Cooling system

Abstract

The invention relates to a cooling system, which is used for cooling a heating load, and comprises a heat exchange assembly which is configured to be connected with the load so as to form a cooling loop between the heat exchange assembly and the load, the first liquid storage tank is used for storing a refrigerant; one end of the cooling loop is connected with the first liquid storage tank, and the other end of the cooling loop is connected with the first liquid storage tank or the cooling loop; a first pump configured to drive a refrigerant within the cooling circuit; and the extraction valve is arranged on the cooling loop and is connected with the heat exchange assembly. And the heat dissipation efficiency and stability of the cooling system can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of data center heat dissipation, and in particular to a cooling system. Background Art

[0002] With the rapid development of computer technology, the data center's ability to process data is getting higher and higher. However, when the chip processes a large amount of data, excessive heat will greatly restrict the data center's server processing capacity. Therefore, it is particularly important to dissipate heat and cool it. At present, the commonly used heat dissipation method is liquid cooling. The refrigerant flowing out of the heat exchanger flows through the heat load to absorb heat and then flows back to the heat exchanger to release heat. The refrigerant continuously repeats this cycle between the heat exchanger and the heat load, thereby continuously dissipating heat and cooling the heat-generating components.

[0003] In the above heat dissipation cooling system, in addition to liquid refrigerant and gaseous refrigerant, there is also a portion of air. Air is a non-condensable gas and will not produce a heat dissipation cooling effect, which is not conducive to improving the heat dissipation efficiency of the cooling system. In addition, as the load heat amount continues to change, the pressure generated by the air will also change continuously, so that the pressure of the cooling system will also fluctuate greatly, which is not conducive to improving the stability of the cooling system. Summary of the invention

[0004] Based on this, the present application proposes a cooling system to improve the heat dissipation efficiency and stability of the cooling system.

[0005] The embodiment of the present application proposes a cooling system for cooling a heat-generating load. The system comprises: a heat exchange component, the heat exchange component is configured to be connected to the load to form a cooling circuit for circulating refrigerant between the two; a first liquid storage tank, used to store refrigerant; a first pipeline, one end of the cooling circuit is connected to the first liquid storage tank, and the other end is connected to the first liquid storage tank or the cooling circuit; a first pump, the first pump is configured to drive the refrigerant in the cooling circuit; and an air extraction valve, the air extraction valve is arranged on the cooling circuit and connected to the heat exchange component.

[0006] In some embodiments, the cooling system further includes a second liquid storage tank and a first switch valve, wherein the second liquid storage tank is connected to the top of the first liquid storage tank, and the first switch valve is disposed on a connecting pipeline between the second liquid storage tank and the first liquid storage tank.

[0007] In some embodiments, the heat exchange assembly includes a heat exchanger and a third liquid storage tank connected to the heat exchanger, and the air extraction valve is connected to the third liquid storage tank.

[0008] In some embodiments, the heat exchanger and the third liquid storage tank are an integrated structure.

[0009] In some embodiments, the heat exchanger and the third liquid storage tank are split structures.

[0010] In some embodiments, the cooling system further includes a fluid replenishing pipeline, one end of which is connected to the third fluid storage tank, and the other end of which is connected to the bottom of the first fluid storage tank.

[0011] In some embodiments, the cooling system further includes a second switch valve disposed on the liquid replenishing pipeline and a first liquid level sensor disposed on the third liquid storage tank, wherein the first liquid level sensor is positioned to detect the liquid level of the refrigerant in the third liquid storage tank and send a liquid level signal;

[0012] When the liquid level signal is lower than a preset liquid level threshold, the second switch valve is opened.

[0013] In some embodiments, both ends of the cooling circuit are connected to the first liquid storage tank, the first pump is disposed in the cooling circuit, and the air extraction valve is located on one side of the outflow port of the first pump.

[0014] In some embodiments, the cooling system further includes a controller, a pressure sensor, a third switch valve and a fourth switch valve, the pressure sensor and the third switch valve are both connected to the heat exchange component, and the fourth switch valve is disposed on a connecting pipeline between the air extraction valve and the heat exchange component;

[0015] The pressure sensor is used to obtain the pressure signal in the heat exchange component;

[0016] The controller is electrically connected to the first pump, the pressure sensor, the third switch valve and the fourth switch valve;

[0017] The controller is configured to receive the pressure signal, and when the pressure signal is greater than a preset first pressure threshold, turn on the first pump and the fourth switch valve, and turn off the third switch valve;

[0018] The controller is also configured to receive the pressure signal, and to close the first pump and the fourth switch valve and open the third switch valve when the pressure signal is less than a preset second pressure threshold, and the first pressure threshold is greater than the second pressure threshold.

