Technology for attaching sand powder to hardware based on electrophoresis

Abstract

The invention relates to the technical field of metal surface treatment, in particular to an electrophoresis-based process for attaching sand powder to hardware, which comprises the following steps: A, preparing an electrophoresis solution with sand powder; b, the metal part is put into electrophoresis liquid for electrophoresis treatment, and sand powder is attached to the surface of the metal part through electrophoresis; and C, the metal part is taken away from the electrophoresis liquid, and then the metal part is cleaned. According to the method, the sand powder is prepared into the electrophoresis liquid, and the sand powder is directly attached to the metal part in an electrophoresis mode, so that the process steps are saved; in addition, the structure formed by attaching the sand powder to the metal piece through electrophoresis is smoother and more stable, and the product quality can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of metal surface treatment, in particular to a sand powder attachment hardware process based on electrophoresis. Background Art

[0002] Electrophoresis is one of the metal surface treatment methods, which can form a uniform and smooth protective layer on the metal surface. However, the existing metal surface treatment is complicated. For example, if you need to make a black metal part with a frosted surface, you need to first perform sand powder adhesion treatment on the metal part and then perform electrophoresis treatment.

[0003] The existing technology is not only inefficient, but also has defects such as obvious granularity on the surface of the metal parts produced, making it difficult to meet the quality requirements. Summary of the invention

[0004] In view of the problems of the prior art, the present invention provides a process for attaching sand powder to hardware based on electrophoresis, which can improve efficiency and ensure the adhesion effect of the sand layer.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] The present invention provides a process for attaching sand powder to hardware based on electrophoresis, comprising the following steps:

[0007] A. Equipped with electrophoresis solution containing sand powder;

[0008] B. Place the metal part in an electrophoresis solution for electrophoresis treatment, and attach the sand powder to the surface of the metal part by electrophoresis;

[0009] C. Remove the metal parts from the electrophoretic liquid and then clean the metal parts.

[0010] Furthermore, step A specifically includes:

[0011] A1. Grinding the sand powder so that the particle size of the sand powder is not greater than a specific value;

[0012] A2. Put the ground sand powder into the container so that the sand powder is mixed with the solution in the container;

[0013] A3. Stir the solution so that the sand powder is evenly distributed in the solution;

[0014] When executing step B, the sand powder concentration of the solution is monitored, and sand powder is supplemented when the sand powder concentration is insufficient.

[0015] Furthermore, the sand powder concentration monitoring of the solution specifically includes:

[0016] After electrophoresis is complete, an image of the container is acquired;

[0017] Analyze the container image and obtain the sand powder concentration in different areas according to the colors of different areas of the container in the image;

[0018] The sand powder concentrations in each area are averaged to obtain an average concentration; if the average concentration is not less than the preset concentration, step A3 is performed; if the average concentration is less than the preset concentration, sand powder is added to the solution.

[0019] Furthermore, if the average concentration is less than the preset concentration, the solution is supplemented with sand powder, specifically including:

[0020] Acquire the area with low sand powder concentration in the solution according to the image;

[0021] Add sand powder just above the area with low sand powder concentration;

[0022] Stirring the solution;

[0023] Among them, the ratio of the solution concentration after adding sand powder to the preset concentration is 1.3-1.5:1.

[0024] Furthermore, between steps A and B, the following steps are also included:

[0025] Sense the ionic strength of the solution and adjust the ionic strength to between 0.02-0.2 mol / kg;

[0026] Sensing the viscosity of the solution and adjusting the temperature of the solution according to the value of the viscosity of the solution;

[0027] Get the average concentration and pH value of the solution in the container;

[0028] Match the electric field strength and electrophoresis time according to the average concentration and pH value.

[0029] Further, step B specifically includes,

[0030] B1. Pickle and degrease the metal parts in sequence;

[0031] B2. heating the inconspicuous area of ​​the metal part so that the temperature of the inconspicuous area is higher than the temperature of other areas;

[0032] B3. Immersing the metal part in an etching solution for etching, so that the metal part forms a nano-scale microstructure;

[0033] Wherein, the inconspicuous area is one or more of a bending position, a recessed position, an inner wall, and a hole position of the metal part.

[0034] Furthermore, step B2 specifically includes:

[0035] Get the current temperature T of the etching solution;

[0036] Heat the metal part to T;

[0037] The inconspicuous area of ​​the metal part is heated again so that the temperature of the inconspicuous area is raised to T', wherein T'=k*T, k is a constant and 1.1≤k≤1.3.

[0038] Furthermore, step B also includes B4. According to the current temperature of the solution, the temperature of the metal part is adjusted so that the temperature of the metal part is substantially equal to the current temperature of the solution.

