A semiconductor integrated gas path analysis and processing method, system and medium

Abstract

The present invention discloses a semiconductor integrated gas path analysis and processing method, system and medium, which relates to the field of semiconductor special gas technology, in order to solve the problem that the integrated gas path analysis method in the prior art cannot adapt to different gas path pressures and gas path flows when the air inlet position and the air outlet position are fixed. The method includes: obtaining a gas path schematic diagram; determining the base block size of the gas path component based on the gas path flow data and the gas path pressure data; comparing the length to be compared with the preset inlet and outlet spacing, if the length to be compared is greater than the preset inlet and outlet spacing, the gas path corresponding to the length to be compared is determined as the gas path to be bypassed; based on the component sequence, the gas path to be bypassed is configured based on the base block size and the preset inlet and outlet spacing, and multiple preliminary bypass schemes are generated, and the multiple preliminary bypass schemes are sorted in order from high to low priority to obtain a first scheme sorting table, thereby improving the gas path configuration efficiency.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor special gas technology, and in particular to a semiconductor integrated gas path analysis and processing method, system and medium. Background Art

[0002] The components in the semiconductor special gas cabinet have a certain life cycle. When the components are damaged or the leakage rate does not meet the standard, they need to be replaced regularly.

[0003] During the installation of the special gas cabinet, the cabinet body of the special gas cabinet is usually fixed to the frame, and then the circuit components, source bottles and integrated gas circuit board are installed in the special gas cabinet in sequence. The integrated gas circuit board is the core of the present invention.

[0004] There are clear requirements for the gas input position, output position, number of valves that each gas pipeline of the integrated gas board passes through, valve sequence, and detection element sequence. In addition, the space where the integrated gas board can be configured also needs to adapt to the specific requirements of the special gas cabinet.

[0005] With the rapid development of domestic semiconductor technology, new materials, new processes and new structures have been continuously broken through. When the integrated gas circuit board of the first generation of special gas cabinets needs to be replaced, in order to use more novel semiconductor-level pipe valve parts, the present invention needs to reshape the pipeline connection method of the EP tube (EP tube refers to a stainless steel tube treated by an electrolytic polishing process) of an integrated gas circuit board. For example, the pipe valve parts of the first generation of integrated gas circuit boards use backward materials, processes and structures to meet the requirements of pressure and flow, which makes the collision volume of the pipe valve parts larger. The collision volume of the new generation of pipe valve parts is smaller. Then, in order to ensure that the path of the gas circuit of the integrated gas circuit board is short enough, we should redraw the gas circuit direction of the integrated gas circuit board according to the parameters. Similarly, if the first generation of integrated gas circuit boards is to adapt to higher pressures and flows, then it is necessary to configure larger-sized pipe valve parts. Then, in order to adapt to larger-sized pipe valve parts and to the shortest preset reference for the gas circuit, we need to redraw the gas circuit direction of the integrated gas circuit board while the positions of the air inlet and outlet remain unchanged.

[0006] The gas path direction of traditional integrated gas manifolds often depends on the designer's ideas, but the level of designers at different levels is different. In order to increase the consistency of the company's products and enable designers with lower levels and lower levels to produce higher-quality integrated gas manifolds more quickly and conveniently, a corresponding integrated gas path configuration method is urgently needed. Summary of the invention

[0007] The object of the present invention is to provide a semiconductor integrated gas circuit analysis and processing method, system and medium, which are used to provide an integrated gas circuit configuration scheme that can adapt to different gas circuit pressures and gas circuit flow rates when the air inlet position and the air outlet position are fixed, thereby improving the integrated gas circuit configuration efficiency and configuration quality.

[0008] In order to achieve the above object, the present invention provides the following technical solutions:

[0009] In a first aspect, the present invention provides a semiconductor integrated gas path analysis and processing method, comprising: obtaining a gas path schematic diagram; the gas path schematic diagram includes an original gas path connection scheme, gas path flow data, and gas path pressure data; the original gas path connection scheme includes at least a component sequence of multiple gas path components in each gas path;

[0010] Determining a base block size corresponding to the gas circuit component based on the gas circuit flow data and the gas circuit pressure data;

[0011] Compare the length to be compared with the preset inlet and outlet spacing. If the length to be compared is greater than the preset inlet and outlet spacing, determine the gas path corresponding to the length to be compared as the gas path to be bypassed; the length to be compared is the sum of the gas path length of each gas path and the length of the first preset threshold; the preset inlet and outlet spacing is the horizontal axial distance between the inlet position and the outlet position of the gas path on the integrated gas path plate;

[0012] Based on the component sequence, the base block size and the preset inlet and outlet spacing, the gas path to be bypassed is configured to generate a plurality of preliminary bypassing schemes;

[0013] The multiple preliminary detour solutions are sorted in order of priority from high to low to obtain a first solution sorting table.

[0014] Optionally, before comparing the length to be compared with the preset entrance and exit spacing, the method further includes:

[0015] Extracting a pre-stored connection scheme corresponding to the gas circuit schematic diagram from a database;

[0016] Determine whether the gas circuit schematic diagram and the pre-stored connection scheme meet a first preset condition; the first preset condition is that the gas circuit component model in the pre-stored connection scheme completely corresponds to the gas circuit component model in the gas circuit schematic diagram;

[0017] When the gas path schematic diagram and the pre-stored connection scheme do not satisfy the first preset condition, continue to compare the length to be compared with the preset inlet and outlet spacing;

[0018] When the gas path schematic diagram and the pre-stored connection plan meet the first preset condition, the pre-stored connection plan is output.

[0019] Optionally, the gas path to be bypassed is configured based on the base block size and the preset inlet and outlet spacing to generate multiple preliminary bypass schemes, including:

[0020] Based on the block size and the preset inlet and outlet spacing, determining a maximum number of blocks corresponding to the preset inlet and outlet spacing;

[0021] Calculating the first bypassing block number based on the gas path length and the maximum block number;

[0022] Based on the maximum number of building blocks, the gas path components that do not need to be bypassed in the gas path to be bypassed are arranged in the first transverse pipeline of the integrated gas path board in the order of components;

[0023] Calculating the first block margin of a second transverse pipeline; the second transverse pipeline is the pipeline that is most adjacent to the first transverse pipeline;

[0024] Based on the first block margin, the first bypass blocks are arranged on the second transverse pipeline in the order of components;

[0025] Determine the size of the first bypassing block number and the first block margin, and if the first bypassing block number is greater than the first block margin, continue to calculate the second bypassing block number;

[0026] Calculating the second block margin of a third transverse pipeline; the third transverse pipeline is a pipeline that is next adjacent to the first transverse pipeline;

[0027] Based on the free amount of the second blocks, the number of the second bypass blocks is arranged on the third transverse pipeline in the order of components;

[0028] Determine the size of the second bypass block number and the second block margin, and if the second bypass block number is greater than the second block margin, continue to calculate the third bypass block number until the Mth bypass block number is less than or equal to the Mth block margin; M is a positive integer greater than or equal to 1;

[0029] The plurality of preliminary detour solutions are outputted.

