-board and the test base plate and provided with a heat insulation film on the bottom surface, a heat exchange tube and a temperature sensor provided in the isolation chamber; the test sub-board includes: a non-test surface provided with a plurality of non-test elements in the isolation chamber, and a test surface provided with a chip to be tested outside the isolation chamber; thereby isolating the non-test elements from the chip to be tested, and respectively providing them on both sides of the test sub-board, so as to facilitate regional control Temperature; the temperature control device includes: a controller, a high temperature medium box and a low temperature medium box arranged in parallel; a temperature control loop is formed between the high temperature medium box, the low temperature medium box and the heat exchange tube through a delivery pipe and a return pipe; a first delivery valve is arranged between the high temperature medium box and the heat exchange tube, and a second delivery valve is arranged between the low temperature medium box and the heat exchange tube; a flow rate regulating valve is arranged on the delivery pipe; the controller is respectively connected to the temperature sensor, the test box, the first delivery valve, the second delivery valve, and the flow rate regulating valve; the chamber temperature of the isolation chamber where the non-test element is located and the test environment temperature of the test box where the chip to be tested is located are controlled by the temperature control device. In the process of using the chip wide temperature test system to perform a wide temperature test on the chip to be tested, first, according to the test verification mode performed in the test box, the opening and closing states of the first delivery valve and the second delivery valve are controlled to deliver fluid media of different temperatures to the isolation chamber, so that the chamber temperature reaches the target temperature range where the non-test element can work normally; then, according to the obtained chamber temperature, the opening of the flow rate regulating valve is controlled to adjust the flow rate of the fluid medium. Therefore, during the wide temperature test of the chip to be tested, the temperature control device can control the chamber temperature of the isolation chamber where the non-test components are located and the test environment temperature of the test box where the chip to be tested is located, and can adjust the chamber temperature to ensure the normal performance of the non-test components, reduce the probability of the performance deterioration of the non-test components interfering with the wide temperature test of the chip, and improve the reliability of the wide temperature test of the chip. That is to say, the embodiment of the present application can improve the reliability of the wide temperature test of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of a chip wide temperature test system provided by an embodiment of the present application;

[0016] Figure 2 is a schematic top view of a single test board after the test sub-board is removed provided by an embodiment of the present application;

[0017] Figure 3 is a side cross-sectional view of a single test board provided by one embodiment of the present application;

[0018] Figure 4Ais a top view of a test sub-board provided by an embodiment of the present application;

[0019] Figure 4B is a side view of a test sub-board provided by an embodiment of the present application;

[0020] Figure 4C This is a bottom view of a test sub-board provided in one embodiment of the present application.

[0021] Figure 5 is a schematic diagram of the specific structure of a temperature control device provided by an embodiment of the present application;

[0022] Figure 6 This is a communication connection diagram of a controller of a chip wide temperature test system provided by an embodiment of the present application;

[0023] Figure 7 This is a schematic diagram of the steps of a control method for a chip wide temperature test system provided by an embodiment of the present application;

[0024] Figure 8 It is a schematic diagram of the hardware structure of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0025] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0026] It should be understood that in the description of the present application, the orientation descriptions, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0027] It should be noted that although a logical order is shown in the flowchart in the description of the present application, in some cases, the steps shown or described may be performed in an order different from that in the flowchart. In the description of the present application, a number of means one or more, and a plurality of means two or more. The description of "first" and "second" is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0029] The present application discloses a chip wide temperature test system and its control method, and electronic equipment, and relates to the field of chip testing technology. The system includes: a test box includes: multiple test boards, each test board includes a test base plate provided with a heat insulation layer, and multiple test stations are opened in the heat insulation layer; the test station includes: a test sub-board, an isolation chamber provided between the test sub-board and the test base plate and provided with a heat insulation film on the bottom surface, a heat exchange tube and a temperature sensor provided in the isolation chamber; the test sub-board includes: a non-test surface provided with multiple non-test elements in the isolation chamber, and a test surface provided with a chip to be tested outside the isolation chamber; the temperature control device includes: a controller, a high-temperature medium box and a low-temperature medium box arranged in parallel; a first delivery valve is provided between the high-temperature medium box and the heat exchange tube, and a second delivery valve is provided between the low-temperature medium box and the heat exchange tube; a flow rate regulating valve is provided on the delivery pipeline; the reliability of the chip wide temperature test can be improved.

[0030] The embodiments of the present application are further described below in conjunction with the accompanying drawings.

[0031] First, as Figures 1 to 6 As shown, the chip wide temperature test system 1000 includes: a test box 100 and a temperature control device 200.

[0032] The test box 100 includes: a plurality of test base plates 110 provided with a heat insulation layer 120, a plurality of test stations 130 being opened in the heat insulation layer 120; the test stations 130 include: a test sub-board 131, an isolation chamber 132 provided between the test sub-board 131 and the test base plate 110 and provided with a heat insulation film 133 on the bottom surface, a heat exchange tube 134 and a temperature sensor 135 provided in the isolation chamber 132; the test sub-board 131 includes: a non-test surface 131B provided with a plurality of non-test components 139 in the isolation chamber 132, and a test surface outside the isolation chamber 132 and provided with a chip to be tested 138.

