Multi-order high-precision printed circuit board
By using the superimposed structure of circuit board substrate, circuit board circuit layer and multi-order circuit dedicated channel board in multi-order circuit board, circuit connection is achieved using upper and lower double-pass conductive components and conductive foil boards, the difficulty of connecting multi-order circuit boards is solved and The problem of high defect rate improves the precision and stability of the circuit board.
Patent Information
- Application Number
- CN202411464402.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-21
- Publication Date
- 2025-01-07
AI Technical Summary
When connecting adjacent conductive layers, multi-order circuit boards need to be filled with conductive materials, which makes it difficult to design and processing, which can easily cause circuit board damage and high defect rate.
Design a multi-order high-precision printed circuit board, adopting a superposition structure of circuit board substrate, circuit board circuit layer and multi-order circuit dedicated channel board, and realize circuit connection through upper and lower double-pass conductive components and conductive foil board to reduce lamination The need for opening holes.
The defective rate after the circuit is printed and laminated is reduced, and the multi-order circuit board structure is optimized, making the circuit connection more accurate and stable, and is suitable for multi-layer circuit boards.
Smart Images
Figure CN119277647A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of circuit boards, and in particular to a multi-stage high-precision printed circuit board. Background Art
[0002] A multi-level circuit board is a printed circuit board with a structure of multiple conductive layers and insulating layers alternately stacked. It is equivalent to a product of traditional multi-layer circuit boards that are stacked and reduced in thickness. When two adjacent conductive layers of a multi-level circuit board need to be connected, it is necessary to open holes in the circuit board, and then fill the conductive material into the drilled holes to connect adjacent layers or even multiple layers of conductive layer lines. Such a design requires high-precision design, which is a challenge for design work and even processing work. The design work needs to consider the layout of the multi-layer design on the plane, and the processing work requires fine drilling, otherwise it will cause damage to the circuit board, thus becoming a defective circuit board. For this reason, a multi-level high-precision printed circuit board is designed. Summary of the invention
[0003] The purpose of the present invention is to provide a multi-stage high-precision printed circuit board to solve the above technical problems. To achieve the above purpose, the present invention adopts the following technical solutions: A multi-stage high-precision printed circuit board comprises a circuit board substrate, a circuit board circuit layer, and a multi-stage circuit dedicated channel board. The circuit board substrate is arranged in multiple layers, the circuit board circuit layer is arranged on the circuit board substrate, the multi-stage circuit dedicated channel board is arranged in multiple layers, and the multi-stage circuit dedicated channel board and the circuit board substrate are arranged as a whole.
[0004] On the basis of the above technical scheme, the circuit board circuit layer is composed of several groups of on-board circuit lines, the multi-stage circuit dedicated channel board is composed of a channel board substrate, upper and lower double-pass conductive components, upper conductive components, and lower conductive components, the upper and lower double-pass conductive components, the upper conductive components, and the lower conductive components are all provided with several groups, and several groups of upper and lower double-pass conductive components, upper conductive components, and lower conductive components are irregularly arranged on the channel board substrate, the channel board substrate and the circuit board substrate are integrally arranged, the upper and lower ends of the upper and lower double-pass conductive components pass through the channel board substrate, and the upper and lower ends of the upper and lower double-pass conductive components are provided with conductive foil plates, the upper end of the upper conductive component passes through the channel board substrate, and the upper end of the upper conductive component is provided with a conductive foil plate, the lower end of the lower conductive component passes through the channel board substrate, and the lower end of the lower conductive component is provided with a conductive foil plate, the on-board circuit line is inserted in the channel board substrate, and the side ends of the on-board circuit line are correspondingly connected to the upper and lower double-pass conductive components, the upper conductive components, and the lower conductive components.
[0005] On the basis of the above technical solution, the conductive foil plate is set as a micro-curved surface, and the concave surface of the conductive foil plate corresponds to contact with the leakage ends of the upper and lower double-pass conductive components, the upper conductive component, and the lower conductive component, and the convex surface of the conductive foil plate corresponds to contact with the convex surface of the conductive foil plate on the adjacent side channel plate substrate, and the edge of the conductive foil plate is fixed on the channel plate substrate.
