High-speed temperature measurement circuit and main control board

Abstract

The invention relates to the technical field of infrared temperature measurement, and discloses a high-speed temperature measurement circuit and a main control board, and the high-speed temperature measurement circuit comprises a differential amplification circuit, an analog-to-digital conversion circuit, a temperature detection circuit and an embedded microcontroller. The temperature detection circuit is connected with the embedded microcontroller, and the embedded microcontroller is connected with the analog-to-digital conversion circuit and the differential amplification circuit. According to the embedded microcontroller, the direct memory access module is integrated, data can be directly accessed from the memory, the data transmission speed is increased, and delay is reduced; and meanwhile, the temperature sensor is integrated, and the embedded microcontroller performs real-time temperature compensation according to data of the temperature sensor, so that the influence of environment temperature on a measurement result is reduced.

Description

Technical Field

[0001] The present application relates to the field of infrared temperature measurement technology, and in particular to a high-speed temperature measurement circuit and a main control board. Background Art

[0002] The infrared high-speed temperature measuring board is an electronic device that uses infrared sensing technology to quickly and accurately measure temperature. It is widely used in industrial process control, medical health monitoring, environmental monitoring and other fields. Infrared temperature measurement technology is based on the principle of thermal radiation of objects. Any object with a temperature above absolute zero will radiate infrared rays. The infrared thermometer detects the infrared radiation emitted by the surface of the object and converts it into an electrical signal, and then processes and calculates the temperature of the object. Infrared temperature measurement has the advantages of non-contact, fast response and wide measurement range. The existing infrared high-speed temperature measuring board provides high-precision and fast-response temperature measurement solutions by combining advanced infrared sensing technology, signal conditioning, analog-to-digital conversion, data processing, communication interface and power management technology.

[0003] The current technical disadvantage is the limited response speed. Although it is called a high-speed temperature measurement board, its response speed may still not meet the needs of some extremely fast-changing applications. In addition, many existing systems do not have integrated environmental sensors and cannot monitor and compensate for environmental factors such as temperature and humidity in real time. The measurement accuracy and system stability are greatly affected by environmental changes, resulting in inconsistent measurement results under different environmental conditions, affecting the reliability of the system. Summary of the invention

[0004] The purpose of this application is to provide a high-speed temperature measurement circuit and a main control board, aiming to solve the technical problem that the ambient temperature affects the measurement results in the technical scenario of infrared temperature measurement.

[0005] To achieve the above object, the present application proposes a high-speed temperature measurement circuit, which includes: a differential amplifier circuit, an analog-to-digital conversion circuit, a temperature detection circuit and an embedded microcontroller;

[0006] The temperature detection circuit is connected to the embedded microcontroller, and the embedded microcontroller is connected to the analog-to-digital conversion circuit and the differential amplifier circuit;

[0007] The temperature detection circuit is used to collect the temperature signal of the environment and output the temperature signal to the analog-to-digital conversion circuit through the embedded microcontroller;

[0008] The analog-to-digital conversion circuit is used to convert the temperature signal into a first digital temperature signal, and output the first digital temperature signal to the differential amplifier circuit through the embedded microcontroller;

[0009] The differential amplifier circuit is used to filter out the common mode noise in the first digital temperature signal and amplify it to obtain a target temperature signal.

[0010] In one embodiment, the analog-to-digital conversion circuit includes: a plurality of high-speed analog-to-digital converters;

[0011] Each of the high-speed analog-to-digital converters is connected to the embedded microcontroller respectively;

[0012] The embedded microcontroller is used to transmit the temperature signal to a corresponding high-speed analog-to-digital converter;

[0013] The high-speed analog-to-digital converter is used to convert the temperature signal into a first digital temperature signal;

[0014] The high-speed analog-to-digital converter is also used to output the first digital temperature signal to the differential amplifier circuit through the embedded microcontroller.

[0015] In one embodiment, the differential amplifier circuit includes: a distributor and amplifiers with multiple gain levels;

[0016] The distributors are respectively connected to amplifiers of each gain level, and the amplifiers of each gain level are also respectively connected to the embedded microcontroller;

[0017] The distributor is used to receive the first digital temperature signal and distribute the first digital temperature signal to an amplifier of a corresponding gain level according to the strength of the first digital temperature signal;

[0018] The amplifier is used to filter out common mode noise in the first digital temperature signal to obtain a denoised first digital temperature signal;

[0019] The amplifier is further used to amplify the denoised first digital temperature signal at a corresponding gain level to obtain a target temperature signal.

