Printed circuit board processing method, printed circuit board processing equipment and medium

Abstract

The present application discloses a printed circuit board processing method, a printed circuit board processing device and a storage medium, and relates to the technical field of printed circuit boards. The printed circuit board processing method is disclosed, including: if the printed circuit board detection process is triggered, the printed circuit board to be detected corresponding to the detection work order of the detection process is detected based on the thickness measurement unit to obtain thickness detection information, wherein, after receiving the detection work order sent by the information management system, the detection process is triggered; according to the standard thickness parameter corresponding to the detection work order and the thickness detection information, the thickness detection result of the printed circuit board to be detected is determined; if the thickness detection result is normal, the printed circuit board to be detected is coded and calibrated based on the coding unit and the detection work order. The accuracy of printed circuit board detection is improved.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit boards, and in particular to a method for processing a printed circuit board, a processing device and a medium for processing a printed circuit board. Background Art

[0002] As a key component of modern electronic devices, the quality and performance of printed circuit boards (PCBs) are directly related to the stability and reliability of the entire electronic product. With the rapid development of electronic technology, the design of PCBs is becoming more and more complex, and the requirements for manufacturing and testing technology are also becoming higher and higher.

[0003] In the process of thickness detection and laser coding of PCB boards, the staff usually first inputs the standard thickness information of the PCB board to be tested, and then puts the PCB board into the thickness detection equipment for detection. After completing the thickness detection, the staff enters the information of the PCB board into the laser coding equipment to perform laser coding and marking on the PCB board. However, when a large number of PCB boards need to be tested, the manual input method is prone to errors, which reduces the accuracy of the detection.

[0004] The above contents are only used to assist in understanding the technical solution of the present application and do not constitute an admission that the above contents are prior art. Summary of the invention

[0005] The main purpose of the present application is to provide a printed circuit board processing method, a printed circuit board processing device and a medium, aiming to solve the technical problem of low accuracy when detecting PCB boards based on manual input.

[0006] To achieve the above objectives, the present application proposes a method for processing a printed circuit board, the method comprising:

[0007] If the inspection process of the printed circuit board is triggered, the thickness of the printed circuit board to be inspected corresponding to the inspection work order of the inspection process is inspected based on the thickness measuring unit to obtain thickness inspection information, wherein the inspection process is triggered after receiving the inspection work order sent by the information management system;

[0008] Determine the thickness detection result of the printed circuit board to be detected according to the standard thickness parameter corresponding to the detection work order and the thickness detection information;

[0009] If the thickness detection result is normal, the printed circuit board to be detected is subjected to coding calibration processing based on the coding unit and the detection work order.

[0010] In one embodiment, if the inspection process of the printed circuit board is triggered, the thickness of the printed circuit board to be inspected corresponding to the inspection work order of the inspection process is inspected based on the thickness measuring unit to obtain thickness inspection information, wherein after the inspection process is triggered, before the step of receiving the inspection work order sent by the information management system, it also includes:

[0011] In response to a work order issuing instruction, work order scanning information or work order information input instruction triggered by a control interface of a programmable logic controller, a work order acquisition instruction is generated;

[0012] A work order acquisition instruction is sent to the information management system, and the inspection work order fed back by the information management system based on the work order acquisition instruction is received.

[0013] In one embodiment, the thickness detection information includes board thickness information and copper thickness information, the thickness measuring unit includes a first thickness measuring unit and a second thickness measuring unit, and if the printed circuit board detection process is triggered, the printed circuit board to be detected corresponding to the detection work order of the detection process is subjected to thickness detection based on the thickness measuring unit to obtain thickness detection information, wherein after the detection process is triggered, the step of receiving the detection work order sent by the information management system includes:

[0014] Detecting the board thickness information of the printed circuit board to be detected based on the first thickness measuring unit, and when the board thickness information is normal, detecting the copper thickness information of the printed circuit board to be detected based on the second thickness measuring unit; or

[0015] Detecting the copper thickness information of the printed circuit board to be detected based on the second thickness measuring unit, and when the copper thickness information is normal, detecting the board thickness information of the printed circuit board to be detected based on the first thickness measuring unit; or

[0016] The board thickness information of the printed circuit board to be inspected is detected based on the first thickness measuring unit, and the copper thickness information of the printed circuit board to be inspected is detected based on the second thickness measuring unit.

[0017] In one embodiment, the step of detecting the board thickness information of the printed circuit board to be detected based on the first thickness measuring unit includes:

[0018] Controlling the first thickness measuring unit to output a detection signal to the printed circuit board to be detected;

[0019] Acquire an electrical signal generated by a detection sensor based on the reflection of the detection signal, wherein the detection sensor comprises a first detection sensor receiving the detection signal reflected from the upper surface of the printed circuit board to be detected, and a second detection sensor receiving the detection signal reflected from the lower surface of the printed circuit board to be detected;

[0020] Based on the signal receiving time of the electrical signal and the signal transmitting time of the detection signal, obtaining a first distance detected by the first detection sensor, and obtaining a second distance detected by the second detection sensor;

[0021] The board thickness information of the printed circuit board to be inspected is determined based on the first distance and the second distance.

[0022] In one embodiment, the step of determining the board thickness information of the printed circuit board to be inspected based on the first distance and the second distance includes:

[0023] determining a third distance between the first detection sensor and the second detection sensor;

[0024] The plate thickness information is obtained by subtracting the first distance from the third distance and then subtracting the second distance; or

[0025] The absolute value of the difference between the first distance and the second distance is set as the plate thickness information.

