Diamond substrate cleaning equipment and cleaning method

Abstract

The invention relates to the technical field of cleaning equipment, and particularly discloses diamond substrate cleaning equipment and a cleaning method.The cleaning equipment comprises a cleaning tank, a cleaning jig and a cleaning mechanism, the cleaning mechanism comprises a plurality of cleaning parts, mounting assemblies, assembling parts and driving parts, and the cleaning parts are connected with the mounting assemblies in a one-to-one correspondence mode; the cleaning part is in friction contact with the substrate, any assembly part is rotationally connected with two mounting assemblies, the two mounting assemblies connected with the same assembly part are connected with the same driving part, the driving part drives the two mounting assemblies to rotate relatively, and the cleaning method comprises the steps of pretreatment, acid pickling, hydrofluoric acid cleaning, plasma cleaning, final cleaning, protection and transfer. The cleaning equipment provided by the invention ensures that the substrate is in full contact with the cleaning solution in the pretreatment cleaning operation, the pretreatment cleaning effect of the substrate is improved, and meanwhile, the possibility that impurities in the solution are attached to the surface of the substrate is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of cleaning equipment, and in particular to a diamond substrate cleaning device and a cleaning method. Background Art

[0002] Diamond substrate is an advanced material used in semiconductor and optical applications. Cleaning of diamond substrate is a key step to ensure its surface cleanliness and the success of subsequent processes. The purpose of cleaning is to remove organic pollutants, dust particles and other impurities on the surface of the substrate, and provide a clean interface for subsequent deposition, etching or other treatments. When cleaning diamond substrates, pretreatment is first performed, that is, using solvents such as ionized water, acetone or ethanol, and cleaning in an ultrasonic bath to remove surface particles and loose dirt. If the substrate is directly placed in an ultrasonic cleaning container, the bottom end face of the substrate may fit the cleaning container and cannot fully contact with the solution, resulting in unsatisfactory substrate cleaning effect.

[0003] The patent document with authorization announcement number CN211938193U discloses an ultrasonic cleaning device for semiconductor display substrates, including a cleaning tank, an ultrasonic generating device, a cleaning jig and a driving mechanism. The ultrasonic generating device is arranged in the cleaning tank. The cleaning jig is used to place the semiconductor display substrate, including a mounting frame, two support plates and a locking structure. The two support plates are respectively arranged at the two ends of the inner side of the mounting frame and are slidably connected to the mounting frame. The opposite sides of the two support plates are respectively provided with mutually matching V-shaped grooves. The locking structure is used to lock the positions of the two support plates. The driving mechanism is used to drive the cleaning jig to perform reciprocating linear motion up and down.

[0004] When the cleaning device provided by the above patent document cleans the substrate, the semiconductor is inserted into the cleaning jig, and then the driving mechanism drives the cleaning jig to move downward, and the cleaning jig carries the substrate into the cleaning tank. Under the action of the ultrasonic generator, the substrate is cleaned. After the cleaning operation is completed, the driving mechanism drives the cleaning jig to move upward and leave the cleaning tank. The cleaned substrate is removed to complete a cleaning operation. The substrate is connected to the V-groove on the support plate, and the connection between the substrate and the V-groove is blocked and cannot fully contact with the cleaning solution, which will affect the cleaning effect of the substrate. In addition, the impurities on the substrate are separated from the substrate under the action of ultrasonic waves and enter the solution. When the substrate is taken out, the impurities floating in the solution may re-attach to the substrate, and too many impurities floating in the cleaning solution will also affect the cleaning of the substrate. Summary of the invention

[0005] The present invention provides a diamond substrate cleaning device and a cleaning method, aiming to solve the problem in the related art that when an ultrasonic cleaning device is used to perform a pre-cleaning treatment on a substrate, the substrate surface cannot be fully contacted with the cleaning solution, and the impurities floating in the cleaning solution are easily reattached to the substrate, thus affecting the substrate cleaning effect.

