Double-sided vacuum film pressing device and double-sided vacuum film pressing method

Abstract

The invention provides a double-sided vacuum film pressing device. The double-sided vacuum film pressing device comprises an upper cavity, a lower cavity, an upper film pressing piece, a lower film pressing piece and a substrate bearing mechanism, the lower cavity is arranged corresponding to the upper cavity. The upper film pressing piece is movably arranged in the upper cavity. The lower film pressing piece is movably arranged in the lower cavity. The substrate bearing mechanism is arranged between the upper film pressing piece and the lower film pressing piece, and the upper cavity and the lower cavity can move relative to the substrate bearing mechanism so as to be in tight fit with the substrate bearing mechanism.

Description

Technical Field

[0001] The invention relates to film pressing technology, in particular to a double-sided vacuum film pressing device and a double-sided vacuum film pressing method. Background Art

[0002] Currently, in the semiconductor or electronic component industry, it is necessary to attach film materials (including Mylar) to the substrate as a construction layer or adhesive for subsequent processes. Generally speaking, the film material is first picked up and then transported to the film attachment work area corresponding to the substrate through a transmission mechanism, and then the film material is pushed to complete the operation of pressing the film material to the substrate surface.

[0003] The double-sided lamination process of laminating films on two opposite surfaces of a substrate is widely used in related technical fields. In the existing double-sided lamination process, a laminator first presses the film material onto one surface of the substrate, then the substrate is removed from the laminator and turned over at another workstation by manual operation or mechanical automation, and then the turned-over substrate is transported to the laminator again and the film material is pressed onto the other surface. However, due to the requirements for improving the film material properties and process yield, the existing laminator and double-sided lamination process can no longer meet the needs of the industry. Summary of the invention

[0004] In view of the above problems, the present invention provides a double-sided vacuum lamination device and a double-sided vacuum lamination method, which are helpful to improve the problem of poor production yield of the existing double-sided lamination process.

[0005] The double-sided vacuum laminating device disclosed in the present invention comprises an upper cavity, a lower cavity, an upper laminating member, a lower laminating member and a substrate supporting mechanism. The lower cavity is arranged corresponding to the upper cavity. The upper laminating member is movably arranged in the upper cavity. The lower laminating member is movably arranged in the lower cavity. The substrate supporting mechanism is arranged between the upper laminating member and the lower laminating member, and the upper cavity and the lower cavity can move relative to the substrate supporting mechanism to be closely fitted with the substrate supporting mechanism.

[0006] The double-sided vacuum lamination method disclosed in the present invention comprises: an upper lamination component picks up an upper film material and a lower lamination component picks up a lower film material; a substrate carrying mechanism carrying a substrate is provided between the upper lamination component and the lower lamination component; a vacuum environment is formed to accommodate the upper lamination component, the lower lamination component and the substrate carrying mechanism; and the upper film material and the lower film material are respectively pressed onto two opposite surfaces of the substrate.

[0007] According to the double-sided vacuum lamination device and double-sided vacuum lamination method disclosed in the present invention, the substrate is transported between two lamination parts by moving the substrate carrier mechanism. The upper cavity and the lower cavity can move relative to the substrate carrier mechanism to fit closely with the substrate carrier mechanism, and then perform lamination operation. During the lamination operation, since the film material will first contact the substrate to be pressed inside the cavity, and the film material will be placed on the substrate for lamination after the vacuum degree of the cavity has reached a suitable condition, the adhesion between the film material and the substrate can be reduced to improve the yield.

[0008] The above description of the content of the present invention and the following description of the implementation modes are used to demonstrate and explain the principles of the present invention and provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 Schematic diagram of a double-sided vacuum lamination device according to a first embodiment of the present invention.

[0010] Figure 2 for Figure 1 Schematic diagram of the substrate supporting mechanism of the double-sided vacuum lamination device.

[0011] Figure 3 4 is a flow chart of a double-sided vacuum lamination method according to an embodiment of the present invention.

[0012] Figures 4 to 9 For use Figure 1 Double-sided vacuum lamination device execution Figure 3 Schematic diagram of the double-sided vacuum lamination method. DETAILED DESCRIPTION

[0013] The detailed features and advantages of the present invention are described in detail in the following embodiments, and the contents are sufficient for any person skilled in the art to understand the technical content of the present invention and implement it accordingly, and according to the contents, claims and drawings disclosed in this specification, any person skilled in the art can easily understand the present invention. The following examples further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention in any viewpoint.

