Resin composition and circuit board and display device comprising same

Abstract

The invention provides a resin composition and a circuit board and a display device containing the same. The resin composition comprises the following components in parts by mass: 15-85 parts of epoxy resin, 1-50 parts of a curing agent, 15-85 parts of modified rubber and 0.1-10 parts of a coloring agent. Through design and mutual compounding of the components, the formed resin layer has colors and can play a color adjusting function; and meanwhile, the resin layer can form high-strength stable bonding with the copper foil / circuit layer, and the anti-stripping performance is good. A resin layer formed by the resin composition is used in a circuit board, so that the circuit board has uniform color, and chromatic aberration is reduced or avoided, so that a display device comprising the circuit board can present clearer and more accurate color, and the display effect is improved; meanwhile, the resin layer can improve the peeling strength of the copper foil of the circuit board, so that the adhesive force of the lamp bead bonding pad is increased, the falling probability of the lamp bead bonding pad is remarkably reduced, and the display yield is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of circuit boards, and in particular relates to a resin composition and a circuit board and a display device containing the same. Background Art

[0002] With the rapid development of light emitting diode (LED) display technology, the pixel pitch and display effect of LED display screens have been rapidly improved. With the advent of the 5G era, as an interactive important information display window, LED display screens will be further widely used with their advantages of seamless splicing and large-screen display. Circuit boards are an indispensable part of LED display screens. Circuit boards make circuits miniaturized and intuitive, and play an important role in the mass production and optimized layout of fixed circuits.

[0003] The current display screen mainly consists of a circuit board and the lamp beads installed on it. The lamp beads show different colors when they are lit, and the color between the lamp beads is the color of the circuit board. If the color of different positions is not uniform, it will cause a large color difference in the overall display of the display screen. Since the colors of circuit board substrates from different manufacturers are significantly different, and the same color inks from different manufacturers are also different, the problem of circuit board color difference has always existed in the application field of display screens, resulting in a significant decline in the display effect of the display screen.

[0004] CN110225651A discloses a circuit board, which includes a substrate and a circuit layer arranged on the substrate, wherein an optical barrier layer is arranged on the side of the substrate facing the circuit layer, the raw material of the optical barrier layer includes white colorant, and an ink layer is arranged on the side of the optical barrier layer away from the circuit layer; when the above circuit board is used to make a display screen, lamp beads are arranged on the circuit layer, and when the lamp beads are extinguished, the optical barrier layer can reflect white light, thereby avoiding reflecting the color of the substrate on the circuit board, maintaining the color consistency of the ink layer, and ensuring the color consistency of the display screen after the lamp beads are extinguished. Although the circuit board solves the problem of color difference of the display screen after the lamp beads are extinguished, the overall display screen still has color difference after the lamp beads are lit, and the problem of color difference of the circuit board caused by different substrates and different inks is not fundamentally solved.

[0005] In recent years, with the density of display screen circuits, the pads of lamp beads on the display screen have become smaller and smaller, and the adhesion between the lamp beads and the pads and the substrate has become smaller and smaller, so that the lamp beads are easily peeled off with the pads. Therefore, it is an urgent problem to be solved in this field to develop a circuit board with low color difference and high peeling strength to improve the display effect of the display screen containing it and increase the adhesion of the lamp bead pads. Summary of the invention

[0006] In view of the deficiencies in the prior art, the object of the present invention is to provide a resin composition and a circuit board and a display device containing the same. Through the design and mutual compounding of the components, the resin composition has excellent bonding performance and high peel strength, and can play a color adjustment function. The resin layer formed by the resin composition is used between the circuit layer and the substrate of the circuit board, which can make the circuit board have a uniform color, reduce or avoid color difference, and enable the display device containing the resin composition to present clearer and more accurate colors, improve the display effect, and at the same time improve the copper foil peeling strength of the circuit board, thereby increasing the adhesion of the lamp bead pad, reducing the probability of the lamp bead pad falling off, and improving the display yield.

[0007] In order to achieve the purpose of the invention, the present invention adopts the following technical solutions:

[0008] In a first aspect, the present invention provides a resin composition, wherein the resin composition comprises the following components in parts by mass:

[0009]

[0010] The resin composition provided by the present invention contains a specific amount of colorant, so that the resin layer formed by it has color and can play a color adjustment function; at the same time, through the design and mutual compounding of epoxy resin, curing agent and modified rubber, the resin layer has excellent bonding performance and high peeling strength, can form a high-strength stable bond with the copper foil / circuit layer, and has good anti-peeling performance. The resin layer formed by the resin composition is used in a circuit board, which can make the circuit board have a uniform color, reduce or avoid color difference, so that the display device containing it can present clearer and more accurate colors, and improve the display effect; at the same time, the resin layer can improve the copper foil peeling strength of the circuit board, thereby increasing the adhesion of the lamp bead pad, significantly reducing the probability of the lamp bead pad falling off, and improving the display yield.

[0011] The following are preferred technical solutions of the present invention, but are not intended to limit the technical solutions provided by the present invention. Through the following preferred technical solutions, the objectives and beneficial effects of the present invention can be better achieved and realized.