[0020] In one embodiment, the embedded microcontroller includes: a direct memory access module;

[0021] The direct memory access module is connected to the amplifiers of each gain level;

[0022] The direct memory access module is used to receive the target temperature signal and transmit the target temperature signal to the memory of the embedded microcontroller.

[0023] In one embodiment, the temperature detection circuit is further used to collect a temperature signal of the surface to be measured, and output the temperature signal of the surface to be measured to the analog-to-digital conversion circuit through the embedded microcontroller;

[0024] The analog-to-digital conversion circuit is further used to convert the temperature signal of the surface to be measured into a second digital temperature signal, and output the second digital temperature signal to the differential amplifier circuit through the embedded microcontroller;

[0025] The differential amplifier circuit is further used to filter out the common mode noise in the second digital temperature signal and amplify it to obtain an actual temperature signal;

[0026] The embedded microcontroller is used to dynamically calibrate the actual temperature signal according to the target temperature signal to obtain a calibrated temperature signal.

[0027] In one embodiment, the high-speed temperature measurement circuit further includes: an indication module;

[0028] The indication module is connected to the embedded microcontroller;

[0029] The indicating module is used to indicate the temperature state of the surface of the object to be measured according to the calibration temperature signal.

[0030] In one embodiment, the high-speed temperature measurement circuit further includes: a first communication module and a second communication module;

[0031] The first communication module and the second communication module are respectively connected to the embedded microcontroller;

[0032] The first communication module is used for serial peripheral interface communication with an external device;

[0033] The second communication module is used to provide an asynchronous transmission standard interface to enable the embedded microcontroller to perform data transmission with the external device.

[0034] In one embodiment, the high-speed temperature measurement circuit further includes: an internal power supply module and a voltage output module;

[0035] The internal power supply module is connected to the embedded microcontroller; the voltage output module is connected to the embedded microcontroller;

[0036] The internal power supply module is used to provide the power supply voltage of the high-speed temperature measurement circuit;

[0037] The voltage output module is used to provide an analog voltage corresponding to an external device.

[0038] In one embodiment, the high-speed temperature measurement circuit further includes: an I / O isolation module;

[0039] The I / O isolation module is connected to the embedded microcontroller;

[0040] The I / O isolation module is used to connect to an external device so that the embedded microcontroller can exchange data with the external device.

[0041] In addition, to achieve the above-mentioned purpose, the present application also proposes a main control board, which includes the high-speed temperature measurement circuit as described above.

[0042] The present application proposes a high-speed temperature measurement circuit, which includes: a differential amplifier circuit, an analog-to-digital conversion circuit, a temperature detection circuit and an embedded microcontroller; the temperature detection circuit is connected to the embedded microcontroller, and the embedded microcontroller is connected to the analog-to-digital conversion circuit and the differential amplifier circuit; the temperature detection circuit is used to collect the temperature signal of the environment, and output the temperature signal to the analog-to-digital conversion circuit through the embedded microcontroller; the analog-to-digital conversion circuit is used to convert the temperature signal into a first digital temperature signal, and output the first digital temperature signal to the differential amplifier circuit through the embedded microcontroller; the differential amplifier circuit is used to filter out the common-mode noise in the first digital temperature signal and amplify it to obtain a target temperature signal. The embedded microcontroller in the present application integrates a direct memory access module, which can directly access data from the memory, improve the data transmission speed, and reduce delays; at the same time, a temperature sensor is integrated, and the embedded microcontroller performs real-time temperature compensation according to the data of the temperature sensor, reducing the influence of the ambient temperature on the measurement results. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 This is a module schematic diagram of the first embodiment of the high-speed temperature measurement circuit proposed in this application;

[0044] Figure 2 This is a module schematic diagram of the second embodiment of the high-speed temperature measurement circuit proposed in this application;

[0045] Figure 3 This is a circuit connection diagram of the third embodiment of the high-speed temperature measurement circuit proposed in this application.

