Silicon wafer sorting mechanism, silicon wafer sorting method and silicon wafer packaging system

Abstract

The embodiment of the invention provides a silicon wafer sorting mechanism, a silicon wafer sorting method and a silicon wafer packaging system. The sheet arranging mechanism comprises a first support; the supporting platform is rotationally connected to the first support, the supporting platform is used for supporting a silicon wafer, the supporting platform comprises a first vertex angle and a second vertex angle which are arranged along a diagonal line, supporting blocks are arranged on the two side edges adjacent to the first vertex angle, and wafer sorting pressing blocks are arranged on the two side edges adjacent to the second vertex angle; the sheet arranging pressing block is movably connected to the supporting platform; the first driving part is used for driving the supporting platform to rotate so as to enable the supporting platform to be switched between a bearing position and a wafer arranging position, the supporting platform is parallel to the mounting surface where the first support is located at the bearing position so as to bear the silicon wafers, and a certain included angle is formed between the supporting platform and the mounting surface at the wafer arranging position.

Description

Technical Field

[0001] The present application belongs to the field of photovoltaic processing technology, and specifically relates to a silicon wafer sorting mechanism, a silicon wafer sorting method and a silicon wafer packaging system. Background Art

[0002] With the development of photovoltaic technology, silicon wafers are used more and more widely. In the production process of silicon wafers, when silicon wafers are transported in different production processes, they usually need to be packaged to improve the transportation safety of silicon wafers.

[0003] In the existing technology, silicon wafers are transported to the collection box through roller conveyors after sorting. Since silicon wafers are thin, hard, and fragile, the roller conveyors only play a role in transmission and do not play a role in trajectory constraint. Therefore, the stacking process of silicon wafers in the collection box is uneven. If the silicon wafers in this state are directly bagged, the uneven silicon wafers will break. Therefore, the silicon wafers need to be manually sorted before bagging. However, the manual sorting of silicon wafers not only increases the workload of operators, but also has low efficiency in wafer sorting, greatly reducing the packaging efficiency of silicon wafers. Summary of the invention

[0004] The present application aims to provide a silicon wafer sorting mechanism, a silicon wafer sorting method and a silicon wafer packaging system to solve the problem of low efficiency of existing silicon wafer sorting methods.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, the present application discloses a silicon wafer sorting mechanism, the wafer sorting mechanism comprising:

[0007] First bracket;

[0008] A rectangular support platform, the support platform is rotatably connected to the first bracket, the support platform is used to support silicon wafers, the support platform includes a first vertex and a second vertex arranged along a diagonal line, two side edges adjacent to the first vertex are provided with support blocks, two side edges adjacent to the second vertex are provided with wafer pressing blocks, and the wafer pressing blocks are movably connected to the support platform;

[0009] And a first driving member, the first driving member is connected to the first bracket, the first driving member is used to drive the support platform to rotate so that the support platform switches between a receiving position and a wafer sorting position. In the receiving position, the support platform is arranged parallel to the mounting surface where the first bracket is located to receive the silicon wafer. In the wafer sorting position, the support platform is arranged at a certain angle to the mounting surface.

[0010] Optionally, a diagonal line formed by connecting the first vertex angle and the second vertex angle is a first diagonal line; the rotation axis of the support platform is a first rotation axis, and the first rotation axis is perpendicular to the first diagonal line.

[0011] Optionally, the wafer sorting mechanism also includes a second driving member, which is fixed to the supporting platform and connected to the wafer sorting block, and the second driving member is used to drive the wafer sorting block to move toward or away from the supporting block to push the silicon wafer to a position against the supporting block.

[0012] Optionally, the wafer sorting mechanism also includes a pressure claw and a third driving member, the pressure claw is movably connected to the support platform, the third driving member is fixed to the support platform and connected to the pressure claw, and the third driving member is used to drive the pressure claw to move above the support platform to limit the silicon wafer on the support platform, or to move away from above the support platform to release the limit on the silicon wafer.

