VC vapor chamber and electronic equipment
By setting a cover layer on the second cover of the VC heat-smoothing plate, the thermal conductivity is reduced, and the heat-dissipating fluid in the sealing chamber is used to achieve heat absorption and heat exchange, which solves the problem of the VC heat-smoothing plate causing serious heat to the bottom shell of the electronic equipment. , achieving the lightness and thinness of electronic devices and improving user experience.
Patent Information
- Application Number
- CN202411411442.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-10
- Publication Date
- 2025-01-03
AI Technical Summary
The existing VC heat-smoothing plates use high thermal conductivity materials, causing severe heat to the bottom shell of the electronic equipment. A certain safe distance is needed to avoid heat conduction, thereby increasing the thickness of the electronic equipment and affecting the lightness and thinness.
The cover layer is provided on the second cover of the VC heat-smoothing plate to reduce the thermal conductivity, and heat absorption and heat exchange are achieved through the heat dissipation working fluid in the sealing chamber, reducing the temperature of the second cover, thereby reducing the VC heat-smoothing plate and The safe spacing of the bottom shell achieves lightness and thinness.
It effectively reduces the safe distance between the VC heat-smoothing plate and the bottom shell, reduces the overall thickness of the electronic equipment, improves the user experience, and maintains the heat dissipation effect of the bottom shell temperature unchanged.
Smart Images
Figure CN119255561A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of heat dissipation technology, and in particular to a VC heat spreader and electronic equipment. Background Art
[0002] VC Vapor Chamber is mainly used for heat dissipation of electronic devices such as smart phones, tablet computers, high-end thin and light laptops, etc. It has the advantage of fast heat conduction and can transfer heat from one hot spot to the entire surface for heat dissipation.
[0003] In the related art, the VC heat spreader includes an upper cover and a lower cover, which are sealed by brazing or diffusion welding to form a vacuum space for accommodating the coolant, wherein the upper cover and the lower cover are made of materials with high thermal conductivity to absorb the heat generated by the heat dissipation components, thereby exchanging heat with the coolant in the vacuum space to achieve uniform temperature. However, since the material with high thermal conductivity can easily conduct heat to the bottom shell of the electronic device through the upper cover, the electronic product will heat up seriously. Therefore, a certain safety distance needs to be maintained from the bottom shell to the upper cover of the heat spreader.
[0004] However, since a certain safety distance needs to be maintained between the bottom case and the upper cover of the heat spreader to achieve the purpose of heat dissipation, the thickness of the entire electronic device increases, affecting the user experience. Summary of the invention
[0005] The present application provides a VC heat spreader and an electronic device, which are used to solve the problem that the safety distance between the heat spreader and the bottom shell of the electronic device is large, the thickness of the entire electronic device is increased, and it is difficult to achieve lightness and thinness.
[0006] On the one hand, the present application provides a VC heat spreader, comprising: a first cover body, the first cover body is used to contact the heat generating element; a second cover body, the second cover body comprises a cover plate and a covering layer covering one side of the cover plate, the covering layer is used to reduce the thermal conductivity of the cover plate, the first cover body and the cover plate are connected, and a sealed cavity is formed therebetween, and a heat dissipating medium is arranged in the sealed cavity.
[0007] In some embodiments, the covering layer is a plastic layer.
[0008] In some embodiments, the covering layer is a plastic hollow layer.
[0009] In some embodiments, the thickness of the covering layer is greater than or equal to 0.05 mm and less than or equal to 0.2 mm.
[0010] In some embodiments, the cover plate and the covering layer are integrally formed; or, the covering layer is a spray coating; or, the cover plate and the covering layer are hot-melt connected.
[0011] In some embodiments, at least one of the cover plate and the first cover body is a metal layer.
[0012] In some embodiments, a groove is provided on at least one of a side of the cover layer facing the cover plate and a side of the cover plate facing the cover layer, and the groove forms an air layer.
[0013] In some embodiments, a plurality of support columns are further included, wherein the support columns are disposed in the sealed cavity, and two ends of the support columns are respectively connected to the first cover body and the cover plate.
[0014] In some embodiments, a capillary structure is disposed inside the sealed cavity, and a plurality of holes or micro grooves are formed on the capillary structure.
[0015] On the other hand, the present application provides an electronic device, including a device body and a VC heat spreader disposed on the device body.
