Circuit board special-shaped hole copper plating device with uniform thickness

Abstract

The invention discloses a uniform-thickness circuit board special-shaped hole copper plating device, and relates to the technical field of circuit board special-shaped hole copper plating, the uniform-thickness circuit board special-shaped hole copper plating device comprises a copper plating frame and a circuit board frame, the bottom of the copper plating frame is provided with a shaft body, and the bottom of the shaft body is provided with a servo motor; a transmission assembly used for assisting uniform copper plating is arranged outside one side of the bottom of the copper plating frame and comprises a built-in column, a transmission gear and teeth, the transmission gear is arranged at the end of the built-in column, and the teeth are arranged on the outer surface of the bottom of the transmission gear in a meshed mode. According to the circuit board special-shaped hole copper plating device with the uniform thickness, through the design of a limiting assembly, multiple sets of circuit boards with different thicknesses can be fixed conveniently, through the design of an auxiliary assembly, it can be ensured that heat cannot be dissipated outwards when the drying frame dries the circuit boards subjected to copper plating, meanwhile, redundant copper plating liquid can fall down to the surface of a cover plate, and the copper plating efficiency is improved. And the liquid drops into the copper plating frame through the leakage holes, so that the copper plating liquid can be conveniently collected and used.

Description

Technical Field

[0001] The invention relates to the technical field of chemical copper plating of special-shaped holes in circuit boards, in particular to a device for chemical copper plating of special-shaped holes in circuit boards with uniform thickness. Background Art

[0002] In the PCB (circuit board) manufacturing process, copper plating of special-shaped holes (non-standard shaped holes) is an important step, which is related to the conductivity and mechanical strength of the circuit board. Special-shaped hole copper plating equipment is specially designed to process these non-standard holes to ensure that they can be evenly plated with copper.

[0003] For example, the invention with application number CN202020752024.3 relates to printed circuit board production technology, and discloses a circuit board copper plating device, including a main box, a transmission mechanism located on the top of the main box, and a circuit board rack connected to the transmission mechanism. The circuit board copper plating device in this invention can effectively improve the uniformity of circuit board copper plating, improve the production efficiency of circuit boards, and has a wide range of applications. However, the thickness of the circuit board's special-shaped holes is not uniform during copper plating, and it is difficult for the copper plating liquid to fully contact the circuit boards stacked together.

[0004] Therefore, in view of this, the existing structure and defects are studied and improved, and a circuit board special-shaped hole electroless copper plating device with uniform thickness is provided. Summary of the invention

[0005] The object of the present invention is to provide a circuit board special-shaped hole chemical copper plating device with uniform thickness to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a device for copper plating of special-shaped holes in a circuit board with uniform thickness, comprising a copper plating frame and a circuit board frame, a shaft body is provided at the bottom of the copper plating frame, and a servo motor is installed at the bottom of the shaft body, a transmission component for assisting uniform copper plating is provided on the outside of one side of the bottom of the copper plating frame, and the transmission component comprises a built-in column, a transmission gear and teeth, a transmission gear is provided at the end of the built-in column, and teeth are meshed on the outer surface of the bottom of the transmission gear, a connecting component for position conversion is installed in the middle of one side of the transmission gear, and the connecting component comprises a connecting shaft, a fixed plate and a connecting plate, a fixed plate is installed on the outer surface of the connecting shaft, a connecting plate is provided at the end of the fixed plate, and the circuit board frame is provided at the end of the connecting plate.

[0007] Furthermore, a limiting component for limiting the position of the circuit board is installed inside the circuit board frame, and the limiting component includes an internal frame, a threaded rod, a internal groove and a positioning plate. Threaded rods are threadedly installed at the four corners of the internal frame, and the positioning plate is threadedly installed on the outer surface of the threaded rod. Internal grooves are opened at the four corners of the internal circuit board frame near the outside of the positioning plate.

[0008] Furthermore, a mounting frame is arranged outside the servo motor, and a chassis is installed at the bottom of the mounting frame.

