Information processing device, display input device, and program

Abstract

The information processing device sets the polishing content of the probe in contact with the object to be inspected. The information processing apparatus includes: a region setting unit that sets a polishing region in a polishing member that polishes a probe; a mode setting unit that sets an operation mode at the time of polishing the probe; and a simulation unit that calculates a relative trajectory between the polishing member and the probe on the basis of the set polishing region and the set operation pattern. As a result, the information processing device can unify the setting of the polishing content of the probe, and can shorten the man-hour.

Description

Technical Field

[0001] The present invention relates to an information processing device, a display input device, and a program. Background Art

[0002] Patent Document 1 discloses a polishing method for polishing the needle tips of a plurality of probes that come into contact with an object to be inspected during inspection in an inspection device (probe device) that performs electrical inspection of an object to be inspected such as a wafer.

[0003] In the grinding of the probe, the shape of the grinding member (e.g., the size and layout of the grinding stone) and the action during grinding (e.g., the action mode of the grinding member) are different depending on the requirements of each user of the inspection device. Conventionally, a device is provided that is individually designed when the inspection device is manufactured or set based on the requirements of each user to implement the grinding content of each user.

[0004] <Prior Art Literature>

[0005] <Patent Documents>

[0006] Patent Document 1: Japanese Patent Application Publication No. 2010-48789 Summary of the invention

[0007] <Problems to be Solved by the Invention>

[0008] The present invention provides a technology capable of reducing man-hours by standardizing the settings of the polishing contents of probes.

[0009] <Methods used to solve the problem>

[0010] According to one embodiment of the present invention, there is provided an information processing device for setting the grinding content of a probe in contact with an object to be inspected, comprising: an area setting unit for setting the grinding area in a grinding member for grinding the probe; a mode setting unit for setting the action mode during grinding of the probe; and a simulation unit for calculating the relative trajectory of the grinding member and the probe based on the set grinding area and the set action mode.

[0011] <Effects of the Invention>

[0012] According to one embodiment, by making the settings of the polishing contents of the probes common, it is possible to shorten the man-hours. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic explanatory diagram showing the overall configuration of an inspection device and a setting computer according to one embodiment.

[0014] Figure 2: is a block diagram showing the overall structure of a processing system including an inspection device.

[0015] Figure 3 It is a block diagram showing the hardware configuration of the control device and the setting computer.

[0016] Figure 4 This is a block diagram showing functional blocks for setting the polishing content in the setting computer.

[0017] Figure 5 This is a diagram showing a main screen for setting polishing contents.

[0018] Fig. 6A is a diagram showing a grinding media selection button.

[0019] Figure 6B It is a figure which shows the size input screen.

[0020] Figure 6C FIG. 1 is a diagram showing another size input screen.

[0021] Fig. 7A is a diagram showing a setting quantity selection button.

[0022] Figure 7B is a diagram showing a conductive area selection button.

[0023] Figure 7C It is a diagram showing a multi-area input screen.

[0024] Fig. 8A is a diagram showing another multi-area input screen.

[0025] Figure 8B This is a first diagram showing yet another multi-region input screen.

[0026] Figure 8C The second figure shows yet another multi-area input screen.

[0027] Fig. 9 It is a diagram schematically showing the display of a setting input screen and a mode setting screen accompanying the operation of the display screen.

[0028] Fig.10 It is a diagram showing a setting input screen.

[0029] Fig.11A It is a plan view schematically showing the deviation of the polishing member and each probe.

[0030] Fig. 11B It is a plan view schematically showing a state in which the polishing member and each probe are aligned with each other by movement based on the index amount.

[0031] Fig. 12Ais a diagram showing a mode selection button.

[0032] Fig. 12B It is a figure which shows the mode setting screen.

[0033] Fig.13A 1 is a first diagram showing the free mode setting screen.

[0034] Fig. 13B The second figure shows the free mode setting screen.

[0035] Fig.14A This is a diagram schematically showing the settings of a plurality of blocks in a simulation.

[0036] Fig. 14B This is a diagram schematically showing the usage range of the polishing member in the simulation.

[0037] Fig.15 The first figure shows the display of the main screen during simulation.

[0038] Fig.16 The second figure shows the display of the main screen during simulation.

[0039] Fig.17A It is a diagram schematically showing a plurality of frames and polishing areas in a simulation.

[0040] Fig. 17B It is a diagram schematically showing a plurality of plotted points and a polishing region in a simulation. DETAILED DESCRIPTION

[0041] Hereinafter, the mode for implementing the present invention will be described with reference to the drawings. In each of the drawings, the same components are denoted by the same reference numerals, and duplicate descriptions may be omitted.

[0042] like Figure 1 As shown, an information processing device according to one embodiment is configured as a setting computer 80, which is connected to an inspection device 10 for performing grinding of a plurality of probes 33 (probes) used in the inspection to set the grinding content. In the following description, in order to facilitate understanding of the operation of each probe 33 during grinding, the structure of the inspection device 10 is first described.

