Electronic equipment and preparation method thereof

Abstract

The invention discloses electronic equipment and a preparation method of the electronic equipment, and belongs to the technical field of electronic products. The electronic equipment comprises a frame body assembly, a circuit board and a connecting piece, the frame body assembly comprises a metal frame and a supporting piece used for supporting the circuit board, the metal frame is arranged in a split mode, the supporting piece is used for supporting the circuit board, the metal frame is arranged around the supporting piece, and an antenna gap is formed in the metal frame. The connecting piece is electrically connected with the circuit board and the metal frame.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic products, and specifically relates to an electronic device and a method for preparing the electronic device. Background Art

[0002] The housing of an electronic device usually includes a back cover and a frame assembly. The frame assembly usually includes metal parts and plastic parts. The plastic parts are filled in the metal parts. At the same time, part of the plastic parts are filled in the antenna gaps opened on the metal parts to achieve the effect of antenna isolation, thereby ensuring the communication quality. The metal parts are used as the appearance structure, and the materials made of the metal parts usually include materials such as stainless steel or titanium alloy. Due to the high hardness of the metal parts, this kind of frame assembly can effectively prevent the electronic device from being deformed and damaged when it is hit or squeezed.

[0003] The structure of metal parts is usually complex. In order to facilitate the manufacture of metal parts, CNC (Computerized Numerical Control) processing technology is usually used to make metal parts in one piece. However, this type of processing of metal parts has a high processing cost and is also difficult to process.

[0004] In summary, the electronic equipment involved in the relevant technology has the problems of high manufacturing cost and great processing difficulty. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide an electronic device and a method for preparing the electronic device, which can solve the problems of high manufacturing cost and high processing difficulty of the electronic devices involved in the related art.

[0006] The present application provides an electronic device, including a frame assembly, a circuit board and a connector. The frame assembly includes a separately arranged metal frame and a support member for supporting the circuit board. The metal frame is arranged around the support member. The metal frame is provided with an antenna gap. The connecting member electrically connects the circuit board and the metal frame.

[0007] An embodiment of the present application provides a method for preparing an electronic device, which is applied to the electronic device described above, and the method includes: The support member and the connecting member are integrally formed by die casting; Disconnecting the support member and the connecting member; Plastic parts are filled between the metal frame and the support member and in the antenna gap.

