Wafer thinning processing equipment

Abstract

The invention belongs to the technical field of wafer processing, and particularly relates to wafer thinning processing equipment which comprises a rotary platform, three workbenches are mounted on the outer side of the rotary platform at equal intervals, mounting bases are arranged on the two sides of the rotary platform, and a loading and unloading mechanism is arranged on the side, away from the two mounting bases, of the rotary platform; the automatic filling unit comprises a taking and placing assembly, a feeding assembly and a returning assembly, the taking and placing assembly comprises telescopic columns arranged on the two sides of the workbench, one end of each telescopic column is hinged to a turnover rod, a clamping plate is arranged above the turnover rods, and a clamping assembly is arranged between the clamping plate and the turnover rods; the clamping plate can drive a wafer body to move and turn over through driving of the telescopic column and the turning rod, the wafer body can be conveniently loaded to the front end of the workbench, the clamping plate can automatically complete material taking and discharging actions in the turning process through driving of the moving block and the telescopic plate, manual operation can be reduced, and the machining efficiency can be improved.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer processing, in particular to wafer thinning processing equipment. Background Art

[0002] A wafer is a silicon chip used to make semiconductor integrated circuits. The 3D packaging multi-layer stacking technology requires a thinner wafer thickness. In order to avoid the transmission difficulties caused by the warping of thin wafers, the process of leaving edges during thinning is often adopted. The existing edge-leaving processing equipment is improved on the basis of the thinning equipment. After leaving edges, the waste slag and waste water generated by thinning are blocked by the edges and cannot be discharged in time, affecting the processing efficiency and wafer surface quality.

[0003] When processing wafers, unprocessed wafers need to be loaded onto a workbench, and the wafers need to be removed from the workbench after processing. The process of loading and removing wafers requires manual operation, which is time-consuming and there is a risk of the wafer falling and being damaged, affecting production.

[0004] To this end, the present invention provides wafer thinning processing equipment. Summary of the invention

[0005] In order to make up for the deficiencies of the prior art, at least one technical problem raised in the background technology is solved.

[0006] The technical solution adopted by the present invention to solve its technical problems is: the wafer thinning processing equipment described in the present invention includes a rotating platform, three workbenches are installed at equal angles on the outside of the rotating platform, one end of the workbench is loaded with the wafer body, and two grinding units and a loading and unloading mechanism are arranged on the outside of the rotating platform, which correspond to the three workbenches one by one; the grinding unit includes a mounting seat, a driving member located inside the mounting seat and a grinding wheel located at the driving end of the driving member, a first-direction moving member is installed at the bottom end of the mounting seat, a second-direction moving member is installed at the bottom end of the first-direction moving member, and a support platform is fixed at the bottom end of the second-direction moving member; the loading and unloading mechanism includes a pick-up and placement assembly, a feeding assembly and a return assembly, the pick-up and placement assembly includes a telescopic column arranged on both sides of the workbench, one end of the telescopic column is hinged with a flip rod, a clamping plate is arranged above the flip rod, and a clamping assembly is arranged between the clamping plate and the flip rod; the return assembly includes a support frame arranged on the side of the rotating platform away from the two mounting seats.

[0007] Preferably, a second motor is provided on both sides of the workbench, a fixing frame is fixed to the outside of the second motor, a guide plate is fixed to the top of the fixing frame, the telescopic column runs through the inside of the guide plate, a first threaded rod is fixed to the end of the rotating shaft of the second motor, the first threaded rod is threadedly connected to one end of the telescopic column, an extension block is fixed to the bottom end of the flip rod, an electric telescopic rod is hinged to the top of the telescopic column, and the other end of the electric telescopic rod is hinged to the side of the flip rod.

[0008] Preferably, the clamping assembly includes a telescopic plate fixed to one side of the top end of the flip rod, a moving block is provided on the outside of the telescopic plate, a telescopic hole is opened inside the moving block, the telescopic plate is inserted into the telescopic hole, two rollers are rotatably connected inside the moving block, the internal threads of the rollers are connected to a second threaded rod, the two rollers are respectively arranged above and below the telescopic hole, a plurality of racks are fixed at equal intervals on the top and bottom ends of the telescopic plate, a rack is also fixed to the outside of one side of the roller close to the telescopic plate, and the telescopic plate is meshed with the rollers through the cooperation of the racks.

