Plastic package mold, power module and integrated power module

Abstract

The invention discloses a plastic package mold, a power module and an integrated power module, the plastic package mold is used for rapid packaging of a semi-finished power module, the plastic package mold comprises a mold body, the mold body comprises an upper mold and a lower mold, the upper mold covers the lower mold, and the lower mold covers the lower mold; a cavity defined by a top surface, a bottom surface and side surfaces is formed between the upper mold and the lower mold, the semi-finished product power module is quickly packaged in the cavity, the upper mold is provided with a glue injection port in a first direction, the glue injection port is used for directly injecting liquid transparent epoxy resin and does not need pressurizing equipment and heating equipment, and the glue injection port is correspondingly communicated with the top surface of the cavity; wherein the first direction is a direction perpendicular to the top surface or a direction perpendicular to the bottom surface. The glue injection port is formed in the upper mold, and specific packaging resin is used for glue injection on the surface of the semi-finished power module at normal temperature and normal pressure, so that the plastic package forming efficiency of the semi-finished power module is improved, and the requirement for the material of the mold is not high.

Description

Technical Field

[0001] The present invention relates to the technical field of power module packaging, and in particular to a plastic packaging mold, a power module and an integrated power module. Background Art

[0002] The power module is a half-bridge, H-bridge or three-phase full-bridge module packaged with power electronic devices such as Schottky diodes, fast recovery rectifier diodes, rectifier diodes, etc. according to a certain functional combination. It is mainly used for current conversion in various occasions such as power supply, wind power generation, industrial frequency conversion, etc.

[0003] Among them, the power module packaging process mostly uses molds to achieve chip packaging in a molding manner. The mold used includes an upper mold plate and a lower mold plate. The upper and lower mold plates are provided with corresponding inner cavities, and the injection molding material flows into the inner cavity through the injection molding runner.

[0004] However, in the power module packaging process, special plastic packaging equipment is usually required. Through high temperature, high pressure and other conditions, the packaging resin is made to flow from the side of the package to the inside, and finally a plastic packaging body with the function of protecting the internal structure of the power module is formed. The entire plastic packaging process involves heating, pressurizing, glue injection, mold cleaning and other steps. The operation time is relatively long, and it is impossible to quickly form a finished power device. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a plastic encapsulation mold, in which liquid transparent epoxy resin can directly flow into the mold cavity and solidify, thereby eliminating the need for pressurizing equipment and heating equipment, thereby achieving rapid plastic encapsulation of semi-finished power modules, shortening the production time of power modules, and improving molding efficiency.

[0006] The present invention further provides a power module.

[0007] The invention also provides an integrated power module.

[0008] According to the plastic encapsulation mold of the first aspect of the present invention, the plastic encapsulation mold is used for the rapid encapsulation of semi-finished power modules, and the plastic encapsulation mold comprises: a mold body, and the mold body comprises: an upper mold and a lower mold, the upper mold cover is arranged on the lower mold, and a cavity formed by a top surface, a bottom surface and side surfaces is formed between the upper mold and the lower mold, and the semi-finished power module is rapidly encapsulated in the cavity, and the upper mold is provided with a glue injection port in the first direction for direct injection of liquid transparent epoxy resin without the need for pressurizing equipment and heating equipment, and the glue injection port is correspondingly connected to the top surface of the cavity; wherein the first direction is a direction perpendicular to the top surface, or a direction perpendicular to the bottom surface.

[0009] According to the plastic encapsulation mold of the embodiment of the present invention, liquid transparent epoxy resin can directly flow into the mold cavity and solidify, thereby eliminating the need for pressurizing equipment and heating equipment, thereby enabling rapid plastic encapsulation of semi-finished power modules, shortening the production time of power modules, and improving molding efficiency.

[0010] According to some embodiments of the present invention, the plastic encapsulation mold further includes: a positioning bracket group, the positioning bracket group includes: a first positioning bracket and a second positioning bracket, the first positioning bracket is arranged on the upper mold, the second positioning bracket is arranged on the lower mold, the frame of the semi-finished power module is clamped between the first positioning bracket and the second positioning bracket, and the first positioning bracket and the second positioning bracket are positioned and matched with the frame of the semi-finished power module.

