Two-component resin composition, application thereof and PCB (printed circuit board)

Abstract

The invention discloses a two-component resin composition, application thereof and a PCB (printed circuit board), and relates to the technical field of circuit board production. The two-component resin composition comprises a component A and a component B, wherein the component A comprises epoxy resin; the component B comprises a liquid curing agent; the initial curing temperature of the liquid curing agent is 60-80 DEG C. The two-component resin composition provided by the technical scheme of the invention adopts the liquid curing agent with low initial temperature, the initial temperature of the curing agent is low, gas in a PCB substrate is not easy to volatilize and expand, and gas pressure generated during heating and curing after hole plugging is low, so that the possibility that resin in holes is blown out is reduced, and the service life of the PCB substrate is prolonged. And the hole blowing in the PCB hole plugging process can be obviously reduced, so that the problem that the hole plugging resin is easy to generate poor hole blowing can be solved. In addition, the dispersity and uniformity of the liquid curing agent in the resin body are better, and poor cracks of the PCB hole plugging resin and poor POFV sinking can be reduced.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board production, and in particular to a two-component resin composition and application thereof and a PCB board. Background Art

[0002] As one of the important functional materials for PCB via plugging, plugging resin provides good flatness and high reliability of dense filling for PCB plugging surface. With the advent of 5G to 6G communications and AI computing power, PCB products are developing in the direction of high frequency and high speed, and it is becoming increasingly difficult for plugging resin to adapt to high-frequency and high-speed substrates. The characteristics of high-frequency and high-speed substrates in terms of water absorption and the high-temperature volatility of small molecules in the material itself lead to high-temperature curing (generally 150°C) after plugging with plugging resin. Due to the existence of water vapor or substrate polymer escape in microscopic channels, when the plug is cured or after vacuum plugging is completed, the gas inside the plug pushes the resin out of the hole under high temperature pressure, resulting in the problem of "explosion" or "blowing" of the plug. This problem causes a large concave defect in the PCB hole. After the PCB resin plugging is completed, an AOI inspection will be carried out after grinding. For through holes that are depressed due to blow holes identified by AOI, the depressed position of the hole needs to be manually filled or re-filled once or multiple times, which has a significant adverse effect on the plugging yield and plugging production efficiency. At the same time, since filling or re-filling cannot completely avoid the occurrence of this hole depression, and there is a certain chance of leakage, the PCB POFV process brings reliability risks of tin blow holes during back-end SMT welding. Based on the above problems, the "blow hole" problem of PCB resin plug holes for high-frequency and high-speed substrates has become a common pain point in the industry.

[0003] At present, some researchers have tried to improve the "hole blowing" problem by improving the cross-linking degree of plugging resin or adjusting the curing temperature, but the improvement effect is not obvious. Therefore, it is of great significance to PCB production to develop a material that can reduce the "hole blowing" problem of plugging resin. Summary of the invention

[0004] The main purpose of the present invention is to provide a two-component resin composition and its application and PCB board, aiming to solve the problem that the existing plugging resin is prone to "hole blowing" defects.

[0005] To achieve the above object, the present invention provides a two-component resin composition, comprising component A and component B;

[0006] The component A comprises epoxy resin;

[0007] The component B includes a liquid curing agent;

[0008] Wherein, the initial curing temperature of the liquid curing agent is 60-80°C.

[0009] In one embodiment, the component A includes 40 to 50 parts by mass of epoxy resin, the component B includes 100 parts by mass of liquid curing agent, and the mass ratio between the component A and the component B is 100:(1 to 3).

[0010] In one embodiment, the epoxy resin includes at least one of a novolac epoxy resin, an isocyanurate epoxy resin, an alicyclic epoxy resin, an aromatic epoxy resin, a silicone-modified epoxy resin, and a polyamide-modified epoxy resin.

[0011] In one embodiment, the liquid curing agent includes at least one of tetrahydrophthalic anhydride, hexahydrophthalic anhydride, 4,4'-diaminodicyclohexylmethane, diaminodiphenylmethane, diethyltetramethylimidazole, 1-benzyl-2-ethylimidazole, 1-aminoethyl-2-methylimidazole, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, N-aminoethylpiperazine, N-hydroxyethylpiperazine, a modified product of meta-xylene diamine, and 4,4'-diaminodiphenylmethane.