[0014] Please refer to Figure 1 and Figure 2 ,in Figure 1 is a schematic diagram of a double-sided vacuum lamination device according to a first embodiment of the present invention, and Figure 2 for Figure 1Schematic diagram of a substrate carrying mechanism of a double-sided vacuum lamination device. In this embodiment, the double-sided vacuum lamination device 1 may include a film cutting module 10, a film lamination module 20, and a pickup module 30. In this embodiment, the film cutting module 10, the pickup module 30, and the film lamination module 20 are integrated into a single device (double-sided vacuum lamination device 1), but in other embodiments, the film cutting module and / or the pickup module may be independently configured in different devices relative to the film lamination module.

[0015] The film cutting module 10 may include a film support seat 110, a film mounting wheel 120, a film conveying wheel 130, a waste film recovery wheel 140 and a film cutting knife 150. The film mounting wheel 120 is disposed on one side of the film support seat 110, and is used to carry the film material F wound into a cylindrical shape. The waste film recovery wheel 140 is disposed on the other side of the film support seat 110. The film conveying wheel 130 is disposed on at least one side of the film support seat 110, and is used to change the conveying direction of the film material so that the film material F can move in a direction parallel to the surface of the film support seat 110. The film cutting knife 150 is disposed corresponding to the film support seat 110, and the film cutting knife 150 can be connected to a driving source (such as a motor, not shown). The film material F can be held on opposite sides of the film support seat 110, and the film cutting knife 150 can move relative to the film support seat 110 to cut the film material F. In this embodiment, a plurality of rollers are used to transport the film material F, but the present invention is not limited thereto. In other embodiments, manual operation may be used to hold the film material on the film supporting seat.

[0016] The film pressing module 20 may include an upper cavity 210, a lower cavity 220, an upper film pressing member 230, a lower film pressing member 240, and a substrate supporting mechanism 250. The lower cavity 220 is disposed corresponding to the upper cavity 210, and the upper cavity 210 and the lower cavity 220 can each move relative to each other through a driving source (such as a motor cylinder, not shown).

[0017] The upper film pressing member 230 is movably disposed on the upper cavity 210. In detail, the upper film pressing member 230 may include a pressure plate 231 movably disposed on the upper cavity 210 and a film taking portion 232 disposed on the pressure plate 231. The pressure plate 231 is located on the side of the upper cavity 210 facing the lower cavity 220, and the pressure plate 231 can be moved relative to the upper cavity 210 to approach the lower cavity 220 through a driving source (such as a motor cylinder, not shown). The film taking portion 232 is, for example but not limited to, one of a negative pressure suction cup, an electrostatic suction cup (E-chuck) and a silicone pad. The film material held on one side of the film support seat 110 can be picked up by the film taking portion 232, which will be further described later.

[0018] The lower pressure film member 240 is movably disposed in the lower cavity 220. In detail, the lower pressure film member 240 may include a pressure plate 241 movably disposed in the lower cavity 220 and a film taking portion 242 disposed on the pressure plate 241. The pressure plate 241 is located on the side of the lower cavity 220 facing the upper cavity 210, and the pressure plate 241 can be moved relative to the lower cavity 220 to approach the upper cavity 210 through a driving source (such as a motor cylinder, not shown). The film taking portion 242 may include at least one of a negative pressure suction cup, an electrostatic suction cup, and a silicone pad. The film material held on the other side of the film support seat 110 can be picked up by the film taking portion 242, which will be further described later.

[0019] The substrate carrying mechanism 250 is movably disposed between the upper pressing film member 230 and the lower pressing film member 240, and the upper cavity 210 and the lower cavity 220 can move relative to the substrate carrying mechanism 250 to be closely fitted with the substrate carrying mechanism 250. Figure 2 As shown, the substrate carrying mechanism 250 may include a frame 251, a driving member 252 and a substrate support member 253. The driving member 252 is, for example but not limited to, a cylinder or a stepping motor, which is disposed in the frame 251 and connected to the substrate support member 253, so that the substrate support member 253 is movable relative to the frame 251, that is, the driving member 252 can drive the substrate support member 253 to move relative to the frame 251. Through the movement of the driving member 252, the substrate support member 253 can be located in the frame 251 or protrude from the inner side surface 2511 of the frame 251 and exposed to the outside. The frame 251 can be annular, for example but not limited to a square ring or a circular ring.

