Cutting equipment

By designing cutting equipment and support parts with alternating wire troughs, the wire hanging and stagnation problems in the cutting process in silicon wafer production are solved, the cutting quality and silicon wafer performance are improved, and the efficiency of battery cells and photovoltaic modules is improved.

CN119283216APending Publication Date: 2025-01-10JINKO SOLAR CO LTD +1
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Patent Information

Application Number
CN202411746022.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-29
Publication Date
2025-01-10

AI Technical Summary

Technical Problem

During the silicon wafer production process, problems such as wire hanging and stuck are prone to occur when cutting silicon rods, resulting in poor wire breakage and cutting quality, affecting production efficiency and silicon wafer quality.

Method used

A cutting device is designed, including a main roller with alternating wire grooves and a cutting member. By alternately winding the incoming groove and wiring groove arranged on the main roller, the tension of the cutting member is increased and the risk of hanging wires and stuck. And optimize the cutting and degumming process through support and supply devices.

Benefits of technology

It effectively reduces the wire hanging and stagnation during the cutting process, improves the cutting quality and the overall performance of the silicon wafer, and improves the efficiency of the battery cells and photovoltaic modules.

✦ Generated by Eureka AI based on patent content.

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Abstract

The embodiment of the invention provides cutting equipment. The cutting equipment comprises a cutting piece, a first main roller with a first wire groove and a second main roller with a second wire groove. The first wire groove comprises at least one first wire inlet groove and at least one first wire outlet groove, the second wire groove comprises at least one second wire inlet groove and at least one second wire outlet groove, the cutting piece is alternately wound around the first wire inlet groove and the second wire inlet groove, and after the cutting piece extends out of the wire inlet grooves, the cutting piece is wound around the first wiring groove and the second wiring groove in a lower mode. The distance between the second wiring groove and the second wire inlet groove is larger than the distance between the first wiring groove and the first wire inlet groove. By means of the design, the cutting piece can be tightened, the possibility of wire hanging and the like in the cutting process can be reduced, and the cutting quality can be improved.
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Description

Technical Field

[0001] The present application relates to the technical field of silicon wafer production, and in particular to a cutting device. Background Art

[0002] With the development of technology, the application of solar energy equipment such as photovoltaic modules is becoming more and more widespread. Photovoltaic modules include solar cells, and the substrate of solar cells is usually silicon wafers. During production, silicon rods are formed by crystal pulling, and then the silicon rods are cut into silicon wafers by diamond wire. In the process of cutting silicon rods, wire hanging and other problems are prone to occur, resulting in problems such as wire breakage and jamming, affecting production efficiency, and also causing the cut silicon wafers to have edge collapse and other problems, affecting the quality of silicon wafers. Summary of the invention

[0003] An embodiment of the present application provides a cutting device for improving cutting quality.

[0004] The embodiment of the present application provides a cutting device for cutting a crystal rod, the cutting device comprising:

[0005] a first main roller, wherein the first main roller is provided with a first wire groove;

[0006] a second main roller, wherein the second main roller is provided with a second wire groove;

[0007] A cutting piece, wherein the cutting piece is alternately wound around the first wire groove and the second wire groove;

[0008] Among them, at least one of the first wire grooves is a first wire input groove, at least one of the first wire grooves is a first wiring groove, at least one of the first wire grooves is a second wire input groove, and at least one of the second wire grooves is a second wiring groove. The cutting piece is alternately wound around the first wire input groove and the second wire input groove. After the cutting piece is wound out from the second wire input groove adjacent to the second wiring groove, the cutting piece is wound around the first wiring groove and alternately wound around the first wiring groove and the second wiring groove. The distance between the second wiring groove and the second wire input groove is greater than the distance between the first wiring groove and the first wire input groove.

[0009] In a possible implementation manner, the portion of the cutting member wound around the first main roller and the second main roller through the first wire feeding groove and the second wire feeding groove is a first section, and the portion of the cutting member wound around the first main roller and the second main roller through the first wiring groove and the second wiring groove is a second section, and the second section is used to cut the crystal rod;

[0010] The included angle between the first section and the second section is 0.044° to 0.123°.

[0011] In a possible implementation manner, the second wire groove located between the adjacent second wire inlet groove and the second wiring groove is a spacing groove, and the cutting piece is not arranged around the spacing groove.