[0013] Optionally, the wafer sorting mechanism further includes a first sensor, which is disposed on the support platform. When the first sensor detects that a silicon wafer is placed on the support platform, the first driving member drives the support platform to rotate to the wafer sorting position.

[0014] In a second aspect, the present application further discloses a silicon wafer sorting method, the silicon wafer sorting method is used for any of the silicon wafer sorting mechanisms described above, and the silicon wafer sorting method comprises:

[0015] When a silicon wafer is detected to be placed on the support platform, the support platform is driven to rotate from the receiving position to the wafer sorting position; wherein, in the wafer sorting position, the first vertex angle of the support platform is located below the second vertex angle;

[0016] The wafer handling block is driven to move toward the support block to push the silicon wafer to a position against the support block.

[0017] Optionally, the step of driving the wafer handling block to move toward the support block to push the silicon wafer to a position abutting against the support block comprises:

[0018] The two wafer sorting and pressing blocks are driven to move alternately toward the supporting block, so as to push the silicon wafer to a position abutting against the supporting block.

[0019] Optionally, when it is detected that a silicon wafer is placed on the support platform, the step of driving the support platform to rotate from the receiving position to the wafer sorting position includes:

[0020] When a silicon wafer is detected to be placed on the support platform, the pressing claw is driven to move above the support platform to limit the silicon wafer on the support platform;

[0021] The supporting platform is driven to rotate from the receiving position to the sheet sorting position.

[0022] In a second aspect, the present application further discloses a silicon wafer packaging system, the silicon wafer packaging system comprising: a wafer stacking mechanism, a first transfer mechanism, a transportation mechanism, a second transfer mechanism, and a wafer sorting mechanism as described in any one of the above; wherein,

[0023] The wafer stacking mechanism is used to perform a wafer stacking operation on silicon wafers;

[0024] The first transfer mechanism is disposed between the wafer stacking mechanism and the transportation mechanism, and is used to transfer the stacked silicon wafers to the transportation mechanism;

[0025] The second transfer mechanism is disposed between the transportation mechanism and the wafer sorting mechanism, and the second transfer mechanism is used to transfer the silicon wafers to the wafer sorting mechanism, and the wafer sorting mechanism is used to sort the silicon wafers.

[0026] Optionally, the sheet stacking mechanism comprises:

[0027] A support plate, the support plate is used to receive the silicon wafer, and the support plate is provided with a side baffle;

[0028] a fourth driving member connected to the support plate, and used to drive the support plate to tilt toward the side where the side baffle is provided, so that the silicon wafer on the support plate slides down to a position abutting against the side baffle;

[0029] and a blowing piece, wherein the blowing piece is arranged at the bottom of the supporting plate and is used for blowing air toward the silicon wafer.

[0030] In the embodiment of the present application, since the support platform includes a first vertex and a second vertex set along the diagonal line, support blocks are set on both sides adjacent to the first vertex, and wafer sorting pressing blocks are set on both sides adjacent to the second vertex, and the wafer sorting pressing blocks are movably connected to the support platform. When the first driving member drives the support platform to rotate to the wafer sorting position, the first vertex is located below the second vertex, that is, the support block is located below the wafer sorting pressing block. Under the action of gravity and the push of the wafer sorting pressing block, the silicon wafers on the support platform can be quickly sorted to the position against the two support blocks, and the wafer sorting efficiency is high. When the wafer sorting mechanism is used in a packaging system, the packaging efficiency of the silicon wafers is greatly improved.

[0031] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0033] Figure 1 It is a structural schematic diagram of a silicon wafer handling mechanism described in an embodiment of the present application;

[0034] Figure 2 yes Figure 1 The structural schematic diagram of the support platform shown is located at the film sorting position;

[0035] Figure 3 This is a flow chart of the steps of a silicon wafer sorting method described in an embodiment of the present application.

