Substrate processing apparatus and system, method of manufacturing semiconductor device, and recording medium

Abstract

The invention provides a conveying robot capable of reducing the load caused by the setting work of the motion information of the conveying robot set by an operator. The substrate processing apparatus includes: a placement chamber in which a container for accommodating a substrate is placed; a first transfer chamber having a first transfer robot therein, the first transfer robot allowing the substrate to enter and exit between the first transfer chamber and the container; a plurality of processing modules for processing the substrate; a second transfer chamber that transfers the substrate between the first transfer chamber and the processing module and is internally provided with a second transfer robot; a storage unit that stores a plurality of pieces of layout information indicating the arrangement of the placement chamber, the first transfer chamber, the second transfer chamber, and the processing module; and a control unit capable of controlling the operation of the first conveyance robot and the second conveyance robot on the basis of the layout information stored in the storage unit.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus, a substrate processing system, a method for manufacturing a semiconductor device, and a recording medium. Background Art

[0002] Patent Document 1 discloses a technique for controlling the extension and retraction and rotation speed of a substrate transport robot in a semiconductor manufacturing apparatus.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 8-181187 Summary of the invention

[0006] When a substrate processing apparatus is installed in a factory or the like, an operator performs a setting operation of setting the transport operation information of a transport robot that transports the substrate according to the arrangement of each room constituting the apparatus.

[0007] The present disclosure provides a technology capable of reducing the burden imposed on an operator in setting operation information of a transport robot for transporting a substrate.

[0008] According to one aspect of the present disclosure, the following technology is provided, which has:

[0009] A loading chamber for loading a container for accommodating a substrate;

[0010] A first transfer chamber, which has a first transfer robot therein, and the first transfer robot moves a substrate in and out between the first transfer chamber and the container;

[0011] a plurality of processing modules for processing the substrate;

[0012] A second transfer chamber, which performs transfer of the substrate between the first transfer chamber and the processing module and has a second transfer robot inside;

[0013] a storage unit storing a plurality of layout information indicating the arrangement of the loading chamber, the first transfer chamber, the second transfer chamber, and the processing module; and

[0014] A control unit capable of controlling the operations of the first transfer robot and the second transfer robot based on the layout information in the storage unit.

[0015] Effects of the Invention

[0016] According to the present disclosure, it is possible to reduce the burden on an operator in setting operation information of a transport robot for transporting a substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic top view of a substrate processing apparatus according to an embodiment of the present disclosure.

[0018] Figure 2A It is a schematic side view of a substrate processing apparatus according to an embodiment of the present disclosure.

[0019] Figure 2B It is a schematic cross-sectional view showing the structure of a process module included in a substrate processing apparatus according to an embodiment of the present disclosure.

[0020] Figure 3 It is a diagram showing a configuration of a control unit included in a substrate processing apparatus according to an embodiment of the present disclosure.

[0021] Figure 4 This is a setting screen for setting the device configuration of the substrate processing apparatus according to one embodiment of the present disclosure.

[0022] Figure 5 This is a diagram showing the set device configuration.

[0023] Figure 6 This is a diagram showing layout information of the device configuration of the substrate processing device according to one embodiment of the present disclosure.

[0024] Figure 7 It is a diagram showing a flow of setting layout information in the substrate processing apparatus according to one embodiment of the present disclosure.

[0025] Figure 8 The diagram shows the arrangement of a plurality of substrate processing apparatuses included in a substrate processing system according to an embodiment of the present disclosure.

[0026] The reference numerals are described as follows:

[0027] 20Substrate processing device

[0028] 30 processing modules

[0029] 50Second transfer room

[0030] 60 Second transfer robot

[0031] 78 Loading Room

[0032] 80 containers

[0033] 84 First transfer robot

[0034] 86 First Transport Room DETAILED DESCRIPTION

[0035] Hereinafter, one embodiment of the present disclosure will be described with reference to the drawings.

[0036] In addition, the drawings used in the following description are all schematic, and the relationship between the dimensions of the elements on the drawings, the ratio of the elements, etc. are not necessarily consistent with reality. In addition, the relationship between the dimensions of the elements, the ratio of the elements, etc. are not necessarily consistent between multiple drawings.

[0037] <Substrate processing equipment>

[0038] The substrate processing apparatus 20 of the present embodiment is a substrate processing apparatus including a vertical reaction furnace.

[0039] The substrate processing device 20 is as follows Figure 1 , Figure 2A as well as Figure 2B The substrate processing apparatus 20 is shown as having a plurality of processing modules 30 for processing substrates (wafers) W. In the present embodiment, as an example, the substrate processing apparatus 20 has four processing modules 30, but is not limited thereto. For example, the number of processing modules 30 provided in the substrate processing apparatus 20 may be less than three or more than five.

[0040] Four processing modules 30 such as Figure 1 As shown, the four processing modules 30 are arranged in a row in the horizontal direction. The four processing modules 30 can independently process the substrate W. That is, the four processing modules 30 are independently controlled by the control unit 100 described later.

