Circuit module, radio frequency front-end module and communication equipment
Through the design of shared power modules and isolation components, the problem of high power costs in traditional RF front-end modules is solved, and the isolation performance and cost reduction between functional devices are improved.
Patent Information
- Application Number
- CN202411267592.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-11
- Publication Date
- 2025-01-03
AI Technical Summary
Each functional device in a traditional RF front-end module uses a separate power chip independently, resulting in high production costs.
By sharing a power supply to multiple functional devices and setting up isolation components between functional devices, reducing device redundancy and cost while improving isolation performance.
This reduces production costs, improves the isolation performance between functional devices, and achieves the isolation effect of power coupling without affecting performance.
Smart Images
Figure CN119254277A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of mobile communication technology, and in particular to a circuit module, a radio frequency front-end module and a communication device. Background Art
[0002] With the development of science and technology and the continuous progress of society, the trend of miniaturization and high performance of RF communication equipment is accelerating, which puts higher requirements on RF front-end design. In mobile communication applications, due to the diversity of RF frequency bands in different countries and regions and different application scenarios, multi-input and multi-output RF front-end modules that support carrier aggregation have emerged. In traditional RF front-end modules, each functional device is powered by a separate power chip, which has the disadvantage of high production cost. Summary of the invention
[0003] Based on this, it is necessary to provide a circuit module, a radio frequency front-end module and a communication device that can reduce the manufacturing cost in order to solve the above problems.
[0004] A first aspect of the present application provides a circuit module, including:
[0005] Power module;
[0006] More than two functional devices, the input end of each functional device is connected to the corresponding input port, and the output end of each functional device is connected to the corresponding output port; the functional device includes at least one of a radio frequency device, an analog device and a digital device;
[0007] There are more than two isolation components, each of which is connected in sequence to the output end of the power module, and the power ends of each functional device are connected through a corresponding isolation component.
[0008] In one of the embodiments, the RF device includes at least one of a RF amplifier, a mixer and a phase shifter, and / or the power module is a PMU.
[0009] In one embodiment, the isolation component includes an isolation inductor, and the isolation inductors in each isolation component are connected in series in sequence and connected to the output end of the power module, and the power ends of each functional device are connected through a corresponding isolation inductor.
[0010] In one embodiment, the isolation component also includes a filter capacitor. In each of the isolation components, the first end of the isolation inductor is connected to the second end of the isolation inductor in the previous isolation component or the output end of the power module, the first end of the filter capacitor is connected to the second end of the corresponding isolation inductor, and the second end of the filter capacitor is grounded; the capacitance value of the filter capacitor is a capacitance value within an allowable error range for the difference between the key performance set for the corresponding functional device and the common power supply condition.
[0011] In one embodiment, the functional device is a radio frequency amplifier; the capacitance value of the filter capacitor is a capacitance value that keeps the difference between the gain and output return loss of the radio frequency amplifier connected to the second end of the corresponding isolation inductor and the common power supply condition within an allowable error range.
[0012] In one embodiment, the filter capacitor is an on-chip capacitor or a surface mount capacitor.
[0013] In one embodiment, the isolation inductor is an on-chip inductor, a substrate-wound inductor or a chip inductor.
[0014] In one embodiment, the circuit module further includes an output filter capacitor, a first end of the output filter capacitor is connected to the output end of the power module, and a second end of the output filter capacitor is grounded.
[0015] A second aspect of the present application provides a radio frequency front-end module, comprising the above-mentioned circuit module.
[0016] A third aspect of the present application provides a communication device, including a radio frequency antenna and the above-mentioned radio frequency front-end module.
[0017] The above-mentioned circuit module, RF front-end module and communication equipment connect the isolation components in sequence and then connect them to the output end of the power module, and the power ends of each functional device are connected through a corresponding isolation component. By sharing a power module to power each functional device, the device redundancy and high production cost caused by the independent power supply of each functional device are reduced. Isolation components are also set between the power ends of each functional device, which improves the isolation performance between the functional devices without affecting the performance of the functional devices. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 is a structural block diagram of a circuit module in an embodiment;
[0019] Figure 2 is a structural schematic diagram of a circuit module in an embodiment;
[0020] Figure 3 This is a structural example diagram of a circuit module in an embodiment;
[0021] Figure 4 1 is a comparison diagram of output signal isolation curves of a circuit module in an embodiment. DETAILED DESCRIPTION
[0022] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0024] It is understood that the terms "first", "second", etc. used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.
[0025] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if the connected circuits, modules, units, etc. have electrical signals or data transmission between each other.
[0026] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" etc. specify the presence of stated features, wholes, operations, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, operations, components, parts or combinations thereof.