[0011] According to some embodiments of the present invention, the first positioning bracket is provided with one of a positioning column and a positioning hole, the second positioning bracket is provided with the other of a positioning column and a positioning hole, and the frame of the semi-finished power module is provided with a through hole corresponding to the positioning hole, and the positioning column is positioned and matched with the positioning hole after passing through the through hole.

[0012] According to some embodiments of the present invention, a thinning groove is provided at the end of the second positioning bracket facing the lower mold, and the dimension of the thinning groove in the thickness direction of the plastic packaging mold is h1, and h1 satisfies the relationship: 1.4mm≤h1≤1.8mm.

[0013] According to some embodiments of the present invention, an opening is provided on the bottom surface of the lower mold and passes through the lower mold in the first direction, a substrate is provided on the side of the semi-finished power module facing the opening, the projection of the substrate in the first direction of the lower mold covers the opening, and the thinning groove is provided on the side of the second positioning bracket close to the first positioning bracket.

[0014] According to some embodiments of the present invention, the first positioning bracket and the second positioning bracket are provided with a first clamping portion on one side facing the mold body, and the upper mold and the lower mold are both provided with a second clamping portion, and the first clamping portion and the second clamping portion are clamped together to enable the positioning bracket group to be selectively provided on the mold body.

[0015] According to some embodiments of the present invention, there are at least two plastic encapsulation molds, and the positioning bracket groups of at least two of the plastic encapsulation molds are connected to each other; wherein, the thickness of the semi-finished power module is in a first direction, and the arrangement direction of at least two of the plastic encapsulation molds is in a second direction, and the second direction is perpendicular to the first direction.

[0016] According to some embodiments of the present invention, there are at least two positioning bracket groups on each of the plastic encapsulation molds, at least two of the first positioning brackets are respectively arranged on both sides of the upper mold in the third direction and at the middle position of the upper mold in the second direction, and at least two of the second positioning brackets are respectively arranged on both sides of the lower mold in the third direction and at the middle position of the lower mold in the second direction; wherein the first direction, the second direction and the third direction are perpendicular to each other.

[0017] According to some embodiments of the present invention, at least one of the positioning bracket groups and the frame are positioned and matched on one side of the third direction, and at least another of the positioning bracket groups and the frame are positioned and matched on one side of the second direction.

[0018] According to some embodiments of the present invention, the first positioning bracket and the second positioning bracket of at least another positioning bracket group both include: an extension portion and a positioning portion, the extension portion is connected to the mold body and extends in a third direction, the positioning portion is connected to the extension portion and extends in a second direction, and the positioning portion is used to position and cooperate with the frame.

[0019] According to some embodiments of the present invention, the upper mold and the lower mold are both acrylic molds.

[0020] According to some embodiments of the present invention, the glue injection port passes through the top surface of the upper mold in the first direction and is arranged at the center position of the top surface of the upper mold. The glue injection port is circular and has a diameter of Φ, and Φ satisfies the relationship: 6mm≤Φ≤10mm.

[0021] According to the power module of the embodiment of the second aspect of the present invention, the power module is injection molded by the plastic encapsulation mold, and the power module is plastic encapsulated by liquid transparent modified epoxy resin.

[0022] The integrated power module according to the third aspect of the present invention comprises: the mold body and a power module, wherein the power module is injection molded by the plastic encapsulation mold, and the power module is plastic encapsulated by liquid transparent modified epoxy resin.

[0023] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0025] Figure 1 is a structural schematic diagram of an upper mold according to an embodiment of the present invention;

[0026] Figure 2 is a cross-sectional view of an upper mold according to an embodiment of the present invention;

[0027] Figure 3 is a schematic structural diagram of at least two upper molds connected to each other according to an embodiment of the present invention;

[0028] Figure 4 is a schematic structural diagram of a lower mold according to an embodiment of the present invention;

[0029] Figure 5 is a cross-sectional view of a lower mold according to an embodiment of the present invention;

[0030] Figure 6 It is a schematic structural diagram of at least two lower molds connected to each other according to an embodiment of the present invention.

[0031] Reference numerals:

[0032] 11. Upper mold; 12. Lower mold; 13. Glue injection port; 14. Opening hole;

[0033] 21. First positioning bracket; 22. Second positioning bracket; 23. Thinning groove; 24. Extension portion; 25. Positioning portion. DETAILED DESCRIPTION

[0034] Embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. Embodiments of the present invention are described in detail below.

