Jig and method for forming lower electrode Emboss

Abstract

The invention provides a jig and method for forming a lower electrode Emboss, the jig comprises a plate body and a plurality of holes vertically arranged on the plate body, the plate body is rectangular, the holes form an array uniformly distributed on the plate body, the thickness of the plate body is uniform, and the surface of the plate body is flat. The method comprises the following steps: acquiring a lower electrode with a flat surface; performing spraying, hole sealing and curing operation to obtain a plurality of hole-sealed and cured Emboss; the jig is placed in the gaps between the Emphs, so that all the Emphs are located in the holes of the jig; the part, exceeding the thickness of the jig, of the Emboss surface is ground; and the jig is taken out, and the lower electrode Emboss with the consistent height is formed. According to the manufacturing method, after the hole-sealed and cured Emboss is formed on the lower electrode, a special grinding jig is adopted to grind the surface of the Emboss to form the lower electrode Emboss with the consistent height, so that the Emboss on the lower electrode is flat and uniform enough, the mura of a product is reduced, and the performance stability and the yield of the product are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electrode plate processing of dry etching equipment, and in particular to a jig and method for forming a lower electrode Emboss. Background Art

[0002] The dry etching machine is a key equipment in the preparation process of liquid crystal panels and semiconductors, and the lower electrode is a key component in the dry etching machine. The lower electrode is also called an electrostatic chuck. Its main function is to carry, adsorb and fix the glass substrate to ensure the stability of the glass substrate during etching inside the vacuum chamber, and cool the back of the glass substrate at the same time. When the etching machine is working, the glass substrate is placed on the surface of the lower electrode and is in direct contact with the dielectric layer of the lower electrode. The DC power supply is connected to the W layer through the DC electrode column on the back of the lower electrode to make it positively charged, and the lower surface of the glass generates induced negative charge. The Coulomb stress generated between the positive and negative charges causes the glass to be adsorbed on the surface of the lower electrode, preventing the substrate from moving during the etching process, ensuring the effectiveness and stability of the etching process, and the upper surface of the glass substrate produces chemical and physical effects with the plasma gas in the etching chamber to etch away the excess film layer to form the required circuit diagram.

[0003] At present, the usage rate of the lower electrode surface of Emboss Type is getting higher and higher in this field. Emboss is a small bump made on the surface of the lower electrode. Its function is to support the glass and provide a circulation channel for the cooling gas on the back. As the panel generation gradually increases to 8.5G and 10.5G, and the high-process LTPS (low-temperature polycrystalline silicon) and AMOLED (flexible organic light-emitting diode) panels are popularized; the etching power of the high generation is high, and the plasma force on the glass substrate increases during etching; the continuous increase in HE gas flow leads to an increase in gas pressure, which may cause HE gas leakage and other reasons. A greater Coulomb force is needed to adsorb the glass substrate, so the working voltage in the vacuum chamber is getting higher and higher. The previous 1000-2000V voltage is generally adjusted to more than 3000V, and even the working voltage of 4.5G and 6G is increased to more than 5000V. According to Coulomb's law F = k×q1×q2÷r 2 When q1 and q2 become very large, a slight change in r value will cause a huge change in F, so the uniformity of r value is very important for vacuum chamber electrodes. If the Emboss on the lower electrode is not flat or uniform, it will cause uneven etching of the entire glass, and in more serious cases, mura will appear visible to the naked eye.

[0004] Therefore, new processes are urgently needed to ensure uniformity and flatness of the Emboss and to improve product performance stability and yield. Summary of the invention

[0005] In view of the shortcomings of the prior art, the present invention provides a jig and method for forming a lower electrode Emboss, which aims to form a sealed and cured Emboss on the lower electrode, and then use a special grinding jig, placed between the gaps of the Emboss, to grind the surface of the Emboss to form a highly consistent lower electrode Emboss, so as to solve the problems of uneven and uneven Emboss in traditional methods.

[0006] In a first aspect, the present invention provides a jig for forming a lower electrode Emboss, comprising a plate body and a plurality of holes vertically opened on the plate body, wherein the size of the plate body is smaller than the inner edge size of a protrusion around the lower electrode, the thickness of the plate body is smaller than the lowest height among the plurality of Embosss, the diameter of the hole is larger than the maximum diameter among the plurality of Embosss, the number of the holes is equivalent to the number of Embosss, and the spacing and position of the holes are in a one-to-one correspondence with the spacing and position of the Emboss.