[0008] In the embodiment of the present application, since the metal frame of the frame assembly as the appearance structure and the support member for supporting the circuit board are separately arranged, the structure of the metal frame and the structure of the support member are relatively simple, which makes it possible for the present application to adopt a simple processing method to process the metal frame and the support member separately, that is, this setting method can reduce the difficulty of processing the frame assembly to a certain extent, while reducing the manufacturing cost, and since the metal frame is provided with an antenna gap, and the connector electrically connects the circuit board and the metal frame, this allows the electronic device to maintain a good antenna signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 An exploded view of the frame assembly and the first spring sheet disclosed in the embodiment of the present application; Figure 2 and Figure 3 It is a schematic diagram of the structure of the frame assembly at different viewing angles disclosed in the embodiments of the present application; Figure 4 A schematic diagram of the structure of a metal frame disclosed in an embodiment of the present application; Figure 5 This is a schematic diagram of the structure of the support member and the connecting member disclosed in the embodiment of the present application; Figure 6 for Figure 5 The enlarged schematic diagram of point A in the middle; Figure 7 This is a schematic diagram of the structure of the plastic part disclosed in the embodiment of the present application; Figure 8 A schematic diagram of the structure of the frame assembly from another perspective disclosed in an embodiment of the present application; Fig. 9 for Figure 8 The enlarged schematic diagram of point B in the middle; Fig.10 It is a schematic cross-sectional structural diagram of the frame assembly disclosed in the embodiment of the present application; Fig.11 for Fig.10 The enlarged schematic diagram of the center C; Fig.12 A schematic diagram of a partial cross-sectional structure of an electronic device disclosed in an embodiment of the present application; Fig.13 A partial exploded view of an electronic device disclosed in an embodiment of the present application; Fig.14 This is a schematic diagram of a structure in which limiting grooves are provided on the first and second sections of a metal frame according to an embodiment of the present application; Fig.15 for Fig.14 The enlarged schematic diagram of point D in the middle; Fig.16 A schematic diagram of a structure in which antenna gaps are provided on the first section and the second section in an embodiment of the present application; Fig.17 for Fig.16 The enlarged schematic diagram of point E in the middle; Fig.18 A schematic diagram of the structure of an antenna slot opened on a metal frame disclosed in an embodiment of the present application; Fig.19 This is a schematic diagram of the structure of the first and second bent sections disclosed in the embodiment of the present application; Fig. 20 for Fig.19 The enlarged schematic diagram of F in the middle; Fig.21 This is a schematic diagram of the structure of the first and second sections welded together according to an embodiment of the present application; Fig. 22 for Fig.21 The enlarged schematic diagram of G in the middle; Fig.23 A schematic diagram of the structure of the frame assembly from another perspective disclosed in an embodiment of the present application; Fig.24 for Fig.23 The enlarged schematic diagram of the H in the middle; Fig.25 and Fig.26 It is a schematic diagram of the structure of the first spring piece at different viewing angles disclosed in the embodiment of the present application; Fig. 27 It is a partial structural schematic diagram of the supporting member and the connecting member disclosed in the embodiment of the present application; Fig.28 It is a schematic diagram of the structure of the plastic part and the first spring piece disclosed in the embodiment of the present application; Fig.29 A schematic diagram of a partial structure of an integrated support member and a connecting member disclosed in an embodiment of the present application; Fig.30 A schematic diagram of a partial structure of a connection section between a disconnecting support member and a connecting member disclosed in an embodiment of the present application; Fig.31 and Fig.32 A schematic diagram of a process for preparing an electronic device disclosed in an embodiment of the present application.

[0010] Description of reference numerals: 100-frame assembly, 110-metal frame, 111-antenna gap, 112-limiting groove, 113-arc segment, 114-straight segment, 115-first part, 116-second part, 117-first section, 118-second section, 120-support member, 130-plastic member, 131-filling part, 132-through hole, 133-mounting hole, 134-clamping part, 140-inner cavity; 200-circuit board; 300-connecting member, 310-first connecting plate, 320-second connecting plate, 321-first plate surface, 322-second plate surface, 323-arc surface, 324-plane surface, 330-first connecting member, 340-second connecting member; 410-first spring piece, 411-serrated portion, 420-second spring piece; 510-Connection segment. DETAILED DESCRIPTION

[0011] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0012] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0013] The electronic device disclosed in the embodiment of the present application is described in detail below through specific embodiments and application scenarios in conjunction with the accompanying drawings.

[0014] Please refer to Figure 1-Figure 30 The present application discloses an electronic device, which includes a frame assembly 100, a circuit board 200 and a connector 300.

[0015] Please refer to Figures 1 to 3 and Figure 8 The frame assembly 100 is a basic component of the electronic device, which can provide certain support and protection for other components of the electronic device. The frame assembly 100 can specifically include a metal frame 110 that is separately arranged (for details, please refer to Figure 4 and Fig.21 ) and support member 120 (for details, please refer to Figure 5), the support member 120 is used to support the circuit board 200, and the metal frame 110 is arranged around the support member 120. The metal frame 110 is an appearance part of the electronic device, which can improve the appearance performance of the electronic device. At the same time, since the metal frame 110 is made of metal material, the metal frame 110 has higher rigidity and strength, which can provide better protection for the electronic device.

[0016] Please refer to Fig.11 and Fig.12 The metal frame 110 is provided with an antenna gap 111, the connector 300 is conductive, and the connector 300 electrically connects the circuit board 200 and the metal frame 110, so that the metal frame 110 can be used as an antenna to achieve signal radiation.