[0035] Reference below Figure 1-Figure 6 The present invention describes a plastic encapsulation mold according to an embodiment of the present invention. The present invention also provides a power module. Furthermore, the present invention also provides an integrated power module.

[0036] In the related art, the power module packaging process generally uses special packaging equipment to perform packaging of semi-finished products, mainly filling the packaging resin in the mold and curing the packaging resin. After disassembling the mold, a power module manufactured by transfer molding is obtained. The use of packaging equipment to plasticize the semi-finished products involves the replacement of the mold and the influence of factors such as the molding time and temperature. The molding time is relatively long, so it is impossible to quickly plasticize the semi-finished products.

[0037] According to the plastic encapsulation mold of the embodiment of the present invention, the plastic encapsulation mold is used for the rapid encapsulation of the semi-finished power module, and the plastic encapsulation mold comprises: a mold body, and the mold body comprises: an upper mold 11 and a lower mold 12, the upper mold 11 is covered on the lower mold 12, and a cavity having a top surface, a bottom surface and side surfaces is formed between the upper mold 11 and the lower mold 12, and the semi-finished power module is rapidly encapsulated in the cavity, and the upper mold 11 is provided with a glue injection port 13 in the first direction for directly injecting liquid transparent epoxy resin without the need for pressurizing equipment and heating equipment, and the glue injection port 13 is correspondingly connected to the top surface of the cavity. That is, a cavity having a top surface, a bottom surface and side surfaces is formed between the upper mold 11 and the lower mold 12, and a glue injection port 13 is provided in the upper mold 11 for direct injection of liquid transparent epoxy resin without the need for pressurizing equipment and heating equipment. In this way, the liquid transparent epoxy resin can directly flow into the cavity and solidify, thereby eliminating the need for pressurizing equipment and heating equipment, thereby achieving rapid plastic sealing of semi-finished power modules, shortening the production time of power modules, and improving molding efficiency.

[0038] The first direction is a direction perpendicular to the top surface, or a direction perpendicular to the bottom surface, and the top surface and the bottom surface are two parallel surfaces. That is, the first direction is the thickness direction of the mold body.

[0039] As a result, liquid transparent epoxy resin can directly flow into the mold cavity and solidify, eliminating the need for pressurizing equipment and heating equipment, thereby enabling rapid plastic sealing of semi-finished power modules, shortening the production time of power modules, and improving molding efficiency.

[0040] In addition, the plastic encapsulation mold also includes: a positioning bracket group, the positioning bracket group includes: a first positioning bracket 21 and a second positioning bracket 22, the first positioning bracket 21 is arranged on the upper mold 11, and the second positioning bracket 22 is arranged on the lower mold 12, and the frame of the semi-finished power module is clamped between the first positioning bracket 21 and the second positioning bracket 22, and the first positioning bracket 21 and the second positioning bracket 22 are positioned and matched with the frame of the semi-finished power module.

[0041] That is, a first positioning bracket 21 is arranged on the upper mold 11, and a second positioning bracket 22 is arranged on the lower mold 12. A gap is formed between the first positioning bracket 21 and the second positioning bracket 22, and the frame of the semi-finished power module is arranged in the gap. In this way, the frame of the semi-finished power module can be clamped between the first positioning bracket 21 and the second positioning bracket 22, so as to position the frame of the semi-finished power module.

[0042] Furthermore, the first positioning bracket 21 and the second positioning bracket 22 can be positioned and matched with each other. At the same time, the first positioning bracket 21 and the second positioning bracket 22 are positioned and matched with the frame of the semi-finished power module, thereby achieving positioning and matching between the frame of the semi-finished power module and the plastic packaging mold.

[0043] And, combined with Figure 2 and Figure 5 As shown, the first positioning bracket 21 is provided with one of the positioning posts and the positioning holes, the second positioning bracket 22 is provided with the other of the positioning posts and the positioning holes, and the frame of the semi-finished power module is provided with through holes corresponding to the positioning holes, and the positioning posts are positioned and matched with the positioning holes after passing through the through holes. In other words, the first positioning bracket 21 and the second positioning bracket 22 are respectively provided with positioning posts and positioning holes, so that when the positioning posts and the positioning holes are positioned and matched, they are positioned and matched with the frame of the semi-finished power module, thereby realizing the positioning and matching between the frame of the semi-finished power module and the plastic packaging mold.

