Composite inorganic plate and preparation method thereof

Abstract

The invention discloses a composite inorganic board which comprises an inorganic board base material layer, a waterproof bridging layer, a bonding layer and an impregnated paper facing layer are sequentially arranged on one surface of the inorganic board base material layer, and a closed back coating is arranged on the other surface of the inorganic board base material layer. According to the composite inorganic board, the complex technology in the construction process can be reduced, the production efficiency is improved, and meanwhile the bonding strength of the surface of the inorganic board is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of building and home decoration boards, and in particular relates to a composite inorganic board and a preparation method thereof. Background Art

[0002] Inorganic board is a board made of inorganic substances and fibers as the main materials. Compared with organic board, it has the advantages of higher strength, smaller deformation and higher cost performance. Among them, the most outstanding feature of inorganic board is its fire resistance. Due to this feature, inorganic board is mainly used in public places, work equipment and internal and external walls with high requirements for fire protection.

[0003] However, traditional inorganic boards are relatively single in style and color. On the contrary, organic boards are widely used in home furniture due to their rich styles and colors. In addition, traditional inorganic boards are relatively heavy, with a density generally greater than 1.0g / cm 3 , which makes its handling and installation process relatively difficult, the construction process is also cumbersome, and it is easy to generate waste. In addition, some inorganic boards may add harmful substances such as formaldehyde and benzene during the production process. These substances pose a potential threat to human health and are inconsistent with the development concept of green environmental protection.

[0004] For this reason, existing manufacturers use inorganic boards as substrates and coat other materials on them to prepare composite inorganic boards to improve their decorative properties. However, the surface bonding strength of such composite inorganic boards is poor, which affects their application in the field of home decoration. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a composite inorganic board and a preparation method thereof, which can reduce the complex process in the construction process, improve production efficiency, and improve the bonding strength of the surface of the inorganic board.

[0006] The above technical objectives of the present invention are achieved through the following technical solutions:

[0007] A composite inorganic board comprises an inorganic board substrate layer, on one surface of which a waterproof bridging layer, an adhesive layer and an impregnated paper facing layer are sequentially arranged, and on the other surface of which a closed back coating layer is arranged.

[0008] Preferably, the inorganic substrate layer is composed of an inorganic substrate, and the density of the inorganic substrate is 0.8-1.0 g / cm 3The inorganic board substrate includes the following raw materials in weight percentage: crystalline minerals: 50%-60%; calcium-silicon-aluminum tailings: 20%-30%; inorganic mineral fibers: 10%-15%; imported natural wood pulp fibers: 5%-10%; wherein the calcium-silicon-aluminum tailings refer to at least one of calcium tailings, silicon tailings and aluminum tailings.

[0009] The method for preparing the inorganic plate substrate comprises the following steps:

[0010] A. Mix the crystal minerals, calcium-silicon-aluminum tailings, inorganic mineral fibers and imported natural wood pulp fibers in proportion;

[0011] B. compacting the mixture into a predetermined shape and size;

[0012] C. Carry out autoclave reaction under high temperature and high pressure, the temperature of the autoclave reaction is 180-230°C, the pressure of the autoclave reaction is 3-6MPa, and the time of the autoclave reaction is 5-15h;

[0013] D. After subsequent processing such as cooling and cutting, the final inorganic board substrate is obtained.

[0014] Preferably, the waterproof bridging layer is composed of water-based paint, and the water-based paint is composed of at least one of amino resin, epoxy resin and polyurethane resin.

[0015] Preferably, the adhesive layer consists of hot melt adhesive.

[0016] Preferably, the hot melt adhesive is PUR hot melt adhesive.

[0017] Preferably, the impregnated paper facing layer is composed of formaldehyde-free impregnated decorative paper whose surface is coated with an electron beam curing coating.

[0018] Preferably, the electron beam cured coating of the non-formaldehyde impregnated decorative paper is made of plain base paper or printed decorative paper as the base material, after non-formaldehyde impregnation and coating, EB varnish is coated on the surface, and then cured by EB accelerator. The relevant parameters of the EB accelerator are: voltage 90-110KV, auxiliary radiation energy 40-100kGy, oxygen content ≤200ppm, energy 80-100%, speed 40-80m / min.

[0019] The method for preparing the formaldehyde-free impregnated decorative paper comprises the following steps:

[0020] A. Impregnate the plain base paper or printed decorative paper with one or more layers of formaldehyde-free glue, wherein the formaldehyde-free glue contains two or three of acrylic acid, polyurethane, polyester, etc., with a coating amount of 30-120 g / m2, and dry and collect into rolls;

[0021] B. Place the impregnated decorative paper on the EB equipment, apply EB varnish on the surface, and then cure it through EB.

