Slicing method and slicing machine

Abstract

The embodiment of the invention relates to the field of monocrystalline silicon production, and provides a slicing method and a slicer. The slicing method comprises the steps that a bearing device is controlled to drive a crystal bar towards a linear cutting device; when an induction signal of the detection sensor is received, the linear cutting device is controlled to operate according to a first operation parameter, the induction signal is used for representing that the crystal bar is driven to an initial position, the initial position is located on the side, close to the bearing device, of the linear cutting device, and the distance between the initial position and the linear cutting device in the driving direction of the bearing device is 0.4 mm-1mm; and when the bearing device drives the crystal bar to the feeding position, the wire cutting device is controlled to operate according to the second operation parameter. The slicing method and the slicing machine provided by the embodiment of the invention are at least beneficial to improving the yield and the production efficiency of the wafer.

Description

Technical Field

[0001] The disclosed embodiments relate to the field of single crystal silicon production, and in particular to a slicing method and a slicing machine. Background Art

[0002] Wafers are widely used in the photovoltaic and semiconductor industries. Wafers are usually obtained by cutting the crystal rods with a slicer. During the processing of wafers, operators will press the rods by manual visual inspection to align the distance between the crystal rod and the wire cutting device of the slicer. Manual visual inspection of the rod pressing can easily cause abnormal pressing, thus affecting the yield and production efficiency of the wafer. Summary of the invention

[0003] The embodiments of the present disclosure provide a slicing method and a slicing machine, which are at least beneficial to improving the yield and production efficiency of chips.

[0004] According to some embodiments of the present disclosure, the embodiments of the present disclosure provide a slicing method for a slicing machine, the slicing machine comprising a carrying device for carrying and driving a crystal rod, a wire cutting device for cutting the crystal rod into wafers, and a detection sensor for being triggered by the crystal rod;

[0005] The slicing method comprises:

[0006] Controlling the carrying device to drive the crystal rod toward the wire cutting device;

[0007] When receiving the sensing signal from the detection sensor, the wire cutting device is controlled to operate with a first operating parameter, wherein the sensing signal is used to indicate that the crystal rod is driven to a starting position, the starting position is located on a side of the wire cutting device close to the carrier device, and the distance between the starting position and the wire cutting device in the driving direction of the carrier device is 0.4 mm to 1 mm;

[0008] When the carrier device drives the crystal rod to the feed position, the wire cutting device is controlled to operate with a second operating parameter.

[0009] In some embodiments, the first operating parameter includes a first line speed, and the first line speed is 600 m / min to 1000 m / min.

[0010] In some embodiments, the first operating parameter includes a first wire feeding amount, and the first wire feeding amount is 700m to 800m.

[0011] In some embodiments, the second operating parameter includes a second line speed, and the second line speed is 900 m / min to 1200 m / min.

[0012] In some embodiments, the second operating parameter includes a second wire feeding amount, and the second wire feeding amount is 460m to 600m.

[0013] In some embodiments, the slicer further includes a lifting drive mechanism, and the lifting drive mechanism is used to drive the detection sensor to rise and fall along the driving direction of the carrying device;

[0014] Before controlling the wire cutting device to operate with the first operating parameter upon receiving the sensing signal from the detection sensor, the slicing method further comprises: controlling the carrying device to drive the detection sensor to rise to the detection position; and controlling the carrying device to drive the detection sensor to descend to the standby position upon receiving the sensing signal from the detection sensor.

[0015] In some embodiments, a plurality of detection sensors are arranged at intervals along the circumference of the crystal rod; when receiving the sensing signal of the detection sensor, controlling the wire cutting device to operate with the first operating parameter includes: when receiving the sensing signal of all the detection sensors, controlling the wire cutting device to operate with the first operating parameter.

[0016] In some embodiments, the slicer further includes a debris slot, and the detection sensor is disposed on the debris slot.

[0017] According to some embodiments of the present disclosure, another aspect of the present disclosure further provides a slicer, including:

[0018] A carrying device, the carrying device is used to carry and drive the crystal rod;

[0019] A wire cutting device, the wire cutting device is located on a side of the carrying device close to the crystal rod in the driving direction of the carrying device, and the wire cutting device is used to cut the crystal rod into wafers;

[0020] A detection sensor, the detection sensor being used to trigger and generate an induction signal when the crystal rod is driven to a starting position by the carrying device;

[0021] A control device, the control device is electrically connected to the carrying device, the wire cutting device, and the detection sensor, and the control device is used to execute the slicing method as described in any one of the above embodiments.

[0022] In some embodiments, the slicer further comprises a sensor carrier and a detection member, and the detection member and the detection sensor are arranged on the sensor carrier;

[0023] The detection member is arranged relative to the sensor carrier so as to be movable along the driving direction. A contact portion and a trigger portion are arranged on the detection member. The contact portion is used to contact the crystal rod so as to drive the detection member to move through the crystal rod. The trigger portion is opposite to the detection sensor in the driving direction so as to trigger the detection sensor through the trigger portion.

[0024] The technical solution provided by the embodiments of the present disclosure has at least the following advantages:

[0025] In the slicing method provided by the embodiment of the present disclosure, when the carrier device of the slicer drives the crystal rod to move to the starting position at a preset distance from the wire cutting device, the crystal rod carried by the carrier device can trigger the detection sensor to generate a sensing signal, so that the position where the crystal rod triggers the detection sensor can be used as the starting position, and the sensing signal received from the detection sensor can be used as a confirmation signal that the crystal rod has reached the starting position. Compared with the manual visual rod pressing method, this rod pressing method relying on the detection sensor can greatly improve the rod pressing accuracy and reduce the rod pressing error. The improved rod pressing accuracy can set the starting position closer to the wire cutting device, thereby reducing the process cycle time; the improved rod pressing accuracy can also improve the operating parameters of the wire cutting device, not only allowing the cutting depth of the wire cutting device to quickly pass through the chamfer position of the crystal rod, reducing the probability of abnormalities such as wire jumpers and twisted wires in the wire cutting device, but also reducing the reversing cycle of the wire cutting device, thereby improving the wire network stability of the wire cutting device. In addition, the rod pressing method relying on the detection sensor can realize automatic rod pressing of the crystal rod, thereby improving the production efficiency of the wafer, reducing the manual operation content, and making the rod pressing operation of the crystal rod easier. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] One or more embodiments are exemplarily illustrated by pictures in the corresponding drawings, and these exemplified descriptions do not constitute a limitation on the embodiments. Unless otherwise specified, the pictures in the drawings do not constitute a scale limitation. In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the traditional technology, the drawings required for use in the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A schematic structural diagram of a slicer provided in one embodiment of the present disclosure;

