Laser die cutting method and device, electronic equipment and storage medium

Abstract

The invention provides a laser die cutting method and device, electronic equipment and a storage medium. The method comprises the following steps: performing laser die cutting action on a plurality of blank areas of a to-be-die-cut pole piece to obtain a plurality of first die-cut pole pieces; performing laser die cutting action on the plurality of blank areas of the pole piece to be die-cut to obtain a plurality of first die-cut pole pieces, and detecting the plurality of first die-cut pole pieces according to a preset process standard to obtain a first detection result; when the first detection result is that the first post-die-cutting pole piece does not meet the process standard, performing jump cutting action on a to-be-die-cut slice after the post-die-cutting pole piece corresponding to the first detection result through the laser industrial personal computer, acquiring a first pre-jump-cutting pole piece, and performing scrap treatment action on the first pre-jump-cutting pole piece; and when the first detection result is that the first die-cut pole piece meets the process standard, a first laser die-cut product is obtained according to the first die-cut pole piece. According to the technical scheme, the number of scrapped laser die cutting products is reduced, and the production cost is saved.

Description

Technical Field

[0001] The present application relates to the technical field of lithium battery processing, and in particular to a laser die-cutting method, device, electronic equipment and storage medium. Background Art

[0002] Lithium-ion batteries are widely used in various fields due to their high voltage, high capacity, low consumption, and high number of cycles. With the development of the lithium battery industry, the requirements for the energy density and number of cycles of lithium-ion batteries are getting higher and higher. The existing technology often chooses to increase the length of a single pole piece of a lithium-ion battery. Compared with traditional lithium-ion batteries, lithium-ion batteries with long pole pieces have the advantages of high consistency and high energy density.

[0003] The existing method for making pole pieces is to laser die-cut the processed substrate to obtain pole pieces of the required size and shape. However, the pole pieces after laser die-cutting need to be defect-detected and marked. When defects are detected, the entire long pole piece obtained after die-cutting will be scrapped, resulting in waste of production materials and increased production costs. Summary of the invention

[0004] The embodiments of the present application provide a laser die-cutting method, device, electronic device and storage medium. In view of the material loss caused by scrapping the entire roll of long pole piece after detecting a pole piece defect in the existing laser die-cutting pole piece method, the laser die-cutting method provided by the present application can perform a jump-cutting action on the non-compliant part of the pole piece when it is detected that the pole piece does not meet the process standard, and the pole piece before the jump-cutting is scrapped, and the pole piece after the jump-cutting is laser-die-cut again, thereby avoiding the problem that the entire pole piece cannot be distinguished after die-cutting and the entire pole piece is scrapped, saving the production cost of the laser die-cutting process and improving the working efficiency of the laser die-cutting process.

[0005] In a first aspect, the present application provides a laser die-cutting method, comprising:

[0006] Performing laser die-cutting on a plurality of blank areas of a to-be-die-cut electrode piece to obtain a plurality of first die-cut electrode pieces, wherein the to-be-die-cut electrode piece is a electrode piece provided with a plurality of coating areas and a plurality of the blank areas arranged alternately;

[0007] While performing a laser die-cutting operation on the plurality of blank areas of the electrode piece to be die-cut to obtain a plurality of first die-cut electrode pieces, testing the plurality of first die-cut electrode pieces according to a preset process standard to obtain a first testing result;

[0008] When the first detection result is that the first die-cutting electrode piece does not meet the process standard, a laser industrial computer performs a jump-cutting action on the to-be-die-cutting slice after the die-cutting electrode piece corresponding to the first detection result, obtains a first jump-cutting electrode piece, and performs a scrapping action on the first jump-cutting electrode piece;

[0009] When the first detection result is that the first die-cut rear electrode sheet meets the process standard, a first laser die-cut product is obtained according to the first die-cut rear electrode sheet.

[0010] Optionally, the pole piece to be die-cut includes a first die area and a second die area, and the laser die-cutting method further includes:

[0011] Laser die-cutting the first die area of ​​the die-cut electrode piece by using the first die area electrode ear laser emitted by the laser industrial control computer to obtain the first die area die-cut electrode piece;

[0012] Laser die-cutting the second mold area of ​​the to-be-die-cut pole piece by using the second mold area pole ear laser emitted by the laser industrial computer to obtain the second mold area die-cut pole piece, wherein the first mold area pole ear laser is not synchronized with the second mold area pole ear laser;

[0013] The die-cut rear electrode sheet including the first die area die-cut rear electrode sheet and the second die area die-cut rear electrode sheet is cut along the center line of the length direction of the blank area to obtain the first die area die-cut rear electrode sheet and the second die area die-cut rear electrode sheet.

[0014] Optionally, the first detection result includes a first mold area detection result and a second mold area detection result, and the laser die-cutting method further includes:

[0015] Using the rear CCD corresponding to the first mold area, respectively inspect the pole pieces after the first mold area is cut according to the process standard, and obtain the inspection result of the first mold area;

[0016] While the rear CCD corresponding to the first mold area detects the pole pieces after the first mold area is cut according to the process standard to obtain the first mold area detection result, the rear CCD corresponding to the second mold area detects the pole pieces after the second mold area is cut according to the process standard to obtain the second mold area detection result.

[0017] Optionally, the laser die cutting method further comprises:

[0018] The first die-cut rear pole piece is inspected according to the process standard by a backlight camera to obtain the first inspection result.