[0046] Description of Figure Numbers:

[0047] Label name Label name 100 Temperature detection circuit 310 High-speed analog-to-digital converters 200 Embedded Microcontroller 410 Allocator 300 Analog-to-digital conversion circuit 420 Amplifier 400 Differential amplifier circuit 610 First communication module 500 Indicator module 620 Second communication module 800 I / O Isolation Module 710 Internal power module 210 Direct Memory Access Module 720 Voltage output module DETAILED DESCRIPTION

[0048] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0049] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0050] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0051] In addition, the descriptions of "first", "second", etc. in this application are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0052] Reference Figure 1 , Figure 1 This is a module diagram of the first embodiment of the high-speed temperature measurement circuit proposed in this application. Figure 1 A first embodiment of a high-speed temperature measurement circuit of the present application is provided.

[0053] The high-speed temperature measurement circuit includes: a differential amplifier circuit 400 , an analog-to-digital conversion circuit 300 , a temperature detection circuit 100 and an embedded microcontroller 200 .

[0054] It should be noted that the differential amplifier circuit 400 is used to amplify the weak signal generated by the temperature sensor (such as a thermocouple or a thermistor); the differential amplifier circuit 400 can improve the signal-to-noise ratio of the signal and ensure the stability and accuracy of the signal during transmission and processing. The analog-to-digital conversion circuit 300 (ADC) converts the amplified analog temperature signal into a digital signal so that the embedded microcontroller 200 can process it; the ADC in the STM32 series microcontroller is an important peripheral module that allows the microcontroller to convert analog signals into digital signals for processing. The temperature detection circuit 100 includes a temperature sensor, which is the sensing part of the system, directly in contact with the measured environment, and converts temperature changes into electrical signals; for example, a K-type thermocouple or a Pt1000 platinum thermal resistor is a commonly used temperature sensor. The embedded microcontroller 200 is the core of the high-speed temperature measurement circuit and is responsible for controlling the entire temperature measurement process, including signal reading, data processing, temperature calculation, and user interface interaction.

[0055] The temperature detection circuit 100 is connected to the embedded microcontroller 200 , and the embedded microcontroller 200 is connected to the analog-to-digital conversion circuit 300 and the differential amplifier circuit 400 .

[0056] It should be understood that the output of the temperature sensor is connected to the corresponding input pin of the embedded microcontroller 200. For example, if a DS18B20 digital temperature sensor is used, it only requires one data line (DQ) to be connected to a GPIO pin of the microcontroller and connected to VCC through a pull-up resistor. Configure the pin connected to the temperature sensor as input mode in the programming environment of the embedded microcontroller 200, and make appropriate electrical configurations according to the requirements of the sensor, such as setting it to pull-up or pull-down input. Write code to initialize the input pin of the microcontroller and implement the function of reading temperature sensor data. For digital sensors, it is necessary to implement 1-Wire protocol communication; for analog sensors, it is necessary to configure the ADC (analog-to-digital converter) to read the analog voltage value and convert it into a temperature reading. Upload the code to the microcontroller and debug it to ensure that the temperature data can be read correctly. Test the stability and accuracy of the connection and optimize the circuit if necessary

[0057] The temperature detection circuit 100 is used to collect the temperature signal of the environment and output the temperature signal to the analog-to-digital conversion circuit 300 through the embedded microcontroller 200;

[0058] The analog-to-digital conversion circuit 300 is used to convert the temperature signal into a first digital temperature signal, and output the first digital temperature signal to the differential amplifier circuit 400 through the embedded microcontroller 200 .

[0059] It should be noted that the temperature change causes the sensor to output an electrical signal, which is amplified and processed, converted into a digital signal, and then read by the microcontroller and performs corresponding control or display operations as needed. In this way, the temperature detection circuit 100 can realize real-time monitoring and control of temperature.

[0060] The differential amplifier circuit 400 is used to filter out the common mode noise in the first digital temperature signal and amplify it to obtain a target temperature signal.

[0061] It should be understood that the differential amplifier circuit 400 can effectively suppress common-mode signals, that is, signals that are the same at the two input terminals, which are often caused by power supply noise or electromagnetic interference. Since the differential amplifier circuit 400 amplifies the differential-mode signal (the voltage difference between the two input terminals) and has almost no amplification effect on the common-mode signal, it can suppress noise while amplifying the useful signal.

[0062] It should be noted that in the temperature sensor application, the first digital temperature signal refers to the original analog signal output by the sensor, which may contain common mode noise. The differential amplifier circuit 400 receives this signal and filters out the common mode noise and amplifies the differential mode signal through its high common mode rejection ratio (CMRR) characteristics, so that the amplified signal is purer and closer to the real temperature change signal.