[0019] In some embodiments, the cooling system further comprises a second pump disposed on the cooling circuit, wherein the second pump is located between the outlet of the heat exchange component and the load;

[0020] The cooling system further includes a liquid discharge pipeline, one end of which is connected to the cooling circuit and located at the outlet side of the second pump, and the other end of which is connected to the bottom of the first liquid storage tank.

[0021] In some embodiments, the first pump is disposed on the cooling circuit, and the first pump is located between the outlet of the heat exchange component and the load;

[0022] One end of the cooling circuit is connected to the first liquid storage tank, and the other end is connected to the cooling circuit and is located at the outlet side of the first pump.

[0023] In some embodiments, the cooling system further includes a fifth switch valve disposed on the cooling circuit and a sixth switch valve disposed on a connecting pipeline between the air extraction valve and the heat exchange component.

[0024] The cooling system of the present application is provided with a first pipeline, a first pump and an exhaust valve. In addition, the first pipeline is a passage for the circulation of refrigerant, and the first pump is configured to drive the refrigerant in the first pipeline. The exhaust valve is arranged on the first pipeline and is connected to the heat exchange component. When the first pump drives the refrigerant to circulate in the first pipeline, a negative pressure area will be formed in the exhaust valve, so that the gas in the heat exchange component, such as air or a mixture of air and gaseous refrigerant, is drawn into the first pipeline, and finally the gas is discharged into the first liquid storage tank. In this way, through the active exhaust work of the first pump and the exhaust valve, the cooling system can be degassed, and the presence of too much non-condensable gas in the cooling system can be avoided, which is beneficial to improve the heat dissipation efficiency and stability of the cooling system. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of a cooling system according to an embodiment of the present application;

[0026] Figure 2 This is another structural schematic diagram of the cooling system of an embodiment of the present application;

[0027] Figure 3 A schematic diagram of the structure of the air extraction valve according to an embodiment of the present application;

[0028] Figure 4 This is another structural schematic diagram of the cooling system of an embodiment of the present application.

[0029] The reference numerals are as follows:

[0030] 10-cooling system; 11-heat exchange component; 111-heat exchanger; 112-third liquid storage tank; 113-temperature sensor; 1121-first liquid level sensor; 1122-third liquid discharge port; 12-first liquid storage tank; 121-second liquid level sensor; 122-second liquid discharge port; 13-first pipeline; 14-first pump; 15-air extraction valve; 151-nozzle; 1511-inlet; 152-suction chamber; 1521-suction port; 153-diffuser; 1531-outlet; 16-second liquid storage tank; 1 61-first switch valve; 162-exhaust valve; 163-first drain port; 164-cooling water; 17-liquid replenishment pipeline; 171-second switch valve; 18-pressure sensor; 19-third switch valve; 20-fourth switch valve; 21-second pump; 21a-first sub-pump; 21b-second sub-pump; 21c-check valve; 22-drain pipeline; 221-seventh switch valve; 14a-third sub-pump; 14b-fourth sub-pump; 14c-second check valve; 131-fifth switch valve; 132-sixth switch valve;

[0031] 100-load; 200-refrigerant; 300-cooling circuit; 400-liquid distributor; 500-gas collector; 600-accommodating chamber; 610-inlet; 620-outlet; 630-liquid level sensor; 640-inlet switch valve; 700-cooling device. DETAILED DESCRIPTION

[0032] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0033] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0034] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0035] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0036] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0037] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0038] The present application embodiment provides a cooling system 10 for cooling a heat load 100. Figure 1 and Figure 2As shown, the cooling system 10 includes a heat exchange component 11, a first liquid storage tank 12, a first pipeline 13, a first pump 14 and an air extraction valve 15. The heat exchange component 11 is configured to be connected to the load 100 to form a cooling circuit 300 for circulating the refrigerant 200 therebetween. The first liquid storage tank 12 is used to store the refrigerant 200. One end of the first pipeline 13 is connected to the first liquid storage tank 12, and the other end is connected to the first liquid storage tank 12 or the cooling circuit 300. The first pump 14 is configured to drive the refrigerant 200 in the first pipeline 13. The air extraction valve 15 is disposed on the first pipeline 13 and connected to the heat exchange component 11.

[0039] The cooling system 10 of the present application includes a heat exchange component 11, a first liquid storage tank 12, a first pipeline 13, a first pump 14 and an exhaust valve 15. The heat exchange component 11 is used to connect with the load 100 to form a cooling circuit 300 for circulating the refrigerant 200 therebetween. In other words, the heat exchange component 11 is connected to the load 100 to form a cooling circuit 300, and the refrigerant 200 continuously changes state in the cooling circuit 300, thereby continuously transferring the heat generated by the load 100 to the heat exchange component 11, and then the heat exchange component 11 cools and lowers the temperature of the load 100. It is easy to understand that since the heat exchange component 11 cools and liquefies the refrigerant 200 in the cooling circuit 300, the heat exchange component 11 includes both completely liquefied liquid refrigerant 200 and unliquefied gaseous refrigerant 200 and air.

