Clamping method for wafer test

Abstract

The invention discloses a clamping method for wafer test, which is used for loading a wafer into a test fixture, the test fixture comprises an upper cover plate, a lower substrate, a PCB (printed circuit board) mounted on the lower surface of the upper cover plate and a needle plate mounted in the center of the lower surface of the PCB and electrically connected with the PCB, and the upper surface of the lower substrate is provided with a groove for embedding the needle plate. A plurality of locking sleeves distributed at intervals in the circumferential direction are installed on the upper surface of the lower base plate and located on the outer side of the groove, a plurality of locking shells are correspondingly installed on the upper cover plate and located over the locking sleeves, and a first installation hole is formed in the upper surface of each locking shell. And a cap body part at the upper end of a lock rod capable of moving up and down is in sliding fit with the inner wall of the first mounting hole. On the basis that clamping, electric conduction, heating aging and inflation testing are carried out on the wafer in the sealing cavity, wafer installation is facilitated, synchronous locking and unlocking are achieved, pollution to the wafer is reduced, and the stability of locking force is kept all the time.

Description

Technical Field

[0001] The invention relates to a wafer testing clamping method, belonging to the technical field of wafer testing. Background Art

[0002] Silicon carbide (Sic), a third-generation semiconductor chip material, is used in high-voltage MOSFET products. Compared with silicon-based MOSFETs, it can withstand higher voltages and needs to be tested in high-voltage arc-extinguishing gas. It usually needs to meet the 3000V high-voltage test and needs to be filled with gas with a pressure of more than 0.5MPa.

[0003] The current sealing device uses a sealing ring to tighten the seal through multiple screws. The screws distributed on the circumference need to be tightened one by one, and each screw cannot be tightened at once, otherwise it will cause unbalanced tightening between the screws. In addition, the screws that have been disassembled and tightened many times are prone to dropping debris and contaminating the wafer, and their lifespan is reduced and they are prone to breakage under high-pressure environments. Summary of the invention

[0004] The object of the present invention is to provide a wafer testing clamping method, which not only facilitates the installation of the wafer, realizes synchronous locking and unlocking, reduces the contamination of the wafer and always maintains the stability of the locking force, based on the realization of clamping, electrical conduction, heating aging and inflation testing of the wafer in a sealed cavity.

[0005] To achieve the above-mentioned purpose, the technical scheme adopted by the present invention is: a wafer test clamping method, which is used to load the wafer into a test fixture, wherein the test fixture comprises: an upper cover plate, a lower base plate, a PCB board installed on the lower surface of the upper cover plate, and a needle board installed in the center of the lower surface of the PCB board and electrically connected to the PCB board, wherein the upper surface of the lower base plate is provided with a groove for the needle board to be embedded, a heat sink plate is installed on the bottom surface of the groove, a sealing ring is arranged in the groove and on the outside of the needle plate and the heat sink plate, a plurality of locking sleeves are installed on the upper surface of the lower base plate and on the outside of the groove and are distributed at intervals in the circumferential direction, a plurality of locking shells are correspondingly installed on the upper cover plate and directly above the locking shells, and the lower end of the locking shell passes through the PCB board and penetrates into the locking shell; Each of the locking shells has a first mounting hole on its upper surface and a second mounting hole on its lower surface. A third mounting hole connecting the first mounting hole and the second mounting hole has an inner diameter smaller than the inner diameter of the first mounting hole and larger than the inner diameter of the second mounting hole, thereby forming an upper step surface between the first mounting hole and the third mounting hole, and a lower step surface between the third mounting hole and the second mounting hole. A cap body portion at the upper end of a lock rod that can move up and down is slidably matched with the inner wall of the first mounting hole, and the column portion of the lock rod is inserted into the third mounting hole and the second mounting hole in sequence. A spring in an extruded state is sleeved on the outer side of the columnar body of the locking rod and located between the lower step surface and the cap body of the locking rod; a flange portion facing radially inward is provided on the inner wall of the upper end of the locking sleeve; a plurality of through holes are provided on the side wall of the locking shell and located below the flange portion; a ball is installed in each of the through holes connected to the second mounting hole; a circumferentially extending receiving groove is provided at the lower part of the columnar body of the locking rod; a slope surface is provided on the lower end surface of the flange portion and the lower side wall of the receiving groove, and the lower end of the slope surface extends radially outward; The clamping method comprises the following steps: Step 1: Press down several locking rods at the same time so that the cap of each locking rod presses the spring downward and the receiving groove on the column of the locking rod moves down to be flush with the ball; Step 2: Pull the lower base plate downward for a certain distance so that the heat sink plate and the locking sleeve installed on the lower base plate move downward synchronously, thereby forming a gap between the heat sink plate and the needle plate. During this process, each ball moves radially into the receiving groove on the column part under the push of the lower end surface of the flange part of the locking sleeve which is set as a slope surface; Step 3: Place the wafer to be tested on the heat sink plate from the gap between the needle plate and the heat sink plate, at this time, the upper surface of the sealing ring installed on the lower substrate is higher than the upper surface of the lower substrate; Step 4: Move the lower substrate upward so that the upper surface of the sealing ring installed thereon is closely fitted with the lower surface of the PCB board installed on the upper cover plate. At this time, the needle plate installed on the upper cover plate is embedded in the groove opened on the lower substrate and the probe on the needle plate is in electrical contact with the upper surface of the wafer; Step 5. Release several locking rods that are pressed down at the same time so that each locking rod moves up synchronously under the action of the spring. During this process, the lower side wall of the accommodating groove on the cylindrical part of the locking rod pushes each ball radially outward while moving up until it is squeezed and contacted with the lower end face of the flange part on the locking sleeve, thereby sealing and clamping the wafer into the sealing cavity surrounded by the needle plate, the heat sink plate and the sealing ring.