[0063] Furthermore, during the amplification process, the differential amplifier circuit 400 can also provide a certain signal gain, which is particularly important for the subsequent analog-to-digital conversion (ADC) because the ADC has requirements for the amplitude of the input signal. By designing the gain of the differential amplifier circuit 400, it can be ensured that the signal reaches the required amplitude level before the ADC, thereby improving the accuracy and dynamic range of the entire temperature measurement system.

[0064] The present embodiment proposes a high-speed temperature measurement circuit, which includes: a differential amplifier circuit 400, an analog-to-digital conversion circuit 300, a temperature detection circuit 100 and an embedded microcontroller 200; the temperature detection circuit 100 is connected to the embedded microcontroller 200, and the embedded microcontroller 200 is connected to the analog-to-digital conversion circuit 300 and the differential amplifier circuit 400; the temperature detection circuit 100 is used to collect a temperature signal of the environment and output the temperature signal to the analog-to-digital conversion circuit 300 through the embedded microcontroller 200; the analog-to-digital conversion circuit 300 is used to convert the temperature signal into a first digital temperature signal, and output the first digital temperature signal to the differential amplifier circuit 400 through the embedded microcontroller 200; the differential amplifier circuit 400 is used to filter out the common-mode noise in the first digital temperature signal and amplify it to obtain a target temperature signal. The embedded microcontroller 200 in the present application integrates a direct memory access module 210, which can directly access data from the memory, improve the data transmission speed and reduce delay; at the same time, a temperature sensor is integrated, and the embedded microcontroller 200 performs real-time temperature compensation according to the data of the temperature sensor, reducing the impact of ambient temperature on the measurement results.

[0065] Reference Figure 2 , Figure 2 This is a module schematic diagram of the second embodiment of the high-speed temperature measurement circuit proposed in the present application. Based on the first embodiment of the high-speed temperature measurement circuit mentioned above, the second embodiment of the high-speed temperature measurement circuit of the present application is proposed.

[0066] The analog-to-digital conversion circuit 300 includes: a plurality of high-speed analog-to-digital converters 310;

[0067] Each of the high-speed analog-to-digital converters 310 is connected to the embedded microcontroller 200 .

[0068] It should be noted that the analog-to-digital conversion circuit 300 includes multiple high-speed analog-to-digital converters 310 (ADCs), which are used to convert analog signals into digital signals for processing by the embedded microcontroller 200 or digital signal processor (DSP). Each high-speed analog-to-digital converter 310 needs to be connected to the embedded microcontroller 200 in order to obtain the converted digital data in real time.

[0069] The embedded microcontroller 200 is used to transmit the temperature signal to the corresponding high-speed analog-to-digital converter 310 .

[0070] It should be understood that after reading the analog signal of the temperature sensor, the embedded microcontroller 200 needs to amplify and condition the signal to facilitate accurate reading by the analog-to-digital converter (ADC).

[0071] The high-speed analog-to-digital converter 310 is used to convert the temperature signal into a first digital temperature signal;

[0072] The high-speed analog-to-digital converter 310 is further configured to output the first digital temperature signal to the differential amplifier circuit 400 via the embedded microcontroller 200 .

[0073] It should be noted that the high-speed analog-to-digital converter 310 is used to convert the analog signal output by the temperature sensor into a digital signal so that the embedded microcontroller 200 can further process it. In temperature signal processing, the speed and accuracy of the ADC directly affect the real-time and accuracy of temperature measurement. For example, some high-performance ADCs can provide high resolution and fast data acquisition rate, which is particularly important for applications that require high accuracy and fast response.

[0074] It should be understood that in practical applications, the combination of the embedded microcontroller 200 and the high-speed ADC can implement complex temperature control strategies, such as PID control algorithms, and advanced data processing techniques, such as noise suppression and filtering, to improve the reliability of temperature measurement.

[0075] The differential amplifier circuit 400 includes: a distributor 410 and an amplifier 420 with multiple gain levels;

[0076] The distributor 410 is respectively connected to the amplifiers 420 of each gain level, and the amplifiers 420 of each gain level are also respectively connected to the embedded microcontroller 200 .

[0077] It should be understood that the distributor 410 can ensure that the signal is evenly distributed to each amplifier 420, and the amplifiers 420 with multiple gain levels can gradually increase the amplitude of the signal according to the characteristics and amplification requirements of the signal until the input requirements of the embedded microcontroller 200 are met. By integrating the high-precision amplifiers 420 of x1000, x100 and x10, weak signals can be effectively amplified to ensure that the signal does not lose details during transmission and processing, thereby improving measurement accuracy.