[0006] Compared with the prior art, the present invention has the following advantages: the present invention optimizes the arrangement of a multi-stage printed circuit board, changes the traditional design that requires opening holes after lamination, and improves it into a design that only requires the circuit to be re-arranged in a fixed conductive area, thereby reducing the defective rate of the circuit after printing and lamination, and improving the structure of the multi-stage circuit board. The present structure is also applicable to multi-layer circuit boards and is suitable for widespread use. BRIEF DESCRIPTION OF THE DRAWINGS
[0007] Figure 1 This is a diagram of the overall appearance of the present invention.
[0008] Figure 2 It is a schematic diagram of the details of the multi-layer multi-stage circuit dedicated channel plate of the present invention.
[0009] Figure 3 This is a half-section detail schematic diagram of a dedicated channel for a multi-stage circuit of the present invention.
[0010] Figure 4 Schematic diagram of three conductive components of the present invention.
[0011] Figure 5 It is a schematic diagram of the conductive foil plate of the present invention.
[0012] In the figure: circuit board substrate 1, circuit board circuit layer 2, multi-stage circuit dedicated channel board 3, on-board circuit line 4, channel board substrate 5, upper and lower double-pass conductive components 6, upper conductive components 7, lower conductive components 8, conductive foil plate 9, concave surface 11, convex surface 12. DETAILED DESCRIPTION
[0013] The present invention is further described in detail below in conjunction with the accompanying drawings and specific implementations.
[0014] A multi-stage high-precision printed circuit board comprises a circuit board substrate 1, a circuit board circuit layer 2, and a multi-stage circuit dedicated channel board 3. The circuit board substrate 1 is arranged in multiple layers, the circuit board circuit layer 2 is arranged on the circuit board substrate 1, the multi-stage circuit dedicated channel board 3 is arranged in multiple layers, and the multi-stage circuit dedicated channel board 3 and the circuit board substrate 1 are arranged as a whole.
[0015] The circuit board circuit layer 2 is composed of several groups of on-board circuit lines 4, and the multi-stage circuit dedicated channel board 3 is composed of a channel board substrate 5, an upper and lower double-pass conductive component 6, an upper conductive component 7, and a lower conductive component 8. The upper and lower double-pass conductive components 6, the upper conductive component 7, and the lower conductive component 8 are all arranged in several groups, and several groups of upper and lower double-pass conductive components 6, the upper conductive component 7, and the lower conductive component 8 are irregularly arranged on the channel board substrate 5. The channel board substrate 5 and the circuit board substrate 1 are arranged as a whole, and the upper and lower double-pass conductive components 6 are arranged on the upper and lower double-pass conductive components 6. Both lower ends pass through the channel plate substrate 5, and both upper and lower ends of the upper and lower double-pass conductive components 6 are provided with conductive foil plates 9, the upper end of the upper conductive component 7 passes through the channel plate substrate 5, and the upper end of the upper conductive component 7 is provided with a conductive foil plate 9, the lower end of the lower conductive component 8 passes through the channel plate substrate 5, and the lower end of the lower conductive component 8 is provided with a conductive foil plate 9, the on-board circuit line 4 is inserted into the channel plate substrate 5, and the side ends of the on-board circuit line 4 are correspondingly connected to the upper and lower double-pass conductive components 6, the upper conductive component 7, and the lower conductive component 8.
[0016] The conductive foil plate 9 is set as a micro-curved surface, and the concave surface 11 of the conductive foil plate 9 corresponds to contact with the leakage ends of the upper and lower double-pass conductive components 6, the upper conductive component 7, and the lower conductive component 8, and the convex surface 12 of the conductive foil plate 9 corresponds to contact with the convex surface 12 of the conductive foil plate 9 on the adjacent side channel plate substrate 5, and the edge of the conductive foil plate 9 is fixed on the channel plate substrate 5.