[0036] Figure 4 is a structural schematic diagram of a silicon wafer packaging system described in an embodiment of the present application;

[0037] Figure 5 It is a structural schematic diagram of a sheet stacking mechanism described in an embodiment of the present application;

[0038] Figure 6 yes Figure 5 The working principle diagram of the blowing parts in the stacking mechanism is shown.

[0039] Figure numerals: 10 - first bracket, 11 - supporting platform, 111 - first vertex, 112 - second vertex, 113 - supporting block, 114 - wafer sorting and pressing block, 12 - first driving member, 13 - base, 14 - pressing claw, 15 - first sensor, A - first diagonal line, B - first rotating shaft, 201 - supporting plate, 202 - side baffle, 203 - fourth driving member, 204 - blowing hole, 205 - second sensor, 206 - third sensor, 21 - transport mechanism, 22 - second transfer mechanism, 23 - wafer sorting mechanism, 30 - silicon wafer. DETAILED DESCRIPTION

[0040] Embodiments of the present invention will be described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0041] The term "first" or "second" in the specification and claims of the present application may include one or more of the features explicitly or implicitly. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0042] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0043] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] An embodiment of the present application provides a silicon wafer sorting mechanism, which can be used in a silicon wafer packaging system. The silicon wafer sorting mechanism can specifically be used to sort the silicon wafers so as to facilitate bagging of the silicon wafers in subsequent processes.

[0045] Reference Figure 1 , shows a schematic diagram of the structure of a silicon wafer handling mechanism according to an embodiment of the present application, such as Figure 1As shown, the silicon wafer sorting mechanism may specifically include: a first bracket 10; a rectangular support platform 11, the support platform 11 is rotatably connected to the first bracket 10, the support platform 11 can be used to support the silicon wafer, the support platform 11 may include a first vertex 111 and a second vertex 112 arranged along a diagonal line, support blocks 113 are arranged on both sides adjacent to the first vertex 111, and wafer sorting pressing blocks 114 are arranged on both sides adjacent to the second vertex 112, and the wafer sorting pressing blocks 114 are movably connected to the support platform 11; and a first driving member 12, The first driving member 12 is connected to the first bracket 10, and is used to drive the supporting platform 11 to rotate so that the supporting platform 11 switches between a receiving position and a wafer sorting position. In the receiving position, the supporting platform 11 is arranged parallel to the mounting surface where the first bracket 10 is located to receive the silicon wafer. In the wafer sorting position, the supporting platform 11 is arranged at a certain angle to the mounting surface, and the first vertex 111 is located below the second vertex 112, so that the wafer sorting block 114 pushes the silicon wafer to a position against the supporting block 113.

[0046] In the embodiment of the present application, since the support platform 11 includes a first vertex 111 and a second vertex 112 set along the diagonal line, support blocks 113 are set on both sides adjacent to the first vertex 111, and wafer sorting pressing blocks 114 are set on both sides adjacent to the second vertex 112, and the wafer sorting pressing blocks 114 are movably connected to the support platform 11. When the first driving member 12 drives the support platform 11 to rotate to the wafer sorting position, the first vertex 111 is located below the second vertex 112, that is, the support block 113 is located below the wafer sorting pressing block 114. Under the action of gravity and the push of the wafer sorting pressing block 114, the silicon wafers on the support platform 11 can be quickly sorted to the position against the two support blocks 113, and the wafer sorting efficiency is high. When the wafer sorting mechanism is used in a packaging system, the packaging efficiency of the silicon wafers is greatly improved.

[0047] In a specific application, when no silicon wafers are placed, the support platform 11 can be located at the receiving position. At this time, the support platform 11 is parallel to the mounting surface where the first bracket 10 is located, that is, the support platform 11 can be placed horizontally so that the support platform 11 can receive the stacked silicon wafers. After the support platform 11 receives the silicon wafers, the first driving member 12 can drive the support platform 11 to rotate to the wafer sorting position to sort the silicon wafers so that the sides of the stacked silicon wafers are aligned.