[0041] The substrate W mentioned here includes product substrates, dummy substrates, and monitoring substrates, etc. That is, the substrates W supported by the substrate support table 40 may be product substrates, dummy substrates, and monitoring substrates, or may be supported mixedly.

[0042] Processing module 30 Figure 2B The figure shows a reaction furnace 32 as an example of a processing container. The reaction furnace 32 is located at the upper part of the processing module 30. Substrates W are loaded into the inner side of the reaction furnace 32. Specifically, a substrate support table 40 supporting at least one substrate W is loaded (carried into) the inner side of the reaction furnace 32. In addition, the space inside the reaction furnace 32 is also referred to as a processing chamber for processing substrates W. A gas supply system (omitted in the figure) for supplying processing gas and inert gas, etc. into the reaction furnace 32 is connected to the reaction furnace 32. A predetermined amount of gas is supplied into the reaction furnace 32 by the gas supply system. In addition, an exhaust system (omitted in the figure) for exhausting processing gas and inert gas, etc. from the reaction furnace 32 is connected to the reaction furnace 32. The pressure in the reaction furnace 32 is adjusted by the exhaust system. In addition, a heater (omitted in the figure) as an example of a heating unit is arranged on the periphery of the reaction furnace 32. The temperature in the reaction furnace 32 is adjusted by the heater. In the present embodiment, the gas supply system, the exhaust system, and the heater provided in the processing module 30 are as follows: Figure 3As shown, the temperature control unit 122, the gas flow control unit 124, and the pressure control unit 126 are controlled respectively. The temperature control unit 122, the gas flow control unit 124, and the pressure control unit 126 are controlled by the control unit 100 described later.

[0043] The substrate W loaded into the reaction furnace 32 is heated by the heater in the reaction furnace 32 and processed by the processing gas supplied from the gas supply system. In this way, the film forming process is performed on the substrate W in the reaction furnace 32, that is, in the processing chamber.

[0044] In addition, the processing module 30 includes a preparation chamber 36. The preparation chamber 36 is located at the lower part of the processing module 30. In other words, the preparation chamber 36 is located below the reaction furnace 32. The preparation chamber 36 is connected to the inside of the reaction furnace 32 (i.e., the processing chamber) through the furnace opening 32A of the reaction furnace 32. A lifting device 37 to which a substrate support platform 40 is fixed is provided in the preparation chamber 36. The lifting device 37 moves the substrate support platform 40 fixed to the lifting platform 37A upward together with the lifting platform 37A and loads it into the reaction furnace 32. The peripheral edge of the lifting platform 37A contacts the peripheral edge of the furnace opening 32A of the reaction furnace 32 via a sealing component (not shown), thereby separating the inside of the reaction furnace 32 from the preparation chamber 36. In addition, the lifting device 37 has the function of rotating the lifting platform 37A in the horizontal direction with the vertical direction as the axis. Figure 2B In FIG. 1 , the lifting direction of the lifting platform 37A by the lifting device 37 is indicated by an arrow Z. The lifting direction of the lifting platform 37A in the present embodiment is the same as the vertical direction.

[0045] The processing module 30 includes an entrance 34 for taking in and out the substrate W. The entrance 34 is opened and closed by a gate valve 35. The entrance 34 of this embodiment is sized to allow the substrate W and the telescopic arm 64 and hand 66 of the second transfer robot 60 supporting the substrate W to enter and exit.

[0046] (Second transfer room)

[0047] The substrate processing device 20 is as follows Figure 1 as well as Figure 2BThe second transfer chamber 50 shown in the figure has a second transfer robot 60 inside. The second transfer chamber 50 extends in the direction in which the four processing modules 30 are arranged. In addition, the second transfer chamber 50 is adjacent to each processing module 30 and the first transfer chamber 86. The second transfer chamber 50 is connected to each processing module 30 via the entrance 34 of each processing module 30. The frame 51 constituting the second transfer chamber 50 is respectively fixed to the frame 31 constituting the processing module 30. In the second transfer chamber 50, the cleanliness suitable for the transportation of the substrate W is maintained by the atmospheric environment gas. In addition, the present disclosure is not limited to this structure, and the second transfer chamber 50 can also be connected to an exhaust device and the like to set the second transfer chamber 50 to a vacuum environment gas to maintain the cleanliness suitable for the transportation of the substrate W.

[0048] A transport rail 52 extending in the direction in which the four processing modules 30 are arranged is provided on the floor of the second transport chamber 50. The second transport robot 60 moves along the transport rail 52. In addition, the second transport robot 60 transports the substrate W along the transport rail 52 while holding the substrate W. Hereinafter, the direction in which the second transport robot 60 moves, that is, the direction in which the substrate W is transported, is appropriately referred to as the substrate transport direction. The substrate transport direction is Figure 1 In the direction indicated by the arrow X. In addition, Figure 2A as well as Figure 2B The direction indicated by the arrow UP in the figure indicates that the vertical direction is upward.