[0030] Optionally, the multiple preliminary detour solutions are sorted in order of priority from high to low to obtain a first solution sorting table, including:

[0031] Based on a first preset reference, a plurality of corresponding first sub-solutions are selected from the plurality of preliminary detour solutions; the first preset reference is that the diaphragm valve is outside all the transverse pipelines;

[0032] Based on a second preset reference, selecting corresponding second sub-solutions from the plurality of preliminary detour solutions; the second preset reference is that the flow meter is on the inner side of all the lateral pipelines;

[0033] Based on a third preset benchmark, a plurality of corresponding third sub-schemes are selected from the plurality of preliminary detour schemes; the third preset benchmark is that the gas path has the least detours;

[0034] The first scheme ranking table is output according to the priority order of the first preset reference, the second preset reference and the third preset reference.

[0035] Optionally, the semiconductor integrated gas path analysis and processing method further includes:

[0036] Based on a fourth preset reference, a corresponding fourth sub-scheme is selected from the plurality of first sub-schemes, the plurality of second sub-schemes and the plurality of third sub-schemes; the fourth preset reference is that the sum of the vertical cross-path pipeline lengths corresponding to all gas paths is the shortest;

[0037] The fourth sub-scheme is determined as the target adjustment scheme.

[0038] Optionally, the semiconductor integrated gas path analysis and processing method further includes:

[0039] Comparing the ratio of the number of solutions that meet the second preset condition in the multiple preliminary detour solutions with a second preset threshold, if it is greater than the second preset threshold, reducing the first preset threshold by a preset percentage, reconfiguring the gas path schematic diagram, and obtaining a second solution ranking table;

[0040] The second preset threshold is a ratio whose value is less than 1; and the second preset condition is that the number of pipe columns of the transverse pipes used in all gas paths in each preliminary bypass scheme is greater than the preset number of columns.

[0041] Optionally, the semiconductor integrated gas path analysis and processing method further includes:

[0042] After lowering the first preset threshold by a preset percentage, determine whether the obtained value is less than the third preset threshold. If it is less than the third preset threshold, determine the third preset threshold as the new first preset threshold, reconfigure the gas path schematic diagram, and obtain a third scheme ranking table.

[0043] Optionally, the semiconductor integrated gas path analysis and processing method further includes:

[0044] Determine whether the number of transverse pipe columns used by each preliminary detour solution is greater than the number of transverse pipe columns in the pre-stored connection solution; if it is less than the number of transverse pipe columns in the pre-stored connection solution, the corresponding preliminary detour solution is ranked up by a preset number of times in the first solution ranking table to form a fourth solution ranking table, and output the fourth solution ranking table;

[0045] If it is greater than or equal to the number of transverse pipeline columns in the pre-stored connection scheme, the corresponding preliminary detour scheme is lowered by a preset number of orders in the first scheme sorting table to form a fifth scheme sorting table, and the fifth scheme sorting table is output.

[0046] Compared with the prior art, the semiconductor integrated gas path analysis and processing method provided by the present invention determines the base block size corresponding to the gas path component based on the gas path flow data and the gas path pressure data after obtaining the gas path schematic diagram, and then configures the gas path to be bypassed based on the base block size and the preset inlet and outlet spacing based on the component sequence, generates multiple preliminary bypass schemes, and sorts the multiple preliminary bypass schemes in order of priority from high to low to obtain a first scheme sorting table. These preliminary bypass schemes in the first scheme sorting table can be adapted to design conditions of different gas path pressures and gas path flows when the air inlet position and the air outlet position are fixed, providing designers with a variety of different integrated gas path board design schemes for reference, thereby enabling designers with lower job levels and lower levels to design higher quality integrated gas path boards more conveniently and quickly, thereby improving the efficiency and configuration quality of semiconductor integrated gas path analysis and processing.

[0047] In a second aspect, the present invention further provides a semiconductor integrated gas path analysis and processing system, comprising:

[0048] An acquisition module, used for acquiring a gas circuit schematic diagram; the gas circuit schematic diagram includes an original gas circuit connection scheme, gas circuit flow data and gas circuit pressure data; the original gas circuit connection scheme includes at least a component sequence of multiple gas circuit components in each gas circuit;

[0049] A first determination module, configured to determine a base block size corresponding to the gas circuit component based on the gas circuit flow data and the gas circuit pressure data;

[0050] The second determination module is used to compare the length to be compared with the preset inlet and outlet spacing. If the length to be compared is greater than the preset inlet and outlet spacing, the gas path corresponding to the length to be compared is determined as the gas path to be bypassed; the length to be compared is the sum of the gas path length of each gas path and the length of the first preset threshold; the preset inlet and outlet spacing is the horizontal axial distance between the inlet position and the outlet position of the gas path on the integrated gas path plate;

[0051] A configuration module, configured to configure the gas path to be bypassed based on the component sequence, the base block size and the preset inlet and outlet spacing, and generate a plurality of preliminary bypass schemes;

[0052] The sorting module is used to sort the multiple preliminary detour solutions in order of priority from high to low to obtain a first solution sorting table.

[0053] In a third aspect, the present invention further provides a computer storage medium, characterized in that instructions are stored in the computer storage medium, and when the instructions are executed, any of the semiconductor integrated gas circuit analysis and processing methods described above is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0055] Figure 1 A schematic flow chart of a semiconductor integrated gas path analysis and processing method provided by one embodiment of the present invention;

[0056] Figure 2 A schematic diagram of the structure of an integrated gas circuit board provided in one embodiment of the present invention;

[0057] Figure 3 A structural diagram of an integrated gas circuit board provided for one embodiment of the present invention;

[0058] Figure 4 A gas circuit schematic diagram provided for one embodiment of the present invention;

[0059] Figure 5 A schematic diagram for comparing multiple preliminary detour solutions provided for an embodiment of the present invention;

[0060] Figure 6 A schematic diagram of a preliminary detour solution provided for an embodiment of the present invention;

[0061] Figure 7 A schematic diagram of a target adjustment scheme provided for one embodiment of the present invention;

[0062] Figure 8 A schematic diagram of the structure of a semiconductor integrated gas path analysis and processing system provided by one embodiment of the present invention;

[0063] Figure markings: 1-first gas path; 2-second gas path; 3-third gas path; 4-fourth gas path; 5-fifth gas path; 6-sixth gas path; 7-seventh gas path; 8-eighth gas path; 10-integrated gas path plate; 11-lateral pipeline; 12-mounting hole; 13-base block; 14-gas path assembly. DETAILED DESCRIPTION

[0064] In order to clearly describe the technical solutions of the embodiments of the present invention, in the embodiments of the present invention, words such as "first" and "second" are used to distinguish the same items or similar items with basically the same functions and effects. For example, the first threshold and the second threshold are only used to distinguish different thresholds, and their order is not limited. Those skilled in the art can understand that words such as "first" and "second" do not limit the quantity and execution order, and words such as "first" and "second" do not necessarily limit them to be different.

[0065] It should be noted that, in the present invention, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the present invention should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0066] In the present invention, "at least one" means one or more, "more than one" means two or more. "And / or" describes the association relationship of the associated objects, indicating that three types of relationships may exist.

[0067] like Figure 1 As shown, an embodiment of the present invention provides a semiconductor integrated gas path analysis and processing method, which may include:

[0068] Step 110: Obtaining a gas circuit schematic diagram; the gas circuit schematic diagram includes an original gas circuit connection scheme, gas circuit flow data, and gas circuit pressure data; the original gas circuit connection scheme includes at least a component sequence of multiple gas circuit components in each gas circuit;

[0069] The gas circuit schematic diagram obtained in step 110 is a gas circuit connection schematic diagram corresponding to the special gas cabinet.