[0009] Preferably, one end of the fixing frame away from the second motor is fixedly connected to the supporting frame.

[0010] Preferably, a second connecting plate is fixed to the end of the second threaded rod away from the movable block, a movable cavity is opened inside the second connecting plate, a telescopic block is fixed to the side of the clamp plate close to the second connecting plate, the end of the telescopic block away from the clamp plate extends into the movable cavity, a second spring is fixed to the end of the movable cavity away from the clamp plate, and the other end of the second spring is fixedly connected to the telescopic block.

[0011] Preferably, a connecting frame is fixed to one side of the fixing frame, a guide block is fixed to the bottom end of one side of the connecting frame, a limiting sliding groove is provided at the top end of the second connecting plate, and the guide block is slidably connected to the limiting sliding groove.

[0012] Preferably, a return material conveyor is installed at the top of the support frame, and a turning frame is provided above the return material conveyor, and first connecting plates are fixed on both sides of the bottom end of the turning frame, and the first connecting plate is rotatably connected to the outside of the return material conveyor, and support plates are fixed on both sides of the return material conveyor, and a first motor is installed on one side of one of the support plates, and a first gear is fixed to the end of the rotating shaft of the first motor, and a second gear is fixed to the end of the first gear away from the first motor, and teeth are provided in a quarter area of ​​the outer side of the second gear close to the first connecting plate, and teeth are also provided in a quarter area of ​​the outer side of the first connecting plate close to the second gear. The first connecting plate and the second gear are meshed and connected through teeth, and two groups of the second gear and the first gear are symmetrically arranged on both sides of the return material conveyor, and a transmission rod is fixedly connected between the two second gears.

[0013] Preferably, the top end of the support plate is rotatably connected to a rotating column, a pressure plate is fixed to the end of the rotating column away from the first connecting plate, the angle between the pressure plate and the flip frame is 90°, a plurality of teeth are evenly spaced on the outer side of the first gear, a plurality of teeth are also evenly spaced on the outer side of one end of the rotating column close to the first gear, and the rotating column is meshingly connected to the first gear.

[0014] Preferably, a support block is provided on the side of the support plate away from the first motor, a lifting block is fixed to the bottom end of the support block, a connecting shell is provided below the support block, the bottom end of the lifting block extends inside the connecting shell, a first spring is fixed to the bottom end of the lifting block, and the bottom end of the first spring is fixedly connected to the connecting shell.

[0015] Preferably, the feeding assembly includes a feed conveyor belt arranged below the return conveyor belt, the feed conveyor belt is fixedly connected to the support frame, and top plates are fixed on both sides of the feed conveyor belt.

[0016] The beneficial effects of the present invention are as follows: 1. The wafer thinning processing equipment described in the present invention can drive the wafer body to move and flip through the driving of the telescopic column and the flip rod, so as to facilitate loading the wafer body to the front end of the workbench. The driving of the moving block and the telescopic plate can enable the clamping plate to automatically complete the material picking and placing actions during the flipping process, thereby reducing manual operations and improving processing efficiency.

[0017] 2. The wafer thinning processing equipment described in the present invention can transport the wafer body through the return conveyor belt and the feed conveyor belt. It can cooperate with the clamping plate to place the processed wafer body on the top of the return conveyor belt, and clamp the unprocessed wafer body from the feed conveyor belt. It can realize automatic operation and improve the stability and efficiency of processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further described below in conjunction with the accompanying drawings.

[0019] Figure 1 is a stereogram of the present invention; Figure 2 It is a schematic diagram of the support frame and telescopic column structure of the present invention; Figure 3 It is a schematic diagram of the telescopic rod structure of the present invention; Figure 4 It is a schematic diagram of the internal structure of the moving block in the present invention; Figure 5 It is a schematic diagram of the internal structure of the connecting plate in the present invention; Figure 6 It is a schematic diagram of the support frame structure in the present invention; Figure 7 It is a schematic diagram of the structure of the overturning frame in the present invention; Figure 8 is a schematic diagram of the first motor structure in the present invention; Fig. 9 It is a schematic diagram of the support block structure in the present invention.