[0006] The further improved scheme in the above technical scheme is as follows: 1. In the above solution, an air inlet and an air outlet are respectively provided on the lower surface of the lower substrate, and the air inlet and the air outlet respectively located on both sides of the lower substrate are connected to the sealed cavity through pipelines.

[0007] 2. In the above solution, the sealing ring is connected to the bottom surface of the groove through a pressure ring.

[0008] 3. In the above solution, the outer wall of the sealing ring is in contact with the inner wall of the groove, and the inner wall of the sealing ring is provided with an annular groove extending radially outward, and the pressure ring is embedded in the annular groove.

[0009] 4. In the above solution, the needle plate is a ceramic needle plate.

[0010] 5. In the above solution, the needle plate is mounted on the PCB board through a snap ring.

[0011] 6. In the above solution, the slope surface on the flange portion is arranged parallel to the slope surface in the receiving groove.

[0012] 7. In the above solution, the upper side wall of the accommodating groove is configured as an inclined surface, and the upper end of the inclined surface extends radially outward.

[0013] 8. In the above solution, the outer surface of the columnar portion of the locking rod is in sliding contact with the inner wall of the second mounting hole.

[0014] 9. In the above solution, the inner wall of the flange portion is in close contact with the outer surface of the locking shell.

[0015] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: The clamping method for wafer testing of the present invention is used for loading the wafer into a test fixture. On the basis of realizing clamping, electrical conduction, heating aging and inflation testing of the wafer in a sealed cavity, it is convenient to repeatedly load the wafer to be tested into the sealed cavity, and can realize synchronous locking and unlocking between multiple locking sleeves and locking shells, so as to ensure the consistency and balance of the acting forces between multiple probes and the wafer, and between the PCB board and the sealing ring in the locked state, so as to improve the sealing performance of the sealed cavity and the consistency and accuracy of the test data, and can also reduce the pollution to the wafer and always maintain the stability of the locking force during long-term and multiple loading and unloading. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Attached Figure 1 It is a structural schematic diagram of the clamping method for wafer testing of the present invention; Attached Figure 2 It is a schematic diagram of the partial structure disassembly of the clamping method for wafer testing of the present invention; Attached Figure 3The local structure diagram of the clamping method for wafer testing of the present invention is shown in FIG. Figure 1 ; Attached Figure 4 For attachment Figure 3 Schematic diagram of the cross section along AA; Attached Figure 5 For attachment Figure 3 Schematic diagram of the cross section along BB; Attached Figure 6 For attachment Figure 5 The enlarged schematic diagram of the center C; Attached Figure 7 The local structure diagram of the clamping method for wafer testing of the present invention is shown in FIG. Figure 2 ; Attached Figure 8 For attachment Figure 7 Schematic diagram of the cross section along DD; Attached Fig. 9 For attachment Figure 8 The enlarged schematic diagram of point E in the middle; Attached Fig.10 Schematic diagram of the unlocking state of the clamping method for wafer testing of the present invention.