[0028] Figure 2 for Figure 1 Schematic diagram of the structure at the middle debris slot;

[0029] Figure 3 for Figure 2 Structural schematic diagram of the tool setting device;

[0030] Figure 4 for Figure 3 A cross-sectional view of the tool setting device;

[0031] Figure 5 for Figure 3 Schematic diagram of the structure of the detection part;

[0032] Figure 6 A flowchart of a slicing method provided in one embodiment of the present disclosure. DETAILED DESCRIPTION

[0033] As can be seen from the background technology, the current rod pressing method is to place the crystal rod on the workbench of the slicer, align the distance between the crystal rod and the cutting line of the wire cutting device, so that the crystal rod is parallel to the movement direction of the wire cutting device and perpendicular to the cutting plane of the wire cutting device. The operator controls the up and down movement of the crystal rod through the machine panel button of the slicer, and visually detects whether the distance between the crystal rod and the cutting line meets the process accuracy requirements to complete the crystal rod pressing (that is, tool alignment). After the operation is completed, manually click the machine panel to zero, and subsequent slicing programs use this position as the starting position. The success rate of the manual visual rod pressing method is about 80%, which is easy to cause rod pressing abnormalities. If the rod pressing does not meet the standard, the cutting position will not match the position set by the process program, which will cause deviations in the execution of the slicing end process, which will affect the quality data of the chip and cause the abnormality rate in the slicing process to increase.

[0034] The present disclosure provides a slicing method and a slicing machine. When the carrier device of the slicing machine drives the crystal rod to move to the starting position at a preset distance from the wire cutting device, the crystal rod carried by the carrier device can trigger the detection sensor to generate a sensing signal. In this way, the position where the crystal rod triggers the detection sensor can be used as the starting position, and the sensing signal received from the detection sensor can be used as a confirmation signal that the crystal rod has reached the starting position. Compared with the manual visual rod pressing method, this rod pressing method relying on the detection sensor can greatly improve the rod pressing accuracy and reduce the rod pressing error. The improved rod pressing accuracy can set the starting position closer to the wire cutting device, thereby reducing the process cycle time; the improved rod pressing accuracy can also improve the operating parameters of the wire cutting device, not only allowing the cutting depth of the wire cutting device to quickly pass the chamfer position of the crystal rod, reducing the probability of abnormalities such as wire jumpers and twisted wires in the wire cutting device, but also reducing the reversing cycle of the wire cutting device, thereby improving the wire network stability of the wire cutting device. In addition, the rod pressing method relying on the detection sensor can realize the automatic rod pressing of the crystal rod, thereby improving the production efficiency of the wafer, reducing the manual operation content, and making the rod pressing operation of the crystal rod easier.

[0035] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined. Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0036] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0037] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists, A and B exist at the same time, and B exists. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0038] In the description of the embodiments of the present application, the orientation or positional relationship indicated by the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. For example, if the device or element in the figure is inverted, then the element described as being "below" or "below" or "below" or "bottom" of other elements or features will be oriented "above" or "top" of the other elements or features. Therefore, the term "below" may cover both the above and below orientations depending on the context in which the term is used, which will be obvious to a person of ordinary skill in the art. The material may be oriented in other ways (e.g., rotated 90 degrees, inverted, flipped), and the spatially relative descriptors used herein may be interpreted accordingly.

[0039] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0040] In the accompanying drawings corresponding to the embodiments of the present application, the thickness and area of ​​the layers are exaggerated for better understanding and ease of description. In addition, when describing that a component is "substantially" formed on another component, it means that the component is not formed on the entire surface (or front surface) of the other component, nor is it formed on a partial edge of the entire surface.

[0041] In the description of the embodiments of the present application, when a certain component "includes" another component, unless otherwise specified, other components are not excluded, and other components may be further included. A second component is formed or provided above or on the first component, or a second component is formed or provided on the surface of the first component, or a second component is formed or provided on one side of the first component, which may include an embodiment in which the first component and the second component are in direct contact, and may also include an embodiment in which an additional component may be provided between the first component and the second component, so that the first component and the second component may not be in direct contact. For the sake of simplicity and clarity, various components may be drawn arbitrarily in different proportions. In the accompanying drawings, some layers / components may be omitted for simplicity. Unless otherwise specified, a second component is formed or provided on the surface of the first component, which means that the first component is in direct contact with the second component. Among them, the above-mentioned "component" may refer to a layer, a film, an area, a part, a structure, etc.

[0042] The terms used in the description of the various embodiments described herein are only used to describe specific embodiments and are not intended to be limiting. As used in the description of the various embodiments described and in the appended claims, "the components" are also intended to include plural forms unless the context clearly indicates otherwise. Among them, components include components such as layers, films, regions, or plates.

[0043] The following will describe the various embodiments of the present disclosure in detail with reference to the accompanying drawings. However, it will be appreciated by those skilled in the art that in the various embodiments of the present disclosure, many technical details are provided in order to enable the reader to better understand the present disclosure. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed in the present disclosure can be implemented.

[0044] Figures 1 to 5A schematic diagram of the structure of a slicer provided in an embodiment of the present disclosure.

[0045] refer to Figures 1 to 4 The slicer 1000 includes a carrying device 100, a wire cutting device 200, a detection sensor 310 and a control device (not shown in the figure), wherein the carrying device 100 is used to carry and drive the crystal rod J; the wire cutting device 200 is located on a side of the carrying device 100 close to the crystal rod J in the driving direction of the carrying device 100, and the wire cutting device 200 is used to cut the crystal rod J into wafers; the detection sensor 310 is used to trigger the generation of an induction signal when the crystal rod J is driven to the starting position by the carrying device 100; the control device is electrically connected to the carrying device 100, the wire cutting device 200 and the detection sensor 310.

