Maintenance method for piezoelectric copolymer thick film forming mold

Abstract

The invention relates to a maintenance method for a piezoelectric copolymer thick film forming mold, which is used for cleaning and maintaining the copolymer thick film forming mold before use, and comprises the following steps: S11, cleaning the mold, putting the mold into an ultrasonic cleaning machine, completely immersing the mold in a solvent by adopting an acetone solvent with the purity of 99.9% or more, and cleaning the mold by using a water bath; the temperature of the solvent is kept within the range of 25 + / -5 DEG C, the ultrasonic power is not lower than 1.5 kW, ultrasonic cleaning is carried out for more than 10 min, then the acetone solvent is replaced, and the process is repeated for more than 3 times. The service life of the mold can be effectively prolonged, and the stability of the copolymer thick film forming process is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of piezoelectric copolymer films, and in particular relates to a maintenance method for a piezoelectric copolymer thick film forming die. Background Art

[0002] The copolymer resin material needs to be pressed under high temperature and high pressure during the film-forming process. In order to ensure the high precision and ultra-high cleanliness of the thickness dimension of the copolymer thick film element, high requirements are placed on the high temperature and high pressure resistance, corrosion resistance, surface finish, parallelism of the upper and lower molds, and hardness of the molding mold. Currently, the commonly used molding molds are generally made of metal materials. At the same time, chrome plating on the metal surface can effectively improve the corrosion resistance, hardness and wear resistance of the metal mold, and the smooth surface of the coating does not affect the finish of the mold. However, due to the strong corrosiveness and high viscosity of the copolymer resin material under high temperature conditions, the coating is prone to corrosion and shedding during the high-frequency molding process. The detached metal particles are mixed in the material, which in turn contaminates the piezoelectric copolymer thick film element and causes subsequent high-voltage polarization breakdown. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a maintenance method for a piezoelectric copolymer thick film forming mold, which can effectively extend the service life of the mold and improve the stability of the copolymer thick film forming process.

[0004] The technical solution of the present invention is to provide a maintenance method for a piezoelectric copolymer thick film forming mold, which cleans and maintains the copolymer thick film forming mold before use, comprising the following steps: S11: Mold cleaning: put the mold into an ultrasonic cleaning machine. The cleaning liquid is an acetone solvent with a purity of more than 99.9%. The mold is completely immersed in the solvent. The solvent temperature is maintained within the range of 25℃±5℃. The ultrasonic power is not less than 1.5kW. The ultrasonic cleaning is performed for more than 10 minutes. Then the acetone solvent is replaced. The above process is repeated for more than 3 times to remove tiny impurities and oily substances on the mold surface. S12: putting the cleaned mold into a clean drying oven, setting the temperature to not less than 70° C., and drying for more than 20 minutes to completely evaporate the acetone solvent; S13: Put the dried mold into an ultrasonic cleaning machine and completely immerse it in ultrapure water solvent. The water temperature is maintained within the range of 25°C ± 5°C and the ultrasonic power is not less than 1kW. After ultrasonic cleaning, the solvent is replaced and the operation is repeated for more than 2 times. S14: completely placing the cleaned mold into the non-woven fabric to absorb moisture from the mold surface, and then placing the mold into a clean drying oven, setting the temperature to not less than 100° C., and drying for more than 30 minutes to completely evaporate the moisture; S15: Place the dried mold on the work surface and wipe the mold surface with a Class 100 microfiber dust-free cloth soaked in isopropyl alcohol or ethanol. Wipe from the inside to the outside in a circular direction for more than 3 times. After the isopropyl alcohol or ethanol evaporates, it can be used normally.

[0005] Preferably, in step S13, the resistivity of the ultrapure water solvent is ≥18 MΩ·cm.

[0006] Preferably, in step S13, ultrasonic cleaning is performed for more than 5 minutes, and then the solvent is replaced.

[0007] Preferably, in step S15, wiping is performed from inside to outside in a circumferential direction, and wiping is performed more than 3 times.

[0008] Furthermore, the method also includes the maintenance of the copolymer thick film forming mold after use, and the specific operation is as follows: Step 21: After use, the surface of the molding mold is usually adhered with a small amount of resin material. Due to the high viscosity of the material, physical removal will cause damage to the mold surface. Therefore, put the mold into an ultrasonic cleaning machine and soak it in hydrofluoroether (HFE-347) solvent. Set the temperature to no higher than 20°C, the ultrasonic power to no less than 0.5kW, and the cleaning time to no less than 15 minutes. Step 22, place the cleaned mold on a work surface, wipe the mold surface with a Class 100 microfiber dust-free cloth soaked in hydrofluoroether solvent, clean the residual material on the mold surface, and then put it into a clean drying oven, set the temperature to not less than 60°C, and dry it for more than 30 minutes to completely evaporate the solvent; Step 23, rinse the dried molding mold with ultrapure water for no less than 5 minutes, completely place the cleaned mold in the non-woven fabric to absorb moisture from the mold surface, and then place the mold in a clean drying oven, set the temperature to no less than 100° C., and dry for more than 30 minutes to completely evaporate the moisture; Step 24, place a clean silicone sheet or polytetrafluoroethylene sheet of the same size as the mold between the upper and lower molds of the dried mold to prevent the molds from colliding with each other and being damaged, and then store them in a drying cabinet with a relative humidity not higher than 30% until the next use.