[0017] In the above figures: 100, upper cover plate; 200, lower base plate; 201, groove; 202, air inlet; 203, air outlet; 204, pipeline; 300, PCB board; 400, needle plate; 401, second buckle groove; 500, sealing cavity; 600, buckle ring; 601, first buckle groove; 700, heat sink plate; 800, sealing ring; 801, annular groove; 900, pressure ring; 1, Locking shell; 2. Locking sleeve; 3. First mounting hole; 4. Second mounting hole; 5. Third mounting hole; 61. Upper step surface; 62. Lower step surface; 7. Locking rod; 71. Cap body; 72. Column body; 8. Spring; 9. Flange; 10. Through hole; 11. Sphere; 12. Accommodating groove; 131. Limiting clamp; 132. Limiting plane; 14. O-ring; 15. Inner top plate; 16. Outer frame. Implementation

[0018] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0019] Embodiment 1: A wafer test clamping method, used for loading the wafer into a test fixture, the test fixture comprising: an upper cover plate 100, a lower base plate 200, a PCB board 300 installed on the lower surface of the upper cover plate 100, and a needle plate 400 installed in the center of the lower surface of the PCB board 300 and electrically connected to the PCB board 300, the upper surface of the lower base plate 200 is provided with a groove 201 for the needle plate 400 to be embedded, a heat sink plate 700 is installed on the bottom surface of the groove 201, a sealing ring 800 is arranged in the groove 201 and on the outside of the needle plate 400 and the heat sink plate 700, a plurality of locking sleeves 2 distributed at intervals in the circumferential direction are installed on the upper surface of the lower base plate 200 and on the outside of the groove 201, a plurality of locking shells 1 are correspondingly installed on the upper cover plate 100 and directly above the locking sleeve 2, and the lower end of the locking shell 1 passes through the PCB board 300 and penetrates into the locking sleeve 2; Each of the locking shells 1 is provided with a first mounting hole 3 on the upper surface and a second mounting hole 4 on the lower surface. The inner diameter of a third mounting hole 5 connecting the first mounting hole 3 and the second mounting hole 4 is smaller than the inner diameter of the first mounting hole 3 and larger than the inner diameter of the second mounting hole 4, so that an upper step surface 61 is formed between the first mounting hole 3 and the third mounting hole 5, and a lower step surface 62 is formed between the third mounting hole 5 and the second mounting hole 4. A cap body portion 71 at the upper end of a locking rod 7 that can move up and down is slidably matched with the inner wall of the first mounting hole 3, and the columnar body 72 of the locking rod 7 is inserted into the third mounting hole 5 and the second mounting hole 4 in sequence. A spring 8 in an extruded state is sleeved outside the columnar portion 72 of the locking rod 7 and between the lower step surface 62 and the cap body portion 71 of the locking rod 7. A flange portion 9 is provided on the inner wall of the upper end of the locking sleeve 2. A plurality of through holes 10 are provided on the side wall of the locking shell 1 and below the flange portion 9. A sphere 11 is installed in each of the through holes 10 connected to the second mounting hole 4. A circumferentially extending receiving groove 12 is provided at the lower portion of the columnar portion 72 of the locking rod 7. A slope surface is provided on the lower end surface of the flange portion 9 and the lower side wall of the receiving groove 12, and the lower end of the slope surface extends radially outward. The clamping method comprises the following steps: Step 1: Press down several locking rods 7 at the same time so that the cap portion 71 of each locking rod 7 presses the spring 8 downward respectively and the receiving groove 12 on the column portion 72 of the locking rod 7 moves down to be flush with the ball 11; Step 2: Pull the lower base plate 200 downward for a certain distance so that the heat sink plate 700 and the locking sleeve 2 installed on the lower base plate 200 move downward synchronously, thereby forming a gap between the heat sink plate 700 and the needle plate 400. During this process, each ball 11 moves radially into the receiving groove 12 on the column part 72 under the push of the lower end surface of the flange part 9 of the locking sleeve 2 which is set as a slope surface; Step 3: Place the wafer to be tested on the heat sink plate 700 from the gap between the needle plate 400 and the heat sink plate 700. At this time, the upper surface of the sealing ring 800 installed on the lower substrate 200 is higher than the upper surface of the lower substrate 200. Step 4: Move the lower substrate 200 upward so that the upper surface of the sealing ring 800 mounted thereon is closely fitted with the lower surface of the PCB board 300 mounted on the upper cover plate 100. At this time, the needle plate 400 mounted on the upper cover plate 100 is embedded in the groove 201 opened on the lower substrate 200 and the probe (not shown in the figure) on the needle plate 400 is in electrical contact with the upper surface of the wafer; Step 5. Release several locking rods 7 that are pressed down at the same time so that each locking rod 7 moves up synchronously under the action of the spring 8. During this process, the lower side wall of the accommodating groove 12 on the columnar portion 72 of the locking rod 7 pushes each ball 11 radially outward while moving up until it is squeezed and contacted with the lower end surface of the flange portion 9 on the locking sleeve 2, thereby sealing and clamping the wafer into the sealing cavity 500 surrounded by the needle plate 400, the heat sink plate 700 and the sealing ring 800.