[0012] In one embodiment, the isocyanurate type epoxy resin includes triglycidyl isocyanurate.

[0013] In one embodiment, the alicyclic epoxy resin includes at least one of tetraglycidyl-1,3-bisaminomethylcyclohexane, 4,5-epoxycyclohexane-1,2-dimethyl diglycidyl ester, 2-(3,4-epoxycyclohexyl)-5,5-spiro(3,4-epoxycyclohexyl)-1,3-dioxane homopolymer, 1,4-cyclohexanedimethanol bis(3,4-epoxycyclohexanecarboxylic acid) ester and bis((3,4-epoxycyclohexyl)methyl)adipate.

[0014] In one embodiment, the aromatic epoxy resin includes at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, hydrogenated bisphenol A epoxy resin, hydrogenated bisphenol F epoxy resin, condensed ring naphthalene epoxy resin, 4,4'-methylenebis(N,N'-diglycidylaniline), triphenylglycidyl ether methane, tetraglycidyl diaminodiphenylmethane, triglycidyl p-aminophenol and benzoxazine modified epoxy resin.

[0015] The present invention proposes an application of the two-component resin composition in a plugging process of a PCB board, comprising the following steps:

[0016] S10, providing a PCB board that has not been plugged; mixing the component A and the component B in the two-component resin composition at a mass ratio of 100: (1-3) to obtain a two-component resin composition;

[0017] S20, filling the two-component resin composition into the PCB board that has not been treated with plugging holes;

[0018] S30, performing thermal baking curing and grinding treatment to obtain the PCB board.

[0019] In one embodiment, in step S10, after the step of mixing component A and component B in the two-component resin composition in a mass ratio of 100:(1-3) to obtain the two-component resin composition, the following steps are included:

[0020] The mixture is allowed to stand for 4 to 12 hours until the viscosity of the two-component resin composition at 25° C. is 400 to 600 Pa.s.

[0021] In one embodiment, in step S20, the viscosity of the two-component resin composition at 25° C. is 400-750 Pa.s.

[0022] In one embodiment, in step S30, the curing includes: sequentially performing a first curing stage, a second curing stage, a third curing stage and a fourth curing stage, and the curing temperatures of the first curing stage, the second curing stage, the third curing stage and the fourth curing stage are increased sequentially.

[0023] In one embodiment, the first curing stage comprises: curing at 60-80° C. for 40-100 min;

[0024] The second curing stage comprises: curing at 90 to 110° C. for 20 to 60 minutes;

[0025] The third curing stage includes: curing at 130-160° C. for 20-60 minutes.

[0026] The present invention provides a PCB board, which includes the two-component plugging composition, or the PCB board is obtained by the plugging process.

[0027] The beneficial effects of the technical solution of the present invention are as follows:

[0028] (1) The two-component resin composition provided by the technical solution of the present invention selects a liquid curing agent with a starting temperature of 60 to 80°C as a curing agent. Since the starting temperature of the curing agent is relatively low, the gas in the micropores of the PCB product is not easy to volatilize and expand, and the gas pressure generated when the temperature is increased and cured after plugging is relatively small, thereby reducing the possibility of the resin in the hole being blown out, which can significantly reduce the hole blowing phenomenon during the hole plugging process of the PCB product, and can be used to solve the problem that the existing plugging resin is prone to "hole blowing".

[0029] (2) The technical solution of the present invention adopts a liquid curing agent, which has good dispersibility. Compared with the traditional solid particle curing agent, it does not need to match a strict grinding process for dispersion, and can select a conventional stirring and dispersion process. In addition, the uniformity of the liquid curing agent dispersed in the resin body is better, which can reduce the high aspect ratio PCB plugging resin cracks and POFV depression caused by uneven curing agent dispersion.