[0070] It is understandable that a special gas cabinet is a special gas storage cabinet or gas safety cabinet, which is a safety device specially used to store special gases (such as flammable, toxic, corrosive gases, etc.). The main purpose of the special gas cabinet is to ensure the safety of these gases during storage and use and reduce potential risks. Semiconductor special gas cabinets can be used for gas supply and control in the chip manufacturing process.

[0071] For example, the integrated gas manifold included in the special gas cabinet can refer to Figure 2 and Figure 3 The integrated gas circuit board 10 includes P (P is greater than or equal to 1) mutually parallel transverse pipelines 11. Each transverse pipeline 11 can be provided with multiple mounting holes 12. These mounting holes 12 can at least be used to fix the base block 13. The base block 13 is a pipeline unit when the gas circuit is connected. The base block is a hard pipe. The gas circuit assembly 14 can be installed on the base block 13.

[0072] Understandably, Figure 2 and Figure 3 The mounting holes 12 are only presented as examples for ease of understanding. In fact, the sizes of the mounting holes may be different, and the distances between different mounting holes may be set according to actual conditions. The embodiments of the present invention do not make any specific limitations on this.

[0073] Specifically, the gas circuit assembly may include a valve, a flow meter, a source bottle, etc. The valve may include a stop valve, a control valve, etc. The source bottle is a storage device for storing special gases.

[0074] It should be noted that the base block includes at least one inlet and at least one outlet, that is, the base block can be two-way, three-way, or even four-way. For more specific base block structures, reference can be made to related technologies, and the embodiments of the present invention will not be repeated.

[0075] For example Figure 4 It shows a gas circuit schematic diagram provided by the customer. Figure 4 There are 2 gas inlets, the first gas inlet inputs nitrogen, and the second gas inlet inputs process gas. There are 3 gas outlets, the first gas outlet flows to the chamber, the second gas outlet flows to the pump, and the third gas outlet flows to the chamber. Obviously, the gas circuit schematic diagram contains multiple gas circuits. The original gas circuit connection scheme of multiple gas circuits can be analyzed from the gas circuit schematic diagram. In the original gas circuit connection scheme, the order of gas circuit components in each gas circuit is fixed. Of course, information such as gas circuit flow data and gas circuit pressure data can also be obtained from the gas circuit schematic diagram. Figure 4 The bottom gas circuit is used as an example for illustration. The process gas is input into the gas circuit inlet and flows to the chamber at the gas circuit outlet. The gas circuit components through which the process gas flows are as follows: high pressure valve HV-GLO2, diaphragm valve DV-G21, control valve CV-G2, flow meter FI-G2, pressure switch PS-G2, mass flow controller MFC-G2, diaphragm valve DV-G22, flow meter FI-GL2 and diaphragm valve DV-GL2. Figure 4 Other gas paths, gas path components in other gas paths, and the order of gas path components will not be repeated here.

[0076] Step 120: Determine the base block size corresponding to the gas circuit component based on the gas circuit flow data and the gas circuit pressure data;

[0077] Step 120 may specifically include: determining the collision volume of the gas circuit component based on the gas circuit flow data and the gas circuit pressure data, and determining the model of the gas circuit component and the corresponding base block size based on the collision volume.

[0078] Specifically, the collision volume is the size of the three-dimensional space occupied by the gas circuit component. The model of the gas circuit component can be determined based on the collision volume, and the size of the base block corresponding to the gas circuit component can be determined based on the collision volume.

[0079] It is understandable that in the embodiment of the present invention, only the projection surface size of the collision volume on the two-dimensional plane of the XY axis is considered to output the block size. That is, a minimum block is output according to the maximum projection area. Among them, the block must be able to cover the above projection area.

[0080] It should be noted that the collision volume of each gas circuit component is different, but the block size needs to be the same size value in the same gas circuit connection scheme. Therefore, when determining the block size corresponding to the gas circuit component based on the collision volume, in the first optional embodiment, the block size can be determined according to the maximum collision volume, in the second optional embodiment, the block size can be determined according to a certain collision volume (not the maximum collision volume), and in the third optional embodiment, the block size can be obtained by querying the table of the minimum block corresponding to the pre-stored maximum valve. In the embodiment of the present invention, there is no specific limitation on which gas circuit component's collision volume is used to determine the block size, and the block size can be determined according to the specific implementation needs.

[0081] For example, the following information can be obtained from an analysis of a gas circuit schematic diagram: the gas circuit flow data is 10ml / s, and the gas circuit pressure data is 2Mpa. Based on the gas circuit flow data of 10ml / s and the gas circuit pressure data of 2Mpa, the collision volume of different gas circuit components can be obtained. For example, the collision volume of the diaphragm valve is 10*5*10 , the collision volume of the one-way valve is 5*5*3 , the collision volume of the pressure reducing valve is 20*10*15 Based on the above three collision volumes, the final block size is 10*10*w , w is a value greater than 0.

[0082] It should be noted that when the gas circuit components in the gas circuit are arranged in the order of components based on the base block on the integrated gas circuit board, in the embodiment of the present invention, the arrangement is only performed on the two-dimensional plane where the integrated gas circuit board is located. Figure 3 In the figure, the two-dimensional plane where the integrated gas circuit board is located can be divided into an X-axis and a Y-axis, wherein the Y-axis is parallel to the transverse pipeline on the integrated gas circuit board, and the X-axis is perpendicular to the transverse pipeline on the integrated gas circuit board.

[0083] It should be further explained that when the gas path components are configured and arranged on the transverse pipeline, one-dimensional data in the block size is used, such as the block length or the block width.

[0084] Preferably, the projection of the base block on the two-dimensional plane is a square, so the base block length and the base block width are equal.

[0085] Step 130: Compare the length to be compared with the preset inlet and outlet spacing. If the length to be compared is greater than the preset inlet and outlet spacing, determine the gas path corresponding to the length to be compared as the gas path to be bypassed; the length to be compared is the sum of the gas path length of each gas path and the length of the first preset threshold; the preset inlet and outlet spacing is the horizontal axial distance between the inlet position and the outlet position of the gas path on the integrated gas path plate;

[0086] The length of the gas path is determined based on the length of the gas path assembly and the number of gas path assemblies in the gas path. It should be noted that the length of the gas path assembly is based on the length of the base block and the preset gas path assembly base block ratio. This is because the gas path assembly length of some gas path assemblies is consistent with the base block length, that is, the preset gas path assembly base block ratio is 1. For example, many valve types need to be directly installed on the base block, then these valve types belong to the reference valve. For these reference valves, one valve occupies one base block, then the gas path assembly length of the reference valve is the base block length. The gas path assembly length of another part of the gas path assemblies is greater than the base block length. For this type of gas path assembly, the preset gas path assembly base block ratio may be 2, or 3, and so on. For example, the preset gas path assembly base block ratio of the flow meter is 2, that is, the gas path assembly length of a flow meter is twice the length of the base block. When a flow meter is configured and arranged on the horizontal pipeline, it needs to occupy the position of 2 base blocks. There are also some gas circuit components whose preset gas circuit component base block ratio is 0, which means that such gas circuit components may be installed on other gas circuit components, such as pressure sensors, which do not need to occupy the position of the base block when they are configured and arranged on the horizontal pipeline.

[0087] In an optional embodiment, the preset gas circuit component base block ratio and base block length are substituted into formula (1):

[0088] (1)

[0089] The gas path length is calculated; where, is the length of a gas path, M is the total number of gas path components on a gas path, is the base block length, The preset gas path component base ratio of the i-th gas path component in a gas path.