[0044] For example, a positioning hole is provided on the first positioning bracket 21, a positioning column is provided on the second positioning bracket 22, and a through hole is provided on the frame of the semi-finished power module, so that the positioning column can pass through the through hole and be positioned and matched with the positioning hole, thereby realizing the positioning and matching between the frame of the semi-finished power module and the plastic packaging mold.

[0045] In addition, a thinning groove 23 is provided at the end of the second positioning bracket 22 facing the lower mold 12. In this way, a thinning groove 23 is provided between the second positioning bracket 22 and the lower mold 12, thereby reducing the connection strength between the second positioning bracket 22 and the lower mold 12, thereby facilitating the separation of the second positioning bracket 22 and the lower mold 12 after the semi-finished power module is packaged and formed.

[0046] Of course, the first positioning bracket 21 may also be provided with a thinning groove 23 according to the actual situation.

[0047] The dimension of the thinning groove 23 in the thickness direction of the plastic encapsulation mold is h1, and h1 satisfies the relationship: 1.4mm≤h1≤1.8mm. That is, the depth of the thinning groove 23 is between 1.4mm-1.8mm, which facilitates the separation between the second positioning bracket 22 and the lower mold 12 and avoids affecting the positioning and matching between the frame of the semi-finished power module and the plastic encapsulation mold.

[0048] Reference Figure 3As shown, an opening 14 penetrating the lower mold 12 in a first direction is provided on the bottom surface of the lower mold 12, and a substrate is provided on the side of the semi-finished power module facing the opening 14, and the projection of the substrate in the first direction of the lower mold 12 covers the opening 14. That is, the substrate is placed at the opening 14, so that the side of the substrate facing the lower mold 12 leaks out relative to the lower mold 12, so that there is no large-area contact between the substrate and the lower mold 12, and the capillary force of the liquid transparent modified epoxy resin between the substrate and the lower mold 12 during the packaging process is reduced, thereby preventing the liquid transparent modified epoxy resin from overflowing from the gap between the substrate and the lower mold 12 during the packaging process, which can improve the packaging quality of the power module and facilitate direct contact between the substrate and the heat sink of the power module.

[0049] Among them, when the substrate and the lower mold 12 are in contact with each other over a large area, due to the influence of the processing technology, a small gap will be formed between the substrate and the lower mold 12. When the liquid transparent modified epoxy resin is injected into the cavity, the liquid transparent modified epoxy resin will be filled in the gap due to the capillary action generated at the gap. In this way, after the power module is packaged, the outer surface of the substrate will be covered with packaging material, which will reduce the packaging quality of the power module on the one hand, and prevent the substrate and the heat sink of the power module from directly contacting each other on the other hand, thereby affecting the heat dissipation effect of the power module.

[0050] Furthermore, since the projection of the substrate on the lower mold 12 covers the opening 14, the substrate will not be embedded in the opening 14, thereby preventing the liquid transparent epoxy resin from leaking out of the mold body along the inner wall of the opening 14 due to the contact between the substrate and the inner wall of the opening 14 under the capillary action.

[0051] The thinning groove 23 is arranged on the side of the second positioning bracket 22 close to the first positioning bracket 21. On the one hand, the thinning groove 23 faces the side of the lower mold 12 away from the hole 14, which can reduce the influence of the thinning groove 23 on the structure of the lower mold 12. On the other hand, since the thinning groove 23 is arranged on the second positioning bracket 22, a gap can be formed between the first positioning bracket 21 and the second positioning bracket 22. In this way, when the first positioning bracket 21 and the second positioning bracket 22 are removed, the cutting device does not need to cut from the first positioning bracket 21 to the second positioning bracket 22 during cutting, but first cuts one of the first positioning bracket 21 and the second positioning bracket 22, reduces the load of the cutting device through the gap, and finally cuts the other of the first positioning bracket 21 and the second positioning bracket 22.