[0006] A diamond substrate cleaning device of the present invention comprises a cleaning tank, in which an ultrasonic generator is arranged, a cleaning jig and a cleaning mechanism, wherein the cleaning jig is provided with a plurality of mounting positions for mounting a substrate, the substrate and the cleaning jig are detachably connected and rotatably matched, and the cleaning mechanism comprises: A cleaning member, wherein there are a plurality of cleaning members, each of which is in a fan-shaped block shape, and the cleaning member is deformed by extrusion; A mounting assembly, wherein the mounting assembly has multiple groups, each of the mounting assemblies corresponds to each of the cleaning members one by one, the mounting assembly comprises a movable member, a guide member and an extrusion member, the movable member, the guide member and the extrusion member surround a space matching the shape of the cleaning member, the thickness of the cleaning member is greater than the thickness of the mounting assembly, and the cleaning member is used for frictional contact with the end surface of the substrate; An assembly part, wherein the assembly parts have multiple groups, and any of the assembly parts is rotatably connected to two groups of the installation components and two cleaning parts, and the axes of the two groups of the installation components coincide; A driving member, wherein the two groups of assembly components connected to the same assembly member are connected to the same driving member, and the driving member drives the two groups of installation components to rotate synchronously relative to each other.

[0007] The beneficial effects are: the substrate is fully and completely in contact with the cleaning solution in the cleaning tank, ensuring the cleaning effect of the substrate in the pretreatment operation; the substrate and the cleaning jig are detachably connected and rotatably matched; the cleaning mechanism is used to make frictional contact with the substrate through the cleaning member during substrate cleaning, so that the substrate rotates relative to the cleaning jig, avoiding the occurrence of a cleaning blind spot at the connection between the substrate and the cleaning jig, and ensuring that the substrate is fully cleaned; in addition, when the cleaning mechanism drives the substrate to rotate through the cleaning member, the friction generated by the cleaning member on the substrate can also promote the shedding of some impurities on the surface of the substrate, reduce the adhesion of impurities in the clear solution on the surface of the substrate, and improve the cleaning effect of the substrate.

[0008] Preferably, the lower ends of the movable member and the extrusion member are both rotatably matched with the assembly member, the guide member is in an arc shape, the movable member and the extrusion member are slidably matched with the guide member along the axial direction and the circumferential direction of the guide member at the same time, the arc-shaped end of the cleaning member is connected to the guide member, the cleaning member is fixed relative to the movable member, the cleaning member is in movably contact with the extrusion member, a plurality of water filtering holes are provided on the extrusion member, and two extrusion members connected to the same assembly member are arranged adjacent to each other; The cleaning tank is also provided with a collecting component for collecting impurities, and the assembly is provided with a guide hole connected to the collecting component. When the two cleaning parts relatively connected to the same assembly are squeezed by the extrusion part, the guide hole opens.

[0009] Preferably, the collecting assembly comprises a collecting chamber and a flow guide tube, and there are multiple flow guide tubes, the lower end of each of the flow guide tubes is connected to the collecting chamber, and the upper end of each of the flow guide tubes is respectively connected to the flow guide holes on each of the assembly parts.

[0010] The beneficial effects are: reducing floating impurities in the cleaning solution, and when the cleaning parts are relatively close, they can push the impurities on the surface of the substrate to between the two extrusion parts, and allow the solution with high impurity content to enter the collection component through the guide holes on the assembly, thereby reducing the content of impurities in the cleaning solution, thereby reducing the attachment of impurities to the surface of the substrate, and at the same time extending the use time of the cleaning solution.

[0011] Preferably, two blocking blocks are elastically connected to the guide hole, and the lower ends of the two extrusion members are movably abutted against the two blocking blocks respectively. When the two extrusion members are relatively close to each other, the two blocking blocks are squeezed to rotate relative to the guide hole until the guide hole is opened.

[0012] Preferably, a lifting mechanism is further provided in the cleaning tank, and the lifting mechanism has two groups, and the two groups of the lifting mechanism are symmetrically arranged with respect to the axial plane of each substrate; The lifting mechanism comprises a cylinder and a lifting member, wherein the cylinder is installed at the bottom of the cleaning tank, the protruding end of the cylinder is connected to the lifting member, and the cleaning fixture is detachably connected to the lifting member.

[0013] Preferably, a support plate is fixed inside the cleaning tank, a plurality of support rods are fixed on the support plate, each of the support rods is longitudinally slidably connected with a guide block, and each of the guide members is slidably matched with each of the guide blocks; The lifting member is also provided with an arc-shaped guide groove, and the movable members located on the same side are connected by a same connecting rod, and the connecting rod is slidably matched with the guide groove.