[0016] In the VC heat spreader and electronic device provided by the present application, the heat dissipating medium contacts the heating element through the first cover body, undergoes phase change and absorbs heat, and then exchanges heat with the heat dissipating end through the second cover body to achieve temperature uniformity. Among them, by arranging a covering layer on the cover plate, the overall thermal conductivity of the second cover body is reduced by using the covering layer, so that the heat absorbed by the second cover body is reduced, thereby reducing the temperature of the second cover body. Therefore, when the VC heat spreader is used in electronic devices such as laptops, the safety distance between the VC heat spreader and the bottom shell can be effectively reduced under the condition that the temperature of the bottom shell remains unchanged, so that the thickness of the entire electronic device is reduced, and the electronic device is made thinner and lighter, thereby improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.
[0018] Figure 1 An exploded view of the structural schematic diagram of a VC vapor chamber provided in an embodiment of the present application;
[0019] Figure 2 An exploded view of a VC vapor chamber provided in an embodiment of the present application;
[0020] Figure 3 for Figure 1 Schematic diagram of the structure of the second cover body.
[0021] Description of reference numerals:
[0022] 100 - first cover body; 200 - second cover body; 210 - cover plate; 220 - covering layer; 221 - groove; 300 - air layer; 400 - support column; 500 - capillary structure; 600 - sealing cavity.
[0023] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION
[0024] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.
[0025] The terms "first", "second", "third", etc. (if any) in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the application described herein can be implemented in an order other than those illustrated or described herein.
[0026] Secondly, it should be noted that in the description of the present application, the terms "inside", "outside", "upper", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is only for the convenience of description and does not indicate or imply that the device or component must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present application.
[0027] In addition, it should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.
[0028] As shown in the background technology, in the related technology, the VC heat spreader includes an upper cover and a lower cover, which are sealed by brazing or diffusion welding to form a vacuum space for accommodating the coolant, wherein the upper cover and the lower cover are made of materials with high thermal conductivity so as to absorb the heat generated by the heat dissipation parts, thereby exchanging heat with the coolant in the vacuum space to achieve temperature uniformity. However, since the material with high thermal conductivity can easily conduct heat to the bottom shell of the electronic device through the upper cover, the electronic product will heat up seriously. Therefore, a certain safety distance needs to be kept from the bottom shell to the upper cover of the heat spreader.
[0029] However, since a certain safety distance needs to be maintained between the bottom case and the upper cover of the heat spreader to achieve the purpose of heat dissipation, the thickness of the entire electronic device increases, affecting the user experience.
[0030] In view of the above problems, the VC heat spreader and electronic device provided by the present application, the heat dissipating medium contacts the heating element through the first cover body, undergoes phase change and absorbs heat, and then exchanges heat with the heat dissipating end through the second cover body to achieve temperature uniformity. Among them, by setting a covering layer on the cover plate, the overall thermal conductivity of the second cover body is reduced by using the covering layer, so that the heat absorbed by the second cover body is reduced, thereby reducing the temperature of the second cover body. Therefore, when the VC heat spreader is used in electronic devices such as laptops, the safety distance between the VC heat spreader and the bottom shell can be effectively reduced under the condition that the temperature of the bottom shell remains unchanged, so that the thickness of the entire electronic device is reduced, and the electronic device is made thinner and lighter, thereby improving the user experience.
[0031] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.
[0032] Figure 1 An exploded view of the structural schematic diagram of a VC vapor chamber provided in an embodiment of the present application; Figure 2 An exploded view of a VC vapor chamber provided in an embodiment of the present application; Figure 3 for Figure 1 Schematic diagram of the structure of the second cover body.
[0033] Reference Figures 1 to 3 As shown, on the one hand, an embodiment of the present application provides a VC heat sink, including:
[0034] A first cover 100, the first cover 100 is used to contact the heating element;
[0035] The second cover body 200 includes a cover plate 210 and a covering layer 220 covering one side of the cover plate 210, and the covering layer 220 is used to reduce the thermal conductivity of the cover plate 210. The first cover body 100 and the cover plate 210 are connected, and a sealed cavity 600 is formed therebetween, and a heat dissipating medium is arranged in the sealed cavity 600.
[0036] It can be understood that a sealed cavity 600 is formed between the interconnected first cover body 100 and the cover plate 210, and the sealed cavity 600 is filled with a heat dissipating medium. When the temperature of the heating element rises, the dissipated heat can be transferred through the first cover body 100 to the contact with the heat dissipating medium inside the sealed cavity 600, thereby realizing heat exchange and achieving a uniform temperature. However, since the first cover body 100 and the cover plate 210 are made of materials with high thermal conductivity to achieve the purpose of heat exchange, it is easy to transfer heat to the cover plate 210, resulting in a higher temperature of the cover plate 210.