[0017] Working principle of the present invention: This structure reduces the need for hole plating after laminating multi-level circuit boards in actual work. When designing circuits, the circuits that need to be connected to another layer in the original single-layer circuit can be gathered into one position for connection, and connected to the corresponding upper and lower double-pass conductive components 6, upper conductive components 7, and lower conductive components 8 as needed. For example: when the upper circuit needs to be connected with the lower circuit, a group of lower conductive components 8 need to be set on the bottom side of the upper circuit, and a group of upper conductive components 7 are set on the lower circuit. During the lamination work, the circuit lines in the two circuit layers can be connected.
[0018] For another example: when the upper circuit needs to be connected with the lower multi-layer circuit and the lower circuit separated by multiple layers, a group of lower conductive components 8 needs to be set on the bottom side of the upper circuit, the circuit sandwiched in the middle layer uses the upper and lower double conductive components 6, and the bottom layer circuit uses the upper conductive component 7. During the lamination work, the circuits in the multi-layer circuit can be connected. The difference is that when connecting with the multi-layer circuit, the upper and lower double conductive components 6 on each layer of the circuit will be connected to the on-board circuit line 4 on the circuit layer, and when connecting with the bottom layer of the circuit, the upper and lower double conductive components 6 on the middle circuit layer are not connected to the on-board circuit line 4 of the circuit layer.
[0019] The above is a preferred embodiment of the present invention. For ordinary technicians in this field, according to the teachings of the present invention, without departing from the principles and spirit of the present invention, changes, modifications, substitutions and variations made to the implementation methods are still within the scope of protection of the present invention.
Claims
1. A multi-stage high-precision printed circuit board, characterized in that: The invention comprises a circuit board substrate (1), a circuit board circuit layer (2), and a channel plate (3) dedicated to a multi-stage circuit, wherein the circuit board substrate (1) is arranged in a plurality of layers, the circuit board circuit layer (2) is arranged on the circuit board substrate (1), the channel plate (3) dedicated to a multi-stage circuit is arranged in a plurality of layers, and the channel plate (3) dedicated to a multi-stage circuit and the circuit board substrate (1) are arranged as a whole.
2. A multi-stage high-precision printed circuit board according to claim 1, characterized in that: The circuit board circuit layer (2) is composed of a plurality of groups of onboard circuit lines (4); the multi-stage circuit dedicated channel board (3) is composed of a channel board substrate (5), an upper and lower double-pass conductive component (6), an upper conductive component (7), and a lower conductive component (8); the upper and lower double-pass conductive components (6), the upper conductive component (7), and the lower conductive component (8) are each provided in a plurality of groups; the plurality of groups of upper and lower double-pass conductive components (6), the upper conductive component (7), and the lower conductive component (8) are irregularly arranged on the channel board substrate (5); the channel board substrate (5) and the circuit board substrate (1) are integrally arranged; the upper and lower double-pass conductive components (6) are provided on Both lower ends pass through the channel plate substrate (5), and both upper and lower ends of the upper and lower double-pass conductive components (6) are provided with conductive foil plates (9); the upper end of the upper conductive component (7) passes through the channel plate substrate (5), and the upper end of the upper conductive component (7) is provided with a conductive foil plate (9); the lower end of the lower conductive component (8) passes through the channel plate substrate (5), and the lower end of the lower conductive component (8) is provided with a conductive foil plate (9); the on-board circuit line (4) passes through the channel plate substrate (5), and the side ends of the on-board circuit line (4) are correspondingly connected to the upper and lower double-pass conductive components (6), the upper conductive component (7), and the lower conductive component (8).
3. A multi-stage high-precision printed circuit board according to claim 2, characterized in that: The conductive foil plate (9) is configured as a micro-curved surface, and the concave surface (11) of the conductive foil plate (9) is in contact with the leakage ends of the upper and lower double-pass conductive components (6), the upper conductive component (7), and the lower conductive component (8), and the convex surface (12) of the conductive foil plate (9) is in contact with the convex surface (12) of the conductive foil plate (9) on the adjacent side channel plate substrate (5), and the edge of the conductive foil plate (9) is fixed on the channel plate substrate (5).