[0014] The beneficial effects are: it is easy to take and place the cleaning jig relative to the cleaning tank, the cleaning jig and the lifting piece are detachably connected, and the lifting piece is pushed up by the cylinder, which facilitates the fixing operation of the cleaning jig and the lifting piece.

[0015] Preferably, the cleaning jig is provided with two mounting strips, and the opposite end surfaces of the two mounting strips are provided with a plurality of mounting grooves, the substrate is rotatably matched with the mounting grooves, and a damping structure is provided in each mounting groove on one mounting strip, the damping structure includes a damping groove and a damping block, the depth of each damping groove increases or decreases uniformly from top to bottom, each damping block is slidably matched with each damping groove respectively, and the damping block partially extends out of the damping groove and contacts the substrate.

[0016] Preferably, at least one of the mounting strips is detachably connected to the cleaning tool.

[0017] The beneficial effects are as follows: it is convenient to install the substrate and the cleaning jig. When installing the substrate, first remove one installation bar, then place each substrate in each installation groove on another installation bar, and finally reinstall the removed installation bar on the cleaning jig, and make the installation groove on the installation bar face the substrate. The assembly of the substrate and the cleaning jig can be completed, and the rotational coordination of the substrate and the cleaning jig can be realized; the damping structure further limits the unidirectional rotation of the substrate relative to the cleaning jig, ensuring that the substrate is fully in contact with the cleaning solution.

[0018] Preferably, among the two cleaning members connected to the same assembly member, one of the cleaning members is provided with a damping strip, and the damping strip is in contact with the substrate.

[0019] The beneficial effect is: the substrate is promoted to rotate relative to the cleaning jig, and when the cleaning member with the damping strip is attached to the substrate and rotates, a greater friction force can be generated, so that the friction effect of the two cleaning members on the substrate is different, thereby promoting the smooth rotation of the substrate.

[0020] A diamond substrate cleaning method comprises the following steps: S1, pretreatment, cleaning the substrate by using the diamond substrate cleaning device provided by the present invention; S2, pickling, immersing the substrate in Piranha solution, maintaining the temperature at 60-80°C for 10-20 minutes; S3, hydrofluoric acid cleaning, immersing the substrate in a diluted hydrofluoric acid solution for 1-5 minutes; S4, plasma cleaning, using oxygen or argon plasma treatment to remove residual organic matter and activate the substrate surface; S5, final cleaning, using the diamond substrate cleaning device provided by the present invention to clean the substrate again, and then drying it; S6. Protection and transfer: immediately transfer the cleaned substrate to a clean room or inert atmosphere to avoid re-contamination of the substrate.

[0021] The beneficial effects are as follows: the cleaning effect in the substrate pretreatment operation is ensured, the substrate and the cleaning jig are detachably connected and rotatably matched, the cleaning mechanism is used to make the substrate rotate relative to the cleaning jig through frictional contact with the substrate through the cleaning member when the substrate is cleaned, thereby avoiding a cleaning blind spot at the connection between the substrate and the cleaning jig, and ensuring that the substrate is fully cleaned. In addition, when the cleaning mechanism drives the substrate to rotate through the cleaning member, the friction generated by the cleaning member on the substrate can also promote the shedding of some impurities on the surface of the substrate, further improving the cleaning effect of the substrate.

[0022] The beneficial effects of the present invention are: (1) The substrate is fully and completely in contact with the cleaning solution in the cleaning tank to ensure the cleaning effect of the substrate in the pretreatment operation. The substrate and the cleaning jig can be detachably connected and rotated together. The cleaning mechanism is used to make friction contact with the substrate through the cleaning member during substrate cleaning, so that the substrate rotates relative to the cleaning jig to avoid a cleaning blind spot at the connection between the substrate and the cleaning jig, thereby ensuring that the substrate is fully cleaned. In addition, when the cleaning mechanism drives the substrate to rotate through the cleaning member, the friction generated by the cleaning member on the substrate can also promote the shedding of some impurities on the surface of the substrate, thereby improving the cleaning effect of the substrate.

