Rigid-flex printed circuit board and preparation method thereof

Abstract

The invention discloses a rigid-flex board and a preparation method thereof, the rigid-flex board comprises a CS1 layer, a first empty layer, a first auxiliary board, a second empty layer, an SS1 layer, a CS2 layer, a third empty layer, a second auxiliary board, a fourth empty layer and an SS2 layer which are sequentially distributed from top to bottom, a CS layer circuit of a main board area is arranged in the CS1 layer of an auxiliary board area, a CS1 layer circuit of the auxiliary board area is arranged in the first empty layer, and a CS2 layer circuit of the auxiliary board area is arranged in the second empty layer. The SS layer circuit of the main board area is arranged in the SS2 layer of the auxiliary board area, the SS2 layer circuit of the auxiliary board area is arranged in the fourth empty layer, and the top surface of the CS1 layer and the bottom surface of the SS2 layer of the auxiliary board area are coated with waterproof breathable films. According to the rigid-flexible combined board, an original CS layer and an original SS layer are omitted, so that the thickness of the main board area is reduced to be the same as or similar to that of the auxiliary board area, a connector on the main board area can be normally replaced, the universality of the circuit board is improved, the waterproof breathable film is adopted to replace the original CS layer and the original SS layer to protect the auxiliary board area, meanwhile, line distribution of the main board area and the auxiliary board area is reset, and the service life of the circuit board is prolonged. Therefore, the original circuit function of the rigid-flex printed circuit board is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a rigid-flexible board and a preparation method thereof. Background Art

[0002] like Figure 1 and Figure 2 As shown, the existing main and sub-board structure rigid-flexible board includes a CS layer, an empty layer 1, a CS1 layer, an empty layer 2, a first sub-board, an empty layer 3, a SS1 layer, a CS2 layer, an empty layer 4, a second sub-board, an empty layer 5, a SS2 layer, an empty layer 6 and a SS layer, which are distributed from top to bottom. The CS layer and the SS layer of the sub-board area are mainly used to protect the hole positions of the sub-board area. After the subsequent process is completed, the CS layer and the SS layer of the sub-board area need to be peeled off to expose the hole positions of the sub-board area. The CS layer and the SS layer of the main board area need to be retained because of the circuits, which results in the main board area of ​​the existing rigid-flexible board being thicker than the sub-board area. The thicker main board area will cause some connectors on it to be unable to be replaced normally, and only special connectors can be customized, which reduces the versatility of the circuit board. During assembly, extra attention needs to be paid to distinguishing the connectors, thereby increasing the production cost of the circuit board. Summary of the invention

[0003] In order to overcome the deficiencies of the prior art, the object of the present invention is to provide a rigid-flexible board, which enables the connector in the main board area to be normally replaced, improves the versatility of the circuit board, and reduces the production cost of the circuit board.

[0004] To solve the above problems, the technical solution adopted by the present invention is as follows: a rigid-flexible board, comprising a CS1 layer, a first empty layer, a first sub-board, a second empty layer, a SS1 layer, a CS2 layer, a third empty layer, a second sub-board, a fourth empty layer and a SS2 layer distributed from top to bottom, the CS layer circuit of the main board area is arranged in the CS1 layer of the sub-board area, the CS1 layer circuit of the sub-board area is arranged in the first empty layer, the SS layer circuit of the main board area is arranged in the SS2 layer of the sub-board area, the SS2 layer circuit of the sub-board area is arranged in the fourth empty layer, and the top surface of the CS1 layer and the bottom surface of the SS2 layer of the sub-board area are both covered with a waterproof and breathable film.

[0005] Compared with the prior art, the beneficial effect of the present invention is that the rigid-flexible board eliminates the original CS layer and SS layer, the thickness of the sub-board area remains unchanged, and the thickness of the main board area is reduced to the same or similar to that of the sub-board area, so that the connector on the main board area can be replaced normally, and for the original connector on the main board area, it only needs to shorten the pins to adapt and use normally. Therefore, there is no need to customize special connectors, thereby improving the versatility of the circuit board, and reducing the number of plates of the rigid-flexible board, and reducing the production cost of the circuit board. In addition, the rigid-flexible board is coated with a waterproof and breathable film on the top surface of the CS1 layer and the bottom surface of the SS2 layer of the sub-board area, which can replace the protective effect of the original CS layer and SS layer on the sub-board area, and avoid the impact of subsequent processes on the hole position of the sub-board area. The CS layer circuit of the main board area is arranged in the CS1 layer of the sub-board area, so it can be guaranteed that after the CS layer is cancelled, the original circuit function of the main board area can still be maintained, and the CS1 layer circuit of the sub-board area is arranged in the first empty layer, without affecting other circuits inside the sub-board area, it can also ensure that the circuit of the sub-board area is complete and maintain the original circuit function of the sub-board area. Similarly, the SS layer circuit of the main board area is set in the SS2 layer of the sub-board area, so it can be guaranteed that after the SS layer is cancelled, the original circuit function of the main board area can still be maintained, and the SS2 layer circuit of the sub-board area is set in the fourth empty layer, which can ensure the integrity of the circuit of the sub-board area and maintain the original circuit function of the sub-board area without affecting other circuits in the sub-board area. Therefore, the rigid-flexible board can reduce the thickness of the main board area to the same or similar to that of the sub-board area without changing the original circuit function and the subsequent circuit board production process, so that the connector on the main board area can be replaced normally, which improves the versatility of the circuit board.