[0009] Furthermore, a connecting plate is provided on one side of the outer surface of the chassis, and a vertical plate is installed on one end of the connecting plate.

[0010] Furthermore, mounting plates are fixedly mounted on both sides of the outer surface of the vertical plate by bolts, and a top plate is arranged on one side of the mounting plate.

[0011] Furthermore, a drying frame is installed on the outer surface of the top plate, and a heating wire tube is arranged inside the drying frame.

[0012] Furthermore, an auxiliary component for assisting in drying the copper-plated circuit board's special-shaped holes is provided at the bottom of the drying frame, and the auxiliary component includes a side frame, a bottom frame and a slider. The bottom of the side frame is provided with a bottom frame, and a slider is slidably installed inside the bottom frame.

[0013] Furthermore, the auxiliary component also includes a cover plate and a leakage hole, and the outer surface of the sliding block is provided with a cover plate, and the inside of the cover plate is provided with a leakage hole.

[0014] The present invention provides a circuit board special-shaped hole electroless copper plating device with uniform thickness, which has the following beneficial effects: 1. The present invention rotates the copper plating frame to follow the teeth, so that the teeth will mesh with the transmission gear, so that the transmission gear rotates with the built-in column as the center, so that the entire connecting component follows, which is conducive to the flipping of the circuit board frame with the circuit board placed at the end of the connecting plate, wherein the copper plating frame is provided with a conventional copper plating liquid and copper plating electrodes for copper plating the circuit board, and the copper plating liquid in the copper plating frame can be synchronously stirred during the flipping process of the circuit board frame, which is conducive to the contact between the copper plating liquid and the circuit boards stacked in the circuit board frame, ensuring that the copper plating liquid is fully and evenly in contact with the circuit boards in the circuit board frame, and is conducive to the uniform thickness of the copper plating of the special-shaped holes in the circuit board.

[0015] 2. The present invention facilitates the fixation of multiple groups of circuit boards with different thicknesses through the design of the limiting components. The design of the auxiliary components can ensure that the heat of the drying frame will not be dissipated too much when the circuit boards after copper plating are dried. At the same time, the excess copper plating liquid will fall to the surface of the cover plate and drip into the copper plating frame through the leakage hole, so that the copper plating liquid can be collected and used. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of a circuit board special-shaped hole chemical copper plating device with uniform thickness according to the present invention; Figure 2 This is a schematic diagram of the structure of a transmission component and a connection component of a circuit board special-shaped hole chemical copper plating device with uniform thickness according to the present invention; Figure 3 This is a schematic diagram of the structure of a limiting component of a circuit board special-shaped hole chemical copper plating device with uniform thickness according to the present invention; Figure 4 It is a schematic diagram of the connection structure between a copper plating frame and a chassis of a circuit board special-shaped hole chemical copper plating device with uniform thickness according to the present invention; Figure 5 The present invention is a schematic diagram of the partially unfolded structure of the auxiliary components of a circuit board special-shaped hole chemical copper plating device with uniform thickness.

[0017] In the figure: 1. copper-plated frame; 2. chassis; 3. connecting plate; 4. vertical plate; 5. mounting plate; 6. top plate; 7. drying frame; 8. transmission assembly; 801. built-in column; 802. transmission gear; 803. teeth; 9. connecting assembly; 901. connecting shaft; 902. fixing plate; 903. connecting plate; 10. circuit board frame; 11. limiting assembly; 1101. built-in frame; 1102. threaded rod; 1103. built-in groove; 1104. positioning plate; 12. shaft body; 13. mounting bracket; 14. servo motor; 15. heating wire tube; 16. auxiliary assembly; 1601. side rack; 1602. bottom frame; 1603. slider; 1604. cover plate; 1605. leakage hole. DETAILED DESCRIPTION