[0040] The following briefly discusses the process of the refrigerant 200 circulation and the heat exchange component 11 cooling the load 100. First, the low-temperature refrigerant 200 passes through the load 100 and exchanges heat with the load 100. At this time, the heat of the load 100 is taken away and the temperature is reduced; the temperature of the refrigerant 200 increases. Then, the high-temperature refrigerant 200 comes out of the load 100 and flows through the heat exchange component 11. The heat exchange component 11 can exchange heat with the high-temperature refrigerant 200 again. At this time, the heat of the high-temperature refrigerant 200 is taken away by the heat exchange component 11, the temperature is reduced and it becomes the low-temperature refrigerant 200 again, and the coolant in the heat exchange component 11 can be cooled by a cooling device 700 connected thereto, such as a cooling fan, a cold source, etc. Through the continuous circulation of the refrigerant 200, the load 100 can be continuously cooled.

[0041] Optionally, according to the different states of the refrigerant 200 when circulating in the cooling system 10, the cooling system 10 can be divided into a single-phase immersion liquid cooling system and a phase change immersion liquid cooling system. The single-phase immersion liquid cooling system means that the refrigerant 200 always maintains a liquid state during the circulation heat dissipation process and does not undergo a phase change. In addition, when the refrigerant 200 passes through the heating load 100, the heating load 100 is completely immersed. The phase change immersion liquid cooling system means that the refrigerant 200 undergoes a phase change during the circulation heat dissipation process, which will produce a gas-liquid change process. In addition, when the refrigerant 200 passes through the heating load 100, the heating load 100 is completely immersed.

[0042] In the present application, the cooling system 10 is described as a phase change immersion liquid cooling system. However, it should be noted that it can also be a single-phase immersion liquid cooling system.

[0043] The first liquid storage tank 12 is a tank for storing the refrigerant 200. The first liquid storage tank 12 can replenish the refrigerant 200 to the cooling system 10; or, can store the excess refrigerant 200 in the cooling system 10.

[0044] The first pipeline 13 is a passage for the refrigerant 200 to flow, and the first pump 14 is configured to drive the refrigerant 200 in the first pipeline 13. Specifically, one end of the first pipeline 13 is connected to the first liquid storage tank 12, and the other end is connected to the first liquid storage tank 12 or the cooling circuit 300. That is, there are two ways to set the first pipeline 13.

[0045] The first one is, Figure 1 As shown, both ends of the first pipeline 13 are connected to the first liquid storage tank 12, and the first pump 14 drives the refrigerant 200 out of one end of the first liquid storage tank 12 and then returns to the first liquid storage tank 12 from the other end. In this case, the first pipeline 13 forms a circulation pipeline for the refrigerant 200 on the first liquid storage tank 12.

[0046] The second case is, if Figure 2 As shown, one end of the first pipeline 13 is connected to the first liquid storage tank 12, and the other end is connected to the cooling circuit 300. The first pump 14 drives the refrigerant 200 from the cooling circuit 300 into the first pipeline 13, and then returns to the first liquid storage tank 12. In this case, the first pipeline 13 forms a pipeline for the refrigerant 200 to flow from the cooling circuit 300 to the first liquid storage tank 12.

[0047] Furthermore, the cooling system 10 of the present application further includes an air extraction valve 15. The air extraction valve 15 is disposed on the first pipeline 13 and connected to the heat exchange component 11. The air extraction valve 15 refers to a component that utilizes the principle of conservation of fluid momentum and the principle of conservation of mass to perform fluid fusion. For example, the air extraction valve 15 may be an ejector. Figure 3As shown, the air extraction valve 15 generally includes three parts, a nozzle 151, a suction chamber 152 and a diffuser 153, which are interconnected. The nozzle 151 is provided with an inlet 1511, the suction chamber 152 is provided with a suction port 1521, and the diffuser 153 is provided with an outlet 1531. The suction port 1521 of the air extraction valve 15 is connected to the heat exchange component 11, and the inlet 1511 and the outlet 1531 are respectively connected to the first pipeline 13. The process of air extraction is as follows: first, the liquid refrigerant 200 with a certain pressure coming out of the first pump 14 enters the nozzle 151 through the inlet 1511. Since the nozzle 151 is a shape with a tapered cross section, the pressure of the refrigerant 200 is reduced and the flow rate is increased, thereby forming a low-pressure area at the nozzle 151, and then the gas in the heat exchange component 11 is sucked into the suction chamber 152 through the suction port 1521. Then, the gas in the heat exchange component 11 is fully mixed with the liquid refrigerant 200 sprayed from the nozzle 151. Finally, the mixture of gas and liquid refrigerant 200 is ejected from the diffuser pipe 153 .