[0012] In the resin composition provided by the present invention, the mass parts of the epoxy resin are 15-85 parts, for example, it can be 18 parts, 20 parts, 25 parts, 30 parts, 35 parts, 40 parts, 45 parts, 50 parts, 55 parts, 60 parts, 65 parts, 70 parts, 75 parts or 80 parts, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0013] The mass proportion of the curing agent is 1-50 parts, for example, it can be 1 part, 2 parts, 5 parts, 8 parts, 10 parts, 12 parts, 15 parts, 18 parts, 20 parts, 22 parts, 25 parts, 28 parts, 30 parts, 32 parts, 35 parts, 38 parts, 40 parts, 42 parts, 45 parts or 48 parts, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0014] The mass parts of the modified rubber are 15-85 parts, for example, 18 parts, 20 parts, 25 parts, 30 parts, 35 parts, 40 parts, 45 parts, 50 parts, 55 parts, 60 parts, 65 parts, 70 parts, 75 parts or 80 parts, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0015] The mass fraction of the colorant is 0.1-10 parts, for example, it can be 0.5 parts, 0.8 parts, 1 parts, 1.5 parts, 2 parts, 2.5 parts, 3 parts, 3.5 parts, 4 parts, 4.5 parts, 5 parts, 5.5 parts, 6 parts, 6.5 parts, 7 parts, 7.5 parts, 8 parts, 8.5 parts, 9 parts or 9.5 parts, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0016] The “parts” and “parts by mass” involved in the present invention are all calculated based on the solid content and do not include solvents, dispersants, etc.

[0017] Preferably, the epoxy resin includes any one or a combination of at least two of bisphenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin, isocyanate-modified epoxy resin, and phosphorus-containing epoxy resin, and further preferably any one or a combination of at least two of bisphenol A epoxy resin, novolac epoxy resin, and isocyanate-modified epoxy resin.

[0018] Preferably, the novolac epoxy resin includes any one of o-cresol novolac epoxy resin, bisphenol A novolac epoxy resin, and phenol-type novolac epoxy resin, or a combination of at least two of them, and o-cresol novolac epoxy resin is more preferred.

[0019] Preferably, the isocyanate-modified epoxy resin includes MDI (diphenylmethane diisocyanate)-modified epoxy resin.

[0020] Preferably, the epoxy equivalent of the epoxy resin is 176-3000 g / eq, for example, it can be 180 g / eq, 200 g / eq, 300 g / eq, 400 g / eq, 500 g / eq, 600 g / eq, 800 g / eq, 1000 g / eq, 1200 g / eq, 1500 g / eq, 1800 g / eq, 2000 g / eq, 2200 g / eq, 2500 g / eq or 2800 g / eq, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0021] Preferably, the epoxy equivalent of the bisphenol A epoxy resin is 176-2000 g / eq, for example, it can be 180 g / eq, 200 g / eq, 300 g / eq, 400 g / eq, 500 g / eq, 600 g / eq, 800 g / eq, 1000 g / eq, 12000 g / eq, 14000 g / eq, 15000 g / eq, 16000 g / eq, 18000 g / eq or 19000 g / eq, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0022] Preferably, the epoxy equivalent of the phenolic epoxy resin is 200-500 g / eq, for example, it can be 220 g / eq, 250 g / eq, 280 g / eq, 300 g / eq, 320 g / eq, 350 g / eq, 380 g / eq, 400 g / eq, 420 g / eq, 450 g / eq or 480 g / eq, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0023] Preferably, the epoxy equivalent of the isocyanate modified epoxy resin is 200-500 g / eq, for example, it can be 220 g / eq, 250 g / eq, 280 g / eq, 300 g / eq, 320 g / eq, 350 g / eq, 380 g / eq, 400 g / eq, 420 g / eq, 450 g / eq or 480 g / eq, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0024] Preferably, the mass percentage of the epoxy resin in the resin composition is 10-80%, for example, it can be 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70% or 75%, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0025] Preferably, the curing agent includes any one of an amine curing agent, an acid anhydride curing agent, a phenol curing agent, and an imidazole curing agent, or a combination of at least two thereof, and more preferably any one of an amine curing agent, an acid anhydride curing agent, and an imidazole curing agent, or a combination of at least two thereof.

[0026] Preferably, the amine curing agent includes any one of dicyandiamide, 4,4'-diaminodiphenyl sulfone, and 4,4'-diaminodiphenylmethane, or a combination of at least two thereof.

[0027] Preferably, the acid anhydride curing agent includes any one of methyl hexahydrophthalic anhydride, hexahydrophthalic anhydride, and maleic anhydride curing agents, or a combination of at least two of them.

[0028] Preferably, the phenolic curing agent comprises a phenolic resin, such as any one or a combination of at least two of linear phenolic resin, o-cresol phenolic resin, biphenyl phenolic resin, phenol phenolic resin, trisphenol phenolic resin, and dicyclopentadiene phenolic resin.

[0029] Preferably, the imidazole curing agent includes any one of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, and 2-phenyl-4-methylimidazole, or a combination of at least two thereof.

[0030] Preferably, based on the mass of the epoxy resin as 100%, the mass of the curing agent is 0.01-150%, for example, it can be 0.05%, 0.1%, 0.5%, 0.8%, 1%, 2%, 5%, 8%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 60%, 70%, 80%, 90%, 100%, 110%, 120%, 130% or 140%, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0031] Preferably, the modified rubber includes reactive functional group modified rubber, and the reactive functional group includes any one of carboxyl, amino, and epoxy groups, or a combination of at least two of them.