[0019] Optionally, the laser die cutting method further comprises:

[0020] The first die-cutting rear pole piece is inspected according to the process standard through the front CCD to obtain the first inspection result.

[0021] Optionally, the laser die cutting method further comprises:

[0022] Performing laser die-cutting on a plurality of blank areas of the electrode piece to be die-cut after the first jump-cut electrode piece, to obtain a second electrode piece after die-cutting;

[0023] While laser die-cutting is performed on a plurality of blank areas of the to-be-die-cut electrode piece after the first jump-cut electrode piece, a plurality of the second die-cut electrode pieces are inspected according to a preset process standard to obtain a second inspection result.

[0024] Optionally, the laser die cutting method further comprises:

[0025] When the second detection result is that the second die-cutting electrode piece does not meet the process standard, a laser industrial computer performs a jump-cutting action on the to-be-die-cutting slice after the die-cutting electrode piece corresponding to the second detection result, obtains a second jump-cutting electrode piece, and performs a scrapping action on the second jump-cutting electrode piece;

[0026] When the second detection result is that the second die-cut pole piece meets the process standard, a second laser die-cut product is obtained according to the second die-cut pole piece.

[0027] In a second aspect, the present application also provides a laser die-cutting device, comprising:

[0028] A first laser die-cutting module, used for performing a laser die-cutting operation on a plurality of blank areas of a to-be-die-cut electrode piece to obtain a plurality of first die-cut electrode pieces, wherein the to-be-die-cut electrode piece is a electrode piece provided with a plurality of coating areas and a plurality of the blank areas arranged alternately;

[0029] A first detection module, configured to detect the plurality of first die-cut electrode sheets according to a preset process standard while performing a laser die-cutting operation on the plurality of blank areas of the electrode sheet to be die-cut to obtain a plurality of first die-cut electrode sheets, to obtain a first detection result;

[0030] A first jump-cut module, for, when the first detection result is that the first die-cutting electrode piece does not meet the process standard, executing a jump-cut action on the to-be-die-cutting slice after the die-cutting electrode piece corresponding to the first detection result through a laser industrial computer, obtaining a first jump-cutting electrode piece and executing a scrapping action on the first jump-cutting electrode piece;

[0031] The first product acquisition module is used to acquire a first laser die-cut product according to the first die-cut electrode sheet when the first detection result is that the first die-cut electrode sheet meets the process standard.

[0032] In a third aspect, the present application further provides an electronic device comprising a processor and a memory, wherein the memory stores programs or instructions that can be run on the processor, and when the programs or instructions are executed by the processor, the steps of the laser die-cutting method described in the first aspect are implemented.

[0033] In a fourth aspect, an embodiment of the present application provides a non-volatile readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, the steps of the laser die-cutting method described in the first aspect are implemented.

[0034] In an embodiment of the present application, in order to address the material loss caused by scrapping an entire roll of long pole piece after detecting a pole piece defect in the existing laser die-cutting method, the laser die-cutting method provided in the present application can, when it is detected that the pole piece does not meet the process standards, perform a jump cut on the non-compliant part of the pole piece, and scrap the pole piece before the jump cut, and re-laser die-cut the pole piece after the jump cut, thereby avoiding the problem of being unable to distinguish the segments that do not meet the process standards after the entire pole piece is die-cut and thus the entire pole piece is scrapped, thereby saving the production cost of the laser die-cutting process and improving the working efficiency of the laser die-cutting process.

[0035] The above description is only an overview of the technical solution provided by the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0037] Figure 1 This is one of the schematic diagrams of the laser die-cutting method provided in the embodiments of the present application;

[0038] Figure 2 This is the second schematic diagram of the laser die-cutting method provided in the embodiment of the present application;

[0039] Figure 3 This is the third schematic diagram of the laser die-cutting method provided in the embodiment of the present application;

[0040] Figure 4 This is the fourth schematic diagram of the laser die-cutting method provided in the embodiment of the present application;

[0041] Figure 5 This is the fifth schematic diagram of the laser die-cutting method provided in the embodiment of the present application;

[0042] Figure 6 This is the sixth schematic diagram of the laser die-cutting method provided in the embodiment of the present application;

[0043] Figure 7 This is the seventh schematic diagram of the laser die-cutting method provided in the embodiment of the present application;

[0044] Figure 8 This is a schematic diagram of a laser die-cutting process provided in an embodiment of the present application;

[0045] Fig. 9 is a schematic diagram of a laser die-cutting device provided in an embodiment of the present application;

[0046] Fig.10 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0047] The exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present application and to fully convey the scope of the present application to those skilled in the art.

[0048] The first embodiment of the present application provides a laser die cutting method, such as Figure 1 As shown, including:

[0049] Step 101, performing a laser die-cutting operation on a plurality of blank areas of a to-be-die-cut electrode piece to obtain a plurality of first die-cut electrode pieces, wherein the to-be-die-cut electrode piece is a electrode piece provided with a plurality of coating areas and a plurality of the blank areas arranged alternately;

[0050] Step 102: while performing a laser die-cutting operation on the plurality of blank areas of the electrode piece to be die-cut to obtain a plurality of first die-cut electrode pieces, the plurality of first die-cut electrode pieces are tested according to a preset process standard to obtain a first test result;

[0051] Step 103: when the first detection result is that the first die-cutting electrode piece does not meet the process standard, a laser industrial computer is used to perform a jump-cutting operation on the to-be-die-cutting slice after the die-cutting electrode piece corresponding to the first detection result, obtain a first jump-cutting electrode piece, and perform a scrapping operation on the first jump-cutting electrode piece;

[0052] Step 104 : when the first detection result is that the first die-cut electrode sheet meets the process standard, a first laser die-cut product is obtained according to the first die-cut electrode sheet.