[0078] The distributor 410 is used to receive the first digital temperature signal and distribute the first digital temperature signal to the amplifier 420 of the corresponding gain level according to the strength of the first digital temperature signal.

[0079] It should be noted that the distributor 410 first receives digital signals from the temperature sensor through its communication interface. These signals contain temperature data, as well as the serial number and other diagnostic information of the sensor. The microprocessor or digital signal processor (DSP) inside the distributor 410 will parse these signals and route them to the correct output channel according to the preset configuration.

[0080] The amplifier 420 is used to filter out the common mode noise in the first digital temperature signal to obtain a denoised first digital temperature signal;

[0081] The amplifier 420 is further configured to amplify the denoised first digital temperature signal at a corresponding gain level to obtain a target temperature signal.

[0082] It should be understood that the circuit parameters, such as feedback resistor and input impedance, are adjusted according to the required amplification factor and the characteristics of the temperature signal to obtain the best amplification effect and noise performance; filters are added to the amplifier circuit to remove high-frequency noise and other unwanted signal components. The appropriate cutoff frequency is selected to ensure that the filter only allows the temperature signal to pass; the amplifier circuit is tested in actual applications and calibrated as needed to ensure that the temperature signal is accurately amplified and the common-mode noise is effectively filtered out.

[0083] The embedded microcontroller 200 includes: a direct memory access module 210;

[0084] The direct memory access module 210 is connected to the amplifiers 420 of each gain level;

[0085] The direct memory access module 210 is used to receive the target temperature signal and transmit the target temperature signal to the memory of the embedded microcontroller 200 .

[0086] It should be noted that the direct memory access (DMA) module is one of the very important functions in the embedded microcontroller 200, which allows the peripherals to exchange data directly with the memory without the intervention of the central processing unit (CPU). This can greatly improve the data processing speed and reduce the burden on the CPU. The DMA module can be configured with multiple channels, each of which can independently manage the data transfer between the peripherals and the memory. It supports multiple transmission modes, including single transmission, continuous transmission, cyclic transmission, etc. In addition, DMA can also configure the size of the data (8 bits, 16 bits or 32 bits), as well as the incremental mode of the pointer, to determine whether the source address and the target address are automatically updated during the transmission process. When the peripheral is ready for data, it sends a transfer request to the DMA controller. The DMA controller responds to this request, reads data from the peripheral according to the preset configuration, and writes the data to the memory, or vice versa. During the transmission process, the CPU can perform other tasks, thereby improving the concurrent processing capability of the system. Using DMA can significantly improve data throughput, especially when high-speed peripherals such as network interfaces, USB controllers, ADC converters, etc. interact with the memory. In addition, DMA can also reduce the interrupt frequency of the CPU, reduce the latency of the system, and make real-time applications more reliable.

[0087] Furthermore, the temperature detection circuit 100 is also used to collect the temperature signal of the surface to be measured, and output the temperature signal of the surface to be measured to the analog-to-digital conversion circuit 300 through the embedded microcontroller 200;

[0088] The analog-to-digital conversion circuit 300 is further used to convert the temperature signal of the surface to be measured into a second digital temperature signal, and output the second digital temperature signal to the differential amplifier circuit 400 through the embedded microcontroller 200;

[0089] The differential amplifier circuit 400 is also used to filter out the common mode noise in the second digital temperature signal and amplify it to obtain an actual temperature signal.

[0090] It should be understood that through multi-point calibration and environmental monitoring, high-speed temperature measurement circuits can dynamically adjust measurement parameters to adapt to different operating conditions and improve measurement accuracy. Multi-point calibration refers to the process of calibrating the measuring device at multiple different reference points, which can more comprehensively compensate for the nonlinear errors of the sensor under different conditions, thereby improving the accuracy and stability of the calibration. Environmental monitoring involves real-time tracking of environmental factors such as temperature, humidity, and air pressure, which can affect the performance of the measuring device.

[0091] The embedded microcontroller 200 is used to dynamically calibrate the actual temperature signal according to the target temperature signal to obtain a calibrated temperature signal.