[0012] In a possible implementation manner, the first wire groove is an annular groove arranged along the circumference of the first main roller, and each of the first wire grooves is arranged in sequence along the axial direction of the first main roller;

[0013] The second wire groove is an annular groove arranged along the circumference of the second main roller, and the second wire grooves are arranged in sequence along the axial direction of the second main roller.

[0014] In a possible implementation manner, the distance between adjacent first wire grooves is a, and satisfies: 160 micrometers ≤ a ≤ 180 micrometers;

[0015] The distance between adjacent second linear grooves is b, and satisfies: 160 micrometers ≤ b ≤ 180 micrometers.

[0016] In a possible implementation, the first wire groove includes a first side wall and a second side wall, the first side wall is located in a direction of a wire inlet end of the first wire groove close to the first main roller, the second side wall is located in a direction of a wire outlet end of the first main roller, and a distance between the first side wall and the second side wall gradually decreases along a direction close to an axis of the first main roller, and an angle between the first side wall and the second side wall is 20° to 50°;

[0017] The second wire groove includes a third side wall and a fourth side wall, the third side wall is located in the direction of the wire input end of the second wire groove close to the second main roller, and the fourth side wall is located in the direction of the wire output end of the second main roller, and along the direction close to the axis of the second main roller, the distance between the third side wall and the fourth side wall gradually decreases, and the angle between the third side wall and the fourth side wall is 20° to 50°.

[0018] In a possible implementation manner, the angle between the first side wall and the radial direction of the first main roller is 12.5° to 37.5°;

[0019] The angle between the second side wall and the radial direction of the first main roller is 12.5° to 13.5°;

[0020] The angle between the third side wall and the radial direction of the second main roller is 12.5° to 37.5°;

[0021] An included angle between the fourth side wall and the radial direction of the second main roller is 12.5° to 13.5°.

[0022] In a possible implementation, the cutting device further includes a support member, the support member is used to place the crystal rod, the support member is provided with a cavity, and at least one end of the cavity passes through the support member along the length direction of the support member.

[0023] In a possible implementation, the support member includes a support surface, the support surface is used to place the crystal rod, and the distance between the cavity and the support surface is 2 mm to 4 mm.

[0024] In a possible embodiment, the cutting equipment further includes a pay-off wheel, a take-up wheel and a supply device, wherein the pay-off wheel is used to release the cutting piece, the take-up wheel is used to store the cutting piece, and the supply device is used to supply cutting fluid to the first main roller and / or the second main roller.

[0025] The embodiment of the present application provides a cutting device, which includes a cutting piece, a first main roller having a first wire groove, and a second main roller having a second wire groove. The first wire groove includes at least one first wire inlet groove and at least one first wire outlet groove, and the second wire groove includes at least one second wire inlet groove and a second wire outlet groove. The cutting piece is alternately wound around the first wire inlet groove and the second wire inlet groove. When the cutting piece extends from the wire inlet groove, the cutting piece is relatively low and wound around the first wiring groove and the second wiring groove, and the distance between the second wiring groove and the second wire inlet groove is greater than the distance between the first wiring groove and the first wire inlet groove. Through such a design, the cutting piece can be tightened, which is beneficial to reduce the possibility of hanging wires and the like during the cutting process, and is beneficial to improving the cutting quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0027] Figure 1 A schematic diagram of a cutting device provided in an embodiment of the present application;

[0028] Figure 2 A partial schematic diagram of a first main roller, a second main roller and a cutting piece provided in an embodiment of the present application;

[0029] Figure 3 A schematic diagram of the winding arrangement of the cutting member provided in the embodiment of the present application;

[0030] Figure 4 A cross-sectional view of a first main roller provided in an embodiment of the present application;

[0031] Figure 5A cross-sectional view of a second main roller provided in an embodiment of the present application;

[0032] Figure 6 The embodiments of the present application provide Figure 4 A partial enlarged view of the middle Ⅰ position;

[0033] Figure 7 The embodiments of the present application provide Figure 5 A partial enlarged view of the middle II position;

[0034] Figure 8 A partial exploded view of the cutting equipment and the crystal rod provided in the embodiment of the present application;

[0035] Fig. 9 A partial schematic diagram of a support member provided in an embodiment of the present application.