[0022] Preferably, the UV varnish comprises the following raw materials in weight percentage: resin: 60%-80%; photoinitiator: 1%-5%; auxiliary agent: 1%-5%; diluent: 5%-10%; wherein the resin is at least two of epoxy resin, acrylic acid, polyester and polyurethane.

[0023] A method for preparing the composite inorganic board as described above comprises the following steps:

[0024] (1) sanding and dusting the inorganic board to obtain a pre-treated inorganic board as an inorganic board substrate layer;

[0025] (2) The inorganic board substrate layer is subjected to roller coating or flow coating process, and water-based paint is applied on the front side of the inorganic board substrate layer as a waterproof bridging layer. After drying, UV varnish is applied on the back side of the inorganic board substrate layer, and a closed back coating layer is formed by ultraviolet light curing; the parameters of ultraviolet light curing are: mercury lamp: 44kw, energy 90-100%, speed 10-20m / min.

[0026] (3) Coating hot melt adhesive on the waterproof bridging layer to obtain an adhesive layer, and then flatly pasting the impregnated decorative paper on the adhesive layer as an impregnated paper facing layer to obtain the composite inorganic board.

[0027] Preferably, the coating amount of the water-based paint is 50-100 g / m2.

[0028] Preferably, the coating amount of the UV varnish is 8-20 g / m2.

[0029] Preferably, the coating amount of the hot melt adhesive is 20-50 g / m2.

[0030] The beneficial effects of the present invention are:

[0031] (1) The composite inorganic board of the present invention has the characteristics of low density, convenient use, low transportation cost, etc., and has excellent adhesion performance between layers and high surface bonding strength.

[0032] (2) The composite inorganic board of the present invention uses electron beam formaldehyde-free impregnated paper for veneer, which has strong and rich decorative properties, is formaldehyde-free and environmentally friendly, and has the advantages of high wear resistance, good scratch resistance, high sun resistance, easy cleaning, antibacterial, and fire resistance.

[0033] (3) The composite inorganic board of the present invention is suitable for various indoor and outdoor decorations, such as homes, offices, hospitals, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1This is a schematic structural diagram of a composite inorganic board according to Example 1 of the present invention;

[0035] Figure 2 This is a schematic diagram of the structure of the composite inorganic board according to Example 2 of the present invention.

[0036] Reference numerals:

[0037] 100. Inorganic board substrate layer; 200. Waterproof bridging layer; 300. Adhesive layer; 400. Impregnated paper facing layer; 500. Closed back coating layer. DETAILED DESCRIPTION

[0038] The present invention will be further described below in conjunction with specific embodiments.

[0039] Embodiment 1:

[0040] A composite inorganic board, such as Figure 1 As shown, it includes an inorganic board substrate layer 100 , on the upper surface of which a waterproof bridging layer 200 , an adhesive layer 300 , and an impregnated paper facing layer 400 are sequentially arranged, and on the lower surface of which a closed back coating layer 500 is arranged.

[0041] A method for preparing the inorganic plate as described above comprises the following steps:

[0042] (1) The density is 0.8g / cm 3 The inorganic board substrate is sanded and dusted to obtain a pre-treated inorganic board as the inorganic board substrate layer 100;

[0043] The inorganic board substrate includes the following raw materials in weight percentage: crystal minerals: 55%; calcium tailings: 10%; silicon tailings: 10%; aluminum tailings: 10%; inorganic mineral fibers: 10%; imported natural wood pulp fibers: 5%;

[0044] The method for preparing an inorganic plate substrate comprises the following steps:

[0045] A. Mix crystal minerals, calcium tailings, silicon tailings, aluminum tailings, inorganic mineral fibers and imported natural wood pulp fibers in proportion;

[0046] B. compacting the mixture into a predetermined shape and size;

[0047] C. Carry out autoclave reaction under high temperature and high pressure, the temperature of the autoclave reaction is 200°C, the pressure of the autoclave reaction is 5MPa, and the time of the autoclave reaction is 10h;

[0048] D. After subsequent processing such as cooling and cutting, the final inorganic board substrate is obtained.