[0026] In one embodiment, the step of detecting the copper thickness information of the printed circuit board to be detected based on the second thickness measuring unit includes:

[0027] Based on the electromagnetic sensor of the second thickness measuring unit, an alternating electromagnetic field of the circuit board to be detected is generated;

[0028] The inductance change information and the resistance change information of the alternating electromagnetic field are obtained, and based on the inductance change information and the resistance change information, the copper thickness information of the circuit board to be detected is generated.

[0029] In one embodiment, the step of determining the thickness detection result of the printed circuit board to be detected according to the standard thickness parameter corresponding to the detection work order and the thickness detection information includes:

[0030] If the plate thickness information is within the normal plate thickness range of the standard thickness parameter, and the copper thickness information is within the normal copper thickness range of the standard thickness parameter, determining that the thickness detection result is normal;

[0031] Otherwise, it is determined that the thickness detection result is abnormal.

[0032] In one embodiment, if the inspection process of the printed circuit board is triggered, the thickness of the printed circuit board to be inspected corresponding to the inspection work order of the inspection process is inspected based on the thickness measuring unit to obtain thickness inspection information, wherein after receiving the inspection work order sent by the information management system, before the step of triggering the inspection process, it also includes:

[0033] In response to an input instruction received by a control interface of a programmable logic controller, determining the board thickness setting information, copper thickness serial port information and programmable logic control information of the printed circuit board to be detected corresponding to the input instruction;

[0034] A connection is established with a first thickness measuring unit for plate thickness testing based on the plate thickness setting information, a connection is established with a second thickness measuring unit for copper thickness testing based on the copper thickness serial port information, and a connection is established with a detection port for receiving thickness detection information based on the programmable control information.

[0035] In addition, to achieve the above-mentioned purpose, the present application also proposes a printed circuit board processing device, which includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, and the computer program is configured to implement the steps of the printed circuit board processing method as described above.

[0036] In addition, to achieve the above-mentioned purpose, the present application also proposes a storage medium, which is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, the steps of the printed circuit board processing method described above are implemented.

[0037] One or more technical solutions proposed in this application have at least the following technical effects:

[0038] After the PCB inspection process is triggered, the PCB board corresponding to the inspection work order is fully inspected by the thickness measuring unit to obtain its accurate thickness inspection information. Then, the thickness inspection information is compared by the intelligent comparison algorithm to obtain the thickness inspection result. If the thickness inspection result meets the standard, the laser coding process is automatically performed, that is, the PCB board is accurately and efficiently coded and marked by the coding unit. Based on this, the automatic inspection and calibration of the PCB board in the production process is realized, and the processing efficiency and inspection accuracy of the PCB board are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0040] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0041] Figure 1 A schematic diagram of a process flow for a first embodiment of a method for processing a printed circuit board of the present application;

[0042] Figure 2 A schematic flow chart of a second embodiment of a method for processing a printed circuit board of the present application;

[0043] Figure 3 A schematic diagram of a simplified process of a method for processing a printed circuit board provided in a second embodiment of the present application;

[0044] Figure 4 A schematic diagram of a process flow for a fifth embodiment of a printed circuit board processing method of the present application;

[0045] Figure 5 It is a schematic diagram of the device structure of the hardware operating environment involved in the printed circuit board processing method in the embodiment of the present application.

[0046] The purpose, features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0047] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the present application and are not used to limit the present application.

[0048] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.

[0049] The main solution of the embodiment of the present application is: if the inspection process of the printed circuit board is triggered, the thickness of the printed circuit board to be inspected corresponding to the inspection work order of the inspection process is inspected based on the thickness measuring unit to obtain thickness inspection information, wherein the inspection process is triggered after receiving the inspection work order sent by the information management system; the thickness inspection result of the printed circuit board to be inspected is determined according to the standard thickness parameter corresponding to the inspection work order; if the thickness inspection result is normal, the printed circuit board to be inspected is subjected to coding and calibration processing based on the coding unit and the inspection work order.

[0050] In this embodiment, for the convenience of description, the following description is made by taking the processing device of the printed circuit board as the execution subject.

[0051] In the process of thickness detection and laser coding of PCB boards in the prior art, the staff usually inputs the standard thickness information of the PCB board to be detected first, and then puts the PCB board into the thickness detection equipment for detection. After completing the thickness detection, the staff enters the information of the PCB board into the laser coding equipment to perform laser coding and marking on the PCB board. However, when a large number of PCB boards need to be detected, the manual input method is prone to errors, which reduces the accuracy of the detection.

[0052] The present application provides a solution. After the inspection process of a printed circuit board is triggered, the thickness of a PCB board to be inspected in an inspection work order of the inspection process is inspected by a thickness measuring unit, and at the same time, the inspection unit is inspected and processed based on the standard thickness parameter in the inspection work order. When the thickness inspection result is normal, the laser coding module is used to perform coding and calibration on the printed circuit board to be inspected in the current inspection work order, thereby realizing automatic acquisition of work order information of the PCB board, automatic thickness inspection and automatic laser coding, realizing automatic inspection and calibration processing of the PCB board in the production process, and improving the processing efficiency and inspection accuracy of the PCB board.

[0053] The present application embodiment provides a method for processing a printed circuit board, referring to Figure 1 , Figure 1 This is a flow chart of a first embodiment of a method for processing a printed circuit board of the present application.

[0054] In this embodiment, the printed circuit board processing method includes steps S10 to S30:

[0055] Step S10: if the inspection process of the printed circuit board is triggered, a thickness inspection is performed on the printed circuit board to be inspected corresponding to the inspection work order of the inspection process based on a thickness measuring unit to obtain thickness inspection information.