[0049] (Second transfer robot)

[0050] The second transfer robot 60 is as follows Figure 1 The structure shown is to move along the transport rail 52 in the second transport chamber 50. In addition, the second transport robot 60 is a device that can move while holding the substrate W. The second transport robot 60 moves between the processing module 30 that is controlled by the control unit 100 and is the target (specified) and the substrate delivery position D. In addition, the substrate delivery position D is a position where the substrate W is delivered between the first transport robot 84 and the second transport robot 60. Figure 1 The position indicated by the double-dotted line in Figure 1 The substrate transfer position D shown in FIG. 1 is an example, and it is preferable to set an optimal position by using the respective configurations of the first transfer robot 84 and the second transfer robot 60 and the device conditions.

[0051] The second transfer robot 60 is configured to transfer the substrate W between the first transfer chamber 86 and the processing module 30. Figure 1 as well as Figure 2A As shown, it includes a conveying platform 62 , a telescopic arm 64 , and a hand 66 .

[0052] The conveying platform 62 is a platform that moves on the conveying rail 52. A driving unit (not shown) for moving the conveying platform 62 in a conveying direction along the conveying rail 52 is provided inside the conveying platform 62.

[0053] The telescopic arm portion 64 is provided on the conveying platform 62 so as to be rotatable in the horizontal direction. The telescopic arm portion 64 is configured to be telescopic.

[0054] The hand 66 is provided at the front end of the telescopic arm 64. The substrate W is held by the hand 66. Specifically, the hand 66 holds the substrate W by supporting the substrate W from below.

[0055] The second transfer robot 60 has a lifting device (not shown) that can lift the telescopic arm 64 relative to the transfer platform 62. The telescopic arm 64 is lifted relative to the transfer platform 62 by the lifting device.

[0056] The second transfer robot 60 is configured to extend the telescopic arm 64 toward the substrate support table 40 and to deliver the substrate W held by the hand 66 to the substrate support table 40 or to receive a processed substrate W from the substrate support table 40 .

[0057] The second transport robot 60 controls the operation of delivering the substrate W between the second transport robot 60 and the substrate support table 40, and the operation of delivering the substrate W between the second transport robot 60 and the first transport robot 84, by the transport control unit 110. Specifically, the second transport robot 60 controls the movement of the transport table 62, the extension and retraction of the telescopic arm 64, and the lifting and lowering of the telescopic arm 64 by the transport control unit 110. In addition, the control unit 100 controls which of the four process modules 30 the second transport robot 60 delivers the substrate W to.

[0058] (Storage Room)

[0059] The substrate processing device 20 is as follows Figure 1 The loading chamber 78 is shown to have a loading port 82 on which a container 80 is loaded.

[0060] The container 80 is a container that can accommodate at least one substrate W and can be delivered to the outside. As an example, a FOUP (Front Opening Unified Pod) is cited, but it is not limited to this. In addition, in each container 80, as a substrate W, a product substrate, a dummy substrate, and a monitoring substrate are accommodated.

[0061] The loading port 82 is a pedestal on which the container 80 can be placed. As an example, in the present embodiment, in a plan view of the substrate processing apparatus 20, four loading ports 82 are arranged in a row in a direction perpendicular to the substrate conveying direction, but the present invention is not limited thereto. In addition, the number of loading ports 82 may be more than four or less than four.

[0062] The container 80 and the loading port 82 are arranged in the loading chamber 78 . The loading chamber 78 is constituted by a frame body 79 .

[0063] (First transfer room)

[0064] The substrate processing device 20 is as follows Figure 1 The first transfer chamber 86 is shown as having a first transfer robot 84 therein. The first transfer chamber 86 extends in a direction perpendicular to the substrate transfer direction in a plan view. In addition, the direction perpendicular to the substrate transfer direction is appropriately referred to as the substrate transfer direction. Figure 1 In the figure, arrow Y is used to indicate the direction of substrate intersection.

[0065] The first transfer chamber 86 is located between the loading chamber 78 and the processing module 30. One side of the frame 87 constituting the first transfer chamber 86 is connected to the frame 31 of the processing module 30. On the other side of the frame 87, entrances and exits (not shown in the figure) for the substrate W are provided at positions corresponding to the four loading ports 82, respectively. These entrances and exits are closed by gates (not shown in the figure). In addition, the first transfer chamber 86 uses atmospheric environment gas to maintain a cleanliness suitable for the transportation of the substrate W. In addition, the present disclosure is not limited to this structure, and an exhaust device or the like may be connected to the first transfer chamber 86, and a vacuum environment gas may be set in the first transfer chamber 86 to maintain a cleanliness suitable for the transportation of the substrate W.

[0066] (First transfer robot)

[0067] The first transfer robot 84 is as follows Figure 1 The first transfer robot 84 is configured to move along the rails 88 in the first transfer chamber 86. The first transfer robot 84 is a device capable of moving while holding the substrate W. The first transfer robot 84 is controlled by the control unit 100 to move between the target (specified) container 80 and the substrate transfer position D.

[0068] The first transfer robot 84 is configured to be able to transfer the substrate W between it and the container 80 placed on the load port 82. In addition, the first transfer robot 84 is configured to be able to directly transfer the substrate W between it and the second transfer robot 60. Specifically, the first transfer robot 84 is configured to be able to transfer the substrate W between it and the container 80 placed on the load port 82. Figure 1 as well as Figure 2A The device shown has a moving platform 85, a telescopic arm 84A, and a hand 84B.