[0020] In the figure: 1, rotary platform; 2, workbench; 3, mounting seat; 31, grinding wheel; 32, driving member; 33, first direction moving member; 34, second direction moving member; 35, support platform; 4, support frame; 41, feed conveyor belt; 411, top plate; 42, return conveyor belt; 421, turning frame; 422, pressing plate; 423, rotating column; 424, first connecting plate; 43, support plate; 431, first motor; 432, first gear; 433, second gear; 434, transmission rod; 44, support block; 441, lifting block; 442, Connecting shell; 443, first spring; 5, wafer body; 6, telescopic column; 61, second motor; 611, first threaded rod; 612, fixing frame; 613, guide plate; 62, flip rod; 621, extension block; 63, electric telescopic rod; 64, telescopic plate; 65, moving block; 651, telescopic hole; 652, roller; 653, second threaded rod; 66, clamping plate; 661, second connecting plate; 662, limiting slide groove; 663, movable cavity; 664, telescopic block; 665, second spring; 67, connecting frame; 671, guide block. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0022] like Figures 1 to 3 As shown, the wafer thinning processing equipment described in the embodiment of the present invention comprises a rotary platform 1, three workbenches 2 are installed at equal angles on the outer side of the rotary platform 1, one end of the workbench 2 is loaded with a wafer body 5, two grinding units and a loading and unloading mechanism are arranged on the outer side of the rotary platform 1, which correspond to the three workbenches 2 one by one respectively; the grinding unit comprises a mounting seat 3, a driving member 32 located inside the mounting seat 3 and a grinding wheel 31 located at the driving end of the driving member 32, a first direction moving member 33 is installed at the bottom end of the mounting seat 3, a second direction moving member 34 is installed at the bottom end of the first direction moving member 33, and a support platform 35 is fixed at the bottom end of the second direction moving member 34; the loading and unloading mechanism comprises a pick-up and placement assembly, a feeding assembly and a return assembly, the pick-up and placement assembly comprises a telescopic column 6 arranged on both sides of the workbench 2, one end of the telescopic column 6 is hinged with a flip rod 62, a clamping plate 66 is arranged above the flip rod 62, and a clamping assembly is arranged between the clamping plate 66 and the flip rod 62; the return assembly comprises a support frame 4 arranged on the side of the rotary platform 1 away from the two mounting seats 3; After the wafer body 5 is produced, in order to ensure that its thickness meets the standard, its surface needs to be thinned. During the thinning process, the wafer body 5 to be processed is transported to the front of the workbench 2 through the feeding assembly. At this time, the clamping plate 66 is driven by the telescopic column 6 to extend toward the telescopic column 6, and then the clamping plate 66 is driven by the flip rod 62 to flip over the wafer body 5. The clamping plate 66 is then pushed by the clamping assembly to enable the clamping plate 66 to clamp the wafer body 5. Then, driven by the telescopic column 6 and the flip rod 62, the clamping plate 66 loads the wafer body 5 to the front end of the workbench 2. A negative pressure adsorption assembly is installed inside the workbench 2. The wafer body 5 can be adsorbed on the front end of the workbench 2 through the adsorption assembly. After the wafer body 5 is fixed, the rotary platform 1 rotates 120° to drive the wafer body 5 to rotate in front of the grinding wheel 31 of the first station, and then the driving member 32 drives the grinding wheel 31 rotates, and the grinding wheel 31 grinds the surface of the wafer body 5 for rough processing under the drive of the first direction moving member 33 and the second direction moving member 34. After the processing at the first processing position is completed, the rotary platform 1 continues to rotate 120°. At this time, the rotary platform 1 drives the roughly processed wafer body 5 to enter the second processing position for fine processing. The two processings can thin the wafer body 5 to the process standard. When one workbench 2 rotates to drive the wafer body 5 for processing, the other workbench 2 will rotate to the front of the feeding component, and then load the wafer body 5 to the front end of the current workbench 2. When the processed wafer body 5 rotates back to the front of the feeding component, the pick-up and place component will place the processed wafer body 5 above the return component, and pick up another wafer body 5 from above the feeding component. In this cycle, the wafer body 5 can be automatically picked up and placed and thinned.