[0056] It should be noted that the printed circuit board processing equipment triggers the inspection process after receiving the inspection work order sent by the information management system. When the processing equipment receives the work order inspection instruction, or detects that the printed circuit board enters the inspection area, it sends the work order acquisition instruction of the printed circuit board to be inspected to the information management system such as the MES (Manufacturing Execution System) system, and receives the inspection work order fed back by the system, thereby triggering the inspection process of the printed circuit board. Based on this, when inspecting and processing a large number of printed circuit boards to be inspected, the corresponding inspection work order information can be directly obtained from the information management system, without the need for staff to manually enter the work order information, thereby improving the inspection efficiency and avoiding errors in manual input, thereby improving the inspection accuracy.

[0057] The inspection work order contains the production batch information, number information, items to be inspected, and standard parameters corresponding to each item to be inspected of the printed circuit board. For example, in the inspection work order information, the standard parameters for the copper thickness inspection of the printed circuit board are marked to be within a certain set range. Based on the information in the inspection work order, the processing equipment can track the production history of each printed circuit board, and perform subsequent thickness inspection and coding calibration processing on the printed circuit board based on the inspection work order, so that it can be quickly identified and processed on the production line. The processing equipment of the printed circuit board can perform thickness inspection and coding calibration processing on the printed circuit boards in the production line.

[0058] In this embodiment, after receiving the inspection work order, the printed circuit board processing device identifies the printed circuit board that needs to be inspected, and at the same time performs thickness inspection on it through a thickness measuring unit to obtain thickness inspection information. The thickness measuring unit can be a thickness measuring module provided by the printed circuit board processing device, or it can be an external thickness measuring module. The thickness measuring unit can be provided with multiple test areas for performing different thickness type tests or an independent test unit, or it can be composed of multiple units for performing different thickness type tests. The thickness inspection information usually includes the board thickness information and copper thickness information of the printed circuit board to be inspected.

[0059] In the actual thickness measurement process, after the printed circuit board to be tested enters the thickness measurement area corresponding to the thickness measurement unit, it is subjected to thickness measurement processing. For example, after entering the board thickness test area, it is subjected to board thickness test processing, and after entering the copper thickness test area, it is subjected to copper thickness test processing.

[0060] It is understandable that the thickness measuring unit can detect the board thickness, copper thickness and other common thickness detection items of the printed circuit board, wherein the board thickness refers to the thickness of the printed circuit board substrate, and the copper thickness refers to the thickness of the copper foil covering the substrate. During the detection process, the board thickness can be detected first, and then compared to determine whether the board thickness detection result is abnormal. If not, continue to detect the copper thickness of the printed circuit board. In addition, the copper thickness can be detected first, and when the copper thickness detection result is normal, the board thickness can be detected. Optionally, the board thickness and copper thickness detection processing can also be performed simultaneously to obtain thickness detection information. Among them, the thickness detection information is a specific parameter corresponding to a certain thickness detection item. For example, in the thickness detection information, the copper thickness of the printed circuit board to be detected is a ounce and the board thickness is b millimeters.

[0061] By performing thickness detection on the corresponding printed circuit board to be detected in the detection work order, the thickness information of the current printed circuit to be detected can be accurately obtained, so that based on the thickness information and the standard thickness parameters, the current thickness information can be automatically compared to see if it is accurate, thereby improving the detection efficiency and the detection accuracy.

[0062] Step S20: determining a thickness detection result of the printed circuit board to be detected according to the standard thickness parameter corresponding to the detection work order and the thickness detection information.

[0063] In this embodiment, the standard thickness parameter includes the normal parameter range of each thickness detection item. The standard thickness parameter is recorded in the detection work order, and the detection work order can be directly read to obtain the standard thickness parameter. Among them, if the thickness parameter in the thickness detection information is within the interval corresponding to the standard thickness parameter, such as the board thickness information of the printed circuit board is within the upper and lower limits of the board thickness corresponding to the standard thickness parameter, then the thickness detection result is determined to be passed.

[0064] Therefore, if in the thickness detection information, the plate thickness information is in the normal plate thickness range of the standard thickness parameter, and the copper thickness information is in the normal copper thickness range of the standard thickness parameter, the thickness detection result is determined to be normal; otherwise, the thickness detection result is determined to be abnormal.

[0065] Based on this, the thickness detection information is detected and processed at the same time through standard thickness parameters, so as to achieve a rapid evaluation of the thickness quality of the printed circuit board, reduce manual detection and evaluation, reduce human errors, and improve detection accuracy.

[0066] Step S30: If the thickness detection result is normal, based on the coding unit and the detection work order, the printed circuit board to be detected is subjected to coding calibration processing.

[0067] It should be noted that the coding unit is used to mark the corresponding production information and detection information on the printed circuit board to be inspected, so as to facilitate subsequent tracking and management. The coding unit includes a built-in laser coding module or an external laser coding device, which uses the laser coding module to perform precise laser engraving at the specified position of the printed circuit board to be inspected. Among them, the laser coding module or device can quickly generate a QR code or barcode based on the preset production information and detection information, and print it accurately on the circuit board. This marking method not only improves the accuracy of the information, but also enhances the durability of the mark. Even in the subsequent production process, the mark is not easy to wear or fade. In practical applications, the appropriate coding and calibration medium can be selected according to the use environment and requirements of the printed circuit board to ensure the accuracy and traceability of the information.

[0068] Optionally, the coding unit may also be other coding equipment such as inkjet coding equipment, thermal transfer coding equipment, and mechanical scribing coding equipment. The coding unit of the present application is preferably a laser coding equipment.

[0069] It is understandable that the coding and calibration process includes not only basic information such as the serial number and production date of the printed circuit board, but also detailed data such as the specific value of the thickness test and the test time. In this way, it can be ensured that the test data of each printed circuit board that passes the thickness test is accurately recorded, providing a reliable basis for quality control and product traceability.