[0069] The moving table 85 is a table that moves on the rails 88. A driving unit (not shown) for moving the moving table 85 along the rails 88 in the substrate transfer direction is provided inside the moving table 85.

[0070] The telescopic arm portion 84A is provided rotatably in the horizontal direction on the moving platform 85. The telescopic arm portion 84A is configured to be telescopic.

[0071] The hand 84B is provided at the front end of the telescopic arm 84A. The substrate W is held by the hand 84B. Specifically, the hand 84B holds the substrate W by supporting the substrate W from below.

[0072] The first transfer robot 84 also includes a lifting device (not shown) capable of lifting and lowering the telescopic arm 84A relative to the moving platform 85. The telescopic arm 84A is lifted and lowered relative to the moving platform 85 by the lifting device.

[0073] The first transfer robot 84 is configured to be able to extend a telescopic arm 84A toward the container 80 and to use a hand 84B to take out a substrate W from the container 80 or to place a processed substrate W into the container 80 .

[0074] The first transport robot 84 controls the operation of taking the substrate W in and out between the first transport robot 84 and the container 80 placed on the load port 82, and the operation of transferring the substrate W between the first transport robot 84 and the second transport robot 60, by the transport control unit 110. Specifically, the first transport robot 84 controls the movement of the moving table 85, the extension and retraction of the telescopic arm 84A, and the lifting and lowering of the telescopic arm 84A, by the transport control unit 110. In addition, the first transport robot 84 controls which container 80 among the four containers 80 the substrate W is to be taken in and out by the control unit 100.

[0075] In the substrate processing apparatus 20 of this embodiment, as Figure 1 As shown, when the loading chamber 78, the first transfer chamber 86, the second transfer chamber 50, and the processing module 30 are arranged at the front of the maintenance area M, the first transfer chamber 86 is arranged behind the loading chamber 78 in parallel with the loading chamber 78, the second transfer chamber 50 is arranged behind the first transfer chamber 86 orthogonally to the first transfer chamber 86, and the processing module 30 is arranged behind the first transfer chamber 86 in parallel with the second transfer chamber 50.

[0076] (Control Department)

[0077] The substrate processing device 20 is as follows Figure 3The controller 100 is shown as a computer including a CPU (Central Processing Unit) 101A, a RAM (Random Access Memory) 101B, a storage unit 101C, and an I / O port 101D.

[0078] RAM 101B, storage unit 101C, and I / O port 101D are configured to exchange data with CPU 101A via internal bus 101E. An input / output device 102, such as a touch panel, is connected to the control unit 100. The input / output device 102 is an example of an operation unit disclosed in the present invention. In addition, an external communication unit 104 for communicating with a host device is connected to the control unit 100, for example.

[0079] The storage unit 101C is composed of, for example, a flash memory, an HDD (Hard Disk Drive), etc. A control program for controlling the operation of the substrate processing device, or a process recipe that records the steps or conditions of the substrate processing described later, etc., is readable and stored in the storage unit 101C. The process recipe enables the control unit 100 to execute each step in the substrate processing process described later, and combines them in a manner that can obtain a specified result, and functions as a program. Hereinafter, the process recipe or control program, etc. are collectively referred to as a program. In addition, the process recipe is also referred to as a process only. In this specification, the term "program" is used in situations including only a process unit, only a control program unit, or both. RAM101B is configured as a memory area (workpiece area) that temporarily holds programs or data read by CPU101A.

[0080] The I / O port 101D is connected to a transport control unit 110 and a plurality of process control units 120. The transport control unit 110 is configured to control the transport of the substrate W. The process control unit 120 is configured to control the film forming process of the substrate W. In the present embodiment, since four process modules 30 are provided, four process control units 120 are provided corresponding to the respective process modules 30. Thus, the film forming process can be performed independently for each process module 30.

[0081] The CPU 101A is configured to read and execute the control program from the storage unit 101C, and to read the recipe from the storage unit 101C in accordance with the input of the operation command from the input / output device 102. The CPU 101A is configured to control the transport control unit 110 to control the transport operation of the first transport robot 84, the lifting device 37, and the second transport robot 60 for the substrate W, the opening and closing operation of the gate valve 35 and the shutter, the positioning operation of the load port 82, etc., in accordance with the contents of the read recipe.

[0082] In addition, the CPU 101A is configured to allow the process control unit 120 to control the temperature control unit 122, the gas flow control unit 124, and the pressure control unit 126 in accordance with the contents of the read recipe. The temperature control unit 122 is configured to control the temperature adjustment operation of the heater that heats the inside of the reaction furnace 32. The gas flow control unit 124 is configured to control the flow adjustment operation of the gas supplied to the reaction furnace 32. The pressure control unit 126 is configured to control the pressure adjustment operation in the reaction furnace 32.