[0020] An air inlet 202 and an air outlet 203 are respectively provided on the lower surface of the lower substrate 200 . The air inlet 202 and the air outlet 203 respectively located on both sides of the lower substrate 200 are connected to the sealed cavity 500 through the pipeline 204 .

[0021] The sealing ring 800 is connected to the bottom surface of the groove 201 via a pressing ring 900 .

[0022] The outer wall of the sealing ring 800 is fitted with the inner wall of the groove 201 . The inner wall of the sealing ring 800 is provided with an annular groove 801 extending radially outward, and the pressure ring 900 is embedded in the annular groove 801 .

[0023] The needle plate 400 is a ceramic needle plate.

[0024] The needle plate 400 is mounted on the PCB 300 via a buckle ring 600 .

[0025] The slope surface on the flange portion 9 is arranged parallel to the slope surface in the receiving groove 12 .

[0026] The upper side wall of the receiving groove 12 is configured as an inclined surface, and the upper end of the inclined surface extends radially outward.

[0027] The outer surface of the column portion 72 of the locking rod 7 is in sliding contact with the inner wall of the second mounting hole 4 .

[0028] The inner wall of the flange portion 9 is in close contact with the outer surface of the lock housing 1 .

[0029] A limiting snap ring 131 is installed at the lower part of the column part 72 of the locking rod 7 , and a limiting plane 132 cooperating with the limiting snap ring 131 is arranged in the locking shell 1 and above the limiting snap ring 131 .

[0030] The upper surface of the locking shell 1 is higher than the upper surface of the first component 100 .