[0033] The temperature control device 200 includes: a controller 210, a high-temperature medium box 220 and a low-temperature medium box 230 arranged in parallel; a temperature control loop is formed between the high-temperature medium box 220, the low-temperature medium box 230, and the heat exchange tube 134 through a delivery pipe 300 and a return pipe 400; a first delivery valve T1 is arranged between the high-temperature medium box 220 and the heat exchange tube 134, and a second delivery valve T2 is arranged between the low-temperature medium box 230 and the heat exchange tube 134; a flow rate regulating valve T5 is arranged on the delivery pipe 300.

[0034] The controller 210 is respectively connected to the temperature sensor 135 , the test box 100 , the first delivery valve T1 , the second delivery valve T2 , and the flow rate regulating valve T5 for communication.

[0035] It is understandable that multiple test boards 100A are placed in the test box 100 as a whole, one layer at a time, and can test a large number of chips 138 to be tested at the same time. Specifically, according to the size of the test box 100, 1,800 chips 138 to be tested can normally be tested at the same time.

[0036] Furthermore, the function of each component in the test box 100 is described.

[0037] It is understandable that the heat insulating layer 120 is used to isolate the isolation chamber 132 from the environment where the chip to be tested 138 is located in the test box 100, play the role of sealing the isolation chamber 132, and play a good role in heat blocking, so as to facilitate the realization of temperature control in different regions. Specifically, the material used for the heat insulating layer 120 and the heat insulating film 133 is silicone rubber, which has a good heat insulating effect.

[0038] Specifically, the test base plate 110 is used to carry a plurality of test stations 130 , which is conducive to realizing batch testing of chips.

[0039] Specifically, the test station 130 is used to load and fix the chip to be tested 138 so as to implement a wide temperature test on the chip to be tested 138 .

[0040] Specifically, the test sub-board 131 is used to load and fix the chip under test 138 and the non-test component 139, and the chip under test 138 and the non-test component 139 are respectively set on both sides of the test sub-board 131 to facilitate the individual adjustment of the ambient temperature of the non-test component 139.

[0041] Specifically, the isolation chamber 132 is used to provide a reliable working environment for the non-test components 139 on the non-test surface 131B of the test sub-board 131 , so that the non-test components 139 can work within a reliable temperature range.

[0042] Specifically, the thermal insulation film 133 is used to further improve the sealing of the isolation chamber 132 and enhance the thermal insulation effect.

[0043] Specifically, the heat exchange tube 134 is used to: exchange heat with the air in the isolation chamber 132, and adjust the chamber temperature in the isolation chamber 132, so that during the wide temperature test of the chip 138 to be tested, the non-test element 139 on the non-test surface 131B of the test sub-board 131 can operate within a reliable temperature range.

[0044] Specifically, the temperature sensor 135 is used to detect the chamber temperature of the isolation chamber 132 in real time during the wide temperature test of the chip to be tested 138, thereby providing a reliable reference for the temperature control device 200 to adjust the chamber temperature. Specifically, the temperature sensor 135 uses a temperature probe, and the temperature probe is connected to the controller 210 through a temperature detection signal line.

[0045] Combination Figure 2 , further illustrating the temperature control loop provided by the embodiment of the present application. Specifically, the chip wide temperature test system 1000 also includes: a delivery pipe 300 and a return pipe 400. The heat exchange tube 134 in each test station 130 includes: an inlet 1341 and an outlet 1342; the inlet 1341 is used to connect to one end of the delivery pipe 300 to introduce the fluid medium used to adjust the chamber temperature; the outlet 1342 is used to connect to one end of the return pipe 400 to discharge the fluid medium after heat exchange. The temperature control device 200 also includes: a delivery port 240 and a return port 250. The temperature control loop includes: a first delivery branch pipe where the high-temperature medium box 220 is located, and a second delivery branch pipe where the low-temperature medium box 230 is located. The first delivery branch pipe and the second delivery branch pipe are connected in parallel to form a delivery branch unit, one end of the delivery branch unit is connected to the delivery port 240, and the other end of the delivery branch unit is connected to the return port 250. The delivery port 240 is connected to the inlet 1341 of the heat exchange tube 134 through the delivery pipe 300, and the return port 250 is connected to the outlet 1342 of the heat exchange tube 134 through the return pipe 400, thereby forming a temperature control loop. The temperature control loop is used to: provide a flow path for fluid media of different temperatures, when the fluid medium flows into the heat exchange tube 134, it exchanges heat with the ambient temperature in the isolation chamber 132 to adjust the chamber temperature; after the heat exchange is completed, the fluid medium flows out of the heat exchange tube 134 and returns to the temperature control device 200, realizing the medium circulation, so as to continuously adjust the temperature of the isolation chamber 132.

[0046] Furthermore, the function of each element in the temperature control device 200 is described.

[0047] It is understandable that the high temperature medium box 220 is used to store high temperature medium and output the high temperature medium to the isolation chamber 132 through the delivery pipeline 300 when the chamber temperature of the isolation chamber 132 needs to be increased. Specifically, the high temperature medium can be hot water or hot air.

[0048] It is understood that the cryogenic medium box 230 is used to store the cryogenic medium and to output the cryogenic medium to the isolation chamber 132 through the delivery pipeline 300 when the chamber temperature of the isolation chamber 132 needs to be lowered. Specifically, the cryogenic medium can be cold air and cold air.

[0049] It can be understood that the first delivery valve T1 is disposed on the first delivery branch pipeline and is disposed between the delivery port 240 and the high temperature medium box 220, and is used to control the on-off of the passage between the delivery port 240 and the high temperature medium box 220. Specifically, when the first delivery valve T1 is opened, the passage between the delivery port 240 and the high temperature medium box 220 is connected; when the first delivery valve T1 is closed, the passage between the delivery port 240 and the high temperature medium box 220 is blocked.