[0023] (2) Reduce the impurities floating in the cleaning solution. When the cleaning parts are relatively close, the impurities on the surface of the substrate can be pushed between the two extrusion parts, and the solution with high impurity content can enter the collection component through the guide holes on the assembly, thereby reducing the content of impurities in the cleaning solution, thereby reducing the attachment of impurities on the surface of the substrate, and at the same time extending the use time of the cleaning solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0025] Figure 2 It is a structural schematic diagram of the cleaning fixture, cleaning mechanism and lifting mechanism assembly in the present invention.

[0026] Figure 3 It is a schematic diagram of the structure in which the cleaning fixture is not connected to the lifting mechanism in the present invention.

[0027] Figure 4 It is a schematic diagram of the connection structure between the lifting mechanism and the cleaning mechanism in the present invention.

[0028] Figure 5 It is a structural schematic diagram of the cleaning mechanism in the present invention.

[0029] Figure 6 It is a schematic structural diagram of the coordination between the damping structure and the mounting groove in the present invention.

[0030] Reference numerals: 1. Cleaning tank; 11. Support plate; 12. Support rod; 13. Collecting chamber; 14. Guide tube; 2. Cleaning fixture; 21. Mounting strip; 22. Mounting slot; 23. Damping slot; 24. Damping block; 25. Substrate; 3. Cylinder; 31. Lifting member; 32. Guide slot; 33. Connecting rod; 4. Cleaning member; 41. Movable member; 42. Extrusion member; 43. Guide member; 431. Guide block; 44. Assembly member; 441. Guide hole; 45. Driving member. DETAILED DESCRIPTION

[0031] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0032] like Figure 1 and Figure 2 As shown, the diamond substrate cleaning device of the present invention comprises a cleaning tank 1, a cleaning jig 2, a lifting mechanism and a cleaning mechanism. The cleaning tank 1 is provided with a cleaning solution and an ultrasonic generator. The cleaning mechanism and the lifting mechanism are both provided in the cleaning tank 1. The cleaning jig 2 is detachably connected to the lifting mechanism. The cleaning jig 2 is provided with a plurality of mounting positions for mounting a substrate 25. The substrate 25 is detachably mounted on each mounting position, and the substrate 25 is rotatably matched with the cleaning jig 2. When the substrate 25 is pre-cleaned, each substrate 25 is firstly mounted on each mounting position of the cleaning jig 2, and then the top of the lifting mechanism is driven to extend above the liquid level of the cleaning solution, and the cleaning jig 2 is fixed to the top of the lifting mechanism. Then, the lifting mechanism carries the cleaning jig 2 and the substrate 25 down to below the liquid level, and the ultrasonic generator is started to clean the substrate 25. During the cleaning operation, the cleaning mechanism is used to push the substrate 25 to rotate relative to the cleaning jig 2, so that the substrate 25 is fully in contact with the cleaning solution, and the connection between the substrate 25 and the cleaning jig 2 is avoided from being blocked, so as to ensure the pre-cleaning effect of the substrate 25.

[0033] like Figure 2 , Figure 3 and Figure 6As shown, the cleaning jig 2 can be plugged into and matched with the lifting mechanism, and two mounting strips 21 are provided on the cleaning jig 2. A plurality of mounting grooves 22 are provided on opposite end surfaces of the two mounting strips 21. The mounting grooves 22 are in an arc shape that matches the shape of the substrate 25, so that the substrate 25 can rotate relative to the mounting grooves 22 when installed in the mounting grooves 22, but will not be detached from the mounting grooves 22. In order not to affect the assembly operation of the substrate 25 and the cleaning jig 2, at least one mounting strip 21 is detachably connected to the cleaning jig 2, and the mounting strip 21 can be connected to the cleaning jig 2 by threading or plugging. When installing the substrate 25, first remove one mounting strip 21, and then place each substrate 25 one by one in each mounting groove 22 on the other mounting strip 21, and finally reinstall the removed mounting strip 21 on the cleaning jig 2, and make the mounting grooves 22 on the mounting strip 21 opposite to the substrate 25. After the substrate 25 is installed relative to the substrate 25, the cleaning jig 2 and the substrate 25 can be placed in the cleaning tank 1, and the cleaning jig 2 is fixed to the lifting mechanism.