[0070] In this embodiment, when the thickness detection results corresponding to all thickness detection information are normal, the coding process of the laser coding device is automatically triggered, and the coding calibration process is performed according to the corresponding printed circuit board in the detection work order. Based on this, after the thickness detection of the printed circuit board to be detected is completed, it can be accurately calibrated to ensure the accuracy and consistency of the coded and calibrated printed circuit board, thereby improving the accuracy of the detection and calibration of the printed circuit board.

[0071] Optionally, if the thickness detection result is abnormal, the coding process needs to be stopped and the information of the current thickness detection abnormality is outputted. The abnormal information includes abnormal logs, abnormal work order information corresponding to the abnormal printed circuit board, and the like.

[0072] This embodiment provides a method for processing a printed circuit board. After the detection process is triggered, the thickness of the printed circuit board to be detected is first detected based on the thickness measuring unit, and the detection results are analyzed after the thickness detection is completed. After the detection results of all thickness detection items are normal, the coding process of the coding unit is triggered and the printed circuit board is calibrated based on the coding unit, so that real-time and accurate coding processing can be performed after the thickness detection of the printed circuit board is completed, ensuring the accuracy and consistency of the printed circuit board, and then when processing a large number of printed circuit boards to be detected, the accuracy of the printed circuit board processing can be effectively improved.

[0073] Based on the first embodiment of the present application, in the second embodiment of the present application, the same or similar contents as those in the first embodiment can refer to the above introduction, and will not be repeated in the following. Figure 2 Before step S10, the printed circuit board processing method further includes steps S01-S02:

[0074] Step S01, generating a work order acquisition instruction in response to a work order issuing instruction, a work order scanning information or a work order information input instruction triggered by a programmable logic controller.

[0075] It should be noted that the programmable logic controller refers to a Programmable Logic Controller, or PLC for short, wherein the PLC can be a control system for a printed circuit board processing device, through which the corresponding operation information or control instructions are received, so as to facilitate the printed circuit board processing device to process the printed circuit board. The work order issuance instruction refers to the work order issuance instruction triggered by the staff in the control interface of the PLC, the work order scanning information refers to the work order information scanned by the staff to be transmitted to the PLC, and the work order information input instruction refers to the work order information input by the staff in the control interface of the PLC. The work order scanning information and the work order information input instruction both contain the current work order number to be tested, which is used to obtain the relevant test work order from the upper-level information management system such as the MES system, thereby reducing the error-prone situation of manually inputting the test work order information through automatic acquisition, thereby reducing the accuracy of the test.

[0076] Therefore, in this embodiment, when the staff clicks to issue a work order instruction or enters a work order number in the PLC control interface, or the user scans and enters the work order number into the PLC by scanning a code, the printed circuit board processing device generates a work order acquisition instruction based on the work order number information, or directly generates a work order acquisition instruction based on the issued work order instruction, so as to send the instruction to the information management system and receive the inspection work order fed back by it.

[0077] Step S02: sending a work order acquisition instruction to the information management system, and receiving the inspection work order fed back by the information management system based on the work order acquisition instruction.

[0078] In this embodiment, after the work order acquisition instruction is generated, the instruction can be directly sent to the information management system, and the received inspection work order can be loaded locally to facilitate the processing of the inspected printed circuit board. After the inspection work order fed back by the information management system is obtained, the inspection process of the printed circuit board is triggered, and then the inspection process of the printed circuit board to be inspected is performed, and the information of the inspection work order is automatically obtained, thereby ensuring the efficiency and accuracy of the inspection process.

[0079] For example, in the PLC operation interface, after scanning the work order number or receiving the input work order number, the printed circuit board processing device can connect to the upper-level system MES through the HTTP (HyperText Transfer Protocol) protocol WEBAPI (WorldWide Web Application Programming Interface) interface to obtain relevant inspection work order information and load it locally to process complex logic and control equipment actions.

[0080] The present embodiment provides a method for processing a printed circuit board, which generates a corresponding work order acquisition instruction by responding to a PLC instruction trigger action, a work order information scanning action, etc., and obtains a printed circuit board inspection work order from an information management system based on the instruction, thereby realizing automatic acquisition of the inspection work order and avoiding errors in the inspection work order information due to manual input.

[0081] Based on the first embodiment of the present application, in the third embodiment of the present application, the same or similar contents as those in the first embodiment can be referred to the above description, and will not be repeated later. On this basis, the thickness detection information includes the plate thickness information and copper thickness information of the printed circuit board, and the thickness measuring unit includes a first thickness measuring unit and a second thickness measuring unit, the plate thickness of the printed circuit board is measured by the first thickness measuring unit, and the copper thickness of the printed circuit board is measured by the second thickness measuring unit. Based on this, step S10, based on the thickness measuring unit, performs thickness detection on the printed circuit board to be detected corresponding to the detection work order of the detection process, and the step of obtaining thickness detection information includes step S11:

[0082] Step S11, detecting the board thickness information of the printed circuit board to be detected based on the first thickness measuring unit, and when the board thickness information is normal, detecting the copper thickness information of the printed circuit board to be detected based on the second thickness measuring unit.

[0083] It should be noted that in the first embodiment, the thickness of the printed circuit board to be inspected is usually first inspected based on the thickness measuring unit, and the inspection result is analyzed after the thickness inspection is completed. In the actual production inspection process, the essence of the thickness test is to inspect the quality of the printed circuit board. Therefore, when one of the thickness tests fails, the printed circuit board is considered unqualified and needs to be reworked or scrapped.