[0018] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0019] like Figure 1 , Figure 2 and Figure 4As shown, a copper plating device for circuit board special-shaped holes with uniform thickness includes a copper plating frame 1, a chassis 2, a connecting plate 3, a vertical plate 4, a mounting plate 5, a top plate 6, a drying frame 7, a transmission component 8, a built-in column 801, a transmission gear 802, a tooth 803, a connecting component 9, a connecting shaft 901, a fixing plate 902, a connecting plate 903, a circuit board frame 10, a limiting component 11, a built-in frame 1101, a threaded rod 1102, a built-in groove 1103, a positioning plate 1104, a shaft 12, a mounting frame 13, a servo motor 14, a heating wire tube 15, an auxiliary component 16, a side frame 1601, a bottom frame 1602, and a slider 16 03, cover plate 1604 and leak hole 1605, a shaft body 12 is arranged at the bottom of the copper plating frame 1, and a servo motor 14 is installed at the bottom of the shaft body 12, a mounting frame 13 is arranged outside the servo motor 14, and a chassis 2 is installed at the bottom of the mounting frame 13, a connecting plate 3 is arranged on one side of the outer surface of the chassis 2, and a vertical plate 4 is installed at one end of the connecting plate 3, mounting plates 5 are fixedly installed on both sides of the outer surface of the vertical plate 4 by bolts, and a top plate 6 is arranged on one side of the mounting plate 5, a transmission component 8 for assisting uniform copper plating is arranged on the outside of one side of the bottom of the copper plating frame 1, and the transmission component 8 includes a built-in column 801, a transmission gear 802 and a tooth 80 3. A transmission gear 802 is provided at the end of the built-in column 801, and teeth 803 are meshed on the outer surface of the bottom of the transmission gear 802. A connecting component 9 for position conversion is installed in the middle of one side of the transmission gear 802, and the connecting component 9 includes a connecting shaft 901, a fixing plate 902 and a connecting plate 903. A fixing plate 902 is installed on the outer surface of the connecting shaft 901, and a connecting plate 903 is provided at the end of the fixing plate 902. The circuit board frame 10 is arranged at the end of the connecting plate 903. The servo motor 14 and the shaft body 12 can rotate the copper-plated frame 1, and the teeth 803 follow the rotation of the copper-plated frame 1, so that the teeth 803 are rotated. 03 will mesh with the transmission gear 802, so that the transmission gear 802 rotates around the built-in column 801, so that the entire connecting component 9 moves with it, which is conducive to the flipping of the circuit board frame 10 with the circuit board placed at the end of the connecting plate 903, wherein the copper plating frame 1 is provided with a conventional copper plating liquid and copper plating electrodes for copper plating the circuit board. During the flipping process of the circuit board frame 10, the copper plating liquid in the copper plating frame 1 can be stirred synchronously, which is conducive to the contact between the copper plating liquid and the circuit boards stacked in the circuit board frame 10, ensuring that the copper plating liquid is in full and uniform contact with the circuit boards in the circuit board frame 10, which is conducive to the uniform thickness of the copper plating of the special-shaped holes in the circuit board.

[0020] like Figure 2 and Figure 3As shown, a limiting component 11 for limiting the circuit board is installed inside the circuit board frame 10, and the limiting component 11 includes an internal frame 1101, a threaded rod 1102, a built-in groove 1103 and a positioning plate 1104. The threaded rods 1102 are threadedly installed at the four corners of the internal frame 1101, and the positioning plate 1104 is threadedly installed on the outer surface of the threaded rod 1102. Internal grooves 1103 are opened on the outside of the positioning plate 1104 near the four corners of the internal corners of the circuit board frame 10. By rotating the threaded rod 1102 clockwise or counterclockwise, the positioning plate 1104 outside the threaded rod 1102 can be controlled to move up or down in the built-in groove 1103, so that the circuit board placed in the internal frame 1101 can be limited. There are multiple groups of positioning plates 1104, and the multiple groups of positioning plates 1104 can be synchronously controlled to move downward by rotating the threaded rod 1102, so as to fix multiple groups of circuit boards with different thicknesses.