[0037] Specifically, in this embodiment, when the VC heat spreader is in use, the first cover body 100 contacts the heat generating element, and the second cover body 200 contacts the cold source (for example, a built-in fan of an electronic device). After the first cover body 100 absorbs the heat from the heat generating element, the heat is transferred to the heat dissipation medium through the first cover body 100. The heat dissipation medium vaporizes into a gas, and the gas moves toward the second cover body 200 until it contacts the cover plate 210 and undergoes heat exchange to be liquefied. The liquefied liquid moves toward the first cover body 100, so that the heat dissipation medium inside the sealed cavity 600 of the VC heat spreader realizes a cycle of absorbing heat, vaporizing, releasing heat, and liquefying, thereby achieving the effect of dissipating heat from the heat generating element.
[0038] It can be understood that in the application scenario of the VC heat spreader, the first cover body 100 is arranged at the bottom and contacts the heat-generating components (such as the CPU, circuit board) inside the electronic device, and the second cover body 200 is arranged at the top, and its outer covering layer 220 faces the bottom shell of the electronic device. There is a certain distance between the bottom shell and the second cover body 200 to avoid the heat being transferred to the bottom shell of the electronic device through the second cover body 200 during the heat exchange process of the VC heat spreader, causing serious heating of the electronic product.
[0039] Therefore, in the VC heat spreader provided by the present application, the heat dissipating medium contacts the heat source through the first cover 100, undergoes phase change and absorbs heat, and then exchanges heat with the heat dissipating end through the second cover 200 to achieve temperature uniformity. Among them, by arranging a covering layer 220 on the cover plate 210, the covering layer 220 is used to reduce the overall thermal conductivity of the second cover 200, so that the heat absorbed by the second cover 200 is reduced, thereby reducing the temperature of the second cover 200. Therefore, when the VC heat spreader is used in electronic devices such as laptops, the safety distance between the VC heat spreader and the bottom shell can be effectively reduced under the condition that the temperature of the bottom shell remains unchanged, so that the thickness of the entire electronic device is reduced, and the electronic device is made thinner and lighter, thereby improving the user experience.
[0040] In a specific implementation, the covering layer 220 may be a plastic member, thereby reducing the thermal conductivity of the cover plate 210 .
[0041] In some embodiments, the covering layer 220 is a plastic layer.
[0042] It is understandable that a covering layer 220 is provided on the side of the cover plate 210 facing away from the accommodating cavity 600. The covering layer 220 may be a plastic layer, thereby reducing the overall thermal conductivity of the second cover body 200 so that the thermal conductivity of the second cover body 200 is in the range of 0.05 to 0.5 W / mK, thereby avoiding the conduction of a large amount of heat that would cause the temperature of the cover plate 210 to be too high.
[0043] Specific, combined Figure 1 and Figure 2 As shown, the first cover 100 and the cover plate 210 are made of materials with high thermal conductivity, which can be copper, to achieve efficient heat exchange. Therefore, when the VC heat spreader is working, the cover plate 210 will also conduct more heat due to its high thermal conductivity, resulting in a temperature increase. Therefore, a plastic layer can be provided on the cover plate 210 to reduce the overall thermal conductivity of the second cover 200, so as to avoid conducting a large amount of heat and causing the temperature of the cover plate 210 to be too high.
[0044] In some embodiments, the cover layer 220 is a hollow plastic layer. It is understood that there is an air layer 300 (described below) between the cover layer 220 and the cover plate 210 to enhance the heat insulation effect of the second cover body 200 and reduce heat conduction to the housing of the electronic device.
[0045] In some embodiments, the thickness of the cover layer 220 is greater than or equal to 0.05 mm and less than or equal to 0.2 mm. This configuration can ensure that the overall thermal conductivity of the second cover 200 is reduced, while also preventing the cover layer 220 from being too thick, which results in a larger thickness of the VC heat spreader and affects the heat exchange of the heat spreader.
[0046] Wherein, in some embodiments, combined Figures 1 to 3 As shown, the cover plate 210 and the covering layer 220 are integrally formed; or, the covering layer 220 is a spray coating; or, the cover plate 210 and the covering layer 220 are connected by hot melting.