[0030] (3) The two-component resin composition provided by the technical solution of the present invention has its component A and component B stored separately before use. Compared with conventional plugging resins, it does not need to be transported through a cold chain or stored in a refrigerator to control the degree of curing. Therefore, it does not need to be stored at low temperature (refrigerator) or cold chain transported, and can be transported at room temperature and stored on site. DETAILED DESCRIPTION

[0031] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0033] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0034] As one of the important functional materials for PCB via plugging, plugging resin provides good flatness and high reliability of dense filling for PCB plugging surface. With the advent of 5G to 6G communications and AI computing power, PCB products are developing in the direction of high frequency and high speed, and it is becoming increasingly difficult for plugging resin to adapt to high-frequency and high-speed substrates. The characteristics of high-frequency and high-speed substrates in terms of water absorption and the high-temperature volatility of small molecules in the material itself lead to high-temperature curing (generally 150°C) after plugging with plugging resin. Due to the existence of water vapor or substrate polymer escape in microscopic channels, when the plug is cured or after vacuum plugging is completed, the gas inside the plug pushes the resin out of the hole under high temperature pressure, resulting in the problem of "explosion" or "blowing" of the plug. This problem causes a large concave defect in the PCB hole. After the PCB resin plugging is completed, an AOI inspection will be carried out after grinding. For through holes that are depressed due to blow holes identified by AOI, the depressed position of the hole needs to be manually filled or re-filled once or multiple times, which has a significant adverse effect on the plugging yield and plugging production efficiency. At the same time, since filling or re-filling cannot completely avoid the occurrence of this hole depression, and there is a certain chance of leakage, the PCB POFV process brings reliability risks of tin blow holes during back-end SMT welding. Based on the above problems, the "blow hole" problem of PCB resin plug holes for high-frequency and high-speed substrates has become a common pain point in the industry.

[0035] In view of this, the present invention provides a two-component resin composition, including component A and component B;

[0036] The component A comprises epoxy resin;

[0037] The component B includes a liquid curing agent;

[0038] Wherein, the initial curing temperature of the liquid curing agent is 60-80°C.

[0039] The two-component resin composition provided by the present invention selects a liquid curing agent with a low starting temperature (60-80°C) as a curing agent. Compared with the traditional single-component curing agent (the starting curing temperature is usually greater than 80°C), the curing temperature of the resin is reduced. At the temperature before the gas forms and gathers, the two-component resin composition has begun to cure, so the gas can be sealed in the hole in advance, so that the gas in the micropores of the PCB product is not easy to escape or expand. The gas pressure generated when the temperature is raised and cured after plugging the hole is small, thereby reducing the possibility of the resin in the hole being blown out, and can be used to solve the problem that the existing plugging resin is prone to "blowing holes". In addition, since the technical solution of the present invention adopts a liquid curing agent, the liquid curing agent has better dispersibility and better uniformity in the resin body, which can reduce the PCB plugging resin cracks and POFV depression caused by uneven dispersion of the curing agent. In addition, the two-component resin composition provided by the present invention includes component A and component B. Before use, the component A and component B are stored separately. Traditional one-component resins have poor storage stability due to the use of latent curing agents, and are mostly stored below 0°C, which increases transportation costs and the difficulty of controlling the transportation process. Therefore, the two-component resin composition provided by the present invention overcomes the defects of traditional one-component resins that require strict control of storage environment and transportation conditions.

[0040] In an embodiment of the present invention, the component A includes 40 to 50 parts by mass of epoxy resin, the component B includes 100 parts by mass of liquid curing agent, and the mass ratio between the components A and B is 100:(1 to 3). The mass ratio between the components A and B can be specifically 100:1, 100:1.5, 100:2, 100:2.5, 100:3. Setting the mass ratio between the components A and B at 100:(1 to 3) is conducive to the full curing of the epoxy resin and the curing agent, and obtaining a plugging resin with good mechanical properties and few curing cracks. If the curing agent content is too low, the curing reaction between the epoxy resin and the curing agent is insufficient, and it is difficult to achieve the curing degree of the resin; if the curing agent content is too high, the curing reaction will be accelerated or over-cured, the mechanical properties of the plugging resin will be reduced, and the curing crack rate of the resin will increase.