[0048] like Figure 1 As shown, the film arrangement mechanism may further include a base 13, the support platform 11 is fixedly connected to the base 13, and the base 13 is connected to the first driving member 12. The first driving member 12 can drive the base 13 to rotate, so that the rotation of the base 13 drives the support platform 11 to rotate.

[0049] For example, the first driving member 12 may include but is not limited to any one of a motor and a cylinder. The embodiment of the present application may not limit the specific content of the first driving member 12.

[0050] Reference Figure 2 , showing Figure 1 The structural diagram of the support platform shown in FIG. Figure 2 As shown, when the support platform 11 is located at the wafer sorting position, the first vertex 111 is located below the second vertex 112. At this time, under the action of the gravity of the silicon wafer, the silicon wafer will usually move toward the two support blocks 113, and the sides of the stacked silicon wafers close to the two support blocks 113 will achieve preliminary wafer sorting. In addition, by moving the wafer sorting pressing block 114 toward the support block 113, the stacked silicon wafers will be pushed further toward the support block 113, so that the silicon wafer is completely against the two support blocks 113 on both sides of the first vertex 111, so as to achieve further wafer sorting of the stacked wafers. In this way, by driving the support platform 10 to rotate once by the first driving member 12, the wafer sorting of the two adjacent sides of the silicon wafer can be achieved, and the wafer sorting efficiency is relatively high.

[0051] In a specific application, when the support platform 11 is in the wafer sorting position, the support platform 11 can be perpendicular to the mounting surface of the first bracket 10. At this time, the silicon wafer can be correspondingly set perpendicular to the horizontal plane. The gravity of the silicon wafer can drive the silicon wafer to slide toward the support block 113 to the greatest extent, so as to further improve the wafer sorting efficiency.

[0052] Of course, in actual applications, technicians in this field can also set the angle between the support platform 11 and the mounting surface when the support platform 11 is in the wafer sorting position according to actual needs. For example, the angle can be 60 degrees, 75 degrees or 88 degrees, etc., and the embodiments of the present application do not limit this.

[0053] like Figure 2 As shown, the diagonal formed by connecting the first vertex 111 and the second vertex 112 is the first diagonal A; the rotation axis of the support platform 11 is the first rotation axis B, and the first rotation axis B is perpendicular to the first diagonal A. In this way, in the process of the first driving member 12 driving the support platform 11 to rotate around the first rotation axis B, the force exerted by the silicon wafer on the support blocks 113 on both sides of the first vertex 111 is equal. Moreover, when the support platform 11 is located at the wafer sorting position, the thrusts exerted by the two wafer sorting pressing blocks 114 at the second vertex 112 to push the silicon wafer toward the support block 113 are also equal. In this way, the thrusts received by the two adjacent sides of the silicon wafer during the wafer sorting process can be relatively even, so as to further improve the wafer sorting efficiency of the silicon wafer.

[0054] In an embodiment of the present application, the wafer sorting mechanism may further include a second driving member, which is fixed to the support platform 11 and connected to the wafer sorting block 114. The second driving member may be used to drive the wafer sorting block 114 to move toward or away from the support block 113 to push the silicon wafer to a position against the support block 113 to achieve wafer sorting of the silicon wafer.

[0055] Specifically, during the wafer sorting process, the second driving member can drive the wafer sorting block 114 to move toward the support block 113 to sort the silicon wafers. After the wafer sorting is completed, the second driving member can drive the wafer sorting block 114 to move away from the support block 113 to facilitate the removal of the silicon wafer between the support block 113 and the wafer sorting block 114.

[0056] Optionally, the wafer sorting mechanism may further include a pressure claw 14 and a third driving member, the pressure claw 14 is movably connected to the support platform 11, the third driving member is fixed to the support platform 11 and connected to the pressure claw 14, and the third driving member can be used to drive the pressure claw 14 to move above the support platform 11 to limit the silicon wafer on the support platform 11, or to leave from above the support platform 11 to release the limit on the silicon wafer.