[0053] Specifically, in the laser die-cutting method provided in the present application, the electrode to be die-cut has been pre-coated to obtain a plurality of alternatingly arranged coating areas and blank areas. First, laser die-cutting is performed according to the blank area of ​​the electrode to be die-cut to obtain the first electrode after die-cutting. While laser die-cutting is continuously performed on a whole roll of electrode to be die-cut, the electrode that has been die-cut is detected. When it is detected that the electrode after die-cut meets the preset process requirements, laser die-cutting is performed normally to obtain a qualified product. When it is detected that the electrode after die-cut does not meet the preset process requirements, a signal is sent to the laser industrial computer or the laser die-cutting machine. After receiving the signal, the laser die-cutting machine performs a jump cut, skips the electrode with process defects in this section, and restarts the laser die-cutting. For example, the jump cutting method can be adopted but not limited to first performing a right-angle die-cutting for a length, such as 700mm, and then punching marks are performed after the three pole ear spacings of the electrode to be die-cut, and die-cutting is performed again according to the original pole ear spacing, that is, the normal laser die-cutting action is continued for the electrode to be die-cut after the punching mark. After receiving the signal, the marking machine will mark the laser die-cutting machine with yellow marks and scrap them. Repeat the action until a whole roll of laser die-cut products is laser die-cut, and then distinguish the defective products from the qualified products according to the yellow mark scrap information to obtain the first laser die-cut product that meets the process standards.

[0054] In response to the material loss caused by scrapping an entire roll of long pole piece after detecting a pole piece defect in the existing laser die-cutting method, the laser die-cutting method provided in the present application can perform a jump cut on the non-compliant part of the pole piece when it is detected that the pole piece does not meet the process standards. The pole piece is scrapped before the jump cut, for example, EA is scrapped or the entire pole piece in a battery cell is scrapped. The pole piece after the jump cut is laser die-cut again, avoiding the problem of being unable to distinguish the segments that do not meet the process standards after the entire pole piece is die-cut and causing the entire piece to be scrapped, saving the production cost of the laser die-cutting process and improving the working efficiency of the laser die-cutting process.

[0055] In addition, the laser die-cutting method provided in the present application controls the laser emitter to achieve asynchronous light output of the left and right mold areas by changing the corresponding program of the laser emitter, and then uses multiple CCD cameras to respectively detect the two sides corresponding to the asynchronous light output, and feeds back the detection results to the laser emitter. The laser emitter performs corresponding actions according to the detection results of the CCD cameras of the left and right mold areas. For example, when one of the left and right mold areas does not meet the pre-set process parameters, the mold area performs a jump cutting action when it does not meet the process, while the other mold area continues to perform laser die-cutting processing, thereby achieving the effect of asynchronous die-cutting of the left and right mold areas according to the feedback data of the CCD camera during the laser die-cutting action.

[0056] Based on the above implementation, Figure 2As shown, the electrode piece to be die-cut includes a first die area and a second die area. In the laser die-cutting method provided in the present application, step 101 includes:

[0057] Step 111, laser die-cutting the first mold area of ​​the die-cut electrode piece by using the first mold area electrode ear laser emitted by the laser industrial control computer to obtain the first mold area die-cut electrode piece;

[0058] Step 112, laser die-cutting the second mold area of ​​the to-be-die-cut pole piece by using the second mold area pole ear laser emitted by the laser industrial computer to obtain the second mold area die-cut pole piece, wherein the first mold area pole ear laser is not synchronized with the second mold area pole ear laser;

[0059] Step 113, cutting the die-cut rear electrode sheet including the first die area die-cut rear electrode sheet and the second die area die-cut rear electrode sheet along the center line of the length direction of the blank area to obtain the first die area die-cut rear electrode sheet and the second die area die-cut rear electrode sheet.

[0060] Specifically, the electrode piece to be die-cut provided in the present application includes a first mold area and a second mold area or a first surface and a second surface. Both mold areas need to be laser die-cut to obtain corresponding laser die-cut products. The laser industrial control computer can emit the first mold area pole ear laser and the second mold area pole ear laser to perform laser die-cutting processing on the first mold area and the second mold area of ​​the electrode piece to be die-cut respectively, wherein, in order to facilitate distinction, the first mold area pole ear laser and the second mold area pole ear laser are not synchronized. Subsequently, the first mold area die-cutting electrode piece corresponding to the first mold area and the second mold area die-cutting electrode piece corresponding to the second mold area are respectively inspected. When it is detected that one of the mold areas does not meet the process standards, a jump cutting action is performed on the electrode piece to be die-cut corresponding to the mold area, while the other mold area that meets the process standards is laser die-cut normally.

[0061] On the basis of the above-mentioned implementation mode, the laser industrial computer emits light asynchronously, and the first mold area and the second mold area of ​​the electrode to be die-cut do not perform the die-cutting action synchronously, and are finally divided by a slitting knife to obtain two rolls of electrode sheets, thereby avoiding the interference of any mold area that does not meet the process standards on another mold area, saving the laser die-cutting production cost and improving the laser die-cutting work efficiency.