[0006] In the rigid-flex board mentioned above, the thickness of the main board area is equal to the thickness of the auxiliary board area.

[0007] The present invention also provides a method for preparing a rigid-flexible board, comprising a design stage S100 and a production stage S200.

[0008] The design stage S100 includes the following steps:

[0009] Step S110, move the CS1 layer circuit of the sub-board area to the first empty layer, and move the CS layer circuit of the main board area to the CS1 layer of the sub-board area;

[0010] Step S120, move the SS2 layer circuit of the sub-board area to the fourth empty layer, and move the SS layer circuit of the main board area to the SS2 layer of the sub-board area;

[0011] The production stage S200 includes the following steps:

[0012] Step S210, manufacturing circuits on the first sub-board and the second sub-board, including the CS1 layer circuit and the SS2 layer circuit of the sub-board area;

[0013] Step S220, laminating the CS1 layer, the first sub-board and the SS1 layer, and laminating the CS2 layer, the second sub-board and the SS2 layer;

[0014] Step S230, making CS1 layer, SS1 layer, CS2 layer and SS2 layer circuits, including CS layer circuits and SS layer circuits in the main board area;

[0015] Step S240, affixing a waterproof breathable membrane to the top surface of the CS1 layer and the bottom surface of the SS2 layer in the sub-panel area;

[0016] Step S250, laminating the CS1 layer, the first sub-board, the SS1 layer, the CS2 layer, the second sub-board and the SS2 layer;

[0017] Step S260, other process flows.

[0018] In the design stage, the method first moves the CS1 layer circuit of the sub-board area to the first empty layer, moves the SS2 layer circuit of the sub-board area to the fourth empty layer, and moves the CS layer circuit of the main board area to the CS1 layer of the sub-board area, and moves the SS layer circuit of the main board area to the SS2 layer of the sub-board area. The other circuits of the main board area and the sub-board area remain as they are, thereby completing the circuit design on the new rigid-flexible board. The circuit function on the new rigid-flexible board is consistent with the circuit function on the original rigid-flexible board. In the production stage, only the CS1 layer, the first sub-board, the SS1 layer, the CS2 layer, the second sub-board and the SS2 layer need to be provided and the corresponding process flow is carried out, without the need to provide the CS layer and the SS layer, which can reduce production raw materials. Since the CS1 layer circuit and the SS2 layer circuit of the sub-board area are moved to the first empty layer and the fourth empty layer respectively, when the circuits on the first sub-board and the second sub-board are made, the CS1 layer circuit and the SS2 layer circuit of the sub-board area are also made at the same time. After lamination, when making the CS1 layer, SS1 layer, CS2 layer and SS2 layer circuits, the CS layer circuits and SS layer circuits of the main board area are also made at the same time. After the waterproof and breathable film is applied and laminated, in the subsequent process flows such as drilling, copper plating and etching, the waterproof and breathable film can replace the original CS layer and SS layer to protect the sub-board area. Compared with the original rigid-flexible board, the thickness of the sub-board area of ​​the finally prepared rigid-flexible board remains unchanged, while the thickness of the main board area is reduced to the same or similar to that of the sub-board area, so that the connector on the main board area can be replaced normally, and for the original connector on the main board area, it only needs to shorten the pins to adapt and use normally. Therefore, there is no need to customize special connectors, which can improve the versatility of the circuit board and reduce the production cost of the circuit board.