[0017] In the embodiment of the present application, since the metal frame 110 serving as the appearance structure of the frame assembly 100 and the support member 120 for supporting the circuit board 200 are separately arranged, the structure of the metal frame 110 and the structure of the support member 120 are relatively simple, which allows the present application to use a simple processing method to separately process the metal frame 110 and the support member 120, that is, this setting method can reduce the difficulty of processing the frame assembly 100 to a certain extent, while reducing the manufacturing cost, and since the metal frame 110 is provided with an antenna gap 111, and the connector 300 electrically connects the circuit board 200 and the metal frame 110, this allows the electronic device to maintain a good antenna signal.

[0018] Optionally, the frame assembly 100 may further include a plastic part 130 (see Figure 7 ), the plastic part 130 can be injection molded on the support part 120, that is, the plastic part 130 can be arranged around the support part 120, and the plastic part 130 and the support part 120 can enclose an inner cavity 140 for arranging the circuit board 200. At this time, the plastic part 130 and the support part 120 can jointly support the circuit board 200. It can be seen that the material made of the frame assembly 100 includes metal material and plastic material, that is, the frame assembly 100 is not entirely made of metal material, which can reduce the overall weight of the frame assembly 100 to a certain extent, thereby reducing the overall weight of the electronic device.

[0019] In this embodiment, please refer to Fig.28 The plastic part 130 is provided with a filling part 131 protruding therefrom, and the filling part 131 is filled in the antenna gap 111 to achieve the effect of antenna isolation, thereby ensuring the communication quality of the electronic device, and also ensuring the integrity of the peripheral structure of the electronic device. Of course, the frame assembly 100 may not include the plastic part 130, and other non-conductive components may be used to fill the antenna gap 111 to prevent impurities from entering the interior of the electronic device through the antenna gap 111.

[0020] Optionally, the connector 300 may include only the first connecting plate 310 , one end of the first connecting plate 310 may be electrically connected to the circuit board 200 , and the other end of the first connecting plate 310 may be electrically connected to the metal frame 110 .

[0021] In another embodiment, please refer to Fig.11 , Fig.12 and Fig. 27 The connector 300 may also include a second connector plate 320. The first connector plate 310 and the second connector plate 320 are connected. The extension direction of the first connector plate 310 intersects with the extension direction of the second connector plate 320. In this case, the connector 300 may be generally in a regular or irregular T-shape. A through hole 132 is provided on the plastic part 130. One end of the first connector plate 310 passes through the through hole 132 and is connected to the circuit board 200 through the second elastic sheet 420. The second connector plate 320 has a first plate surface 321 and a second plate surface 322 that are arranged opposite to each other. The first plate surface 321 and the second plate surface 322 both have a large area, so that the other end of the first connector plate 310 is more easily connected to the first plate surface 321, and the second plate surface 322 is more easily electrically connected to the metal frame 110. That is, in this case, the area of ​​the connector 300 electrically connected to the metal frame 110 is larger, which can ensure the electrical connection stability between the connector 300 and the metal frame 110, and further ensure the transmission stability of the antenna signal.

[0022] Optionally, during the specific process of injection molding the plastic part 130, the support member 120 and the connector 300 can be placed in the mold at the same time, and the plastic part 130 can be injection molded on the support member 120 and the connector 300. This arrangement can ensure that the through hole 132 is sealed with the first connecting plate 310 to prevent impurities and water vapor from entering the inner cavity 140 through the through hole 132, that is, it plays a waterproof role. It should be noted that during the process of injection molding the plastic part 130, the second plate surface 322 needs to be exposed to facilitate the electrical connection between the second plate surface 322 and the metal frame 110. At the same time, the first plate surface 321 and the area of ​​the plastic part 130 surrounding the through hole 132 are also sealed to further prevent impurities from entering the inner cavity 140 through the through hole 132.