[0057] It should be noted that the positioning of the silicon wafer by the pressure claw 14 does not mean fixing the pressure claw 14 above the silicon wafer, but placing the pressure claw 14 above the silicon wafer to prevent the silicon wafer from falling during the wafer sorting process. The positioning of the silicon wafer by the pressure claw 14 cannot affect the movement of the silicon wafer during the wafer sorting process.

[0058] In a specific application, after a silicon wafer is placed on the support platform 11, the third driving member can drive the pressing claw 14 to rotate to a position above the support platform 11 and in contact with the silicon wafer. During the rotation of the support platform 11 and the silicon wafer, the limiting effect of the pressing claw 14 can prevent the silicon wafer from falling off the support platform 11. After the silicon wafer is sorted, the third driving member can drive the pressing claw 14 to leave the support platform 11 to release the limiting effect on the silicon wafer, so as to facilitate the removal of the silicon wafer from the support platform 11.

[0059] For example, the second driving member and the third driving member may include but are not limited to any one of a motor and a cylinder. The embodiment of the present application may not limit the specific contents of the second driving member and the third driving member.

[0060] In some optional embodiments of the present application, the wafer sorting mechanism may further include a first sensor 15, which is disposed on the support platform 11. When the first sensor 15 detects that a silicon wafer is placed on the support platform 11, the first driving member 12 may drive the support platform 11 to rotate to the wafer sorting position.

[0061] For example, the first sensor 15 may include but is not limited to any one of an infrared sensor and a Hall sensor. The embodiment of the present application may not limit the specific type of the first sensor 15.

[0062] In summary, the film arrangement mechanism described in the embodiment of the present application can at least include the following advantages:

[0063] In the embodiment of the present application, since the support platform includes a first vertex and a second vertex set along the diagonal line, support blocks are set on both sides adjacent to the first vertex, and wafer sorting pressing blocks are set on both sides adjacent to the second vertex, and the wafer sorting pressing blocks are movably connected to the support platform. When the first driving member drives the support platform to rotate to the wafer sorting position, the first vertex is located below the second vertex, that is, the support block is located below the wafer sorting pressing block. Under the action of gravity and the push of the wafer sorting pressing block, the silicon wafers on the support platform can be quickly sorted to the position against the two support blocks, and the wafer sorting efficiency is high. When the wafer sorting mechanism is used in a packaging system, the packaging efficiency of the silicon wafers is greatly improved.

[0064] Reference Figure 3 , shows a flow chart of the steps of a silicon wafer sorting method described in an embodiment of the present application, such as Figure 3 As shown, the silicon wafer sorting method may specifically include:

[0065] Step 301: When it is detected that a silicon wafer is placed on a support platform, drive the support platform to rotate from a receiving position to a wafer sorting position; wherein, in the wafer sorting position, a first vertex angle of the support platform is located below the second vertex angle.

[0066] In the embodiment of the present application, a first sensor 15 may be provided on the support platform 11, and the first sensor 15 may be used to detect whether a silicon wafer is placed on the support platform 11. When the first sensor 15 detects that a silicon wafer is placed on the support platform 11, the first driving member 12 may drive the support platform 11 to rotate from the receiving position to the wafer sorting position, so as to sort the silicon wafer.

[0067] For example, the first sensor 15 may include but is not limited to any one of an infrared sensor and a Hall sensor. The embodiment of the present application may not limit the specific type of the first sensor 15.

[0068] Optionally, in the case where it is detected that a silicon wafer is placed on the supporting platform, driving the supporting platform to rotate from the receiving position to the wafer sorting position may include the following sub-steps:

[0069] Sub-step S11 : when it is detected that a silicon wafer is placed on the supporting platform 11 , the pressing claw 14 is driven to move to the top of the supporting platform 11 to limit the silicon wafer on the supporting platform 11 .

[0070] In the embodiment of the present application, when it is detected that a silicon wafer is placed on the support platform 11, the third driving member can drive the pressing claw 14 to rotate to a position above the support platform 11 and in contact with the silicon wafer. During the rotation of the support platform 11 and the silicon wafer, the limiting effect of the pressing claw 14 can prevent the silicon wafer from falling off the support platform 11. After the silicon wafer is sorted, the third driving member can drive the pressing claw 14 to leave from above the support platform 11 to release the limiting effect on the silicon wafer, so as to facilitate the removal of the silicon wafer from the support platform 11.