[0090] The first preset threshold represents the construction operation space reserved during the gas circuit configuration process, or the first preset threshold is the space reserved for workers to insert their wrenches into the bolts of the pipe joints.

[0091] Substitute the first preset threshold and the gas path length into formula (2):

[0092] (2)

[0093] Calculate the length to be compared; where, is the length to be compared, is the first preset threshold.

[0094] Optionally, the preset inlet and outlet spacing may correspond to the length of the transverse pipeline in the Y-axis direction on the integrated gas circuit board.

[0095] It is understandable that when the length to be compared is greater than the preset inlet and outlet spacing, there are two situations. The first situation may be that the gas path length is greater than the preset inlet and outlet spacing. In this case, there is no operating space for the gas path configuration at all; the second situation may be that the gas path length is less than the preset inlet and outlet spacing, but the sum of the gas path length and the first preset threshold is greater than the preset inlet and outlet spacing. In this case, there is a part of the operating space for the gas path configuration, but the operating space is not large enough. In order to improve the efficiency of the actual operation of the gas path configuration, in the stage of designing the gas path configuration, it is necessary to reserve enough operating space (that is, the first preset threshold) in advance. Therefore, whether it is the first situation or the second situation, the gas path needs to be bypassed. In other words, the gas path to be bypassed needs to be configured on at least 2 horizontal pipelines on the integrated gas path board.

[0096] It is understandable that when the length to be compared is less than or equal to the preset inlet and outlet spacing, it indicates that sufficient operating space has been reserved. At this time, the gas path does not need to be detoured, and can be arranged in a certain horizontal pipeline of the integrated gas circuit board according to the component sequence.

[0097] Step 140: Based on the component sequence, the base block size and the preset inlet and outlet spacing, the bypass gas path is configured to generate multiple preliminary bypass solutions.

[0098] Optionally, in step 140 , a plurality of preliminary detour solutions may be generated based on a product neural network.

[0099] Optionally, in step 140 , a plurality of preliminary detour solutions may be generated based on an enumeration method.

[0100] The primary purpose of the embodiment of the present invention is to adapt to different pressures and flow rates, and to generate a configuration method of multiple gas paths on an integrated gas path board according to fixed gas inlet and outlet positions for reference by designers.

[0101] From the above content, it can be seen that in the embodiment of the present invention, after obtaining the gas circuit schematic diagram, the base block size corresponding to the gas circuit component is determined based on the gas circuit flow data and the gas circuit pressure data, and then when the sum of the gas circuit length and the length of the first preset threshold is greater than the preset inlet and outlet spacing, the bypass gas circuit is configured based on the component sequence, the base block size and the preset inlet and outlet spacing, and multiple preliminary bypass schemes are generated. These preliminary bypass schemes are suitable for different pressures, flows, and fixed air inlet and outlet positions, providing designers with a variety of different integrated gas circuit board design schemes for reference, so that designers with lower job levels and lower levels can design higher quality integrated gas circuit boards more conveniently and quickly.

[0102] In the first specific implementation, step 140 may specifically include the following steps:

[0103] Step 1: Based on the block size and the preset inlet and outlet spacing, determine the maximum number of blocks corresponding to the preset inlet and outlet spacing;

[0104] In the first step, the maximum number of blocks corresponding to the preset inlet and outlet spacing is actually determined based on the block length and the preset inlet and outlet spacing.

[0105] Further, the difference between the preset inlet and outlet spacing and the first preset threshold is calculated, and then the ratio of the difference to the block length is calculated, and the comparison value result is rounded to obtain the maximum number of blocks corresponding to the preset inlet and outlet spacing. It can be understood that the comparison value result is greater than 0, so after the comparison value result is rounded, the positive integer part of the ratio result is obtained.

[0106] Alternatively, the block length and the preset inlet and outlet spacing can be substituted into formula (3):

[0107] (3)

[0108] Calculate the maximum number of blocks corresponding to the preset entrance and exit spacing. Among them, INT() is the value function; The maximum number of blocks corresponding to the preset entrance and exit spacing; The preset entrance and exit distance.

[0109] For example, if the length of the base block is 10 cm, the preset inlet and outlet spacing is 100 cm, and the first preset threshold is 15 cm, then the maximum number of base blocks corresponding to the preset inlet and outlet spacing is .

[0110] Step 2: Calculate the number of first bypass blocks based on the gas path length and the maximum number of blocks;

[0111] The calculation formula for the gas path length is shown in the above formula (1).

[0112] The second step is equivalent to: determining the difference between the number of blocks included in each gas path and the maximum number of blocks as the number of blocks for the first bypass.

[0113] For example, the first gas path contains 10 gas path components, including 8 reference valves and 2 flow meters. As mentioned above, the length of the reference valve is the length of the base block, and the length of a flow meter is 2 base block lengths. Therefore, the gas path length of the first gas path is the sum of the base block lengths of 12 base blocks, that is, the first gas path needs to occupy the space of 12 base blocks. Since the maximum number of base blocks is 8, there are still 4 base blocks that need to be bypassed.

[0114] Step 3: Based on the maximum number of blocks, the gas path components that do not need to be bypassed in the gas path to be bypassed are arranged in the first transverse pipeline of the integrated gas path board in the order of components;

[0115] According to the example analyzed in the second step, since the maximum number of base blocks is 8, the first 8 reference valves can be arranged in the first horizontal pipeline according to the component order (for example, refer to Figure 6 As for the remaining two flow meters, that is, the redundant four blocks, they are arranged on other lateral pipelines except the lateral pipeline of route A according to the following steps.

[0116] It is understandable that when the number of the first bypass blocks is 0, all the gas path components in the gas path are arranged on the first transverse pipeline according to the component sequence, and the gas path achieves a straight line configuration.

[0117] Step 4: when the number of first bypass blocks is not 0, the first block margin of the second transverse pipeline is calculated; the second transverse pipeline is the pipeline closest to the first transverse pipeline;

[0118] It is understandable that the second transverse pipeline may have been configured with blocks corresponding to the gas path components from other gas paths. In this case, the block difference between the maximum number of blocks and the existing number of blocks in the second transverse pipeline can be calculated, and the block difference can be determined as the first block margin of the second transverse pipeline.

[0119] Then, the fourth step can specifically include:

[0120] Get the number of existing blocks on the second transverse pipeline after the last configuration is completed;

[0121] The block difference between the maximum number of blocks and the existing number of blocks is calculated, and the block difference is determined as the first block margin corresponding to the second transverse pipeline.

[0122] Similarly, for all transverse pipelines, the number of existing blocks corresponding to the transverse pipeline can be obtained after each configuration is completed, and the maximum number of blocks and the number of existing blocks can be used to calculate the block free space after each configuration of the transverse pipeline is completed.

[0123] Step 5: Based on the free space of the first blocks, the number of first bypass blocks is arranged on the second transverse pipeline in the order of components;

[0124] Optionally, when configuring on the second transverse pipeline, the configuration can be performed based on a convolutional neural network system.

[0125] Optionally, when configuring on the second transverse pipeline, the configuration may be performed based on an enumeration method.

[0126] Step 6: After the second transverse pipeline configuration is completed, the number of the first bypass blocks and the first block margin are determined. If the number of the first bypass blocks is greater than the first block margin, the number of the second bypass blocks is calculated.

[0127] It is understandable that if the number of the first bypass blocks is less than or equal to the first block margin, this judgment result indicates that the second transverse pipeline can carry the first number of bypass blocks. In this case, there is no need to perform the following steps and multiple preliminary bypass plans can be directly output.