[0046] Specifically, the crystal rod J is usually a square rod, and the crystal rod J is provided with four chamfers. The carrying device 100 usually includes a carrying member 110 and a driving mechanism 120. The crystal rod J can be fixed on a surface of the carrying member 110 by bonding or the like. The surface of the carrying member 110 away from the crystal rod J is connected to the driving end of the driving mechanism 120. The driving mechanism 120 can drive the carrying member 110 to move, so as to drive the crystal rod J to rise and fall through the carrying member 110, wherein the driving mechanism 120 can be a cylinder or a motor, etc. The driving direction of the carrying device 100 is defined as the up-down direction, and the driving mechanism 120 is located on the upper side of the carrying member 110. Then the crystal rod J can be fixed on the lower surface of the carrying member 110, so as to realize the carrying of the crystal rod J by the carrying device 100, and when the crystal rod J is fixed on the lower surface of the carrying member 110, the length direction and the width direction of the crystal rod J are both perpendicular or approximately perpendicular to the up-down direction. The driving mechanism 120 can drive the carrier 110 to move up and down, so as to drive the crystal rod J to rise and fall through the carrier 110 , thereby achieving driving of the crystal rod J through the carrier device 100 .

[0047] The wire cutting device 200 is located at the lower side of the carrier 100, and the wire cutting device 200 generally includes a cutting wire 210 and a transmission mechanism 220. The cutting wire 210 is a component for cutting the crystal rod J. A plurality of cutting wires 210 are arranged at intervals on the transmission mechanism 220 along the length direction of the crystal rod J. The transmission mechanism 220 can drive the plurality of cutting wires 210 to move along the extension direction of the cutting wires 210, wherein the transmission mechanism 220 can be a transmission roller, etc. In the process of the carrier 100 driving the crystal rod J to descend, the crystal rod J on the carrier 100 will contact the cutting wire 210 of the wire cutting device 200, so that the crystal rod J on the carrier 100 is cut by the moving cutting wire 210, thereby realizing that the crystal rod J on the carrier 100 is cut into a plurality of wafers by the wire cutting device 200.

[0048] The preset distance above the wire cutting device 200 is used as the starting position, that is, the starting position is located above the wire cutting device 200, and the starting position is spaced from the wire cutting device 200 by a preset distance in the vertical direction. The detection sensor 310 is arranged corresponding to the starting position, so that when the crystal rod J is driven to the starting position by the carrier 100 (that is, the lower surface of the crystal rod J reaches the starting position), the detection sensor 310 is triggered by the crystal rod J at the starting position to generate a sensing signal.

[0049] The control device is electrically connected to the detection sensor 310, and the detection sensor 310 will send a sensing signal to the control device after being triggered. When the control device receives the sensing signal from the detection sensor 310, the control device will determine that the crystal rod J has reached the starting position. In this way, the position where the crystal rod J triggers the detection sensor 310 can be used as the starting position, and the sensing signal received from the detection sensor 310 can be used as a confirmation signal that the crystal rod J has reached the starting position. Compared with the manual visual rod pressing method, this rod pressing method relying on the detection sensor 310 can greatly improve the rod pressing accuracy and reduce the rod pressing error.

[0050] Since the slicer 1000 can improve the accuracy of the bar pressing, the slicer 1000 can set the starting position closer to the wire cutting device 200, thereby reducing the process cycle time. For example, in the manual visual bar pressing method, the spacing between the starting position and the wire cutting device in the upper and lower directions is usually about 1 mm. In some embodiments, the spacing between the starting position and the wire cutting device 200 in the upper and lower directions is a preset distance, and the preset distance is 0.4 mm to 1 mm. For example, the preset distance can be 0.4 mm, 0.45 mm, 0.5 mm, 0.55 mm, 0.6 mm, 0.65 mm, 0.7 mm, 0.75 mm, 0.8 mm, 0.85 mm, 0.9 mm, 0.95 mm or 1 mm, etc.

[0051] The control device is electrically connected to the carrier device 100 and the wire cutting device 200, and the operation of the carrier device 100 and the wire cutting device 200 can be controlled by the control device. Since the slicer 1000 can improve the rod pressing accuracy, the wire cutting device 200 can be controlled by the control device to operate with higher operating parameters. Improving the operating parameters of the wire cutting device 200 not only enables the cutting depth of the wire cutting device 200 to quickly pass through the chamfer position of the crystal rod J, reducing the probability of abnormalities such as wire jumpers and twisted wires in the wire cutting device 200, but also reduces the commutation period of the wire cutting device 200, thereby improving the wire network stability of the wire cutting device 200.

[0052] When the carrier device 100 of the slicer 1000 drives the crystal rod J to move to the starting position at a preset distance from the wire cutting device 200, the crystal rod J carried by the carrier device 100 can trigger the detection sensor 310 to generate a sensing signal, so that the position where the crystal rod J triggers the detection sensor 310 can be used as the starting position, and the sensing signal received from the detection sensor 310 can be used as a confirmation signal that the crystal rod J has reached the starting position. Compared with the manual visual rod pressing method, this rod pressing method relying on the detection sensor 310 can greatly improve the rod pressing accuracy and reduce the rod pressing error. The improved rod pressing accuracy can set the starting position closer to the wire cutting device 200, thereby reducing the process cycle time; the improved rod pressing accuracy can also improve the operating parameters of the wire cutting device 200, not only allowing the cutting depth of the wire cutting device 200 to quickly pass through the chamfered position of the crystal rod J, reducing the probability of abnormalities such as wire jumpers and twisted wires in the wire cutting device 200, but also reducing the reversing cycle of the wire cutting device 200, thereby improving the wire network stability of the wire cutting device 200. Furthermore, the automatic pressing of the crystal ingot J can be realized by relying on the pressing method of the detection sensor 310, thereby improving the production efficiency of the wafer, reducing the manual operation content, and making the pressing operation of the crystal ingot J easier.

[0053] The embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings.

[0054] The detection sensor 310 is used to locate the crystal rod J at the starting position. Figures 1 to 3 , the part of the slicer 1000 used for positioning the crystal rod J at the starting position is defined as the tool setting device 300, and the tool setting device 300 at least includes a detection sensor 310. The detection sensor 310 is triggered by the crystal rod J. The detection sensor 310 can be directly triggered by the crystal rod J, that is, the tool setting device 300 is the detection sensor 310; or the detection sensor 310 can drive a movable member to trigger the detection sensor 310 through the movable member, that is, the crystal rod J indirectly triggers the detection sensor 310 through the movable member, that is, the tool setting device 300 includes the detection sensor 310 and the movable member.