[0050] It can be understood that the second delivery valve T2 is arranged on the second delivery branch pipeline and is arranged between the delivery port 240 and the cryogenic medium box 230, and is used to control the opening and closing of the passage between the delivery port 240 and the cryogenic medium box 230. Specifically, when the second delivery valve T2 is opened, the passage between the delivery port 240 and the cryogenic medium box 230 is connected; when the second delivery valve T2 is closed, the passage between the delivery port 240 and the cryogenic medium box 230 is blocked.

[0051] It is understandable that the flow rate regulating valve T5 is used to regulate the flow rate of the fluid in the pipeline. By adjusting the opening of the flow rate regulating valve T5, the amount of liquid flowing through the valve can be adjusted, thereby controlling the flow rate.

[0052] In some embodiments, there are three ways to set the flow rate regulating valve T5 of the system of the embodiment of the present application in the chip wide temperature testing system 1000.

[0053] The first setting method is to use a flow rate regulating valve T5, which is set as a master regulating valve between the delivery port 240 and the test box 100, so that the flow rate of the fluid medium flowing into the test box 100 body can be uniformly adjusted according to the average temperature of all the isolated chambers 132, so that the flow rate of the fluid medium flowing into all the heat exchange tubes 134 in different test plates 100A is the same, thereby uniformly adjusting the chamber temperature of all the isolated chambers 132. Although the uniform adjustment of the chamber temperature of all the isolated chambers 132 is efficient, the adjustment is not targeted and accurate. Based on this, a second setting method is provided.

[0054] The second setting method is: using multiple flow rate regulating valves T5, the number of flow rate regulating valves T5 is the same as the number of test plates 100A, and a flow rate regulating valve T5 is set between each test plate 100A and the delivery port 240 of the temperature control device 200, and multiple flow rate regulating valves T5 are in parallel. At this time, each flow rate regulating valve T5 is equivalent to a branch regulator, which can independently adjust the flow rate of the fluid medium flowing into the corresponding test plate 100A according to the average temperature of all isolated chambers 132 on a corresponding test plate 100A, so that the flow rate of the fluid medium flowing into all heat exchange tubes 134 on the same test plate 100A is the same, thereby uniformly adjusting the chamber temperature of all isolated chambers 132 on the same test plate 100A. In addition, by adjusting each flow rate regulating valve T5, the flow rate of the fluid medium flowing into different test plates 100A is different. In this way, the chamber temperature of all isolated chambers 132 on the same test plate 100A can be uniformly adjusted, improving the pertinence and accuracy of temperature regulation. In order to further improve the pertinence and accuracy of temperature regulation, a third setting method is provided.

[0055] The third setting mode is: using multiple flow rate regulating valves T5, the number of flow rate regulating valves T5 is the same as the number of isolation chambers 132, and a flow rate regulating valve T5 is set at the inlet 1341 of each isolation chamber 132, and each flow rate regulating valve T5 can independently adjust the flow rate of the fluid medium flowing into the corresponding isolation chamber 132 according to the temperature of the corresponding isolation chamber 132, thereby independently adjusting the chamber temperature of the corresponding isolation chamber 132. Under the third setting mode, the flow rate regulating valve T5 can be used to independently adjust the flow rate of the fluid medium flowing into each isolation chamber 132, and the chamber temperature of each isolation chamber 132 can be independently regulated, thereby further improving the pertinence and accuracy of temperature regulation.

[0056] Therefore, the present application does not impose any specific restrictions on the number and setting method of the flow rate regulating valve T5; it can be selected according to actual needs.

[0057] The controller 210 is used to: control the opening and closing states of the first delivery valve T1 and the second delivery valve T2 according to the test verification mode performed in the test box 100, and deliver fluid media of different temperatures to the isolation chamber 132, so that the chamber temperature reaches the target temperature range where the non-test element 139 can work normally; and control the opening of the flow rate regulating valve T5 according to the acquired chamber temperature to adjust the flow rate of the fluid medium. Thus, in the process of performing a wide temperature test on the chip to be tested 138, the chamber temperature of the isolation chamber 132 where the non-test element 139 is located and the test environment temperature of the test box 100 where the chip to be tested 138 is located are controlled by the temperature control device 200, and the chamber temperature can be adjusted to ensure that the performance of the non-test element 139 is normal, reduce the probability of the performance deterioration of the non-test element 139 interfering with the wide temperature test of the chip, and improve the reliability of the wide temperature test of the chip. Therefore, the chip wide temperature test system 1000 provided in the embodiment of the present application can improve the reliability of the wide temperature test of the chip.

[0058] like Figure 3 and Figure 4A As shown, the test sub-board 131 includes a test surface and a non-test surface 131B, and a plurality of non-test components 139 are arranged on the non-test surface 131B. According to some embodiments of the present application, the test surface is provided with a chip test seat 137, and the chip test seat 137 is used to load the chip to be tested 138; the isolation chamber 132 is filled with thermal conductive silicone 1321. By providing the thermal conductive silicone 1321, the non-test components 139 are placed in the isolation chamber 132 isolated from the incubator.

[0059] It can be understood that the multiple non-test components 139 disposed on the non-test surface 131B include but are not limited to: a CPU, a power chip, and the like.