[0034] like Figures 3 to 5 As shown, the cleaning mechanism includes a cleaning member 4, a mounting assembly, an assembly member 44 and a driving member 45. There are multiple cleaning members 4, each of which is in a fan-shaped block shape. The material used for the cleaning member 4 is a flexible material so that the cleaning member 4 can be deformed when it is squeezed. The material used for the cleaning member 4 is preferably sponge. There are multiple groups of mounting assemblies, and each group of mounting assemblies corresponds to each cleaning member 4 one by one. The mounting assembly includes a movable member 41, a guide member 43 and an extrusion member 42. The movable member 41, the guide member 43 and the extrusion member 42 surround a space that matches the shape of the cleaning member 4. The cleaning member 4 is installed in the space, and the thickness of the cleaning member 4 is greater than the thickness of the mounting assembly. , so that the cleaning member 4 can extend out of the mounting assembly and frictionally contact the end surface of the substrate 25. Multiple groups of assembly parts 44 are also provided. Two groups of mounting components and two cleaning members 4 are rotatably connected to any assembly part 44, and the rotation circles of the two groups of mounting components are consistent. The two groups of assembly components connected to the same assembly part 44 are connected to the same driving member 45. The driving member 45 drives the two groups of mounting components to rotate synchronously relative to each other, wherein the driving member 45 can be a double-headed cylinder 3, which is fixed relative to the assembly part 44, and the two protruding ends of the double-headed cylinder 3 are respectively connected to the movable parts 41 of the two groups of mounting components, and the two protruding ends of the double-headed cylinder 3 are synchronously extended and retracted.

[0035] When the two groups of mounting components connected to the same assembly part 44 rotate relative to each other, the cleaning member 4 drives the substrate 25 to rotate relative to the mounting groove 22 through the friction force. In order to promote the smooth rotation of the substrate 25, the friction between the two cleaning members 4 and the substrate 25 can be set differently, that is, a damping strip is set on one cleaning member 4, and the damping strip can be made of rubber material. The damping strip fits the substrate 25. When the cleaning member 4 with the additional damping strip fits the substrate 25 and rotates, a greater friction force can be generated, so that the friction effect of the two cleaning members 4 on the substrate 25 is different, thereby promoting the smooth rotation of the substrate 25.

[0036] like Figure 6 As shown, in order to smoothly promote the unidirectional rotation of the substrate 25 and make the substrate 25 fully contact with the cleaning solution, a damping structure can also be arranged in the mounting groove 22, the damping structure includes a damping block 24 and a damping groove 23, the damping groove 23 is arranged on the side wall of the mounting groove 22, the depth of each damping groove 23 increases or decreases uniformly from top to bottom, each damping block 24 is slidably matched with the damping groove 23 respectively, the damping block 24 partially extends out of the damping groove 23 and is in frictional contact with the substrate 25, when the substrate 25 rotates in one direction, the damping block 24 is located at the deep end of the damping groove 23, and the friction effect on the substrate 25 is small, when the substrate 25 rotates in the other direction, the damping block 24 is located at the shallow end of the damping groove 23, and the friction effect on the substrate 25 is large, when the damping block 24 moves to the shallow end of the damping groove 23, under the action of friction, the rotation of the substrate 25 is blocked, and the cooperation of the damping structure and the damping strip can better promote the rotation of the substrate 25 relative to the mounting groove 22 during the cleaning process.

[0037] In addition, when the cleaning member 4 rotates in contact with the substrate 25, it can also assist in removing some impurities on the surface of the substrate 25, making it easier for some impurities with strong adhesion to detach from the substrate 25, while reducing the possibility of floating impurities in the solution adhering to the surface of the substrate 25. The lower ends of the movable member 41 and the extrusion member 42 are both rotatably matched with the assembly member 44. The movable member 41 and the extrusion member 42 can both be long strips. The width of the movable member 41 and the extrusion member 42 is less than the thickness of the cleaning member 4. The guide member 43 is arc-shaped. The rotation center of the guide member 43 coincides with the rotation center of the movable member 41 and the extrusion member 42, that is, the length direction of the movable member 41 and the extrusion member 42 is consistent with the radial direction of the guide member 43. The movable member 41 and the extrusion member 42 are slidably matched with the guide member 43 along the axial direction and circumferential direction of the guide member 43 at the same time.