[0021] like Figure 1 and Figure 5 As shown, a drying frame 7 is installed on the outer surface of the top plate 6, and a heating wire tube 15 is arranged inside the drying frame 7. The copper plating frame 1 can be rotated by the design of the servo motor 14 and the shaft 12. The teeth 803 of the copper plating frame 1 rotate and follow, so that the teeth 803 will mesh with the transmission gear 802, so that the transmission gear 802 rotates with the built-in column 801 as the center, so that the entire connecting component 9 follows, which is conducive to the flipping of the circuit board frame 10 with the circuit board placed on the end of the connecting plate 903. By flipping the circuit board frame 10, the circuit board after copper plating can be flipped to the inside of the drying frame 7, and the heating wire tube 15 can be used to dry the circuit board after copper plating. The structure is simple, and there is no need for the user to manually transfer between the copper plating operation area and the drying area. The bottom of the drying frame 7 is provided with an auxiliary component 16 for assisting in drying the special-shaped holes of the circuit board after copper plating, and the auxiliary component 16 includes a side frame 1601, a bottom frame 1602 and a slider 1603. The bottom of the side frame 1601 is provided with the bottom frame 1602, and the slider 1603 is slidably installed inside the bottom frame 1602. The auxiliary component 16 also includes a cover plate 1604 and a leak hole 1605. The outer surface of the slider 1603 is provided with the cover plate 1604, and the inside of the cover plate 1604 is provided with a leak hole 1605. When the drying frame 7 is used to dry the special-shaped holes of the circuit board, the slider 1603 and the cover plate 1604 can be slid into position through the design of the bottom frame 1602, so that the two groups of cover plates 1604 can seal the opening from the bottom of the drying frame 7, ensuring that the heat will not be dissipated too much when the drying frame 7 dries the copper-plated circuit board. In addition, excess copper plating liquid will fall to the surface of the cover plate 1604 and drip into the copper plating frame 1 through the leak hole 1605, which is convenient for collecting and using the copper plating liquid.

[0022] In summary, the circuit board shaped hole electroless copper plating device with uniform thickness is firstly based on Figure 1-Figure 5 The structure shown in the figure, when in use, by rotating the threaded rod 1102 clockwise or counterclockwise, the positioning plate 1104 outside the threaded rod 1102 can be controlled to move up or down in the built-in groove 1103, so that the circuit board placed in the built-in frame 1101 can be limited, wherein the positioning plates 1104 are provided with multiple groups, and the multiple groups of positioning plates 1104 can be synchronously controlled to move downward by rotating the threaded rod 1102, so as to fix multiple groups of circuit boards of different thicknesses, and then the copper-plated frame 1 can be rotated by the design of the servo motor 14 and the shaft 12, and the copper-plated frame 1 rotates the gear The tooth 803 moves with the gear 803, so that the tooth 803 will mesh with the transmission gear 802, so that the transmission gear 802 rotates with the built-in column 801 as the center, so that the entire connecting component 9 moves with the gear 803, which is conducive to the flipping of the circuit board frame 10 with the circuit board placed at the end of the connecting plate 903. The copper plating frame 1 is provided with a conventional copper plating liquid and a copper plating electrode for chemical copper plating of the special-shaped holes of the circuit board. During the flipping process of the circuit board frame 10, the copper plating liquid in the copper plating frame 1 can be stirred synchronously, which is conducive to the contact between the copper plating liquid and the circuit boards stacked in the circuit board frame 10, ensuring that the copper plating liquid and the electrodes in the circuit board frame 10 are in contact with each other. The circuit board is fully and evenly contacted, which is conducive to the uniform thickness of the copper plating of the special-shaped holes of the circuit board. Then, the copper plating frame 1 can be rotated through the design of the servo motor 14 and the shaft 12, and the teeth 803 of the copper plating frame 1 are rotated, so that the teeth 803 will mesh with the transmission gear 802, so that the transmission gear 802 rotates with the built-in column 801 as the center, so that the entire connecting component 9 follows, which is conducive to the flipping of the circuit board frame 10 with the circuit board placed at the end of the connecting plate 903. By flipping the circuit board frame 10, the circuit board after the copper plating is completed can be flipped to the inside of the drying frame 7, and the heating wire tube 1 can be used. 5 The circuit board after copper plating is dried. The structure is simple and there is no need for the user to manually transfer between the copper plating operation area and the drying area. Finally, when the drying frame 7 is used to dry the special-shaped holes of the circuit board, the slider 1603 and the cover plate 1604 can be slid into position through the design of the bottom frame 1602, so that the two groups of cover plates 1604 can seal the opening from the bottom of the drying frame 7, ensuring that the heat will not be dissipated too much when the drying frame 7 dries the circuit board after copper plating. In addition, the excess copper plating liquid will fall to the surface of the cover plate 1604 and drip into the copper plating frame 1 through the leak hole 1605.

