Temperature compensation auxiliary heating film and processing method thereof

Abstract

The invention discloses a processing method of a temperature compensation auxiliary heating film. The processing method comprises the following steps: step 1, processing a polyimide film into a set shape with a wiring main body and an auxiliary heating sheet; 2, coating a layer of curing film on the polyimide film; 3, laying a conductive metal foil on the wiring main body and one of the auxiliary heating sheets; 4, etching the conductive metal foil, forming a heating circuit on the auxiliary heating sheet, and forming a power supply circuit on the wiring main body; step 5, coating a layer of curing film on the etched conductive metal foil; step 6, judging whether heating circuits are processed on all the auxiliary heating sheets or not: if so, executing step 7; if not, executing the step 2; and 7, after the polyimide film is heated to a set temperature range, the auxiliary heating sheet is bent, so that the included angle between the auxiliary heating sheet and the wiring main body is 60-110 degrees. The invention further discloses a temperature compensation auxiliary heating film which can carry out temperature compensation on each hot well.

Description

Technical Field

[0001] The present invention belongs to the technical field of in vitro diagnosis, and specifically relates to a temperature compensation auxiliary heating film used for improving temperature uniformity in a PCR fluorescence quantitative analyzer and a processing method thereof. Background Art

[0002] During the PCR process, the temperature uniformity between the variable temperature metal hot wells directly affects the accuracy of the measurement. In the prior art, there are mainly the following ways to improve the temperature uniformity between the hot wells: (1) edge insulation; (2) connecting each hot well with ribs to improve the heat conduction between the hot wells; (3) installing a temperature compensation heating film. The edge insulation and increased heat conduction methods still cannot completely isolate the heat exchange between the variable temperature metal and the surrounding air, resulting in a lower temperature in the edge area of ​​the variable temperature metal. Although installing a temperature compensation heating film can improve the temperature uniformity of each hot well to a certain extent, the heat dissipated by each hot well of the variable temperature metal is uneven, and the heat required to be compensated is different due to the different temperature differences between each hot well and the outside world at different temperature points. The existing method of using a heating film to compensate for heat loss can only achieve rough temperature compensation, but cannot perform precise temperature compensation for each hot well. The existing temperature compensation heating film generally uses a semiconductor refrigerator, and the cooling or heating power on the surface of the semiconductor refrigerator has a certain degree of unevenness. In view of this, it is necessary to design a temperature compensation auxiliary heating film that can independently compensate for the temperature of each hot well.

[0003] At present, the most widely used circuit boards in the market are mainly PCB circuit boards. Usually, PCB circuit boards are divided into three categories according to the number of layers: single-sided boards, double-sided boards and multi-layer circuit boards. In a single-sided board, the electronic device layer and other parts are concentrated on only one side of the PCB, and the wires are concentrated on the other side. The production process of this single-sided board is simple and the cost is low, but it cannot be applied to too complex products. When single-layer wiring cannot meet the needs of electronic products, double-sided boards can be used. Double-sided boards, that is, both sides of the circuit board have copper coating and routing, and the vias on the board can be used to conduct the lines between the front and back sides to form the required network connection. Multi-layer circuit boards refer to those with three or more layers of conductive coating and insulating materials in between, which are laminated in between. Multi-layer circuit boards have large capacity, small size, and many functions, but they are expensive.

[0004] During the processing of circuit boards, etching is mainly used, that is, chemical reagents are used to corrode the useless copper or aluminum on the surface of the circuit board, which pollutes the environment. In addition, the circuit boards made by the existing methods, even if they are soft boards, feel relatively hard and have poor flexibility. Especially when used in the field of electronic tags of products, the circuit board where the electronic tag is located needs to be used multiple times when identifying the electronic tag, so the harder circuit board is prone to bending or even damage. Summary of the invention

[0005] In view of this, an object of the present invention is to provide a temperature compensation auxiliary heating film and a processing method thereof, which can meet the production and processing requirements of the temperature compensation auxiliary heating film.