[0052] Furthermore, the first positioning bracket 21 and the second positioning bracket 22 are provided with a first clamping portion on one side facing the mold body, and the upper mold 11 and the lower mold 12 are provided with a second clamping portion, and the first clamping portion and the second clamping portion are clamped together, so that the positioning bracket group is selectively arranged on the mold body. That is to say, the first positioning bracket 21 and the second positioning bracket 22 are provided with a first clamping portion, and the upper mold 11 and the lower mold 12 are correspondingly provided with a second clamping portion, so that the first positioning bracket 21 and the upper mold 11 are clamped together through the first clamping portion and the second clamping portion, and the second positioning bracket 22 and the lower mold 12 are clamped together through the first clamping portion and the second clamping portion, so that during packaging, the first positioning bracket 21 and the second positioning bracket 22 are clamped together on the mold body, and after packaging, the first positioning bracket 21 and the second positioning bracket 22 can be removed from the mold body, so that the first positioning bracket 21 and the second positioning bracket 22 can be reused, thereby reducing the packaging cost of the semi-finished power module.

[0053] There are at least two plastic encapsulation molds, and the positioning bracket groups of at least two plastic encapsulation molds are connected to each other. The thickness of the semi-finished power module is in the first direction, and the arrangement direction of the at least two plastic encapsulation molds is in the second direction, and the second direction is perpendicular to the first direction. In other words, there can be at least two plastic encapsulation molds, and at least two plastic encapsulation molds are connected by the positioning bracket group, which can facilitate the packaging of the semi-finished power module, that is, when the semi-finished power module is packaged, multiple plastic encapsulation molds can be packaged and injection molded together.

[0054] Wherein, at least two plastic encapsulation molds are arranged in a row, that is, the arrangement direction of the at least two plastic encapsulation molds is the second direction.

[0055] There are at least two positioning bracket groups on each plastic encapsulation mold, at least two first positioning brackets 21 are respectively arranged on both sides of the upper mold 11 in the third direction and are arranged at the middle position of the upper mold 11 in the second direction, at least two second positioning brackets 22 are respectively arranged on both sides of the lower mold 12 in the third direction and are arranged at the middle position of the lower mold 12 in the second direction, and the first direction, the second direction and the third direction are perpendicular. In other words, at least two positioning bracket groups are arranged on each plastic encapsulation mold, that is, at least two first positioning brackets 21 can be arranged on the upper mold 11, and at least two second positioning brackets 22 can be arranged on the lower mold 12, which can effectively improve the positioning effect between the plastic encapsulation mold and the semi-finished power module.

[0056] In addition, at least two first positioning brackets 21 are respectively arranged on both sides of the upper mold 11 in the third direction, and at least two second positioning brackets 22 are respectively arranged on both sides of the lower mold 12 in the third direction, which will not affect the connection between the at least two plastic encapsulation molds.

[0057] Furthermore, at least two first positioning brackets 21 are arranged at the middle position of the upper mold 11 in the second direction, and at least two second positioning brackets 22 are arranged at the middle position of the lower mold 12 in the second direction. In this way, the first positioning brackets 21 and the second positioning brackets 22 are both arranged at the middle position, which can improve the positioning effect between the plastic encapsulation mold and the semi-finished power module.

[0058] Reference Figure 3 and Figure 6 As shown, at least one positioning bracket group and the frame are positioned and matched on one side of the third direction, and at least another positioning bracket group and the frame are positioned and matched on one side of the second direction. That is to say, at least two positioning bracket groups are fixed on different directions of the frame, specifically, at least one positioning bracket group and the frame are positioned and matched on one side of the third direction, and at least another positioning bracket group and the frame are positioned and matched on one side of the second direction, so that the frame can be positioned in both the second direction and the third direction, thereby effectively improving the positioning effect of the frame, avoiding displacement between the frame and the plastic encapsulation mold during injection molding, and causing the semi-finished power module to fail to be packaged.

[0059] And, combined with Figure 3 and Figure 6 As shown, the first positioning bracket 21 and the second positioning bracket 22 of at least another positioning bracket group each include: an extension portion 24 and a positioning portion 25, the extension portion 24 is connected to the mold body and extends in the third direction, the positioning portion 25 is connected to the extension portion 24 and extends in the second direction, and the positioning portion 25 is used to position and cooperate with the frame. In this way, by making at least another positioning bracket group composed of the extension portion 24 and the positioning portion 25, at least another positioning bracket group can extend to one side of the frame in the second direction, thereby making at least another positioning bracket group and the frame position and cooperate on one side of the second direction.

[0060] Furthermore, a connecting portion is provided between two adjacent encapsulation molds, one end of the connecting portion is connected to the positioning portion 25 of one of the encapsulation molds, and the other end of the connecting portion is connected to the connection between the extending portion 24 and the positioning portion 25 of the other encapsulation mold.