[0062] Based on the above implementation, Figure 3 As shown, the first detection result includes a first mold area detection result and a second mold area detection result. In the laser die-cutting method provided by the present application, step 102 includes:

[0063] Step 121, using a rear charge coupled device (CCD) camera corresponding to the first mold area to detect the electrode pieces after cutting in the first mold area according to the process standard, and obtaining the detection result of the first mold area;

[0064] Step 122: While the rear CCD camera corresponding to the first mold area detects the pole pieces after being cut in the first mold area according to the process standard to obtain the detection result of the first mold area, the rear CCD camera corresponding to the second mold area detects the pole pieces after being cut in the second mold area according to the process standard to obtain the detection result of the second mold area.

[0065] Specifically, when there are first mold areas and second mold areas in the electrode piece to be die-cut, for example, both the front and back sides of the electrode piece to be die-cut are coated with a coating area and a blank area through a coating process, and the electrode piece of the first mold area and the electrode piece of the second mold area are obtained through a slitting process, the laser die-cutting method provided in the present application can also detect the electrode piece of the first mold area and the electrode piece of the second mold area respectively. For example, the electrode piece of the first mold area and the electrode piece of the second mold area obtained after slitting are gathered into rolls by inner winding and outer winding, respectively. When the electrode piece of the first mold area is conveyed to the corresponding marking machine and the upper winding reel, the electrode piece of the first mold area is detected by the corresponding rear CCD camera of the first mold area, such as the upper winding CCD camera, according to the pre-set laser die-cutting process standards or process parameters such as the electrode ear size, electrode piece width, die-cutting width, and electrode ear spacing after laser die-cutting. When it is detected that the pole piece of the first mold area does not meet the process standards or process parameters, for example, it is lower than the lower limit of the process parameters or higher than the upper limit of the process parameters, the process control machine connected to the CCD camera corresponding to the upper winding CCD camera feeds back signals to the marking machine for scrap marking and the laser die-cutting machine for laser die-cutting. After receiving the signal sent by the process control machine connected to the CCD camera, the laser die-cutting machine performs a jump cutting action on the first mold area of ​​the pole piece to be die-cut, for example, first performs a right-angle die-cutting for a length, for example, 700mm, and then performs a punch mark after the three pole ear spacing of the pole piece to be die-cut, and re-die-cuts according to the original pole ear spacing of the first mold area, that is, the first mold area of ​​the pole piece to be die-cut after the punch mark continues to perform normal laser die-cutting action. After receiving the signal sent by the process control machine connected to the CCD camera corresponding to the upper winding CCD camera, the marking machine marks the punch mark of the laser die-cutting machine with a yellow mark for scrapping. The pole piece of the second mold area is transported to the corresponding marking machine and the lower winding reel, and is detected by the rear CCD camera corresponding to the second mold area, such as the lower winding CCD camera. The jump cutting action performed by the laser die-cutting machine in the first mold area does not affect the normal laser die-cutting action of the pole piece to be die-cut in the second mold area. The pole piece detection method of the second mold area is the same as the pole piece detection method of the first mold area mentioned above, and this application will not be repeated.

[0066] It should be emphasized that the front CCD camera, backlight CCD camera, upper winding CCD camera and lower winding CCD camera provided in this application are all installed at corresponding positions in the laser die-cutting process of lithium-ion batteries. The specific positions are determined by the die-cutting process environment of the specific lithium-ion battery pole piece, which can be but not limited to Fig. 9The arrangement position in is not limited in this application.

[0067] On the basis of the above-mentioned implementation mode, by performing process inspection on the pole pieces in different mold areas respectively, the laser die-cutting jump caused by the pole piece in the first mold area not meeting the process standards does not affect the normal laser die-cutting action of the pole piece in the second mold area, and the scrapped pole piece in the first mold area will not affect the pole piece in the second mold area, which further saves production materials, reduces the scrapped pole pieces, and reduces production costs.

[0068] Based on the above implementation, Figure 4 As shown, in the laser die-cutting method provided by the present application, step 102 also includes:

[0069] Step 123: inspect the first die-cut rear electrode sheet according to the process standard using a backlight camera to obtain the first inspection result.

[0070] Specifically, the laser die-cutting method provided by the present application, after the first die-cut electrode piece is obtained by laser die-cutting the electrode piece to be die-cut by the laser die-cutting machine, the first die-cut electrode piece is detected by the backlight camera. When it is detected that the first die-cut electrode piece does not meet the preset process standards, for example, the first die-cut electrode piece does not meet the process parameters such as the laser die-cut electrode ear size, electrode piece width, die-cutting width, and electrode ear spacing, the process control machine connected to the CCD camera or the industrial computer connected to the CCD camera provides signal feedback to the laser die-cutting machine and the marking machine according to the information collected by the backlight camera. After receiving the signal sent by the process control machine connected to the CCD camera, the laser die-cutting machine performs a jump-cutting action on the electrode to be die-cut. For example, it first performs a right-angle die-cutting for a length, such as 700mm. On the electrode to be die-cut, the last three pole ear spacings in the pre-set process parameters are used as the jump-cutting distance. When the corresponding length is reached, the jump-cutting action is deemed to be completed, and punching marks are performed, such as punching MK holes, and die-cutting is performed again according to the original pole ear spacing, that is, the normal laser die-cutting action is continued on the electrode to be die-cut after the punching marks. The CCD camera determines the MK hole by the last three pole ear spacings in the pre-set process parameters, and sends a signal to the marking machine through the connected process control machine. After receiving the signal sent by the process control machine connected to the CCD camera corresponding to the backlight camera, the marking machine marks the punching marks of the laser die-cutting machine with a yellow mark and scraps them.