[0006] In order to achieve the above object, the present invention provides the following technical solutions:

[0007] The present invention first proposes a method for processing a temperature compensation auxiliary heating film, wherein the temperature compensation auxiliary heating film comprises a wiring body, one side or two opposite sides of the wiring body are provided with auxiliary heating sheets at intervals, the auxiliary heating sheets are provided with heating circuits, and the wiring body is provided with power supply circuits corresponding to the heating circuits on each of the auxiliary heating sheets;

[0008] The processing method comprises the following steps:

[0009] Step 1: Processing the polyimide film into a set shape having a wiring body and an auxiliary heat sheet;

[0010] Step 2: coating a layer of curing film on the polyimide film;

[0011] Step 3: Lay the conductive metal foil on the wiring body and one of the auxiliary heat sheets;

[0012] Step 4: Etching the conductive metal foil to form a heating circuit on the auxiliary heating sheet and a power supply circuit on the wiring body;

[0013] Step 5: coating a layer of curing film on the etched conductive metal foil;

[0014] Step 6: Determine whether all auxiliary heating plates are processed with heating circuits: if yes, go to step 7; if not, go to step 2;

[0015] Step 7: After the polyimide film is heated to a set temperature range, the auxiliary heating sheet is bent so that the angle between the auxiliary heating sheet and the wiring body is 60°-110°.

[0016] Furthermore, positioning plates are provided on both sides of the auxiliary heating plate, and a positioning area for positioning the heat well is formed between two adjacent positioning plates; in the step 1, the polyimide film is processed into a set shape having a wiring body, an auxiliary heating plate and a positioning plate.

[0017] Furthermore, in the step three, the metal conductive foil is laid on the wiring body and the auxiliary heat sheet by calendering.

[0018] Furthermore, in step seven, the heating temperature of the polyimide film is in the range of 250-300°C.

[0019] Furthermore, the heating temperature of the polyimide film was 280°C.

[0020] Furthermore, in step seven, the angle between the bent auxiliary heating sheet and the wiring body is 90°.

[0021] Furthermore, the conductive metal foil is copper foil, silver foil or gold foil.

[0022] Furthermore, the heating circuit is a ring circuit.

[0023] Furthermore, the curing film is a PES hot melt film.

[0024] The present invention also provides a temperature compensation auxiliary heating film, which is obtained by processing using the temperature compensation auxiliary heating film processing method described above.

[0025] The beneficial effects of the present invention are:

[0026] The temperature compensation auxiliary heating film processing method of the present invention first processes the polyimide film into a set shape including a wiring body and an auxiliary heating sheet, and then processes the power supply circuit and the heating circuit respectively between the wiring body and the auxiliary heating sheet; in the process of processing the power supply circuit and the heating circuit, the curing film can be used to bond and fix the conductive metal foil on the one hand, and on the other hand, it can also isolate the power supply circuits corresponding to different auxiliary heating sheets, so that the power supply circuits of different auxiliary heating sheets are independent of each other; after the heating circuit is processed on all auxiliary heating sheets, the polyimide film is finally heated to a set temperature and then the auxiliary heating sheet is bent, so that there is a set angle between the auxiliary heating sheet and the wiring body, so that the auxiliary heating sheet and the outer wall of the heat well are attached when in use. The temperature compensation auxiliary heating film processing method of the present invention has a multi-layer power supply circuit on the wiring body, which can increase the structural rigidity of the wiring body; only one layer of heating circuit is set on the auxiliary heating sheet, so that the auxiliary heating sheet has sufficient flexibility to fit with the outer surface of the heat well.

[0027] In this way, in the temperature compensation auxiliary heating film processed, the heating circuit and power supply circuit in each auxiliary heating sheet are independently set. In this way, the heating power of each heating circuit can be controlled separately, so that different heating powers can be used for different hot wells for temperature compensation, thereby improving the temperature uniformity of the hot well. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to make the purpose, technical solution and beneficial effects of the present invention clearer, the present invention provides the following drawings for illustration:

[0029] Figure 1 It is a structural schematic diagram of an embodiment of a PCR fluorescence quantitative analyzer;

[0030] Figure 2 This is a schematic diagram of the structure of the PCR fluorescence quantitative analyzer after the shell is hidden;

[0031] Figure 3 It is a structural schematic diagram of a temperature control device;

[0032] Figure 4 This is an exploded view of the temperature control device;

[0033] Figure 5 It is a schematic diagram of the structure of the temperature compensation auxiliary heating film;

[0034] Figure 6 It is a schematic diagram of the structure after the temperature-changing metal and the temperature compensation auxiliary heating film are assembled;

[0035] Figure 7 A schematic diagram of the coordination relationship between one set of thermal wells and the temperature compensation auxiliary thermal film;

[0036] Figure 8 It is a flow chart of an embodiment of the temperature compensation auxiliary heating film processing method of the present invention;

[0037] Fig. 9 The present invention is a flow chart of a method for controlling the temperature of variable-temperature metal in a temperature control device.