[0036] Reference numerals

[0037] 1- first main roller;

[0038] 11- first line slot;

[0039] 111- first inlet duct;

[0040] 112-first wiring groove;

[0041] 113- first side wall;

[0042] 114- second side wall;

[0043] 2- second main roller;

[0044] 21- second line slot;

[0045] 211- second inlet duct;

[0046] 212-second wiring slot;

[0047] 213- spacing groove;

[0048] 214- third side wall;

[0049] 215- fourth side wall;

[0050] 3- Cutting pieces;

[0051] 31- first paragraph;

[0052] 32-Second paragraph;

[0053] 33- third paragraph;

[0054] 4- Support member;

[0055] 41- support surface;

[0056] 42- cavity;

[0057] 5- Pay-off reel;

[0058] 6- Take-up wheel;

[0059] 7- supply device;

[0060] 71- first supply device;

[0061] 72- second supply device;

[0062] 8-Connector;

[0063] 9-Crystal rod. DETAILED DESCRIPTION

[0064] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0065] It should be clear that the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0066] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0067] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0068] like Figure 1 As shown, the embodiment of the present application provides a cutting device, which can be used to cut the crystal rod 9 and cut the crystal rod 9 into silicon wafers. Figure 2As shown, the cutting device includes a first main roller 1, a second main roller 2 and a cutting member 3. The first main roller 1 and the second main roller 2 are used to wind the cutting member 3, and the cutting member 3 can be a component such as a diamond wire. The first main roller 1 is provided with a first wire groove 11, and the second main roller 2 is provided with a second wire groove 21, and the cutting member 3 is alternately wound in the first wire groove 11 and the second wire groove 21. When winding the cutting member 3, the cutting member 3 can first enter the first wire groove 11 from one side of the first main roller 1, and after winding along the first wire groove 11 to the other side of the first main roller 1, extend from the first wire groove 11, extend into the second wire groove 21 on one side of the second main roller 2, and after winding along the second wire groove 21 to the other side of the second main roller 2, extend from the second wire groove 21 and extend into the first wire groove 11 from one side of the first main roller 1, so that the cutting member 3 can be alternately wound on the first main roller 1 and the second main roller 2 in an approximately spiral structure. At least one first wire groove 11 is a first wire inlet groove 111, and at least one first wire groove 11 is a first wiring groove 112. At least one second wire groove 21 is a second wire inlet groove 211, and at least one second wire groove 21 is a second wiring groove 212. The first wire inlet groove 111 may be one or more first wire grooves 11 near the wire inlet end of the first main roller 1, and the first wiring groove 112 may be a first wire groove 11 located at the wire outlet end of the first wire inlet groove 111 near the first main roller 1. The second wire inlet groove 211 may be one or more second wire grooves 21 near the wire inlet end of the second main roller 2, and the second wiring groove 212 may be a second wire groove 21 located at the wire outlet end of the second wire inlet groove 211 near the second main roller 2. When the cutting element 3 is wound, the cutting element 3 is alternately wound in the first wire inlet groove 111 and the second wire inlet groove 211. After the cutting element 3 is wound out from the second wire inlet groove 211 adjacent to the second wiring groove 212, the cutting element 3 is wound in the first wiring groove 112, and alternately wound in the first wiring groove 112 and the second wiring groove 212. The distance between the second wiring groove 212 and the second wire inlet groove 211 is greater than the distance between the first wiring groove 112 and the first wire inlet groove 111 .

[0069] When the cutting piece 3 is wound, there will be an angle between the cutting piece 3 wound on the wire feed slot and the cutting piece 3 wound on the wiring slot. Since the distance between the second wiring slot 212 and the second wire feed slot 211 is greater than the distance between the first wiring slot 112 and the first wire feed slot 111, when the cutting piece 3 extends from the first main roller 1 and is wound to the second wiring slot 212 closest to the second wire feed slot 211, the inclination angle of the cutting piece 3 becomes larger. Such a design can help improve the overall tension of the cutting piece 3 during winding, making the cutting piece 3 taut. During cutting, the part of the cutting piece 3 wound on the main roller through the wire feed slot does not participate in cutting and is a non-cutting part. The part of the cutting piece 3 wound on the main roller through the wiring slot is used to cut the crystal rod 9 and is a cutting part. By adding a non-cutting part when winding the cutting piece 3, the winding stability of the cutting piece 3 can be improved, which is conducive to tightening the cutting piece 3, so that when cutting the crystal rod 9, the possibility of hanging wires, jamming, etc. can be reduced, thereby reducing the possibility of wire breakage during the cutting process, so as to improve the cutting quality, and reduce the possibility of edge collapse and two sides of the cut silicon wafer, so that the quality of the silicon wafer is improved. When the silicon wafer is processed into a battery cell, since the quality of the silicon wafer is improved, the quality of the battery processed from the silicon wafer is also improved, which is conducive to improving the efficiency of the battery cell and the photovoltaic module, and is more in line with the actual use requirements.