[0027] In one embodiment, Figure 1 As shown, a circuit module is provided, including a power supply module 110, more than two functional devices 120 and more than two isolation components 130, the input end of each functional device 120 is connected to the corresponding input port, and the output end of each functional device 120 is connected to the corresponding output port; each isolation component 130 is connected in sequence and connected to the output end of the power supply module 110, and the power supply ends of each functional device 120 are connected through a corresponding isolation component 130.
[0028] The power module 110 may be a battery or other energy storage element, which supplies power to each functional device 120 through the stored electrical energy; the power module 110 may also be a power conversion circuit, which connects to an external power source for conversion and supplies power to each functional device 120. The type of the power module 110 may be flexibly planned according to the environmental power source and the performance requirements of the functional device, so as to achieve the best circuit performance and cost. Figure 2As shown, the power module 110 can specifically adopt a PMU (Power Management Unit), which supplies power to each functional device 120 after accessing the voltage VDD. The PMU integrates several types of power management chips, such as a low-dropout linear regulator (LDO), a direct current / direct current (DC / DC) converter, etc., which can achieve higher power conversion efficiency and lower power consumption, and fewer components to adapt to the reduced board space, and lower cost. Further, the PMU can be a pass switch (SW), a low-dropout linear regulator (LDO) or a buck-boost DC-DC converter, which will not be limited to the power supply voltage value when applied, and can flexibly configure the voltage value according to the functional device 120 to optimize the performance. For example, when the voltage value is appropriate, a pass switch can be selected, when the voltage is too large, a low-dropout linear regulator or a buck-boost DC-DC converter can be selected to reduce the voltage, and when the voltage is too low, a buck-boost DC-DC converter can be selected to increase the voltage.
[0029] The number and type of the functional devices 120 are not unique, and may specifically include at least one of RF devices, analog devices, and digital devices. The isolation component 130 is suitable for power isolation between different RF devices, power isolation between different analog devices, and power isolation between different digital devices. In addition, the isolation component 130 is also suitable for power isolation between RF devices, analog devices, and digital devices. The RF device may specifically include at least one of an RF amplifier, a mixer, and a phase shifter. For ease of understanding, the following explanation is based on the functional device 120 being an RF amplifier. Correspondingly, a circuit module including multiple RF amplifiers is an RF amplifier circuit.
[0030] The number of RF amplifiers may be two or more. For example, the RF amplifier may include RF amplifier AMP1, RF amplifier AMP2, RF amplifier AMPn, etc. The specific number may be set according to actual needs. The data volume of the isolation component 130 may be less than the number of RF amplifiers, may be the same as the number of RF amplifiers, or may be more than the number of RF amplifiers. In this embodiment, the number of isolation components 130 is one less than the number of RF amplifiers, and an isolation component 130 is correspondingly provided between the power supply ends of every two RF amplifiers. The power supply end of each RF amplifier is isolated by the isolation component 130, and the isolation deterioration between the RF amplifiers caused by power supply coupling is reduced without affecting the performance of each RF amplifier.
[0031] In one embodiment, the isolation component 130 includes an isolation inductor, and the isolation inductors in each isolation component 130 are connected in series and then connected to the output end of the power module 110, and the power ends of each functional device 120 are connected through a corresponding isolation inductor. Figure 2As shown, taking the functional device 120 as an RF amplifier as an example, the RF amplifier includes RF amplifiers AMP1 to RF amplifiers AMPn, the input end of the RF amplifier AMP1 is connected to the input port RFIN1, the output end of the RF amplifier AMP1 is connected to the output port RFOUT1, ..., the input end of the RF amplifier AMPn is connected to the input port RFINn, and the output end of the RF amplifier AMPn is connected to the output port RFOUTn. The number of isolation components 130 can be n-1, the first isolation component 130 includes an isolation inductor L1, ..., the n-1th isolation component 130 includes an isolation inductor Ln-1, after the isolation inductors L1 to the isolation inductors Ln-1 are connected in series in sequence, the other end of the isolation inductor L1 is connected to the output end of the power module 110 and the power end of the RF amplifier AMP1, each common end between the isolation inductors L1 to the isolation inductors Ln-1 is respectively connected to the power end of a corresponding RF amplifier in the RF amplifiers AMP2 to RF amplifiers AMPn-1, and the other end of the isolation inductor Ln-1 is connected to the power end of the RF amplifier AMPn.
[0032] In this embodiment, all RF amplifiers share a power module 110, thereby reducing the device redundancy and high manufacturing cost caused by the independent power supply of each RF amplifier. On this basis, the power supply end of each RF amplifier is isolated by an isolation inductor, which greatly improves the isolation performance between the RF amplifiers without affecting the performance of the RF amplifier.