[0038] 10-housing; 11-top hole; 12-heat cover device; 13-temperature control device; 14-photoelectric module; 15-control module; 16-power module;

[0039] 50-heat cover bracket; 51-bracket bottom plate; 59-heat well cover plate; 70-heat well through hole;

[0040] 71-bottom plate; 72-variable temperature metal; 73-heat well; 74-temperature compensation component; 75-temperature control element; 76-first heat-conducting layer; 77-second heat-conducting layer; 78-heat dissipation cover; 79-heat dissipation channel; 80-heat dissipation fan; 81-heat sink; 82-temperature compensation auxiliary heating film; 83-wiring body; 84-auxiliary heating sheet; 85-power supply interface; 86-positioning sheet; 87-positioning area; 88-fitting plane; 89-connection port; 90-optical fiber; 91-positioning plate; 92-temperature compensation control board. DETAILED DESCRIPTION

[0041] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0042] like Figure 1-2As shown, the PCR fluorescence quantitative analyzer of this embodiment includes a housing 1, and a top hole 11 is provided on the top surface of the housing 1. A heat cover device 12, a temperature control device 13, a photoelectric module 14, a control module 15 and a power module 16 are provided in the housing 1. The heat cover device includes a heat cover module, and the heat cover module and the temperature control device 13 constitute the temperature control system of this embodiment. The heat cover module includes a heat cover assembly and a heat cover bracket 50, and the heat cover bracket 50 includes a bracket bottom plate 51, and a heat well cover plate 59 is provided on the bracket bottom plate 51, and the temperature control device 13 is arranged below the heat well cover plate 59. A heat well through hole 70 is provided on the heat well cover plate 59, and a heat well 73 is provided on the temperature control device 13 corresponding to the heat well through hole 70, and the reagent tube 2 is placed in the heat well 73 through the heat well through hole 70. In this embodiment, the photoelectric module 14 and the control module 15 are both located on the same side of the temperature control device 13, and the photoelectric module 14 and the control module 15 are installed in the space below the bracket bottom plate 51 that is not occupied by the temperature control device 13. The power module 16 is installed at both ends of the bracket bottom plate 51 .

[0043] The temperature control device 13 is arranged below the heat well cover plate 59. Figure 3-4 As shown, the temperature control device 13 of this embodiment includes a bottom plate 71, a positioning plate 91 is installed above the bottom plate 71, a variable temperature metal 72 is installed on the positioning plate 91, a temperature raising and lowering component for controlling the temperature raising or lowering of the variable temperature metal 72 is provided between the bottom plate 71 and the variable temperature metal 72, and a heat dissipation component for discharging heat is provided below the bottom plate 71. A hot well 73 is provided on the variable temperature metal 72, and a hot well through hole 70 is provided on the hot well cover plate 59 in a one-to-one correspondence with the hot well 73, so that the reagent tube can be placed into the corresponding hot well 73 through the hot well through hole 70. In this embodiment, the temperature raising and lowering component includes a temperature control element 75 installed between the bottom plate 71 and the variable temperature metal 72, a first heat conducting layer 76 is provided between the temperature control element 75 and the bottom plate 71, and a second heat conducting layer 77 is provided between the temperature control element 75 and the variable temperature metal 72. Specifically, in this embodiment, the temperature control element 75 adopts TEC, and the use of TEC can achieve the technical purpose of rapidly raising or lowering the temperature of the variable temperature metal 72. The first heat conducting layer 76 and the second heat conducting layer 77 are made of graphene, which can effectively improve the heat conduction efficiency. In this embodiment, the heat dissipation assembly includes a heat dissipation cover 78 disposed below the bottom plate 71, a heat dissipation channel 79 is formed between the heat dissipation cover 78 and the bottom plate 71, a heat dissipation fan 80 is installed on the heat dissipation cover 78, and a heat dissipation fin 81 located in the heat dissipation channel 79 is provided on the bottom surface of the bottom plate 71. Starting the heat dissipation fan 80 can speed up the air flow speed in the heat dissipation channel 79, and use the heat dissipation fin 81 to quickly achieve heat dissipation.