[0071] Sub-step S12: driving the support platform 11 to rotate from the receiving position to the sheet sorting position.

[0072] In the embodiment of the present application, after the third driving member can drive the pressing claw 14 to rotate to a position above the supporting platform 11 and contact the silicon wafer, the first driving member 12 can drive the supporting platform 11 to rotate from the receiving position to the wafer sorting position to perform wafer sorting operations on the silicon wafer.

[0073] Step 302: driving the wafer handling block to move toward the support block to push the silicon wafer to a position against the support block.

[0074] In the embodiment of the present application, when the support platform 11 is located at the wafer sorting position, the first vertex 111 is located below the second vertex 112. At this time, under the action of the gravity of the silicon wafer, the silicon wafer will usually move toward the two support blocks 113, and the sides of the stacked silicon wafers close to the two support blocks 113 will achieve preliminary wafer sorting. In addition, through the movement of the wafer sorting press toward the support block 113, the stacked silicon wafers will be pushed further toward the support block 113, so that the silicon wafer and the two support blocks 113 on both sides of the first vertex 111 are completely against each other, so as to achieve further wafer sorting of the stacked wafers. In this way, by driving the support platform 11 to rotate once by the first driving member 12, the wafer sorting of the two adjacent sides of the silicon wafer can be achieved, and the wafer sorting efficiency is relatively high.

[0075] In some optional embodiments of the present application, during the process of sorting the silicon wafer, the two sorting pressing blocks 114 can be driven to move alternately toward the support block 113 to push the silicon wafer to a position against the support block 113. In practical applications, when the two sorting pressing blocks 114 move alternately toward the support block 113 opposite to them, the stroke and thrust of the sorting pressing blocks 114 pushing the silicon wafer can be made smaller, and the pushing position can be corrected in time, thereby further improving the sorting efficiency and sorting quality of the silicon wafer.

[0076] In the embodiment of the present application, since the support platform includes a first vertex and a second vertex set along the diagonal line, support blocks are set on both sides adjacent to the first vertex, and wafer sorting pressing blocks are set on both sides adjacent to the second vertex, and the wafer sorting pressing blocks are movably connected to the support platform. When the first driving member drives the support platform to rotate to the wafer sorting position, the first vertex is located below the second vertex, that is, the support block is located below the wafer sorting pressing block, and under the action of gravity, the wafer sorting pressing block and the push of the wafer sorting pressing block, the silicon wafer on the support platform can be quickly sorted to a position against the two support blocks, and the wafer sorting efficiency is high. When the wafer sorting mechanism is used in a packaging system, the packaging efficiency of the silicon wafers is greatly improved.

[0077] Reference Figure 4 , shows a schematic structural diagram of a silicon wafer packaging system according to an embodiment of the present application, such as Figure 4 As shown, the silicon wafer packaging system may specifically include: a stacking mechanism (not shown in the figure), a first transfer mechanism (not shown in the figure), a transportation mechanism 21, a second transfer mechanism 22 and a wafer sorting mechanism 23 as described in any of the above embodiments; wherein; the stacking mechanism can be used to stack silicon wafers 30; the first transfer mechanism is arranged between the stacking mechanism and the transportation mechanism 21, and the first transfer mechanism can be used to transfer the stacked silicon wafers 30 to the transportation mechanism 21; the second transfer mechanism 22 is arranged between the transportation mechanism 21 and the wafer sorting mechanism 23, the second transfer mechanism 22 can be used to transfer the silicon wafers 30 to the wafer sorting mechanism 23, and the wafer sorting mechanism 23 can be used to sort the silicon wafers 30.