[0071] On the basis of the above-mentioned implementation mode, the first die-cut electrode sheet obtained after laser die-cutting is inspected by a backlight camera, which ensures the quality of the first die-cut electrode sheet while avoiding the problem of the entire electrode sheet to be die-cut being scrapped due to the existence of electrode sheets that do not meet the process standards.

[0072] Based on the above implementation, Figure 5 As shown, in the laser die-cutting method provided by the present application, step 102 also includes:

[0073] Step 124: Use the front CCD to inspect the first die-cut rear electrode sheet according to the process standard to obtain the first inspection result.

[0074] Specifically, the laser die-cutting method provided by the present application, after the first die-cut electrode piece is obtained by laser die-cutting the electrode piece to be die-cut by the laser die-cutting machine, the first die-cut electrode piece is detected by the front CCD camera. When it is detected that the first die-cut electrode piece does not meet the preset process standards, for example, the first die-cut electrode piece does not meet the process parameters such as the laser die-cut electrode ear size, electrode piece width, die-cutting width, and electrode ear spacing, the process control machine connected to the CCD camera or the industrial computer connected to the CCD camera provides signal feedback to the laser die-cutting machine and the marking machine according to the information collected by the front CCD camera. After receiving the signal from the CCD process control machine, the laser die-cutting machine performs a jump-cutting action on the electrode to be die-cut. For example, it first performs a right-angle die-cutting for a length, such as 700mm. On the electrode to be die-cut, the last three tab spacings in the pre-set process parameters are used as the jump-cutting distance. When the corresponding length is reached, the jump-cutting action is considered to be completed, and punching marks are performed, such as punching MK holes, and die-cutting is performed again according to the original tab spacing, that is, the electrode to be die-cut continues to perform normal laser die-cutting actions after punching marks. After receiving the signal from the process control machine connected to the CCD camera corresponding to the front CCD camera, the marking machine marks the punching marks of the laser die-cutting machine with a yellow mark and scraps them.

[0075] On the basis of the above implementation mode, the first die-cut electrode obtained after laser die-cutting is detected by the front CCD camera, which ensures the quality of the first die-cut electrode and avoids the problem of scrapping the entire electrode to be die-cut due to the existence of electrode that does not meet the process standards.

[0076] Based on the above implementation, Figure 6 As shown, in the laser die-cutting method provided by the present application, after step 104, the following steps are further included:

[0077] Step 105, performing a laser die-cutting operation on a plurality of blank areas of the electrode piece to be die-cut after the first jump-cut electrode piece, to obtain a second electrode piece after die-cutting;

[0078] Step 106 , while performing laser die-cutting on a plurality of blank areas of the electrode pieces to be die-cut after the first jump-cut electrode pieces, inspect the plurality of the second die-cut electrode pieces according to a preset process standard to obtain a second inspection result.

[0079] Specifically, after the unqualified pole pieces that do not meet the preset process requirements are jump-cut, the material to be die-cut after marking and punching continues to be laser die-cut according to the preset pole ear spacing, and the pole pieces after normal laser die-cutting are inspected according to the process standards, and a second inspection result is obtained after the re-inspection.

[0080] On the basis of the above implementation mode, by continuing to perform laser die-cutting on the pole piece after jump cutting, the scrapping of the subsequent pole piece to be processed due to the previous pole piece not meeting the process requirements is avoided, thereby saving production costs.

[0081] Based on the above implementation, Figure 7 As shown, in the laser die-cutting method provided by the present application, after step 106, the method further includes:

[0082] Step 107: when the second detection result is that the second die-cutting electrode piece does not meet the process standard, a laser industrial computer performs a jump-cutting operation on the to-be-die-cutting slice after the die-cutting electrode piece corresponding to the second detection result, obtains a second jump-cutting electrode piece, and performs a scrapping operation on the second jump-cutting electrode piece;

[0083] Step 108: When the second detection result is that the second die-cut electrode sheet meets the process standard, a second laser die-cut product is obtained according to the second die-cut electrode sheet.

[0084] Specifically, after the electrode piece after normal laser die-cutting is detected to obtain the second detection result, the corresponding action is performed on the electrode piece after laser die-cutting again according to the second detection result. When it is detected that the electrode piece after laser die-cutting again still does not meet the process requirements, the remaining electrode pieces to be die-cut are re-jump-cut. For example, after the right-angle die-cutting of 700mm is first performed by the laser industrial control computer, the jump-cut distance is used as the jump-cut distance on the electrode piece to be die-cut. When the corresponding length is reached, the jump-cut action is deemed to be completed, and punching marks are performed, such as punching MK holes, and then re-die-cutting is started. Among them, the second jump-cut electrode piece before the punching mark is scrapped by marking with a yellow mark by a marking machine. When it is detected that the second die-cut electrode piece after laser die-cutting again meets the process requirements, a laser die-cut product that meets the process is obtained according to the second die-cut electrode piece. Repeat the detection according to the process standard and the jump-cut and normal laser die-cutting actions according to the detection results, so that all the electrode pieces to be die-cut are processed.