[0048] The cooling system 10 of the present application is provided with a first pipeline 13, a first pump 14 and an air extraction valve 15. In addition, the first pipeline 13 is a passage for the circulation of the refrigerant 200, and the first pump 14 is configured to drive the refrigerant 200 in the first pipeline 13. The air extraction valve 15 is arranged on the first pipeline 13 and connected to the heat exchange component 11. When the first pump 14 drives the refrigerant 200 to circulate in the first pipeline 13, a negative pressure area is formed in the air extraction valve 15, so that the gas in the heat exchange component 11, such as air or a mixture of air and gaseous refrigerant, is drawn into the first pipeline 13, and finally the gas is discharged into the first liquid storage tank 12. In this way, the degassing of the cooling system 10 can be achieved through the active air extraction work of the first pump 14 and the air extraction valve 15, so as to avoid the existence of too much non-condensable gas in the cooling system 10, thereby facilitating the improvement of the heat dissipation efficiency and stability of the cooling system 10. In addition, due to the entry of gas into the first liquid storage tank 12, the air pressure in the first liquid storage tank 12 increases. In this way, more gaseous refrigerant 200 will be liquefied in the first liquid storage tank 12, which is also conducive to improving the liquid storage effect of the first liquid storage tank 12 and the separation effect of the refrigerant 200. On the third aspect, a negative pressure zone is formed in the air extraction valve 15, which can not only extract gas but also liquid. In other words, when the refrigerant 200 in the cooling system 10 is excessive, the liquid level of the liquid refrigerant 200 in the heat exchange component 11 will be higher than the connection position of the air extraction valve 15 and the heat exchange component 11. At this time, the air extraction valve 15 can automatically draw the liquid refrigerant 200 in the heat exchange component 11 into the first liquid storage tank 12. In this way, it is also conducive to realizing the automatic liquid level control function of the cooling system 10 and improving the utilization rate of the refrigerant 200. On the fourth aspect, due to the existence of the air extraction valve 15, regardless of whether the cooling circuit 300 is circulated, the cooling system 10 of the present application is in a slightly negative pressure state as a whole. In this way, the leakage of the refrigerant 200 can also be avoided, thereby improving the safety of the refrigerant 200.

[0049] Optionally, in some embodiments, Figure 1 and Figure 2 As shown, the heat exchange component 11 of the cooling system 10 can be connected to multiple loads 100 to improve the heat dissipation efficiency. Figure 1 As shown, multiple loads 100 are arranged in parallel in a cooling circuit 300, and a liquid distributor 400 is arranged at the input end of the multiple loads 100 to divide a circuit into multiple branches. A gas collector 500 is arranged at the output end of the multiple loads 100 to collect the refrigerant 200 after cooling the loads 100 in the multiple branches.

[0050] Optionally, each load 100 may be disposed in a housing 600 filled with refrigerant 200, such as a knife housing, a water tank, etc. Optionally, each housing 600 is provided with an inlet 610 and an outlet 620 to be connected to the liquid distributor 400 and the gas collector 500, respectively.

[0051] Optionally, a liquid level sensor 630 is also provided on each accommodating cavity 600 to monitor the liquid level of the refrigerant 200 in the accommodating cavity 600 at any time.

[0052] Optionally, each accommodating cavity 600 is further provided with an inlet switch valve 640 to control the on-off of each branch separately, thereby flexibly controlling the cooling system 10 to cool the load 100 that needs to be cooled.

[0053] In some embodiments, Figure 1 As shown, the cooling system 10 also includes a second liquid storage tank 16 and a first switch valve 161. The second liquid storage tank 16 is connected to the top of the first liquid storage tank 12, and the first switch valve 161 is arranged on the connecting pipeline between the second liquid storage tank 16 and the first liquid storage tank 12.

[0054] In this embodiment, the cooling system 10 further includes a second liquid storage tank 16 and a first switch valve 161. The second liquid storage tank 16 is a tank for storing and recovering the refrigerant 200, and the first switch valve 161 can control the on-off of the connecting pipeline between the second liquid storage tank 16 and the first liquid storage tank 12. The first switch valve 161 can be, for example, a solenoid valve or a mechanical switch valve. When the air extraction valve 15 draws the gas in the heat exchange component 11 into the first liquid storage tank 12, the air pressure in the first liquid storage tank 12 will increase. In this way, more gaseous refrigerant 200 will be liquefied, so that the content of the gaseous refrigerant 200 in the upper part of the first liquid storage tank 12 becomes less and less, while the air content becomes higher and higher. When the air pressure in the first liquid storage tank 12 reaches a preset pressure value, the first switch valve 161 can be opened. At this time, a large amount of air and a small amount of gaseous refrigerant 200 in the first liquid storage tank 12 can flow into the second liquid storage tank 16. In this way, the second liquid storage tank 16 can further recycle the gas extracted by the air extraction valve 15 , thereby helping to improve the energy utilization rate of the cooling system 10 .