[0060] like Figure 4B and Figure 4CAs shown, the test sub-board 131 is connected to the bottom board via a connector 136, and the connector 136 is disposed on the non-test surface 131B. The test sub-board 131 is also provided with a screw mounting hole 131C, and a screw is passed through the screw mounting hole 131C and screwed to the bottom board to further fix the test sub-board 131.

[0061] like Figure 5 and Figure 6 As shown, according to some embodiments of the present application, the temperature control device 200 also includes: a heater 221, a refrigerator 231, a fluid pump 260, a first feed valve T3, and a second feed valve T4 that are communicatively connected to the controller 210; the heater 221 is arranged in the high-temperature medium box 220; the refrigerator 231 is arranged in the low-temperature medium box 230; the fluid pump 260 is arranged on the return pipe 400; the first feed valve T3 is arranged between the high-temperature medium box 220 and the fluid pump 260; the second feed valve T4 is arranged between the low-temperature medium box 230 and the fluid pump 260.

[0062] Specifically, the heater 221 is used to heat the fluid medium stored in the high-temperature medium box 220 to increase the temperature of the fluid medium to a first target temperature.

[0063] Specifically, the refrigerator 231 is used to cool the fluid medium stored in the low-temperature medium box 230 to reduce the temperature of the fluid medium to the second target temperature.

[0064] Specifically, the fluid pump 260 is used to: provide power for the flow of the fluid medium, send the fluid medium in the return pipe 400 into the high-temperature medium box 220 or the low-temperature medium box 230; and realize the recycling of the fluid medium. Specifically, when the fluid medium is gas, the fluid pump 260 uses an air pump; when the fluid medium is water, the fluid pump 260 uses a water pump; it can be selected according to needs, and this application does not impose specific restrictions on the selection of the fluid pump 260.

[0065] Specifically, the first feed valve T3 is provided on the first delivery branch pipeline and between the high temperature medium box 220 and the fluid pump 260, and is used to control the on-off of the passage between the high temperature medium box 220 and the fluid pump 260. Specifically, when the first feed valve T3 is opened, the passage between the high temperature medium box 220 and the fluid pump 260 is connected, and the fluid medium enters the high temperature medium box 220; when the first feed valve T3 is closed, the passage between the high temperature medium box 220 and the fluid pump 260 is blocked.

[0066] Specifically, the second feed valve T4 is disposed on the second delivery branch pipeline and between the cryogenic medium box 230 and the fluid pump 260, and is used to control the on-off of the passage between the cryogenic medium box 230 and the fluid pump 260. Specifically, when the second feed valve T4 is opened, the passage between the cryogenic medium box 230 and the fluid pump 260 is connected, and the fluid medium enters the cryogenic medium box 230; when the second feed valve T4 is closed, the passage between the cryogenic medium box 230 and the fluid pump 260 is blocked.

[0067] In some embodiments, the heater 221 and the refrigerator 231 may not be provided; instead, the high-temperature medium box 220 is directly connected to an external heat source (an external hot water source or an external hot air source), and the external heat source injects high-temperature medium into the high-temperature medium box 220, and a certain amount of high-temperature medium is stored in the high-temperature medium box 220; the low-temperature medium box 230 is directly connected to an external cold source (an external cold water source or an external cold air source), and the external cold source injects low-temperature medium into the low-temperature medium box 230, and a certain amount of low-temperature medium is stored.

[0068] According to some embodiments of the present application, when the high-temperature medium tank 220 is a hot water tank and the low-temperature medium tank 230 is a cold water tank, the temperature control device 200 also includes: a water storage tank 270, which is arranged on the return pipe 400 between the outlet 1342 of the heat exchange tube 134 and the fluid pump 260; the water storage tank 270 is provided with a water supply port, and the water supply port is connected to an external water source.

[0069] It is understandable that when water is used as the fluid medium, water will be lost when it evaporates due to heat, so a water tank 270 is provided to ensure that the fluid medium for adjusting the chamber temperature is sufficient, so that the chamber temperature can be continuously adjusted to maintain the normal performance of the non-test element 139. When the water in the water tank 270 is insufficiently consumed, water can be added to the water tank 270 from an external water source, and special situations such as water outage can be dealt with.

[0070] In some embodiments, when the fluid medium is gas, a heat pump system of an air conditioner can be used in the temperature control device 200 to deliver hot air and cold air.

[0071] The temperature control device 200 controls the chamber temperature of the isolation chamber 132 where the non-test element 139 is located and the test environment temperature of the test box 100 where the chip under test 138 is located. The chip wide temperature test system 1000 provided in the embodiment of the present application can improve the reliability of chip wide temperature test.

[0072] Those skilled in the art will appreciate that the system structure shown in the figure does not constitute a limitation on the embodiments of the present application, and may include more or fewer components than shown in the figure, or a combination of certain components, or a different arrangement of components.

[0073] Those skilled in the art will appreciate that the system architecture and application scenarios described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Those skilled in the art will appreciate that with the evolution of the system architecture and the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are equally applicable to similar technical problems.

[0074] Based on the above system structure, various embodiments of the control method of the chip wide temperature test system of the present application are proposed below.

[0075] First, as Figure 7 As shown, the control method of the chip wide temperature test system can be applied to Figure 1 In the controller of the chip wide temperature test system shown. In addition, the chip wide temperature test system also includes: a test box and a temperature control device, the test box includes: a test sub-board, an isolation chamber, and a temperature sensor; the test sub-board includes: a non-test surface in the isolation chamber; the temperature control device includes: a high temperature medium box, a low temperature medium box, a first delivery valve, a second delivery valve, and a flow rate regulating valve. The control method may include but is not limited to steps S110 to S120.