[0085] On the basis of the above-mentioned implementation mode, by repeatedly testing the pole pieces to be die-cut according to the process standards and performing jump cutting and normal laser die-cutting actions according to the test results until all the pole pieces to be die-cut are processed, while ensuring the quality of the laser die-cut products, all pole pieces obtained after laser die-cutting that meet the process standards are retained as products of the laser die-cutting process as much as possible, saving the production cost of the laser die-cutting process and improving the efficiency of the laser die-cutting work.

[0086] Based on the above implementation, Figure 8 As shown, the present application also provides a schematic diagram of a laser die-cutting method for saving waste materials:

[0087] The existing laser die-cutting method often emits light synchronously for the two mold areas or two sides of the electrode to be die-cut, and performs left and right equidistant die-cutting of the blank area obtained in advance through coating treatment in the electrode to produce the electrode ears, and then uses the front CCD camera to detect defects on both sides of the die-cut electrode according to the process parameters. When the front CCD camera detects that the electrode after die-cut has defects that do not meet the process parameters, the laser die-cutting is continued for the remaining entire electrode to be die-cut, and the marking machine fixed in front of the winding device scraps the electrode starting from the defect that does not meet the process parameters to all the remaining die-cut electrode pieces, which not only causes a lot of waste but also takes up a lot of working time of the laser die-cutting machine, resulting in a serious decline in the overall work efficiency of laser die-cutting.

[0088] The technical solution provided by this application is that in the laser die-cutting process, the laser die-cutting machine is used to asynchronously emit light to the two mold areas or two sides of the electrode to be die-cut, and the electrode ears are die-cut in the blank area of ​​the electrode. Subsequently, the electrode after die-cutting on both sides is inspected separately according to the pre-set process parameters by multiple detection devices such as the front CCD camera, the backlight camera, the rear CCD internal winding camera and the rear CCD external winding camera. When it is detected that one side does not meet the pre-set process requirements, the process control machine connected to the CCD camera or the industrial computer connected to the CCD camera provides signal feedback to the laser die-cutting machine and the marking machine based on the information collected by these detection devices. After receiving the signal sent by the process control machine connected to the CCD camera, the laser die-cutting machine performs a jump-cutting action on the side of the electrode to be die-cut that does not meet the process standards. For example, it first performs a right-angle die-cutting for a length, such as 700mm. On the electrode to be die-cut, the last three pole ear spacings in the pre-set process parameters are used as the jump-cut distance. When the corresponding length is reached, the jump-cutting action is deemed to be completed, and a punching mark is made, such as MK holes, and the die-cutting is performed again according to the original pole ear spacing, that is, the normal laser die-cutting action is continued on the electrode to be die-cut after the punching mark. The CCD camera determines the MK hole by the last three pole ear spacings in the pre-set process parameters, and sends a signal to the marking machine through the connected process control machine. After receiving the signal sent by the process control machine connected to the CCD camera corresponding to the detection equipment, the marking machine marks the punching mark of the laser die-cutting machine with a yellow mark and scraps it. The other side performs normal laser die-cutting action without jump-cutting, so as to avoid the influence of the electrode on the first side that does not meet the process standards on the normal processing of the electrode on the second side.

[0089] The second embodiment of the present application also provides a laser die cutting device, such as Fig. 9 As shown, including:

[0090] A first laser die-cutting module 201 is used to perform a laser die-cutting operation on a plurality of blank areas of a to-be-die-cut electrode piece to obtain a plurality of first die-cut electrode pieces, wherein the to-be-die-cut electrode piece is a electrode piece provided with a plurality of coating areas and a plurality of the blank areas arranged alternately;

[0091] A first detection module 202 is used to perform a laser die-cutting operation on the plurality of blank areas of the electrode piece to be die-cut to obtain a plurality of first die-cut electrode pieces, and to detect the plurality of first die-cut electrode pieces according to a preset process standard to obtain a first detection result;

[0092] A first jump-cut module 203 is used for, when the first detection result is that the first die-cutting electrode sheet does not meet the process standard, executing a jump-cut action on the to-be-die-cutting slice after the die-cutting electrode sheet corresponding to the first detection result through a laser industrial computer, obtaining a first jump-cutting electrode sheet and executing a scrapping action on the first jump-cutting electrode sheet;

[0093] The first product acquisition module 204 is used to acquire a first laser die-cut product according to the first die-cut electrode sheet when the first detection result is that the first die-cut electrode sheet meets the process standard.

[0094] In the embodiment of the present application, the first laser die-cutting module 201 includes:

[0095] The first die area laser die cutting unit 211 is used to laser die cut the first die area of ​​the die-cut electrode piece by using the first die area electrode ear laser emitted by the laser industrial control computer to obtain the first die area die-cut electrode piece;

[0096] The second mold area laser die-cutting unit 212 is used to laser die-cut the second mold area of ​​the to-be-die-cut pole piece by using the second mold area pole ear laser emitted by the laser industrial computer to obtain the second mold area die-cut pole piece, wherein the first mold area pole ear laser is not synchronized with the second mold area pole ear laser;

[0097] The slitting unit 213 is used to slit the die-cut rear electrode sheet including the first die area die-cut rear electrode sheet and the second die area die-cut rear electrode sheet along the center line of the length direction of the blank area to obtain the first die area die-cut rear electrode sheet and the second die area die-cut rear electrode sheet.