[0055] Alternatively, if Figure 1 As shown, the second liquid storage tank 16 is also filled with cooling water 164, and the top of the second liquid storage tank 16 is provided with an exhaust valve 162, and the bottom is provided with a first drain port 163. In this way, by filling the cooling water 164, on the first hand, a small amount of gaseous refrigerant 200 entering the second liquid storage tank 16 is also liquefied. In addition, since the density of the liquid refrigerant 200 is greater than that of water, it is deposited at the bottom of the cooling water 164, and then the liquid refrigerant 200 can be recycled and reused through the first drain port 163. On the second hand, a large amount of air entering the second liquid storage tank 16 floats on the upper part of the cooling water 164, and after the air pressure in the second liquid storage tank 16 is greater than the preset air pressure, the air can be discharged through the exhaust valve 162. In other words, the cooling water 164 can make a large amount of air entering the second liquid storage tank 16 and a small amount of gaseous refrigerant 200 realize stratification, thereby realizing the discharge of air and the recycling of refrigerant 200. In addition, the liquid refrigerant 200 is located below the cooling water 164, which can also prevent the liquid refrigerant 200 from evaporating.

[0056] In this way, the present application can achieve triple separation of the refrigerant 200 through the heat exchange component 11, the air extraction valve 15, the first liquid storage tank 12 and the second liquid storage tank 16. The first separation is that the heat exchange component 11 cools the high-temperature liquid refrigerant 200 to liquefy it, thereby performing the first separation with the air. At this time, there is liquid refrigerant 200 at the bottom and air and gaseous refrigerant 200 at the top in the heat exchange component 11. The second separation is that the air extraction valve 15 draws the air and gaseous refrigerant 200 in the heat exchange component 11 into the first liquid storage tank 12. As the air pressure in the first liquid storage tank 12 continues to increase, the gaseous refrigerant 200 in the first liquid storage tank 12 is further reduced, and the air content increases. The third separation is that the second liquid storage tank 16 receives the gas discharged from the first liquid storage tank 12, and through the condensation of cooling water, the second liquid storage tank 16 is layered into three parts: air, cooling water, and liquid refrigerant 200, and finally all the refrigerant 200 is successfully separated. This is beneficial to improving the recovery effect of the refrigerant 200 of the cooling system 10.

[0057] In some embodiments, Figure 1As shown, the heat exchange component 11 includes a heat exchanger 111 and a third liquid storage tank 112 connected to the heat exchanger 111, and the air extraction valve 15 is connected to the third liquid storage tank 112. Among them, the heat exchanger 111 and the third liquid storage tank 112 are an integrated structure. This embodiment proposes one of the structures of the heat exchange component 11. Specifically, the heat exchange component 11 includes a heat exchanger 111 and a third liquid storage tank 112. The heat exchanger 111 is configured to be connected to an external cooling device 700, so as to perform heat exchange on the refrigerant 200 flowing out of the load 100, and the third liquid storage tank 112 can receive the liquid refrigerant 200 condensed by the heat exchanger 111 and the uncondensed gaseous refrigerant 200. Furthermore, the heat exchanger 111 and the third liquid storage tank 112 are an integrated structure, so that the structure of the entire cooling system 10 is compact, which is conducive to improving the layout convenience of the cooling system 10.

[0058] In other embodiments, Figure 4 As shown, the heat exchanger 111 and the third liquid storage tank 112 are split structures. In this way, the volume of the third liquid storage tank 112 will not be affected by the heat exchanger 111, so that the heat dissipation power of the heat exchanger 111 and the volume of the third liquid storage tank 112 can be flexibly matched, thereby facilitating the design diversity of the cooling system 10.

[0059] In some embodiments, Figure 1 As shown, the cooling system 10 also includes a liquid replenishing pipeline 17, one end of which is connected to the third liquid storage tank 112 of the heat exchange component 11, and the other end is connected to the bottom of the first liquid storage tank 12. In this embodiment, the cooling system 10 also includes a liquid replenishing pipeline 17. By setting the liquid replenishing pipeline 17, the refrigerant 200 of the first liquid storage tank 12 can be replenished into the third liquid storage tank 112 of the heat exchange component 11 to maintain the normal operation of the cooling system 10. Furthermore, the refrigerant 200 of the first liquid storage tank 12 can be automatically replenished into the third liquid storage tank 112 by gravity; or, the refrigerant 200 of the first liquid storage tank 12 can be driven to replenish into the third liquid storage tank 112 by setting a driving pump, and the present application does not impose any restrictions on this.