[0038] like Figure 4 and Figure 5As shown, specifically, the guide member 43 is provided with an arc-shaped through groove consistent with its shape, and the upper end of the movable member 41 extends into the through groove. The movable member 41 can slide along the through groove or penetrate the through groove and slide along its length direction. A slider is also slidably connected in the through groove, and a through hole is provided on the slider. The upper end of the extrusion member 42 is movably plugged into the through hole on the slider and can slide relative to the through groove in cooperation with the slider. The cleaning member 4 is fixed relative to the movable member 41, and the cleaning member 4 is in active contact with the extrusion member 42, that is, the central angle of the cleaning member 4 is slightly smaller than the central angle of the guide member 43. The extrusion member 42 is provided with a plurality of water filtering holes. Two extrusion members 42 connected to the same assembly member 44 are arranged adjacent to each other. When the two mounting components are relatively close to each other and rotate, the two guide members 43 gradually abut against each other, and the movable member 41 pushes the cleaning member 4 and the extrusion member 4 2, when the two cleaning members 4 are relatively close to each other, some impurities on the substrate 25 are pushed to the middle. When the cleaning member 4 moves to be pressed and contacted with the extrusion member 42, the water in the cleaning member 4 is squeezed and flows to the space between the two extrusion members 42, further pushing the impurities in the middle to flow downward in the space between the two extrusion members 42. A cleaning component for collecting impurities is also provided in the cleaning tank 1. The assembly member 44 is provided with a guide hole 441 for the collection component. When the two cleaning members connected to the same assembly member 44 are pressed and contacted with the extrusion member 42, the guide hole 441 is opened, and the sewage carrying impurities enters the collection component from the guide hole 441. By introducing a part of the solution with high impurity content into the collection component, the content of impurities in the cleaning solution can be reduced and the use time of the cleaning solution can be extended.

[0039] like Figures 3 to 5 As shown, the collecting assembly includes a collecting chamber 13 and a guide tube 14. There are multiple guide tubes 14. The lower end of each guide tube 14 is connected to the collecting chamber 13, and the upper end of each guide tube 14 is respectively connected to the guide hole 441 on each assembly part 44. An automatic valve can be set at the guide hole 441. When two groups of installation components are relatively close to the cleaning part 4 and the extrusion part 42 are relatively squeezed, the automatic valve automatically opens based on the change in pressure on the extrusion part 42, so that the sewage carrying more impurities pushed by the cleaning part 4 between the two extrusion parts 42 can smoothly enter the collecting assembly.

[0040] In other operating modes, the guide hole 441 can also be blocked by a blocking block. Specifically, two blocking blocks are elastically connected to the guide hole 441, and the blocking blocks can be connected to the guide hole 441 through a torsion spring. The blocking blocks block the guide hole 441 when not squeezed, and the lower ends of the two extrusion members 42 are movably abutted against the two blocking blocks respectively. When the two extrusion members 42 are relatively close to each other, the two blocking blocks are squeezed to rotate relative to the guide hole 441 until the guide hole 441 opens, and the torsion spring accumulates force. When the two extrusion members 42 are relatively far away from each other, the two blocking blocks are reset under the elastic force of the torsion spring and re-block the guide hole 441.

[0041] There are two groups of lifting mechanisms, and the two groups of lifting mechanisms are symmetrically arranged about the axial plane of each substrate 25. The lifting mechanism includes a cylinder 3 and a lifting member 31. The cylinder 3 is installed at the bottom of the cleaning tank 1, and the protruding end of the cylinder 3 is connected to the lifting member 31. The cleaning fixture 2 is detachably connected to the lifting member 31. A support plate 11 is fixed inside the cleaning tank 1, and a plurality of support rods 12 are fixed on the support plate 11. A guide block 431 is longitudinally slidably connected to each support rod 12, and each guide member 43 is slidably matched with each guide block 431. An arc-shaped guide groove 32 is also provided on the lifting member 31. Each movable member 41 located on the same side is connected to the same connecting rod 33, and the connecting rod 33 is slidably matched with the guide groove 32. A driving member 45 can be set only on the assembly parts 44 at both ends. The middle installation components are synchronously moved with the installation components at both ends through the connecting rod 33. The guide tube 14 is slidably matched with the support plate 11, and the length of the guide tube 14 can adapt to the change in the spacing between the assembly part 44 and the collection chamber 13.