[0128] If the number of the first bypass blocks is greater than the first block margin, this judgment result indicates that the second transverse pipeline cannot carry the first number of bypass blocks. Then it is necessary to first arrange the gas path components that the second transverse pipeline can carry based on the first block margin, and then convert the gas path components that the second transverse pipeline cannot carry into the second number of bypass blocks, and continue to configure towards the third transverse pipeline, which is the configuration method in the seventh step.

[0129] The second bypass block number is the difference between the first bypass block number and the first block margin.

[0130] Step 7: Calculate the second base block margin of the third transverse pipeline; the third transverse pipeline is the pipeline that is second most adjacent to the first transverse pipeline; it can be understood that the third transverse pipeline is the pipeline that is most adjacent to the second transverse pipeline;

[0131] Step 8: Based on the free space of the second blocks, the number of second bypass blocks is arranged on the third transverse pipeline in the order of components;

[0132] Optionally, when configuring on the third transverse pipeline, the configuration can be performed based on a convolutional neural network system.

[0133] Optionally, when configuring on the third transverse pipeline, the configuration may be performed based on an enumeration method.

[0134] Step 9: Determine the size of the second bypass block number and the second block margin. If the second bypass block number is greater than the second block margin, continue to calculate the third bypass block number until the Mth bypass block number is less than or equal to the Mth block margin; M is a positive integer greater than or equal to 1;

[0135] Step 10: Output multiple preliminary bypass plans.

[0136] In the second specific implementation, a grid for placing blocks can be constructed; according to formula (3), the maximum number of grids between the gas inlet and the gas outlet is calculated by the preset inlet and outlet spacing; the blocks corresponding to each gas path component are arranged according to the A path that needs to be detoured in the original gas path connection plan until they cannot be arranged. For example, the maximum number of grids is 8, and 7 blocks have been arranged. It is impossible to arrange a flow meter that occupies 2 blocks on this route. The remaining number is the number of blocks that need to be detoured for the first time. In this way, the number of blocks for the second detour, the number of blocks for the third detour, and so on can also be calculated. The next step is to perform multiple detour steps according to the steps in the first specific implementation to generate multiple preliminary detour plans.

[0137] With reference to the first and second embodiments, in the third embodiment, step 140 may include:

[0138] Step 1: Based on the size of the blocks and the preset inlet and outlet spacing, determine the maximum number of blocks corresponding to the preset inlet and outlet spacing;

[0139] Step 2: Based on the gas path length and the maximum number of blocks, the number of first bypass blocks is calculated and the corresponding first bypass gas path assembly is generated;

[0140] Step 3: Based on the maximum number of blocks, the gas path components that do not need to be bypassed in the gas path to be bypassed are arranged in the first transverse pipeline of the integrated gas path board in the order of components;

[0141] Step 4: Calculate the first base block margin of the second transverse pipeline; the second transverse pipeline is the pipeline closest to the first transverse pipeline;

[0142] Step 5: Based on the first block free space and the number of first bypass blocks, the first bypass gas path components are arranged on the second transverse pipeline according to the component sequence;

[0143] Step 6: Determine the sum of the lengths of the first bypass gas path components and the size of the first base block margin. If the sum of the lengths of the first bypass gas path components is greater than the first base block margin, continue to calculate the second bypass base block number and generate the corresponding second bypass gas path components.

[0144] Step 7: Calculate the second base block margin of the third transverse pipeline; the third transverse pipeline is the pipeline that is next to the first transverse pipeline;

[0145] Step 8: Based on the free space of the second base block, arrange the second bypass gas path assembly on the third transverse pipeline according to the assembly sequence;

[0146] Step 9: Determine the sum of the lengths of the second bypass gas path components and the size of the second base block margin. If the sum of the lengths of the second bypass gas path components is greater than the second base block margin, continue to calculate the third bypass base block number and generate the corresponding third bypass gas path components until the sum of the lengths of the Mth bypass gas path components is less than or equal to the Mth base block margin; M is a positive integer greater than or equal to 1;

[0147] Step 10: Output multiple preliminary detour plans.

[0148] The above describes the specific implementation steps of multiple preliminary bypass solutions. After obtaining multiple preliminary solutions, in order to facilitate designers to select a better design solution, after step 140, step 150 can be performed: sort the multiple preliminary bypass solutions in order from high to low priority to obtain a first solution sorting table.

[0149] Regarding the ranking criteria of the priority in the first scheme ranking table, refer to the following specific steps in step 150:

[0150] The first selection step: based on a first preset reference, selecting a corresponding plurality of first sub-solutions from a plurality of preliminary detour solutions; the first preset reference is that the diaphragm valve is outside all the lateral pipelines;

[0151] It should be noted that in the first preset reference, the diaphragm valve is on the outer pipeline of all transverse pipelines. This is in consideration of the special structure of the diaphragm valve. Because the diaphragm valve has a 90-degree bend structure, it will be inconvenient to install the diaphragm valve on the transverse pipeline in the middle of the integrated gas manifold. In order to improve the efficiency of construction and installation, when designing the integrated gas manifold, it is often considered to place the diaphragm valve on the outermost transverse pipeline of the integrated gas manifold as much as possible.

[0152] The second selection step: based on a second preset reference, selecting a corresponding plurality of second sub-solutions from a plurality of preliminary detour solutions; the second preset reference is that the flow meter is on the inner side of all lateral pipelines;

[0153] It should be noted that in the second preset benchmark, the flow meter is designed to be installed in the middle pipeline of all the horizontal pipelines on the integrated gas circuit board. This is because many flow meters are relatively high. If the flow meter is configured on the outer horizontal pipeline, it will cause inconvenient construction conditions when constructing and configuring the inner horizontal pipeline. In order to improve the construction and installation efficiency, the flow meter is often configured on the inner horizontal pipeline when designing the integrated gas circuit board.

[0154] The third selection step: based on a third preset criterion, selecting corresponding third sub-schemes from the plurality of preliminary detour schemes; the third preset criterion is that the gas path has the least detours;

[0155] Output step: output the first scheme ranking table according to the priority order of the first preset benchmark, the second preset benchmark and the third preset benchmark.

[0156] For example Figure 5 As shown, Scheme 0 is a straight-through scheme for a gas route, but the length to be compared of the gas route is greater than the preset entrance and exit spacing. Therefore, it is necessary to generate multiple preliminary detour schemes for the gas route according to the above detour schemes. Figure 5 Scheme 1 and Scheme 2 in the figure are two of the multiple preliminary detour schemes. The circle in the figure represents the diaphragm valve; the rectangle represents the flow meter; the sum of the lengths of the two dotted boxes at both ends of the pipeline is the first preset threshold. Specifically, the two dotted boxes can be the space reserved for workers to insert the wrench into the bolts of the pipe joints; the direction of the arrow represents the gas output direction. Scheme 2 meets the first preset criterion, and Scheme 2 meets the second preset criterion. Scheme 1 has fewer bends and meets the third preset criterion. It should be noted that in Scheme 1, only two horizontal pipelines, such as A and B, are used. There is a gap between A and B, and a hard pipe can be installed to connect A and B. Scheme 2 uses three horizontal pipelines, A, B and C.