[0084] Based on this, in order to reduce the number of tests and improve the processing efficiency when processing a large number of printed circuit boards, one of the thickness detection items of the printed circuit board to be tested is usually first tested by a thickness measuring unit, and then compared with the standard thickness parameters recorded in the test work order based on the test result. If the comparison result is abnormal, it means that the production process of the printed circuit board to be tested does not meet the standard. At this time, there is no need to test another thickness detection item to directly determine that the printed circuit board is unqualified. Such a processing flow not only saves detection time, but also improves production efficiency, ensuring that only printed circuit boards that meet the standards will enter the subsequent detection, calibration and production process. In addition, through this detection method, the damage to the printed circuit board that may be caused by repeated detection can be effectively reduced, thereby ensuring the stability of product quality. At the same time, in practical applications, it can greatly reduce the production cost of printed circuit boards.

[0085] Therefore, in this embodiment, it is necessary to first detect the board thickness information of the printed circuit board through the first thickness measuring unit, and after the board thickness information is normal, the copper thickness information of the printed circuit board is detected based on the second thickness measuring unit.

[0086] In another optional implementation, the copper thickness information of the printed circuit board may be detected based on the second thickness measuring unit first, and when the copper thickness information is normal, the copper thickness information of the printed circuit board may be detected by the first thickness measuring unit.

[0087] It is understandable that in step S11, one of the thickness detection items in the printed circuit board to be detected can be detected based on one of the thickness measuring units, and then step S20 is performed to obtain the thickness detection result of a certain thickness detection item, and when the detection result is normal, the action of performing thickness detection on another detection item in step S11 is continued to be cyclically performed, and after the detection is completed, the step of determining the thickness detection result in step S20 is continued. Finally, when all the thickness detection items are completed and the thickness detection results are normal, the printed circuit to be detected is subjected to coding and calibration processing. Therefore, in the embodiment of the present application and any of the above embodiments, step codes such as S10 and S20 are used, the purpose of which is to express the corresponding content more clearly and concisely, and does not constitute a substantial restriction on the order. When implementing it specifically, those skilled in the art may first execute S20 and then S10, or cyclically execute the actions of S10 and S20 and then the action of S30, etc., which should all be within the scope of protection of the present application.

[0088] Optionally, in addition to sequentially testing different thickness detection items, the thickness and copper thickness of the printed circuit board to be tested can also be detected based on the first thickness measuring unit and the second thickness measuring unit, respectively, to achieve multi-parameter parallel detection of the printed circuit board and improve detection efficiency. At the same time, the first thickness measuring unit and the second thickness measuring unit can work independently or collaboratively, and can be flexibly configured according to actual needs. Through parallel detection, detection interruptions caused by single point failures can be reduced, and the stability and reliability of the entire detection system can be improved.

[0089] For example, in order to help understand the implementation process of the printed circuit board processing method obtained by combining this embodiment with the above-mentioned first embodiment, please refer to Figure 3 , Figure 3 A brief schematic flow chart of a method for processing a printed circuit board is provided, specifically:

[0090] After the PCB board to be inspected starts to be produced and enters the PCB board processing equipment, the inspection process is triggered. At this time, the board thickness test is started through the first thickness measuring unit, and the test result is sent to the PLC device and judged. So that when the board thickness test result is NG (not good), the PLC control device will flow the NG PCB board to the unqualified area without coding and calibration processing, or perform abnormal alarm shutdown processing based on the settings.

[0091] When the board thickness test result is OK, that is, the test result is normal, the copper thickness is tested through the second thickness measuring unit, and the test result is sent to the PCL device to analyze and judge the test result, so that when the test result is NG, that is, abnormal, the NG PCB board is removed from the production inspection line. Finally, when the board thickness test and the copper thickness test results are both normal, the coding unit, that is, the laser equipment, is used to perform coding and calibration processing on the PCB board that has passed the inspection, and finally the production inspection processing of the PCB board at the current stage is completed.

[0092] This embodiment provides a method for processing a printed circuit board. During the thickness measurement process, one of the thickness detection items is first detected and processed, and then the thickness detection result is verified. After the verification passes, other thickness test items are continuously tested and processed. Based on this, the thickness test efficiency can be effectively improved.

[0093] Based on the third embodiment of the present application, in the fourth embodiment of the present application, the same or similar contents as those in the third embodiment can be referred to the above description, and will not be described in detail later. On this basis, the process of detecting the thickness information of the printed circuit board to be detected based on the first thickness measuring unit specifically includes steps S110 to S114:

[0094] Step S110: controlling the first thickness measuring unit to output a detection signal to the printed circuit board to be detected.

[0095] Step S112, obtaining an electrical signal generated by the detection sensor after the detection signal is reflected.

[0096] Step S113, based on the signal receiving time of the electrical signal and the signal transmitting time of the detection signal, obtaining the first distance detected by the first detection sensor and obtaining the second distance detected by the second detection sensor.

[0097] Step S114: determining the board thickness information of the printed circuit board to be inspected based on the first distance and the second distance.

[0098] It should be noted that the detection signal may include a laser detection signal, a pulse signal, or other signals suitable for thickness measurement. The detection sensor includes the first detection sensor receiving the detection signal reflected from the upper surface of the printed circuit board to be detected, and the second detection sensor receiving the detection signal reflected from the lower surface of the printed circuit board to be detected.

[0099] In this embodiment, in order to calculate the board thickness information, as an optional implementation, the transmitter of the detection signal, the first detection sensor and the second detection sensor are perpendicular to the printed circuit board to be detected. At this time, the actual board thickness can be calculated directly by the third distance between the two detection sensors, and the first distance and the second distance between the detection sensor and the printed circuit board, based on the difference method. That is, the board thickness information is obtained by subtracting the first distance and the second distance from the third distance.