[0041] In an embodiment of the present invention, the epoxy resin includes at least one of a phenolic epoxy resin, an isocyanurate epoxy resin, an alicyclic epoxy resin, an aromatic epoxy resin, an organosilicon-modified epoxy resin, and a polyamide-modified epoxy resin. The epoxy resin may be any one of a phenolic epoxy resin, an isocyanurate epoxy resin, an alicyclic epoxy resin, an aromatic epoxy resin, an organosilicon-modified epoxy resin, and a polyamide-modified epoxy resin, or may be two or more of a phenolic epoxy resin, an isocyanurate epoxy resin, an alicyclic epoxy resin, an aromatic epoxy resin, an organosilicon-modified epoxy resin, and a polyamide-modified epoxy resin, all of which belong to the protection scope of the present invention. The technical solution of the present invention selects epoxy resins within the above range to be cured with a liquid curing agent, and no additional modification of the epoxy resin is required.

[0042] In an embodiment of the present invention, the isocyanurate epoxy resin includes triglycidyl isocyanurate.

[0043] In an embodiment of the present invention, the alicyclic epoxy resin includes at least one of tetraglycidyl-1,3-bisaminomethylcyclohexane, 4,5-epoxycyclohexane-1,2-dimethyl diglycidyl ester, 2-(3,4-epoxycyclohexyl)-5,5-spiro(3,4-epoxycyclohexyl)-1,3-dioxane homopolymer, 1,4-cyclohexanedimethanol bis(3,4-epoxycyclohexanecarboxylic acid) ester and bis((3,4-epoxycyclohexyl)methyl)adipate.

[0044] In an embodiment of the present invention, the aromatic epoxy resin includes at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, hydrogenated bisphenol A epoxy resin, hydrogenated bisphenol F epoxy resin, condensed ring naphthalene epoxy resin, 4,4'-methylenebis(N,N'-diglycidylaniline), triphenylglycidyl ether methane, tetraglycidyl diaminodiphenylmethane, triglycidyl p-aminophenol and benzoxazine modified epoxy resin.

[0045] In an embodiment of the present invention, the liquid curing agent includes at least one of tetrahydrophthalic anhydride, hexahydrophthalic anhydride, 4,4'-diaminodicyclohexylmethane, diaminodiphenylmethane, diethyltetramethylimidazole, 1-benzyl-2-ethylimidazole, 1-aminoethyl-2-methylimidazole, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, N-aminoethylpiperazine, N-hydroxyethylpiperazine, a modified product of meta-xylene diamine, and 4,4'-diaminodiphenylmethane. The liquid curing agent may be any one of tetrahydrophthalic anhydride, hexahydrophthalic anhydride, 4,4'-diaminodicyclohexylmethane, diaminodiphenylmethane, diethyltetramethylimidazole, 1-benzyl-2-ethylimidazole, 1-aminoethyl-2-methylimidazole, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, N-aminoethylpiperazine, N-hydroxyethylpiperazine, a modified product of meta-xylene diamine, and 4,4'-diaminodiphenylmethane; or may be at least one of tetrahydrophthalic anhydride, hexahydrophthalic anhydride, 4,4'-diaminodicyclohexylmethane, diaminodiphenylmethane, diethyltetramethylimidazole, 1-benzyl-2-ethylimidazole, 1-aminoethyl-2-methylimidazole, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, N-aminoethylpiperazine, N-hydroxyethylpiperazine, a modified product of meta-xylene diamine, and 4,4'-diaminodiphenylmethane. The liquid curing agent can be two or more of tetrahydrophthalic anhydride, hexahydrophthalic anhydride, 4,4'-diaminodicyclohexylmethane, diaminodiphenylmethane, diethyltetramethylimidazole, 1-benzyl-2-ethylimidazole, 1-aminoethyl-2-methylimidazole, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, N-aminoethylpiperazine, N-hydroxyethylpiperazine, a modified product of meta-xylene diamine, and 4,4'-diaminodiphenylmethane, all of which are within the scope of protection of the present invention. It should be noted that the selection of the liquid curing agent mainly considers the curing temperature and the adaptation to the curing rate of the monomer epoxy resin in the resin.

[0046] In an embodiment of the present invention, the component A further comprises 40 to 60 parts by weight of inorganic filler and 0.1 to 2 parts by weight of auxiliary agent. Adding a proper amount of inorganic filler is used to improve the filling property of the PCB plugging resin, ensure a good filling effect during the plugging process, and also improve the stability and wear resistance of the PCB plugging resin.