[0023] Optionally, refer to Fig. 9 , Fig.11 , Fig.12 , Fig.25 , Fig.26 and Fig.28The electronic device may further include a first spring clip 410, which has a certain elasticity and can be conductive. The plastic part 130 is further provided with a mounting hole 133 connected to the through hole 132. The first spring clip 410 is installed in the mounting hole 133. The bottom wall of the mounting hole 133 can limit the first spring clip 410 so that the first spring clip 410 is located between the second connecting plate 320 and the metal frame 110, and the first spring clip 410 is electrically connected to the second connecting plate 320 and the metal frame 110. The elastic force provided by the first spring clip 410 can improve the reliability of the electrical connection between the connector 300 and the metal frame 110.

[0024] In addition, the first spring piece 410 can also apply an extrusion force to the second connecting plate 320, so that the second connecting plate 320 squeezes the plastic part 130, thereby making the first plate surface 321 and the area of ​​the plastic part 130 surrounding the through hole 132 more tightly sealed and matched. At the same time, since the first spring piece 410 electrically connects the second connecting plate 320 and the metal frame 110, the thickness of the second connecting plate 320 does not need to be increased, which can reduce the weight of the connector 300 and reduce the production cost. Of course, the electronic device may not include the first spring piece 410. In this case, the second plate surface 322 can directly contact the metal frame 110 and be electrically connected.

[0025] Optionally, refer to Fig.25 and Fig.26 The first spring piece 410 can be a sawtooth spring piece, and the first spring piece 410 includes a plurality of sawtooth portions 411, a portion of each sawtooth portion 411 contacts the second connecting plate 320, and another portion of each sawtooth portion 411 contacts the metal frame 110, which can increase the contact area between the first spring piece 410 and the metal frame 110 and the second connecting plate 320, thereby further ensuring the stability of the electrical connection, and further ensuring the transmission stability of the antenna signal. Of course, the first spring piece 410 can also be an ordinary flat spring piece, in which case the two ends of the first spring piece 410 can contact the metal frame 110 and the second connecting plate 320 respectively, and be electrically connected.

[0026] Optionally, the adjacent sawtooth portions 411 of the sawtooth spring clip may have an arc-shaped transition, in which case the first spring clip 410 has crests and troughs, and the side where all the crests of the first spring clip 410 are located may contact the metal frame 110 , and the side where all the troughs of the first spring clip 410 are located may contact the second connecting plate 320 .

[0027] Optionally, the first connecting plate 310 and the second connecting plate 320 may be provided separately.

[0028] In another embodiment, the first connecting plate 310 and the second connecting plate 320 may be integrally provided, which may increase the structural strength of the connecting member 300 and reduce the overall assembly complexity of the electronic device.

[0029] Optionally, after the plastic part 130 is injection molded, the metal frame 110 may be assembled on the plastic part 130. For details, please refer to Fig.11 and Fig.12 The metal frame 110 has a limiting groove 112 on one side facing the plastic part 130, and a clamping portion 134 is protruded from the plastic part 130. The clamping portion 134 is clamped in the limiting groove 112 to achieve the effect of assembling the metal frame 110 and the plastic part 130. This assembly method is relatively simple, and it is easier to disassemble and repair the metal frame 110 and the plastic part 130. Of course, the metal frame 110 may not have the limiting groove 112. When the metal frame 110 and the plastic part 130 are assembled, the metal frame 110 and the plastic part 130 may be connected by bonding.

[0030] Optionally, the limiting groove 112 can be an annular limiting groove 112, and the limiting groove 112 can be arranged around the plastic part 130. Correspondingly, the clamping portion 134 can also be an annular clamping portion 134. In this case, the connection area between the metal frame 110 and the plastic part 130 is larger, and the assembly is more stable.

[0031] Optionally, the number of the limiting grooves 112 may be at least two, and each limiting groove 112 may be arranged at intervals in the thickness direction of the frame assembly 100. When the number of the limiting grooves 112 is two, the cross-sectional shape of the metal frame 110 (for details, please refer to Fig.11 and Fig.12 ) is generally E-shaped, and correspondingly, there can be at least two clamping parts 134, each clamping part 134 can be arranged at intervals in the thickness direction of the frame assembly 100, and each limiting groove 112 corresponds to each clamping part 134 one by one, which can further increase the connection area between the metal frame 110 and the plastic part 130, and further ensure the assembly stability of the frame assembly 100.