[0007] As a further improvement of the present invention, the plate body is rectangular in shape, has uniform thickness and a flat surface.

[0008] As a further improvement of the present invention, the holes are configured as an array evenly distributed on the plate body.

[0009] As a further improvement of the present invention, the plate body is made of 200 series stainless steel.

[0010] As a further improvement of the present invention, one side of the plate is 60 cm long, the other side is 52 cm long, and the thickness is 0.04 mm.

[0011] As a further improvement of the present invention, the diameter of the hole is 1 mm, the distance between the hole located at the edge of the plate body and the edge of the plate body is 1 mm, and the distance between the centers of two adjacent holes is 3 mm.

[0012] In a second aspect, the present invention further provides a method for forming a lower electrode Emboss, using the above-mentioned jigs, comprising the following steps:

[0013] Obtaining a lower electrode having a flat surface;

[0014] Through spraying, sealing and curing operations, several Emboss with sealing and curing completed are obtained;

[0015] Place the jig between the gaps of the Emboss so that all the Emboss are located in the holes of the jig;

[0016] Grinding the Emboss surface that exceeds the thickness of the jig;

[0017] The jig is taken out to form a highly consistent lower electrode Emboss.

[0018] As a further improvement of the present invention, the Emboss height of the plurality of sealed holes after curing is greater than the thickness of the fixture.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] The present invention provides a jig and method for forming a lower electrode Emboss. After the Emboss with sealed holes and solidified is formed on the lower electrode, a special grinding jig is placed between the gaps of the Emboss to grind the surface of the Emboss to form a highly consistent lower electrode Emboss, so that the Emboss on the lower electrode is sufficiently flat and uniform, the mura of the product is reduced, and the performance stability and yield of the product are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0022] Figure 1 A schematic diagram of the structure of a lower electrode Emboss fixture disclosed in an embodiment of the present invention;

[0023] Figure 2 The figure is a schematic diagram of the structure of a lower electrode disclosed in an embodiment of the present invention.

[0024] The markings in the accompanying drawings are as follows: 1. Plate, 2. Hole, 3. Plate edge, 4. Lower electrode, 5. Peripheral protrusion, 6. Emboss, 7. Glass, 8. Coating, 9. Base material. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the present invention will combine the accompanying drawings to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments, wherein steps S1, S2... in the embodiments described in the present invention do not limit the only execution steps of the present invention; wherein the various models described in the present invention are not the only limiting methods of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0026] Example 1

[0027] In this embodiment, the overall structure of the lower electrode 4 is as follows: Figure 2 As shown, it is composed of a base material 9, a coating 8, a peripheral protrusion 5 on the coating 8 and an Emboss 6, and is used to carry, absorb and fix the glass 7.

[0028] This embodiment provides a jig for forming a lower electrode Emboss, such as Figure 1 As shown, it can be used for making Emboss 6 in the lower electrode 4. The operation method is to place the jig between the gaps of Emboss 6, grind the surface of Emboss 6, and form a highly consistent lower electrode Emboss, so that the Emboss on the lower electrode is sufficiently flat and uniform, thereby reducing the mura of the product and improving the product performance stability and yield.

[0029] It should be noted that the jig for forming the lower electrode Emboss provided in this embodiment can be used not only in the lower electrode 4 described in this embodiment, but also in various electrodes of other structures, types and uses. The present invention does not limit the application of the jig to which electrode. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0030] Recombination Figure 1 and Figure 2 The jig for forming the lower electrode Emboss provided in this embodiment includes a plate body 1 and a plurality of holes 2 vertically opened on the plate body 1. The size of the plate body 1 is smaller than the inner size of the peripheral protrusion 5 of the lower electrode 4, so that the plate body 1 can be set in the depression formed by the peripheral protrusion 5. The thickness of the plate body 1 is smaller than the lowest height of the plurality of Emboss 6, so that when the plate body 1 is used to grind the surface of the Emboss 6, a grinding margin is left, and a highly consistent Emboss 6 can be formed. The diameter of the hole 2 is larger than the maximum diameter of the plurality of Emboss 6, the number of the holes 2 is equivalent to the number of Emboss 6, and the spacing and position of the holes 2 are in a one-to-one correspondence with the spacing and position of the Emboss 6, so that the plate body 1 can be correspondingly embedded in the Emboss 6.