[0060] Alternatively, if Figure 1 As shown, a second switch valve 171 is provided on the liquid replenishing pipeline 17, and a first liquid level sensor 1121 is provided in the third liquid storage tank 112. The first liquid level sensor 1121 is positioned to detect the liquid level of the refrigerant 200 in the third liquid storage tank 112 and send a liquid level signal. When the liquid level signal is lower than a preset liquid level threshold, the second switch valve 171 is opened.

[0061] In this embodiment, a second switch valve 171 is provided on the liquid replenishment pipeline 17, and a first liquid level sensor 1121 is provided in the third liquid storage tank 112. The second switch valve 171 can be opened or closed according to the liquid level signal sent by the first liquid level sensor 1121 on the third liquid storage tank 112. Specifically, when the liquid level signal is lower than the preset liquid level threshold, the second switch valve 171 is opened. At this time, the liquid replenishment pipeline 17 is opened, and the refrigerant 200 in the first liquid storage tank 12 can be added to the cooling circuit 300 to maintain the stable operation of the cooling circuit 300. When the liquid level signal is equal to or higher than the preset liquid level threshold, the second switch valve 171 is closed to avoid excessive refrigerant 200 in the cooling circuit 300. In this way, the automatic liquid replenishment function of the cooling system 10 can be realized.

[0062] Furthermore, if Figure 1 As shown, a third liquid drain port 1122 is provided at the bottom of the third liquid storage tank 112. When the liquid level is too high, the refrigerant 200 can be recovered through the third liquid drain port 1122.

[0063] In some embodiments, Figure 1 As shown, a second liquid level sensor 121 is provided on the first liquid storage tank 12, and a second liquid discharge port 122 is provided at the bottom. In this way, the second liquid level sensor 121 can monitor the liquid level of the refrigerant 200 in the first liquid storage tank 12 in real time. When the liquid level is too high, the refrigerant 200 can be recovered through the second liquid discharge port 122.

[0064] In some embodiments, Figure 1 As shown, both ends of the first pipeline 13 are connected to the first liquid storage tank 12 , the first pump 14 is disposed in the first pipeline 13 , and the air extraction valve 15 is located at one side of the outflow port of the first pump 14 .

[0065] In this embodiment, both ends of the first pipeline 13 are connected to the first liquid storage tank 12, that is, the first pipeline 13 forms a circulation pipeline for the refrigerant 200 on the first liquid storage tank 12. Since the first liquid storage tank 12 contains liquid refrigerant 200, gaseous refrigerant 200 and air, and the liquid refrigerant 200 is located below the gaseous refrigerant 200 and the air. Therefore, preferably, one end of the first pipeline 13 is arranged at the bottom of the first liquid storage tank 12, which is the inlet of the refrigerant 200; the other end is arranged at the top of the first liquid storage tank 12, which is the outlet of the refrigerant 200. In this way, the liquid refrigerant 200 circulates in the first pipeline 13, which is conducive to improving the working efficiency of the first pump 14.

[0066] In some embodiments, Figure 1As shown, the cooling system 10 also includes a controller (not shown), a pressure sensor 18, a third switch valve 19 and a fourth switch valve 20. The pressure sensor 18 and the third switch valve 19 are both connected to the heat exchange component 11. The fourth switch valve 20 is arranged on the connecting pipeline between the air extraction valve 15 and the heat exchange component 11. The pressure sensor 18 is used to obtain the pressure signal in the heat exchange component 11. The controller is electrically connected to the first pump 14, the pressure sensor 18, the third switch valve 19 and the fourth switch valve 20. The controller is configured to receive the pressure signal, and when the pressure signal is greater than a preset first pressure threshold, the first pump 14 and the fourth switch valve 20 are turned on, and the third switch valve 19 is turned off. The controller is also configured to receive the pressure signal, and when the pressure signal is less than a preset second pressure threshold, the first pump 14 and the fourth switch valve 20 are turned off, and the third switch valve 19 is turned on. The first pressure threshold is greater than the second pressure threshold.

[0067] In this embodiment, by setting a controller, the pressure on the cooling circuit 300 of the cooling system 10 can be flexibly controlled. Specifically, the pressure sensor 18 can measure the pressure in the heat exchange component 11 and send a pressure signal. The third switch valve 19 can control the connection and disconnection of the heat exchange component 11 and the outside atmosphere. When the pressure signal is greater than the preset first pressure threshold, it indicates that the pressure of the system cooling circuit 300 is too high. At this time, the first pump 14 and the fourth switch valve 20 are opened, and the third switch valve 19 is closed. In this way, the first pipeline 13 starts to operate, and the gas in the heat exchange component 11 enters the first liquid storage tank 12 through the exhaust valve 15, and the cooling circuit 300 is disconnected from the outside atmosphere. In this way, the air and gaseous refrigerant 200 in the cooling circuit 300 are reduced, thereby reducing its pressure. When the pressure signal is less than the preset second pressure threshold, it indicates that the pressure of the system cooling circuit 300 is too low. At this time, the first pump 14 and the fourth switch valve 20 are closed, and the third switch valve 19 is opened. In this way, the pipeline between the air extraction valve 15 and the heat exchange component 11 is disconnected, and the cooling circuit 300 is in contact with the outside atmosphere through the third switch valve 19. In this way, the outside atmosphere can replenish air into the cooling circuit 300, thereby increasing its pressure.