[0042] After the substrate 25 is cleaned, the cylinder 3 pushes the lifting member 31 to move upward, and the connecting rod 33 rises with the lifting member 31. The connecting rod 33 drives each movable member 41 upward, and the assembly member 44 and the extrusion member 42 move upward with the movable member 41. Because the guide member 43 is connected to the support rod 12 through the guide block 431, the support rod 12 does not move with the lifting mechanism, and therefore the guide member 43 does not move upward. During the upward movement, the cleaning member 4 passes through the through groove, and a small amount of impurities remaining in the cleaning member 4 are squeezed out, so that the cleaning member 4 is further cleaned to ensure the cleaning effect of the cleaning member 4 on the subsequent substrate 25.

[0043] The diamond substrate cleaning method includes the following specific steps: S1, pretreatment, cleaning the substrate 25 by the diamond substrate 25 cleaning device provided by the present invention to remove particles and loose impurities on the surface of the substrate 25, usually lasting for 5-10 minutes, and after the pretreatment, nitrogen blowing or centrifugal drying is used to remove moisture on the surface of the substrate 25; S2, pickling, immersing the substrate 25 in a Piranha solution (a mixture of sulfuric acid and hydrogen peroxide), the ratio of which is usually 3:1 (sulfuric acid: hydrogen peroxide), the temperature is maintained at 60-80°C, and the time is 10-20 minutes; S3, cleaning with hydrofluoric acid to remove the oxide layer on the surface of the substrate 25, immersing the substrate 25 in a diluted hydrofluoric acid solution, the concentration of which is generally 1% to 5%, for 1-5 minutes; S4, plasma cleaning, using oxygen or argon plasma treatment to remove residual organic matter and activate the surface of the substrate 25, which is beneficial to subsequent chemical vapor deposition (CVD) or other processes. The treatment time is generally 5-15 minutes; S5, final cleaning, using the diamond substrate 25 cleaning device provided by the present invention to clean the substrate 25 again, and then drying it; S6, protection and transfer, the cleaned substrate 25 is immediately transferred to a clean room or an inert atmosphere to prevent the substrate 25 from being contaminated again.

[0044] The diamond substrate cleaning device provided by the present invention is used in the pretreatment operation of the substrate to make the substrate fully contact with the cleaning solution, ensure the substrate is fully cleaned, and reduce the possibility of impurities in the solution adhering to the substrate surface.

[0045] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0046] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0047] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A diamond substrate cleaning device, comprising a cleaning tank (1), wherein an ultrasonic generating device is provided in the cleaning tank (1), characterized in that: It also includes a cleaning jig (2) and a cleaning mechanism. The cleaning jig (2) is provided with a plurality of mounting positions for mounting a substrate (25). The substrate (25) and the cleaning jig (2) are detachably connected and rotatably matched. The cleaning mechanism includes: A cleaning member (4), wherein there are a plurality of cleaning members (4), each cleaning member (4) is in the shape of a fan-shaped block, and the cleaning member (4) is deformed by being squeezed; A mounting assembly, wherein the mounting assembly comprises a plurality of groups, each mounting assembly corresponding to each cleaning member (4) one by one, the mounting assembly comprising a movable member (41), a guide member (43) and an extrusion member (42), the movable member (41), the guide member (43) and the extrusion member (42) enclosing a space having a shape matching that of the cleaning member (4), the thickness of the cleaning member (4) being greater than the thickness of the mounting assembly, and the cleaning member (4) being used for frictionally contacting an end surface of the substrate (25); An assembly part (44), wherein there are multiple groups of assembly parts (44), and any assembly part (44) is rotatably connected to two groups of mounting components and two cleaning parts (4), and the axes of the two groups of mounting components coincide with each other; The driving member (45) is connected to the two groups of assembly components connected to the same assembly member (44) and connected to the same driving member (45). The driving member (45) drives the two groups of assembly components to rotate synchronously relative to each other.