[0039] Furthermore, between step B1 and step B2, the following steps are also included:

[0040] Acquire image information of the metal part, and identify the hole position of the metal part from the image information of the metal part;

[0041] Classify each hole position into conductive holes and non-conductive holes, wherein the non-conductive holes are inconspicuous areas;

[0042] The conductive holes are sequentially subjected to coating, exposure and development processes.

[0043] Furthermore, the masking, exposure and development processes are sequentially performed on the conductive holes, specifically including:

[0044] Use a robot to spray a photosensitive film layer on the conductive holes of metal parts;

[0045] The photosensitive film layer is irradiated with ultraviolet rays to expose the photosensitive film layer to form a macromolecular protective layer that is insoluble in a dilute alkaline solution.

[0046] Beneficial effects of the present invention: The present invention prepares sand powder with electrophoretic liquid, and directly allows the sand powder to adhere to the metal part by electrophoresis, thereby saving process steps; in addition, the structure formed by the sand powder adhering to the metal part by electrophoresis is smoother and more stable, which is beneficial to improving the quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 It is a process flow chart of the present invention.

[0048] Figure 2 The figure is a schematic diagram of a system to which the present invention is applied.

[0049] Figure numerals: 1—transmission module, 2—primary cleaning module, 3—mask module, 4—etching module, 5—electrophoresis module, 6—secondary cleaning module, 7—lifting module. DETAILED DESCRIPTION

[0050] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with the embodiments and drawings, and the contents mentioned in the embodiments are not intended to limit the present invention. The present invention is described in detail below in conjunction with the drawings.

[0051] like Figure 1 As shown, the present invention provides a process for attaching sand powder to hardware based on electrophoresis, comprising the following steps:

[0052] EX. Clean the surface of metal parts to remove oil stains on the surface of metal parts;

[0053] A. Prepare an electrophoretic liquid with sand powder; specifically, mix the sand powder and the electrophoretic paint according to a predetermined ratio to obtain the electrophoretic liquid;

[0054] B. Place the metal part in an electrophoresis solution for electrophoresis treatment, and attach the sand powder to the surface of the metal part by electrophoresis;

[0055] C. Remove the metal parts from the electrophoretic liquid and then clean the metal parts.

[0056] Specifically, the present invention uses sand powder and electrophoresis liquid, that is, the sand powder is directly attached to the metal part by electrophoresis. The electrostatic adhesion can make the adhesion of the sand powder better than the existing technology, and the electrophoresis process can further improve the uniformity of the distribution of the sand powder on the surface of the metal part, avoiding the appearance of too obvious granularity and affecting the quality of the product. In addition, compared with the existing technology, the present invention integrates two steps into one step, improves the efficiency of the process, and reduces the number of devices required to implement the process, thereby reducing the cost.

[0057] In this embodiment, step A specifically includes:

[0058] A1. Grinding the sand powder so that the particle size of the sand powder is not greater than a specific value;

[0059] A2. Put the ground sand powder into the container so that the sand powder is mixed with the solution in the container;

[0060] A3. Stir the solution so that the sand powder is evenly distributed in the solution;

[0061] When executing step B, the sand powder concentration of the solution is monitored, and sand powder is supplemented when the sand powder concentration is insufficient.

[0062] The sand powder is preferably ground by wet grinding, that is, after the sand powder is ground to a specific size, it will be dissolved with water to form a sand powder liquid. Wet grinding is beneficial to reduce the concentration of other impurities (mainly grinding materials) in the sand powder liquid. The equipment and process of wet grinding of the present invention are all prior art and do not fall within the scope of protection of the present invention.

[0063] The sand powder liquid will be put into the container and mixed with the electrolyte (the conventional one will do, and technicians in this field can test the most suitable electrolyte) to form the required solution. During electrophoresis, the ions in the electrolyte move due to the power supply, and they attach to the sand powder, which can drive the sand powder to move together, so that the sand powder can attach to the metal parts through the ions, and the adhesion effect is guaranteed by electricity.

[0064] In step A3, the solution needs to be stirred to make the distribution of sand powder in the solution more uniform, so that the rate at which sand powder is attached to each position of the metal part during the electrophoresis process will not be too different, thereby ensuring the uniformity of the surface of the metal part after electrophoresis. The stirring method adopted in the present invention is preferably achieved by providing power through a water pump to generate a vortex in the container.