[0044] The temperature control device of this embodiment further includes a temperature compensation component 74 for performing temperature compensation on each thermal well 73. The temperature compensation component 74 of this embodiment includes a temperature compensation auxiliary thermal film 82. Figure 5As shown, the temperature compensation auxiliary heating film 82 includes a wiring body 83, and auxiliary heating sheets 84 are arranged at intervals on one side or two opposite sides of the wiring body 83. A heating circuit (not shown in the figure) is arranged on the auxiliary heating sheet 84, and a power supply circuit (not shown in the figure) is arranged on the wiring body 83 in a one-to-one correspondence with the heating circuit on each auxiliary heating sheet 84. The wiring body 83 of this embodiment is provided with a power supply interface 85. The auxiliary heating sheet 84 is arranged in a one-to-one correspondence with the heat well 73, and the auxiliary heating sheet 84 is attached to the outer wall of the corresponding heat well 73. The two sides of the auxiliary heating sheet 84 of this embodiment are respectively provided with positioning sheets 86 arranged on the wiring body 83, and a positioning area 87 for positioning the heat well 73 is formed between two adjacent positioning sheets 86, so that the auxiliary heating sheet 84 and the corresponding heat well 73 can be conveniently positioned. In the preferred implementation of this embodiment, the auxiliary heating sheet 84 is perpendicular to the wiring body 83, and a fitting plane 88 is provided on the outer wall of the heat well 73, and the auxiliary heating sheet 84 is attached to the fitting plane 88. Specifically, the temperature compensation component 74 further includes a temperature compensation control board 92. A power supply interface 85 is provided on the wiring body 83. The temperature compensation control board 92 is connected to the temperature compensation auxiliary thermal film 82 through the power supply interface 85 and controls the temperature compensation power of each power supply circuit respectively. Specifically, the temperature compensation control board 92 of this embodiment is installed on the side wall of the heat dissipation channel 79.

[0045] The heat wells 73 are provided as at least one group, each group includes one or two rows of the heat wells 73 arranged in a linear array, and the temperature compensation auxiliary heat film 82 is provided in a one-to-one correspondence with each group of heat wells 73. Specifically, as Figure 6 As shown, in this embodiment, the heat wells 73 are set to 6 groups, and the variable temperature metal can also be set in a one-to-one correspondence with each group of heat wells 73, that is, the variable temperature metal 72 is set to 6 pieces, and the heat wells 73 belonging to the same group are set on a corresponding piece of variable temperature metal 72. Figure 7 As shown, each group of heat wells 73 includes two rows of heat wells 73 arranged in a linear array. When the temperature compensation auxiliary heat film 82 is installed, the wiring body 83 is arranged between the two rows of heat wells 73, and auxiliary heat sheets 84 are respectively arranged on both sides of the wiring body 83, and the auxiliary heat sheets 84 are attached to the corresponding heat wells 73. Of course, in some other embodiments, the variable temperature metal 73 can also be set as one piece, and all the heat wells 73 are set on one piece of variable temperature metal 73; of course, the variable temperature metal 72 can also be set as two or more pieces, and each piece of variable temperature metal 72 is provided with at least one group of heat wells 73, which will not be repeated.

[0046] In this embodiment, each hot well is provided with two connection ports 89, and two optical fibers 90 are respectively connected to the two connection ports 89. Specifically, an excitation optical fiber interface and a receiving optical fiber interface are respectively provided on the optoelectronic module 14 corresponding to each hot well 73, and the two optical fibers are respectively connected to the corresponding excitation optical fiber interface and the receiving optical fiber interface.

[0047] The specific implementation of the method for processing the temperature compensation auxiliary heating film in this embodiment is described in detail below.

[0048] like Figure 8 As shown, a temperature compensation auxiliary heating film processing method of this embodiment includes the following steps:

[0049] Step 1: Process the polyimide film into a set shape having a wiring body 83 , an auxiliary heat sheet 84 and a positioning sheet 86 .

[0050] Step 2: Coat a layer of curing film on the polyimide film for pasting the conductive metal foil. In the preferred implementation of this embodiment, the curing film is a PES hot-melt film.