[0076] Step S110: According to the test verification mode performed in the test box, the opening and closing states of the first delivery valve and the second delivery valve are controlled to deliver fluid media of different temperatures to the isolation chamber so that the chamber temperature reaches the target temperature range in which non-test components can work normally.

[0077] Step S120: According to the acquired chamber temperature, the opening of the flow rate regulating valve is controlled to adjust the flow rate of the fluid medium.

[0078] Specifically, the test verification modes include: high temperature verification test and low temperature verification test; the fluid media at different temperatures include: high temperature medium and low temperature medium.

[0079] It is understandable that the target temperature range is a reliable temperature range in which the non-test components can work normally. Usually, conventional components such as CPUs can operate reliably at 0 to 60°C. That is, the target temperature range is 0 to 60°C.

[0080] Through steps S110 to S120, in the process of performing a wide temperature test on the chip to be tested using the chip wide temperature test system, first, according to the test verification mode performed in the test box, the opening and closing states of the first delivery valve and the second delivery valve are controlled to deliver fluid media of different temperatures to the isolation chamber so that the chamber temperature reaches the target temperature range in which the non-test components can work normally; then, according to the acquired chamber temperature, the opening of the flow rate regulating valve is controlled to adjust the flow rate of the fluid medium. Thus, in the process of performing a wide temperature test on the chip to be tested, the chamber temperature of the isolation chamber where the non-test components are located and the test environment temperature of the test box where the chip to be tested is located are controlled by the temperature control device respectively, and the chamber temperature can be adjusted to ensure the normal performance of the non-test components, reduce the probability of the performance deterioration of the non-test components interfering with the wide temperature test of the chip, and improve the reliability of the wide temperature test of the chip. That is to say, the embodiment of the present application can improve the reliability of the wide temperature test of the chip.

[0081] According to some embodiments of the present application, the temperature control device further includes: a heater, a refrigerator, a fluid pump, a first feed valve and a second feed valve; before step S110, the control method further includes but is not limited to steps S210 to S220.

[0082] Step S210: When the test verification mode is a low-temperature verification test, control the first feed valve to open and the second feed valve to close, start the fluid pump to send the fluid medium at room temperature into the high-temperature medium box, and control the heater to heat the fluid medium; when the temperature of the fluid medium rises to the first target temperature, start the test box to perform a low-temperature verification test on the chip to be tested.

[0083] Step S220: When the test verification mode is a high-temperature verification test, control the first feed valve to close and the second feed valve to open, start the fluid pump to send the fluid medium at room temperature into the low-temperature medium box, and control the refrigerator to cool the fluid medium; when the temperature of the fluid medium drops to the second target temperature, start the test box to perform a high-temperature verification test on the chip to be tested.

[0084] Specifically, the first target temperature is 100 degrees Celsius, and the second target temperature is 0 degrees Celsius.

[0085] Through step S210 to step S220, when the chip wide temperature test system is first used, before the test box performs verification test on the chip to be tested, the required high temperature medium or low temperature medium is prepared according to the test verification mode to be performed; to ensure that the required fluid medium for adjusting the chamber temperature can be delivered in time during the chip wide temperature test. And it can be heated or cooled as needed, which is conducive to reducing the energy consumption of the temperature control device.

[0086] According to some embodiments of the present application, step S110 is further described, and step S110 includes but is not limited to steps S111 to S112.

[0087] Step S111: When the test verification mode performed in the test box is a low temperature verification test, the first delivery valve is controlled to open and the second delivery valve is controlled to close, and the high temperature medium in the high temperature medium box is delivered to the heat exchange tube to raise the temperature of the isolation chamber to the target temperature range.

[0088] Step S112: When the test verification mode performed in the test box is a high temperature verification test, the first delivery valve is controlled to be closed and the second delivery valve is controlled to be opened, and the low-temperature medium in the low-temperature medium box is delivered to the heat exchange tube to reduce the temperature of the isolation chamber to the target temperature range.

[0089] Specifically, when the temperature control device further includes: a fluid pump, a first feed valve and a second feed valve. In order to ensure that the fluid medium circulates in the temperature control loop to regulate the chamber temperature during the low-temperature verification test, step S111 also includes: controlling the first feed valve to open, the second feed valve to close, and the fluid pump to start; after the high-temperature medium flows out of the high-temperature medium box, it passes through the heat exchange tube, the reflux pipe, and the fluid pump in sequence, and then returns to the high-temperature medium box to achieve recycling.

[0090] Specifically, in order to ensure that the fluid medium circulates in the temperature control loop to regulate the chamber temperature during the high-temperature verification test, step S112 also includes: controlling the first feed valve to close, the second feed valve to open, and the fluid pump to start; allowing the low-temperature medium to flow out of the low-temperature medium box, pass through the heat exchange tube, the reflux pipe, and the fluid pump in sequence, and then return to the low-temperature medium box for recycling.