[0032] Preferably, the base rubber in the modified rubber includes any one or a combination of at least two of styrene-butadiene rubber, nitrile rubber, butyl rubber, ethylene-propylene rubber, silicone rubber, fluororubber, and polysulfide rubber, and further preferably any one or a combination of at least two of nitrile rubber, silicone rubber, and styrene-butadiene rubber.

[0033] Preferably, the reactive functional group modified rubber includes any one or a combination of at least two of reactive functional group modified styrene-butadiene rubber, reactive functional group modified nitrile rubber, reactive functional group modified butyl rubber, reactive functional group modified ethylene-propylene rubber, reactive functional group modified silicone rubber, reactive functional group modified fluororubber, and reactive functional group modified polysulfide rubber; the reactive functional groups each independently include any one or a combination of at least two of carboxyl, amino, and epoxy groups.

[0034] Preferably, the weight average molecular weight of the modified rubber is 10000-1000000, for example, it can be 20000, 50000, 80000, 100000, 150000, 200000, 250000, 300000, 350000, 400000, 450000, 500000, 550000, 600000, 650000, 700000, 750000, 800000, 850000, 900000 or 950000, as well as specific values ​​between the above points. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively enumerates the specific points included in the range, and 50000-1000000 is further preferred.

[0035] Preferably, the mass percentage of the modified rubber in the resin composition is 10-70%, for example, it can be 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60% or 65%, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0036] Preferably, the colorant includes any one of white colorant, black colorant, green colorant, blue colorant, and red colorant, or a combination of at least two of them, and white colorant or black colorant is more preferred.

[0037] Further preferably, the colorant includes any one of carbon black, black soluble pigment, red pigment, blue pigment, green pigment, titanium dioxide, barium sulfate, and antimony oxide, or a combination of at least two thereof.

[0038] For example, the colorant may be added to the resin composition in the form of powder or color paste, such as carbon black paste.

[0039] The average particle size of the colorant (D 50 ) is not particularly limited; from the perspective of dispersion and performance, the average particle size (D 50 ) is preferably 0.001-20μm, for example, it can be 0.001μm, 0.005μm, 0.01μm, 0.05μm, 0.1μm, 0.2μm, 0.5μm, 1μm, 3μm, 5μm, 8μm, 10μm, 12μm, 15μm or 18μm, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the said range, and 0.01-10μm is further preferred.

[0040] Preferably, the mass percentage of the colorant in the resin composition is 0.1-10%, for example, it can be 0.2%, 0.5%, 0.8%, 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, 5%, 5.5%, 6%, 6.5%, 7%, 7.5%, 8%, 8.5%, 9% or 9.5%, and specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively enumerates the specific point values ​​included in the range, and 0.1-5% is further preferred.

[0041] Preferably, the resin composition further comprises polyimide resin and / or phenoloxy resin.

[0042] Preferably, the resin composition further comprises other additives that a person skilled in the art is motivated to add, such as any one or a combination of at least two of an antioxidant, a viscosity modifier, a flame retardant, a coupling agent, etc.

[0043] Preferably, the method for preparing the resin composition comprises: uniformly mixing the components of the resin composition to obtain the resin composition.

[0044] An optional solvent may also be added to the resin composition. On the other hand, the present invention provides a resin adhesive, which comprises the resin composition as described in the first aspect and a solvent, wherein the resin composition is dispersed and / or dissolved in the solvent.

[0045] The amount of solvent added is selected by those skilled in the art based on experience and process requirements to make the resin glue reach a suitable viscosity for use, so as to facilitate the impregnation and coating of the resin glue. The solvent will partially or completely evaporate in the subsequent drying, semi-curing or complete curing stages.

[0046] The solvent of the present invention is not particularly limited. Generally, ketones such as acetone, butanone, and cyclohexanone, aromatic hydrocarbons such as toluene and xylene, esters such as ethyl acetate and butyl acetate, alcohols such as methanol, ethanol or butanol, alcohol ethers such as ethyl cellosolve, butyl cellosolve, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, carbitol or butyl carbitol, and nitrogen-containing solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone can be selected; the solvent can be used alone or in combination of two or more. Preferably, any one of acetone, butanone, N,N-dimethylformamide, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, cyclohexanone, ethanol, and methanol or a combination of at least two of them is used.

[0047] Preferably, the mass percentage of the solvent in the resin glue is 20%-80%, for example, it can be 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 62%, 65%, 68%, 70%, 72%, 75% or 78%, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0048] Preferably, the method for preparing the resin adhesive comprises: mixing the components in the resin composition with a solvent, and dispersing them uniformly to obtain the resin adhesive.

[0049] In a second aspect, the present invention provides a resin film, wherein the material of the resin film includes the resin composition as described in the first aspect.

[0050] Preferably, the resin adhesive film is obtained by coating the resin composition on a carrier and then drying and / or semi-curing the resin composition.

[0051] Specifically, the method for preparing the resin adhesive film comprises: coating the resin adhesive liquid of the resin composition on a carrier, and drying to obtain the resin adhesive film.

[0052] In a third aspect, the present invention provides a resin-coated copper foil, wherein the resin-coated copper foil comprises a copper foil layer and a resin layer, wherein the material of the resin layer comprises the resin composition as described in the first aspect.