[0070] In a possible embodiment, the portion of the cutting element 3 wound around the main roller through the wire feed groove includes the portion of the cutting element 3 located at the first wire feed groove 111 and the second wire feed groove 211 and the portion therebetween, that is, the portion of the cutting element 3 wound around the main roller through the wire feed groove is a continuous structure. The portion of the cutting element 3 wound around the main roller through the wiring groove includes the portion located at the first wiring groove 112 and the second wiring groove 212 and the portion therebetween, that is, the portion of the cutting element 3 wound around the main roller through the wiring groove is a continuous structure at one end.

[0071] The portion of the cutting member 3 wound around the first main roller 1 and the second main roller 2 through the first wire feeding groove 111 and the second wire feeding groove 211 is the first section 31, and the portion of the cutting member 3 wound around the first main roller 1 and the second main roller 2 through the first wiring groove 112 and the second wiring groove 212 is the second section 32, and the second section 32 is used to cut the crystal rod 9. The angle α between the first section 31 and the second section 32 is 0.044° to 0.123°.

[0072] like Figure 3As shown, when the cutting piece 3 is provided, the cutting piece 3 can be provided above the first main roller 1 and the second main roller 2 through the first wire feed groove 111 and the second wire feed groove 211 from the side where the second main roller 2 is located, and is wound along the first wire feed groove 111 to the bottom of the first main roller 1, and then extends out from the first wire feed groove 111. The cutting piece 3 extending from the first wire feed groove 111 enters the second wiring groove 212 from the bottom of the second main roller 2, and after winding along the second wiring groove 212 to the top of the second main roller 2, extends out from the second wiring groove 212. After extending from the second wiring groove 212, the cutting piece 3 winds from the top of the first main roller 1 to the bottom of the first main roller 1 along the first wiring groove 112, and extends out from the first main roller 1. Thereafter, the cutting piece 3 is alternately wound around the first main roller 1 and the second main roller 2 through the first wiring groove 112 and the second wiring groove 212. Figure 3 It is a schematic diagram of the winding of the cutting element 3, wherein the cutting element 3 represented by the solid line is located above the first main roller 1 and the second main roller 2, and the cutting element 3 represented by the dotted line is located below the first main roller 1 and the second main roller 2.

[0073] The portion of the cutting member 3 wound around the first main roller 1 through the first wire feed groove 111 and the second wire feed groove 211 is the first section 31, the portion of the cutting member 3 wound around the second main roller 2 through the first wiring groove 112 and the second wiring groove 212 is the second section 32, and the portion of the cutting member 3 wound around the first main roller 1 and the second main roller 2 through the second wiring groove 212 of the first wire feed groove 111 is the third section 33. Along the winding direction of the cutting member 3, the starting point of the first section 31 is located at the second wire feed groove 211, and the end point is located at the first wire feed groove 111, the starting point of the second section 32 is located at the second wiring groove 212, and the end point is located at the first wiring groove 112, and the starting point of the third section 33 is located at the first wire feed groove 111, and the end point is located at the second wiring groove 212. The first section 31 and the second section 32 are located above the first main roller 1 and the second main roller 2, and the third section 33 is located below the first main roller 1 and the second main roller 2. The angle between the first section 31 and the second section 32 can be 0.044°, 0.054°, 0.064°, 0.074°, 0.084°, 0.094°, 0.104°, 0.114°, 0.123°, etc. When the angle between the first section 31 and the second section 32 is less than 0.044°, the size of the third section 33 is shorter, and the radial size relative to the first main roller 1 and the second main roller 2 is smaller, the winding tightness of the cutting piece 3 is loose, and it is easy to get hung up. When the angle between the first section 31 and the second section 32 is greater than 0.123°, the size of the third section 33 and the radial angle relative to the first main roller 1 and the second main roller 2 are larger, and it is easy to wear and cause wire breakage or main roller damage, which affects the service life of the cutting equipment.

[0074] In a possible embodiment, the first section 31 is perpendicular to the axial direction of the first main roller 1 and the axial direction of the second main roller 2. Such a design is conducive to tightening the cutting element 3 when the cutting element 3 is wound.