[0091] Through step S111 to step S112, when performing a low-temperature verification test, the first delivery valve is controlled to open so that the passage between the delivery port and the high-temperature medium box is connected, and the second delivery valve is controlled to close so that the passage between the delivery port and the low-temperature medium box is blocked, and the high-temperature medium in the high-temperature medium box flows into the heat exchange tube of the isolation chamber through the delivery pipeline, and heat exchanges with the isolation chamber environment, and the chamber temperature of the isolation chamber is increased to the target temperature range, ensuring that the performance of the non-test components is normal. When performing a high-temperature verification test, the first delivery valve is controlled to close so that the passage between the delivery port and the high-temperature medium box is blocked, and the second delivery valve is controlled to open so that the passage between the delivery port and the low-temperature medium box is connected, and the low-temperature medium in the low-temperature medium box flows into the heat exchange tube of the isolation chamber through the delivery pipeline, and heat exchanges with the isolation chamber environment, and the chamber temperature of the isolation chamber is reduced to the target temperature range, ensuring that the performance of the non-test components is normal. In this way, the probability of the performance deterioration of the non-test components interfering with the wide-temperature test of the chip is reduced, and the reliability of the wide-temperature test of the chip is improved.

[0092] For example, the temperature control device controls the chamber temperature range within the reliable temperature range required by the CPU and other devices. When the chip to be tested is in a high temperature environment (85°C), the temperature control device includes but is not limited to injecting 0 degrees Celsius ice water / cold air into the heat exchange tube through a delivery pipeline to take away the heat conducted by the isolation chamber where the non-test components such as the CPU are located, ensuring that the CPU, power IC and other circuits operate within a qualified high temperature range (<60°C). When the chip to be tested is in a low temperature environment (-40°C), the temperature control device includes but is not limited to injecting 100 degrees Celsius hot water / hot air into the heat exchange tube through a delivery pipeline to heat the isolation chamber where the non-test components are located, ensuring that the CPU, power IC and other circuits operate within their qualified low temperature range (>0°C). This reduces the difficulty of implementing the temperature control device and reduces the energy consumption of the temperature control device.

[0093] According to some embodiments of the present application, step S120 is further described, and step S120 includes but is not limited to steps S310 to S350.

[0094] Step S310: During the low temperature verification test, the flow rate regulating valve is opened, and the opening of the flow rate regulating valve is adjusted to an initial opening value.

[0095] Step S320: obtaining the chamber temperature of each isolation chamber in real time through a temperature sensor.

[0096] Step S330: determining a temperature reference value according to the chamber temperature of each isolation chamber.

[0097] Step S340: when the temperature reference value is lower than the first temperature threshold, the opening of the flow rate regulating valve is increased from the initial opening to the first opening value to increase the flow rate of the fluid medium.

[0098] Step S350: When the temperature reference value is higher than the second temperature threshold, the opening of the flow rate regulating valve is reduced from the initial opening to the second opening value to reduce the flow rate of the fluid medium; wherein the first temperature threshold is lower than the second temperature threshold.

[0099] It can be understood that the opening of the flow rate regulating valve affects the flow rate of the fluid medium, and the opening of the flow rate regulating valve can be determined according to the actual required flow rate of the high-temperature medium. Therefore, this application does not impose specific restrictions on the values ​​of the first opening value and the second opening value.

[0100] In one embodiment, the first temperature threshold is 5°C and the second temperature threshold is 10°C.

[0101] Through steps S310 to S350, during the low-temperature verification test, the temperature control device can automatically and timely adjust the chamber temperature according to the chamber temperature of the isolation chamber by regulating the flow rate of the high-temperature medium sent into the isolation chamber, thereby ensuring the normal performance of non-test components and improving the reliability of wide-temperature testing of the chip.

[0102] For example, when performing a low-temperature verification test on a chip under test, 100°C hot water is injected into the delivery pipeline; and the chamber temperature of the isolation chamber where the CPU is located is detected in real time. When the chamber temperature is lower than 5°C, the injection speed of hot water is increased, and when the chamber temperature is higher than 10°C, the injection speed of hot water is reduced. Through this dynamic adjustment method, when the chip under test is in a low-temperature environment, the chamber temperature is higher than 0°C, ensuring that non-test components can work reliably.

[0103] According to some embodiments of the present application, step S120 is further described, and step S120 includes but is not limited to steps S410 to S450.

[0104] Step S410: during the high temperature verification test, the flow rate regulating valve is opened, and the opening of the flow rate regulating valve is adjusted to an initial opening value.

[0105] Step S420: obtaining the chamber temperature of each isolation chamber in real time through a temperature sensor.

[0106] Step S430: determining a temperature reference value according to the chamber temperature of each isolation chamber.

[0107] Step S440: when the temperature reference value is higher than the third temperature threshold, the opening of the flow rate regulating valve is increased from the initial opening to the third opening value to increase the flow rate of the fluid medium.

[0108] Step S450: When the temperature reference value is lower than the fourth temperature threshold, the opening of the flow rate regulating valve is reduced from the initial opening to the fourth opening value to reduce the flow rate of the fluid medium; wherein the third temperature threshold is greater than the fourth temperature threshold.

[0109] It can be understood that the opening of the flow rate regulating valve affects the flow rate of the fluid medium, and the opening of the flow rate regulating valve can be determined according to the actual required flow rate of the low-temperature medium. Therefore, this application does not make specific restrictions on the values ​​of the third opening value and the fourth opening value.

[0110] In one embodiment, the third temperature threshold is 55°C, and the fourth temperature threshold is 50°C.

[0111] Through steps S410 to S450, during the high-temperature verification test, the temperature control device can automatically and timely adjust the chamber temperature according to the chamber temperature of the isolation chamber by regulating the flow rate of the low-temperature medium sent into the isolation chamber, thereby ensuring the normal performance of non-test components and improving the reliability of wide-temperature testing of the chip.