[0065] In this embodiment, the sand powder concentration monitoring of the solution specifically includes:

[0066] After electrophoresis is complete, an image of the container is acquired;

[0067] Analyze the container image and obtain the sand powder concentration in different areas according to the colors of different areas of the container in the image;

[0068] The sand powder concentrations in each area are averaged to obtain an average concentration; if the average concentration is not less than the preset concentration, step A3 is performed; if the average concentration is less than the preset concentration, sand powder is added to the solution.

[0069] That is, after the electrophoresis is completed, the sand powder concentration at different positions in the solution will inevitably be different due to the specificity of the metal part shape, and the sand powder has a very low movement rate in the solution without stirring. Therefore, based on this phenomenon, the present invention analyzes the solution in the container after each electrophoresis, that is, the solution is divided into several areas according to the pre-set conditions, and the current sand powder concentration of each area is judged according to the depth of the color, so that the distribution of sand powder in each area can be quickly identified.

[0070] According to normal logic, after electrophoresis, the concentration of the area occupied by the metal parts will be significantly reduced, while the area at the bottom of the container will have a relatively high concentration of sand powder. At this time, after performing concentration tests on each area and then calculating the average concentration, the actual concentration of sand powder in the solution can be known more accurately, so as to determine whether sand powder needs to be supplemented.

[0071] When it is not time to replenish the sand powder, the container needs to be stirred again to allow the sand powder deposited at the bottom of the container to diffuse to other areas due to turbulence, thereby achieving the effect of making the sand powder concentration in each area basically the same within the required time, which is conducive to the stable implementation of the next electrophoresis.

[0072] Specifically, if the average concentration is less than the preset concentration, the solution is supplemented with sand powder, which specifically includes:

[0073] Acquire the area with low sand powder concentration in the solution according to the image;

[0074] Add sand powder just above the area with low sand powder concentration;

[0075] Stirring the solution;

[0076] Among them, the ratio of the solution concentration after adding sand powder to the preset concentration is 1.3-1.5:1.

[0077] The preset concentration value is only a minimum value that can ensure that electrophoresis is carried out at a predetermined efficiency. At this value, the efficiency of electrophoresis can be ensured by adjusting the electric field strength and other methods. On this basis, when the average concentration of sand powder is lower than the preset concentration, the sand powder liquid needs to be supplemented, and the supplementation method is to add it above the area with low sand powder concentration, so that the newly supplemented sand powder liquid can give priority to the area with low sand powder concentration, so that the subsequent stirring time of the solution can be reduced, thereby improving efficiency.

[0078] The solution concentration value after adding sand powder must be greater than the preset concentration value to ensure that sand powder needs to be replenished again after multiple electrophoresis after adding sand powder, thereby reducing the number of times sand powder is replenished to improve the overall efficiency of the present invention.

[0079] During the electrophoretic process, the electrophoretic paint will also be lost, and this loss can also be fed back according to the color of the solution; when the proportion of the electrophoretic paint is reduced to a certain value, the electrophoretic paint needs to be replenished. The method for replenishing the electrophoretic paint in the present invention is also to directly add it to the container and then stir it.

[0080] That is to say, the method of supplementing electrophoretic paint and sand powder in the present invention is similar to "adding water if it is sweet and adding sugar if it is light", and the above-mentioned sweetness and lightness are equivalent to the solution concentration of the present invention, so as to ensure that the ratio of electrophoretic paint to sand powder is always within a certain range to ensure the adhesion effect of the sand powder.

[0081] Specifically, between steps A and B, the following steps are also included:

[0082] Sense the ionic strength of the solution and adjust the ionic strength to between 0.02-0.2 mol / kg;

[0083] Sensing the viscosity of the solution and adjusting the temperature of the solution according to the value of the viscosity of the solution;

[0084] Get the average concentration and pH value of the solution in the container;

[0085] Match the electric field strength and electrophoresis time according to the average concentration and pH value.

[0086] Ionic strength is one of the core factors affecting electrophoresis. When the ionic strength of the solution is between 0.02-0.2 mol / kg, the efficiency of electrophoresis is the highest. The present invention detects the ionic strength by an instrument, and the detection time is after each electrophoresis is completed, so that it can be adjusted in time when the ionic strength is low. It is usually set to adjust when the ionic strength is between 0.03-0.05 mol / kg to ensure that it will not drop below 0.0.2 mol / kg during the electrophoresis process.

[0087] Solution viscosity is also one of the values ​​that affect electrophoresis. It is related to temperature. That is, when the solution viscosity is high, the solution temperature needs to be increased to ensure the electrophoresis efficiency by increasing the activity of particles at high temperatures. When the solution viscosity decreases, the solution temperature also needs to be appropriately lowered to prevent the particles from being too active and causing the sand powder to adhere to the metal surface unevenly.