[0075] like Figure 2 As shown, in a possible embodiment, at least one second wire groove 21 is arranged between adjacent second wire feed grooves 211 and second wiring grooves 212, and the second wire grooves 21 located between adjacent second wire feed grooves 211 and second wiring grooves 212 can be used as spacing grooves 213, and when winding, the cutting piece 3 is not wound in the spacing grooves 213.

[0076] By arranging a spacing groove 213 on the second main roller 2 and avoiding the spacing groove 213 when winding the cutting piece 3, the distance between the second wire feed groove 211 and the second wiring groove 212 can be increased, which is beneficial to increase the inclination angle of the cutting piece 3 wound on the wiring groove, thereby helping to improve the tightness of the cutting piece 3 and reduce the possibility of wire hanging and the like.

[0077] By providing the spacing grooves 213, it is convenient for the operator to adjust the position of the cutting member 3 during winding, and by avoiding the cutting grooves, the inclination angle of the cutting member 3 can be adjusted. In actual operation, the number of spacing grooves 213 can be selected according to demand, so that the winding method of the cutting member 3 is more flexible.

[0078] In a possible implementation manner, the number of the spacing grooves 213 may be one, two, three, four, etc.

[0079] When the spacing groove 213 is not provided, the distance between the second wire feeding groove 211 and the second wiring groove 212 is small, and when the cutting element 3 is wound, the inclination angle of the cutting element 3 is small, which is not conducive to tightening the cutting element 3. When the number of the spacing grooves 213 is more than four, the inclination angle of the cutting element 3 is too large, and the axial dimension of the second main roller 2 is affected.

[0080] like Figure 4 and Figure 5 As shown, in a possible implementation, the first line groove 11 is an annular groove arranged along the circumference of the first main roller 1, and each first line groove 11 is arranged in sequence along the axial direction of the first main roller 1. The second line groove 21 is an annular groove arranged along the circumference of the second main roller 2, and each second line groove 21 is arranged in sequence along the axial direction of the second main roller 2.

[0081] Compared with the spiral groove, by setting the first wire groove 11 and the second wire groove 21 as annular grooves, the contact area between the cutting piece 3 and the main roller can be reduced, thereby reducing the wear of the main roller during use and reducing the risk of breakage of the cutting piece 3, which is beneficial to extending the service life of the cutting equipment.

[0082] In a possible implementation manner, the distance between adjacent first linear grooves 11 is a, and 160 micrometers ≤ a ≤ 180 micrometers. The distance between adjacent second linear grooves 21 is b, and 160 micrometers ≤ b ≤ 180 micrometers.

[0083] The distance between adjacent first wire grooves 11 can be 160 microns, 162 microns, 164 microns, 166 microns, 168 microns, 170 microns, 172 microns, 174 microns, 176 microns, 178 microns, 180 microns, etc. The distance between adjacent second wire grooves 21 can be 160 microns, 162 microns, 164 microns, 166 microns, 168 microns, 170 microns, 172 microns, 174 microns, 176 microns, 178 microns, 180 microns, etc.

[0084] When the distance between adjacent wire grooves is less than 160 microns, the distance between adjacent cutting pieces 3 is too small, and when the distance between adjacent wire grooves is greater than 180 microns, the distance between adjacent cutting pieces 3 is too large, resulting in an increase in the overall size of the main roller. The distance between adjacent wire grooves can be adjusted according to actual usage requirements, usually according to the required silicon wafer thickness.

[0085] like Figure 6 As shown, in a possible embodiment, the first wire groove 11 includes a first side wall 113 and a second side wall, the first side wall 113 is located in the direction of the wire inlet end of the first wire groove 11 close to the first main roller 1, and the second side wall is located in the direction of the wire outlet end of the first wire groove 11 close to the first main roller 1. Along the axial direction close to the first main roller 1, the distance between the first side wall 113 and the second side wall gradually decreases, and the angle between the first side wall 113 and the second side wall is 20° to 50°. Figure 7 As shown, the second wire groove 21 includes a third side wall 214 and a fourth side wall 215, the third side wall 214 is located in the direction of the wire inlet end of the second wire groove 21 close to the second main roller 2, and the fourth side wall 215 is located in the direction of the wire outlet end of the second wire groove 21 close to the second main roller 2. Along the axial direction close to the second main roller 2, the distance between the third side wall 214 and the second side wall gradually decreases, and the angle between the third side wall 214 and the fourth side wall 215 is 20° to 50°.

