Wafer Mark area detection method and system

Abstract

The invention provides a wafer Mark area detection method and system, and belongs to the field of semiconductors. The wafer Mark area detection method comprises the steps that a wafer GDS form file is provided to confirm a detected Mark area, and the Mark area is provided with a pattern to be detected. And performing screenshot on the Mark area, and extracting a contour line of the pattern. And obtaining the similarity between the contour line and the pattern in the GDS-form file, and outputting a comparison result. And setting a threshold value of similarity comparison, if the output comparison result is within the threshold value range, outputting the Mark region detection result as OK, and if the output comparison result is not within the threshold value range, outputting the Mark region detection result as NG. According to the method, the contour line of the Mark area screenshot is extracted, so that the Mark area screenshot can be converted into the GDS-form file, then the contour line pattern of the extracted Mark area screenshot can be aligned and zoomed, the Mark area screenshot file is directly compared with the GDS-form pattern, and the effects of reducing the inspection time and improving the inspection efficiency are achieved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a method and system for detecting a wafer Mark area. Background Art

[0002] When manufacturing the mask, each module will be placed on the cutting path as part of the GDS format file to monitor the process test key (TSK) for monitoring and measuring various parameters in the manufacturing process. Before manufacturing the mask, the mask company will provide a data file for inspection. Taking the JDV inspection of the lithography mask as an example, a fully manual method is currently used to check whether the Mark area exists and whether the position of the Mark area is accurate. In actual operation, first, open the step form file and find the coordinates corresponding to the Mark area. Then, log in to the Job Deck View (JDV) software and find the corresponding Mark area through the JDV software. Finally, complete the relevant measurements of the Mark area and save the screenshot. If there is a critical dimension (such as line width) inspection of the mask in the semiconductor structure layer being inspected, it will take an engineer about 2 hours to complete it. Therefore, it takes a lot of manpower and time, and the inspection efficiency is low.

[0003] To improve inspection efficiency, Figure 2 As shown in the figure, the existing technology first logs in to the JDV software system. Then, the coordinates are converted through the existing python applet. Then, the existing python applet automatically inputs the coordinates and takes screenshots in sequence. Finally, a screenshot file is generated, and the engineer makes a second judgment on whether each JDV inspection result is correct. Although this JDV inspection method can realize automatic coordinate conversion and JDV automatic screenshot. However, the generated screenshot file is as follows Figure 3 The image format is shown, but it still cannot be used with Figure 2 The image in the GDS format file shown is directly compared, and the engineer still needs to re-check whether the image is the required mark area. Therefore, there is also the problem of long inspection time and low efficiency.

[0004] It should be noted that the information disclosed in the background technology section of the invention is only intended to deepen the understanding of the general background technology of the invention, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Summary of the invention

[0005] The object of the present invention is to provide a method and system for detecting the Mark area of ​​a wafer, so as to solve the problem that the inspection of the Mark area has a long inspection time and low efficiency.

[0006] In order to solve the above technical problems, the present invention provides a method for detecting a wafer Mark area, comprising:

[0007] Providing a wafer GDS format file to confirm the Mark area to be inspected, wherein the Mark area has a pattern to be inspected;

[0008] Take a screenshot of the Mark area and extract the outline of the pattern;

[0009] Get the similarity between the contour line and the pattern in the GDS format file, and output the comparison result;

[0010] Set the threshold for similarity comparison. If the output comparison result is within the threshold range, the Mark area detection result is output as OK. If the output comparison result is not within the threshold range, the Mark area detection result is output as NG.

[0011] Preferably, providing a wafer GDS format file to confirm the Mark area to be inspected includes:

[0012] Providing a wafer GDS format file, wherein the GDS format file has the coordinates of the Mark area to be detected;

[0013] Based on the coordinates of the Mark area, the detected Mark area is confirmed.

[0014] Preferably, the wafer includes a plurality of Mark areas to be detected.

[0015] Preferably, the pattern to be inspected includes an alignment mark, a test key, a process control mark, a defect mark, and a critical dimension mark.