[0031] In this embodiment, the plate body 1 may preferably be rectangular in shape, with uniform thickness and a flat surface.

[0032] In this embodiment, the holes 2 may preferably be configured as an array evenly distributed on the plate body 1 .

[0033] In this embodiment, the material of the plate body 1 may preferably be 200 series stainless steel, or other materials with high hardness and wear resistance.

[0034] In this embodiment, one side of the plate body 1 is preferably 60 cm long, the other side is preferably 52 cm long, and the thickness is preferably 0.04 mm.

[0035] In this embodiment, the diameter of the hole 2 is preferably 1 mm, the distance between the hole 2 located at the edge 3 of the plate body and the edge 3 of the plate body is preferably 1 mm, and the distance between the centers of two adjacent holes 2 is preferably 3 mm.

[0036] Example 2

[0037] The present invention also provides a method for forming a lower electrode Emboss, using the jig in Example 1, comprising the following steps:

[0038] S1: Obtaining a lower electrode 4 with a flat surface;

[0039] S2: Through spraying, sealing and curing operations, a number of Emboss 6 with sealed and cured holes are obtained;

[0040] In this embodiment, the height of the Emboss 6 after the sealing and curing is greater than the thickness of the jig, so that when the surface of the Emboss 6 is ground using the plate 1, a grinding margin is left, and the Emboss 6 with consistent height can be formed.

[0041] S3: placing the jig between the gaps of the Emboss 6 so that all the Emboss 6 are located in the holes 2 of the jig;

[0042] S4: grinding the Emboss 6 surface exceeding the thickness of the jig;

[0043] S5: Take out the jig to form a highly consistent lower electrode Emboss 6.

[0044] The present invention provides a jig and method for forming a lower electrode Emboss. After the Emboss with sealed holes and solidified is formed on the lower electrode, a special grinding jig is placed between the gaps of the Emboss to grind the surface of the Emboss to form a highly consistent lower electrode Emboss, so that the Emboss on the lower electrode is sufficiently flat and uniform, the mura of the product is reduced, and the performance stability and yield of the product are improved.

Claims

1. A jig for forming a lower electrode Emboss, characterized in that: It includes a plate body and a plurality of holes vertically opened on the plate body. The size of the plate body is smaller than the inner edge size of the protrusion around the lower electrode. The thickness of the plate body is smaller than the lowest height of a plurality of Embosss. The diameter of the hole is larger than the maximum diameter of a plurality of Embosss. The number of the holes is equivalent to the number of Embosss. The spacing and position of the holes are in one-to-one correspondence with the spacing and position of the Emboss.

2. The jig for forming the lower electrode Emboss according to claim 1, characterized in that: The plate body is rectangular in shape, has uniform thickness and a flat surface.

3. The jig for forming the lower electrode Emboss according to claim 1, characterized in that: The holes are configured to form an array uniformly distributed on the plate body.

4. The jig for forming the lower electrode Emboss according to claim 1 or 2, characterized in that: The material of the plate body is 200 series stainless steel.

5. The jig for forming the lower electrode Emboss according to claim 1 or 2, characterized in that: The length of one side of the plate is 60 cm, the length of the other side is 52 cm, and the thickness is 0.04 mm.

6. The jig for forming the lower electrode Emboss according to claim 1 or 3, characterized in that: The diameter of the hole is 1 mm, the distance between the hole located at the edge of the plate body and the edge of the plate body is 1 mm, and the distance between the centers of two adjacent holes is 3 mm.

7. A method for forming a lower electrode Emboss, characterized in that: The jig for forming the lower electrode Emboss according to any one of claims 1 to 6 comprises the following steps: Obtaining a lower electrode having a flat surface; Through spraying, sealing and curing operations, several Emboss with sealing and curing completed are obtained; Place the jig between the gaps of the Emboss so that all the Emboss are located in the holes of the jig; Grinding the Emboss surface that exceeds the thickness of the jig; The jig is taken out to form a highly consistent lower electrode Emboss.

8. The method for forming a lower electrode Emboss according to claim 7, characterized in that: The Emboss height of the plurality of sealed holes after curing is greater than the thickness of the fixture.

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