[0023] like Figures 1 to 3 As shown, a second motor 61 is arranged on both sides of the workbench 2, a fixing frame 612 is fixed to the outside of the second motor 61, a guide plate 613 is fixed to the top of the fixing frame 612, the telescopic column 6 runs through the inside of the guide plate 613, a first threaded rod 611 is fixed to the end of the rotating shaft of the second motor 61, the first threaded rod 611 is threadedly connected to one end of the telescopic column 6, an extension block 621 is fixed to the bottom end of the flip rod 62, an electric telescopic rod 63 is hinged to the top of the telescopic column 6, and the other end of the electric telescopic rod 63 is hinged to the side of the flip rod 62; During the process of taking and placing materials, the second motor 61 is started to drive the first threaded rod 611 to rotate. The rotation of the first threaded rod 611 drives the telescopic column 6 to extend and retract horizontally. The guide plate 613 guides the telescopic column 6. After the telescopic column 6 is extended and retracted to the required position, the electric telescopic rod 63 drives the flip rod 62 to flip, which can meet the action required by the clamping plate 66 when taking and placing materials. After the flip rod 62 flips, the extension block 621 can limit it to prevent the flip rod 62 from flipping too large an angle.

[0024] like Figure 3 to Figure 4As shown, the clamping assembly includes a telescopic plate 64 fixed to one side of the top end of the flip rod 62, a moving block 65 is arranged on the outside of the telescopic plate 64, a telescopic hole 651 is opened inside the moving block 65, the telescopic plate 64 is inserted inside the telescopic hole 651, two rollers 652 are rotatably connected inside the moving block 65, the second threaded rod 653 is threadedly connected inside the roller 652, the two rollers 652 are respectively arranged above and below the telescopic hole 651, the top and bottom ends of the telescopic plate 64 are fixed with racks, the outside of the roller 652 is also fixed with racks, and the telescopic plate 64 is meshed and connected with the roller 652 through the rack cooperation; When the telescopic column 6 drives the clamping plate 66 to move, the wafer body 5 needs to be clamped and put down by the clamping plate 66. During the clamping process, the moving block 65 is pushed by an external force, and the force at this time pushes the clamping plate 66 in the direction of the flip rod 62. At this time, the moving block 65 is pushed and moved, and the telescopic plate 64 passes through the inside of the telescopic hole 651. The rollers 652 above and below the telescopic plate 64 are driven by the rack of the telescopic plate 64 to rotate. When the roller 652 rotates in this direction, it will drive the second threaded rod 653 to extend from the inside of the roller 652, and the second threaded rod 653 can push The clamp 66 clamps the wafer body 5. When the clamp 66 drives the wafer body 5 to contact the inside of the workbench 2, the wafer body 5 needs to be loosened. At this time, the telescopic column 6 pulls the telescopic plate 64 through the flip rod 62, and the telescopic plate 64 is pulled out from the inside of the telescopic hole 651. During this process, the telescopic plate 64 will drive the roller 652 to rotate in the opposite direction. At this time, the rotation direction of the roller 652 will drive the second threaded rod 653 to retract into the inside of the roller 652. The second threaded rod 653 drives the clamp 66 to separate from the wafer body 5, so that the clamp 66 can automatically take and place the wafer body 5.

[0025] like Figure 1 to Figure 2 As shown, one end of the fixing bracket 612 away from the second motor 61 is fixedly connected to the supporting bracket 4; The second motor 61 is fixed to one end of the support frame 4 via a fixing frame 612 , and the support frame 4 can support the second motor 61 , making it more stable during use.

[0026] like Figures 1 to 5 As shown, a second connecting plate 661 is fixed to one end of the second threaded rod 653 away from the moving block 65, an active cavity 663 is provided inside the second connecting plate 661, a telescopic block 664 is fixed to one side of the clamping plate 66 close to the second connecting plate 661, an end of the telescopic block 664 away from the clamping plate 66 extends inside the active cavity 663, a second spring 665 is fixed to one end of the active cavity 663 away from the clamping plate 66, and the other end of the second spring 665 is fixedly connected to the telescopic block 664; When the clamping plate 66 clamps the wafer body 5, the second threaded rod 653 pushes the second connecting plate 661, and the second connecting plate 661 drives the clamping plate 66 to approach the wafer body 5. When the clamping plate 66 contacts the wafer body 5 and is pushed, the clamping plate 66 pushes the telescopic block 664 to squeeze the second spring 665 into the movable cavity 663. At this time, the second spring 665 can buffer the space between the second connecting plate 661 and the clamping plate 66, so as to prevent the clamping plate 66 from damaging the wafer body 5 due to excessive force of the second connecting plate 661.