[0157] In an optional embodiment, the semiconductor integrated gas path analysis and processing method may also include the following adjustment scheme generation step: based on a fourth preset benchmark, selecting a corresponding fourth sub-scheme from multiple first sub-schemes, multiple second sub-schemes, and multiple third sub-schemes, and determining the fourth sub-scheme as the target adjustment scheme; wherein the fourth preset benchmark is the shortest sum of the vertical cross-path pipeline lengths corresponding to all gas paths.

[0158] It is understandable that the sum of the lengths of the vertical cross-pipes can be said to be the sum of the widths of the multiple transverse pipelines occupied by all gas circuits. The concept of transverse pipelines has been explained above and will not be repeated here.

[0159] Optionally, the adjustment scheme generating step may specifically include: according to the relative relationship requirements between multiple horizontal pipelines, using enumeration method, based on multiple first sub-schemes, multiple second sub-schemes and multiple third sub-schemes, enumerating and generating the vertical cross-pipe lengths corresponding to each sub-scheme, and then selecting the scheme with the shortest sum of the vertical cross-pipe lengths of all pipelines and outputting it as the fourth sub-scheme, which is the target adjustment scheme.

[0160] Figure 6 That is, a preliminary detour plan in the first plan ranking table, Figure 6It shows the first gas line 1, the second gas line 2, the third gas line 3, the fourth gas line 4, the fifth gas line 5, the sixth gas line 6, the seventh gas line 7, and the eighth gas line 8. These eight gas lines use a total of four horizontal pipelines, namely A, B, C, and D.

[0161] Figure 7 It is a target adjustment plan. Figure 7 Indicated that Figure 6 The positions of the original gas path components on road C and road D were swapped, so that the sum of the vertical cross-pipe lengths corresponding to all gas paths in this target adjustment plan was the shortest.

[0162] The relative relationship requirements are illustrated by way of example. The source bottle does not affect the configuration of other gas circuit components in the transverse pipeline, that is, the gas circuit components can be configured at the location of the source bottle. Since the source bottle is large in size, it generally occupies two transverse pipelines at the same time. Therefore, the relative relationship requirement can be: when the source bottle is separated by one path between two adjacent transverse pipelines, no transverse pipeline is added.

[0163] For example Figure 6 The Zhongyuan bottle needs to occupy 2 horizontal pipes. Figure 6 It shows that the source bottle occupies two horizontal pipelines, B and C. After adjusting the scheme generation step of the first scheme sorting table, we get Figure 7 The target adjustment scheme shown is that the source bottle does not affect the configuration of other gas path components. Figure 6 The original C route and D route were swapped.

[0164] In an optional implementation, before comparing the length to be compared with the preset inlet and outlet spacing, the semiconductor integrated gas path analysis and processing method may further include:

[0165] Extracting a pre-stored connection scheme corresponding to the gas circuit schematic diagram from a database;

[0166] Determine whether the gas circuit schematic diagram and the pre-stored connection scheme meet a first preset condition; the first preset condition is that the gas circuit component model in the pre-stored connection scheme completely corresponds to the gas circuit component model in the gas circuit schematic diagram;

[0167] When the gas path schematic diagram and the pre-stored connection scheme do not meet the first preset condition, continue to compare the length to be compared with the preset inlet and outlet spacing;

[0168] When the gas circuit schematic diagram and the pre-stored connection plan meet a first preset condition, the pre-stored connection plan is output.

[0169] From the above content, it can be seen that in the specific implementation, it is possible that the gas circuit schematic diagram provided by the customer is the same as the schematic diagram of other customers before. In this case, the previous design plan should be stored in the database, that is, the pre-stored connection plan. The pre-stored connection plan can be directly output as the final design plan, which saves the designer's working time and improves work efficiency.

[0170] In an optional embodiment, the semiconductor integrated gas path analysis and processing method may further include:

[0171] Compare the proportion of the number of solutions that meet the second preset condition in the multiple preliminary detour solutions with the second preset threshold value, if it is greater than the second preset threshold value, reduce the first preset threshold value by a preset percentage, reconfigure the gas path schematic diagram, and obtain a second solution ranking table;

[0172] The second preset threshold is a ratio whose value is less than 1; and the second preset condition is that the number of pipe columns of the transverse pipes used in all gas paths in each preliminary bypass scheme is greater than the preset number of columns.

[0173] For example, the preset number of columns is the number of all transverse pipes on the integrated gas manifold.

[0174] For example Figure 3 From the integrated gas circuit board in the X-axis direction, it can be seen that the number of pipeline columns of the transverse pipelines is 9 in total. Preferably, the preset number of columns is 9.

[0175] For example, the second preset threshold is 30%, there are 100 preliminary bypass solutions, and the number of pipeline columns in 50 preliminary bypass solutions exceeds 9 columns, then the number of solutions that meet the second preset condition in the multiple preliminary bypass solutions accounts for 50%, and it is obvious that 50% exceeds the requirement of 30%, so the first preset threshold of 15cm can be reduced by, for example, 10% to obtain a new first preset threshold of 13.5cm. Based on the new first preset threshold, step 140 is repeated to obtain a second solution ranking table in order of priority.

[0176] For example, the second preset threshold is 50%.

[0177] In an optional embodiment, the semiconductor integrated gas path analysis and processing method may further include:

[0178] After lowering the first preset threshold by a preset percentage, determine whether the obtained value is less than the third preset threshold. If it is less than the third preset threshold, determine the third preset threshold as the new first preset threshold, reconfigure the gas path schematic, and obtain the third scheme ranking table.

[0179] From the above content, it can be seen that the first preset threshold has a lower limit, which is to reserve the minimum construction operation space.

[0180] For example, the third preset threshold is half of the first preset threshold.

[0181] In an optional embodiment, the semiconductor integrated gas path analysis and processing method may further include:

[0182] Determine whether the number of transverse pipeline columns used by each preliminary detour scheme is greater than the number of transverse pipeline columns in the pre-stored connection scheme; if it is less than the number of transverse pipeline columns in the pre-stored connection scheme, the corresponding preliminary detour scheme is ranked up by a preset number of times in the first scheme ranking table to form a fourth scheme ranking table, and output the fourth scheme ranking table;

[0183] If it is greater than or equal to the number of transverse pipeline columns in the pre-stored connection scheme, the corresponding preliminary detour scheme will be lowered by a preset number of orders in the first scheme sorting table to form a fifth scheme sorting table, and the fifth scheme sorting table will be output.

[0184] For example, the preset number is 3% of the total number of solutions in the first solution ranking table.

[0185] In an optional embodiment, outputting a plurality of preliminary detour solutions may be based on a convolutional neural network output, or may be given an enumeration method output.

[0186] In an optional implementation, it is determined whether the maximum number of base blocks in a column in the first scheme sorting table exceeds a fourth preset threshold. If so, the first threshold is lowered and the sorted scheme sorting table is output.

[0187] The above ranking method for all preliminary bypass solutions provides novice engineers with reference-worthy optimal solution layout suggestions for the layout of semiconductor integrated gas path connection channels, and uses this to draw specific three-dimensional models.

[0188] The semiconductor integrated gas circuit analysis and processing system provided by the present invention is described below. The semiconductor integrated gas circuit analysis and processing system described below and the semiconductor integrated gas circuit analysis and processing method described above can be referenced to each other.