[0100] Therefore, a laser beam can be sent to the printed circuit board through a laser, and after the laser beam is irradiated to the surface of the object to be measured, part of the laser is reflected back by the surface of the object, and the distance between the sensor and the reflecting surface is calculated by the electrical signal generated in the sensor by the reflected light, and the same is true for the pulse signal. Among them, after the detection signal is reflected, it can be imaged onto a photosensitive receiver through an imaging objective lens, and then an electrical signal for detecting the position of the light spot on the surface is generated. Based on this, in the current embodiment, the first distance is the vertical distance between the first detection sensor and the upper surface of the PCB board, and the second distance is the vertical distance between the second detection sensor and the lower surface of the PCB board. After obtaining the distance D between the first detection sensor and the second detection sensor, the board thickness T=D-(d1+d2), where d1 is the first distance and d2 is the second distance.

[0101] Although D minus (d1+d2) can theoretically represent the thickness of the PCB board, this calculation method is not the first choice due to the errors that may exist in actual operation. In addition, when the detection signal is not perpendicular to the printed circuit board or when the detection sensor is not perpendicular to the printed circuit board, the error generated by the calculation result is large. At the same time, forcing the sensor to be perpendicular to the detection position will increase the complexity of the device. Therefore, in another optional embodiment, the one-way distance of the two detection signals from the signal transmitting sensor to the upper surface of the PCB board and reflected back can be calculated, and then the difference between the two can be used as the detected board thickness information. It can be understood that the difference between the first distance and the second distance |d1 - d2| corresponds to the one-way thickness of the PCB board, so the absolute value of the difference between the first distance and the second distance can be used as the board thickness information.

[0102] Specifically, the first distance represents the one-way distance of the detection signal from the sensor to the upper surface of the PCB board and reflected back, and the second distance represents the one-way distance of the detection signal from the sensor to the lower surface of the PCB board and reflected back. In actual operation, the emission time of the detection signal is the same, so the absolute value of the difference between the two distances can be used as the thickness of the PCB board.

[0103] Exemplarily, the time t1 measured by the first detection sensor is 10 ns (nanoseconds), the time t2 measured by the second detection sensor B is 12 ns, and the speed of light c is 3×10^8 m / s. At this time, the first distance d1 = c × t1 / 2 = 3×10-4 m (or 150 μm), and the second distance d2 = c × t2 / 2 = 3×10-4 m (or 180 μm). Finally, the calculated thickness of the PCB board T is |d1 - d2| = |150 μm - 180 μm| = 30 μm.

[0104] The present embodiment provides a method for processing a printed circuit board, using a first detection sensor and a second detection sensor to respectively measure the reflection time of a signal from the sensor to the upper and lower surfaces of the PCB board, and then calculating the one-way distance of the signal on the upper and lower surfaces of the PCB board according to the speed of light and the measured time. Finally, by calculating the absolute value of the difference between the two distances, the precise thickness of the PCB board is obtained. In addition, if the calculated distance is a vertical distance, the thickness of the PCB board can also be calculated by the distance between the detection sensors. Based on this, the thickness of the PCB board can be measured quickly and accurately, thereby improving the detection efficiency.

[0105] Based on the third embodiment of the present application, in the fifth embodiment of the present application, the same or similar contents as those in the third embodiment can be referred to the above description, and will not be described in detail later. On this basis, the process of detecting the thickness information of the printed circuit board to be detected based on the second thickness measuring unit specifically includes steps S114~S115:

[0106] Step S114: generating an alternating electromagnetic field of the circuit board to be inspected based on the electromagnetic sensor of the second thickness measuring unit.

[0107] Step S115, acquiring the inductance change information and the resistance change information of the alternating electromagnetic field, and generating the copper thickness information of the circuit board to be detected based on the inductance change information and the resistance change information.

[0108] In this embodiment, the thickness can be calculated by the electromagnetic induction method based on the principle of electromagnetic induction by measuring the eddy currents generated by the copper foil of the circuit in the alternating electromagnetic field. It can be understood that when the copper sheet passes through the measuring instrument, the sensor in the instrument will generate an alternating electromagnetic field. According to Faraday's law of electromagnetic induction, this electromagnetic field will generate eddy currents inside the copper sheet. The size of the eddy current is proportional to the thickness of the copper sheet. By measuring the changes in inductance and resistance caused by the eddy current, the thickness of the copper sheet can be determined.

[0109] Specifically, after the printed circuit board is placed in the sensing area of ​​the electromagnetic sensor, the sensor generates an alternating electromagnetic field. The frequency and intensity of this electromagnetic field are usually adjusted according to the material and thickness of the copper film. Assume that the frequency of the alternating electromagnetic field currently generated is 1kHz and the intensity is 1T, and the material of the copper film of the printed circuit board is pure copper, whose conductivity and magnetic permeability are known. Through measurement, it is obtained that the inductance change caused by eddy current is ΔL, and the resistance change is ΔR. Then, according to the principle of electromagnetic induction and eddy current effect, the following mathematical model can be established: ΔL = k1 × d × σ × f^2 × μ, ΔR = k2 ×d × ρ × f × μ, where: k1 and k2 are constants, which are related to the sensor design and the material of the copper film. d is the thickness of the copper film, σ is the conductivity of copper, ρ is the resistivity of copper (which is the reciprocal of conductivity), f is the frequency of the alternating electromagnetic field, and μ is the magnetic permeability of copper.

[0110] By combining the above two equations, we can solve the thickness d of the copper sheet:

[0111] d = (ΔL / k1 × σ × f^2 × μ) = (ΔR / k2 × ρ × f × μ).

[0112] It is understandable that in practical applications, since constants such as k1 and k2 are usually obtained through experimental calibration, the calibrated formula can be directly used for calculation.

[0113] The copper thickness of the printed circuit board is calculated through the inductance change information and resistance change information of the electromagnetic field, thereby realizing the accurate measurement of the copper layer thickness of the printed circuit board. This method not only improves the accuracy of the measurement, but also can quickly detect whether the copper layer of the circuit board has reached the thickness standard required by the design, ensuring the product quality of the printed circuit to be tested.