[0053] Specifically, the method for preparing the resin-coated copper foil comprises: coating the resin adhesive of the resin composition on the copper foil, and drying to obtain the resin-coated copper foil.

[0054] Preferably, the resin glue is applied to the matte surface of the copper foil.

[0055] Preferably, the drying temperature is 80-200°C, for example, it can be 85°C, 90°C, 95°C, 100°C, 105°C, 110°C, 115°C, 120°C, 130°C, 140°C, 150°C, 160°C, 170°C, 180°C or 200°C, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0056] Preferably, the drying time is 1-20 min, for example, it can be 2 min, 3 min, 4 min, 5 min, 6 min, 7 min, 8 min, 9 min, 10 min, 11 min, 12 min, 13 min, 14 min, 15 min, 16 min, 17 min, 18 min, 19 min or 20 min, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0057] In a fourth aspect, the present invention provides a copper clad laminate, comprising a substrate and a first copper foil and a second copper foil arranged on both sides of the substrate, a first resin layer is provided between the substrate and the first copper foil; the material of the first resin layer comprises the resin composition described in the first aspect.

[0058] Preferably, the substrate includes at least one prepreg, for example, the number of prepregs in the substrate can be 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 12, 14, 15, 16, 18, 20, 22, 24, 26, 28, 30 or more, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0059] Preferably, a second resin layer is provided between the substrate and the second copper foil.

[0060] Preferably, the material of the second resin layer includes the resin composition described in the first aspect.

[0061] Preferably, the structural schematic diagram of the copper clad laminate is as follows Figure 1 As shown, it includes a substrate 400 and a first copper foil 501 and a second copper foil 502 arranged on both sides of the substrate 400, a first resin layer 201 is arranged between the substrate 400 and the first copper foil 501, and a second resin layer 202 is arranged between the substrate 400 and the second copper foil 502; the material of the first resin layer 201 includes the resin composition described in the first aspect.

[0062] In a fifth aspect, the present invention provides a circuit board, comprising a substrate and a first circuit layer and a second circuit layer arranged on both sides of the substrate; a first ink layer is provided on the side of the first circuit layer facing away from the substrate, and a second ink layer is provided on the side of the second circuit layer facing away from the substrate; a first resin layer is provided between the first circuit layer and the substrate, and the material of the first resin layer includes the resin composition described in the first aspect.

[0063] In the circuit board provided by the present invention, a first resin layer is arranged between the first circuit layer and the substrate, which is formed by the resin composition provided by the first aspect, so that the area of ​​the circuit board not covered by the circuit presents the uniform color of the first resin layer; the first resin layer and the first ink layer have the same or different color system, and the color of the first ink layer and the color of the first resin layer are superimposed or reflected on each other, so that the circuit board has a uniform color, especially avoiding or reducing the color difference of the circuit board except the light source (lamp bead). The display device including the circuit board can present clearer, more accurate and full colors, so as to have a significantly improved display effect, and solves the problem of uneven ink color caused by large color differences of circuit board substrates, ink layer thickness differences, ink batch differences, light reflection and other reasons in the field of LED display screens. At the same time, the first resin layer has a high peeling strength with the circuit layer, has excellent anti-peeling performance, improves the copper foil peeling strength of the circuit board, can increase the adhesion of the light source (lamp bead) pad, solves the problem of low peeling strength of the lamp bead pad, and the circuit board of the present invention is used for display devices, which can significantly reduce the probability of light source (lamp bead) pad falling off, and improve display effect and display yield.

[0064] In a preferred technical solution, the structural diagram of the circuit board is as follows: Figure 2 As shown, it includes a substrate 400, a first circuit layer 301 and a second circuit layer 302; the first circuit layer 301 and the second circuit layer 302 are respectively arranged on both sides of the substrate 400; a first ink layer 101 is provided on the side of the first circuit layer 301 away from the substrate 400, and a second ink layer 102 is provided on the side of the second circuit layer 302 away from the substrate 400; a first resin layer 201 is provided between the first circuit layer 301 and the substrate 400, and the material of the first resin layer 201 includes the resin composition as described in the first aspect, which has the same color or a different color as the first ink layer 101.

[0065] Preferably, the thickness of the first resin layer is 5-200 μm, for example, it can be 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 120 μm, 140 μm, 150 μm, 160 μm or 180 μm, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0066] Preferably, a second resin layer is provided between the second circuit layer and the substrate.

[0067] In another preferred technical solution, the structural diagram of the circuit board is as follows Figure 3 As shown, it includes a substrate 400, a first circuit layer 301 and a second circuit layer 302; the first circuit layer 301 and the second circuit layer 302 are respectively arranged on both sides of the substrate 400; a first ink layer 101 is arranged on the side of the first circuit layer 301 away from the substrate 400, and a second ink layer 102 is arranged on the side of the second circuit layer 302 away from the substrate 400; a first resin layer 201 is arranged between the first circuit layer 301 and the substrate 400, and the material of the first resin layer 201 includes the resin composition as described in the first aspect, which has the same color or a different color as the first ink layer 101; a second resin layer 202 is arranged between the second circuit layer 302 and the substrate 400.

[0068] Preferably, the material of the second resin layer includes the resin composition provided in the first aspect.