[0092] It should be understood that a suitable temperature sensor, such as an NTC thermistor or the temperature sensor built into the STM32, is selected and integrated into the microcontroller system. A target temperature value is set in the microcontroller program, and this value will be used as a reference point for calibration. The analog signal of the temperature sensor is read using the analog-to-digital conversion circuit 300 and converted into a digital signal for processing by the embedded microcontroller 200. Program code is written to implement a dynamic calibration algorithm. The algorithm will be adjusted based on the difference between the actual temperature signal and the target temperature signal to dynamically compensate for the nonlinear error or drift of the temperature sensor. After being processed by the dynamic calibration algorithm, the microcontroller will output a calibrated temperature signal. This signal is closer to the actual temperature value and reduces the system error. The response and accuracy of the system are tested in a real environment, and the calibration algorithm is optimized based on the test results to ensure that the system can maintain high-precision temperature measurement under different conditions.

[0093] The high-speed temperature measurement circuit further includes: an indication module 500;

[0094] The indication module 500 is connected to the embedded microcontroller 200;

[0095] The indicating module 500 is used to indicate the temperature state of the surface of the object to be measured according to the calibration temperature signal.

[0096] It should be noted that in the high-speed temperature measurement circuit, the main function of the indicator module 500 is to display the temperature reading in real time so that the operator or the monitoring system can intuitively understand the current temperature status. The indicator module 500 includes a digital display screen or a pointer instrument, which can convert the analog signal detected by the temperature sensor into a numerical value or graphical representation that is easy for the user to understand. In addition, the indicator module 500 may also have an alarm function. When the temperature exceeds the preset safety range, it can remind the user to take corresponding measures through sound, light or other signals. In some advanced temperature measurement systems, the indicator module 500 may also be integrated with a communication interface, which can send temperature data to a remote monitoring center or connect to other smart devices to realize remote reading and control of data.

[0097] In this embodiment, by integrating high-precision differential signal acquisition amplifier 420 (such as x1000, x100, x10 amplifier 420) and high-speed AD sampling analog-to-digital conversion module, the accuracy and signal-to-noise ratio of signal acquisition are effectively improved. The differential amplifier 420 design can effectively suppress common-mode noise and improve signal quality. A multi-channel parallel processing architecture is also adopted, and multiple amplifier 420 modules and AD conversion modules can process multiple signals at the same time. MCU and DMA controller also support multi-channel data transmission and processing, thereby significantly improving the efficiency and response speed of data processing. The DMA module can access data directly from the memory, improve the data transmission speed, and reduce delays. And integrated high-speed communication interface (such as SPI, RS232), can quickly transmit a large amount of data, further improving the real-time and response speed of the system. A temperature sensor is also integrated, and the MCU can perform real-time temperature compensation according to the data of the temperature sensor to reduce the influence of ambient temperature on the measurement results. Through multi-point calibration and environmental monitoring, the system can dynamically adjust the measurement parameters, adapt to different environmental conditions, and improve the stability and reliability of the measurement.

[0098] Reference Figure 3 , Figure 3 This is a circuit connection diagram of the third embodiment of the high-speed temperature measurement circuit proposed in this application. Based on the first and second embodiments of the high-speed temperature measurement circuit mentioned above, the third embodiment of the high-speed temperature measurement circuit of this application is proposed.

[0099] The high-speed temperature measurement circuit further includes: a first communication module 610 and a second communication module 620;

[0100] The first communication module 610 and the second communication module 620 are respectively connected to the embedded microcontroller 200;

[0101] The first communication module 610 is used for performing serial peripheral interface communication with an external device.

[0102] It should be noted that, in the high-speed temperature measurement circuit, the main function of the first communication module 610 is to communicate data with the main controller or other devices. This module integrates high-speed data processing capabilities so that temperature data can be transmitted in a timely and accurate manner.

[0103] The second communication module 620 is used to provide an asynchronous transmission standard interface to enable the embedded microcontroller 200 to perform data transmission with the external device.

[0104] It should be understood that Universal Asynchronous Receiver / Transmitter (UART) communication is a widely used serial communication protocol. It allows asynchronous data exchange between two devices, meaning that a common clock signal is not required to send and receive data. UART communication is used for communication between microcontrollers, computers, and various peripherals, such as serial printers, modems, and sensors. In UART communication, data is sent in serial form, that is, multiple bits of data are serialized and sent one by one. Each data frame includes a start bit, data bits, an optional check bit, and a stop bit. The start bit is a logic low level used to mark the beginning of the data frame, while the stop bit is a logic high level used to mark the end of the data frame. The number of data bits can be configured as needed, and 7, 8, or 9 bits are common. The check bit is used for error detection, and modes such as no check, odd check, or even check can be selected.