[0088] Of course, the average concentration (sand powder) and pH value of the solution are also factors that affect electrophoresis. The average concentration and viscosity have different judgment criteria - the former is only for sand powder, and the latter is for all substances in the solution. The changes in the average concentration and pH value need to be compensated and adjusted by the electric field strength and electrophoresis time.

[0089] That is, the present invention adjusts the corresponding parameters by combining the above-mentioned multiple factors, thereby ensuring that the electrophoresis efficiency is always within the established efficiency and that the electrophoresis time is not too long or too short, thereby ensuring the quality.

[0090] In this embodiment, step B specifically includes:

[0091] B1. Pickle and degrease the metal parts in sequence;

[0092] B2. heating the inconspicuous area of ​​the metal part so that the temperature of the inconspicuous area is higher than the temperature of other areas;

[0093] B3. Immersing the metal part in an etching solution for etching, so that the metal part forms a nano-scale microstructure;

[0094] Wherein, the inconspicuous area is one or more of a bending position, a recessed position, an inner wall, and a hole position of the metal part.

[0095] That is, for the treatment of the surface of the metal part, the present invention forms a nano-scale microstructure on the surface of the metal part by etching, so that the metal part is electrophoretically treated when the surface has a certain degree of roughness to improve the adhesion efficiency of the sand powder. In addition, for the inconspicuous areas, that is, some areas with low adhesion efficiency, in addition to etching, the present invention also requires special heating treatment to increase the temperature of the inconspicuous areas, thereby producing a finer microstructure during etching, and compensating for the problem of difficult adhesion at this position by improving the adhesion efficiency of the inconspicuous areas, and finally achieving that the adhesion efficiency of the inconspicuous areas is basically the same as that of other areas.

[0096] Specifically, step B2 specifically includes:

[0097] Get the current temperature T of the etching solution;

[0098] Heat the metal part to T;

[0099] The inconspicuous area of ​​the metal part is heated again so that the temperature of the inconspicuous area is raised to T', wherein T'=k*T, k is a constant and 1.1≤k≤1.3.

[0100] The etching temperature T is preferably 60-80°C. The metal part is heated to the same temperature as the etching solution before etching, which reduces the time required for heat transfer and helps improve efficiency. For heating of the inconspicuous area, the inconspicuous area is usually heated to 100-150°C by electric heating wire contact, and then the metal part is placed in the etching solution; during the etching process, laser heating can be used to supplement the heat of the inconspicuous area to ensure the heat stability of the inconspicuous area.

[0101] Specifically, step B also includes B4. adjusting the temperature of the metal part according to the current temperature of the solution so that the temperature of the metal part is substantially equal to the current temperature of the solution.

[0102] Specifically, between step B1 and step B2, the following steps are also included:

[0103] Acquire image information of the metal part, and identify the hole position of the metal part from the image information of the metal part;

[0104] Classify each hole position into conductive holes and non-conductive holes, wherein the non-conductive holes are inconspicuous areas;

[0105] The conductive holes are sequentially subjected to coating, exposure and development processes.

[0106] For the hole positions, non-conductive holes need to be electrophoretically processed, while conductive holes do not need to be electrophoretically processed. Therefore, non-conductive holes are inconspicuous areas, while conductive holes need to be masked so that subsequent etching and electrophoresis will not process the inner side walls of the conductive holes.

[0107] In this embodiment, the masking, exposure and development processes are sequentially performed on the conductive holes, specifically including:

[0108] Use a robot to spray a photosensitive film layer on the conductive holes of metal parts;

[0109] The photosensitive film layer is irradiated with ultraviolet rays to expose the photosensitive film layer to form a macromolecular protective layer that is insoluble in a dilute alkaline solution.

[0110] like Figure 2 As shown, a system for executing the present invention is provided in this embodiment, which includes a transmission module 1 and a plurality of lifting modules 7 installed on the transmission module 1, along the transmission direction of the transmission module 1, a primary cleaning module 2, a mask module 3, an etching module 4, an electrophoresis module 5 and a secondary cleaning module 6 are arranged in sequence, wherein the lifting module 7 is used to pick up metal parts and drive the metal parts to rise and fall, and the transmission module 1 is a horizontally arranged ring structure.

[0111] That is, after the lifting module 7 picks up the metal part, the transmission module 1 drives the lifting module 7 to move, so that the metal part passes through the primary cleaning module 2, the mask module 3, the etching module 4, the electrophoresis module 5 and the secondary cleaning module 6 in sequence. Whenever the metal part reaches a module, the lifting module 7 controls the metal part to descend so that the metal part can be processed by the corresponding module; after the processing is completed, the lifting module 7 controls the metal part to ascend.