[0189] like Figure 8 As shown, an embodiment of the present invention further provides a semiconductor integrated gas circuit analysis and processing system, which is used to implement the semiconductor integrated gas circuit analysis and processing method in any of the above embodiments. The semiconductor integrated gas circuit analysis and processing system may include:

[0190] The acquisition module 810 is used to acquire a gas circuit schematic diagram; the gas circuit schematic diagram includes an original gas circuit connection scheme, gas circuit flow data, and gas circuit pressure data; the original gas circuit connection scheme at least includes a component sequence of multiple gas circuit components in each gas circuit;

[0191] A first determination module 820, for determining a base block size corresponding to the gas circuit component based on the gas circuit flow data and the gas circuit pressure data;

[0192] The second determination module 830 is used to compare the length to be compared with the preset inlet and outlet spacing. If the length to be compared is greater than the preset inlet and outlet spacing, the gas path corresponding to the length to be compared is determined as the gas path to be bypassed; the length to be compared is the sum of the gas path length of each gas path and the length of the first preset threshold; the preset inlet and outlet spacing is the horizontal axial distance between the inlet position and the outlet position of the gas path on the integrated gas path plate;

[0193] A configuration module 840 is used to configure the gas path to be bypassed based on the component sequence, the base block size and the preset inlet and outlet spacing, and generate multiple preliminary bypass solutions;

[0194] The sorting module 850 is used to sort the multiple preliminary detour solutions in order of priority from high to low to obtain a first solution sorting table.

[0195] Optionally, the configuration module 840 is specifically used for:

[0196] Based on the size of the blocks and the preset inlet and outlet spacing, determining the maximum number of blocks corresponding to the preset inlet and outlet spacing;

[0197] Calculate the number of first bypass blocks based on the gas path length and the maximum number of blocks;

[0198] Based on the maximum number of blocks, the gas path components that do not need to be bypassed in the gas path to be bypassed are arranged in the first transverse pipeline of the integrated gas path board in the order of components;

[0199] Calculating the first block margin of the second transverse pipeline; the second transverse pipeline is the pipeline closest to the first transverse pipeline;

[0200] Based on the first block vacancy, the first bypass blocks are arranged on the second transverse pipeline in the order of components;

[0201] Determine the size of the first bypass block number and the first block margin, if the first bypass block number is greater than the first block margin, then continue to calculate the second bypass block number;

[0202] Calculating the second block margin of the third transverse pipeline; the third transverse pipeline is the pipeline that is next adjacent to the first transverse pipeline;

[0203] Based on the second block vacancy, the second bypass blocks are arranged on the third transverse pipeline in the order of components;

[0204] Determine the size of the second bypass block number and the second block margin, if the second bypass block number is greater than the second block margin, continue to calculate the third bypass block number until the Mth bypass block number is less than or equal to the Mth block margin; M is a positive integer greater than or equal to 1;

[0205] Output multiple preliminary detour plans.

[0206] Optionally, the first sorting module is specifically used for:

[0207] Based on a first preset reference, a plurality of corresponding first sub-solutions are selected from a plurality of preliminary detour solutions; the first preset reference is that the diaphragm valve is outside all the transverse pipelines;

[0208] Based on a second preset reference, a plurality of corresponding second sub-solutions are selected from a plurality of preliminary detour solutions; the second preset reference is that the flow meter is on the inner side of all the lateral pipelines;

[0209] Based on a third preset benchmark, a plurality of corresponding third sub-schemes are selected from the plurality of preliminary detour schemes; the third preset benchmark is that the gas path has the least detours;

[0210] According to the priority order of the first preset reference, the second preset reference and the third preset reference, a first scheme ranking table is output.

[0211] Optionally, the semiconductor integrated gas path analysis and processing system may further include:

[0212] An adjustment scheme generation module is used to select a corresponding fourth sub-scheme from multiple first sub-schemes, multiple second sub-schemes and multiple third sub-schemes based on a fourth preset benchmark, and determine the fourth sub-scheme as a target adjustment scheme; wherein the fourth preset benchmark is the shortest sum of the vertical cross-pipeline lengths corresponding to all gas paths.

[0213] Optionally, the semiconductor integrated gas path analysis and processing system may further include:

[0214] A second sorting module is used to compare the proportion of the number of solutions that meet the second preset condition in the multiple preliminary detour solutions with the second preset threshold value. If it is greater than the second preset threshold value, the first preset threshold value is reduced by a preset percentage, and the gas path schematic diagram is reconfigured to obtain a second solution sorting table;

[0215] The second preset threshold is a ratio whose value is less than 1; and the second preset condition is that the number of pipe columns of the transverse pipes used in all gas paths in each preliminary bypass scheme is greater than the preset number of columns.

[0216] Optionally, the semiconductor integrated gas path analysis and processing system may further include:

[0217] The third sorting module is used to determine whether the obtained value is less than the third preset threshold after reducing the first preset threshold by a preset percentage. If it is less than the third preset threshold, the third preset threshold is determined as the new first preset threshold, and the gas path schematic is reconfigured to obtain a third scheme sorting table.

[0218] Optionally, the semiconductor integrated gas path analysis and processing system may further include:

[0219] a fourth sorting module, configured to determine whether the number of transverse pipe columns used by each preliminary detour solution is greater than the number of transverse pipe columns in the pre-stored connection solution; if the number of transverse pipe columns is less than the number of transverse pipe columns in the pre-stored connection solution, the corresponding preliminary detour solution is ranked up by a preset number of positions in the first solution sorting table to form a fourth solution sorting table, and output the fourth solution sorting table;

[0220] If it is greater than or equal to the number of transverse pipeline columns in the pre-stored connection scheme, the corresponding preliminary detour scheme will be lowered by a preset number of orders in the first scheme sorting table to form a fifth scheme sorting table, and the fifth scheme sorting table will be output.

[0221] In yet another aspect, the present invention further provides a computer storage medium, wherein instructions are stored in the computer storage medium, and when the instructions are executed, the semiconductor integrated gas circuit analysis and processing method in any of the above embodiments is implemented.

[0222] The embodiment of the present invention also provides a semiconductor integrated gas circuit analysis and processing device, which may include: a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory communicate with each other through the communication bus. The memory stores a computer program that can be run by the processor; when the processor runs the computer program, it can execute the semiconductor integrated gas circuit analysis and processing method in any of the above embodiments. In addition, the logic instructions in the above memory can be implemented in the form of software functional units and can be stored in a computer-readable storage medium when sold or used as an independent product. Based on such an understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art or the part of the technical solution can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods of each embodiment of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as a U disk, a mobile hard disk, a read-only memory, a random access memory, a magnetic disk or an optical disk.

[0223] Although the present invention is described herein in conjunction with various embodiments, in the process of implementing the claimed invention, those skilled in the art may understand and implement other variations of the disclosed embodiments by viewing the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other components or steps, and "one" or "an" does not exclude multiple situations. A single processor or other unit may implement several functions listed in the claims. Certain measures are recorded in different dependent claims, but this does not mean that these measures cannot be combined to produce good results.

[0224] Although the present invention has been described in conjunction with specific features and embodiments thereof, it is apparent that various modifications and combinations may be made thereto without departing from the spirit and scope of the present invention. Accordingly, this specification and the accompanying drawings are merely exemplary illustrations of the present invention as defined by the appended claims and are deemed to cover any and all modifications, variations, combinations or equivalents within the scope of the present invention. Obviously, those skilled in the art may make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, the present invention is intended to include such modifications and variations if they fall within the scope of the claims of the present invention and their equivalents.