[0105] The high-speed temperature measurement circuit further includes: an internal power supply module 710 and a voltage output module 720;

[0106] The internal power supply module 710 is connected to the embedded microcontroller 200; the voltage output module 720 is connected to the embedded microcontroller 200;

[0107] The internal power supply module 710 is used to provide the power supply voltage of the high-speed temperature measurement circuit.

[0108] It should be understood that the main function of the internal power module 710 in the high-speed temperature measurement circuit is to provide a stable power supply. It contains a voltage stabilizer and a filter circuit to ensure that each part of the circuit obtains the required voltage level and maintains the voltage stability during the operation of the circuit. This stability is particularly important for high-speed temperature measurement, because the temperature sensor and related electronic components are very sensitive to fluctuations in the power supply voltage, and voltage fluctuations may cause measurement errors.

[0109] The voltage output module 720 is used to provide an analog voltage corresponding to an external device.

[0110] It should be noted that the role of the voltage output module 720 in the high-speed temperature measurement circuit is to convert the signal of the temperature sensor into a voltage signal for subsequent amplification, processing and reading. This module usually includes a signal conditioning circuit, such as an operational amplifier 420 and a filter, which work together to ensure that the temperature signal is accurately converted into a voltage output. The design of the voltage output module 720 must ensure high accuracy and fast response to meet the requirements of high-speed temperature measurement.

[0111] The high-speed temperature measurement circuit further includes: an I / O isolation module 800;

[0112] The I / O isolation module 800 is connected to the embedded microcontroller 200;

[0113] The I / O isolation module 800 is used to connect to an external device so that the embedded microcontroller 200 can exchange data with the external device.

[0114] It should be understood that in the high-speed temperature measurement circuit, the main functions of the I / O isolation module 800 include:

[0115] Electrical Isolation: The I / O Isolation Module 800 provides electrical isolation between input and output, which helps protect sensitive microprocessors or digital circuits from damage caused by high voltage or current surges. This isolation is usually achieved by using optocouplers or transformers, ensuring that even if a fault occurs on the input, it will not affect the output and the rest of the system.

[0116] Improve signal integrity: In high-speed data transmission, signals may be subject to electromagnetic interference, resulting in data errors. The I / O Isolation Module 800 can reduce this interference through isolation, maintaining signal clarity and integrity, which is especially important for accurate temperature measurement.

[0117] Enhanced system stability: By isolating potential sources of failure, the I / O Isolation Module 800 helps improve overall system stability and reliability. This means the system is less likely to crash due to the failure of a single component, thus extending the life of the system.

[0118] Support multiple communication protocols: Modern I / O isolation modules 800 usually support multiple communication protocols, such as RS-485, RS-232, etc., which makes them easily integrated into existing industrial automation systems and communicate with various control devices.

[0119] Provide flexible configuration options: Users can program and set the module's address, baud rate and other parameters as needed, which provides a high degree of flexibility to adapt to different application scenarios and system requirements.

[0120] In summary, the application of the I / O isolation module 800 in the high-speed temperature measurement circuit not only improves the safety and stability of the circuit, but also optimizes the signal transmission quality and ensures the accuracy and reliability of the temperature measurement data.

[0121] In this embodiment, the high-speed temperature measurement circuit is designed with a variety of I / O interfaces and communication interfaces (such as SPI, RS232), supporting multiple functions such as query longitude and latitude response IO, timing response processing IO, interrupt response processing IO, laser synchronous drive IO, material delivery step linkage IO, etc., which is suitable for complex industrial control applications. In addition, the modular design makes the system have good scalability and is easy to maintain and upgrade. The internal power supply module 710 provides various power supply voltages required by the system, including +3V / 2.5V, positive and negative 12V, 3.3V and 2.5V reference voltages; the voltage output module 720 provides analog voltage output for driving external devices. At the same time, the various functional modules are connected through a high-speed bus, which reduces the bottleneck of data transmission and improves the data processing efficiency of the overall system.

[0122] In addition, to achieve the above-mentioned purpose, the present application also proposes a main control board, which includes the high-speed temperature measurement circuit as described above; since the main control board adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here one by one.

[0123] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or system including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or system. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or system including the element.