[0032] Optionally, at least two antenna slots 111 are usually provided on the metal frame 110. The plurality of antenna slots 111 can enhance the signal of the electronic device. This means that the metal frame 110 is divided into at least two sections. Figure 6 The number of the connecting members 300 is also at least two, and each connecting member 300 can correspond one-to-one to each segment of the metal frame 110 .

[0033] Optionally, refer to Figure 4The metal frame 110 may include a connected arc segment 113 and a straight segment 114. The at least two connectors 300 may include a first connector 330 and a second connector 340. The second plate surface 322 of the first connector 330 may be an arc surface 323, and the arc surface 323 is electrically connected to the arc segment 113. The second plate surface 322 of the second connector 340 may be a plane 324, and the plane 324 is electrically connected to the straight segment 114.

[0034] In this embodiment, since the arc surface 323 is electrically connected to the arc segment 113, and the plane 324 is electrically connected to the straight segment 114, the first connector 330 has a higher degree of fit with the arc segment 113, and the second connector 340 has a higher degree of fit with the straight segment 114, so that the electrical connection is more stable. In addition, when the first elastic sheet 410 is used to electrically connect the metal frame 110 and the connector 300, since the first elastic sheet 410 is easily elastically deformed, the first elastic sheet 410 can be more adapted to the arc surface 323 and the arc segment 113 and the plane 324 and the straight segment 114, that is, the first elastic sheet 410 has a greater degree of fit with the arc surface 323, the arc segment 113, the plane 324 and the straight segment 114, which can further improve the reliability of the electrical connection. Of course, the second plate surface 322 of each connector 300 can be a plane.

[0035] Optionally, refer to Fig.11 and Fig.12 The metal frame 110 may include a first portion 115 and a second portion 116 connected to each other. The first portion 115 and the second portion 116 are arranged along the thickness direction of the frame assembly 100 or the thickness direction of the electronic device. The first portion 115 is electrically connected to the connector 300. In the thickness direction of the metal frame 110, the thickness of the first portion 115 may be greater than the thickness of the second portion 116. The thickness direction of the metal frame 110 here may specifically be the setting direction of the metal frame 110 and the connector 300, which may specifically be Fig.10 The direction indicated by the arrow X in the figure.

[0036] In this embodiment, since the thickness of the first part 115 is greater than the thickness of the second part 116, the structural strength of the first part 115 is relatively large. When the metal frame 110 is hit, the first part 115 is not easily deformed or broken. Since the thicker first part 115 of the metal frame 110 is electrically connected to the connector 300, the electrical connection stability between the first part 115 and the connector 300 can be ensured, thereby ensuring the stability of signal transmission. Of course, the thickness of the first part 115 can also be equal to or less than the thickness of the second part 116.

[0037] Optionally, in the thickness direction of the frame assembly 100 or the thickness direction of the electronic device, the first part 115 can be located between the two limit grooves 112, that is, the first part 115 is centered relative to the metal frame 110, so that the connector 300 is also centered relative to the frame assembly 100, and thus the frame assembly 100 can fully protect the connector 300 and is conducive to force balance.

[0038] Optionally, the material of the metal frame 110 is different from the material of the support 120, and the density of the material of the metal frame 110 is greater than the density of the material of the support 120. For example, the material of the metal frame 110 can be stainless steel or titanium alloy with greater structural strength and hardness, which can ensure that the metal frame 110 can effectively prevent the electronic device from being deformed and damaged when it is hit or squeezed. The material of the support 120 can be aluminum, so that the density of the material of the metal frame 110 is greater than the density of the material of the support 120, which can reduce the overall weight of the frame assembly 100 to a certain extent, and then reduce the weight of the electronic device. Of course, the material of the metal frame 110 and the material of the support 120 can also be the same.