[0047] In an embodiment of the present invention, the inorganic filler includes at least one of barium sulfate, talc, crystalline silica, fused silica, amorphous silica, nano silica, magnesium carbonate, calcium carbonate, nano calcium carbonate, aluminum oxide, aluminum hydroxide, and silicon powder.

[0048] In an embodiment of the present invention, the auxiliary agent includes a wetting and dispersing agent or a defoaming agent.

[0049] In an embodiment of the present invention, the wetting and dispersing agents include BYK-110 and BYK-111 produced by BYK Chemicals of Germany, Disponer 904 and Disponer 904S produced by Hemmings Special Chemicals, and 2400SC and 20000 produced by Lubrizol.

[0050] In an embodiment of the present invention, the defoaming agent includes BYK-A550, BYK-A515, BYK-A506 produced by BYK Chemical of Germany, H10, FS80 produced by Dow Corning, Foamex1495, Foamex842 produced by Digo.

[0051] The present invention proposes an application of the two-component resin composition in a plugging process of a PCB board, comprising the following steps:

[0052] S10, providing a PCB board that has not been plugged; mixing the component A and the component B in the two-component resin composition at a mass ratio of 100: (1-3) to obtain a two-component resin composition;

[0053] S20, filling the two-component resin composition into the PCB board that has not been treated with plugging holes;

[0054] S30, performing thermal baking curing and grinding treatment to obtain the PCB board.

[0055] When using a two-component resin composition for plugging holes, first mix component A and component B in the two-component resin composition in a certain mass ratio and then fill the PCB. After filling, the PCB is thermally baked, cured, and ground. The PCB board obtained by the technical solution of the present application can significantly reduce the poor blow hole and POFV depression of the PCB board. It should be noted that in the technical solution of the present application, the plugging structure is not limited to through-holes, back-drilled holes, blind holes, buried holes and other structures; the PCB board is not limited to double-sided high-frequency boards, high-speed multi-layer boards, high-frequency and high-speed mixed-pressure boards and other products.

[0056] In an embodiment of the present invention, before step S20, the PCB board without plugging hole treatment is pre-baked. The pre-baking temperature is based on the characteristics of the designed board, the baking temperature is 150-200° C., and the baking time is 4-8 hours.

[0057] In an embodiment of the present invention, in step S10, the step of mixing component A and component B in the two-component resin composition in a mass ratio of 100:(1-3) to obtain the two-component resin composition comprises:

[0058] SA1, mixing epoxy resin, inorganic filler and additives, dispersing, grinding and degassing to obtain component A;

[0059] SA2. Weigh the liquid curing agent to obtain component B, and mix component A and component B in a mass ratio of 100:(1-3) to obtain a two-component resin composition.

[0060] In an embodiment of the present invention, in step SA1, the dispersion treatment is performed in a disperser, wherein the rotation speed of the disperser is 10 to 20 rpm, and the dispersion time is 40 to 100 min.

[0061] In an embodiment of the present invention, in step SA1, the grinding process is performed in a three-roll mill, wherein the grinding speed in the disperser is 500-800 rpm, and the grinding time is 40-100 min.

[0062] In an embodiment of the present invention, in step SA1, the degassing treatment includes: vacuum degassing and centrifugal degassing in sequence. The vacuum degassing is performed in a double planetary vacuum degassing machine, wherein the vacuum degree is 100 Pa and the vacuum degassing time is 1.5 to 2.5 hours; the centrifugal degassing is performed in a double planetary vacuum degassing machine, wherein the centrifugal speed is 500-2000 rpm and the centrifugal time is 60 to 180 seconds.

[0063] In an embodiment of the present invention, in step S10, after the step of mixing component A and component B in the two-component resin composition in a mass ratio of 100:(1-3) to obtain the two-component resin composition, the following steps are included:

[0064] The mixture is allowed to stand for 4 to 12 hours until the viscosity of the two-component resin composition at 25° C. is 400 to 600 Pa.s. Before plugging the PCB board, the viscosity of the two-component resin composition is controlled within the above range, which is conducive to obtaining better curing effect and plugging effect, and is easy to process.