[0124] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A high-speed temperature measurement circuit, characterized in that: The high-speed temperature measurement circuit includes: a differential amplifier circuit, an analog-to-digital conversion circuit, a temperature detection circuit and an embedded microcontroller; The temperature detection circuit is connected to the embedded microcontroller, and the embedded microcontroller is connected to the analog-to-digital conversion circuit and the differential amplifier circuit; The temperature detection circuit is used to collect the temperature signal of the environment and output the temperature signal to the analog-to-digital conversion circuit through the embedded microcontroller; The analog-to-digital conversion circuit is used to convert the temperature signal into a first digital temperature signal, and output the first digital temperature signal to the differential amplifier circuit through the embedded microcontroller; The differential amplifier circuit is used to filter out the common mode noise in the first digital temperature signal and amplify it to obtain a target temperature signal.

2. The high-speed temperature measurement circuit according to claim 1, characterized in that: The analog-to-digital conversion circuit includes: a plurality of high-speed analog-to-digital converters; Each of the high-speed analog-to-digital converters is connected to the embedded microcontroller respectively; The embedded microcontroller is used to transmit the temperature signal to a corresponding high-speed analog-to-digital converter; The high-speed analog-to-digital converter is used to convert the temperature signal into a first digital temperature signal; The high-speed analog-to-digital converter is also used to output the first digital temperature signal to the differential amplifier circuit through the embedded microcontroller.

3. The high-speed temperature measurement circuit according to claim 1, characterized in that: The differential amplifier circuit comprises: a distributor and amplifiers of multiple gain levels; The distributors are respectively connected to amplifiers of each gain level, and the amplifiers of each gain level are also respectively connected to the embedded microcontroller; The distributor is used to receive the first digital temperature signal and distribute the first digital temperature signal to an amplifier of a corresponding gain level according to the strength of the first digital temperature signal; The amplifier is used to filter out common mode noise in the first digital temperature signal to obtain a denoised first digital temperature signal; The amplifier is further used to amplify the denoised first digital temperature signal at a corresponding gain level to obtain a target temperature signal.

4. The high-speed temperature measurement circuit according to claim 3, characterized in that: The embedded microcontroller includes: a direct memory access module; The direct memory access module is connected to the amplifiers of each gain level; The direct memory access module is used to receive the target temperature signal and transmit the target temperature signal to the memory of the embedded microcontroller.

5. The high-speed temperature measurement circuit according to claim 1, characterized in that: The temperature detection circuit is further used to collect the temperature signal of the surface to be measured, and output the temperature signal of the surface to be measured to the analog-to-digital conversion circuit through the embedded microcontroller; The analog-to-digital conversion circuit is further used to convert the temperature signal of the surface to be measured into a second digital temperature signal, and output the second digital temperature signal to the differential amplifier circuit through the embedded microcontroller; The differential amplifier circuit is further used to filter out the common mode noise in the second digital temperature signal and amplify it to obtain an actual temperature signal; The embedded microcontroller is used to dynamically calibrate the actual temperature signal according to the target temperature signal to obtain a calibrated temperature signal.

6. The high-speed temperature measurement circuit according to claim 5, characterized in that: The high-speed temperature measurement circuit also includes: an indication module; The indication module is connected to the embedded microcontroller; The indicating module is used to indicate the temperature state of the surface of the object to be measured according to the calibration temperature signal.

7. The high-speed temperature measurement circuit according to claim 1, characterized in that: The high-speed temperature measurement circuit also includes: a first communication module and a second communication module; The first communication module and the second communication module are respectively connected to the embedded microcontroller; The first communication module is used for serial peripheral interface communication with an external device; The second communication module is used to provide an asynchronous transmission standard interface to enable the embedded microcontroller to perform data transmission with the external device.

8. The high-speed temperature measurement circuit according to claim 1, characterized in that: The high-speed temperature measurement circuit also includes: an internal power supply module and a voltage output module; The internal power supply module is connected to the embedded microcontroller; the voltage output module is connected to the embedded microcontroller; The internal power supply module is used to provide the power supply voltage of the high-speed temperature measurement circuit; The voltage output module is used to provide an analog voltage corresponding to an external device.

9. The high-speed temperature measurement circuit according to claim 1, characterized in that: The high-speed temperature measurement circuit also includes: an I / O isolation module; The I / O isolation module is connected to the embedded microcontroller; The I / O isolation module is used to connect to an external device so that the embedded microcontroller can exchange data with the external device.

10. A main control board, characterized in that: The main control board includes a high-speed temperature measurement circuit as claimed in any one of claims 1 to 9.

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