[0061] The upper mold 11 and the lower mold 12 can both be acrylic molds, that is, the staff can directly see the packaging of the semi-finished power module through the upper mold 11 and the lower mold 12, so as to adjust the packaging speed and the amount of liquid transparent epoxy resin according to the packaging situation.

[0062] Of course, the upper mold 11 and the lower mold 12 can also be transparent molds made of other materials.

[0063] The injection port 13 penetrates the top surface of the upper mold 12 in the first direction, that is, the injection port 13 is connected to the cavity, so that the liquid transparent modified epoxy resin can be directly injected into the cavity through the injection port 13 on the top surface of the upper mold 12 .

[0064] Furthermore, due to the high temperature and high pressure injection molding method in the prior art, in order to make the flow rate of the plastic packaging material uniform during the packaging process, the injection port can only be set on the side of the mold body, and a stopper is required to realize the clamping of the mold body.

[0065] Furthermore, the glue injection port 13 is arranged at the center of the top surface of the upper mold 12. The glue injection port 13 is arranged at the center of the upper mold 11, so that after the liquid transparent epoxy resin is injected into the cavity, the liquid transparent epoxy resin can be more evenly distributed in the cavity, thereby improving the packaging quality of the semi-finished power module. Specifically, the glue injection port 13 is arranged at the center of the top surface of the upper mold 12 in the second direction and the third direction.

[0066] The glue injection port 13 may be circular. That is, the glue injection port 13 may be arranged in a circular shape to facilitate the injection of liquid transparent epoxy resin.

[0067] And, the diameter of the injection port 13 is Φ, and Φ satisfies the relationship: 6mm≤Φ≤10mm. Since the injection mold of the embodiment of the present invention can realize the encapsulation of the power module at normal temperature and pressure, the size of the injection port 13 is larger than the size of the injection port of the injection mold under high pressure and high pressure, so that the injection speed of the liquid transparent modified epoxy resin can be faster without affecting the encapsulation quality of the power module.

[0068] According to the power module of the second embodiment of the present invention, the power module is injection molded by a plastic encapsulation mold, and the power module is plastic encapsulated by a liquid transparent modified epoxy resin. In this way, the liquid transparent modified epoxy resin is directly injected from the injection port 13 of the upper mold 11, and the liquid transparent modified epoxy resin can directly fill the cavity. In the process of such filling, it is not necessary to heat and pressurize the liquid transparent modified epoxy resin, nor is it necessary to control parameters such as the injection time. The operation time is short, that is, the rapid plastic encapsulation of the semi-finished power module can be achieved, the production time of the power module can be shortened, and the molding efficiency can be improved.

[0069] In addition, the power module is encapsulated by liquid transparent modified epoxy resin, which makes it convenient for testers to directly see the internal structure of the power module, thereby improving the test effect of the power module.

[0070] According to the third aspect of the present invention, the integrated power module includes: a mold body and a power module, the power module is injection molded by a plastic encapsulation mold, and the power module is encapsulated by a liquid transparent modified epoxy resin. That is to say, after the semi-finished power module is encapsulated, it is not necessary to disassemble the mold, but to form the mold body and the power module as a whole for subsequent testing, thereby effectively improving the testing efficiency of the power module.

[0071] In addition, the power module is encapsulated by liquid transparent modified epoxy resin, which makes it convenient for testers to directly see the internal structure of the power module, thereby improving the test effect of the power module.

[0072] In addition, since both the upper mold 11 and the lower mold 12 can be acrylic molds, the insulation between the mold body and the power module can be ensured, thereby preventing electrical interference between the mold body and the power module.

[0073] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0074] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0075] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A plastic encapsulation mold, characterized in that: The plastic encapsulation mold is used for rapid encapsulation of a semi-finished power module, and the plastic encapsulation mold comprises: a mold body, and the mold body comprises: an upper mold and a lower mold, wherein the upper mold cover is arranged on the lower mold, and a cavity formed by a top surface, a bottom surface and a side surface is formed between the upper mold and the lower mold, and the semi-finished power module is rapidly encapsulated in the cavity, and the upper mold is provided with a glue injection port for direct injection of liquid transparent epoxy resin without the need for a pressurizing device and a heating device in a first direction, and the glue injection port is correspondingly connected to the top surface of the cavity; wherein, The first direction is a direction perpendicular to the top surface, or a direction perpendicular to the bottom surface.