[0069] As a preferred technical solution of the present invention, a second resin layer is arranged between the second circuit layer and the substrate, and the second resin layer has the same or different color scheme as the second ink layer, so that the colors of the two surfaces of the circuit board are more uniform after superposition or reflection, reducing color difference, and the circuit board has a symmetrical structure, which can reduce warping and has better dimensional stability and reliability.

[0070] Preferably, the thickness of the second resin layer is 5-200 μm, for example, it can be 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 120 μm, 140 μm, 150 μm, 160 μm or 180 μm, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0071] Preferably, the substrate includes at least one prepreg, for example, the number of prepregs in the substrate can be 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 12, 14, 15, 16, 18, 20, 22, 24, 26, 28, 30 or more, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0072] Preferably, the prepreg comprises a glass fiber cloth prepreg, a glass fiber paper prepreg or a wood pulp paper prepreg.

[0073] Preferably, the substrate comprises at least 2 prepregs, and a plurality of (≥2) prepregs are sequentially stacked and laminated to form the substrate; the plurality of (≥2) prepregs are the same or different, and each is independently a glass fiber cloth prepreg, a glass fiber paper prepreg or a wood pulp paper prepreg.

[0074] In the present invention, the substrate is insulated, that is, the substrate is an insulating substrate, used to carry the first circuit layer and the second circuit layer; the prepreg forming the substrate can be any one of a glass fiber cloth prepreg (FR-4), a glass fiber paper prepreg used for sandwich (CEM-3), and a wood pulp paper prepreg used for sandwich (CEM-1).

[0075] Preferably, the thickness of the first ink layer is 10-50 μm, for example, it can be 12 μm, 14 μm, 15 μm, 16 μm, 18 μm, 20 μm, 22 μm, 24 μm, 25 μm, 28 μm, 30 μm, 32 μm, 34 μm, 35 μm, 38 μm, 40 μm, 42 μm, 45 μm or 48 μm, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0076] Preferably, the thickness of the second ink layer is 10-50 μm, for example, it can be 12 μm, 14 μm, 15 μm, 16 μm, 18 μm, 20 μm, 22 μm, 24 μm, 25 μm, 28 μm, 30 μm, 32 μm, 34 μm, 35 μm, 38 μm, 40 μm, 42 μm, 45 μm or 48 μm, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the said range.

[0077] Preferably, the color of the first ink layer may be white, black, green, blue or red, and any other feasible color may be used as required, with white or black being more preferred.

[0078] Preferably, the color of the second ink layer may be white, black, green, blue or red, and any other feasible color may be used as required, with white or black being more preferred.

[0079] Preferably, the first ink layer and the second ink layer each independently include a photocurable ink layer or a thermal curable ink layer.

[0080] Preferably, the first circuit layer and the second circuit layer are metal circuit layers, and more preferably copper circuit layers.

[0081] As a preferred technical solution, the method for preparing the circuit board comprises the following steps:

[0082] A copper-clad laminate is provided, the copper-clad laminate comprising a substrate and a first copper foil and a second copper foil arranged on both sides of the substrate, a first resin layer is arranged between the substrate and the first copper foil, and a second resin layer is arranged between the substrate and the second copper foil (its structure is as follows Figure 1 shown);

[0083] Processing the first copper foil to form a first circuit layer, and processing the second copper foil to form a second circuit layer;

[0084] A first ink layer and a second ink layer are formed respectively to obtain the circuit board.

[0085] In the circuit board for the display device, the first copper foil and the second copper foil are processed to form the first circuit layer and the second circuit layer, and the first resin layer and the second resin layer at other positions of the substrate are exposed, and the color of the resin layer covers the color of the substrate, and after being superimposed or reflected with the color of the ink layer, the color difference problem caused by the substrate is reduced, thereby reducing the color difference of the display screen; the first ink layer and the second ink layer are coated on the resin layer and the circuit layer, and the first resin layer and the first ink layer have the same or different color systems, and can further perform color matching and color superposition or reflection, thereby improving the color uniformity of the circuit board, further reducing the color difference of the display screen, and improving the display effect; at the same time, the first resin layer, the second resin layer and the copper foil have strong bonding strength, and the copper foil has high peeling strength, thereby improving the adhesion of the light source (lamp bead) pad, reducing the probability of the light source (lamp bead) pad falling off, and improving the display yield.

[0086] Preferably, the first resin layer is disposed on the rough surface of the first copper foil by a coating method to obtain a first resin-coated copper foil, and the second resin layer is disposed on the rough surface of the second copper foil by a coating method to obtain a second resin-coated copper foil; the first resin-coated copper foil and the second resin-coated copper foil are respectively overlapped on both sides of the substrate, laminated, and a copper clad laminate is obtained.

[0087] Preferably, the lamination temperature is 120-280°C, for example 130°C, 140°C, 150°C, 160°C, 170°C, 180°C, 190°C, 200°C, 210°C, 220°C, 230°C, 240°C, 250°C, 260°C or 270°C, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range, and 160-220°C is further preferred.

[0088] Preferably, the lamination pressure is 10-60 kg / cm 2 , for example, it can be 15kg / cm 2 , 20kg / cm 2 , 25kg / cm 2 、30kg / cm 2 、35kg / cm 2 , 40kg / cm 2 , 45kg / cm 2 , 50kg / cm 2 or 55kg / cm 2 , as well as specific point values ​​between the above point values, due to space limitations and for the sake of brevity, the present invention no longer exhaustively lists the specific point values ​​included in the range.