[0086] The angle between the first side wall 113 and the second side wall may be 20°, 22°, 24°, 26°, 28°, 30°, 32°, 34°, 36°, 38°, 40°, 42°, 44°, 46°, 48°, 50°, etc. The angle between the third side wall 214 and the fourth side wall 215 may be 20°, 22°, 24°, 26°, 28°, 30°, 32°, 34°, 36°, 38°, 40°, 42°, 44°, 46°, 48°, 50°, etc.

[0087] The first wire groove 11 and the second wire groove 21 can be approximately V-shaped grooves, and the opening of the wire groove is located on the surface of the main roller. As the wire groove extends toward the inside of the main roller along its own depth direction, the cross-sectional area of ​​the wire groove decreases. This design facilitates the winding of the cutting piece 3. The side wall of the wire groove can play a guiding role during winding, and the cutting piece 3 can slide into the inside of the wire groove along the side wall of the wire groove. As the depth of the wire groove increases, the cross-sectional area gradually decreases. During winding, the cutting piece 3 can be wound at the bottom of the wire groove. The smaller the cross-sectional area of ​​the bottom of the wire groove, the less likely the cutting piece 3 will shake, which is conducive to improving the stability of the winding of the cutting piece 3. When the angle between the side walls of the wire groove is less than 20°, the opening of the wire groove is small and the winding difficulty is greater. When the angle between the side walls of the wire groove is greater than 50°, the opening of the wire groove is larger. Since the cutting piece 3 will be arranged along the axial spiral of the main roller during winding, when the opening of the wire groove is larger, the cutting piece 3 is easy to fall off from the wire groove, and the winding stability of the cutting piece 3 is poor.

[0088] like Figure 6 As shown, in a possible implementation, the angle between the first side wall 113 and the radial direction of the first main roller 1 is 12.5° to 37.5°. The angle between the second side wall and the radial direction of the first main roller 1 is 12.5° to 13.5°. The angle between the third side wall 214 and the radial direction of the second main roller 2 is 12.5° to 37.5°. Figure 7 As shown, the angle between the fourth side wall 215 and the radial direction of the second main roller 2 is 12.5° to 13.5°. The angle between the first side wall 113 and the radial direction of the first main roller 1 can be 12.5°, 14.5°, 16.5°, 18.5°, 20.5°, 22.5°, 24.5°, 26.5°, 28.5°, 30.5°, 32.5°, 34.5°, 36.5°, 37.5°, etc. The angle between the second side wall and the radial direction of the first main roller 1 can be 12.5°, 12.6°, 12.7°, 12.8°, 12.9°, 13.0°, 13.1°, 13.2°, 13.3°, 13.4°, 13.5°, etc. The angle between the third side wall 214 and the radial direction of the second main roller 2 may be 12.5°, 14.5°, 16.5°, 18.5°, 20.5°, 22.5°, 24.5°, 26.5°, 28.5°, 30.5°, 32.5°, 34.5°, 36.5°, 37.5°, etc. The angle between the fourth side wall 215 and the radial direction of the second main roller 2 may be 12.5°, 12.6°, 12.7°, 12.8°, 12.9°, 13.0°, 13.1°, 13.2°, 13.3°, 13.4°, 13.5°, etc.

[0089] Such a design can make the first wire groove 11 and the second wire groove 21 tilted in the direction close to the wire outlet end, thereby helping to reduce the wear of the cutting element 3 on the first main roller 1 and the second main roller 2, thereby helping to increase the service life of the cutting equipment.

[0090] like Figure 8 As shown, in a possible implementation, the cutting device further includes a support member 4, and the support member 4 is used to place the crystal rod 9. Fig. 9 As shown, the support member 4 is provided with a cavity 42, and at least one end of the cavity 42 penetrates the support member 4 along the length direction of the support member 4. One side of the support member 4 can be used to set the crystal rod 9 and the other side is used to connect with the connecting member 8, which can be a dovetail iron plate.

[0091] The crystal rod 9 can be fixed to the support member 4 by bonding or other means, and the support member 4 can be driven to move in a direction close to the cutting member 3 so that the cutting path can cut the crystal rod 9. During cutting, the cutting member 3 can cut off the side wall of the cavity 42 facing the crystal rod 9, so that a gap is generated on the side wall of the cavity 42 facing the crystal rod 9, that is, during the cutting process, the cutting member 3 cuts into the inside of the support member 4. After the crystal rod 9 is cut, when the silicon wafer obtained by cutting is debonded, the debonding agent can enter the cavity 42 and flow along the gap of the side wall of the cavity 42 to the end where the crystal rod 9 and the support member 4 are connected to each other. Through such a design, the penetration efficiency of the debonding agent can be improved, so that the debonding agent can fully contact the position where the crystal rod 9 and the support member 4 are connected, which is conducive to improving the debonding efficiency, reducing costs, improving overall production efficiency, and more in line with actual use needs.