[0083] The control unit 100 can be configured by installing the above-mentioned program stored in an external storage unit (for example, a disk such as a hard disk, an optical disk such as a CD, an optical magneto-optical disk such as an MO, a semiconductor memory such as a USB memory) 103 by a computer. The storage unit 101C or the external storage unit 103 is configured as a recording medium that can be read by a computer. Hereinafter, they will be collectively referred to as recording media. The term recording medium is used in this specification in the case where only the storage unit 101C alone is included, only the external storage unit 103 alone is included, or both are included. In addition, the program can be provided to the computer without using the external storage unit 103, but using communication means such as the Internet or a dedicated line.

[0084] In addition, the storage unit 101C stores a plurality of layout information indicating the arrangement of the loading chamber 78, the first transfer chamber 86, the second transfer chamber 50, and the processing modules 30. Specifically, the plurality of layout information includes first layout information indicating that a plurality of (four in the present embodiment) processing modules 30 are arranged in such a manner that each entrance 34 faces a first direction orthogonal to the substrate transfer direction in the second transfer chamber 50 when the substrate processing apparatus 20 is viewed from above, and second layout information indicating that a plurality of processing modules 30 are arranged in such a manner that each entrance 34 faces a second direction different from the first direction with respect to the substrate transfer direction when the substrate processing apparatus 20 is viewed from above. In addition, in the present embodiment, the first direction and the second direction are opposite directions to each other.

[0085] Furthermore, the storage unit 101C stores a plurality of pieces of transport operation information of the first transport robot 84 and a plurality of pieces of transport operation information of the second transport robot 60 in association with each of the plurality of pieces of layout information.

[0086] The transport operation information of the second transport robot 60 includes information on the transfer direction of the substrate W between the second transport robot 60 and the inside of the process module 30 via the entrance 34 of the process module 30. Specifically, it includes information on the extension direction (the same direction as the transfer direction) of the telescopic arm 64 when transferring the substrate W.

[0087] In addition, the transporting action information of the second transport robot 60 includes the position information of the plurality of processing modules 30. In addition, the position information of the plurality of processing modules 30 may be information related to the distance from the reference position B of the second transport robot 60 to the delivery position where the substrate W is delivered to each processing module 30. In addition, in the present embodiment, the reference position B of the second transport robot 60 is set to the position of the second transport robot 60 that moves on the transport rail 52 closest to the first transport chamber 86, but the present disclosure is not limited thereto. The second transport robot 60 moves on the transport rail 52 based on the position information of the processing module 30 specified by the control unit 100, thereby transporting the substrate W to the specified processing module 30.

[0088] The control unit 100 is configured to be able to control the actions of the first conveying robot 84 and the second conveying robot 60 based on the layout information stored in the storage unit 101C. Specifically, the control unit 100 is configured to have a conveyance control unit 110 that controls the actions of the first conveying robot 84 and the second conveying robot 60, and the actions of the first conveying robot 84 and the second conveying robot 60 are controlled by the conveyance control unit 110. More specifically, the control unit 100 is configured to be able to obtain conveyance action information associated with the selected layout information among the plurality of layout information, and send (expand) the conveyance action information to the conveyance control unit 110, thereby controlling the actions of the first conveying robot 84 and the second conveying robot 60.

[0089] In addition, the input / output device 102 is configured to be able to set information for selecting one layout information from a plurality of layout information. Figure 4 In the system parameter setting screen of the device configuration of the substrate processing apparatus 20 shown, the number of processing modules is input (or selected) to set the configuration of the second transfer chamber relative to the processing modules. In addition, the configuration of the second transfer chamber relative to the processing modules mentioned here refers to the right side configuration or the left side configuration when the loading chamber 78 of the substrate processing apparatus 20 is set to the front. The control unit 100 is configured to select a layout information from a plurality of layout information based on the information related to the number of processing modules and the configuration of the second transfer chamber relative to the processing modules, and the selected layout information is sent to the transport control unit 110.

[0090] Figure 5 FIG. 1 shows layout information selected by the control unit 100 based on information input from the input / output device 102. Figure 5 In the example of , the first layout information is selected as the layout information.

[0091] exist Figure 6, an example of the transport motion information of the first transport robot 84 and the transport motion information of the second transport robot 60 associated with the layout information is shown in FIG. The placement table position information of the first transport robot 84 is the position information of the container 80 placed on each loading port 82. The substrate delivery position information of the first transport robot 84 is the information about the substrate delivery position D where the substrate W is delivered to the second transport robot 60. The arm rotation information of the first transport robot 84 is the information about the telescopic motion of the telescopic arm 84A. The support part lifting information of the first transport robot 84 is the information about the lifting of the support part (not shown) that supports the telescopic arm 84A so that the telescopic arm 84A can rotate in the horizontal direction. In addition, the substrate delivery position information of the second transport robot 60 is the information about the substrate delivery position D where the substrate W is delivered to the first transport robot 84. The arm rotation information of the second transport robot 60 is the information about the telescopic motion of the telescopic arm 64. The support portion lifting information of the second transfer robot 60 is information on lifting of a support portion (not shown) that supports the telescopic arm 64 so as to be rotatable in the horizontal direction. The process module position information of the second transfer robot 60 is position information of each process module 30 .