Claims

1. A semiconductor integrated gas circuit analysis and processing method, characterized in that: include: Obtaining a gas circuit schematic diagram; the gas circuit schematic diagram includes an original gas circuit connection scheme, gas circuit flow data, and gas circuit pressure data; The original gas path connection scheme at least includes the component sequence of multiple gas path components in each gas path; Determining a base block size corresponding to the gas circuit component based on the gas circuit flow data and the gas circuit pressure data; Compare the length to be compared with the preset inlet and outlet spacing. If the length to be compared is greater than the preset inlet and outlet spacing, determine the gas path corresponding to the length to be compared as the gas path to be bypassed; the length to be compared is the sum of the gas path length of each gas path and the length of the first preset threshold; the preset inlet and outlet spacing is the horizontal axial distance between the inlet position and the outlet position of the gas path on the integrated gas path plate; Based on the component sequence, the base block size and the preset inlet and outlet spacing, the gas path to be bypassed is configured to generate a plurality of preliminary bypassing schemes; The multiple preliminary detour solutions are sorted in order of priority from high to low to obtain a first solution sorting table.

2. The semiconductor integrated gas circuit analysis and processing method according to claim 1, characterized in that: Before comparing the length to be compared with the preset entrance and exit spacing, the method further includes: Extracting a pre-stored connection scheme corresponding to the gas circuit schematic diagram from a database; Determine whether the gas circuit schematic diagram and the pre-stored connection scheme meet a first preset condition; the first preset condition is that the gas circuit component model in the pre-stored connection scheme completely corresponds to the gas circuit component model in the gas circuit schematic diagram; When the gas path schematic diagram and the pre-stored connection scheme do not satisfy the first preset condition, continue to compare the length to be compared with the preset inlet and outlet spacing; When the gas path schematic diagram and the pre-stored connection plan meet the first preset condition, the pre-stored connection plan is output.

3. The semiconductor integrated gas circuit analysis and processing method according to claim 1, characterized in that: The step of configuring the gas path to be bypassed based on the base block size and the preset inlet and outlet spacing to generate a plurality of preliminary bypassing schemes includes: Based on the block size and the preset inlet and outlet spacing, determining a maximum number of blocks corresponding to the preset inlet and outlet spacing; Calculating the first bypassing block number based on the gas path length and the maximum block number; Based on the maximum number of building blocks, the gas path components that do not need to be bypassed in the gas path to be bypassed are arranged in the first transverse pipeline of the integrated gas path board in the order of components; Calculating the first block margin of a second transverse pipeline; the second transverse pipeline is the pipeline that is most adjacent to the first transverse pipeline; Based on the first block margin, the first bypass blocks are arranged on the second transverse pipeline in the order of components; Determine the size of the first bypassing block number and the first block margin, and if the first bypassing block number is greater than the first block margin, continue to calculate the second bypassing block number; Calculating the second block margin of a third transverse pipeline; the third transverse pipeline is a pipeline that is next adjacent to the first transverse pipeline; Based on the free amount of the second blocks, the number of the second bypass blocks is arranged on the third transverse pipeline in the order of components; Determine the size of the second bypass block number and the second block margin, and if the second bypass block number is greater than the second block margin, continue to calculate the third bypass block number until the Mth bypass block number is less than or equal to the Mth block margin; M is a positive integer greater than or equal to 1; The plurality of preliminary detour solutions are outputted.

4. The semiconductor integrated gas circuit analysis and processing method according to claim 1, characterized in that: The multiple preliminary detour solutions are sorted in order of priority from high to low to obtain a first solution sorting table, including: Based on a first preset reference, a plurality of corresponding first sub-solutions are selected from the plurality of preliminary detour solutions; the first preset reference is that the diaphragm valve is outside all the transverse pipelines; Based on a second preset reference, a plurality of corresponding second sub-solutions are selected from the plurality of preliminary detour solutions; the second preset reference is that the flow meter is on the inner side of all the lateral pipelines; Based on a third preset benchmark, a plurality of corresponding third sub-schemes are selected from the plurality of preliminary detour schemes; the third preset benchmark is that the gas path has the least detours; The first scheme ranking table is output according to the priority order of the first preset reference, the second preset reference and the third preset reference.

5. The semiconductor integrated gas circuit analysis and processing method according to claim 4, characterized in that: Also includes: Based on a fourth preset benchmark, selecting a corresponding fourth sub-scheme from the plurality of first sub-schemes, the plurality of second sub-schemes, and the plurality of third sub-schemes; The fourth preset reference is that the sum of the vertical cross-pipe lengths corresponding to all gas paths is the shortest; The fourth sub-scheme is determined as the target adjustment scheme.

6. The semiconductor integrated gas circuit analysis and processing method according to claim 1, characterized in that: Also includes: Comparing the ratio of the number of solutions that meet the second preset condition in the multiple preliminary detour solutions with a second preset threshold, if it is greater than the second preset threshold, reducing the first preset threshold by a preset percentage, reconfiguring the gas path schematic diagram, and obtaining a second solution ranking table; The second preset threshold is a ratio whose value is less than 1; and the second preset condition is that the number of pipe columns of the transverse pipes used in all gas paths in each preliminary bypass scheme is greater than the preset number of columns.

7. The semiconductor integrated gas circuit analysis and processing method according to claim 6, characterized in that: Also includes: After lowering the first preset threshold by a preset percentage, determine whether the obtained value is less than the third preset threshold. If it is less than the third preset threshold, determine the third preset threshold as the new first preset threshold, reconfigure the gas path schematic diagram, and obtain a third scheme ranking table.

8. The semiconductor integrated gas circuit analysis and processing method according to claim 2, characterized in that: Also includes: Determine whether the number of transverse pipe columns used by each preliminary detour solution is greater than the number of transverse pipe columns in the pre-stored connection solution; if it is less than the number of transverse pipe columns in the pre-stored connection solution, the corresponding preliminary detour solution is ranked up by a preset number of times in the first solution ranking table to form a fourth solution ranking table, and output the fourth solution ranking table; If it is greater than or equal to the number of transverse pipeline columns in the pre-stored connection scheme, the corresponding preliminary detour scheme is lowered by a preset number of orders in the first scheme sorting table to form a fifth scheme sorting table, and the fifth scheme sorting table is output.

9. A semiconductor integrated gas path analysis and processing system, characterized in that: include: An acquisition module is used to acquire a gas circuit schematic diagram; the gas circuit schematic diagram includes an original gas circuit connection scheme, gas circuit flow data, and gas circuit pressure data; The original gas path connection scheme at least includes the component sequence of multiple gas path components in each gas path; A first determination module, configured to determine a base block size corresponding to the gas circuit component based on the gas circuit flow data and the gas circuit pressure data; The second determination module is used to compare the length to be compared with the preset inlet and outlet spacing. If the length to be compared is greater than the preset inlet and outlet spacing, the gas path corresponding to the length to be compared is determined as the gas path to be bypassed; the length to be compared is the sum of the gas path length of each gas path and the length of the first preset threshold; the preset inlet and outlet spacing is the horizontal axial distance between the inlet position and the outlet position of the gas path on the integrated gas path plate; A configuration module, configured to configure the gas path to be bypassed based on the component sequence, the base block size and the preset inlet and outlet spacing, and generate a plurality of preliminary bypass schemes; The sorting module is used to sort the multiple preliminary detour solutions in order of priority from high to low to obtain a first solution sorting table.

10. A computer storage medium, characterized in that: The computer storage medium stores instructions, and when the instructions are executed, the semiconductor integrated gas circuit analysis and processing method according to any one of claims 1 to 8 is implemented.

Images