[0047] Specific, combined Figures 1 to 3 As shown, the cover layer 220 can be connected to the cover plate 210 by injection molding to form an integral structure, thereby preventing the cover layer 220 and the cover plate 210 from separating during use and affecting the use of the VC heat spreader.
[0048] Of course, in other embodiments, the covering layer 220 may also be a spray layer, that is, the molten plastic molecules are uniformly sprayed onto the surface of the cover plate 210 through a spraying device to form the covering layer 220 .
[0049] In addition, the cover plate 210 and the covering layer 220 may be connected by hot melt, that is, the covering layer 220 is directly hot melted and attached to the cover plate 210 to form the second cover body 200; the cover plate 210 and the covering layer 220 may also be partially hot melted, that is, the second cover body 200 is set to a three-layer structure, including the cover plate 210, the covering layer 220, and the air layer 300 between the cover plate 210 and the covering layer 220 (to be introduced below), so as to further enhance the heat insulation effect of the second cover body 200.
[0050] In some embodiments, at least one of the cover plate 210 and the first cover body 100 is a metal layer. It is understood that the cover plate 210 and the first cover body 100 can be copper parts, stainless steel parts, or aluminum parts with high thermal conductivity, so as to conduct the heat of the heating element to the accommodating cavity 600 to contact with the heat dissipation medium for heat exchange. The cover plate 210 and the first cover body 100 can be connected by brazing or diffusion welding.
[0051] Wherein, in some embodiments, Figure 3 As shown, a groove 221 is provided on at least one of a side of the cover layer 220 facing the cover plate 210 and a side of the cover plate 210 facing the cover layer 220 , and the groove 221 forms an air layer 300 .
[0052] Specifically, Figure 3 As shown, a groove 221 is formed on the side of the cover layer 220 facing the cover plate 210, so that when the cover layer 220 and the cover plate 210 are heat-melted, the groove 221 can be combined to form an air layer 300 to enhance the heat insulation effect of the second cover body 200. Of course, in other embodiments, a groove 221 can also be provided on the side of the cover plate 210 facing the cover layer 220, so that when the cover layer 220 and the cover plate 210 are heat-melted, the groove 221 forms an air layer 300.
[0053] Of course, in the specific application scenario of the VC heat spreader, the thickness of the air layer 300 can be flexibly adjusted according to the hardness of the second cover 200 and the overall thickness requirements of the electronic device to avoid the situation where the air layer 300 is too large, causing the second cover 200 to be easily deformed, or the entire electronic device is too thick. The thickness of the air layer 300 is greater than or equal to 0.01 mm and less than or equal to 0.3.
[0054] In some embodiments, a plurality of support columns 400 are further included. The support columns 400 are disposed in the sealed cavity 600 , and two ends of the support columns 400 are respectively connected to the first cover body 100 and the cover plate 210 .
[0055] It is understandable that if Figure 1 As shown, a plurality of support columns 400 can be vertically arranged inside the sealed cavity 600, and the two ends of the support columns 400 are respectively connected to the first cover body 100 and the cover plate 210. Such arrangement allows the support columns 400 to support the first cover body 100 and the cover plate 210, thereby avoiding local force deformation of the VC heat spreader, thereby facilitating improving the heat dissipation performance of the VC heat spreader.
[0056] Specifically, copper powder can be sintered on the surface of the support column 400. Since the first cover body 100 is in contact with the heat generating element during the use of the VC heat spreader, sintering copper powder on the support column 400 can enhance the adsorption capacity of the copper column, that is, increase the contact area between the copper column and the heat sink, so that the heat sink can quickly absorb heat and vaporize under the action of the support column 400, thereby achieving heat exchange.
[0057] The support column 400 may also be made of other heat-conducting metal materials to achieve a rapid heat exchange effect.
[0058] In some embodiments, a capillary structure 500 is disposed inside the sealed cavity 600 , and a plurality of holes or micro grooves are formed on the capillary structure 500 .
[0059] Specific, combined Figure 1 As shown, a capillary structure 500 can be arranged inside the sealed cavity 600. The capillary structure 500 can be a structure such as a capillary tube or a porous material, so that the heat dissipating medium can move spontaneously in the capillary tube or pore due to surface tension and adhesion, thereby transmitting the heat dissipating medium. The capillary structure 500 of the cover can be a copper mesh, and copper powder is used to sinter the capillary on the copper mesh. With such an arrangement, the capillary structure 500 can be used to increase the reflux speed of the heat dissipating medium, which is beneficial to further improve the heat dissipation effect of the heating element. Among them, during the preparation process of the VC heat spreader, the capillary structure 500 can be welded to the cover plate 210 and the first cover body 100 by diffusion welding to avoid the capillary structure 500 from moving out of position and affecting the heat dissipation effect of the VC heat spreader.