[0055] Optionally, refer to Figures 1 to 5 In some embodiments, the slicer 1000 further includes a sensor carrier 320 and a detection member 330, and the sensor carrier 320 is provided with the detection member 330 and the detection sensor 310; the detection member 330 is arranged to be movable along the driving direction relative to the sensor carrier 320, and the detection member 330 is provided with a contact portion 331 and a trigger portion 332, the contact portion 331 is used to contact with the crystal rod J so as to drive the detection member 330 to move through the crystal rod J, and the trigger portion 332 is opposite to the detection sensor 310 in the driving direction so as to trigger the detection sensor 310 through the trigger portion 332.

[0056] Specifically, the tool setting device 300 includes a detection sensor 310, a sensor carrier 320 and a detection member 330, wherein the sensor carrier 320 is disposed upward on the sensor carrier 320, and the detection member 330 is disposed on the sensor carrier 320 so as to be movable up and down. A contact portion 331 and a trigger portion 332 are convexly disposed on the detection member 330, wherein at least a portion of the contact portion 331 is located directly below the carrier 110, and at least a portion of the trigger portion 332 is located directly above the detection sensor 310. In this way, when the carrier 100 drives the crystal rod J to descend, the lower surface of the crystal rod J will abut against the contact portion 331 of the detection member 330, so that the crystal rod J drives the detection member 330 to move downward, so that the trigger portion 332 of the detection member 330 gradually approaches the detection sensor 310. When the carrier 100 drives the crystal rod J to descend to the starting position, the trigger portion 332 of the detection member 330 will trigger the detection sensor 310. In this way, the crystal rod J indirectly triggers the detection sensor 310 through the detection member 330, which can avoid the setting mode in which the crystal rod J directly triggers the detection sensor 310, and the sensing end of the detection sensor 310 needs to be exposed and set directly below the carrier 110, so that the detection sensor 310 can be hidden inside the sensor carrier 320, so that the sensor carrier 320 can protect the detection sensor 310. And the sensor carrier 320 is used as the carrier of the tool setting device 300, so that the tool setting device 300 can be assembled into an independent module, so that it is convenient to set the tool setting device 300 on the slicer 1000.

[0057] The detection member 330 is provided with a contact portion 331 and a trigger portion 332. The specific shapes of the contact portion 331 and the trigger portion 332 can be set according to actual conditions. The contact portion 331 and the trigger portion 332 can be set in a plate shape or a strip shape. Figures 2 to 5 In some embodiments, the protruding direction of one of the contact portion 331 and the trigger portion 332 is the length direction of the crystal ingot J, and the protruding direction of the other is the width direction of the crystal ingot J. For example, when the contact portion 331 is used to abut against one end of the crystal ingot J in the length direction, the protruding direction of the contact portion 331 is the length direction of the crystal ingot J; when the contact portion 331 is used to abut against one end of the crystal ingot J in the width direction, the protruding direction of the contact portion 331 is the width direction of the crystal ingot J.

[0058] Optionally, refer to Figures 2 to 5 In some embodiments, a housing cavity 321 is provided in the sensor carrier 320, and an avoidance hole 322 communicating with the housing cavity 321 is provided on the sensor carrier 320. The detection sensor 310 is provided in the housing cavity 321, the detection member 330 is provided at the avoidance hole 322, and the contact portion 331 extends from the avoidance hole 322 to the outside of the housing cavity 321.

[0059] Specifically, the detection member 330 includes a detection member body, which is located in the accommodating cavity 321. A contact portion 331 and a trigger portion 332 are convexly provided on the peripheral side of the detection member body. The trigger portion 332 is located in the accommodating cavity 321, and one end of the contact portion 331 away from the detection member body extends out of the accommodating cavity 321 from the avoidance hole 322. The sensor carrier 320 is arranged in the accommodating cavity 321 corresponding to the trigger portion 332. In this way, the detection sensor 310 is arranged in the accommodating cavity 321 of the sensor carrier 320, so that the sensor carrier 320 can protect the detection sensor 310.

[0060] Further, refer to Figures 2 to 5 In some embodiments, a guide column 323 extending along the moving direction of the detection member 330 is provided on the inner wall of the accommodating cavity 321, and a guide hole 333 for the guide column 323 to pass through is provided on the detection member 330. The guide hole 333 and the guide column 323 form a sliding guide fit in the moving direction of the detection member 330.

[0061] Specifically, a guide post 323 extending in the vertical direction is provided in the accommodating cavity 321, and a guide hole 333 is provided on the detection member 330 corresponding to the guide post 323, and the guide post 323 passes through the detection member 330 from the guide hole 333, and the guide hole 333 and the guide post 323 form a sliding guide fit in the vertical direction. In this way, through the sliding fit between the guide hole 333 and the guide post 323, not only can the detection member 330 be guided in the vertical direction, but also the detection member 330 can be prevented from being separated from the sensor carrier 320.

[0062] Similarly, refer to Figures 2 to 5 In some embodiments, the avoidance hole 322 is extended along the moving direction of the detection member 330 , and the contact portion 331 and the avoidance hole 322 form a sliding guide fit in the moving direction of the detection member 330 .

[0063] Specifically, the avoidance hole 322 is provided in the form of a long hole extending in the vertical direction, and the portion of the contact portion 331 located in the avoidance hole 322 forms a sliding guide fit with the inner hole wall of the avoidance hole 322 in the vertical direction. In this way, through the sliding fit between the contact portion 331 and the avoidance hole 322, the detection member 330 can be slidably guided in the vertical direction.

[0064] Further, refer to Figures 2 to 5In some embodiments, the portion of the contact portion 331 located in the avoidance hole 322 is thickened. That is, the vertical dimension of the portion of the contact portion 331 located in the avoidance hole 322 is larger than the vertical dimension of the portion of the contact portion 331 used to abut against the crystal rod J. In this way, the portion of the contact portion 331 located in the avoidance hole 322 is thickened, which is conducive to ensuring that the contact portion 331 and the avoidance hole 322 can play a better role in sliding guidance for the detection member 330.

[0065] Optionally, refer to Figures 2 to 5 In some embodiments, an elastic reset member 340 is provided between the detection member 330 and the sensor carrier 320 , and the elastic reset member 340 is used for movement and reset of the detection member 330 .