[0051] Step three: laying the conductive metal foil on the wiring body 83 and one of the auxiliary heating sheets 84 without a heating circuit; in this embodiment, the conductive metal foil is laid on the wiring body 83 and the auxiliary heating sheet 84 by calendering.

[0052] Step 4: Etch the conductive metal foil to form a heating circuit on the auxiliary heat sheet 84 and a power supply circuit on the wiring body 83 .

[0053] Step 5: Coating a layer of curing film on the etched conductive metal foil.

[0054] Step 6: Determine whether all auxiliary heating plates 84 are processed with heating circuits: if yes, go to step 7; if not, go to step 2;

[0055] Step 7: After heating the polyimide film with heating circuits on all auxiliary heating sheets 84 to a set temperature range, bend the auxiliary heating sheet 84 so that the angle between the auxiliary heating sheet and the wiring body is 60°-110°. In this embodiment, the heating temperature range of the polyimide film is 250-300°C, and preferably, the heating temperature of the polyimide film is 280°C. In the preferred implementation of this embodiment, the angle between the bent auxiliary heating sheet and the wiring body is 90°, that is, the bent auxiliary heating sheet is perpendicular to the wiring body.

[0056] In this embodiment, the conductive metal foil is copper foil, silver foil or gold foil; and the heating circuit is a ring circuit.

[0057] The specific implementation of the variable temperature metal temperature control method in the temperature control device after adopting the temperature compensation auxiliary heating film 82 is described in detail below.

[0058] like Fig. 9 As shown, the variable temperature metal temperature control method in the temperature control device of this embodiment includes the following steps:

[0059] Step 1: Set M temperature compensation points in order from low to high, j = 1; the difference between two adjacent temperature compensation values ​​is 20-60° C. In this embodiment, the difference between two adjacent temperature compensation values ​​is 30° C.

[0060] Step 2: Use the temperature rise and fall components to control the temperature of the variable temperature metal to rise to the temperature compensation point T j , and maintain the set temperature for a constant time.

[0061] Step 3: Use a thermometer to detect the temperature of each hot well and determine the temperature T of each hot well 73. ji and temperature compensation point T j If the difference between the values ​​is within the set threshold range, no temperature compensation is performed; if not, the auxiliary heat sheet 84 is used to perform temperature compensation on the corresponding hot well 73, so that the temperature of the corresponding hot well 73 is within the set time and the temperature compensation point T j The difference between them is within the set threshold range.

[0062] Record the temperature compensation point T of the heating circuit corresponding to each hot well 73. j Temperature compensation power value P_T at ji .

[0063] Step 4: Determine whether the number of iterations j is equal to M: If so, stop the iteration and obtain the temperature compensation power value of each hot well 73 at each temperature compensation point; if not, j=j+1 and execute step 2 in a loop.

[0064] Specifically, in this embodiment, in order to verify that each hot well 73 is at the temperature compensation point T j Temperature compensation power value P_T at ji When the number of iterations j is equal to M, temperature compensation verification is performed. The method for temperature compensation verification includes the following steps:

[0065] 41) Use the temperature rise and fall components to control the temperature of the variable temperature metal to rise to the temperature compensation point T m , m = 1;

[0066] 42) According to the temperature compensation power value P_T mi Temperature compensation for each thermal well;

[0067] 42) Determine the temperature value T′ of each hot well 73 within the set time range after temperature compensation. mi The corresponding temperature compensation point T m Is the difference between the two values ​​within the set threshold range?

[0068] If yes, determine whether m is equal to M: If yes, determine whether the current temperature compensation verification times r is equal to the set maximum temperature compensation verification times R: If yes, the temperature compensation verification is completed, and step 5 is executed; if no, step 41 is executed, r=r+1;

[0069] If not, go to step 2.

[0070] That is, in the continuous R temperature compensation verification, if the temperature of each hot well 73 at each temperature compensation point can be within the set threshold range, it means that each hot well is obtained at the temperature compensation point T j Temperature compensation power value P_T at ji The reliability is higher, and then proceed to step five.