[0019] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the existing rigid-flex board sub-board area when the cover is not removed;

[0021] Figure 2 This is a schematic diagram of the existing rigid-flex board sub-board area after the cover is removed;

[0022] Figure 3 Schematic diagram of a rigid-flex board according to an embodiment of the present invention. DETAILED DESCRIPTION

[0023] The embodiments of the present invention are described in detail below

[0024] Embodiment 1

[0025] Reference Figure 3 An embodiment of the present invention provides a rigid-flexible board, comprising a CS1 layer, a first empty layer, a first sub-board, a second empty layer, a SS1 layer, a CS2 layer, a third empty layer, a second sub-board, a fourth empty layer and a SS2 layer, which are sequentially arranged from top to bottom. The CS layer circuit of the main board area is arranged in the CS1 layer of the sub-board area, the CS1 layer circuit of the sub-board area is arranged in the first empty layer, the SS layer circuit of the main board area is arranged in the SS2 layer of the sub-board area, the SS2 layer circuit of the sub-board area is arranged in the fourth empty layer, and the top surface of the CS1 layer and the bottom surface of the SS2 layer of the sub-board area are both covered with a waterproof and breathable film.

[0026] This rigid-flex board eliminates the original CS layer and SS layer, the thickness of the sub-board area remains unchanged, and the thickness of the main board area is reduced to the same or similar to that of the sub-board area, so that the connector on the main board area can be replaced normally, and for the original connector on the main board area, it only needs to shorten the pins to adapt and use normally. Therefore, there is no need to customize special connectors, which can improve the versatility of the circuit board, and can also reduce the number of boards of the rigid-flex board and reduce the production cost of the circuit board. In addition, this rigid-flex board is coated with a waterproof and breathable film on the top surface of the CS1 layer and the bottom surface of the SS2 layer of the sub-board area, which can replace the protective effect of the original CS layer and SS layer on the sub-board area and avoid the impact of subsequent processes on the hole position of the sub-board area. The CS layer circuit of the main board area is set in the CS1 layer of the sub-board area, so it can be guaranteed that after the CS layer is cancelled, the original circuit function of the main board area can still be maintained. The CS1 layer circuit of the sub-board area is set in the first empty layer, which can ensure the integrity of the circuit of the sub-board area without affecting other circuits inside the sub-board area, and maintain the original circuit function of the sub-board area. Similarly, the SS layer circuit of the main board area is set in the SS2 layer of the sub-board area, so it can be guaranteed that after the SS layer is cancelled, the original circuit function of the main board area can still be maintained, and the SS2 layer circuit of the sub-board area is set in the fourth empty layer, which can ensure the integrity of the circuit of the sub-board area and maintain the original circuit function of the sub-board area without affecting other circuits in the sub-board area. Therefore, the rigid-flexible board can reduce the thickness of the main board area to the same or similar to that of the sub-board area without changing the original circuit function and the subsequent circuit board production process, so that the connector on the main board area can be replaced normally, which improves the versatility of the circuit board.

[0027] Of course, it is understandable that the first empty layer in this scheme corresponds to the empty layer 2 in the original structure, and the fourth empty layer corresponds to the empty layer 5 in the original structure. The empty layer is some structure that naturally remains after etching the circuit on the core board, some places are copper sheets, and some places are substrates. The empty layer originally has no other function, so the CS1 layer circuit of the sub-board area is set in the first empty layer, and it will not affect the functions of other circuits in the sub-board area. The same is true for other circuit layers, which will not be elaborated here. In addition, for the circuit board, the function of the circuit board is not affected without affecting the wiring network, and the rigid-flexible board moves the CS1 layer circuit of the sub-board area to the first empty layer, and the SS2 layer circuit to the fourth empty layer, which does not affect the wiring network, and therefore does not affect the original function of the rigid-flexible board. The same is true for the circuit in the main board area, which will not be elaborated here.

[0028] Embodiment 2

[0029] A second embodiment of the present invention provides a method for preparing a rigid-flexible board, including a design stage S100 and a production stage S200.

[0030] The design stage S100 includes the following steps:

[0031] Step S110, move the CS1 layer circuit of the sub-board area to the first empty layer, and move the CS layer circuit of the main board area to the CS1 layer of the sub-board area;

[0032] Step S120, move the SS2 layer circuit of the sub-board area to the fourth empty layer, and move the SS layer circuit of the main board area to the SS2 layer of the sub-board area;

[0033] The production stage S200 includes the following steps:

[0034] Step S210, manufacturing circuits on the first sub-board and the second sub-board, including the CS1 layer circuit and the SS2 layer circuit of the sub-board area;

[0035] Step S220, laminating the CS1 layer, the first sub-board and the SS1 layer, and laminating the CS2 layer, the second sub-board and the SS2 layer;

[0036] Step S230, making CS1 layer, SS1 layer, CS2 layer and SS2 layer circuits, including CS layer circuits and SS layer circuits in the main board area;

[0037] Step S240, affixing a waterproof breathable membrane to the top surface of the CS1 layer and the bottom surface of the SS2 layer in the sub-panel area;

[0038] Step S250, laminating the CS1 layer, the first sub-board, the SS1 layer, the CS2 layer, the second sub-board and the SS2 layer;

[0039] Step S260, other process flows.