[0066] Specifically, the elastic reset member 340 may be a spring, etc., and the following description will be made by taking the elastic reset member 340 as a spring as an example. The elastic reset member 340 is arranged in an up-down direction, and the two ends of the elastic reset member 340 abut against the detection member 330 and the sensor carrier 320, respectively. When the crystal rod J drives the detection member 330 to move downward, the elastic reset member 340 is compressed or stretched. When the crystal rod J is separated from the detection member 330, the detection member 330 can automatically move upward and reset under the action of the elastic reset member 340.

[0067] When the sensor carrier 320 is provided with a receiving cavity 321, the elastic reset member 340 can be provided in the receiving cavity 321, and the specific setting position of the elastic reset member 340 in the receiving cavity 321 can be set according to actual conditions. Figures 2 to 5 In some embodiments, the elastic reset member 340 is sleeved on the guide column 323 , and the elastic reset member 340 is located on one side of the detection member 330 in the moving direction of the detection member 330 .

[0068] Specifically, the elastic reset member 340 is sleeved on the guide column 323, which can not only realize the installation and positioning of the elastic reset member 340 in the accommodating chamber 321, but also avoid the situation where the elastic reset member 340 and the detection member 330 are disengaged. The elastic reset member 340 can be arranged on the upper side or the lower side of the detection member 330. If the elastic reset member 340 is located on the upper side of the detection member 330, the upper end and the lower end of the elastic reset member 340 are respectively connected to the upper cavity wall of the accommodating chamber 321 and the upper end face of the detection member body, and when the crystal rod J drives the detection member 330 to move downward, the elastic reset member 340 is stretched. If the elastic reset member 340 is located on the lower side of the detection member 330, the upper end and the lower end of the elastic reset member 340 are respectively connected to the lower end face of the detection member body and the lower cavity wall of the accommodating chamber 321, and when the crystal rod J drives the detection member 330 to move downward, the elastic reset member 340 is compressed.

[0069] The specific style of the detection sensor 310 can be set according to actual conditions. The detection sensor 310 can be a contact sensor or a non-contact sensor. Figure 4 In some embodiments, the detection sensor 310 is a button switch, and the triggering portion 332 is used to press and trigger the button switch.

[0070] Specifically, the detection sensor 310 is a button switch that can automatically reset. When the trigger portion 332 of the detection member 330 contacts the button switch, the button switch is closed to generate an induction signal. When the elastic reset member 340 drives the detection member 330 to move upward to reset, the trigger portion 332 of the detection member 330 separates from the button switch, and the button switch automatically disconnects. In this way, using the button switch as the detection sensor 310 can not only reduce the installation cost of the detection sensor 310, but also realize the automatic disconnection and reset of the detection sensor 310.

[0071] The slicer 1000 positions the crystal rod J at the starting position by using the tool setting device 300. The specific number of tool setting devices 300 may be one or multiple tool setting devices 300 may be provided at intervals along the circumference of the crystal rod J. For example, one tool setting device 300 may be provided, and the one tool setting device 300 is provided corresponding to one end of the crystal rod J in the length direction or the width direction; or multiple tool setting devices 300 may be provided, and the multiple tool setting devices 300 are provided corresponding to at least one end of the four ends of the crystal rod J in the length direction and the width direction.

[0072] Optionally, refer to Figure 2 In some embodiments, the carrying device 100 is provided with two sensor carriers 320 on both sides of the length direction of the crystal rod J, and each sensor carrier 320 is provided with a detection member 330 and a detection sensor 310 .

[0073] Specifically, two sensor carriers 320 are provided, that is, two tool setting devices 300 are provided, and the two tool setting devices 300 are respectively provided corresponding to the two ends of the crystal rod J in the length direction. When the crystal rod J is driven to the starting position by the carrier device 100, the two ends of the crystal rod J in the length direction can respectively trigger the detection sensors 310 in the two tool setting devices 300 to generate sensing signals, so that the control device can confirm whether the crystal rod J has reached the starting position according to the two tool setting devices 300, and the crystal rod J is pressed by two tool setting devices 300, which can further improve the pressing accuracy and reduce the pressing error. The following will take the example of setting two tool setting devices 300 corresponding to the two ends of the crystal rod J in the length direction as an example.

[0074] Optionally, refer to Figures 2 to 4In some embodiments, two detection members 330 and two detection sensors 310 are correspondingly disposed on the sensor carrier 320 , and the two detection members 330 are spaced apart along the width direction of the crystal rod J.

[0075] Specifically, each tool setting device 300 includes two detection sensors 310 arranged at intervals along the width direction of the crystal ingot J, so the two tool setting devices 300 are provided with a total of four detection sensors 310. When the crystal ingot J is driven to the starting position by the carrier device 100, the two ends of the crystal ingot J in the length direction can respectively trigger the four detection sensors 310 to generate sensing signals, so that the control device can confirm whether the crystal ingot J reaches the starting position according to the four detection sensors 310, and the crystal ingot J is pressed by the four detection sensors 310, which can further improve the pressing accuracy and reduce the pressing error.

[0076] The specific location of the detection sensor 310 on the slicer 1000 can be set according to actual conditions. The detection sensor 310 can be set on a workbench or a fragment trough 400 of the slicer 1000. Figure 1 and Figure 2 In some embodiments, the slicer 1000 further includes a debris slot 400 , and the detection sensor 310 is disposed on the debris slot 400 .

[0077] Specifically, in the process of cutting the crystal rod J by the wire cutting device 200, some fragments will be generated. The fragment groove 400 can be used to collect the fragments generated in the cutting process to improve the situation of fragment scattering. The tool setting device 300 is arranged on the fragment groove 400, which can make the installation of the tool setting device 300 easier. The following will take the tool setting device 300 arranged on the fragment groove 400 as an example for description.

[0078] Further, refer to Figure 1 and Figure 2 In some embodiments, detection sensors 310 are disposed on both inner groove side walls of the debris groove 400 in the length direction of the crystal ingot J. That is, the two tool setting devices 300 are disposed on the two inner groove side walls of the debris groove 400 in the length direction of the crystal ingot J, respectively.

[0079] Optionally, in other embodiments, the slicer 1000 further includes a lifting drive mechanism, which is power-coupled to the sensor carrier 320 so as to drive the sensor carrier 320 to rise and fall along the moving direction of the detection member 330 through the lifting drive mechanism.