[0016] Preferably, the step of taking a screenshot of the Mark area and extracting the outline of the pattern comprises:

[0017] Log in to JDV software and find the Mark area according to the coordinates of the Mark area in the GDS format file;

[0018] The coordinates of the Mark area are converted, and the Mark area after the coordinate conversion is automatically captured.

[0019] Preferably, the Mark area is automatically captured by an automatic screenshot module in a Python program.

[0020] Preferably, after taking a screenshot of the Mark area and extracting the outline of the pattern, the outline is in the form of a GDS file.

[0021] Preferably, the threshold for setting the similarity comparison includes:

[0022] A threshold value of similarity between the extracted contour line and the pattern in the Mark area in the GDS format file is set to 0.8 to 0.9.

[0023] Preferably, the similarity between the contour line and the pattern in the GDS format file is obtained through the JDV software system, and the comparison result is output, and the threshold for the similarity comparison is set. If the output comparison result is within the threshold range, the Mark area detection result is output as OK. If the output comparison result is not within the threshold range, the Mark area detection result is output as NG.

[0024] Based on the same inventive concept, the present invention also provides a wafer Mark area detection system, comprising:

[0025] An acquisition module is used to provide a wafer GDS format file to confirm the Mark area to be detected, wherein the Mark area has a pattern to be detected;

[0026] Screenshot module, used to screenshot the Mark area and extract the outline of the pattern;

[0027] The comparison module is used to obtain the similarity between the contour line and the pattern in the GDS format file and output the comparison result; set the threshold for the similarity comparison. If the output comparison result is within the threshold range, the Mark area detection result is output as OK; if the output comparison result is not within the threshold range, the Mark area detection result is output as NG.

[0028] Compared with the prior art, the wafer Mark area detection method of the present invention has the following advantages:

[0029] The present invention can convert the Mark area screenshot into a GDS format file by extracting the contour line of the Mark area screenshot, and then can align and scale the contour line pattern of the extracted Mark area screenshot, so that the Mark area screenshot file can be directly compared with the GDS format pattern, which reduces the inspection time and improves the inspection efficiency.

[0030] The wafer Mark area detection system provided by the present invention and the wafer Mark area detection method provided by the present invention belong to the same inventive concept. Therefore, the wafer Mark area detection system provided by the present invention has at least all the advantages of the wafer Mark area detection method provided by the present invention, and can reduce the inspection time and improve the inspection efficiency when detecting whether the wafer Mark area exists and whether the position of the Mark area is correct. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic diagram of a process of automatically taking screenshots of a Mark area in one embodiment;

[0032] Figure 2 is a Mark area image of a GDS format file in one embodiment of the present invention;

[0033] Figure 3 is a Mark area image captured by a Python program in one embodiment of the present invention;

[0034] Figure 4 It is a flow chart of a method for detecting a wafer mark area in one embodiment of the present invention. DETAILED DESCRIPTION

[0035] In order to make the purpose, advantages and features of the present invention clearer, the detection method and system of the wafer Mark area proposed in the present invention are further described in detail in combination with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. It should be understood that the drawings in the specification do not necessarily show the specific structure of the present invention in proportion, and the illustrative features used to illustrate certain principles of the present invention in the drawings in the specification will also adopt a slightly simplified drawing method. The specific design features of the present invention disclosed herein include, for example, specific dimensions, directions, positions and shapes, which will be determined in part by the specific application and use environment. And, in the embodiments described below, sometimes the same figure mark is used in common between different drawings to represent the same part or a part with the same function, and its repeated description is omitted. In this specification, similar numbers and letters are used to represent similar items, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0037] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0038] In the prior art, when detecting whether the wafer Mark area exists and whether the position of the Mark area is correct, since the Mark area screenshot is an image text and cannot be directly compared with the GDS format file, engineers need to perform manual inspection. Therefore, there are problems of long inspection time and low inspection efficiency.

[0039] The core idea of ​​the present invention is to provide a method for detecting the wafer Mark area, which can convert the Mark area screenshot into a GDS format file, so that the Mark area screenshot file can be directly compared with the GDS format pattern, thereby achieving the purpose of reducing inspection time and improving inspection efficiency.