[0089] Preferably, the lamination time is 30-300 min, for example, 40 min, 60 min, 80 min, 100 min, 120 min, 150 min, 180 min, 200 min, 220 min, 240 min, 260 min or 280 min, as well as specific point values ​​between the above point values. Due to space limitations and for the sake of simplicity, the present invention no longer exhaustively lists the specific point values ​​included in the range, and 30-180 min is further preferred.

[0090] Preferably, the first circuit layer and the second circuit layer can be manufactured by laminating, exposing, developing, etching and stripping the corresponding first copper foil and the second copper foil.

[0091] In a fifth aspect, the present invention provides a display device, comprising a light source and the circuit board as described in the fourth aspect.

[0092] Preferably, the light source is a lamp bead, the lamp bead is arranged on the first circuit layer of the circuit board, and the lamp bead is connected to the first circuit layer.

[0093] Preferably, the display device further comprises a driving component, wherein the driving component is disposed on the second circuit layer of the circuit board, and the driving component is connected to the second circuit layer.

[0094] In a preferred technical solution, the structural schematic diagram of the display device is as follows Figure 4 As shown, the lamp bead 600 is arranged on the first circuit layer 301, and the lamp bead 600 is connected to the first circuit layer 301; the driving component 700 is arranged on the second circuit layer 302, and the driving component 700 is connected to the second circuit layer 302; the driving component 700 is connected to the lamp bead 600 through the circuit, and the driving component 700 is used to drive the lamp bead 600 to realize light emission.

[0095] In another preferred technical solution, the structural schematic diagram of the display device is as follows Figure 5 As shown, the lamp bead 600 is arranged on the first circuit layer 301, and the lamp bead 600 is connected to the first circuit layer 301; the driving component 700 is arranged on the second circuit layer 302, and the driving component 700 is connected to the second circuit layer 302; the driving component 700 is connected to the lamp bead 600 through the circuit, and the driving component 700 is used to drive the lamp bead 600 to realize light emission.

[0096] Preferably, the substrate is provided with a via hole, and a copper hole is provided on the side wall of the via hole. The circuit layer is connected to the driving component through the copper hole, thereby realizing the connection between the driving component and the lamp bead, and driving the lamp bead to emit light.

[0097] In the display device provided by the present invention, during the process of the lamp bead emitting light, the first resin layer covers the color difference of the substrate and performs corresponding color superposition or reflection with the first ink layer, thereby reducing the color difference problem caused by the substrate and the ink, thereby maintaining the color consistency of the circuit board, thereby ensuring the color consistency of the display device during the process of the lamp bead emitting light, and achieving excellent display effects. At the same time, the first resin layer has good bonding performance with the copper foil, and the copper foil has high peeling strength, thereby improving the adhesion of the lamp bead pad, significantly reducing the probability of the lamp bead pad falling off, and improving the display yield.

[0098] Compared with the prior art, the present invention has the following beneficial effects:

[0099] (1) In the resin composition provided by the present invention, the resin layer formed by the resin composition has color through the design and mutual compounding of the components, and can play a color adjustment function; at the same time, the resin layer has excellent bonding performance and high peeling strength, can form a high-strength stable bond with the copper foil / circuit layer, has good anti-peeling performance, and has excellent toughness and heat resistance. The resin layer formed by the resin composition is used in a circuit board, which can make the circuit board have a uniform color, reduce or avoid color difference, and enable the display device containing it to present clearer and more accurate colors, thereby improving the display effect; at the same time, the resin layer can improve the copper foil peeling strength of the circuit board, thereby increasing the adhesion of the lamp bead pad, and significantly reducing the probability of the lamp bead pad falling off.

[0100] (2) In the circuit board provided by the present invention, a first resin layer is arranged between the first circuit layer and the substrate, so that the area of ​​the circuit board not covered by the circuit presents the uniform color of the first resin layer; the first resin layer and the first ink layer have the same or different color system, and after the colors of the two are superimposed or reflected on each other, the circuit board has a uniform color, especially avoiding or reducing the color difference of the area of ​​the circuit board other than the light source (lamp bead). The display device including the circuit board can present clearer, more accurate and fuller colors, thereby having a significantly improved display effect; at the same time, the first resin layer has a high peeling strength with the circuit layer, has excellent anti-peeling performance, improves the copper foil peeling strength of the circuit board, can increase the adhesion of the light source (lamp bead) pad, significantly reduces the probability of the light source (lamp bead) pad falling off, and improves the display yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0101] Figure 1 A schematic diagram of the structure of a copper clad laminate provided by a technical solution of the present invention;

[0102] Figure 2 A schematic diagram of the structure of a circuit board provided by a technical solution of the present invention;

[0103] Figure 3 A schematic diagram of the structure of a circuit board provided by another technical solution of the present invention;

[0104] Figure 4 A schematic diagram of the structure of a display device provided by a technical solution of the present invention;

[0105] Figure 5 A schematic structural diagram of a display device provided by another technical solution of the present invention;

[0106] Among them, 101-first ink layer, 102-second ink layer, 201-first resin layer, 202-second resin layer, 301-first circuit layer, 302-second circuit layer, 400-substrate, 501-first copper foil, 502-second copper foil, 600-lamp beads, 700-driving components. DETAILED DESCRIPTION

[0107] The technical solution of the present invention is further described below by specific implementation methods. It should be understood by those skilled in the art that the embodiments are only used to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0108] In the present invention, the features defined as "first" or "second" may include one or more of the features explicitly or implicitly, and are used to distinguish and describe the features, without distinction of order or importance. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0109] In the present invention, the directions or positional relationships indicated by terms such as "upper", "lower", "inside", "outside", "vertical", and "horizontal" are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the devices or elements referred to must have a specific direction, be constructed and operated in a specific direction, and should not be understood as limiting the present invention.