[0112] For example, when performing a high-temperature verification test on a chip under test, 0°C ice water is injected into the delivery pipeline, and the chamber temperature of the isolation chamber where the CPU is located is detected in real time. When the chamber temperature is higher than 55°C, the injection speed of ice water is increased, and when the chamber temperature is lower than 50°C, the injection speed of ice water is reduced. Through this dynamic adjustment method, when the chip under test is in a high-temperature environment, the chamber temperature is lower than 60°C, ensuring that non-test components can work reliably.

[0113] Step S330 and step S430 are further described. It can be understood that there are three ways to set the flow rate regulating valve in the chip wide temperature test system of the embodiment of the present application, and there are three different ways to determine the temperature reference value under different flow rate regulating valve setting methods.

[0114] When the flow rate regulating valve is set in the first setting mode, that is, one flow rate regulating valve is used as the main regulating valve to uniformly regulate the flow rate of the fluid medium flowing into the test box. The corresponding temperature reference value is determined by obtaining the chamber temperatures of all isolated chambers, calculating the first average temperature of the isolated chambers based on the chamber temperatures of all isolated chambers, and determining the first average temperature as the temperature reference value; so as to be used as a reference for subsequent regulation of the main regulating valve.

[0115] When the flow rate regulating valve is set in the second setting mode, that is, one flow rate regulating valve independently regulates the flow rate of the fluid medium flowing into the corresponding test board. The corresponding temperature reference value is determined as follows: for each flow rate regulating valve, after obtaining the chamber temperatures of all the isolation chambers on the corresponding test board, the second average temperature of the isolation chambers on the test board is calculated, and the second average temperature is determined as the temperature reference value; so as to be used as a reference for subsequent adjustment of the flow rate regulating valves of each branch.

[0116] When the flow rate regulating valve is set in the third setting mode, that is, each flow rate regulating valve independently adjusts the flow rate of the fluid medium flowing into the corresponding isolation chamber. The corresponding temperature reference value is determined as follows: for each flow rate regulating valve, the obtained chamber temperature of the isolation chamber is determined as the temperature reference value; so as to be used as a reference for subsequent adjustment of the flow rate regulating valves of each branch.

[0117] It should be emphasized that the present invention can also be applied to all other compatibility testing and aging testing applications in the IC industry that need to be scaled up.

[0118] like Figure 8As shown, the present invention also provides an electronic device, including:

[0119] The processor 801 can be implemented by a general-purpose central processing unit, a microprocessor, an application-specific integrated circuit, or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application.

[0120] The memory 802 may be implemented in the form of a read-only memory, a static storage device, a dynamic storage device, or a random access memory. The memory 802 may store an operating system and other application programs. When the technical solution provided in the embodiment of this specification is implemented by software or firmware, the relevant program code is stored in the memory 802, and the processor 801 calls and executes the control method of the chip wide temperature test system in the embodiment of this application.

[0121] The input / output interface 803 is used to implement information input and output.

[0122] The communication interface 804 is used to realize the communication interaction between the present apparatus and other devices. The communication can be realized through wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).

[0123] The bus 805 transmits information between various components of the device (eg, the processor 801 , the memory 802 , the input / output interface 803 , and the communication interface 804 ).

[0124] The processor 801 , the memory 802 , the input / output interface 803 and the communication interface 804 are connected to each other in communication within the device via a bus 805 .

[0125] The above is a specific description of the preferred implementation of the present application, but the present application is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions without violating the spirit of the present application. These equivalent deformations or substitutions are all included in the scope defined by the present application.

Claims

1. A chip wide temperature test system, characterized in that: include: A test box, comprising: a plurality of test boards, each of the test boards comprising a test base plate provided with a heat insulation layer, a plurality of test stations being provided in the heat insulation layer; the test stations comprising: a test sub-board, an isolation chamber provided between the test sub-board and the test base plate and provided with a heat insulation film on the bottom surface, a heat exchange tube and a temperature sensor provided in the isolation chamber; the test sub-board comprising: a non-test surface provided with a plurality of non-test elements in the isolation chamber, and a test surface provided with a chip to be tested outside the isolation chamber; The temperature control device comprises: a controller, a high temperature medium box and a low temperature medium box arranged in parallel; a temperature control loop is formed between the high temperature medium box, the low temperature medium box and the heat exchange tube through a delivery pipe and a return pipe; a first delivery valve is arranged between the high temperature medium box and the heat exchange tube, and a second delivery valve is arranged between the low temperature medium box and the heat exchange tube; a flow rate regulating valve is arranged on the delivery pipe; The controller is respectively connected to the temperature sensor, the test box, the first delivery valve, the second delivery valve, and the flow rate regulating valve for communication; The controller is used to: control the opening and closing states of the first delivery valve and the second delivery valve according to the test verification mode performed in the test box, and deliver fluid media of different temperatures to the isolation chamber so that the chamber temperature reaches a target temperature range in which the non-test element can work normally; and control the opening of the flow rate regulating valve according to the acquired chamber temperature to adjust the flow rate of the fluid medium.

2. The chip wide temperature test system according to claim 1, characterized in that: The test surface is provided with a chip test seat, and the chip test seat is used to load the chip to be tested; the isolation chamber is filled with thermal conductive silica gel.