[0092] Furthermore, when the loading chamber 78, the first transfer chamber 86, the second transfer chamber 50, and the processing module 30 are electrically connected, the control unit 100 can select one layout information from a plurality of layout information. In other words, when a certain device configuration is not electrically connected, the control unit 100 cannot select the layout information, thereby preventing the startup due to poor connection.

[0093] In addition, the layout information is set in advance. When any one of the loading chamber 78, the first transfer chamber 86, the second transfer chamber 50, and the processing module 30 is not electrically connected, the control unit 100 can also determine that the pre-set layout information and the device configuration are inconsistent and prevent startup.

[0094] In addition, the control unit 100 is configured to be able to control the transport control unit 110 in accordance with the processing of the substrate W.

[0095] Next, the initial setting when the substrate processing apparatus 20 is installed in a factory or the like is described. First, the various devices (loading chamber 78, first transfer chamber 86, second transfer chamber 50, and a plurality of processing modules 30) constituting the substrate processing apparatus 20 are installed in the factory and electrically connected to each other. After the connection of the various devices constituting the substrate processing apparatus 20 is completed, the substrate processing apparatus 20 is started. When the substrate processing apparatus 20 is started, as shown in FIG. Figure 7 As shown, the control unit 100 starts (step S100). When the control unit 100 starts, the display Figure 4The system parameter setting screen is shown. The operator sets various parameters while confirming the system parameter setting screen (step S102). When the operator sets various parameters, the control unit 100 selects one layout information from a plurality of layout information (step S104). Here, when the operator sets the transport layout to LEFT (left), the control unit 100 moves to step S106. On the other hand, when the operator sets the transport layout to RIGHT (right), the control unit 100 moves to step S108. In step S106, the control unit 100 selects the first layout information as the layout information. On the other hand, in step S108, the control unit 100 selects the second layout information as the layout information. Then, in step S110, the layout information selected by the control unit 100 is sent to (expanded to) the transport control unit 110. The transport control unit 110 controls the actions of the first transport robot 84 and the second transport robot 60 based on each transport action information associated with the sent layout information.

[0096] <Method for manufacturing semiconductor device>

[0097] Next, a method for manufacturing a semiconductor device using the substrate processing apparatus 20 according to an embodiment of the present disclosure, that is, a processing procedure of a substrate W will be described.

[0098] When the substrate processing apparatus 20 is started, the control unit 100 selects layout information based on various set parameters and sends each transport operation information of the first transport robot 84 and the second transport robot 60 to the transport control unit 110. The transport control unit 110 controls the operation of the first transport robot 84 and the second transport robot 60 based on each transport operation information sent.

[0099] When a command for processing a substrate is input, the transport control unit 110 operates the first transport robot 84 and the second transport robot 60 in accordance with a request from the control unit 100 .

[0100] First, the substrate W is taken out from the container 80 placed in the loading chamber 78 using the first transfer robot 84 in the first transfer chamber 86 .

[0101] Next, the first transfer robot 84 is moved to transfer the substrate W to the second transfer robot 60 in the second transfer chamber 50 .

[0102] The second transfer robot 60 that has received the substrate W moves toward the designated process module 30 and delivers the substrate W to the substrate support table 40 .

[0103] The substrate support table 40 receiving the substrate W is raised and loaded into the reaction furnace 32. The substrate W loaded into the reaction furnace 32 is subjected to a film forming process.

[0104] By performing the film formation process on the substrate W in this manner, a semiconductor device is manufactured.

[0105] Next, the effects of this embodiment will be described.

[0106] In the present embodiment, the actions of the first transfer robot 84 and the second transfer robot 60 are controlled based on a plurality of layout information indicating the configuration of the loading chamber 78, the first transfer chamber 86, the second transfer chamber 50, and the processing module 30 stored in the storage unit, thereby reducing the burden of setting the transfer action information of the transfer robot for transferring the substrate W set by the operator. In particular, the burden of the operator during the initial setting just after the substrate processing apparatus 20 is installed in the factory can be reduced. In addition, when the processing module 30 is added to the substrate processing apparatus 20, the burden of the operator during the setting can also be reduced.

[0107] In addition, in this embodiment, the loading chamber 78 is arranged in front of the maintenance area M, and based on this, the first transfer chamber 86, the second transfer chamber 50, and the processing module 30 are arranged. As a result, the maintenance area M can be shared when two substrate processing devices 20 are set up in the factory, which can reduce the installation space.

[0108] In addition, in this embodiment, the layout information includes the first layout information and the second layout information, so the burden on the operator caused by the layout setting work that matches the device configuration can be reduced. In addition, it is also possible to prevent the operator from making erroneous operations.

[0109] In addition, when a plurality of substrate processing apparatuses 20 are arranged side by side in a semiconductor factory, a maintenance area M for performing maintenance work is provided for each apparatus. Figure 8 By changing the device layout as shown, the maintenance area M can be shared among the substrate processing devices 20, the device installation area can be reduced, and the number of devices installed can be ensured. Figure 8 In the embodiment, a plurality of (in Figure 8 Specifically, the maintenance area M is set in the substrate processing device 20 on the side opposite to the second transfer chamber 50 side of the processing module 30. Figure 8 The figure shows a plurality of substrate processing apparatuses 20 arranged in such a manner as to share the maintenance area M with each other.