[0027] like Figures 1 to 4 As shown, a connecting frame 67 is fixed to one side of the fixing frame 612, a guide block 671 is fixed to the bottom end of one side of the connecting frame 67, a limiting slide groove 662 is provided at the top end of the second connecting plate 661, and the guide block 671 is slidably connected to the limiting slide groove 662; When the moving block 65 drives the clamping plate 66 to separate from the wafer body 5, the second connecting plate 661 will slide at the front end of the workbench 2. During the sliding process, the second connecting plate 661 will drive the limiting slide groove 662 to slide outside the guide block 671. When the clamping plate 66 is separated from the wafer body 5, the guide block 671 and the limiting slide groove 662 are closed. At this time, the second connecting plate 661 is fixed below the connecting frame 67 through the limiting slide groove 662 and the guide block 671. When the wafer body 5 needs to be taken out from the front end of the workbench 2, the telescopic column 6 is turned over by the turning rod 6 2 pushes the telescopic plate 64. At this time, the guide block 671 can provide a limiting function for the limiting slide groove 662, so that the telescopic plate 64 can pass through the inside of the moving block 65 during the forward extension process. The telescopic plate 64 can drive the second threaded rod 653 to extend from the inside of the roller 652 through the movement of the telescopic plate 64 inside the moving block 65. At this time, the second threaded rod 653 can push the second connecting plate 661 to drive the clamping plate 66 to clamp the wafer body 5. At this time, the negative pressure adsorption component of the workbench 2 stops adsorption, so that the processed wafer body 5 can be easily removed.

[0028] like Figures 6 to 8As shown, a return material conveyor belt 42 is installed on the top of the support frame 4, and a turning frame 421 is arranged above the return material conveyor belt 42. First connecting plates 424 are fixed on both sides of the bottom end of the turning frame 421. The first connecting plates 424 are rotatably connected to the outside of the return material conveyor belt 42. Support plates 43 are fixed on both sides of the return material conveyor belt 42. A first motor 431 is installed on one side of one of the support plates 43. A first gear 432 is fixed to the end of the rotating shaft of the first motor 431. A second gear 433 is fixed to the end of the first gear 432 away from the first motor 431. A quarter area of ​​the outer side of the second gear 433 close to the first connecting plate 424 is provided with teeth, and a quarter area of ​​the outer side of the first connecting plate 424 close to the second gear 433 is also provided with teeth. The first connecting plate 424 and the second gear 433 are meshed and connected through the teeth. Two groups of the second gear 433 and the first gear 432 are symmetrically arranged on both sides of the return material conveyor belt 42, and a transmission rod 434 is fixedly connected between the two second gears 433. Before processing, the flip frame 421 is in a vertical state with the return conveyor belt 42. At this time, the flip frame 421 does not affect the clamping plate 66 to take materials from the top of the feeding assembly. When the wafer body 5 is processed and needs to be recycled, the first motor 431 is started to drive the first gear 432 and the second gear 433 to rotate. After the second gear 433 rotates, it drives the first connecting plate 424 to rotate. At this time, the first connecting plate 424 drives the flip frame 421 to flip 90° in the direction of the workbench 2. At this time, the flip frame 421 is in a flip state. The rod 62 drives the clamping plate 66 to flip in the path, and then the flip rod 62 drives the clamping plate 66 to flip, and the clamping plate 66 drives the wafer body 5 to pass over the top of the flip frame 421, and the flip frame 421 can receive the processed wafer body 5. After the flip frame 421 completes the reception, the first motor 431 rotates in the opposite direction. During this process, the wafer body 5 at the top of the flip frame 421 slides to the top of the return conveyor belt 42, and the return conveyor belt 42 can transport the wafer body 5, so that the processed wafer body 5 can be automatically removed.

[0029] like Figures 1 to 8 As shown, the top of the support plate 43 is rotatably connected with a rotating column 423, and a pressing plate 422 is fixed to one end of the rotating column 423 away from the first connecting plate 424, and the angle between the pressing plate 422 and the flip frame 421 is 90°. A plurality of teeth are evenly spaced on the outer side of the first gear 432, and a plurality of teeth are also evenly spaced on the outer side of one end of the rotating column 423 close to the first gear 432, and the rotating column 423 is meshingly connected with the first gear 432; When the first connecting plate 424 is rotated by the second gear 433, the first connecting plate 424 loses engagement with the second gear 433. At this time, the clamping plate 66 drives the wafer body 5 to flip over to the top of the flip frame 421. Then the first gear 432 can continue to drive the rotating column 423 to continue to rotate. At this time, the rotating column 423 drives the pressure plate 422 to continue to rotate 90°. The rotating column 423 can drive the pressure plate 422 to continue to flip. The flipping of the pressure plate 422 can press the flipped moving block 65 downward. After the moving block 65 is subjected to force, it drives the clamping plate 66 to release the clamping of the wafer body 5. After unloading is completed, the first motor 431 is started to rotate in the opposite direction. At this time, the first gear 432 and the second gear 433 can drive the rotating column 423 and the first connecting plate 424 to rotate in the opposite direction and reset, thereby completing automatic unloading.