[0040] In order to realize the above idea, the present invention provides a method for detecting the wafer Mark area. Figures 1 to 4 A specific implementation of a wafer mark area detection method disclosed herein includes the following steps S1 to S4.

[0041] Step S1: providing a wafer GDS format file to confirm the Mark area to be inspected, wherein the Mark area has a pattern to be inspected.

[0042] Specifically, refer to Figure 4As shown, a wafer GDS format file is provided, and the GDS format file is a standard format for storing geometric layout data of integrated circuits and other microelectronic devices. In mask manufacturing, designers use GDS files to define all features on the chip, including structures for testing purposes, such as Mark areas, etc. The wafer includes multiple Mark areas to be detected. The patterns to be detected in the Mark area include but are not limited to alignment marks, test keys, process control marks, defect marks, and critical dimension marks. A wafer GDS format file is provided, and the GDS format file has the coordinates of the Mark area to be detected. Based on the coordinates of the Mark area, the Mark area to be detected is confirmed, so that it is possible to confirm whether the Mark area to be detected in the wafer exists.

[0043] Step S2: Take a screenshot of the Mark area and extract the outline of the pattern.

[0044] Specifically, refer to Figure 3 and Figure 4 As shown, the Mark area is screenshotted and the outline of the pattern is extracted, including: first, log in to the JDV software, and find the Mark area according to the coordinates of the Mark area in the GDS format file. Log in to the JDV software system through the provided GDS format file, and find the Mark area according to the coordinates of the Mark area in the GDS format file.

[0045] Next, the Mark area coordinates are converted, and the Mark area after the coordinate conversion is automatically screenshotted. Next, the coordinates of the Mark area are converted by a Python program. And the Mark area is automatically screenshotted by the Python program to obtain an image of the Mark area in a picture format. Then, the outline of the pattern to be detected in the image is extracted to form a file in the form of GDS. It should be noted that converting the coordinates of the Mark area by a Python program and automatically screenshotting the Mark area by a Python program are prior arts, and those skilled in the art are already familiar with the specific steps and principles thereof.

[0046] Step S3: Obtain the similarity between the contour line and the pattern in the GDS format file, and output the comparison result.

[0047] Specifically, refer to Figure 4 As shown, the JDV software system compares the contour line with the pattern in the GDS format file, obtains the similarity between the contour line and the pattern in the GDS format file, and outputs the comparison result.

[0048] Step S4: Set a threshold for the similarity comparison. If the output comparison result is within the threshold range, the Mark area detection result is output as OK. If the output comparison result is not within the threshold range, the Mark area detection result is output as NG.

[0049] Specifically, refer to Figure 4 As shown, the JDV software system is used to set the threshold for similarity comparison, make comparison judgments, and output JDV test results. For example, engineers can set the threshold to 0.8-0.9. When the output comparison result is within the threshold range, the Mark area test result is output as OK. If the output comparison result is not within the threshold range, the Mark area test result is output as NG. It should be noted that when the similarity is 1, the contour line is exactly the same as the pattern in the GDS format file. When the similarity is less than the set minimum value of 0.8, the contour line is inconsistent with the pattern part in the GDS format file. This indicates that there is a problem with the photolithography pattern and it needs to be remade.

[0050] In this embodiment, the Mark area screenshot is converted into a GDS format file by extracting the contour line of the Mark area screenshot, so that the contour line pattern of the extracted Mark area screenshot can be aligned and scaled, so that the Mark area screenshot file can be directly compared with the GDS format pattern, which reduces the inspection time and improves the inspection efficiency.

[0051] To realize the above idea, this embodiment also discloses a wafer Mark area detection system, including: an acquisition module, used to provide a wafer GDS format file to confirm the Mark area to be detected, and the area where the Mark area is located has a pattern. A screenshot module, used to screenshot the Mark area and extract the contour line of the pattern. A comparison module, used to obtain the similarity between the contour line and the pattern in the GDS format file, and output the comparison result; set a threshold for the similarity comparison, if the output comparison result is within the threshold range, the Mark area detection result is output as OK, if the output comparison result is not within the threshold range, the Mark area detection result is output as NG.