[0009] Preferably, in step 24, a clean silicone sheet or polytetrafluoroethylene sheet with a thickness of not less than 1 mm and the same size as the mold is placed between the upper and lower molds of the dried mold.

[0010] Based on the physicochemical properties of copolymer resin materials and chrome plating of metal molds, the present invention proposes a cleaning and maintenance method for piezoelectric copolymer thick film molding molds before and after use. A complete set of physical and chemical methods are used to clean the mold, including the selection of cleaning solvents, cleaning conditions, and cleaning tools, which can effectively prevent the mold from contaminating the material and the material from corroding the mold, and can also effectively prevent the mold from oxidizing.

[0011] Compared with the prior art, the present invention has the following advantages: The present invention selects appropriate cleaning solvents and cleaning conditions according to the characteristics of the material and the mold, and at the same time uses physical cleaning methods as little as possible to reduce mold damage during use, which can effectively ensure that the molding mold can be used stably for a long time. DETAILED DESCRIPTION

[0012] The present invention will be further described below with regard to specific embodiments: A maintenance method for a piezoelectric copolymer thick film forming mold, as follows: (1) Cleaning and maintenance of copolymer thick film molding molds before use a. The first step is to clean the mold. Put the mold into an ultrasonic cleaning machine. Use acetone solvent with a purity of more than 99.9% as the cleaning liquid. Completely immerse the mold in the solvent. Keep the solvent temperature within the range of 25℃±5℃. The ultrasonic power is not less than 1.5kW. Perform ultrasonic cleaning for more than 10 minutes. Replace the acetone solvent and repeat the above process for more than 3 times to remove tiny impurities and oily substances on the surface of the mold.

[0013] b. The second step is to place the cleaned mold into a clean drying oven, set the temperature to no less than 70°C, and dry it for more than 20 minutes to completely evaporate the acetone solvent.

[0014] c. The third step is to put the dried mold into an ultrasonic cleaning machine and completely immerse it in ultrapure water (resistivity ≥ 18MΩ·cm) solvent. The water temperature is maintained within the range of 25℃±5℃, the ultrasonic power is not less than 1kW, and the ultrasonic cleaning is performed for more than 5 minutes. The solvent is replaced and the operation is repeated for more than 2 times.

[0015] d. The fourth step is to completely place the cleaned mold into the non-woven fabric to absorb the moisture on the surface of the mold, and then place the mold into a clean drying oven, set the temperature to no less than 100°C, and dry it for more than 30 minutes to completely evaporate the moisture.

[0016] e. The fifth step is to place the dried mold on the work surface and wipe the mold surface with a Class 100 microfiber dust-free cloth soaked in isopropyl alcohol or ethanol, wiping from the inside to the outside in a circular direction for more than 3 times. After the isopropyl alcohol or ethanol evaporates, it can be used normally.

[0017] (2) Maintenance of copolymer thick film molding molds after use a. The first step is that there is usually a small amount of resin material bonded to the surface of the used mold. Due to the high viscosity of the material, physical removal will cause damage to the mold surface. Therefore, put the mold into an ultrasonic cleaning machine and soak it in hydrofluoroether (HFE-347) solvent. The temperature is set to no higher than 20°C, the ultrasonic power is no less than 0.5kW, and the cleaning time is no less than 15 minutes.

[0018] b. In the second step, place the cleaned mold on the work surface, wipe the mold surface with a Class 100 microfiber dust-free cloth soaked in hydrofluoroether solvent, clean the residual material on the mold surface, and then place it in a clean drying oven, set the temperature to not less than 60°C, and dry it for more than 30 minutes to allow the solvent to evaporate completely.

[0019] c. The third step is to rinse the dried molding mold with ultrapure water for no less than 5 minutes. The cleaned mold is completely placed in the non-woven fabric to absorb the moisture on the surface of the mold. The mold is then placed in a clean drying oven with a temperature set to no less than 100°C and dried for more than 30 minutes to completely evaporate the moisture.