[0080] Specifically, the tool setting device 300 is provided with a debris groove 400 so as to be movable up and down, so that the tool setting device 300 has a detection position and a standby position, and the standby position is located at the lower side of the detection position. When the tool setting device 300 is located at the detection position, the crystal rod J located at the starting position can trigger the tool setting device 300 to generate an induction signal. The lifting drive mechanism can be a cylinder or a motor, etc., and the lifting drive mechanism is coupled with the tool setting device 300 by power, so that the tool setting device 300 can be driven to rise and fall through the lifting drive mechanism. The control device is electrically connected to the lifting drive mechanism. After the crystal rod J is placed on the carrier device 100, the control device controls the lifting drive mechanism to drive the tool setting device 300 located at the standby position to rise to the detection position. After the tool setting device 300 located at the detection position completes the rod pressing, the control device controls the lifting drive mechanism to drive the tool setting device 300 located at the detection position to descend to the standby position, so that the tool setting device 300 can be prevented from interfering with the normal cutting process.

[0081] As described above, the slicer 1000 can improve the precision of the pressing rod, and the improvement of the pressing rod precision can also improve the operating parameters of the wire cutting device 200. Optionally, in some embodiments, when receiving the sensing signal of the detection sensor 310, the control device controls the wire cutting device 200 to operate with the first operating parameter, wherein the first operating parameter includes a first wire speed and / or a first wire feeding amount, the first wire speed is 600m / min to 1000m / min, and the first wire feeding amount is 700m to 800m.

[0082] Specifically, the wire speed of the existing wire cutting device when the crystal rod is at the starting position is usually about 500m / min, while the first wire speed of the wire cutting device 200 when the crystal rod J is at the starting position is 600m / min to 1000m / min, for example, the first wire speed can be 600m / min, 650m / min, 700m / min, 750m / min, 800m / min, 850m / min, 900m / min, 950m / min or 1000m / min, etc. Increasing the wire speed of the wire cutting device 200 when the crystal rod J is at the starting position in this way can enable the cutting depth of the wire cutting device 200 to quickly pass through the chamfer position of the crystal rod J, and reduce the probability of abnormalities such as wire jumpers and twisted wires in the wire cutting device 200.

[0083] The wire feeding amount of the existing wire cutting device when the crystal rod is at the starting position is usually about 680m, while the first wire feeding amount of the wire cutting device 200 when the crystal rod J is at the starting position is 700m-800m, for example, the first wire feeding amount can be 700m, 710m, 720m, 730m, 740m, 750m, 760m, 770m, 780m, 790m or 800m, etc. Increasing the wire feeding amount of the wire cutting device 200 when the crystal rod J is at the starting position can reduce the commutation period of the wire cutting device 200, thereby improving the wire network stability of the wire cutting device 200.

[0084] Optionally, in some embodiments, when the supporting device 100 drives the crystal rod J to the feed position, the wire cutting device 200 is controlled to operate with second operating parameters, and the second operating parameters include a second wire speed and / or a second wire feed amount, the second wire speed is 900m / min~1200m / min, and the second wire feed amount is 460m~600m.

[0085] Specifically, when receiving the sensing signal from the detection sensor 310, the control device controls the wire cutting device 200 to operate with the first operating parameter, and at the same time, the control device controls the carrier device 100 to drive the crystal rod J to continue to descend. When the crystal rod J descends to the feed position, the cutting line 210 of the wire cutting device 200 cuts into the crystal rod J to a preset depth. When the carrier device 100 drives the crystal rod J to reach the feed position, the control device controls the wire cutting device 200 to operate with the second operating parameter. Among them, the preset depth is usually 4mm to 6mm, for example, the preset depth can be 4mm, 4.1mm, 4.2mm, 4.3mm, 4.4mm, 4.5mm, 4.6mm, 4.7mm, 4.8mm, 4.9mm, 5mm, 5.1mm, 5.2mm, 5.3mm, 5.4mm, 5.5mm, 5.6mm, 5.7mm, 5.8mm, 5.9mm or 6mm, etc.

[0086] The wire speed of the existing wire cutting device when the crystal rod is located at the feed position is usually about 800 m / min, and the second wire speed of the wire cutting device 200 when the crystal rod J is located at the feed position is 900 m / min to 1200 m / min. For example, the second wire speed can be 900 m / min, 920 m / min, 940 m / min, 960 m / min, 980 m / min, 1000 m / min, 1020 m / min, 1040 m / min, 1060 m / min, 1080 m / min, 1100 m / min, 1120 m / min, 1140 m / min, 1160 m / min, 1180 m / min or 1200 m / min, etc. Increasing the wire speed of the wire cutting device 200 when the crystal rod J is at the feed position can enable the cutting depth of the wire cutting device 200 to quickly pass through the chamfered position of the crystal rod J, thereby reducing the probability of abnormalities such as wire jumpers and twisted wires occurring in the wire cutting device 200.

[0087] The wire feeding amount of the existing wire cutting device when the crystal rod J is at the feed position is usually about 450m, while the second wire feeding amount of the wire cutting device 200 when the crystal rod J is at the feed position is 460m-600m. For example, the second wire feeding amount can be 460m, 470m, 480m, 490m, 500m, 510m, 520m, 530m, 540m, 550m, 560m, 570m, 580m, 590m or 600m, etc. Increasing the wire feeding amount of the wire cutting device 200 when the crystal rod J is at the feed position can reduce the reversing period of the wire cutting device 200, thereby improving the wire network stability of the wire cutting device 200.

[0088] Slicer 1000 can improve the accuracy of the slicing process by more than 15%, ensure error-free execution of the slicing process, improve chip quality data, and reduce the abnormality rate during the slicing process, achieving the purpose of automated crystal rod J pressing, thereby saving manpower.

[0089] Correspondingly, another embodiment of the present disclosure further provides a slicing method, which can be implemented based on the slicer provided in the above embodiment. The slicing method provided in another embodiment of the present disclosure will be described in detail below in conjunction with the accompanying drawings. For the parts that are the same or corresponding to the previous embodiment, refer to the corresponding description of the previous embodiment, and will not be described in detail below.

[0090] Figure 6 A flowchart of a slicing method provided in an embodiment of the present disclosure.

[0091] refer to Figure 6 , the slicing method includes the following steps:

[0092] Step S610: controlling the carrying device to drive the crystal rod toward the wire cutting device.