[0020] In the present embodiment, the upper cavity 210 and the lower cavity 220 can move relative to the substrate carrier 250 to be closely fitted with the substrate carrier 250. In detail, the substrate carrier 250 can be placed between the upper cavity 210 and the lower cavity 220. At this time, the upper cavity 210 can move toward the lower cavity 220 to be closely fitted with one side of the frame 251, and the lower cavity 220 can move toward the upper cavity 210 to be closely fitted with the other side of the frame 251. In this way, a negative pressure vacuum atmosphere can be provided between the upper cavity 210 and the lower cavity 220 by exhausting gas through a gas channel (not shown) formed in the upper cavity 210 or the lower cavity 220, so that the upper cavity 210 and the lower cavity 220 are both airtightly joined with the frame 251 of the substrate carrier 250, which will be further described later. The close fit between the upper cavity 210 or the lower cavity 220 and the substrate supporting mechanism 250 is, for example but not limited to, that the upper cavity 210 or the lower cavity 220 continuously presses against the frame 251 of the substrate supporting mechanism 250 , or that the upper cavity 210 or the lower cavity 220 is fixedly engaged with the frame 251 .

[0021] The pick-up module 30 may include a mechanical working arm 310 and a suction nozzle 320 located at the mechanical working arm 310. The mechanical working arm 310 may be moved to a material area (not shown separately) where substrates are stored. The pick-up module 30 picks up the substrate through the suction nozzle 320, and then transports the picked-up substrate to the double-sided vacuum lamination device 1 through the mechanical working arm 310. The substrate carrying mechanism 250 can receive the substrate picked up by the pick-up module 30, which will be further described later. The specific state of the pick-up module 30 is not intended to limit the present invention. In other embodiments, the pick-up module may include a fixture, a tray, or a linear slide rail.

[0022] An embodiment of the present invention discloses a double-sided vacuum lamination method, which can be used Figure 1 The double-sided vacuum lamination device performs this double-sided vacuum lamination method. Please refer to Figures 3 to 9 ,in Figure 3 is a flow chart of a double-sided vacuum lamination method according to an embodiment of the present invention, and Figures 4 to 9 For use Figure 1 The lamination system is implemented Figure 3 Schematic diagram of the double-sided vacuum lamination method.

[0023] The double-sided vacuum lamination method disclosed in this embodiment includes steps S1 to S8 performed in sequence, which press the film material onto the upper and lower surfaces of a substrate (such as a silicon wafer). In other embodiments, the film material and the substrate may be a resin film and a multilayer circuit board, respectively.

[0024] In step S1, a film support 110 is provided on which film materials are respectively held on opposite sides. Specifically, the film conveying wheel 130 of the film cutting module 10 conveys the strip-shaped film material F to the opposite sides of the film support 110, and holds the film material F on the film support 110. In more detail, one film conveying wheel 130 conveys one film material F to the top of the film support 110, and the other film conveying wheel 130 conveys the other film material F to the bottom of the film support 110. The film material F conveyed to the top of the film support 110 is held on the upper surface 111 of the film support 110, for example, by negative pressure adsorption, and the film material F conveyed to the bottom of the film support 110 is held on the lower surface 112 of the film support 110, for example, by negative pressure adsorption. The film cutting knife 150 cuts the two film materials F into upper film material F1 and lower film material F2, respectively, whose shapes match the substrate.

[0025] In the following, for convenience, how to perform the double-sided vacuum lamination device 1 is described. Figure 3 The double-sided vacuum lamination method can be defined as three working areas, namely, the film supply area R1, the film lamination area R2 and the film insertion area R3. Figure 4The film cutting knife 150 of the film cutting module 10 is often located in the film supply area R1, the upper cavity 210, the lower cavity 220, the upper film pressing member 230 and the lower film pressing member 240 of the film pressing module 20 may often be located in the film pressing area R2, and the picking module 30 may often be located in the film feeding area R3.

[0026] In step S2, the film support seat 110 is provided between the upper pressing film member 230 and the lower pressing film member 240. Figure 4 and Figure 5 As shown, the film support seat 110 holding the upper film material F1 and the lower film material F2 is moved from the film supply area R1 to the film pressing area R2, and the upper film material F1 and the lower film material F2 are placed between the upper film pressing member 230 and the lower film pressing member 240 of the film pressing module 20. The method of moving the film support seat 110 is, for example but not limited to, manual handling or mechanical automatic handling. In addition, in this embodiment, the film mounting wheel 120, the film conveying wheel 130 and the waste film recovery wheel 140 are fixedly arranged relative to the film support seat 110, so when the film support seat 110 is moved to the film pressing area R2, the film mounting wheel 120, the film conveying wheel 130 and the waste film recovery wheel 140 will also be brought to the film pressing area R2, but the present invention is not limited thereto. In other embodiments, the film support seat is an independently movable element, so when the film support seat is moved, the film mounting wheel, the film conveying wheel and the waste film recovery wheel will not be driven to move together.