[0110] In addition, in the present embodiment, the storage unit 101C stores multiple conveying action information of the first conveying robot 84 and the conveying action information of the second conveying robot 60 in association with each of the multiple layout information. Therefore, when the layout information is determined, the conveying action information of the first conveying robot 84 and the conveying action information of the second conveying robot 60 are automatically expanded to control the actions of the first conveying robot 84 and the second conveying robot 60.

[0111] In addition, in the present embodiment, the control unit 100 selects and expands one piece of layout information from a plurality of layout information by inputting various parameters of the system parameter setting screen from the input / output device 102. Therefore, the burden on the operator can be reduced compared to a case where the operator sets the transport operation information of the first transport robot 84 and the transport operation information of the second transport robot 60 according to the device configuration.

[0112] In addition, in the present embodiment, when layout information is selected by the control unit 100, the selected layout information is sent to (developed to) the transport control unit 110. Therefore, the burden on the operator can be reduced, and the warm-up operation time can also be shortened.

[0113] In addition, in this embodiment, the transport action information of the second transport robot 60 includes information on the transfer direction of the substrate W between the second transport robot 60 and the inside of the processing module 30 via the entrance and exit 34, thereby reducing the operator's operating time for performing settings matching the device layout each time.

[0114] In addition, in the present embodiment, since the transport operation information of the second transport robot 60 includes the position information of the plurality of process modules 30 , the distance to the process module 30 that is the target of the second transport robot 60 can be easily obtained.

[0115] In addition, in the present embodiment, the second transfer robot 60 moves toward a designated process module on the transfer rail based on the position information of the process module 30 , and thus can accurately and quickly move to the target process module.

[0116] In addition, in the present embodiment, the arm of the second transport robot 60 transfers the substrate W between the second transport robot 60 and the processing module 30. The movement of the arm is also included in the transport movement information, so the operator's work time for setting each time in accordance with the device layout can be reduced. In addition, it is possible to prevent the operator from making erroneous settings.

[0117] In addition, in the present embodiment, the telescopic arm 84A of the first transport robot 84 moves the substrate W in and out between the first transport robot 84 and the container 80. The movement of the arm is also included in the transport movement information, so the operator's work time for setting each time to match the device layout can be reduced. In addition, it is also possible to prevent the operator from making erroneous settings.

[0118] Furthermore, in the present embodiment, by directly transferring the substrate W between the first transfer robot 84 and the second transfer robot 60 , an area for temporarily placing the substrate W is not required, and the device configuration can be simplified.

[0119] In addition, in the present embodiment, when the loading chamber 78, the first transfer chamber 86, the second transfer chamber 50, and the processing module 30 are connected, one layout information can be selected from a plurality of layout information, so that reliable transfer operation information can be developed.

[0120] In the above-mentioned form, an example of forming a film using a batch-type substrate processing device that processes a plurality of substrates at a time is described. The present disclosure is not limited to the above-mentioned form, and can also be appropriately applied to the case where a film is formed using a single-type substrate processing device that processes one or more substrates at a time. In addition, in the above-mentioned form, an example of forming a film using a substrate processing device having a hot-wall type processing furnace is described. The present disclosure is not limited to the above-mentioned form, and can also be appropriately applied to the case where a film is formed using a substrate processing device having a cold-wall type processing furnace.

[0121] When these substrate processing apparatuses are used, each process can be performed using the same process steps and process conditions as those of the above-mentioned embodiment or modification examples, and the same effects as those of the above-mentioned embodiment or modification examples can be obtained.

[0122] <Other embodiments>

[0123] The present disclosure is not limited to the above-mentioned embodiments, and various changes can be made without departing from the main purpose thereof. In the above-mentioned embodiments, the substrate W is transported by the first transport robot 84 and the second transport robot 60, but the present disclosure is not limited to this. For example, the first transport robot 84 and the second transport robot 60 can also adopt the structure of transferring the substrate W from the container 80 to other sealed containers to transport the sealed container, or can adopt the structure of transporting the container 80. The same effect as the above-mentioned form can be obtained in this form. In addition, in this form, multiple substrates W can be transported to the processing module at the same time in the second transport robot 60, which has the effect of shortening the transport time of the substrate W.

[0124] The above-mentioned forms or modified examples can be used in combination as appropriate. The processing steps and processing conditions at this time can be, for example, the same as the processing steps and processing conditions of the above-mentioned forms or modified examples.

Claims

1. A substrate processing device, characterized in that: have: A loading chamber for loading a container for accommodating a substrate; A first transfer chamber, which has a first transfer robot therein, and the first transfer robot moves a substrate in and out between the first transfer chamber and the container; a plurality of processing modules for processing the substrate; A second transfer chamber, which performs transfer of the substrate between the first transfer chamber and the processing module and has a second transfer robot inside; a storage unit storing a plurality of layout information indicating the arrangement of the loading chamber, the first transfer chamber, the second transfer chamber, and the processing module; as well as A control unit capable of controlling the operations of the first transfer robot and the second transfer robot based on the layout information in the storage unit.