[0030] like Figures 6 to 9 As shown, a support block 44 is provided on the side of the support plate 43 away from the first motor 431, a lifting block 441 is fixed to the bottom end of the support block 44, a connecting shell 442 is provided below the support block 44, the bottom end of the lifting block 441 extends inside the connecting shell 442, a first spring 443 is fixed to the bottom end of the lifting block 441, and the bottom end of the first spring 443 is fixedly connected to the connecting shell 442; After the flip frame 421 flips, the support block 44 can support the bottom of the flip frame 421 to prevent the state of the flip frame 421 from being affected after the first connecting plate 424 and the second gear 433 lose engagement. After the top of the flip frame 421 is compressed, the support block 44 pushes the lifting block 441 downward, and the lifting block 441 squeezes the first spring 443 into the connecting shell 442, thereby buffering the flip frame 421 and preventing the teeth from being excessively squeezed and damaged when the first connecting plate 424 and the second gear 433 lose engagement.

[0031] like Figures 1 to 7 As shown, the feeding assembly includes a feed conveyor belt 41 disposed below the return conveyor belt 42, the feed conveyor belt 41 is fixedly connected to the support frame 4, and top plates 411 are fixed on both sides of the feed conveyor belt 41; After the clamp 66 unloads the wafer body 5, the clamp 66 moves to the top of the feed conveyor 41, and the feed conveyor 41 transports the unprocessed wafer body 5 to the bottom of the clamp 66. At this time, the top plate 411 will lift the moving block 65, so that the clamp 66 can move toward the wafer body 5 while moving downward. When the clamp 66 is completely aligned with the position of the wafer body 5, the clamp 66 can clamp the wafer body 5, and automatically clamp the wafer body 5. After clamping the wafer body 5, the clamp 66 is reset, which can drive the wafer body 5 to be loaded to the front end of the workbench 2.

[0032] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. Wafer thinning processing equipment, characterized in that: It comprises a rotary platform (1), three workbenches (2) are installed at equal angles on the outer side of the rotary platform (1), a wafer body (5) is loaded on one end of the workbench (2), and two polishing units and a loading and unloading mechanism are arranged on the outer side of the rotary platform (1), which correspond to the three workbenches (2) one by one respectively; The grinding unit comprises a mounting seat (3), a driving member (32) located inside the mounting seat (3), and a grinding wheel (31) located at a driving end of the driving member (32); a first-direction moving member (33) is mounted at the bottom end of the mounting seat (3); a second-direction moving member (34) is mounted at the bottom end of the first-direction moving member (33); and a support platform (35) is fixed at the bottom end of the second-direction moving member (34); The loading and unloading mechanism comprises a pick-up and placement assembly, a material feeding assembly and a material return assembly. The pick-up and placement assembly comprises telescopic columns (6) arranged on both sides of the workbench (2). A flip rod (62) is hingedly connected to one end of the telescopic column (6). A clamping plate (66) is arranged above the flip rod (62). A clamping assembly is arranged between the clamping plate (66) and the flip rod (62). The material return assembly comprises a support frame (4) arranged on a side of the rotary platform (1) away from the two mounting seats (3).

2. The wafer thinning processing equipment according to claim 1, characterized in that: A second motor (61) is arranged on both sides of the workbench (2); a fixing frame (612) is fixed to the outside of the second motor (61); a guide plate (613) is fixed to the top of the fixing frame (612); a telescopic column (6) passes through the inside of the guide plate (613); a first threaded rod (611) is fixed to the end of the rotating shaft of the second motor (61); the first threaded rod (611) is threadedly connected to one end of the telescopic column (6); an extension block (621) is fixed to the bottom end of the flip rod (62); an electric telescopic rod (63) is hinged to the top of the telescopic column (6); and the other end of the electric telescopic rod (63) is hinged to the side of the flip rod (62).