[0039] Optionally, refer to Fig.31 and Fig.32 The present application also discloses a method for preparing an electronic device, which is applied to the electronic device described in any of the above embodiments, and the method includes: S100 , forming an integral support member 120 and a connecting member 300 by die casting.

[0040] Specifically, please refer to Fig.29 , the present application can adopt a die-casting machine to die-cast the support member 120 and the connector 300, so that the support member 120 and the connector 300 are made in one piece, that is, the support member 120 and the connector 300 are connected by the connecting section 510, the support member 120 can support the circuit board 200, and the connector 300 can play an electrical connection role, that is, this arrangement method can facilitate the simultaneous acquisition of the support member 120 and the connector 300. Of course, in other embodiments, the support member 120 and the connector 300 can be formed by die-casting separately or processed by the CNC processing technology mentioned in the background technology.

[0041] S200 , disconnect the support member 120 and the connection member 300 .

[0042] Specifically, please refer to Fig.30In the present application, a cutting machine or CNC processing technology can be used to cut the connecting member 300 from the supporting member 120, that is, to cut the connecting section 510, so as to disconnect the supporting member 120 and the connecting member 300, so that the supporting member 120 and the connecting member 300 can function separately, which can greatly shorten the manufacturing process time and further reduce costs.

[0043] S300 , filling the plastic part 130 between the metal frame 110 and the support part 120 and in the antenna gap 111 .

[0044] Specifically, first, the support member 120 can be placed in a mold. Secondly, the present application can use an injection molding machine to inject the molten plastic into the mold by heating and pressurizing to form a plastic part 130. That is, at this time, the plastic part 130 is arranged around the support member 120. Finally, the plastic part 130 and the support member 120 are assembled as a whole in the metal frame 110. That is, this arrangement method can make the plastic part 130 fill between the metal frame 110 and the support member 120 and at the antenna gap 111. The plastic part 130 filled in the antenna gap 111 (specifically, it can be the above-mentioned filling part 131 of the plastic part 130) can be used to achieve the effect of antenna isolation, thereby ensuring communication quality.

[0045] The preparation method of the electronic device disclosed in the embodiment of the present application forms the support member 120 and the connector 300 by die-casting, that is, the present application adopts CNC processing technology to only process a small part of the frame assembly 100, which can reduce the difficulty of processing the frame assembly 100 to a certain extent and reduce the manufacturing cost at the same time.

[0046] Optionally, after the above step S300 , the method may further include: opening an inner cavity 140 between the plastic component 130 and the support component 120 for arranging the circuit board 200 .

[0047] Specifically, the present application can use CNC processing technology to open an inner cavity 140 for arranging the circuit board 200 between the plastic part 130 and the support part 120. At this time, the plastic part 130 and the support part 120 can jointly support the circuit board 200 and protect the circuit board 200 at the same time.

[0048] Optionally, the method may further include: S400 , stamping to form the first section 117 and the second section 118 of the metal frame 110 .

[0049] Specifically, please refer to Fig.14 The present application can use a punching machine to punch out the first section 117 and the second section 118 of the metal frame 110, and the first section 117 and the second section 118 can be two parallel strip structures. Of course, the present application can use CNC processing technology to process the metal frame 110.

[0050] S500, a limiting groove 112 and an antenna gap 111 are provided on the first section 117 and the second section 118.

[0051] Specifically, please refer to Figures 15 to 18 In the present application, the CNC processing technology can be used to process the above-mentioned limiting groove 112 and antenna gap 111 on the first section 117 and the second section 118, and the limiting groove 112 is used to limit the plastic part 130.

[0052] S600 , bend and connect the first section 117 and the second section 118 to form a metal frame 110 .