[0033] Among them, the isolation inductor can be an on-chip inductor, a substrate winding inductor or a chip inductor. The type of isolation inductor can be selected according to the different settings of each functional device 120. Regardless of whether each functional device 120 is set on the same chip or on multiple chips, the isolation inductor can use an on-chip inductor, a substrate winding inductor or a chip inductor to achieve isolation of the power supply inside the chip or isolation of the power supply between chips, so that it can be suitable for different application scenarios.
[0034] Furthermore, the isolation component 130 further includes a filter capacitor. In each isolation component 130, the first end of the isolation inductor is connected to the second end of the isolation inductor in the previous isolation component 130 or the output end of the power module 110, the first end of the filter capacitor is connected to the second end of the corresponding isolation inductor, and the second end of the filter capacitor is grounded. The filter capacitor can be an on-chip capacitor or a surface mount capacitor, such as Figure 2As shown, taking the number of isolation components 130 as n-1 as an example, the first isolation component 130 includes a filter capacitor C2, ..., the n-1th isolation component 130 includes a filter capacitor Cn, the first end of the isolation inductor L1 in the first isolation component 130 is connected to the output end of the power module 110, and the first end of the isolation inductor in the rear isolation component 130 is connected to the second end of the isolation inductor in the upper isolation component 130. In each isolation component 130, the first end of the filter capacitor is connected to the second end of the corresponding isolation inductor, and the second end of the filter capacitor is grounded. The capacitance value of each filter capacitor is not unique and can be set according to the performance requirements of the corresponding RF amplifier. In this embodiment, the capacitance value of the filter capacitor is the capacitance value of the difference between the key performance set by the corresponding functional device 120 and the common power supply case within the allowable error range. It can be understood that depending on the type of functional device 120, the specific type of key performance will also be different. Taking the functional device 120 as an RF amplifier as an example, the capacitance value of the filter capacitor is a capacitance value that keeps the difference between the gain and output return loss of the RF amplifier connected to the second end of the corresponding isolation inductor and the common power supply within the allowable error range. The capacitance value needs to be large enough to enable the power supply end of the RF amplifier to produce an AC short circuit to the ground within the operating frequency range. Among them, the difference between the gain and output return loss of the RF amplifier and the common power supply is kept within the allowable error range, which means that the RF amplifier shares the power supply module 110, the difference between the gain of the RF amplifier before and after the isolation component 130 is added, and the difference between the output return loss of the RF amplifier before and after the isolation component 130 is added, are all within the corresponding allowable error range. In an RF amplifier circuit with n inputs and n outputs, the n RF amplifiers share a power supply module 110, and n output nodes VDD_AMP are obtained by connecting (n-1) isolation inductors in series, which are used to power the n RF amplifiers in turn. At the same time, each node is connected to a suitable ground filter capacitor to ensure that the performance of the RF amplifier does not deteriorate. In addition, if the functional device 120 is another type of device, the capacitance value of the filter capacitor can be a capacitance value that ensures that the difference between the key performance of the functional device 120 other than isolation and the common power supply condition is within the allowable error range.
[0035] In this embodiment, the power supply end of each RF amplifier is isolated by an isolation inductor, and the filter capacitor is reasonably allocated. Without affecting the performance of each RF amplifier, the isolation deterioration between RF amplifiers caused by power supply coupling is reduced, and the stability of each RF amplifier and the entire circuit can also be improved.
[0036] In addition, the circuit module may further include an output filter capacitor C1, a first end of the output filter capacitor C1 is connected to the output end of the power module 110, and a second end of the output filter capacitor C1 is grounded. The specific capacitance value of the output filter capacitor C1 can be selected according to the output index requirements of the power module 110, and the output filter capacitor connected to the ground is set at the output end of the power module 110 to stabilize the output voltage.