[0027] In step S3, the upper film pressing member 230 picks up the upper film material F1 and the lower film pressing member 240 picks up the lower film material F2. Figure 5 As shown, the upper film pressing member 230 descends and approaches the film bearing seat 110, and the film taking portion 232 of the upper film pressing member 230 picks up the upper film material F1. The lower film pressing member 240 rises and approaches the film bearing seat 110, and the film taking portion 242 of the lower film pressing member 240 picks up the film material F2. When the film taking portions 232 and 242 include negative pressure suction cups or electrostatic suction cups, the picking up may be that the film taking portions 232 and 242 suck up the upper film material F1 and the lower film material F2 respectively. When the film taking portions 232 and 242 include silicone pads, the picking up may be that the film taking portions 232 and 242 stick to the upper film material F1 and the lower film material F2 respectively.

[0028] In step S4, the film support seat 110 is removed from between the upper film pressing member 230 and the lower film pressing member 240. Figure 5 and Figure 6 As shown, after the film taking portion 232 of the upper film pressing member 230 picks up the upper film material F1 and the film taking portion 242 of the lower film pressing member 240 picks up the lower film material F2, the upper film pressing member 230 and the lower film pressing member 240 return to their original positions, and the film support seat 110 is moved back from the film pressing area R2 to the film supply area R1. The film support seat 110 may be selectively provided with film material again by executing step S1.

[0029] In step S5, the substrate carrying mechanism 250 carrying the substrate is provided between the upper pressing film member 230 and the lower pressing film member 240. Figure 5 and Figure 6 As shown, in the film-casting area R3, the pick-up module 30 has already picked up the substrate 100 from the material area (not shown separately) in advance. The pick-up module 30 can transfer the substrate 100 to the substrate support 253 of the substrate carrying mechanism 250. Further, the substrate support 253 can maintain the inner side surface 2511 of the protruding frame 251 so that the substrate support 253 can receive the substrate 100. The substrate 100 can be supported on the substrate support 253. The substrate carrying mechanism 250 carrying the substrate 100 is moved from the film-casting area R3 to the film pressing area R2, and the substrate 100 is placed between the upper film pressing member 230 and the lower film pressing member 240 of the film pressing module 20. The method of moving the substrate carrying mechanism 250 is, for example but not limited to, manual handling or mechanical automated handling.

[0030] In step S6, a vacuum environment is formed to accommodate the upper pressing film component 230, the lower pressing film component 240 and the substrate supporting mechanism 250. Figure 6 and Figure 7 As shown, the upper cavity 210 descends to fit closely with one side of the frame 251 of the substrate supporting mechanism 250, and the lower cavity 220 rises to fit closely with the other side of the frame 251. Then, the gas is evacuated through the gas channel (not shown) formed in the upper cavity 210 or the lower cavity 220, and a negative pressure vacuum atmosphere is provided in the cavity 200 between the upper cavity 210 and the lower cavity 220. Figure 7 In the figure, the pressure plate 231 and the film removal part 232 of the upper pressure film member 230 are located in the cavity 200, the pressure plate 241 and the film removal part 242 of the lower pressure film member 240 are located in the cavity 200, the driving member 252 and the substrate supporting member 253 of the substrate carrying mechanism 250 are located in the cavity 200, and the upper film material F1, the lower film material F2 and the substrate 100 are located in the cavity 200.