[0078] In a specific application, the stacking mechanism 23 can make a preliminary adjustment to the uniformity of the stacked silicon wafers 30, so that the first transfer mechanism can grab the stacked silicon wafers 30. The transportation mechanism 21 can be used to receive the silicon wafers 30 transferred by the first transfer mechanism and transport the silicon wafers 30 to a position close to the wafer sorting mechanism.

[0079] For example, the transport mechanism 21 may include but not limited to a belt conveyor, a conveyor roller, etc., and the first transfer mechanism and the second transfer mechanism 22 may include but not limited to a manipulator, a manipulator arm truss, etc. The embodiment of the present application may not limit the specific contents of the transport mechanism 21, the first transfer mechanism and the second transfer mechanism 22.

[0080] Reference Figure 5 , shows a schematic structural diagram of a sheet stacking mechanism according to an embodiment of the present application, such as Figure 5As shown, the stacking mechanism may specifically include: a support plate 201, which may be used to receive the silicon wafer 30, and a side baffle 202 is provided on the support plate 201; a fourth driving member 203, which is connected to the support plate 201, and which may be used to drive the support plate 201 to tilt toward the side where the side baffle 202 is provided, so that the silicon wafer 30 on the support plate 201 slides down to a position abutting against the side baffle 202, and the uniformity of the silicon wafer 30 is adjusted; and a blowing member, which is provided at the bottom of the support plate 201, and which may be used to blow air toward the silicon wafer 30, so as to slow down the falling speed of the silicon wafer 30 and increase the falling time, so that the silicon wafer 30 has sufficient time to move along a predetermined trajectory to a position abutting against the side baffle 202.

[0081] Reference Figure 6 , showing Figure 5 The working principle diagram of the blowing part in the stacking mechanism is shown in FIG. Figure 6 The support plate 201 shown may be provided with a blowing hole 204 arranged opposite to the blowing member. In practical applications, the first silicon wafer 30 cannot slide down to the middle side baffle 202 due to the large friction between the first silicon wafer 30 and the sulfur-free paper during the sliding process. By adding the blowing hole 204 on the support plate 201, the air flow is blown upward, and the gas support force slows down the falling speed of the silicon wafer 30 and increases the falling time, so that the silicon wafer 30 has sufficient time to move to the position against the side baffle 202 according to the predetermined trajectory.

[0082] Optionally, the support plate 201 of the stacking mechanism may be further provided with a second sensor 205 and a third sensor 206, wherein the second sensor 205 may be used to detect whether a silicon wafer 30 is placed on the support plate 201. The third sensor 206 may be provided on a side of the support plate 201 away from the side baffle 202, and the third sensor 206 may be used to detect whether the silicon wafer 30 exceeds the side of the support plate 201.

[0083] In practical applications, when the second sensor 205 detects that a silicon wafer 30 is placed on the support plate 201, the fourth driving member 203 can be retracted to drive the support plate 201 to tilt, so as to utilize the gravity of the silicon wafer 30 to make the silicon wafer 30 slide down to the side baffle 202 and automatically stack. When the third sensor 206 detects that a silicon wafer 30 exceeds the side of the support plate 201, the stacking degree can be improved by manual wafer sorting or other methods.

[0084] For example, the fourth driving member 203 may include but is not limited to a cylinder and a motor, etc., and the second sensor 205 and the third sensor 206 may include but are not limited to any one of an infrared sensor and a Hall sensor. The specific types of the fourth driving member 203, the second sensor 205 and the third sensor 206 are not limited in this embodiment of the application.

[0085] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0086] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A silicon wafer sorting mechanism, characterized in that: The film handling mechanism comprises: First bracket; A rectangular support platform, the support platform is rotatably connected to the first bracket, the support platform is used to support silicon wafers, the support platform includes a first vertex and a second vertex arranged along a diagonal line, two side edges adjacent to the first vertex are provided with support blocks, two side edges adjacent to the second vertex are provided with wafer pressing blocks, and the wafer pressing blocks are movably connected to the support platform; And a first driving member, the first driving member is connected to the first bracket, the first driving member is used to drive the support platform to rotate so that the support platform switches between a receiving position and a wafer sorting position. In the receiving position, the support platform is arranged parallel to the mounting surface where the first bracket is located to receive the silicon wafer. In the wafer sorting position, the support platform is arranged at a certain angle to the mounting surface.