[0098] In an embodiment of the present application, the first detection module 202 includes:

[0099] The first mold area detection unit 221 is used to detect the first mold area after the electrode pieces are cut according to the process standard through the rear CCD corresponding to the first mold area, and obtain the first mold area detection result;

[0100] The second mold area detection unit 222 is used for detecting the pole pieces after the first mold area is cut according to the process standard by the rear CCD corresponding to the first mold area to obtain the first mold area detection result, and at the same time, detecting the pole pieces after the second mold area is cut according to the process standard by the rear CCD corresponding to the second mold area to obtain the second mold area detection result.

[0101] In the implementation manner of the present application, the first detection module 202 further includes:

[0102] The backlight camera detection unit 223 is used to detect the first die-cut rear electrode sheet according to the process standard through a backlight camera to obtain the first detection result.

[0103] In the implementation manner of the present application, the first detection module 202 further includes:

[0104] The front CCD detection unit 224 is used to detect the first die-cut rear electrode sheet according to the process standard through the front CCD to obtain the first detection result.

[0105] In an embodiment of the present application, the laser die-cutting device further comprises:

[0106] A second laser die-cutting module 205 is used to perform a laser die-cutting operation on a plurality of blank areas of the to-be-die-cut electrode piece after the first jump-cut electrode piece, to obtain a second die-cut electrode piece;

[0107] The second detection module 206 is used to detect the plurality of second die-cut electrode pieces according to a preset process standard while performing laser die-cutting on the plurality of blank areas of the electrode piece to be die-cut after the first jump-cut electrode piece, to obtain a second detection result.

[0108] In an embodiment of the present application, the laser die-cutting device further comprises:

[0109] A second jump-cut module 207 is used for, when the second detection result is that the second die-cut electrode piece does not meet the process standard, executing a jump-cut action on the to-be-die-cut slice after the die-cut electrode piece corresponding to the second detection result through a laser industrial computer, obtaining a second jump-cut electrode piece before the jump-cut and executing a scrapping action on the second jump-cut electrode piece before the jump-cut;

[0110] The second product acquisition module 208 is used to acquire a second laser die-cut product according to the second die-cut electrode sheet when the second detection result is that the second die-cut electrode sheet meets the process standard.

[0111] A third embodiment of the present application relates to an electronic device, such as Fig.10 As shown, including:

[0112] at least one processor 301; and,

[0113] A memory 302 is communicatively connected to the at least one processor 301; wherein,

[0114] The memory 302 stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor 301 so that the at least one processor 301 can implement the laser die-cutting method described in the first embodiment of the present application.

[0115] Among them, the memory and the processor are connected in a bus manner, and the bus may include any number of interconnected buses and bridges, and the bus connects various circuits of one or more processors and memories together. The bus can also connect various other circuits such as peripherals, voltage regulators, and power management circuits, which are well known in the art and are therefore not further described herein. The bus interface provides an interface between the bus and the transceiver. The transceiver can be one element or multiple elements, such as multiple receivers and transmitters, providing a unit for communicating with various other devices on a transmission medium. The data processed by the processor is transmitted on a wireless medium via an antenna, and further, the antenna also receives data and transmits the data to the processor.

[0116] The processor is responsible for managing the bus and general processing, and can also provide various functions, including timing, peripheral interfaces, voltage regulation, power management, and other control functions. Memory can be used to store data used by the processor when performing operations.

[0117] The fourth embodiment of the present application relates to a computer-readable storage medium storing a computer program, which implements the laser die-cutting method described in the first embodiment of the present application when executed by a processor.

[0118] That is, those skilled in the art can understand that all or part of the steps in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a program, and the program is stored in a storage medium, including a number of instructions to enable a device (which can be a single-chip microcomputer, chip, etc.) or a processor to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned processor is responsible for managing the bus and general processing, and can also provide various functions, including timing, peripheral interfaces, voltage regulation, power management and other control functions. The memory can be used to store data used by the processor when performing operations.

[0119] The fourth embodiment of the present application relates to a computer-readable storage medium storing a computer program, which implements the laser die-cutting method described in the first embodiment of the present application when executed by a processor.

[0120] That is, those skilled in the art can understand that all or part of the steps in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a program, and the program is stored in a storage medium, including several instructions to enable a device (which can be a single-chip microcomputer, chip, etc.) or a processor to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program codes.

[0121] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the application disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0122] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A laser die cutting method, characterized in that: include: Performing laser die-cutting on a plurality of blank areas of a to-be-die-cut electrode piece to obtain a plurality of first die-cut electrode pieces, wherein the to-be-die-cut electrode piece is a electrode piece provided with a plurality of coating areas and a plurality of the blank areas arranged alternately; While performing a laser die-cutting operation on the plurality of blank areas of the electrode piece to be die-cut to obtain a plurality of first die-cut electrode pieces, testing the plurality of first die-cut electrode pieces according to a preset process standard to obtain a first testing result; When the first detection result is that the first die-cutting electrode piece does not meet the process standard, a laser industrial computer performs a jump-cutting action on the to-be-die-cutting slice after the die-cutting electrode piece corresponding to the first detection result, obtains a first jump-cutting electrode piece, and performs a scrapping action on the first jump-cutting electrode piece; When the first detection result is that the first die-cut rear electrode sheet meets the process standard, a first laser die-cut product is obtained according to the first die-cut rear electrode sheet.