[0110] In the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", "installed", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above-mentioned terms in the present invention can be understood according to specific circumstances.

[0111] In the following specific implementation of the present invention, the materials involved are as follows:

[0112]

[0113] Examples 1-10, Comparative Examples 1-4

[0114] A resin composition, the types and amounts of the components are shown in Table 1 and Table 2, and the units of the amounts of the components are all "parts".

[0115] A resin-coated copper foil and a copper-clad laminate comprising the resin composition, the preparation method of which is as follows:

[0116] (1) mixing the resin composition with a solvent (a mixed solvent of N,N-dimethylformamide DMF and butanone in a mass ratio of 2:1) according to the formula amount, stirring and dispersing them uniformly, and preparing a resin adhesive with a solid content of 68%; applying the resin adhesive on the rough surface of the copper foil (HOZ), drying at 100° C. for 5 minutes, forming a 30 μm resin layer, and obtaining a resin-coated copper foil;

[0117] (2) 8 sheets of Shengyi Technology S1000H 7628RC45% prepreg were stacked, and the resin-coated copper foil obtained in step (1) was covered on both sides of the outer side of the stack. 2 Hot pressing for 60 minutes to make a copper clad laminate.

[0118] The copper clad laminate is subjected to a performance test, and the specific method is as follows:

[0119] (1) Peel strength: Refer to the method test in IPC-TM-650 2.4.8C-1994 Peel Strength of Metallic CladLaminates;

[0120] (2) Chromaticity value (L value): Tested using a colorimeter;

[0121] (3) Toughness and bendability: Toughness is characterized by bendability. The resin-coated copper foil after drying is manually folded in half to examine the bendability. The resin-coated copper foil can be folded in half for more than 20 times without the resin layer falling off or slag falling off, which is excellent; the resin layer starts to fall off or slag falling off after being folded in half for more than 10 times but less than 20 times, which is good; the resin layer starts to fall off or slag falling off after being folded in half for less than 10 times, which is poor.

[0122] (4) Heat resistance and thermal stress: The test was conducted using the method in IPC-TM-650 2.4.13.1-1994 Thermal Stress of Laminates. If the soldering time at 288°C was ≥ 300s, it was recorded as “excellent”; if the soldering time at 288°C was 100s ≤ and the soldering time at 288°C was < 300s, it was recorded as “good”; if the soldering time at 288°C was < 100s, it was recorded as “poor”.

[0123] The test results are shown in Table 1 and Table 2.

[0124] Table 1

[0125]

[0126] Table 2

[0127]

[0128]

[0129] According to the performance data in Table 1 and Table 2, the resin composition provided by the present invention has a colored resin layer formed by the design and compounding of the components, and has excellent bonding performance and high peel strength, and can form a high-strength stable bond with the copper foil / circuit layer, so that the copper foil peel strength of Examples 1-8 is 1.5-1.8N / mm, and has excellent toughness and bending resistance, 288°C soldering time ≥100s, good performance in thermal stress test, and high heat resistance. Further, in combination with Examples 1-8 and 9-10, it can be seen that the present invention can further improve the performance of the resin layer by optimizing the design and compounding of epoxy resin and curing agent.

[0130] The resin compositions of Comparative Examples 1-2 do not use the modified rubber defined in the present invention, resulting in poor bendability and thermal stress of the copper clad laminate; the resin composition of Comparative Example 3 does not contain a pigment and cannot play a color adjustment function; the resin composition of Comparative Example 4 not only has no color, but also has a comprehensive deterioration in peel strength and bendability, and cannot meet the performance requirements of the circuit board.

[0131] Application Examples

[0132] A circuit board and a display device comprising the same, wherein the preparation method of the circuit board is as follows:

[0133] (1) providing a copper-clad laminate, wherein the copper-clad laminate is the copper-clad laminate prepared in the above embodiment;

[0134] (2) processing the copper foils on both sides of the copper clad laminate by lamination, exposure, development, etching and film removal to obtain a first circuit layer and a second circuit layer respectively;

[0135] (3) Then, a first ink layer and a second ink layer are formed respectively to obtain the circuit board, and a schematic diagram of the structure is shown in FIG. Figure 3 As shown;

[0136] (4) The display device is assembled by using the circuit board, lamp beads and driving components, and its structural schematic diagram is as follows Figure 5 As shown, the lamp beads are arranged on the first circuit layer of the circuit board, and the lamp beads are connected to the first circuit layer, and the driving components are arranged on the second circuit layer of the circuit board, and the driving components are connected to the second circuit layer.