[0065] In an embodiment of the present invention, in step S20, the viscosity of the two-component resin composition at 25°C is 400-750Pa.s. Using a curing agent with a low initial curing temperature and allowing the curing reaction to be carried out as close to room temperature as possible can solve the "blowing hole" phenomenon caused by gas expansion due to increased temperature, but a lower curing temperature means a faster reaction, which will reduce the effective use period. In this application, when executing step S20, by controlling the viscosity of the two-component resin composition at 25°C to 400-750Pa.s, it is ensured that the effective use time of the two-component resin composition reaches 6 hours, meeting the processing requirements.

[0066] In an embodiment of the present invention, in step S30, the curing includes: sequentially performing a first curing stage, a second curing stage, and a third curing stage, wherein the curing temperatures of the first curing stage, the second curing stage, and the third curing stage are sequentially increased. By sequentially increasing the temperature for curing, the resin is uniformly cured, the internal stress is reduced, and the quality and reliability of the final product are improved.

[0067] In an embodiment of the present invention, the first curing stage comprises: curing at 60-80° C. for 40-100 min;

[0068] The second curing stage comprises: curing at 90 to 110° C. for 20 to 60 minutes;

[0069] The third curing stage includes: curing at 130-160° C. for 20-60 minutes.

[0070] The initial curing temperature of the curing agent in the technical solution of the present invention is 60-80°C. Compared with the traditional latent curing agent, the curing agent has begun to cure at the temperature before the gas forms and gathers, so that the gas can be sealed in the PCB product hole in advance, making it difficult for the gas to escape or expand, reducing the possibility of "blow hole". In one embodiment of the present invention, the parameters of the first curing stage are set to 60°C curing for 30 minutes + 80°C curing for 30 minutes, the parameters of the second curing stage are 120°C curing for 30 minutes, and the parameters of the third curing stage are 150°C curing for 30 minutes.

[0071] The present invention provides a PCB board, the PCB board includes the two-component plugging composition, or the PCB board is obtained by the application of the above technical solution. The PCB board includes all technical solutions of the two-component plugging composition, and thus has all the beneficial effects of the two-component plugging composition, which will not be described in detail in the present invention.

[0072] The technical solution of the present invention is further described in detail below in conjunction with specific embodiments. It should be understood that the following embodiments are only used to explain the present invention, and are not used to limit the present invention.

[0073] Example 1

[0074] A two-component resin composition comprises a component A and a component B, wherein the component A comprises 16 parts of a polyamide-modified epoxy resin, 23 parts of a bisphenol A epoxy resin, 55 parts of calcium carbonate and 1 part of BYK-110; the component B comprises 100 parts of 1-benzyl-2-ethylimidazole; and the mass ratio of the component A to the component B is 100:1.

[0075] Example 2

[0076] A two-component resin composition comprises a component A and a component B, wherein the component A comprises 21 parts of triglycidyl isocyanurate, 26 parts of hydrogenated bisphenol F epoxy resin, 35 parts of calcium carbonate, 16 parts of silicon dioxide, 1.2 parts of BYK-A515 and 0.8 parts of Foamex842; the component B comprises 42 parts of tetraethylenepentamine and 58 parts of N-aminoethylpiperazine; and the mass ratio of the component A to the component B is 100:2.

[0077] Example 3

[0078] A two-component resin composition comprises a component A and a component B, wherein the component A comprises 23 parts of a polyamide-modified epoxy resin, 24 parts of a hydrogenated bisphenol F epoxy resin, 51 parts of silicon dioxide and 2 parts of Disponer 904; the component B comprises 65 parts of 1-aminoethyl-2-methylimidazole and 35 parts of N-aminoethylpiperazine; and the mass ratio of the component A to the component B is 100:3.