2. The substrate processing device according to claim 1, characterized in that: The loading chamber, the first transfer chamber, the second transfer chamber, and the processing module are arranged in a manner that when the loading chamber is arranged in front of the maintenance area, The first transfer chamber is arranged in parallel with the loading chamber and at the rear of the loading chamber. The second transfer chamber is arranged at the rear of the first transfer chamber so as to be orthogonal to the first transfer chamber. The processing module is arranged in parallel with the second transfer chamber and behind the first transfer chamber.

3. The substrate processing device according to claim 1, characterized in that: Each of the plurality of processing modules is provided with an entrance and exit for the substrate. The layout information includes first layout information and second layout information, the first layout information refers to information that the multiple processing modules are arranged in a manner such that each of the entrances and exits are oriented toward a first direction orthogonal to the substrate conveying direction when viewed from above, and the second layout information refers to information that the multiple processing modules are arranged in a manner such that each of the entrances and exits are oriented toward a second direction different from the first direction relative to the substrate conveying direction when viewed from above.

4. The substrate processing device according to claim 3, characterized in that: The first direction and the second direction are opposite to each other.

5. The substrate processing apparatus according to claim 1, wherein: The storage unit stores a plurality of transport operation information of the first transport robot and a plurality of transport operation information of the second transport robot in association with each of the plurality of layout information.

6. The substrate processing device according to claim 5, characterized in that: An operation unit is provided, and the operation unit is capable of setting information for selecting one piece of layout information from the plurality of pieces of layout information.

7. The substrate processing device according to claim 6, characterized in that: A transport control unit is provided, the transport control unit controls the actions of the first transport robot and the second transport robot, The control unit can control the operations of the first and second transfer robots by acquiring the transfer operation information associated with the selected layout information among the plurality of layout information and transmitting the information to the transfer control unit.

8. The substrate processing device according to claim 5, characterized in that: Each of the plurality of processing modules is provided with an entrance and exit for the substrate. The transport operation information of the second transport robot includes information on a transfer direction of the substrate between the entrance and the inside of the process module.

9. The substrate processing device according to claim 5, characterized in that: The transport operation information of the second transport robot includes position information of the plurality of process modules.

10. The substrate processing apparatus according to claim 9, wherein: The second transfer chamber is provided with a transfer rail. The second transfer robot transfers the substrate by moving on the transfer rail toward the designated processing module based on the position information.

11. The substrate processing apparatus according to claim 1, wherein: The second transfer robot has an arm that can rotate and extend in the horizontal direction. The substrate is transferred between the arm and the processing module.

12. The substrate processing apparatus according to claim 1, wherein: The first transfer robot has an arm that can rotate and extend in the horizontal direction. The substrate is inserted into and removed from between the arm and the container.

13. The substrate processing apparatus according to claim 1, wherein: The first transfer robot and the second transfer robot directly transfer the substrate to and from each other.

14. The substrate processing apparatus according to claim 1, wherein: When the loading chamber, the first transfer chamber, the second transfer chamber, and the processing module are connected, one piece of layout information can be selected from a plurality of pieces of layout information.

15. A substrate processing system, characterized in that: The device is configured to include a plurality of substrate processing apparatuses according to claim 1, and to share a maintenance area included in the plurality of substrate processing apparatuses.

16. The substrate processing system according to claim 15, characterized in that: The maintenance area is provided on a side of the plurality of process modules opposite to the second transfer chamber side.

17. A method for manufacturing a semiconductor device, characterized in that: include: A step of storing layout information, wherein the layout information indicates the configuration of a first transfer chamber, a second transfer chamber, and a processing module, wherein the first transfer chamber, the second transfer chamber, and the processing module are configured to enable the first transfer robot of the first transfer chamber to take out the substrate from a loading chamber where a container for accommodating the substrate is loaded, deliver the substrate to a second transfer robot of the second transfer chamber, and transfer the substrate received by the second transfer robot to a plurality of processing modules for processing the substrate; a step of controlling the operations of the first transfer robot and the second transfer robot based on the layout information; and A step of processing the substrate received from the second transfer robot using the processing module.

18. A computer-readable recording medium, characterized in that: A program is recorded which causes the substrate processing apparatus to execute the following steps through a computer: storing layout information, the layout information indicating the configuration of the first transfer chamber, the second transfer chamber, and the processing module, the first transfer chamber, the second transfer chamber, and the processing module being configured to enable the first transfer robot of the first transfer chamber to take out the substrate from the loading chamber where a container for accommodating the substrate is loaded, delivering the substrate to the second transfer robot of the second transfer chamber, and transferring the substrate received by the second transfer robot to the plurality of processing modules for processing the substrate; controlling the actions of the first transfer robot and the second transfer robot based on the layout information; as well as The substrate received from the second transfer robot is processed by the processing module.

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