[0020] d. The fourth step is to place a clean silicone sheet or polytetrafluoroethylene sheet with a thickness of not less than 1mm and the same size as the mold between the upper and lower molds after drying to prevent the molds from colliding with each other and being damaged. Then place them in a drying cabinet with a relative humidity of no more than 30% and store them until the next time they are used.

[0021] Based on the physicochemical properties of copolymer resin materials and chrome plating of metal molds, the present invention proposes a cleaning and maintenance method for piezoelectric copolymer thick film molding molds before and after use. A complete set of physical and chemical methods are used to clean the mold, including the selection of cleaning solvents, cleaning conditions, and cleaning tools. The mold can be effectively prevented from being contaminated by the mold and from being corroded by the material. At the same time, the mold can be effectively prevented from being oxidized, thereby effectively extending the service life of the mold and improving the stability of the copolymer thick film molding process.

[0022] The above is only an explanation of the preferred embodiments of the present invention, which should not be construed as a limitation on the claims. Any equivalent process changes made using the present invention specification are included in the patent protection scope of the present invention.

Claims

1. A maintenance method for a piezoelectric copolymer thick film forming mold, characterized in that: Clean and maintain the copolymer thick film forming mold before use. The following steps are included: S11: Mold cleaning: put the mold into an ultrasonic cleaning machine. The cleaning liquid is an acetone solvent with a purity of more than 99.9%. The mold is completely immersed in the solvent. The solvent temperature is maintained within the range of 25℃±5℃. The ultrasonic power is not less than 1.5kW. The ultrasonic cleaning is performed for more than 10 minutes. Then the acetone solvent is replaced. The above process is repeated for more than 3 times. S12: putting the cleaned mold into a clean drying oven, setting the temperature to not less than 70° C., and drying for more than 20 minutes to completely evaporate the acetone solvent; S13: Put the dried mold into an ultrasonic cleaning machine and completely immerse it in ultrapure water solvent. The water temperature is maintained within the range of 25°C ± 5°C and the ultrasonic power is not less than 1kW. After ultrasonic cleaning, the solvent is replaced and the operation is repeated for more than 2 times. S14: completely placing the cleaned mold into the non-woven fabric to absorb moisture from the mold surface, and then placing the mold into a clean drying oven, setting the temperature to not less than 100° C., and drying for more than 30 minutes to completely evaporate the moisture; S15: Place the dried mold on the work surface and wipe the mold surface with a Class 100 microfiber dust-free cloth soaked in isopropyl alcohol or ethanol. Wipe from the inside to the outside in a circular direction for more than 3 times. After the isopropyl alcohol or ethanol evaporates, it can be used normally.

2. The maintenance method for a piezoelectric copolymer thick film forming mold according to claim 1, characterized in that: In step S13, the resistivity of the ultrapure water solvent is ≥18 MΩ·cm.

3. The maintenance method for a piezoelectric copolymer thick film forming mold according to claim 1, characterized in that: In step S13, ultrasonic cleaning is performed for more than 5 minutes, and then the solvent is replaced.

4. The maintenance method for a piezoelectric copolymer thick film forming mold according to claim 1, characterized in that: In step S15, wiping is done from the inside to the outside in a circumferential direction, and the process is repeated more than three times.

5. The maintenance method for a piezoelectric copolymer thick film forming mold according to claim 1, characterized in that: It also includes the maintenance of the copolymer thick film forming mold after use. The specific operations are as follows: Step 21, placing the mold in an ultrasonic cleaning machine and immersing it in a hydrofluoroether solvent, setting the temperature to no higher than 20° C., the ultrasonic power to no lower than 0.5 kW, and the cleaning time to no less than 15 min; Step 22, place the cleaned mold on a work surface, wipe the mold surface with a Class 100 microfiber dust-free cloth soaked in hydrofluoroether solvent, clean the residual material on the mold surface, and then put it into a clean drying oven, set the temperature to not less than 60°C, and dry it for more than 30 minutes to completely evaporate the solvent; Step 23, rinse the dried molding mold with ultrapure water for no less than 5 minutes, completely place the cleaned mold in the non-woven fabric to absorb moisture from the mold surface, and then place the mold in a clean drying oven, set the temperature to no less than 100° C., and dry for more than 30 minutes to completely evaporate the moisture; Step 24, place a clean silicone sheet or polytetrafluoroethylene sheet of the same size as the mold between the upper and lower molds of the dried mold, and then store it in a drying cabinet with a relative humidity not higher than 30% until the next use.

6. The maintenance method for a piezoelectric copolymer thick film forming mold according to claim 1, characterized in that: In step 24, a clean silicone sheet or polytetrafluoroethylene sheet with a thickness of not less than 1 mm and the same size as the mold is placed between the upper and lower molds of the dried mold.