[0092] During cutting, the cutting piece 3 can extend into the interior of the support piece 4 by 6 to 10 mm. The cutting depth can be 6 mm, 6.5 mm, 7 mm, 7.5 mm, 8 mm, 8.5 mm, 9 mm, 9.5 mm, 10 mm, etc. And 2% to 20% of a surfactant is added to the degumming agent. The proportion of the surfactant can be 2%, 4%, 6%, 8%, 10%, 12%, 14%, 16%, 18%, 20%, etc. Increasing the cutting depth can facilitate the degumming agent to penetrate, and increasing the surfactant can improve the permeability of the degumming agent, which is conducive to improving the degumming efficiency and more in line with actual use requirements.

[0093] like Fig. 9 As shown, in a possible implementation, the support member 4 includes a support surface 41, and the support surface 41 is used to place the crystal rod 9. Along the thickness direction of the support member 4, the distance L between the cavity 42 and the support surface 41 is 2 mm to 4 mm. The distance L can generally be the wall thickness of the cavity 42.

[0094] The distance between the cavity 42 and the supporting surface 41 can be 2.0 mm, 2.2 mm, 2.4 mm, 2.6 mm, 2.8 mm, 3.0 mm, 3.2 mm, 3.4 mm, 3.6 mm, 3.8 mm, 4.0 mm, etc.

[0095] When the distance between the cavity 42 and the support surface 41 is less than 2 mm, the wall thickness of the cavity 42 will be thinner, the structural strength of the support member 4 will be reduced, and it will be easily damaged during use. When the distance between the support surfaces 41 of the cavity 42 is greater than 4 mm, the wall thickness of the cavity 42 will be thicker, and during cutting, the cutting member 3 will cut into a greater depth, affecting the cutting efficiency.

[0096] like Figure 1 As shown, in a possible embodiment, the cutting device further includes a pay-off wheel 5, a take-up wheel 6 and a supply device 7, wherein the pay-off wheel 5 is used to release the cutting piece 3, and the released cutting piece 3 can be wound around the first main roller 1 and the second main roller 2. The take-up wheel 6 is used to store the cutting piece 3. The supply device 7 is used to supply cutting liquid to the first main roller 1 and / or the second main roller 2. The supply device 7 may include a first supply device 71 and a second supply device 72, wherein the first supply device 71 is used to provide cutting liquid to the first main roller 1, and the second supply device 72 is used to provide cutting liquid to the second main roller 2. The cutting liquid may be added with 2% to 20% of a surfactant, and the surface tension is 22 to 26. The proportion of the surfactant may be 2%, 4%, 6%, 8%, 10%, 12%, 14%, 16%, 18%, 20%, etc. By adding surfactants, the permeability of the cutting fluid can be improved, which is beneficial to improving the lubricity and dispersibility of the cutting fluid, and is beneficial to reducing the possibility of sticking, hanging wires, and twisted wires during the cutting process, thereby improving the cutting quality and reducing the possibility of damage, edge collapse, and bright edges on silicon wafers, thereby improving the quality of solar cells processed from silicon wafers and photovoltaic modules including the solar cells.

[0097] The above describes in detail the structure, features and effects of the present application based on the embodiments shown in the drawings. The above is only a preferred embodiment of the present application, but the present application does not limit the scope of implementation to what is shown in the drawings. Any changes made in accordance with the concept of the present application, or modifications to equivalent embodiments with equivalent changes, which still do not exceed the spirit covered by the description and drawings, should be within the protection scope of the present application.