[0049] (2) The inorganic board substrate layer 100 is subjected to a flow coating process, and epoxy resin is coated on the front side of the inorganic board substrate layer 100 as a waterproof bridging layer 200, with a coating amount of 80 g / m2. After hot air drying, UV varnish is coated on the back side of the inorganic board substrate layer 100, with a coating amount of 15 g / m2, and a closed back coating layer 500 is formed by ultraviolet light curing, wherein the UV varnish comprises the following raw materials in weight percentage: 30% epoxy resin, 30% acrylic acid, and 20% polyester; 5% photoinitiator; 5% auxiliary agent; 10% diluent; wherein the brand of epoxy resin is L6130, the brand of acrylic acid is CN550, the brand of polyester is UA606, the brand of photoinitiator is BKY1173, and the brand of auxiliary agent is BYK333; the parameters of ultraviolet light curing are: mercury lamp: 44kw, energy 95%, speed 15m / min;

[0050] (3) coating the waterproof bridging layer 200 with PUR hot melt adhesive to obtain an adhesive layer 300, with a coating amount of 40 g / m2, and then flatly pasting the impregnated decorative paper on the adhesive layer as an impregnated paper facing layer 400, thereby obtaining a composite inorganic board;

[0051] Among them, the formaldehyde-free impregnated decorative paper is based on plain base paper, which is impregnated and coated with formaldehyde-free paper, and then coated with EB varnish on the surface, and then cured by EB accelerator. The specific steps include: A. Impregnating the plain base paper with three layers of formaldehyde-free glue, wherein the formaldehyde-free glue is a mixture of acrylic acid and polyurethane in a mass ratio of 1:1, with a coating amount of 50 g / m2, and then drying and collecting into rolls; B. Placing the impregnated decorative paper on the EB equipment, coating the surface with EB varnish, and then curing it with EB accelerator. The EB varnish is EB5210 produced by D&B Company, and the relevant parameters of the EB accelerator are: voltage 100KV, auxiliary radiation energy 80kGy, oxygen content 120ppm, energy 90%, speed 50m / min.

[0052] Embodiment 2:

[0053] A composite inorganic board, such as Figure 2 As shown, it includes an inorganic board substrate layer 100, on the upper surface of which a waterproof bridging layer 200, a waterproof bridging layer 200, an adhesive layer 300, and an impregnated paper facing layer 400 are sequentially arranged, and on the lower surface of the inorganic board substrate layer 100 a closed back coating layer 500 is arranged.

[0054] A method for preparing the inorganic plate as described above comprises the following steps:

[0055] (1) The density is 1.0g / cm 3 The inorganic board substrate is sanded and dusted to obtain a pre-treated inorganic board as the inorganic board substrate layer 100;

[0056] The inorganic board substrate includes the following raw materials in weight percentage: crystal minerals: 55%; calcium tailings: 10%; silicon tailings: 10%; aluminum tailings: 10%; inorganic mineral fibers: 10%; imported natural wood pulp fibers: 5%;

[0057] The method for preparing an inorganic plate substrate comprises the following steps:

[0058] A. Mix crystal minerals, calcium tailings, silicon tailings, aluminum tailings, inorganic mineral fibers and imported natural wood pulp fibers in proportion;

[0059] B. compacting the mixture into a predetermined shape and size;

[0060] C. Carry out autoclave reaction under high temperature and high pressure, the temperature of the autoclave reaction is 200°C, the pressure of the autoclave reaction is 5MPa, and the time of the autoclave reaction is 10h;

[0061] D. After subsequent processing such as cooling and cutting, the final inorganic board substrate is obtained.

[0062] (2) The inorganic board substrate layer 100 is subjected to a flow coating process, and epoxy resin is coated on the front side of the inorganic board substrate layer 100 as a waterproof bridging layer 200, with a coating amount of 50 g / m2. After hot air drying, an additional layer of epoxy resin is coated on the waterproof bridging layer 200 as a waterproof bridging layer 200, with a coating amount of 50 g / m2. After hot air drying, UV varnish is coated on the back side of the inorganic board substrate layer 100, with a coating amount of 20 g / m2, and a closed back coating layer 500 is formed by ultraviolet light curing, wherein the UV varnish comprises the following raw materials in weight percentage: 30% epoxy resin, 30% acrylic acid, and 20% polyester; 5% photoinitiator; 5% auxiliary agent; 10% diluent; wherein the brand of epoxy resin is L6130, the brand of acrylic acid is CN550, the brand of polyester is UA606, and the brand of photoinitiator is Irgacure 184, the brand of the additive is BYK1797; the parameters of UV curing are: mercury lamp: 44kw, energy 95%, speed 15m / min;