[0079] Example 4

[0080] Application of a two-component resin composition in a hole plugging process of a PCB board comprises the following steps:

[0081] (1) 16 parts of polyamide modified epoxy resin, 23 parts of bisphenol A epoxy resin, 55 parts of calcium carbonate and 1 part of BYK-110 were mixed, dispersed, ground and degassed to obtain component A; component A and component B (100 parts of 1-benzyl-2-ethylimidazole) were mixed at a mass ratio of 100:1 to obtain a two-component resin composition; the two-component resin composition was allowed to stand and used after confirming that the viscosity reached 400-600 dPa.s;

[0082] (2) Pre-baking the PCB product at 180°C for 6 hours, wherein the PCB substrate is IT-968G;

[0083] (3) using a vacuum plugging process and an aluminum sheet plugging method to fill the two-component resin composition obtained in step (1) into the baked PCB board for plugging;

[0084] (4) Performing thermal baking curing and grinding treatment to obtain a PCB board with plugged holes; wherein the parameters of the first curing stage are curing at 60°C for 30 minutes + curing at 80°C for 30 minutes, the parameters of the second curing stage are curing at 120°C for 30 minutes, and the parameters of the third curing stage are curing at 150°C for 30 minutes.

[0085] Example 5

[0086] Compared with Example 4, the difference is that: in step (1), component A is 21 parts of triglycidyl triisocyanate, 26 parts of hydrogenated bisphenol F epoxy resin, 35 parts of calcium carbonate, 16 parts of silicon dioxide, 1.2 parts of BYK-A515 and 0.8 parts of Foamex842, component B is 42 parts of tetraethylenepentamine and 58 parts of N-aminoethylpiperazine, and component A and component B are mixed in a mass ratio of 100:2; in step (2), the PCB substrate is PTFE, and the PCB product is pre-baked at 150°C for 8 hours.

[0087] Example 6

[0088] Compared with Example 4, the difference is that: in step (1), component A is 23 parts of polyamide modified epoxy resin, 24 parts of hydrogenated bisphenol F epoxy resin, 51 parts of silicon dioxide and 2 parts of Disponer 904, component B is 65 parts of 1-aminoethyl-2-methylimidazole and 35 parts of N-aminoethylpiperazine, and component A and component B are mixed in a mass ratio of 100:3; in step (2), the PCB substrate is M7, and the PCB product is pre-baked at 190°C for 4 hours.

[0089] Comparative Example 1

[0090] Compared with Example 5, the difference is that the liquid curing agent is methyltetrahydrophthalic anhydride, and the first curing stage parameter when using methyltetrahydrophthalic anhydride is curing at 75° C. for 60 minutes.

[0091] Comparative Example 2

[0092] Compared with Example 5, the difference is that the curing agent is a solid curing agent, and the solid curing agent is 2-ethyl-4-methylimidazole.

[0093] Performance Testing

[0094] The two-component resin compositions of Examples 1-3 and Comparative Examples 1-2, and commercially available PCB plugging resins were plugged according to the method of Example 4, and the blow hole defect rate and POFV depression defect rate of the products during the plugging process were statistically analyzed, and the test results are shown in Table 1. Among them, the substrate of the PCB board plugged with the two-component resin composition of Example 1 is EM891K, the substrate of the PCB board plugged with the two-component resin composition of Example 2 is S1000-2, the substrate of the PCB board plugged with the two-component resin composition of Example 3 is S7136H, and the substrate of the PCB board plugged with the commercially available PCB plugging resin is M7.

[0095] The blow hole defect rate and POFV depression defect rate of the PCB boards obtained in Examples 4-6 were statistically tested, and the test results are shown in Table 1.

[0096] Table 1 Performance test results of Examples 1-6, Comparative Examples 1-2 and commercially available PCB plugging resins

[0097]

[0098] As shown in Table 1, the blow hole defect rate and POFV depression defect rate after plugging the holes using the two-component resin composition of Examples 1-6 are lower than those of Comparative Examples 1-2, and are also lower than those of commercially available PCB plugging resins. Among them, the two-component resin composition of Comparative Example 1 has a higher starting temperature of the curing agent than the curing agent in the technical solution of the present invention, so the effect of solving the blow hole problem is poor; the two-component resin composition of Comparative Example 2 has a poor effect of solving the blow hole problem because the curing agent is a solid curing agent, and the dispersibility of the curing agent in the resin composition is not as good as that of the liquid curing agent, and there is a phenomenon of uneven dispersion; the commercially available PCB plugging resin is a solid curing agent with a higher curing temperature, and because the curing temperature is high and there is a phenomenon of uneven dispersion, the effect of solving the blow hole problem is poor.