2. The plastic encapsulation mold according to claim 1, characterized in that: The plastic encapsulation mold also includes: a positioning bracket group, the positioning bracket group includes: a first positioning bracket and a second positioning bracket, the first positioning bracket is arranged on the upper mold, the second positioning bracket is arranged on the lower mold, the frame of the semi-finished power module is clamped between the first positioning bracket and the second positioning bracket, and the first positioning bracket and the second positioning bracket are positioned and matched with the frame of the semi-finished power module.

3. The plastic encapsulation mold according to claim 2, characterized in that: The first positioning bracket is provided with one of a positioning column and a positioning hole, the second positioning bracket is provided with the other of a positioning column and a positioning hole, and the frame of the semi-finished power module is provided with a through hole corresponding to the positioning hole, and the positioning column is positioned and matched with the positioning hole after passing through the through hole.

4. The plastic encapsulation mold according to claim 2, characterized in that: The second positioning bracket is provided with a thinning groove at the end portion facing the lower mold, and the dimension of the thinning groove in the thickness direction of the plastic packaging mold is h1, and h1 satisfies the relationship: 1.4mm≤h1≤1.8mm.

5. The plastic encapsulation mold according to claim 4, characterized in that: An opening is provided on the bottom surface of the lower mold and passes through the lower mold in the first direction. A substrate is provided on the side of the semi-finished power module facing the opening, and the projection of the substrate in the first direction of the lower mold covers the opening. The thinning groove is provided on the side of the second positioning bracket close to the first positioning bracket.

6. The plastic encapsulation mold according to claim 2, characterized in that: The first positioning bracket and the second positioning bracket are provided with a first clamping portion on one side facing the mold body, and the upper mold and the lower mold are both provided with a second clamping portion. The first clamping portion and the second clamping portion are clamped together to enable the positioning bracket group to be selectively arranged on the mold body.

7. The plastic encapsulation mold according to claim 2, characterized in that: There are at least two plastic encapsulation molds, and the positioning bracket groups of at least two plastic encapsulation molds are connected to each other; wherein, The thickness of the semi-finished power module is in a first direction, and the arrangement direction of at least two of the plastic encapsulation molds is in a second direction, and the second direction is perpendicular to the first direction.

8. The plastic encapsulation mold according to claim 7, characterized in that: There are at least two positioning brackets on each plastic encapsulation mold, at least two of the first positioning brackets are respectively arranged on both sides of the upper mold in the third direction and at the middle position of the upper mold in the second direction, and at least two of the second positioning brackets are respectively arranged on both sides of the lower mold in the third direction and at the middle position of the lower mold in the second direction; wherein, The first direction, the second direction and the third direction are perpendicular to each other.

9. The plastic encapsulation mold according to claim 8, characterized in that: At least one of the positioning bracket groups and the frame are positioned and matched on one side of the third direction, and at least another of the positioning bracket groups and the frame are positioned and matched on one side of the second direction.

10. The plastic encapsulation mold according to claim 9, characterized in that: The first positioning bracket and the second positioning bracket of at least another positioning bracket group both include: an extension portion and a positioning portion, the extension portion is connected to the mold body and extends in the third direction, the positioning portion is connected to the extension portion and extends in the second direction, and the positioning portion is used to position and cooperate with the frame.

11. The plastic encapsulation mold according to claim 1, characterized in that: The upper mold and the lower mold are both acrylic molds.

12. The plastic encapsulation mold according to claim 1, characterized in that: The glue injection port passes through the top surface of the upper mold in the first direction and is arranged at the center of the top surface of the upper mold. The glue injection port is circular and has a diameter of Φ, and Φ satisfies the relationship: 6mm≤Φ≤10mm.

13. A power module, characterized in that: The power module is injection molded by the plastic encapsulation mold according to any one of claims 1 to 12, and the power module is plastic encapsulated by liquid transparent modified epoxy resin.

14. An integrated power module, characterized in that: include: The mold body according to any one of claims 1 to 12; A power module, wherein the power module is injection molded by the plastic encapsulation mold according to any one of claims 1 to 12, and the power module is plastic encapsulated by liquid transparent modified epoxy resin.

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