[0063] (3) coating the waterproof bridging layer 200 with PUR hot melt adhesive to obtain an adhesive layer 300, with a coating amount of 25 g / m2, and then flatly pasting the impregnated decorative paper on the adhesive layer as an impregnated paper facing layer 400, thereby obtaining a composite inorganic board;

[0064] The formaldehyde-free impregnated decorative paper is based on printed decorative paper, which is impregnated and coated with formaldehyde-free paper, and then coated with EB varnish on the surface, and then cured by EB accelerator. The following steps are specifically included: A. The printed decorative paper is impregnated with three layers of formaldehyde-free glue, wherein the formaldehyde-free glue is a mixture of acrylic acid and polyurethane in a mass ratio of 1:1, with a coating amount of 50 g / m2, and then dried and rolled; B. The impregnated decorative paper is placed on the EB equipment, EB varnish is coated on the surface, and then cured by EB accelerator. The EB varnish is EB5210 produced by D&B Company, and the relevant parameters of the EB accelerator are: voltage 100KV, auxiliary radiation energy 80kGy, oxygen content 120ppm, energy 90%, speed 50m / min.

[0065] Test example:

[0066] The composite inorganic boards of Examples 1 and 2 were tested for board performance, and the test results are shown in Table 1:

[0067] Table 1. Performance test results

[0068]

[0069]

[0070] It can be seen from Table 1 that the composite inorganic board of the present invention can be torn 33 times without falling off in the adhesion test; the surface bonding strength can reach 1.42MPa; the abrasion value in the surface wear resistance test is less than 45mg / 100r, the pattern is retained more than 65% and there is no bottom exposure; the surface pollution and corrosion resistance can reach level 5; the surface water vapor resistance can reach level 5; the surface cracking resistance can reach level 5; the surface dry heat resistance can reach level 5; the scratch resistance can reach 3H; and the flame retardant performance reaches level A.

[0071] The above embodiments are preferred implementation modes of the present invention, but the implementation modes of the present invention are not limited to the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention should be equivalent replacement methods and are included in the protection scope of the present invention.

Claims

1. A composite inorganic board, characterized in that: The invention comprises an inorganic board substrate layer, on one surface of which a waterproof bridging layer, an adhesive layer and an impregnated paper facing layer are sequentially arranged, and on the other surface of which a closed back coating layer is arranged.

2. A composite inorganic board according to claim 1, characterized in that: The inorganic substrate layer is composed of an inorganic substrate, and the density of the inorganic substrate is 0.8-1.0 g / cm 3 .

3. A composite inorganic board according to claim 1, characterized in that: The waterproof bridging layer is composed of water-based paint, and the water-based paint is composed of at least one of amino resin, epoxy resin and polyurethane resin.

4. The composite inorganic board according to claim 1, characterized in that: The adhesive layer is composed of hot melt adhesive.

5. A composite inorganic board according to claim 4, characterized in that: The hot melt adhesive is PUR hot melt adhesive.

6. The composite inorganic board according to claim 1, characterized in that: The impregnated paper facing layer is composed of formaldehyde-free impregnated decorative paper with an electron beam cured coating on the surface.

7. A composite inorganic board according to claim 6, characterized in that: The electron beam cured coating formaldehyde-free impregnated decorative paper is based on plain base paper or printed decorative paper, which is impregnated and coated with formaldehyde-free paper, and then coated with EB varnish on the surface, and then cured by EB accelerator irradiation.

8. The composite inorganic board according to claim 1, characterized in that: The closed back coating layer is composed of UV varnish, and the UV varnish includes the following raw materials in weight percentage: resin: 60%-80%; Photoinitiator: 1%-5%; Additives: 1%-5%; Diluent: 5%-10%; wherein the resin is at least two of epoxy resin, acrylic acid, polyester and polyurethane.

9. A method for preparing a composite inorganic board according to any one of claims 1 to 8, characterized in that: The following steps are involved: (1) sanding and dusting the inorganic board to obtain a pre-treated inorganic board as an inorganic board substrate layer; (2) coating the inorganic board substrate layer with water-based paint as a waterproof bridging layer on the front side of the inorganic board substrate layer by roller coating or flow coating, and after drying, coating the back side of the inorganic board substrate layer with UV varnish, and curing with ultraviolet light to form a closed back coating layer; (3) Coating hot melt adhesive on the waterproof bridging layer to obtain an adhesive layer, and then flatly pasting the impregnated decorative paper on the adhesive layer as an impregnated paper facing layer to obtain the composite inorganic board.

10. The method for preparing a composite inorganic board according to claim 9, characterized in that: In step (2), the coating amount of the water-based paint is 50-100 g / m2.

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