3. The chip wide temperature test system according to claim 1, characterized in that: The temperature control device further comprises: a heater, a refrigerator, a fluid pump, a first feed valve, and a second feed valve which are communicatively connected to the controller; The heater is arranged in the high temperature medium box; The refrigerator is arranged in the low temperature medium box; The fluid pump is arranged on the return pipe; A first feed valve is disposed between the high temperature medium box and the fluid pump; The second feed valve is disposed between the cryogenic medium tank and the fluid pump.

4. The chip wide temperature test system according to claim 3, characterized in that: When the high-temperature medium tank is a hot water tank and the low-temperature medium tank is a cold water tank, the temperature control device further comprises: A water storage tank is arranged on the return pipe between the outlet of the heat exchange tube and the fluid pump; the water storage tank is provided with a water supply port, and the water supply port is connected to an external water source.

5. A control method for a chip wide temperature test system, characterized in that: A controller for a chip wide temperature test system as claimed in any one of claims 1 to 4; The chip wide temperature test system also includes: a test box and a temperature control device, the test box includes: a test sub-board, an isolation chamber, and a temperature sensor; the test sub-board includes: a non-test surface in the isolation chamber; the temperature control device includes: a high-temperature medium box, a low-temperature medium box, a first delivery valve, a second delivery valve, and a flow rate regulating valve; The control method comprises: According to the test verification mode performed in the test box, the opening and closing states of the first delivery valve and the second delivery valve are controlled to deliver fluid media of different temperatures to the isolation chamber so that the chamber temperature reaches a target temperature range in which the non-test element can work normally; According to the acquired chamber temperature, the opening of the flow rate regulating valve is controlled to adjust the flow rate of the fluid medium.

6. The control method of the chip wide temperature test system according to claim 5, characterized in that: The test verification modes include: high temperature verification test and low temperature verification test; the fluid media at different temperatures include: high temperature medium and low temperature medium; According to the test verification mode performed in the test box, the opening and closing states of the first delivery valve and the second delivery valve are controlled to deliver fluid media of different temperatures to the isolation chamber so that the chamber temperature reaches a target temperature range in which the non-test element can work normally, including: When the test verification mode performed in the test box is the low temperature verification test, the first delivery valve is controlled to be opened and the second delivery valve is controlled to be closed, and the high temperature medium in the high temperature medium box is delivered to the heat exchange tube, so that the temperature of the isolation chamber is increased to the target temperature range; When the test verification mode performed in the test box is the high temperature verification test, the first delivery valve is controlled to be closed and the second delivery valve is controlled to be opened, and the low-temperature medium in the low-temperature medium box is delivered to the heat exchange tube to reduce the temperature of the isolation chamber to the target temperature range.

7. The control method of the chip wide temperature test system according to claim 6, characterized in that: According to the acquired chamber temperature, controlling the opening of the flow rate regulating valve to adjust the flow rate of the fluid medium includes: During the low temperature verification test, the flow rate regulating valve is opened, and the opening of the flow rate regulating valve is adjusted to an initial opening value; Acquiring the chamber temperature of each of the isolation chambers in real time through the temperature sensor; determining a temperature reference value according to the chamber temperature of each of the isolation chambers; When the temperature reference value is lower than a first temperature threshold, increasing the opening of the flow rate regulating valve from the initial opening to a first opening value to increase the flow rate of the fluid medium; When the temperature reference value is higher than a second temperature threshold, the opening of the flow rate regulating valve is reduced from the initial opening to a second opening value to reduce the flow rate of the fluid medium; wherein the first temperature threshold is less than the second temperature threshold.

8. The control method of the chip wide temperature test system according to claim 6, characterized in that: According to the acquired chamber temperature, controlling the opening of the flow rate regulating valve to adjust the flow rate of the fluid medium includes: During the high temperature verification test, the flow rate regulating valve is opened, and the opening of the flow rate regulating valve is adjusted to an initial opening value; Acquiring the chamber temperature of each of the isolation chambers in real time through the temperature sensor; determining a temperature reference value according to the chamber temperature of each of the isolation chambers; When the temperature reference value is higher than a third temperature threshold, increasing the opening of the flow rate regulating valve from the initial opening to a third opening value to increase the flow rate of the fluid medium; When the temperature reference value is lower than a fourth temperature threshold, the opening of the flow rate regulating valve is reduced from the initial opening to a fourth opening value to reduce the flow rate of the fluid medium; wherein the third temperature threshold is greater than the fourth temperature threshold.

9. The control method of the chip wide temperature test system according to claim 6, characterized in that: The temperature control device further comprises: a heater, a refrigerator, a fluid pump, a first feed valve and a second feed valve; Before controlling the opening and closing states of the first delivery valve and the second delivery valve according to the test verification mode performed in the test box, the control method further includes: When the test verification mode is the low-temperature verification test, the first feed valve is controlled to be opened and the second feed valve is controlled to be closed, the fluid pump is started to send the fluid medium at room temperature into the high-temperature medium box, and the heater is controlled to heat the fluid medium; when the temperature of the fluid medium rises to the first target temperature, the test box is started to perform the low-temperature verification test on the chip to be tested; When the test verification mode is the high-temperature verification test, the first feed valve is controlled to be closed and the second feed valve is controlled to be opened, the fluid pump is started to send the fluid medium at room temperature into the low-temperature medium box, and the refrigerator is controlled to cool the fluid medium; when the temperature of the fluid medium drops to the second target temperature, the test box is started to perform the high-temperature verification test on the chip to be tested.

10. An electronic device, characterized in that: It includes at least one processor and a memory for communicating with the at least one processor; the memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the control method of the chip wide temperature test system as described in any one of claims 5 to 9.

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