[0031] Embodiment 2: A wafer test clamping method, used for loading the wafer into a test fixture, the test fixture comprising: an upper cover plate 100, a lower base plate 200, a PCB board 300 installed on the lower surface of the upper cover plate 100, and a needle plate 400 installed in the center of the lower surface of the PCB board 300 and electrically connected to the PCB board 300, the upper surface of the lower base plate 200 is provided with a groove 201 for the needle plate 400 to be embedded, a heat sink plate 700 is installed on the bottom surface of the groove 201, a sealing ring 800 is arranged in the groove 201 and on the outside of the needle plate 400 and the heat sink plate 700, a plurality of locking sleeves 2 distributed along the circumferential direction are installed on the upper surface of the lower base plate 200 and on the outside of the groove 201, a plurality of locking shells 1 are correspondingly installed on the upper cover plate 100 and directly above the locking sleeve 2, and the lower end of the locking shell 1 passes through the PCB board 300 and penetrates into the locking sleeve 2; Each of the locking shells 1 is provided with a first mounting hole 3 on the upper surface and a second mounting hole 4 on the lower surface. The inner diameter of a third mounting hole 5 connecting the first mounting hole 3 and the second mounting hole 4 is smaller than the inner diameter of the first mounting hole 3 and larger than the inner diameter of the second mounting hole 4, so that an upper step surface 61 is formed between the first mounting hole 3 and the third mounting hole 5, and a lower step surface 62 is formed between the third mounting hole 5 and the second mounting hole 4. A cap body portion 71 at the upper end of a locking rod 7 that can move up and down is slidably matched with the inner wall of the first mounting hole 3, and the columnar body 72 of the locking rod 7 is inserted into the third mounting hole 5 and the second mounting hole 4 in sequence. A spring 8 in an extruded state is sleeved outside the columnar portion 72 of the locking rod 7 and between the lower step surface 62 and the cap body portion 71 of the locking rod 7. A flange portion 9 is provided on the inner wall of the upper end of the locking sleeve 2. A plurality of through holes 10 are provided on the side wall of the locking shell 1 and below the flange portion 9. A sphere 11 is installed in each of the through holes 10 connected to the second mounting hole 4. A circumferentially extending receiving groove 12 is provided at the lower portion of the columnar portion 72 of the locking rod 7. A slope surface is provided on the lower end surface of the flange portion 9 and the lower side wall of the receiving groove 12, and the lower end of the slope surface extends radially outward. The clamping method comprises the following steps: Step 1: Press down several locking rods 7 at the same time so that the cap portion 71 of each locking rod 7 presses the spring 8 downward respectively and the receiving groove 12 on the column portion 72 of the locking rod 7 moves down to be flush with the ball 11; Step 2: Pull the lower base plate 200 downward for a certain distance so that the heat sink plate 700 and the locking sleeve 2 installed on the lower base plate 200 move downward synchronously, thereby forming a gap between the heat sink plate 700 and the needle plate 400. During this process, each ball 11 moves radially into the receiving groove 12 on the column part 72 under the push of the lower end surface of the flange part 9 of the locking sleeve 2 which is set as a slope surface; Step 3: Place the wafer to be tested on the heat sink plate 700 from the gap between the needle plate 400 and the heat sink plate 700. At this time, the upper surface of the sealing ring 800 installed on the lower substrate 200 is higher than the upper surface of the lower substrate 200. Step 4: Move the lower substrate 200 upward so that the upper surface of the sealing ring 800 mounted thereon is closely fitted with the lower surface of the PCB board 300 mounted on the upper cover plate 100. At this time, the needle plate 400 mounted on the upper cover plate 100 is embedded in the groove 201 opened on the lower substrate 200 and the probe (not shown in the figure) on the needle plate 400 is in electrical contact with the upper surface of the wafer; Step 5. Release several locking rods 7 that are pressed down at the same time so that each locking rod 7 moves up synchronously under the action of the spring 8. During this process, the lower side wall of the accommodating groove 12 on the columnar portion 72 of the locking rod 7 pushes each ball 11 radially outward while moving up until it is squeezed and contacted with the lower end surface of the flange portion 9 on the locking sleeve 2, thereby sealing and clamping the wafer into the sealing cavity 500 surrounded by the needle plate 400, the heat sink plate 700 and the sealing ring 800.

[0032] An air inlet 202 and an air outlet 203 are respectively provided on the lower surface of the lower substrate 200 . The air inlet 202 and the air outlet 203 respectively located on both sides of the lower substrate 200 are connected to the sealed cavity 500 through the pipeline 204 .

[0033] The needle plate 400 is mounted on the PCB 300 via a buckle ring 600 .

[0034] A first buckling groove 601 is provided on the upper surface of the inner circumference area of ​​the above-mentioned buckling ring 600, and a second buckling groove 401 matching the first buckling groove 601 is provided at the edge of the lower surface of the needle plate 400. The outer circumference area of ​​the buckling ring 600 is connected to the PCB board 300 by a plurality of bolts, so that the upper surface of the first buckling groove 601 is in extrusion contact with the lower surface of the second buckling groove 401.