[0068] Alternatively, if Figure 1 As shown, a temperature sensor 113 is also provided on the heat exchange component 11. In this way, the temperature signal of the heat exchange component 11 can also be obtained in real time.

[0069] In some embodiments, the cooling system 10 further includes a second pump 21 disposed on the cooling circuit 300, and the second pump 21 is located between the outlet of the heat exchange component 11 and the load 100. By providing the second pump 21, a driving force for the refrigerant 200 in the cooling circuit 300 can be provided.

[0070] Optionally, the second pump 21 includes a first sub-pump 21a and a second sub-pump 21b arranged in parallel. This is conducive to increasing the flow rate of the cooling circuit 300 and improving the reliability of the cooling system 10. Optionally, a first one-way valve 21c located at the outlet side of the first sub-pump 21a or the second sub-pump 21b is also arranged on each parallel branch, which is conducive to further improving the reliability of the cooling system 10.

[0071] Furthermore, if Figure 1 As shown, the cooling system 10 further includes a drain pipe 22, one end of which is connected to the cooling circuit 300 and is located at the outlet side of the second pump 21, and the other end of which is connected to the bottom of the first liquid storage tank 12. In this embodiment, by providing the drain pipe 22, the excess refrigerant 200 in the cooling circuit 300 can be discharged into the first liquid storage tank 12, which is conducive to improving the convenience of controlling the liquid level in the third liquid storage tank 112.

[0072] Optionally, the liquid discharge pipeline 22 is further provided with a seventh switch valve 221. In this way, the opening and closing of the liquid discharge pipeline 22 can be flexibly controlled by the seventh switch valve 221.

[0073] It should be noted that in Figure 1 In the cooling system 10 shown, the excess refrigerant 200 in the cooling circuit 300 can be discharged into the first liquid storage tank 12 through the connecting pipeline between the air extraction valve 15 and the third liquid storage tank 112 of the heat exchange component 11. The excess refrigerant 200 in the cooling circuit 300 can also be discharged into the first liquid storage tank 12 through the drainage pipeline 22. Alternatively, the excess refrigerant 200 in the cooling circuit 300 can be discharged into the first liquid storage tank 12 by the above two methods at the same time, which is conducive to improving the drainage efficiency.

[0074] In some embodiments, Figure 2 As shown, the first pump 14 is disposed on the cooling circuit 300 and is located between the outlet of the heat exchange assembly 11 and the load 100. One end of the first pipeline 13 is connected to the first liquid storage tank 12, and the other end is connected to the cooling circuit 300 and is located at the outlet side of the first pump 14.

[0075] In this embodiment, one end of the first pipeline 13 is connected to the first liquid storage tank 12, and the other end is connected to the cooling circuit 300 and is located on the outlet side of the first pump 14. That is to say, the first pipeline 13 forms a pipeline for the refrigerant 200 to flow from the cooling circuit 300 to the first liquid storage tank 12. At this time, the first pump 14 has two functions. The first is to act as a driving pump on the cooling circuit 300 to drive the refrigerant 200 to circulate in the cooling circuit. The second is to act as a driving pump of the first pipeline 13 to drive the refrigerant 200 from the cooling circuit 300 to the first liquid storage tank 12, thereby forming a negative pressure area at the exhaust valve 15 to extract the gas in the third liquid storage tank 112 of the heat exchange component 11. In this way, two functions can be achieved at the same time through one driving pump, which is conducive to simplifying the structure of the cooling system 10 and reducing costs.

[0076] In some embodiments, Figure 2 As shown, the first pump 14 includes a third sub-pump 14a and a fourth sub-pump 14b arranged in parallel. This is conducive to increasing the flow rate of the cooling circuit 300 and improving the reliability of the cooling system 10. Optionally, a second one-way valve 14c located at the outlet side of the third sub-pump 14a or the fourth sub-pump 14b is also provided on each parallel branch, which is conducive to further improving the reliability of the cooling system 10.

[0077] In some embodiments, the cooling system 10 further includes a fifth switch valve 131 disposed on the first pipeline 13 and a sixth switch valve 132 disposed on the connecting pipeline between the air extraction valve 15 and the heat exchange component 11. In this way, the opening and closing of the first pipeline 13 can be controlled by the fifth switch valve 131, and the opening and closing of the connecting pipeline between the air extraction valve 15 and the heat exchange component 11 can be controlled by the sixth switch valve 132. When the pressure of the cooling circuit 300 of the cooling system 10 is relatively low, the fifth switch valve 131 can be closed, and the third switch valve 19 on the heat exchange component 11 can be opened, so that the external atmosphere can enter the cooling circuit 300. When the pressure of the cooling circuit 300 of the cooling system 10 is relatively high, the fifth switch valve 131 and the sixth switch valve 132 can be opened, and the third switch valve 19 on the heat exchange component 11 can be closed, so that the gas in the cooling circuit 300 is discharged into the first liquid storage tank 12 through the air extraction valve 15 and the first pipeline 13.