[0031] In step S7, the upper film material F1 and the lower film material F2 are pressed onto two opposite surfaces of the substrate 100 respectively. Figure 7 and Figure 8 As shown, the pressing film member 240 is driven to move closer to the lower surface 102 of the substrate 100. In addition, the substrate carrying mechanism 250 releases the substrate 100 so that the pressing film member 240 can receive the substrate 100. Further, the driving member 252 of the substrate carrying mechanism 250 can move the substrate supporting member 253 into the frame 251, for example, along the Figure 8The substrate 100 is moved into the frame 251 in the horizontal direction H in the cavity 200. After the cavity 200 is evacuated, the substrate support member 253 moved into the frame 251 will no longer support the substrate 100, so that the substrate 100 can be transferred to the lower pressing film member 240 and the pressing plate 241 of the lower pressing film member 240 supports the substrate 100, and the substrate 100 contacts the lower film material F2 picked up by the lower pressing film member 240. The two actions of the lower pressing film member 240 moving up to approach the substrate 100 and the substrate support member 253 moving into the frame 251 can be performed sequentially or simultaneously. In addition, the upper pressing film member 230 is driven to move close to the upper surface 101 of the substrate 100 so that the upper film material F1 picked up by the upper pressing film member 230 contacts the upper surface 101 of the substrate 100. The two actions of the lower pressing film member 240 moving up to approach the substrate 100 and the upper pressing film member 230 moving down to approach the substrate 100 can be performed sequentially or simultaneously.

[0032] Next, the upper pressing film member 230 and the lower pressing film member 240 are pressurized to press the upper film material F1 and the lower film material F2 onto the upper surface 101 and the lower surface 102 of the substrate 100, respectively. Specifically, the upper pressing film member 230 continues to move downward and the lower pressing film member 240 continues to move upward, so that the upper film material F1 and the lower film material F2 are pushed by the pressing plate 231 and the pressing plate 241, respectively, so that the upper film material F1 and the lower film material F2 are closely attached to the upper surface 101 and the lower surface 102 of the substrate 100, respectively. Subsequently, the upper pressing film member 230 moves upward and the lower pressing film member 240 moves downward after being received by the supporting mechanism 250, so that the upper film material F1 and the lower film material F2 are separated from the film removal portion 232 and the film removal portion 242, respectively.

[0033] In step S8, the substrate supporting mechanism 250 is removed from between the upper pressing film member 230 and the lower pressing film member 240. Fig. 9 As shown, after the double-sided vacuum lamination is completed, the driving member 252 of the substrate carrying mechanism 250 drives the substrate supporting member 253 to protrude out of the frame 251 again along the horizontal direction H. The substrate supporting member 253 protruding out of the frame 251 can receive the substrate 100 with double-sided film (upper film material F1, lower film material F2). Then, the vacuum of the cavity 200 is broken. The upper cavity 210 moves up and the lower cavity 220 moves down and separates from the frame 251 of the substrate carrying mechanism 250. Afterwards, the substrate carrying mechanism 250 carrying the substrate 100 is moved back from the lamination area R2 to the film casting area R3. The pickup module 30 can pick up the substrate 100 with double-sided film.

[0034] Figures 4 to 9The double-sided vacuum lamination method is exemplarily illustrated as involving the lamination module 20 being maintained in the lamination area R2, the film support 110 holding the film material moving between the film supply area R1 and the lamination area R2, and the substrate support mechanism 250 carrying the substrate moving between the lamination area R2 and the film injection area R3, but the present invention is not limited thereto. In some embodiments, the film support 110 is maintained in the film supply area R1 and the substrate support mechanism 250 is maintained in the film injection area R3, and the lamination module 20 is moved to the film supply area R1 and the film injection area R3 in sequence to perform the operation. In some embodiments, the film support 110 is maintained in the film supply area R1, and the lamination module 20 is moved to the film supply area R1 to perform the film removal operation and the substrate support mechanism 250 is moved to the lamination area R2 to perform the lamination operation. In some embodiments, the substrate supporting mechanism 250 is maintained in the film insertion area R3, and the film supporting seat 110 is moved to the film lamination area R2 for film removal and the lamination module 20 is moved to the film insertion area R3 for lamination.

[0035] In summary, according to the double-sided vacuum lamination device and double-sided vacuum lamination method disclosed in the present invention, the substrate is transported between the two lamination parts by moving the substrate supporting mechanism. The upper cavity and the lower cavity can move relative to the substrate supporting mechanism to fit closely with the substrate supporting mechanism, and then perform lamination operations. During the lamination operation, since the substrate can be supported by the substrate supporting mechanism instead of being supported by a carrier such as that provided in the lower cavity, the lamination operation can achieve vacuuming without the film material contacting the substrate and laminating the film material on two opposite surfaces of the substrate at the same time, thereby helping to improve the production yield. Since the film material will first contact the substrate to be pressed inside the cavity, and the film material will be placed on the substrate for lamination after the vacuum degree of the cavity has reached a suitable condition, the adhesion between the film material and the substrate can be reduced to improve the yield.