[0035] The slope surface on the flange portion 9 is arranged parallel to the slope surface in the receiving groove 12 .

[0036] The upper side wall of the receiving groove 12 is configured as an inclined surface, and the upper end of the inclined surface extends radially outward.

[0037] An O-shaped groove is formed on the lower surface of the upper cover plate 100 and located inside the locking shells 1 , and an O-shaped ring 14 is embedded in the O-shaped groove.

[0038] An inner top plate 15 is disposed between the central area of ​​the upper cover plate 100 and the PCB board 300 .

[0039] The upper cover plate 100 and the PCB board 300 are connected to an outer frame 16 at their respective edges.

[0040] The PCB board 300 extends to the outer sides of the upper cover plate 100 and the lower substrate 200 .

[0041] When the locking rod 7 moves to the lowermost end, the lower surface of the cap body 71 of the locking rod 7 is in surface contact with the upper step surface 61 .

[0042] A limiting snap ring 131 is installed at the lower part of the column part 72 of the locking rod 7 , and a limiting plane 132 cooperating with the limiting snap ring 131 is arranged in the locking shell 1 and above the limiting snap ring 131 .

[0043] The upper surface of the locking shell 1 is higher than the upper surface of the first component 100 .

[0044] When the above-mentioned wafer testing clamping method is adopted, it can realize the clamping, electrical conduction, heat aging and inflation testing of the wafer in the sealed cavity, and it is convenient to repeatedly load the wafer to be tested into the sealed cavity, and can realize the synchronous locking and unlocking between multiple locking sleeves and locking shells, thereby ensuring the consistency and balance of the forces between multiple probes and wafers, and between the PCB board and the sealing ring in the locked state, thereby improving the sealing performance of the sealed cavity and the consistency and accuracy of the test data, and can also reduce the contamination of the wafer and always maintain the stability of the locking force during long-term and multiple loading and unloading.