[0099] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification under the technical concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A two-component resin composition, characterized in that: It includes component A and component B; The component A comprises epoxy resin; The component B includes a liquid curing agent; Wherein, the initial curing temperature of the liquid curing agent is 60-80°C.

2. The two-component resin composition according to claim 1, characterized in that: The component A includes 40 to 50 parts by mass of epoxy resin, the component B includes 100 parts by mass of liquid curing agent, and the mass ratio between the component A and the component B is 100:(1 to 3).

3. The two-component resin composition according to claim 1, characterized in that: The epoxy resin includes at least one of a phenolic epoxy resin, an isocyanurate epoxy resin, an alicyclic epoxy resin, an aromatic epoxy resin, a silicone-modified epoxy resin and a polyamide-modified epoxy resin; and / or, The liquid curing agent includes at least one of tetrahydrophthalic anhydride, hexahydrophthalic anhydride, 4,4'-diaminodicyclohexylmethane, diaminodiphenylmethane, diethyltetramethylimidazole, 1-benzyl-2-ethylimidazole, 1-aminoethyl-2-methylimidazole, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, N-aminoethylpiperazine, N-hydroxyethylpiperazine, a modified product of meta-xylene diamine, and 4,4'-diaminodiphenylmethane.

4. The two-component resin composition according to claim 3, characterized in that: The isocyanurate epoxy resin includes triglycidyl isocyanurate; and / or, The alicyclic epoxy resin includes at least one of tetraglycidyl-1,3-bisaminomethylcyclohexane, 4,5-epoxycyclohexane-1,2-dimethyl diglycidyl ester, 2-(3,4-epoxycyclohexyl)-5,5-spiro(3,4-epoxycyclohexyl)-1,3-dioxane homopolymer, 1,4-cyclohexanedimethanol bis(3,4-epoxycyclohexanecarboxylic acid) ester and bis((3,4-epoxycyclohexyl)methyl)adipate; and / or, The aromatic epoxy resin includes at least one of bisphenol A epoxy resin, bisphenol F epoxy resin, hydrogenated bisphenol A epoxy resin, hydrogenated bisphenol F epoxy resin, condensed ring naphthalene epoxy resin, 4,4'-methylenebis(N,N'-diglycidyl aniline), triphenyl glycidyl ether methane, tetraglycidyl diaminodiphenylmethane, triglycidyl p-aminophenol and benzoxazine modified epoxy resin.

5. An application of the two-component resin composition according to any one of claims 1 to 4 in a plugging process of a PCB board, characterized in that: The following steps are involved: S10, providing a PCB board that has not been plugged; mixing component A and component B in the two-component resin composition according to any one of claims 1 to 4 at a mass ratio of 100: (1-3) to obtain a two-component resin composition; S20, filling the two-component resin composition into the PCB board that has not been treated with plugging holes; S30, performing thermal baking curing and grinding treatment to obtain the PCB board.

6. The use according to claim 5, characterized in that In step S10, after the step of mixing component A and component B in the two-component resin composition according to any one of claims 1 to 5 at a mass ratio of 100:(1-3) to obtain the two-component resin composition, the step further comprises: The mixture is allowed to stand for 4 to 12 hours until the viscosity of the two-component resin composition at 25° C. is 400 to 600 Pa.s.

7. The use according to claim 5, characterized in that In step S20, the viscosity of the two-component resin composition at 25° C. is 400-750 Pa.s.

8. The use according to claim 5, characterized in that In step S30, the curing includes: sequentially performing a first curing stage, a second curing stage and a third curing stage, and the curing temperatures of the first curing stage, the second curing stage and the third curing stage are increased sequentially.

9. The use according to claim 8, characterized in that The first curing stage comprises: curing at 60-80° C. for 40-100 min; The second curing stage comprises: curing at 90 to 110° C. for 20 to 60 minutes; The third curing stage includes: curing at 130-160° C. for 20-60 minutes.

10. A PCB board, characterized in that: The PCB board comprises the two-component plugging composition according to any one of claims 1 to 4, or the PCB board is obtained by the application according to any one of claims 5 to 9.

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