Claims

1. A cutting device for cutting a crystal rod (9), characterized in that: The cutting device comprises: A first main roller (1), wherein the first main roller (1) is provided with a first wire groove (11); A second main roller (2), wherein the second main roller (2) is provided with a second wire groove (21); A cutting piece (3), wherein the cutting piece (3) is alternately wound around the first wire groove (11) and the second wire groove (21); Wherein, at least one of the first wire grooves (11) is a first wire inlet groove (111), at least one of the first wire grooves (11) is a first wiring groove (112), at least one of the first wire grooves (11) is a second wire inlet groove (211), at least one of the second wire grooves (21) is a second wiring groove (212), the cutting piece (3) is alternately wound around the first wire inlet groove (111) and the second wire inlet groove (211), when the cutting piece (3) is wound out from the second wire inlet groove (211) adjacent to the second wiring groove (212), the cutting piece (3) is wound around the first wiring groove (112) and alternately wound around the first wiring groove (112) and the second wiring groove (212), and the distance between the second wiring groove (212) and the second wire inlet groove (211) is greater than the distance between the first wiring groove (112) and the first wire inlet groove (111).

2. The cutting device according to claim 1, characterized in that The portion of the cutting member (3) that is wound around the first main roller (1) and the second main roller (2) through the first wire feeding groove (111) and the second wire feeding groove (211) is a first section (31), and the portion of the cutting member (3) that is wound around the first main roller (1) and the second main roller (2) through the first wiring groove (112) and the second wiring groove (212) is a second section (32), and the second section (32) is used for cutting the crystal rod; The included angle between the first section (31) and the second section (32) is 0.044° to 0.123°.

3. The cutting device according to claim 1, characterized in that The second wire groove (21) located between the adjacent second wire inlet groove (211) and the second wiring groove (212) is a spacing groove (213), and the cutting piece (3) is not arranged around the spacing groove (213).

4. The cutting device according to claim 1, characterized in that The first wire groove (11) is an annular groove arranged along the circumference of the first main roller (1), and each of the first wire grooves (11) is arranged in sequence along the axial direction of the first main roller (1); The second wire groove (21) is an annular groove arranged along the circumference of the second main roller (2), and the second wire grooves (21) are arranged in sequence along the axial direction of the second main roller (2).

5. The cutting device according to claim 4, characterized in that The distance between adjacent first wire grooves (11) is a, and satisfies: 160 micrometers ≤ a ≤ 180 micrometers; The distance between adjacent second wire grooves (21) is b, and satisfies: 160 micrometers ≤ b ≤ 180 micrometers.

6. The cutting device according to claim 1, characterized in that The first wire groove (11) comprises a first side wall (113) and a second side wall (114); the first side wall (113) is located in the direction of the first wire groove (11) close to the wire inlet end of the first main roller (1); the second side wall (114) is located in the direction of the wire outlet end of the first main roller (1); along the direction close to the axis of the first main roller (1), the distance between the first side wall (113) and the second side wall (114) gradually decreases; and the angle between the first side wall (113) and the second side wall (114) is 20° to 50°; The second wire groove (21) comprises a third side wall (214) and a fourth side wall (215), wherein the third side wall (214) is located in the direction of the wire inlet end of the second wire groove (21) close to the second main roller (2), and the fourth side wall (215) is located in the direction of the wire outlet end of the second main roller (2), and along the direction close to the axis of the second main roller (2), the distance between the third side wall (214) and the fourth side wall (215) gradually decreases, and the angle between the third side wall (214) and the fourth side wall (215) is 20° to 50°.

7. The cutting device according to claim 6, characterized in that The angle between the first side wall (113) and the radial direction of the first main roller (1) is 12.5° to 37.5°; The included angle between the second side wall (114) and the radial direction of the first main roller (1) is 12.5° to 13.5°; The included angle between the third side wall (214) and the radial direction of the second main roller (2) is 12.5° to 37.5°; The included angle between the fourth side wall (215) and the radial direction of the second main roller (2) is 12.5° to 13.5°.

8. The cutting device according to any one of claims 1 to 7, characterized in that The cutting device further comprises a support member (4), wherein the support member (4) is used to place a crystal rod (9). The support member (4) is provided with a cavity (42), and at least one end of the cavity (42) passes through the support member (4) along the length direction of the support member (4).

9. The cutting device according to claim 8, characterized in that The support member (4) comprises a support surface (41), the support surface (41) is used to place the crystal rod (9), and the distance between the cavity (42) and the support surface (41) is 2 mm to 4 mm.

10. The cutting device according to any one of claims 1 to 7, characterized in that The cutting device further comprises a pay-off wheel (5), a take-up wheel (6) and a supply device (7), wherein the pay-off wheel (5) is used to release the cutting piece (3), the take-up wheel (6) is used to store the cutting piece (3), and the supply device (7) is used to supply cutting fluid to the first main roller (1) and / or the second main roller (2).