[0114] Based on the first embodiment of the present application, in the sixth embodiment of the present application, the same or similar contents as those in the first embodiment can be referred to the above introduction, and will not be repeated in the following. Figure 4 Before step S10, the printed circuit board processing method further includes steps S03-S04:

[0115] Step S03, responding to the input instruction received by the control interface of the programmable logic controller, determining the board thickness setting information, copper thickness serial port information and programmable logic control information of the printed circuit board to be detected corresponding to the input instruction.

[0116] Step S04, establishing a connection with a first thickness measuring unit performing a plate thickness test based on the plate thickness setting information, establishing a connection with a second thickness measuring unit performing a copper thickness test based on the copper thickness serial port information, and establishing a connection with a detection port receiving thickness detection information based on the programmable control information.

[0117] It should be noted that the plate thickness setting information includes the IP address of the plate thickness test, the plate thickness port, the thickness test, the upper and lower limits of the plate thickness, etc., while the copper thickness serial port information includes the port number, the baud rate used by the copper thickness serial port for detection, the data bit, the upper and lower limits of the copper thickness, the stop bit, the parity bit, etc., and the copper thickness serial port information includes the upper and lower serial port information. The programmable logic control information includes the PLC port number, the PLC IP address, the plate thickness signal, the copper thickness signal, the plate thickness result, the copper thickness result and the heartbeat address, etc.

[0118] Therefore, in this embodiment, in order to ensure that the processing equipment of the printed circuit board can accurately interact and control with each processing module or processing unit, thereby improving the detection efficiency and detection accuracy of the entire printed circuit board. After obtaining the board thickness setting information, copper thickness serial port information and programmable control information, a connection is established with the first thickness measuring unit that performs the board thickness test through the board thickness IP address in the board thickness setting information, so as to control the first test unit to perform the board thickness test processing, and at the same time, a connection is established with the second thickness measuring unit that performs the copper thickness test based on the port number of the copper thickness serial port information. Finally, a connection is established with the corresponding detection port through the copper thickness signal and board thickness information of the programmable control information, so as to identify the thickness measurement results sent by the second and second thickness measuring units after the thickness test received from the corresponding port.

[0119] By inputting instructions in the control interface, the test ports corresponding to the board thickness test and the copper thickness test are determined, and after establishing a connection with them, it is convenient for the processing equipment to control the thickness measuring unit to perform thickness detection. At the same time, the corresponding thickness detection results are sent to the PLC device based on the detection port, so that when the thickness detection fails, the printed circuit board can be discharged to the unqualified area, avoiding repeated detection or coding and marking of abnormal circuit boards, thereby improving the processing accuracy when processing a large number of printed circuit boards.

[0120] The present application provides a printed circuit board processing device, the printed circuit board processing device includes: at least one processor; and a memory connected to the at least one processor in communication; wherein the memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the printed circuit board processing method in the first embodiment described above.

[0121] Reference below Figure 5 , which shows a schematic structural diagram of a printed circuit board processing device suitable for implementing an embodiment of the present application. Figure 5The printed circuit board processing device shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0122] like Figure 5 As shown, the processing device of the printed circuit board may include a processing device 1001 (such as a central processing unit, a graphics processor, etc.), which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM: Read Only Memory) 1002 or a program loaded from a storage device 1003 to a random access memory (RAM: Random Access Memory) 1004. In RAM1004, various programs and data required for the operation of the processing device of the printed circuit board are also stored. The processing device 1001, ROM1002 and RAM1004 are connected to each other through a bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. Generally, the following systems can be connected to the I / O interface 1006: an input device 1007 including, for example, a touch screen, a touch pad, a keyboard, a mouse, an image sensor, a microphone, an accelerometer, a gyroscope, etc.; an output device 1008 including, for example, a liquid crystal display (LCD: Liquid Crystal Display), a speaker, a vibrator, etc.; a storage device 1003 including, for example, a magnetic tape, a hard disk, etc.; and a communication device 1009. The communication device 1009 can allow the processing device of the printed circuit board to communicate with other devices wirelessly or by wire to exchange data. Although the processing device of the printed circuit board with various systems is shown in the figure, it should be understood that it is not required to implement or have all the systems shown. More or fewer systems can be implemented or have alternatively.

[0123] In particular, according to the embodiments disclosed in the present application, the process described above with reference to the flowchart can be implemented as a computer software program. For example, the embodiments disclosed in the present application include a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program includes a program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network through a communication device, or installed from a storage device 1003, or installed from a ROM 1002. When the computer program is executed by the processing device 1001, the above-mentioned functions defined in the method of the embodiment disclosed in the present application are executed.

[0124] The printed circuit board processing device provided by the present application adopts the printed circuit board processing method in the above embodiment, which can solve the technical problem of low accuracy when the PCB board is detected based on manual input. Compared with the prior art, the beneficial effects of the printed circuit board processing device provided by the present application are the same as the beneficial effects of the printed circuit board processing method provided by the above embodiment, and other technical features in the printed circuit board processing device are the same as the features disclosed in the method of the previous embodiment, which will not be repeated here.

[0125] It should be understood that the various parts disclosed in this application can be implemented by hardware, software, firmware or a combination thereof. In the description of the above embodiments, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0126] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

[0127] The present application provides a computer-readable storage medium having computer-readable program instructions (ie, computer programs) stored thereon, and the computer-readable program instructions are used to execute the printed circuit board processing method in the above-mentioned embodiment.

[0128] The computer-readable storage medium provided in the present application may be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared or semiconductor systems, systems or devices, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM: Random Access Memory), a read-only memory (ROM: Read Only Memory), an erasable programmable read-only memory (EPROM: Erasable Programmable Read Only Memory or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM: CD-Read Only Memory), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, system or device. The program code contained on the computer-readable storage medium may be transmitted using any appropriate medium, including but not limited to: wires, optical cables, RF (Radio Frequency: Radio Frequency), etc., or any suitable combination of the above.