[0052] The wafer Mark area detection system provided in this embodiment and the wafer Mark area detection method provided in this embodiment belong to the same inventive concept. Therefore, the wafer Mark area detection system provided in this embodiment has at least all the advantages of the wafer Mark area detection method provided in this embodiment, and can reduce the inspection time and improve the inspection efficiency when detecting whether the wafer Mark area exists and whether the position of the wafer Mark area is correct.

[0053] In summary, the above embodiments have described in detail the different configurations of the wafer Mark area detection method and system. Of course, the above description is only a description of the preferred embodiments of the present invention, and is not any limitation to the scope of the present invention. The present invention includes but is not limited to the configurations listed in the above implementations. Those skilled in the art can draw inferences based on the contents of the above embodiments. Any changes and modifications made by ordinary technicians in the field of the present invention based on the above disclosure are within the scope of protection of the claims.

Claims

1. A method for detecting a wafer Mark area, characterized in that: include: Providing a wafer GDS format file to confirm the Mark area to be inspected, wherein the Mark area has a pattern to be inspected; Take a screenshot of the Mark area and extract the outline of the pattern; Get the similarity between the contour line and the pattern in the GDS format file, and output the comparison result; Set the threshold for similarity comparison. If the output comparison result is within the threshold range, the Mark area detection result is output as OK. If the output comparison result is not within the threshold range, the Mark area detection result is output as NG.

2. The wafer Mark area detection method according to claim 1, characterized in that: The provision of a wafer GDS format file to confirm that the Mark area to be inspected includes: Providing a wafer GDS format file, wherein the GDS format file has the coordinates of the Mark area to be detected; Based on the coordinates of the Mark area, the detected Mark area is confirmed.

3. The wafer Mark area detection method according to claim 1, characterized in that: The wafer includes a plurality of Mark areas to be inspected.

4. The method for detecting wafer Mark area according to claim 1, characterized in that: The patterns to be inspected include alignment marks, test keys, process control marks, defect marks, and critical dimension marks.

5. The method for detecting wafer Mark area according to claim 1, characterized in that: The step of taking a screenshot of the Mark area and extracting the outline of the pattern includes: Log in to JDV software and find the Mark area according to the coordinates of the Mark area in the GDS format file; The coordinates of the Mark area are converted, and the Mark area after the coordinate conversion is automatically captured.

6. The method for detecting wafer Mark area according to claim 5, characterized in that: The Mark area is automatically captured by the automatic screenshot module in the Python program.

7. The method for detecting wafer Mark areas according to claim 1, characterized in that: After the Mark area is screenshotted and the outline of the pattern is extracted, the outline is in the form of a GDS file.

8. The method for detecting wafer Mark areas according to claim 1, characterized in that: The threshold for setting the similarity comparison includes: A threshold value of similarity between the extracted contour line and the pattern in the Mark area in the GDS format file is set to 0.8 to 0.

9.

9. The method for detecting wafer Mark area according to claim 1, characterized in that: The JDV software system is used to obtain the similarity between the contour line and the pattern in the GDS format file, and the comparison result is output, and the threshold value of the similarity comparison is set. If the output comparison result is within the threshold range, the Mark area detection result is output as OK. If the output comparison result is not within the threshold range, the Mark area detection result is output as NG.

10. A wafer mark area detection system, characterized in that: include: An acquisition module is used to provide a wafer GDS format file to confirm the Mark area to be detected, wherein the Mark area has a pattern to be detected; Screenshot module, used to screenshot the Mark area and extract the outline of the pattern; The comparison module is used to obtain the similarity between the contour line and the pattern in the GDS format file and output the comparison result; Set the threshold for similarity comparison. If the output comparison result is within the threshold range, the Mark area detection result is output as OK. If the output comparison result is not within the threshold range, the Mark area detection result is output as NG.

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