[0060] On the other hand, an embodiment of the present application provides an electronic device, including a device body and a VC heat spreader disposed on the device body.
[0061] The electronic device body may be a notebook computer, a tablet computer, etc.
[0062] It is understandable that the first cover 100 of the VC heat spreader is in contact with the device body, the device body is a heating element, and the second cover 200 is in contact with the cold source to achieve heat dissipation of the device body. Among them, there is a certain safety distance between the second cover 200 and the housing of the electronic device to prevent the heat emitted by the VC heat spreader from being transferred to the housing when the VC heat spreader is working, causing the electronic device to become hot and affecting the user experience. In general, the safety distance is designed to be 0.8~1.5mm. However, the present application effectively reduces the thermal conductivity of the second cover 200 by setting the second cover 200 in the form of a covering layer 220 and a cover plate 210, that is, the covering layer 220 is arranged on one side of the cover plate 210, thereby avoiding a large amount of heat from being conducted to the housing of the electronic device through the second cover 200 during the heat exchange process of the VC heat spreader, thereby effectively seeing the safety distance from the housing to the VC heat spreader, making the entire electronic device thinner. Among them, according to experiments, through the above technical solution of this application, the safe distance from the shell to the VC heat sink can be reduced to 0.1~1.2mm, that is, the thickness of the entire electronic device can be reduced by 0.1~1.2mm. Specifically, as shown in the following table,
[0063]
[0064] Through the above-mentioned technical solution of the present application, when the housing of the electronic device reaches the same temperature, by directly applying plastic parts on the cover plate 210 with high thermal conductivity, or by partially connecting the plastic with the cover plate 210 to form an air layer 300, the distance from the housing to the VC heat spreader can be effectively reduced, thereby reducing the overall thickness of the electronic device.
[0065] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the invention disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.
[0066] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.
Claims
1. A VC vapor chamber, characterized in that: include: A first cover body (100), the first cover body (100) being used for contacting the heating element; A second cover body (200), the second cover body (200) comprising a cover plate (210) and a covering layer (220) covering one side of the cover plate (210), the covering layer (220) being used to reduce the thermal conductivity of the cover plate (210), the first cover body (100) and the cover plate (210) being connected, and a sealed cavity (600) being formed therebetween, and a heat dissipating medium being arranged in the sealed cavity (600).
2. The VC vapor chamber according to claim 1, characterized in that: The covering layer (220) is a plastic layer.
3. The VC vapor chamber according to claim 1, characterized in that: The covering layer (220) is a plastic hollow layer.
4. The VC vapor chamber according to claim 1, characterized in that: The thickness of the covering layer (220) is greater than or equal to 0.05 millimeters and less than or equal to 0.2 millimeters.
5. The VC vapor chamber according to claim 4, characterized in that: The cover plate (210) and the covering layer (220) are integrally formed; Alternatively, the covering layer (220) is a sprayed layer; Alternatively, the cover plate (210) and the covering layer (220) are connected by heat melting.
6. The VC vapor chamber according to any one of claims 1 to 5, characterized in that: At least one of the cover plate (210) and the first cover body (100) is a metal layer.
7. The VC vapor chamber according to any one of claims 1 to 5, characterized in that: A groove (221) is provided on at least one of a side of the cover layer (220) facing the cover plate (210) and a side of the cover plate (210) facing the cover layer (220), and the groove (221) forms an air layer (300).
8. The VC vapor chamber according to any one of claims 1 to 5, characterized in that: It also comprises a plurality of support columns (400), wherein the support columns (400) are arranged in the sealed cavity (600), and two ends of the support columns (400) are respectively connected to the first cover body (100) and the cover plate (210).
9. The VC vapor chamber according to any one of claims 1 to 5, characterized in that: A capillary structure (500) is arranged inside the sealed cavity (600), and a plurality of holes or micro grooves are formed on the capillary structure (500).
10. An electronic device, characterized in that: The device comprises a device body and a VC heat spreader as described in any one of claims 1 to 9 arranged on the device body.