[0129] The computer-readable storage medium may be included in the processing device of the printed circuit board; or may exist independently without being assembled into the processing device of the printed circuit board.

[0130] The computer-readable storage medium carries one or more programs. When the one or more programs are executed by the processing device of the printed circuit board, the processing device of the printed circuit board:

[0131] If the inspection process of the printed circuit board is triggered, the thickness of the printed circuit board to be inspected corresponding to the inspection work order of the inspection process is inspected based on the thickness measuring unit to obtain thickness inspection information, wherein the inspection process is triggered after receiving the inspection work order sent by the information management system;

[0132] Determine the thickness detection result of the printed circuit board to be detected according to the standard thickness parameter corresponding to the detection work order and the thickness detection information;

[0133] If the thickness detection result is normal, the printed circuit board to be detected is subjected to coding calibration processing based on the coding unit and the detection work order.

[0134] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0135] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of a code, and the module, a program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of boxes in the block diagram and / or flowchart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0136] The modules involved in the embodiments described in this application may be implemented by software or hardware, wherein the name of the module does not constitute a limitation on the unit itself in some cases.

[0137] The readable storage medium provided by the present application is a computer-readable storage medium, which stores computer-readable program instructions (i.e., computer programs) for executing the above-mentioned printed circuit board processing method, and can solve the technical problem of low accuracy when the PCB board is detected based on manual input. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided by the present application are the same as the beneficial effects of the printed circuit board processing method provided by the above-mentioned embodiment, and will not be repeated here.

[0138] The above descriptions are only some embodiments of the present application, and are not intended to limit the patent scope of the present application. All equivalent structural changes made using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect applications in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A method for processing a printed circuit board, characterized in that: The printed circuit board processing method comprises: If the inspection process of the printed circuit board is triggered, the first thickness measuring unit is controlled to output an inspection signal to the printed circuit board to be inspected corresponding to the inspection work order of the inspection process, wherein the inspection process is triggered after receiving the inspection work order sent by the information management system; Acquire an electrical signal generated by a detection sensor based on the reflection of the detection signal, wherein the detection sensor comprises a first detection sensor receiving the detection signal reflected from the upper surface of the printed circuit board to be detected, and a second detection sensor receiving the detection signal reflected from the lower surface of the printed circuit board to be detected; Based on the signal receiving time of the electrical signal and the signal transmitting time of the detection signal, obtaining a first distance detected by the first detection sensor, and obtaining a second distance detected by the second detection sensor; Determining the board thickness information of the printed circuit board to be inspected based on the first distance and the second distance; When the board thickness information is normal, generating an alternating electromagnetic field of the printed circuit board to be inspected based on the electromagnetic sensor of the second thickness measuring unit; Acquiring inductance change information and resistance change information of the alternating electromagnetic field, and generating copper thickness information of the printed circuit board to be inspected based on the inductance change information and the resistance change information; Determine the thickness detection result of the printed circuit board to be detected according to the standard thickness parameter and thickness detection information corresponding to the detection work order, wherein if the board thickness information is within the normal board thickness range of the standard thickness parameter, and the copper thickness information is within the normal copper thickness range of the standard thickness parameter, determine that the thickness detection result is normal; otherwise, determine that the thickness detection result is abnormal; If the thickness detection result is normal, based on the coding unit and the detection work order, the printed circuit board to be detected is coded and calibrated to mark the production information and the detection information on the printed circuit board to be detected.

2. The method for processing a printed circuit board according to claim 1, characterized in that: If the inspection process of the printed circuit board is triggered, the first thickness measuring unit is controlled to output an inspection signal to the printed circuit board to be inspected corresponding to the inspection work order of the inspection process, wherein after receiving the inspection work order sent by the information management system, before the step of triggering the inspection process, it also includes: In response to a work order issuing instruction, work order scanning information or work order information input instruction triggered by a control interface of a programmable logic controller, a work order acquisition instruction is generated; A work order acquisition instruction is sent to the information management system, and the inspection work order fed back by the information management system based on the work order acquisition instruction is received.

3. The method for processing a printed circuit board according to claim 1, characterized in that: The step of determining the board thickness information of the printed circuit board to be inspected based on the first distance and the second distance comprises: determining a third distance between the first detection sensor and the second detection sensor; The plate thickness information is obtained by subtracting the first distance from the third distance and then subtracting the second distance; or The absolute value of the difference between the first distance and the second distance is set as the plate thickness information.

4. The method for processing a printed circuit board according to claim 1, wherein: If the inspection process of the printed circuit board is triggered, the first thickness measuring unit is controlled to output an inspection signal to the printed circuit board to be inspected corresponding to the inspection work order of the inspection process, wherein after receiving the inspection work order sent by the information management system, before the step of triggering the inspection process, it also includes: In response to an input instruction received by a control interface of a programmable logic controller, determining the board thickness setting information, copper thickness serial port information and programmable logic control information of the printed circuit board to be detected corresponding to the input instruction; A connection is established with a first thickness measuring unit for performing a plate thickness test based on the plate thickness setting information, a connection is established with a second thickness measuring unit for performing a copper thickness test based on the copper thickness serial port information, and a connection is established with a detection port for receiving thickness detection information based on the programmable logic control information.

5. A printed circuit board processing device, characterized in that: The printed circuit board processing device comprises: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program is configured to implement the steps of the printed circuit board processing method according to any one of claims 1 to 4.

6. A storage medium, characterized in that: The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, the steps of the printed circuit board processing method according to any one of claims 1 to 4 are implemented.

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