[0093] Specifically, refer to Figures 1 to 4 The slicer 1000 includes a carrier 100 for carrying and driving a crystal ingot J, a wire cutting device 200 for cutting the crystal ingot J into wafers, a detection sensor 310 for being triggered by the crystal ingot J, and a control device. The control device is electrically connected to the carrier 100, the wire cutting device 200, and the detection sensor 310. After the crystal ingot J is placed downward on the carrier 100, the control device controls the carrier 100 to drive the crystal ingot J to descend, so that the crystal ingot J moves toward the wire cutting device 200 located at the lower side.

[0094] Step S620: When receiving the sensing signal from the detection sensor, control the wire cutting device to operate with the first operating parameter.

[0095] Specifically, in the process of the carrier device 100 driving the crystal rod J to descend, the crystal rod J will trigger the detection sensor 310 to generate a sensing signal, and the sensing signal is used to indicate that the crystal rod J is driven to the starting position, and the starting position is located on the side of the wire cutting device 200 close to the carrier device 100 (that is, the starting position is located on the upper side of the wire cutting device 200). After the detection sensor 310 generates the sensing signal, the detection sensor 310 will send the sensing signal to the control device. When the control device receives the sensing signal from the detection sensor 310, the control device will determine that the crystal rod J has reached the starting position. In this way, the position where the crystal rod J triggers the detection sensor 310 can be used as the starting position, and the sensing signal received from the detection sensor 310 can be used as a confirmation signal that the crystal rod J has reached the starting position. Compared with the manual visual rod pressing method, this rod pressing method relying on the detection sensor 310 can greatly improve the rod pressing accuracy and reduce the rod pressing error.

[0096] Since the slicer 1000 can improve the accuracy of the pressing rod, the slicer 1000 can set the starting position closer to the wire cutting device 200, thereby reducing the process cycle time. For example, in the manual visual pressing rod method, the spacing between the starting position and the wire cutting device in the up and down direction is usually about 1mm. In some embodiments, the spacing between the starting position and the wire cutting device 200 in the driving direction of the carrier 100 (i.e., up and down) is a preset distance, and the preset distance is 0.4mm to 1mm. For example, the preset distance can be 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm, 0.65mm, 0.7mm, 0.75mm, 0.8mm, 0.85mm, 0.9mm, 0.95mm or 1mm, etc.

[0097] After the control device confirms that the crystal rod J has reached the starting position, the control device controls the wire cutting device 200 to operate with the first operating parameter. The first operating parameter may include at least one of the wire speed, wire feeding amount, wire return amount, and the like.

[0098] Step S630: When the carrier device drives the crystal rod to the feed position, the wire cutting device is controlled to operate with the second operating parameters.

[0099] Specifically, when receiving the sensing signal from the detection sensor 310, the control device controls the wire cutting device 200 to operate with the first operating parameter, and at the same time, the control device controls the carrier device 100 to drive the crystal rod J to continue to descend. When the crystal rod J descends to the feed position, the cutting line 210 of the wire cutting device 200 cuts into the crystal rod J to a preset depth. The preset depth is usually 4 mm to 6 mm, for example, the preset depth can be 4 mm, 4.1 mm, 4.2 mm, 4.3 mm, 4.4 mm, 4.5 mm, 4.6 mm, 4.7 mm, 4.8 mm, 4.9 mm, 5 mm, 5.1 mm, 5.2 mm, 5.3 mm, 5.4 mm, 5.5 mm, 5.6 mm, 5.7 mm, 5.8 mm, 5.9 mm or 6 mm, etc.

[0100] When the carrier device 100 drives the crystal rod J to reach the feed position, the control device controls the wire cutting device 200 to operate with the second operating parameter. The second operating parameter may include at least one of the wire speed, wire feeding amount, wire return amount, and the like.

[0101] The slicer 1000 can improve the bar pressing accuracy, and the improved bar pressing accuracy can also improve the operating parameters of the wire cutting device 200, for example, the operating parameters of the wire cutting device 200 can be improved when the crystal bar J is located at the starting position. Optionally, in some embodiments, the first operating parameter includes a first wire speed, and the first wire speed is 600m / min to 1000m / min.

[0102] Specifically, the wire speed of the existing wire cutting device when the crystal rod is at the starting position is usually about 500m / min, while the first wire speed of the wire cutting device 200 when the crystal rod J is at the starting position is 600m / min to 1000m / min, for example, the first wire speed can be 600m / min, 650m / min, 700m / min, 750m / min, 800m / min, 850m / min, 900m / min, 950m / min or 1000m / min, etc. Increasing the wire speed of the wire cutting device 200 when the crystal rod J is at the starting position in this way can enable the cutting depth of the wire cutting device 200 to quickly pass through the chamfer position of the crystal rod J, and reduce the probability of abnormalities such as wire jumpers and twisted wires in the wire cutting device 200.

[0103] Optionally, in some embodiments, the first operating parameter includes a first wire feeding amount, and the first wire feeding amount is 700m to 800m.

[0104] Specifically, the wire feeding amount of the existing wire cutting device when the crystal rod is located at the starting position is usually about 680m, while the first wire feeding amount of the wire cutting device 200 when the crystal rod J is located at the starting position is 700m-800m, for example, the first wire feeding amount can be 700m, 710m, 720m, 730m, 740m, 750m, 760m, 770m, 780m, 790m or 800m, etc. Increasing the wire feeding amount of the wire cutting device 200 when the crystal rod J is located at the starting position can reduce the commutation period of the wire cutting device 200, thereby improving the wire network stability of the wire cutting device 200.

[0105] Similarly, the operating parameters of the wire cutting device 200 when the crystal rod J is at the feed position may also be improved. Optionally, in some embodiments, the second operating parameters include a second wire speed, and the second wire speed is 900 m / min to 1200 m / min.

[0106] Specifically, the wire speed of the existing wire cutting device when the crystal rod is located at the feed position is generally about 800 m / min, while the second wire speed of the wire cutting device 200 when the crystal rod J is located at the feed position is 900 m / min to 1200 m / min. For example, the second wire speed may be 900 m / min, 920 m / min, 940 m / min, 960 m / min, 980 m / min, 1000 m / min, 1020 m / min, 1040 m / min, 1060 m / min, 1080 m / min, 1100 m / min, 1120 m / min, 1140 m / min, 1160 m / min, 1180 m / min or 1200 m / min, etc. Increasing the wire speed of the wire cutting device 200 when the crystal rod J is at the feed position can enable the cutting depth of the wire cutting device 200 to quickly pass through the chamfered position of the crystal rod J, thereby reducing the probability of abnormalities such as wire jumpers and twisted wires occurring in the wire cutting device 200.