[0023] The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A copper plating device for circuit board special-shaped holes with uniform thickness, comprising a copper plating frame (1) and a circuit board frame (10), characterized in that: The bottom of the copper plating frame (1) is provided with a shaft (12), and a servo motor (14) is installed at the bottom of the shaft (12). A transmission component (8) for assisting uniform copper plating is arranged on the outside of one side of the bottom of the copper plating frame (1), and the transmission component (8) comprises a built-in column (801), a transmission gear (802) and teeth (803). The end of the built-in column (801) is provided with a transmission gear (802), and the outer surface of the bottom of the transmission gear (802) is meshingly provided with teeth (803). A connecting component (9) for position conversion is installed in the middle of one side of the transmission gear (802), and the connecting component (9) comprises a connecting shaft (901), a fixing plate (902) and a connecting plate (903). The fixing plate (902) is installed on the outer surface of the connecting shaft (901), and the connecting plate (903) is arranged at the end of the fixing plate (902). The circuit board frame (10) is arranged at the end of the connecting plate (903).

2. The device for electroless copper plating of circuit board special-shaped holes with uniform thickness according to claim 1, characterized in that: A limiting assembly (11) for limiting the position of the circuit board is installed inside the circuit board frame (10), and the limiting assembly (11) comprises an internal frame (1101), a threaded rod (1102), an internal groove (1103) and a positioning plate (1104); threaded rods (1102) are threadedly installed at the four corners inside the internal frame (1101), and the positioning plate (1104) is threadedly installed on the outer surface of the threaded rod (1102); and internal grooves (1103) are provided outside the positioning plate (1104) at the four corners inside the circuit board frame (10).

3. The device for electroless copper plating of circuit board special-shaped holes with uniform thickness according to claim 1, characterized in that: A mounting frame (13) is arranged outside the servo motor (14), and a chassis (2) is installed at the bottom of the mounting frame (13).

4. The device for electroless copper plating of circuit board special-shaped holes with uniform thickness according to claim 3, characterized in that: A connecting plate (3) is provided on one side of the outer surface of the chassis (2), and a vertical plate (4) is installed on one end of the connecting plate (3).

5. The device for electroless copper plating of circuit board special-shaped holes with uniform thickness according to claim 4, characterized in that: Mounting plates (5) are fixedly mounted on both sides of the outer surface of the vertical plate (4) by means of bolts, and a top plate (6) is provided on one side of the mounting plate (5).

6. The device for electroless copper plating of circuit board special-shaped holes with uniform thickness according to claim 5, characterized in that: A drying frame (7) is installed on the outer surface of the top plate (6), and a heating wire tube (15) is arranged inside the drying frame (7).

7. The device for electroless copper plating of circuit board special-shaped holes with uniform thickness according to claim 6, characterized in that: An auxiliary component (16) for assisting in drying the copper-plated special-shaped holes of a circuit board is arranged at the bottom of the drying frame (7), and the auxiliary component (16) comprises a side frame (1601), a bottom frame (1602) and a slider (1603). The bottom of the side frame (1601) is arranged with the bottom frame (1602), and the slider (1603) is slidably mounted inside the bottom frame (1602).

8. The device for electroless copper plating of circuit board special-shaped holes with uniform thickness according to claim 7, characterized in that: The auxiliary component (16) further comprises a cover plate (1604) and a leakage hole (1605), and the outer surface of the sliding block (1603) is provided with the cover plate (1604), and the leakage hole (1605) is opened inside the cover plate (1604).

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