[0112] That is, through the setting of this system, the effect of automatic execution of the process is achieved. After the corresponding module completes its work, the metal part will be separated from the module, so that the metal part that completes the action faster will wait for the unfinished metal part after the action is separated, ensuring that the metal part will not be over-processed during the waiting process.

[0113] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention is disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent changes and modifications made to the above embodiments according to the technology of the present invention are within the scope of the technical solution of the present invention without departing from the content of the technical solution of the present invention.

Claims

1. A process for attaching sand powder to hardware based on electrophoresis, characterized in that: The following steps are involved: A. Equipped with electrophoresis solution containing sand powder; B. Place the metal part in an electrophoresis solution for electrophoresis treatment, and attach the sand powder to the surface of the metal part by electrophoresis; C. Remove the metal parts from the electrophoretic liquid and then clean the metal parts.

2. The electrophoresis-based sand powder attachment hardware process according to claim 1 is characterized in that: Step A specifically includes: A1. Grinding the sand powder so that the particle size of the sand powder is not greater than a specific value; A2. Put the ground sand powder into the container so that the sand powder is mixed with the solution in the container; A3. Stir the solution so that the sand powder is evenly distributed in the solution; When executing step B, the sand powder concentration of the solution is monitored, and sand powder is supplemented when the sand powder concentration is insufficient.

3. The electrophoresis-based sand powder attachment hardware process according to claim 2 is characterized in that: The sand powder concentration monitoring of the solution specifically includes: After electrophoresis is complete, an image of the container is acquired; Analyze the container image and obtain the sand powder concentration in different areas according to the colors of different areas of the container in the image; The sand powder concentrations in each area are averaged to obtain an average concentration; if the average concentration is not less than the preset concentration, step A3 is performed; if the average concentration is less than the preset concentration, sand powder is added to the solution.

4. The electrophoresis-based sand powder attachment hardware process according to claim 3 is characterized in that: If the average concentration is less than the preset concentration, the solution is supplemented with sand powder, which specifically includes: Acquire the area with low sand powder concentration in the solution according to the image; Add sand powder just above the area with low sand powder concentration; Stirring the solution; Among them, the ratio of the solution concentration after adding sand powder to the preset concentration is 1.3-1.5:

1.

5. The electrophoresis-based sand powder attachment hardware process according to claim 3 is characterized in that: Between steps A and B, it also includes: Sense the ionic strength of the solution and adjust the ionic strength to between 0.02-0.2 mol / kg; Sensing the viscosity of the solution and adjusting the temperature of the solution according to the value of the viscosity of the solution; Get the average concentration and pH value of the solution in the container; Match the electric field strength and electrophoresis time according to the average concentration and pH value.

6. The electrophoresis-based sand powder attachment hardware process according to claim 1 is characterized in that: Step B specifically includes: B1. Pickle and degrease the metal parts in sequence; B2. heating the inconspicuous area of ​​the metal part so that the temperature of the inconspicuous area is higher than the temperature of other areas; B3. Immersing the metal part in an etching solution for etching, so that the metal part forms a nano-scale microstructure; Wherein, the inconspicuous area is one or more of a bending position, a recessed position, an inner wall, and a hole position of the metal part.

7. The electrophoresis-based sand powder attachment hardware process according to claim 6 is characterized in that: Step B2 specifically includes: Get the current temperature T of the etching solution; Heat the metal part to T; The inconspicuous area of ​​the metal part is heated again so that the temperature of the inconspicuous area is raised to T', wherein T'=k*T, k is a constant and 1.1≤k≤1.

3.

8. The electrophoresis-based sand powder attachment hardware process according to claim 6 is characterized in that: Step B also includes B4. adjusting the temperature of the metal part according to the current temperature of the solution so that the temperature of the metal part is substantially equal to the current temperature of the solution.

9. The electrophoresis-based sand powder attachment hardware process according to claim 6, characterized in that: The steps between step B1 and step B2 also include: Acquire image information of the metal part, and identify the hole position of the metal part from the image information of the metal part; Classify each hole position into conductive holes and non-conductive holes, wherein the non-conductive holes are inconspicuous areas; The conductive holes are sequentially subjected to coating, exposure and development processes.

10. The electrophoresis-based sand powder attachment hardware process according to claim 9, characterized in that: The sequentially performing masking, exposure and development processing on the conductive holes specifically includes: Use a robot to spray a photosensitive film layer on the conductive holes of metal parts; The photosensitive film layer is irradiated with ultraviolet rays to expose the photosensitive film layer to form a macromolecular protective layer that is insoluble in a dilute alkaline solution.

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