2. The silicon wafer handling mechanism according to claim 1, characterized in that: A diagonal line formed by connecting the first vertex angle and the second vertex angle is a first diagonal line; a rotation axis of the support platform is a first rotation axis, and the first rotation axis is perpendicular to the first diagonal line.

3. The silicon wafer sorting mechanism according to claim 1, characterized in that: The wafer sorting mechanism also includes a second driving member, which is fixed to the support platform and connected to the wafer sorting block. The second driving member is used to drive the wafer sorting block to move toward or away from the support block to push the silicon wafer to a position against the support block.

4. The silicon wafer sorting mechanism according to claim 1, characterized in that: The wafer sorting mechanism also includes a pressure claw and a third driving member, the pressure claw is movably connected to the support platform, the third driving member is fixed to the support platform and connected to the pressure claw, and the third driving member is used to drive the pressure claw to move above the support platform to limit the silicon wafer on the support platform, or to move away from above the support platform to release the limit on the silicon wafer.

5. The silicon wafer handling mechanism according to claim 1, characterized in that: The wafer sorting mechanism further includes a first sensor, which is disposed on the support platform. When the first sensor detects that a silicon wafer is placed on the support platform, the first driving member drives the support platform to rotate to the wafer sorting position.

6. A silicon wafer sorting method, the wafer sorting method being used in the silicon wafer sorting mechanism according to any one of claims 1 to 5, characterized in that: The silicon wafer sorting method comprises: When a silicon wafer is detected to be placed on the support platform, the support platform is driven to rotate from the receiving position to the wafer sorting position; wherein, in the wafer sorting position, the first vertex angle of the support platform is located below the second vertex angle; The wafer handling block is driven to move toward the support block to push the silicon wafer to a position against the support block.

7. The silicon wafer sorting method according to claim 6, characterized in that: The step of driving the wafer handling block to move toward the support block to push the silicon wafer to a position against the support block includes: The two wafer sorting and pressing blocks are driven to move alternately toward the supporting block, so as to push the silicon wafer to a position abutting against the supporting block.

8. The silicon wafer sorting method according to claim 6, characterized in that: The step of driving the support platform to rotate from the receiving position to the wafer sorting position when a silicon wafer is detected to be placed on the support platform comprises: When a silicon wafer is detected to be placed on the support platform, the pressing claw is driven to move above the support platform to limit the silicon wafer on the support platform; The supporting platform is driven to rotate from the receiving position to the sheet sorting position.

9. A silicon wafer packaging system, characterized in that: The silicon wafer packaging system comprises: a wafer stacking mechanism, a first transfer mechanism, a transportation mechanism, a second transfer mechanism, and a wafer sorting mechanism according to any one of claims 1 to 5; wherein: The wafer stacking mechanism is used to perform a wafer stacking operation on silicon wafers; The first transfer mechanism is disposed between the wafer stacking mechanism and the transportation mechanism, and is used to transfer the stacked silicon wafers to the transportation mechanism; The second transfer mechanism is disposed between the transportation mechanism and the wafer sorting mechanism, and the second transfer mechanism is used to transfer the silicon wafers to the wafer sorting mechanism, and the wafer sorting mechanism is used to sort the silicon wafers.

10. The silicon wafer packaging system according to claim 9, characterized in that: The sheet stacking mechanism comprises: A support plate, the support plate is used to receive the silicon wafer, and the support plate is provided with a side baffle; a fourth driving member connected to the support plate, and used to drive the support plate to tilt toward the side where the side baffle is provided, so that the silicon wafer on the support plate slides down to a position abutting against the side baffle; and a blowing piece, wherein the blowing piece is arranged at the bottom of the supporting plate and is used for blowing air toward the silicon wafer.

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