[0078] In addition, when the liquid level signal of the first liquid level sensor 1121 in the third liquid storage tank 112 is higher than the preset liquid level threshold, the fifth switch valve 131 can be opened, or the fifth switch valve 131 and the sixth switch valve 132 can be opened at the same time, and the operating frequency of the first pump 14 can be increased, so that the liquid refrigerant 200 in the third liquid storage tank 112 can be discharged into the first liquid storage tank 12 through at least one of the first pipeline 13 and the exhaust valve 15.

[0079] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0080] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A cooling system for cooling a heat load, characterized in that: include: A heat exchange component, the heat exchange component is configured to be connected to the load to form a cooling circuit for circulating a refrigerant therebetween; A first liquid storage tank, used for storing refrigerant; a first pipeline, one end of the cooling circuit is connected to the first liquid storage tank, and the other end is connected to the first liquid storage tank or the cooling circuit; a first pump configured to drive a refrigerant in the cooling circuit; as well as An air extraction valve is arranged on the cooling circuit and connected to the heat exchange component.

2. The cooling system according to claim 1, characterized in that: The cooling system further includes a second liquid storage tank and a first switch valve, wherein the second liquid storage tank is connected to the top of the first liquid storage tank, and the first switch valve is arranged on a connecting pipeline between the second liquid storage tank and the first liquid storage tank.

3. The cooling system according to claim 1, characterized in that: The heat exchange assembly includes a heat exchanger and a third liquid storage tank communicated with the heat exchanger, and the air extraction valve is connected to the third liquid storage tank; Wherein, the heat exchanger and the third liquid storage tank are an integrated structure; Alternatively, the heat exchanger and the third liquid storage tank are of split structure.

4. The cooling system according to claim 3, characterized in that: The cooling system further comprises a liquid replenishing pipeline, one end of which is connected to the third liquid storage tank, and the other end of which is connected to the bottom of the first liquid storage tank.

5. The cooling system according to claim 4, characterized in that: The cooling system further comprises a second switch valve disposed on the liquid replenishing pipeline and a first liquid level sensor disposed on the third liquid storage tank, wherein the first liquid level sensor is positioned to detect the liquid level of the refrigerant in the third liquid storage tank and to send a liquid level signal; When the liquid level signal is lower than a preset liquid level threshold, the second switch valve is opened.

6. The cooling system according to any one of claims 1 to 5, characterized in that: Both ends of the cooling circuit are connected to the first liquid storage tank, the first pump is arranged in the cooling circuit, and the air extraction valve is located at one side of the outflow port of the first pump.

7. The cooling system according to claim 6, characterized in that: The cooling system further includes a controller, a pressure sensor, a third switch valve and a fourth switch valve, wherein the pressure sensor and the third switch valve are both connected to the heat exchange component, and the fourth switch valve is arranged on a connecting pipeline between the air extraction valve and the heat exchange component; The pressure sensor is used to obtain the pressure signal in the heat exchange component; The controller is electrically connected to the first pump, the pressure sensor, the third switch valve and the fourth switch valve; The controller is configured to receive the pressure signal, and when the pressure signal is greater than a preset first pressure threshold, turn on the first pump and the fourth switch valve, and turn off the third switch valve; The controller is also configured to receive the pressure signal, and to close the first pump and the fourth switch valve and open the third switch valve when the pressure signal is less than a preset second pressure threshold, and the first pressure threshold is greater than the second pressure threshold.

8. The cooling system according to claim 6, characterized in that The cooling system further comprises a second pump disposed on the cooling circuit, wherein the second pump is located between the outlet of the heat exchange component and the load; The cooling system further includes a liquid discharge pipeline, one end of which is connected to the cooling circuit and located at the outlet side of the second pump, and the other end of which is connected to the bottom of the first liquid storage tank.

9. The cooling system according to any one of claims 1 to 5, characterized in that: The first pump is disposed on the cooling circuit, and the first pump is located between the outlet of the heat exchange component and the load; One end of the cooling circuit is connected to the first liquid storage tank, and the other end is connected to the cooling circuit and is located at the outlet side of the first pump.

10. The cooling system according to claim 9, characterized in that The cooling system further includes a fifth switch valve disposed on the cooling circuit and a sixth switch valve disposed on a connecting pipeline between the air extraction valve and the heat exchange component.

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