2. The method according to claim 1, characterized in that: The electrode piece to be die-cut includes a first die area and a second die area, and performing a laser die-cutting operation on a plurality of blank areas of the electrode piece to be die-cut to obtain a plurality of die-cut electrode pieces includes: Laser die-cutting the first die area of ​​the die-cut electrode piece by using the first die area electrode ear laser emitted by the laser industrial control computer to obtain the first die area die-cut electrode piece; Laser die-cutting the second mold area of ​​the to-be-die-cut pole piece by using the second mold area pole ear laser emitted by the laser industrial computer to obtain the second mold area die-cut pole piece, wherein the first mold area pole ear laser is not synchronized with the second mold area pole ear laser; The die-cut rear electrode sheet including the first die area die-cut rear electrode sheet and the second die area die-cut rear electrode sheet is cut along the center line of the length direction of the blank area to obtain the first die area die-cut rear electrode sheet and the second die area die-cut rear electrode sheet.

3. The method according to claim 2, characterized in that The first detection result includes a first mold area detection result and a second mold area detection result. While performing a laser die-cutting operation on the plurality of blank areas of the to-be-die-cut electrode pieces to obtain a plurality of first die-cut electrode pieces, the plurality of first die-cut electrode pieces are detected according to a preset process standard. Obtaining the first detection result includes: Using the rear CCD corresponding to the first mold area, respectively inspect the pole pieces after the first mold area is cut according to the process standard, and obtain the inspection result of the first mold area; While the rear CCD corresponding to the first mold area detects the pole pieces after the first mold area is cut according to the process standard to obtain the first mold area detection result, the rear CCD corresponding to the second mold area detects the pole pieces after the second mold area is cut according to the process standard to obtain the second mold area detection result.

4. The method according to claim 1, characterized in that: While performing the laser die-cutting operation on the plurality of blank areas of the electrode piece to be die-cut to obtain a plurality of first die-cut electrode pieces, detecting the plurality of first die-cut electrode pieces according to a preset process standard, and obtaining a first detection result comprises: The first die-cut rear pole piece is inspected according to the process standard by a backlight camera to obtain the first inspection result.

5. The method according to claim 1, characterized in that: While performing the laser die-cutting operation on the plurality of blank areas of the electrode piece to be die-cut to obtain a plurality of first die-cut electrode pieces, detecting the plurality of first die-cut electrode pieces according to a preset process standard, and obtaining a first detection result comprises: The first die-cut rear pole piece is inspected according to the process standard through the front CCD to obtain the first inspection result.

6. The method according to claim 1, characterized in that When the first detection result is that the first die-cutting electrode sheet does not meet the process standard, a laser industrial computer performs a jump-cutting action on the to-be-die-cutting slice after the die-cutting electrode sheet corresponding to the first detection result, obtains a first jump-cutting electrode sheet, and performs a scrapping action on the first jump-cutting electrode sheet, and further includes: Performing laser die-cutting on a plurality of blank areas of the electrode piece to be die-cut after the first jump-cut electrode piece, to obtain a second electrode piece after die-cutting; While laser die-cutting is performed on a plurality of blank areas of the to-be-die-cut electrode piece after the first jump-cut electrode piece, a plurality of the second die-cut electrode pieces are inspected according to a preset process standard to obtain a second inspection result.

7. The method according to claim 6, characterized in that While performing the laser die-cutting operation on the plurality of blank areas of the electrode piece to be die-cut after the first jump-cut electrode piece, the plurality of the second die-cut electrode pieces are inspected according to a preset process standard, and after obtaining the second inspection result, the method further includes: When the second detection result is that the second die-cutting electrode piece does not meet the process standard, a laser industrial computer performs a jump-cutting action on the to-be-die-cutting slice after the die-cutting electrode piece corresponding to the second detection result, obtains a second jump-cutting electrode piece, and performs a scrapping action on the second jump-cutting electrode piece; When the second detection result is that the second die-cut pole piece meets the process standard, a second laser die-cut product is obtained according to the second die-cut pole piece.

8. A laser die-cutting device, characterized in that: include: A first laser die-cutting module, used for performing a laser die-cutting operation on a plurality of blank areas of a to-be-die-cut electrode piece to obtain a plurality of first die-cut electrode pieces, wherein the to-be-die-cut electrode piece is a electrode piece provided with a plurality of coating areas and a plurality of the blank areas arranged alternately; A first detection module, configured to detect the plurality of first die-cut electrode sheets according to a preset process standard while performing a laser die-cutting operation on the plurality of blank areas of the electrode sheet to be die-cut to obtain a plurality of first die-cut electrode sheets, to obtain a first detection result; A first jump-cut module, for, when the first detection result is that the first die-cutting electrode piece does not meet the process standard, executing a jump-cut action on the to-be-die-cutting slice after the die-cutting electrode piece corresponding to the first detection result through a laser industrial computer, obtaining a first jump-cutting electrode piece and executing a scrapping action on the first jump-cutting electrode piece; The first product acquisition module is used to acquire a first laser die-cut product according to the first die-cut pole piece when the first detection result is that the first die-cut pole piece meets the process standard.

9. An electronic device, characterized in that: It comprises a processor and a memory, wherein the memory stores a program or instruction that can be run on the processor, and when the program or instruction is executed by the processor, the steps of the laser die-cutting method according to any one of claims 1 to 7 are implemented.

10. A readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the laser die-cutting method according to any one of claims 1 to 7 is implemented.

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