[0053] Specifically, please refer to Figures 19 to 22 In the process of making the metal frame 110, firstly, the first section 117 and the second section 118 need to be bent into the required shape so that the first section 117 and the second section 118 can form a frame structure after being connected. Secondly, the first section 117 and the second section 118 are welded to form a metal frame 110 that meets the requirements. Finally, the metal frame 110 can be assembled on the plastic part 130 and the support part 120 to form the frame assembly 100.

[0054] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An electronic device, characterized in that: It comprises a frame assembly (100), a circuit board (200) and a connecting piece (300), The frame assembly (100) comprises a separately arranged metal frame (110) and a support member (120) for supporting the circuit board (200); the metal frame (110) is arranged around the support member (120); an antenna slit (111) is provided in the metal frame (110); and the connector (300) electrically connects the circuit board (200) and the metal frame (110).

2. The electronic device according to claim 1, characterized in that: The frame assembly (100) further comprises a plastic part (130), the plastic part (130) being provided with a filling portion (131) protruding therefrom, the filling portion (131) being filled in the antenna gap (111); The connecting member (300) comprises a first connecting plate (310) and a second connecting plate (320) which are connected to each other. The extension direction of the first connecting plate (310) intersects with the extension direction of the second connecting plate (320). The plastic member (130) is provided with a through hole (132). One end of the first connecting plate (310) passes through the through hole (132) and is connected to the circuit board (200). The second connecting plate (320) has a first plate surface (321) and a second plate surface (322) which are arranged opposite to each other. The other end of the first connecting plate (310) is connected to the first plate surface (321), and the second plate surface (322) is electrically connected to the metal frame (110).

3. The electronic device according to claim 2, characterized in that: The electronic device further comprises a first spring sheet (410); the plastic part (130) further comprises a mounting hole (133) connected to the through hole (132); the first spring sheet (410) is mounted in the mounting hole (133) so that the first spring sheet (410) is located between the second connecting plate (320) and the metal frame (110); and the first spring sheet (410) electrically connects the second connecting plate (320) and the metal frame (110).

4. The electronic device according to claim 3, characterized in that: The first spring piece (410) is a sawtooth-shaped spring piece, and the first spring piece (410) comprises a plurality of sawtooth portions (411), a portion of each sawtooth portion (411) contacts the second connecting plate (320), and another portion of each sawtooth portion (411) contacts the metal frame (110).

5. The electronic device according to claim 2, characterized in that: The first connecting plate (310) and the second connecting plate (320) are integrally arranged.

6. The electronic device according to claim 2, characterized in that: A limiting groove (112) is provided on a side of the metal frame (110) facing the plastic part (130), and a clamping portion (134) is protruding from the plastic part (130), and the clamping portion (134) is clamped in the limiting groove (112).

7. The electronic device according to claim 2, characterized in that: The metal frame (110) comprises a connected arc segment (113) and a straight segment (114); the number of the connecting members (300) is at least two, including a first connecting member (330) and a second connecting member (340); the second plate surface (322) of the first connecting member (330) is an arc surface (323), and the arc surface (323) is electrically connected to the arc segment (113); the second plate surface (322) of the second connecting member (340) is a plane (324), and the plane (324) is electrically connected to the straight segment (114).

8. The electronic device according to claim 1, characterized in that: The metal frame (110) comprises a first part (115) and a second part (116) which are connected to each other; the first part (115) and the second part (116) are arranged along the thickness direction of the electronic device; the first part (115) is electrically connected to the connecting member (300); and in the thickness direction of the metal frame (110), the thickness of the first part (115) is greater than the thickness of the second part (116).

9. The electronic device according to claim 1, characterized in that: The material of which the metal frame (110) is made is different from the material of which the support member (120) is made, and the density of the material of which the metal frame (110) is made is greater than the density of the material of which the support member (120) is made.

10. A method for preparing an electronic device, applied to the electronic device according to any one of claims 1 to 9, characterized in that: The method comprises: The support member (120) and the connecting member (300) are integrally formed by die casting; Disconnecting the support member (120) and the connecting member (300); A plastic part (130) is filled between the metal frame (110) and the support part (120) and in the antenna gap (111).

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