[0137] The present invention introduces a resin layer between the circuit layer and the substrate, covers the color of the substrate, and after superimposing or reflecting the color of the ink layer, reduces the color difference problem caused by the substrate, thereby reducing the color difference of the display device; a first ink layer and a second ink layer are coated on the resin layer and the circuit layer, and the first resin layer and the first ink layer are color matched and color superimposed or reflected, thereby improving the color uniformity of the circuit board, further reducing the color difference of the display device, and improving the display effect; at the same time, the resin layer has a strong bonding force with the copper foil / circuit layer, and the copper foil has a high peeling strength, thereby improving the adhesion of the lamp bead pad, greatly reducing the probability of the lamp bead pad falling off, and improving the display yield.

[0138] The applicant declares that the present invention uses the above embodiments to illustrate the resin composition of the present invention and the circuit board and display device containing the same, but the present invention is not limited to the above process steps, that is, it does not mean that the present invention must rely on the above process steps to be implemented. Those skilled in the art should understand that any improvement of the present invention, equivalent replacement of the raw materials selected by the present invention, addition of auxiliary components, selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

Claims

1. A resin composition, characterized in that The resin composition comprises the following components in parts by mass:

2. The resin composition according to claim 1, characterized in that The epoxy resin includes any one or a combination of at least two of bisphenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin, isocyanate modified epoxy resin, and phosphorus-containing epoxy resin, preferably any one or a combination of at least two of bisphenol A epoxy resin, novolac epoxy resin, and isocyanate modified epoxy resin; Preferably, the novolac epoxy resin includes any one of o-cresol novolac epoxy resin, bisphenol A novolac epoxy resin, and phenol-type novolac epoxy resin, or a combination of at least two thereof, and o-cresol novolac epoxy resin is further preferred; Preferably, the isocyanate-modified epoxy resin comprises an MDI-modified epoxy resin; Preferably, the epoxy equivalent of the epoxy resin is 176-3000 g / eq; Preferably, the curing agent includes any one of an amine curing agent, an acid anhydride curing agent, a phenol curing agent, and an imidazole curing agent, or a combination of at least two thereof, and more preferably any one of an amine curing agent, an acid anhydride curing agent, and an imidazole curing agent, or a combination of at least two thereof; Preferably, the amine curing agent includes any one of dicyandiamide, 4,4'-diaminodiphenyl sulfone, and 4,4'-diaminodiphenylmethane, or a combination of at least two thereof; Preferably, the acid anhydride curing agent includes any one of methyl hexahydrophthalic anhydride, hexahydrophthalic anhydride, and maleic anhydride curing agents, or a combination of at least two thereof; Preferably, the imidazole curing agent includes any one of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, and 2-phenyl-4-methylimidazole, or a combination of at least two thereof.

3. The resin composition according to claim 1 or 2, characterized in that The modified rubber includes reactive functional group modified rubber, wherein the reactive functional group includes any one of carboxyl, amino, and epoxy groups or a combination of at least two of them; Preferably, the base rubber in the modified rubber includes any one of styrene-butadiene rubber, nitrile rubber, butyl rubber, ethylene-propylene rubber, silicone rubber, fluororubber, and polysulfide rubber, or a combination of at least two thereof; Preferably, the weight average molecular weight of the modified rubber is 10,000-1,000,000, more preferably 50,000-1,000,000.

4. The resin composition according to any one of claims 1 to 3, characterized in that The colorant includes any one of white colorant, black colorant, green colorant, blue colorant, and red colorant, or a combination of at least two thereof, and preferably includes any one of carbon black, black soluble pigment, red pigment, blue pigment, green pigment, titanium dioxide, barium sulfate, and antimony oxide, or a combination of at least two thereof; Preferably, the resin composition further comprises polyimide resin and / or phenoloxy resin.

5. A resin-coated copper foil, characterized in that: The resin-coated copper foil comprises a copper foil layer and a resin layer, and the material of the resin layer comprises the resin composition according to any one of claims 1 to 4.

6. A copper clad laminate, characterized in that: The copper-clad laminate comprises a substrate and a first copper foil and a second copper foil arranged on both sides of the substrate, a first resin layer is arranged between the substrate and the first copper foil; and a material of the first resin layer comprises the resin composition according to any one of claims 1 to 4.

7. A circuit board, characterized in that: The circuit board comprises a substrate and a first circuit layer and a second circuit layer arranged on both sides of the substrate; A first ink layer is provided on a side of the first circuit layer facing away from the substrate, and a second ink layer is provided on a side of the second circuit layer facing away from the substrate; A first resin layer is disposed between the first circuit layer and the substrate, and a material of the first resin layer includes the resin composition according to any one of claims 1 to 4.

8. The circuit board according to claim 7, characterized in that: The thickness of the first resin layer is 5-200 μm; Preferably, a second resin layer is provided between the second circuit layer and the substrate; Preferably, the material of the second resin layer comprises the resin composition according to any one of claims 1 to 4; Preferably, the thickness of the second resin layer is 5-200 μm; Preferably, the substrate comprises at least one prepreg; Preferably, the prepreg comprises a glass fiber cloth prepreg, a glass fiber paper prepreg or a wood pulp paper prepreg.

9. A display device, characterized in that: The display device comprises a light source and the circuit board as claimed in claim 7 or 8.

10. The display device according to claim 9, characterized in that The light source is a lamp bead, which is arranged on the first circuit layer of the circuit board and connected to the first circuit layer; Preferably, the display device further comprises a driving component, wherein the driving component is disposed on the second circuit layer of the circuit board, and the driving component is connected to the second circuit layer.

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