[0107] Optionally, in some embodiments, the second operating parameter includes a second wire feeding amount, and the second wire feeding amount is 460m to 600m.

[0108] Specifically, the wire feeding amount of the existing wire cutting device when the crystal rod J is at the feed position is usually about 450m, while the second wire feeding amount of the wire cutting device 200 when the crystal rod J is at the feed position is 460m-600m, for example, the second wire feeding amount can be 460m, 470m, 480m, 490m, 500m, 510m, 520m, 530m, 540m, 550m, 560m, 570m, 580m, 590m or 600m, etc. Increasing the wire feeding amount of the wire cutting device 200 when the crystal rod J is at the feed position can reduce the commutation period of the wire cutting device 200, thereby improving the wire network stability of the wire cutting device 200.

[0109] refer to Figures 2 to 4 When a plurality of detection sensors 310 are arranged at intervals along the circumference of the crystal ingot J, step S620 includes: when receiving the sensing signals of all the detection sensors 310, controlling the wire cutting device 200 to operate with the first operating parameter. In this way, the control device can confirm whether the crystal ingot J reaches the starting position according to the plurality of detection sensors 310, and the crystal ingot J is pressed by the plurality of detection sensors 310, which can further improve the pressing accuracy and reduce the pressing error.

[0110] When the slicer 1000 also includes a lifting drive mechanism, which is used to drive the detection sensor 310 to rise and fall along the driving direction of the carrying device 100, before step S620, the slicing method also includes: controlling the carrying device 100 to drive the detection sensor 310 to rise to the detection position; and when receiving the sensing signal of the detection sensor 310, controlling the carrying device 100 to drive the detection sensor 310 to descend to the standby position.

[0111] Specifically, the lifting drive mechanism can drive the detection sensor 310 (i.e., the tool setting device 300) to move up and down, so that the detection sensor 310 has a detection position and a standby position, and the standby position is located on the lower side of the detection position. When the detection sensor 310 is located at the detection position, the crystal rod J located at the starting position can trigger the detection sensor 310 to generate an induction signal. After the crystal rod J is placed on the carrier 100, the control device controls the lifting drive mechanism to drive the detection sensor 310 located at the standby position to rise to the detection position. After the detection sensor 310 located at the detection position completes the rod pressing, the control device controls the lifting drive mechanism to drive the detection sensor 310 located at the detection position to descend to the standby position, so that the detection sensor 310 can be prevented from interfering with the normal cutting process.

[0112] Those skilled in the art can understand that the above-mentioned embodiments are specific examples for realizing the present disclosure, and in practical applications, various changes can be made to them in form and details without departing from the spirit and scope of the present disclosure. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure, so the protection scope of the present disclosure shall be based on the scope defined in the claims.

Claims

1. A slicing method, used for a slicing machine, characterized in that: The slicer includes a carrying device for carrying and driving a crystal rod, a wire cutting device for cutting the crystal rod into wafers, and a detection sensor for being triggered by the crystal rod; The slicing method comprises: Controlling the carrying device to drive the crystal rod toward the wire cutting device; When receiving the sensing signal from the detection sensor, the wire cutting device is controlled to operate with a first operating parameter, wherein the sensing signal is used to indicate that the crystal rod is driven to a starting position, the starting position is located on a side of the wire cutting device close to the carrier device, and the distance between the starting position and the wire cutting device in the driving direction of the carrier device is 0.4 mm to 1 mm; When the carrier device drives the crystal rod to the feed position, the wire cutting device is controlled to operate with a second operating parameter.

2. The slicing method according to claim 1, characterized in that: The first operating parameter includes a first line speed, and the first line speed is 600 m / min to 1000 m / min.

3. The slicing method according to claim 1, characterized in that: The first operating parameter includes a first wire feeding amount, and the first wire feeding amount is 700m to 800m.

4. The slicing method according to claim 1, characterized in that: The second operating parameter includes a second line speed, and the second line speed is 900 m / min to 1200 m / min.

5. The slicing method according to claim 1, characterized in that: The second operating parameter includes a second wire feeding amount, and the second wire feeding amount is 460m to 600m.

6. The slicing method according to claim 1, characterized in that: The slicer further comprises a lifting drive mechanism, and the lifting drive mechanism is used to drive the detection sensor to rise and fall along the driving direction of the carrying device; Before controlling the wire cutting device to operate with the first operating parameter upon receiving the sensing signal from the detection sensor, the slicing method further comprises: controlling the carrying device to drive the detection sensor to rise to a detection position; When the sensing signal of the detection sensor is received, the carrying device is controlled to drive the detection sensor to descend to a standby position.

7. The slicing method according to claim 1, characterized in that: The detection sensors are arranged in plurality along the circumference of the crystal rod at intervals; when receiving the sensing signals from the detection sensors, the wire cutting device is controlled to operate with the first operating parameters, including: when receiving the sensing signals from all the detection sensors, the wire cutting device is controlled to operate with the first operating parameters.

8. The slicing method according to claim 1, characterized in that: The slicer further comprises a debris slot, and the detection sensor is arranged on the debris slot.

9. A slicer, characterized in that: include: A carrying device, the carrying device is used to carry and drive the crystal rod; A wire cutting device, the wire cutting device is located on a side of the carrying device close to the crystal rod in the driving direction of the carrying device, and the wire cutting device is used to cut the crystal rod into wafers; A detection sensor, the detection sensor being used to trigger and generate an induction signal when the crystal rod is driven to a starting position by the carrying device; A control device, wherein the control device is electrically connected to the carrying device, the wire cutting device, and the detection sensor, and the control device is used to execute the slicing method as described in any one of claims 1-8.

10. The slicer according to claim 9, characterized in that: The slicer further comprises a sensor carrier and a detection member, wherein the detection member and the detection sensor are arranged on the sensor carrier; The detection member is arranged relative to the sensor carrier so as to be movable along the driving direction. A contact portion and a trigger portion are arranged on the detection member. The contact portion is used to contact the crystal rod so as to drive the detection member to move through the crystal rod. The trigger portion is opposite to the detection sensor in the driving direction so as to trigger the detection sensor through the trigger portion.

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