[0071] Step 5: Set the temperature T of the variable temperature metal and obtain two temperature compensation points T adjacent to the temperature T. k and T k+1 , and satisfy T k <T≤T k+1 ; Get the heating circuit corresponding to each hot well 73 at the temperature compensation point T k and T k+1 Temperature compensation power value P_T ki and P_T (k+1)i After the variable temperature metal reaches the temperature T by using the temperature rise and fall component, the temperature compensation power value of each hot well 73 is:

[0072]

[0073] Among them, m k 、n k and p k are coefficients, and:

[0074] m1=T k+1 -T k

[0075]

[0076]

[0077] Where, 1≤k<M, M≥2; 1≤i≤N, N is the number of hot wells;

[0078] Step 6: The temperature compensation power value P_T of the heating circuit corresponding to each hot well 73 calculated in step 5 i Temperature compensation is performed for each thermal well.

[0079] The temperature compensation method for variable temperature metal of the present embodiment sets a plurality of temperature compensation points, and obtains the compensation power value required for each hot well to reach the temperature within the set threshold range of the corresponding temperature compensation point at different temperature compensation points. Thus, in actual use, two temperature compensation points adjacent to the set temperature of the variable temperature metal can be queried, and the power compensation value of each hot well at the two adjacent temperature compensation points can be used to calculate the power compensation value of each hot well at the current set temperature of the variable temperature metal. Thus, after the variable temperature metal reaches the set temperature, each hot well can be temperature compensated using the calculated power compensation value, so that the temperature of each hot well reaches the threshold range of the set temperature, thereby improving the temperature uniformity between the hot wells.

[0080] The above-described embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Equivalent substitutions or changes made by those skilled in the art based on the present invention are within the protection scope of the present invention. The protection scope of the present invention shall be subject to the claims.

Claims

1. A method for processing a temperature compensation auxiliary heating film, characterized in that: The temperature compensation auxiliary heating film comprises a wiring body, one side or two opposite sides of the wiring body are provided with auxiliary heating sheets at intervals, the auxiliary heating sheets are provided with heating circuits, and the wiring body is provided with power supply circuits corresponding to the heating circuits on each of the auxiliary heating sheets; The processing method comprises the following steps: Step 1: Processing the polyimide film into a set shape having a wiring body and an auxiliary heat sheet; Step 2: coating a layer of curing film on the polyimide film; Step 3: Lay the conductive metal foil on the wiring body and one of the auxiliary heat sheets; Step 4: Etching the conductive metal foil to form a heating circuit on the auxiliary heating sheet and a power supply circuit on the wiring body; Step 5: coating a layer of curing film on the etched conductive metal foil; Step 6: Determine whether all auxiliary heating plates are processed with heating circuits: if yes, go to step 7; if not, go to step 2; Step 7: After the polyimide film is heated to a set temperature range, the auxiliary heating sheet is bent so that the angle between the auxiliary heating sheet and the wiring body is 60°-110°.

2. The temperature compensation auxiliary heating film processing method according to claim 1, characterized in that: Positioning plates are respectively arranged on both sides of the auxiliary heating plate, and a positioning area for positioning the heat well is formed between two adjacent positioning plates; in the step 1, the polyimide film is processed into a set shape having a wiring body, an auxiliary heating plate and a positioning plate.

3. The temperature compensation auxiliary heating film processing method according to claim 1, characterized in that: In the step three, the metal conductive foil is laid on the wiring body and the auxiliary heat sheet by calendering.

4. The temperature compensation auxiliary heating film processing method according to claim 1, characterized in that: In the step seven, the heating temperature of the polyimide film is in the range of 250-300°C.

5. The temperature compensation auxiliary heating film processing method according to claim 4, characterized in that: The heating temperature of the polyimide film was 280°C.

6. The temperature compensation auxiliary heating film processing method according to claim 1, characterized in that: In the step seven, the angle between the bent auxiliary heating sheet and the wiring body is 90°.

7. The temperature compensation auxiliary heating film processing method according to claim 1, characterized in that: The conductive metal foil is made of copper foil, silver foil or gold foil.

8. The temperature compensation auxiliary heating film processing method according to claim 1, characterized in that: The heating circuit is a ring circuit.

9. The temperature compensation auxiliary heating film processing method according to claim 1, characterized in that: The curing film is a PES hot melt film.

10. A temperature compensation auxiliary heating film, characterized in that: The film is obtained by processing using the temperature compensation auxiliary heating film processing method as described in any one of claims 1 to 5.

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