[0040] In the design stage, the method first moves the CS1 layer circuit of the sub-board area to the first empty layer, moves the SS2 layer circuit of the sub-board area to the fourth empty layer, and moves the CS layer circuit of the main board area to the CS1 layer of the sub-board area, and moves the SS layer circuit of the main board area to the SS2 layer of the sub-board area. The other circuits of the main board area and the sub-board area remain as they are, thereby completing the circuit design on the new rigid-flexible board. The circuit function on the new rigid-flexible board is consistent with the circuit function on the original rigid-flexible board. In the production stage, only the CS1 layer, the first sub-board, the SS1 layer, the CS2 layer, the second sub-board and the SS2 layer need to be provided and the corresponding process flow is carried out, without the need to provide the CS layer and the SS layer, which can reduce production raw materials. Since the CS1 layer circuit and the SS2 layer circuit of the sub-board area are moved to the first empty layer and the fourth empty layer respectively, when the circuits on the first sub-board and the second sub-board are made, the CS1 layer circuit and the SS2 layer circuit of the sub-board area are also made at the same time. After lamination, when making the CS1 layer, SS1 layer, CS2 layer and SS2 layer circuits, the CS layer circuits and SS layer circuits of the main board area are also made at the same time. After the waterproof and breathable film is applied and laminated, in the subsequent process flows such as drilling, copper plating and etching, the waterproof and breathable film can replace the original CS layer and SS layer to protect the sub-board area. Compared with the original rigid-flexible board, the thickness of the sub-board area of ​​the finally prepared rigid-flexible board remains unchanged, while the thickness of the main board area is reduced to the same or similar to that of the sub-board area, so that the connector on the main board area can be replaced normally, and for the original connector on the main board area, it only needs to shorten the pins to adapt and use normally. Therefore, there is no need to customize special connectors, which can improve the versatility of the circuit board and reduce the production cost of the circuit board.

[0041] It should be noted that in the description of the present invention, if there are any orientation descriptions, such as up, down, front, back, left, right, etc., the orientations or positional relationships indicated are all based on the orientations or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed or operated in a specific orientation, and cannot be understood as a limitation on the present invention.

[0042] In the description of the present invention, "several" means one or more, "more" means two or more, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0043] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0044] The above-mentioned embodiments are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A rigid-flex board, characterized in that: It includes a CS1 layer, a first empty layer, a first sub-board, a second empty layer, a SS1 layer, a CS2 layer, a third empty layer, a second sub-board, a fourth empty layer and a SS2 layer which are sequentially distributed from top to bottom. The CS layer circuit of the main board area is arranged in the CS1 layer of the sub-board area, the CS1 layer circuit of the sub-board area is arranged in the first empty layer, the SS layer circuit of the main board area is arranged in the SS2 layer of the sub-board area, the SS2 layer circuit of the sub-board area is arranged in the fourth empty layer, and the top surface of the CS1 layer and the bottom surface of the SS2 layer of the sub-board area are both covered with waterproof and breathable membranes.

2. The rigid-flex board according to claim 1, characterized in that: The thickness of the main plate area is equal to the thickness of the auxiliary plate area.

3. A method for preparing a rigid-flexible board, characterized in that: Including the design stage S100 and the production stage S200, The design stage S100 includes the following steps: Step S110, move the CS1 layer circuit of the sub-board area to the first empty layer, and move the CS layer circuit of the main board area to the CS1 layer of the sub-board area; Step S120, move the SS2 layer circuit of the sub-board area to the fourth empty layer, and move the SS layer circuit of the main board area to the SS2 layer of the sub-board area; The production stage S200 includes the following steps: Step S210, manufacturing circuits on the first sub-board and the second sub-board, including the CS1 layer circuit and the SS2 layer circuit of the sub-board area; Step S220, laminating the CS1 layer, the first sub-board and the SS1 layer, and laminating the CS2 layer, the second sub-board and the SS2 layer; Step S230, making CS1 layer, SS1 layer, CS2 layer and SS2 layer circuits, including CS layer circuits and SS layer circuits in the main board area; Step S240, affixing a waterproof breathable membrane to the top surface of the CS1 layer and the bottom surface of the SS2 layer in the sub-panel area; Step S250, laminating the CS1 layer, the first sub-board, the SS1 layer, the CS2 layer, the second sub-board and the SS2 layer; Step S260, other process flows.

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