3. The wafer thinning processing equipment according to claim 2, characterized in that: The clamping assembly comprises a telescopic plate (64) fixed to one side of the top end of the flip rod (62); a moving block (65) is arranged outside the telescopic plate (64); a telescopic hole (651) is opened inside the moving block (65); the telescopic plate (64) is inserted into the telescopic hole (651); two rollers (652) are rotatably connected inside the moving block (65); a second threaded rod (653) is threadedly connected inside the roller (652); the two rollers (652) are arranged above and below the telescopic hole (651), respectively; a plurality of racks are fixed at equal intervals on the top and bottom ends of the telescopic plate (64); a rack is also fixed outside the side of the roller (652) close to the telescopic plate (64); the telescopic plate (64) is meshed and connected with the roller (652) through the cooperation of the racks.

4. The wafer thinning processing equipment according to claim 2, characterized in that: One end of the fixing frame (612) away from the second motor (61) is fixedly connected to the supporting frame (4).

5. The wafer thinning processing equipment according to claim 4, characterized in that: A second connecting plate (661) is fixed to one end of the second threaded rod (653) away from the movable block (65); a movable cavity (663) is provided inside the second connecting plate (661); a telescopic block (664) is fixed to one side of the clamping plate (66) close to the second connecting plate (661); an end of the telescopic block (664) away from the clamping plate (66) extends into the movable cavity (663); a second spring (665) is fixed to one end of the movable cavity (663) away from the clamping plate (66); and the other end of the second spring (665) is fixedly connected to the telescopic block (664).

6. The wafer thinning processing equipment according to claim 5, characterized in that: A connecting frame (67) is fixed to one side of the fixing frame (612), a guide block (671) is fixed to the bottom end of one side of the connecting frame (67), a limiting sliding groove (662) is provided at the top end of the second connecting plate (661), and the guide block (671) is slidably connected to the limiting sliding groove (662).

7. The wafer thinning processing equipment according to claim 1, characterized in that: A return material conveyor belt (42) is installed at the top of the support frame (4), a turning frame (421) is arranged above the return material conveyor belt (42), first connecting plates (424) are fixed on both sides of the bottom end of the turning frame (421), the first connecting plates (424) are rotatably connected to the outside of the return material conveyor belt (42), support plates (43) are fixed on both sides of the return material conveyor belt (42), a first motor (431) is installed on one side of one of the support plates (43), a first gear (432) is fixed to the end of the rotating shaft of the first motor (431), and the first gear (432) is away from the first motor A second gear (433) is fixed to one end of the (431), and teeth are provided on a quarter area of ​​the outer side of the second gear (433) close to the first connecting plate (424). Teeth are also provided on a quarter area of ​​the outer side of the first connecting plate (424) close to one side of the second gear (433). The first connecting plate (424) and the second gear (433) are meshed and connected by the teeth. Two groups of second gears (433) and first gears (432) are symmetrically provided on both sides of the return material conveyor belt (42), and a transmission rod (434) is fixedly connected between the two second gears (433).

8. The wafer thinning processing equipment according to claim 7, characterized in that: The top end of the support plate (43) is rotatably connected to a rotating column (423), and a pressing plate (422) is fixed to one end of the rotating column (423) away from the first connecting plate (424). The angle between the pressing plate (422) and the turning frame (421) is 90 degrees. A plurality of teeth are arranged at equal intervals on the outer side of the first gear (432). A plurality of teeth are also arranged at equal intervals on the outer side of one end of the rotating column (423) close to the first gear (432). The rotating column (423) is meshingly connected with the first gear (432).

9. The wafer thinning processing equipment according to claim 7, characterized in that: A support block (44) is provided on a side of the support plate (43) away from the first motor (431); a lifting block (441) is fixed to the bottom end of the support block (44); a connecting shell (442) is provided below the support block (44); the bottom end of the lifting block (441) extends inside the connecting shell (442); a first spring (443) is fixed to the bottom end of the lifting block (441); and the bottom end of the first spring (443) is fixedly connected to the connecting shell (442).

10. The wafer thinning processing equipment according to claim 7, characterized in that: The feeding assembly comprises a feed conveyor belt (41) arranged below the return conveyor belt (42); the feed conveyor belt (41) is fixedly connected to the support frame (4); and top plates (411) are fixed on both sides of the feed conveyor belt (41).

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