[0045] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer test clamping method, for loading the wafer into a test fixture, the test fixture comprising: An upper cover plate (100), a lower base plate (200), a PCB (300) mounted on the lower surface of the upper cover plate (100), and a needle plate (400) mounted at the center of the lower surface of the PCB (300) and electrically connected to the PCB (300), characterized in that: a groove (201) is provided on the upper surface of the lower base plate (200) for the needle plate (400) to be embedded, a heat sink plate (700) is mounted on the bottom surface of the groove (201), and the groove (201) is provided with a heat sink plate (700). 01) and is located on the outside of the needle plate (400) and the heat sink plate (700), a sealing ring (800) is provided, a plurality of locking sleeves (2) are installed on the upper surface of the lower base plate (200) and are located on the outside of the groove (201) and are distributed in a circumferential direction, a plurality of locking shells (1) are correspondingly installed on the upper cover plate (100) and are located directly above the locking sleeves (2), and the lower end of the locking shell (1) passes through the PCB board (300) and is inserted into the locking sleeve (2); Each of the locking shells (1) has a first mounting hole (3) on its upper surface and a second mounting hole (4) on its lower surface. A third mounting hole (5) connecting the first mounting hole (3) and the second mounting hole (4) has an inner diameter smaller than the inner diameter of the first mounting hole (3) and larger than the inner diameter of the second mounting hole (4), so that an upper step surface (61) is formed between the first mounting hole (3) and the third mounting hole (5), and a lower step surface (62) is formed between the third mounting hole (5) and the second mounting hole (4). A cap body (71) at the upper end of a locking rod (7) that can move up and down is slidably matched with the inner wall of the first mounting hole (3), and a columnar body (72) of the locking rod (7) is inserted into the third mounting hole (5) and the second mounting hole (4) in sequence. , a spring (8) in an extruded state is sleeved outside the columnar portion (72) of the locking rod (7) and located between the lower step surface (62) and the cap portion (71) of the locking rod (7); a flange portion (9) is provided on the inner wall of the upper end of the locking sleeve (2) in the radial direction; a plurality of through holes (10) are provided on the side wall of the locking shell (1) and located below the flange portion (9); a sphere (11) is installed in each of the through holes (10) connected to the second mounting hole (4); a circumferentially extending receiving groove (12) is provided at the lower portion of the columnar portion (72) of the locking rod (7); a slope surface is provided on the lower end surface of the flange portion (9) and the lower side wall of the receiving groove (12), and the lower end of the slope surface extends radially outward; The clamping method comprises the following steps: Step 1: Press down a plurality of locking rods (7) simultaneously so that the cap portion (71) of each locking rod (7) presses the spring (8) downwards respectively and the receiving groove (12) provided on the column portion (72) of the locking rod (7) moves downwards to be flush with the ball (11); Step 2: Pull the lower base plate (200) downward for a certain distance so that the heat sink plate (700) and the locking sleeve (2) installed on the lower base plate (200) move downward synchronously, thereby forming a gap between the heat sink plate (700) and the needle plate (400). During this process, each ball (11) moves radially into the receiving groove (12) on the column part (72) under the push of the lower end surface of the upper flange part (9) of the locking sleeve (2) which is set as a slope surface; Step 3: placing the wafer to be tested on the heat sink plate (700) from the gap between the needle plate (400) and the heat sink plate (700), at which point the upper surface of the sealing ring (800) mounted on the lower substrate (200) is higher than the upper surface of the lower substrate (200); Step 4: Move the lower substrate (200) upward so that the upper surface of the sealing ring (800) mounted thereon is closely fitted with the lower surface of the PCB board (300) mounted on the upper cover plate (100); at this time, the needle plate (400) mounted on the upper cover plate (100) is embedded in the groove (201) provided on the lower substrate (200) and the probe on the needle plate (400) is in electrical contact with the upper surface of the wafer; Step 5: simultaneously release the plurality of locking rods (7) that are pressed downward so that each locking rod (7) moves upward synchronously under the action of the spring (8). During this process, the lower side wall of the accommodating groove (12) provided on the columnar portion (72) of the locking rod (7) pushes each ball (11) radially outward while moving upward until it is pressed and contacted with the lower end surface of the flange portion (9) on the locking sleeve (2), thereby sealing and clamping the wafer into the sealing cavity (500) surrounded by the needle plate (400), the heat sink plate (700) and the sealing ring (800).

2. The wafer high pressure sealing device according to claim 1, characterized in that: An air inlet (202) and an air outlet (203) are respectively provided on the lower surface of the lower substrate (200), and the air inlet (202) and the air outlet (203) respectively located on both sides of the lower substrate (200) are each connected to the sealed cavity (500) through a pipeline (204).

3. The wafer high pressure sealing device according to claim 1, characterized in that: The sealing ring (800) is connected to the bottom surface of the groove (201) via a pressure ring (900).

4. The wafer high pressure sealing device according to claim 3, characterized in that: The outer wall of the sealing ring (800) fits the inner wall of the groove (201), and an annular groove (801) extending radially outward is provided on the inner wall of the sealing ring (800), and the pressure ring (900) is embedded in the annular groove (801).

5. The wafer high pressure sealing device according to claim 1, characterized in that: The needle plate (400) is a ceramic needle plate.

6. The wafer high pressure sealing device according to claim 1, characterized in that: The needle plate (400) is mounted on the PCB board (300) via a buckle ring (600).

7. The wafer high pressure sealing device according to claim 1, characterized in that: The slope surface on the flange portion (9) is arranged parallel to the slope surface in the accommodating groove (12).

8. The wafer high pressure sealing device according to claim 1, characterized in that: The upper side wall of the accommodating groove (12) is arranged as an inclined surface, and the upper end of the inclined surface extends radially outwards.

9. The wafer high pressure sealing device according to claim 1, characterized in that: The outer surface of the column portion (72) of the locking rod (7) is in sliding contact with the inner wall of the second mounting hole (4).

10. The wafer high pressure sealing device according to claim 1, characterized in that: The inner wall of the flange portion (9) is in close contact with the outer surface of the locking shell (1).

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