2. The diamond substrate cleaning device according to claim 1, characterized in that: The lower ends of the movable member (41) and the extrusion member (42) are both rotatably matched with the assembly member (44); the guide member (43) is in an arc shape; the movable member (41) and the extrusion member (42) are slidably matched with the guide member (43) along the axial direction and the circumferential direction of the guide member (43); the arc-shaped end of the cleaning member (4) is connected to the guide member (43); the cleaning member (4) is fixed relative to the movable member (41); the cleaning member (4) is in movable contact with the extrusion member (42); a plurality of water filtering holes are provided on the extrusion member (42); and two extrusion members (42) connected to the same assembly member (44) are arranged adjacent to each other; A collecting assembly for collecting impurities is also provided in the cleaning tank (1), and a guide hole (441) communicating with the collecting assembly is provided on the assembly part (44). When two cleaning parts (4) connected to the same assembly part (44) are squeezed by the squeezing part (42), the guide hole (441) opens.

3. The diamond substrate cleaning device according to claim 2, characterized in that: The collection assembly comprises a collection chamber (13) and a flow guide tube (14). There are a plurality of flow guide tubes (14). The lower end of each flow guide tube (14) is in communication with the collection chamber (13), and the upper end of each flow guide tube (14) is in communication with a flow guide hole (441) on each assembly part (44).

4. The diamond substrate cleaning device according to claim 2, characterized in that: Two blocking blocks are elastically connected to the guide hole (441), and the lower ends of the two extrusion pieces (42) are movably abutted against the two blocking blocks respectively. When the two extrusion pieces (42) are relatively close to each other, the two blocking blocks are squeezed to rotate relative to the guide hole (441) until the guide hole (441) is opened.

5. The diamond substrate cleaning device according to claim 1, characterized in that: A lifting mechanism is also provided in the cleaning tank (1), and the lifting mechanism has two groups, and the two groups of lifting mechanisms are symmetrically arranged with respect to the axial plane of each substrate (25); The lifting mechanism comprises a cylinder (3) and a lifting member (31); the cylinder (3) is mounted at the bottom of the cleaning tank (1); the protruding end of the cylinder (3) is connected to the lifting member (31); and the cleaning fixture (2) is detachably connected to the lifting member (31).

6. The diamond substrate cleaning device according to claim 5, characterized in that: A support plate (11) is also fixed inside the cleaning tank (1), a plurality of support rods (12) are fixed on the support plate (11), each support rod (12) is longitudinally slidably connected to a guide block (431), and each guide member (43) is slidably matched with each guide block (431); The lifting member (31) is also provided with an arc-shaped guide groove (32), and the movable members (41) located on the same side are connected by a same connecting rod (33), and the connecting rod (33) is slidably matched with the guide groove (32).

7. The diamond substrate cleaning device according to claim 1, characterized in that: The cleaning jig (2) is provided with two mounting strips (21), and a plurality of mounting grooves (22) are provided on opposite end surfaces of the two mounting strips (21). The substrate (25) is rotatably matched with the mounting grooves (22). A damping structure is provided in each mounting groove (22) on one mounting strip (21), and the damping structure comprises a damping groove (23) and a damping block (24). The depth of each damping groove (23) increases or decreases uniformly from top to bottom. Each damping block (24) is slidably matched with each damping groove (23). The damping block (24) partially extends out of the damping groove (23) and contacts the substrate (25).

8. The diamond substrate cleaning device according to claim 7, characterized in that: At least one mounting strip (21) is detachably connected to the cleaning fixture (2).

9. The diamond substrate cleaning device according to claim 1, characterized in that: Among the two cleaning members (4) connected to the same assembly member (44), one of the cleaning members (4) is provided with a damping strip, and the damping strip is in contact with the substrate (25).

10. A diamond substrate cleaning method, characterized in that: The following steps are involved: S1. Pretreatment, cleaning the substrate (25) by using the diamond substrate cleaning device according to any one of claims 1 to 9; S2, pickling, immersing the substrate (25) in a Piranha solution at a temperature of 60-80°C for 10-20 minutes; S3, hydrofluoric acid cleaning, immersing the substrate (25) in a diluted hydrofluoric acid solution for 1-5 minutes; S4, plasma cleaning, using oxygen or argon plasma treatment to remove residual organic matter and activate the surface of the substrate (25); S5, final cleaning, again using the diamond substrate cleaning device of any one of claims 1 to 9 to clean the substrate (25), and then drying; S6. Protection and transfer: immediately transfer the cleaned substrate (25) to a clean room or an inert atmosphere to prevent the substrate (25) from being contaminated again.

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