[0036]

Explanation of symbols

[0037] 1: Double-sided vacuum lamination device

[0038] 10: Film cutting module

[0039] 110: membrane bearing seat

[0040] 111: Upper surface

[0041] 112: Lower surface

[0042] 120: Film wheel

[0043] 130: Film conveying wheel

[0044] 140: Waste film recovery wheel

[0045] 150: Film cutting knife

[0046] 20: Film pressing module

[0047] 200: Cavity

[0048] 210: Upper cavity

[0049] 220: Lower cavity

[0050] 230: Upper pressure film

[0051] 231: Pressure plate

[0052] 232: Film removal

[0053] 240: Pressed membrane

[0054] 241: Pressure plate

[0055] 242: Film removal

[0056] 250: substrate carrying mechanism

[0057] 251:Frame

[0058] 2511:Inside

[0059] 252: driving part

[0060] 253: Substrate support

[0061] 30: Pickup Module

[0062] 310: Mechanical working arm

[0063] 320: Nozzle

[0064] 100:Substrate

[0065] 101: Upper surface

[0066] 102: Lower surface

[0067] F: Film material

[0068] F1: film material

[0069] F2: lower film material

[0070] H: Horizontal direction

[0071] R1: Film supply area

[0072] R2: Film pressing area

[0073] R3: Film casting area

[0074] S1~S8: steps.

Claims

1. A double-sided vacuum lamination device, characterized in that: Include: upper cavity; The lower cavity is arranged corresponding to the upper cavity; An upper pressure film member is movably disposed on the upper cavity; A lower pressure film is movably arranged in the lower cavity; as well as The substrate carrying mechanism is arranged between the upper pressing film component and the lower pressing film component, and the upper cavity body and the lower cavity body can move relative to the substrate carrying mechanism to be closely fitted with the substrate carrying mechanism.

2. The double-sided vacuum lamination device according to claim 1, wherein the substrate supporting mechanism comprises: A frame, wherein the upper cavity and the lower cavity are respectively tightly fitted with two opposite sides of the frame; and The substrate support is movably arranged on the frame.

3. The double-sided vacuum lamination device according to claim 2, wherein the substrate supporting mechanism further comprises: The driving component is arranged on the frame and connected with the substrate supporting component, and the driving component can drive the substrate supporting component to move relative to the frame. 4 . The double-sided vacuum lamination device according to claim 2 , wherein the upper cavity and the lower cavity can move relative to the frame to fit closely with the frame, and the substrate support can move relative to the frame to protrude from the frame. 5 . The double-sided vacuum lamination device according to claim 4 , wherein the substrate support member protrudes from an inner side surface of the frame. 6 . The double-sided vacuum lamination device according to claim 1 , wherein the upper lamination member and the lower lamination member each have a film taking portion.

7. A double-sided vacuum lamination method, characterized in that: Include: The upper film pressing part picks up the upper film material and the lower film pressing part picks up the lower film material; Providing a substrate carrying mechanism carrying a substrate between the upper pressing film member and the lower pressing film member; Forming a vacuum environment to accommodate the upper pressing film component, the lower pressing film component and the substrate supporting mechanism; as well as The upper film material and the lower film material are pressed onto two opposite surfaces of the substrate respectively.

8. The double-sided vacuum lamination method according to claim 7, wherein the vacuum environment is formed by an upper cavity, a lower cavity and the substrate supporting mechanism being in close contact, the upper lamination member is movably disposed in the upper cavity, and the lower lamination member is movably disposed in the lower cavity.

9. The double-sided vacuum lamination method according to claim 7, wherein: Also includes: Providing film bearing seats on opposite sides respectively holding the upper film material and the lower film material; providing the film support seat between the upper pressing film member and the lower pressing film member; and After the upper film material is picked up by the upper film pressing member and the lower film material is picked up by the lower film pressing member, the film bearing seat is removed from between the upper film pressing member and the lower film pressing member.

10. The double-sided vacuum lamination method according to claim 7, wherein laminating the upper film material and the lower film material onto two opposite surfaces of the substrate comprises: Moving the pressing film member closer to the substrate; The substrate is released by the substrate carrying mechanism so that the pressing film receives the substrate; Moving the upper pressure film member closer to the substrate; as well as The upper pressing film component and the lower pressing film component are pressurized to press the upper film material and the lower film material onto two opposite surfaces of the substrate respectively.

Images