[0037] like Figure 3 As shown, taking a 2x2 RF amplifier circuit as an example, the RF amplifier includes an RF amplifier AMP1 and an RF amplifier AMP2. The first end of the output filter capacitor C1 is connected to the output end of the power module 110, and the second end of the output filter capacitor C1 is grounded. The number of isolation components 130 is one, including an isolation inductor L1 and a filter capacitor C2. The first end of the isolation inductor L1 is connected to the output end of the power module 110 and the power end of the RF amplifier AMP1. The second end of the isolation inductor L1 is connected to the power end of the RF amplifier AMP2 and is grounded through the filter capacitor C2. The input port RFIN1 serves as the test point PORT1, the input port RFIN2 is the test point PORT2, the output port RFOUT1 is the test point PORT3, and the output port RFOUT2 is the test point PORT4. The RF amplifier AMP1 / RF amplifier AMP2 simultaneously work in the B7 / B40 / B41 (2.3-2.7G) frequency band. The output signal of the RF amplifier AMP1 is output from the output port RFOUT1, and the output signal of the RF amplifier AMP2 is output from the output port RFOUT2. Figure 4 The output signal isolation curve comparison diagram is a solution where two RF amplifiers share one power module (dashed line) and a solution where two RF amplifiers share one power module and add isolation components (solid line). The isolation performance between RF amplifier AMP1 and RF amplifier AMP2 is measured by the isolation of the output port. Figure 4 It can be seen that the present application has an 8-16dB improvement in output isolation, which is a significant effect.
[0038] In one embodiment, a radio frequency front-end module is provided, including the above-mentioned circuit module. The radio frequency front-end module may also include a matching circuit and a filter, each radio frequency amplifier is connected to a corresponding filter through a corresponding input port, and each filter is connected to a corresponding matching circuit. Among them, the matching circuit can adopt an LC (inductor capacitor) type matching topology structure, or an L-type dual inductor matching topology structure, and the filtering frequency band of each filter can be set according to actual needs. In addition, the number of circuit modules can be more than two, and isolation components can be provided between each circuit module, as well as between the matching circuit, the filter and the circuit module.
[0039] Furthermore, the RF front-end module may also include an RF switch, which is connected to each matching circuit and may also be connected to an RF antenna. The RF switch specifically includes a static contact and multiple moving contacts, the static contact is connected to the RF antenna, and each moving contact is connected to a corresponding matching circuit. By controlling the RF switch to turn on a single switch, each frequency band can work separately; or by controlling the RF switch to turn on two or more switches at the same time, several frequency bands can work simultaneously during carrier aggregation.
[0040] In one embodiment, a communication device is also provided, including a radio frequency antenna and the above-mentioned radio frequency front-end module. Further, the communication device may also include a controller, which is connected to the radio frequency switch to control the on and off of the radio frequency switch. The type of controller is not unique, for example, it can be a CPU (Central Processing Unit), an MCU (Microcontroller Unit), an FPGA (Field-Programmable Gate Array) and other devices.
[0041] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0042] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.
Claims
1. A circuit module, characterized in that: include: Power module; More than two functional devices, the input end of each functional device is connected to the corresponding input port, and the output end of each functional device is connected to the corresponding output port; the functional device includes at least one of a radio frequency device, an analog device and a digital device; There are more than two isolation components, each of which is connected in sequence to the output end of the power module, and the power ends of each functional device are connected through a corresponding isolation component.
2. The circuit module according to claim 1, characterized in that: The radio frequency device includes at least one of a radio frequency amplifier, a mixer and a phase shifter, and / or the power supply module is a PMU.
3. The circuit module according to claim 1, characterized in that: The isolation component includes an isolation inductor. The isolation inductors in each isolation component are connected in series in sequence and then connected to the output end of the power module. The power ends of each functional device are connected through a corresponding isolation inductor.
4. The circuit module according to claim 3, characterized in that: The isolation component also includes a filter capacitor. In each of the isolation components, the first end of the isolation inductor is connected to the second end of the isolation inductor in the previous isolation component or the output end of the power module, the first end of the filter capacitor is connected to the second end of the corresponding isolation inductor, and the second end of the filter capacitor is grounded; the capacitance value of the filter capacitor is a capacitance value within an allowable error range for the difference between the key performance set for the corresponding functional device and the common power supply condition.
5. The circuit module according to claim 4, characterized in that: The functional device is a radio frequency amplifier; the capacitance value of the filter capacitor is a capacitance value that keeps the difference between the gain and output return loss of the radio frequency amplifier connected to the second end of the corresponding isolation inductor and the common power supply condition within the allowable error range.
6. The circuit module according to claim 4, characterized in that: The filter capacitor is an on-chip capacitor or a chip capacitor.
7. The circuit module according to claim 3, characterized in that: The isolation inductor is an on-chip inductor, a substrate winding inductor or a chip inductor.
8. The circuit module according to any one of claims 1 to 7, characterized in that: It also includes an output filter capacitor, a first end of the output filter capacitor is connected to the output end of the power module, and a second end of the output filter capacitor is grounded.
9. A radio frequency front-end module, characterized in that: A circuit module comprising any one of claims 1-8.
10. A communication device, characterized in that: It comprises a radio frequency antenna and the radio frequency front-end module as claimed in claim 9.