[0043] The inspection device 10 according to the present embodiment is installed in, for example, a factory that manufactures wafers W as an example of substrates (see also Figure 2), and the manufactured wafer W is electrically inspected. On the surface of the wafer W, a device under test (DUT) is formed for each probe 33 to contact, that is, a plurality of semiconductor devices (LSI, semiconductor memory, etc.). In the electrical inspection, the semiconductor device is tested for abnormalities, electrical characteristics, etc. In addition, the substrate is not limited to the wafer W, and can also be a carrier, a glass substrate, a chip monomer, an electronic circuit substrate, etc., on which semiconductor devices are configured.

[0044] The inspection device 10 includes: a loader 11 that transports a wafer W; a housing 20 that is disposed adjacent to the loader 11; a tester 30 that is disposed above the housing 20; a workbench 40 that is accommodated in the housing 20; and a control device 90 that controls each structure of the inspection device 10.

[0045] The loader 11 takes out a wafer W from a FOUP (Front Opening Unified Pod) (not shown) and places it on a table 40 that moves in the housing 20. The loader 11 takes out the inspected wafer W from the table 40 and stores it in the FOUP.

[0046] The housing 20 is formed as a substantially rectangular parallelepiped box, and has an inspection space 21 therein for inspecting the wafer W. A worktable 40 for conveying the wafer W is provided below the inspection space 21. The wafer W placed on the worktable 40 from the loader 11 in the inspection space 21 moves in three-dimensional directions (X-axis direction, Y-axis direction, and Z-axis direction) by the movement of the worktable 40.

[0047] A probe card 32 is held in the upper portion of the housing 20 via an interface 31. The interface 31 has a performance board (not shown) and a plurality of connection terminals, and is electrically connected to the tester 30 via a test head (not shown). The tester 30 is connected to the control device 90 of the inspection device 10, and performs inspection of the wafer W under the command of the control device 90.

[0048] The probe card 32 has a plurality of probes 33 protruding toward the bottom of the inspection space 21. During the inspection by the inspection device 10, each probe 33 contacts the pad or solder bump of each DUT of the wafer W moved to an appropriate three-dimensional coordinate position by the workbench 40. As a result, an appropriate circuit formed on one or more test boards (not shown) of the tester 30 is electrically connected to each DUT of the wafer W. In this conductive state, the tester 30 performs electrical inspection on each DUT contacted by each probe 33.

[0049] The workbench 40 is disposed in the housing 20, and conveys the wafer W or the probe card 32 in the inspection space 21. For example, the workbench 40 conveys the wafer W from the loader 11 to a position opposite to the probe card 32, and raises the wafer W toward the probe card 32, thereby bringing the wafer W into contact with the plurality of probes 33. In addition, after the inspection, the workbench 40 lowers the inspected wafer W from the probe card 32, and further conveys the wafer W toward the loader 11.

[0050] Specifically, the workbench 40 includes a moving portion 41 (X-axis moving mechanism 42, Y-axis moving mechanism 43, Z-axis moving mechanism 44) that can move in the X-axis direction, the Y-axis direction, and the Z-axis direction, a stage 45, and a workbench control unit 49. In addition, the housing 20 includes a frame structure 22 that supports the moving portion 41 of the workbench 40, the stage 45, and the workbench control unit 49 in two layers. In addition, the moving portion 41 may also have a structure that rotates the stage 45 around an axis (θ direction) in addition to moving the stage 45 in the X-axis direction, the Y-axis direction, and the Z-axis direction.

[0051] The X-axis moving mechanism 42 of the moving part 41 includes: a plurality of guide rails 42a, which are fixed to the upper surface of the frame structure 22 and extend along the X-axis direction; and an X-axis movable body 42b, which is arranged between the guide rails 42a. The X-axis movable body 42b has an X-axis motion part (motor, gear mechanism, etc.) not shown in the figure inside, and the X-axis motion part is connected to the workbench control part 49. The X-axis movable body 42b reciprocates in the X-axis direction based on the power supply from the motor driver not shown in the figure of the workbench control part 49.

[0052] Similarly, the Y-axis moving mechanism 43 includes: a plurality of guide rails 43a, which are fixed to the upper surface of the X-axis movable body 42b and extend along the Y-axis direction; and a Y-axis movable body 43b, which is arranged between the guide rails 43a. The Y-axis movable body 43b has a Y-axis action part (motor, gear mechanism, etc.) not shown in the figure inside, and the Y-axis action part is connected to the workbench control unit 49. The Y-axis movable body 43b reciprocates in the Y-axis direction based on the power supply from the motor driver not shown in the figure of the workbench control unit 49.

[0053] The Z-axis moving mechanism 44 includes a fixed body 44a provided on the Y-axis movable body 43b and a Z-axis movable body 44b which is lifted and lowered in the Z-axis direction relative to the fixed body 44a, and a mounting table 45 is held on the upper part of the Z-axis movable body 44b. The Z-axis moving mechanism 44 includes a Z-axis motion part (motor, gear mechanism, etc.) not shown in the figure, which is connected to the stage control part 49. The Z-axis movable body 44b is displaced in the Z-axis direction (vertical direction) based on the power supply of the motor driver not shown in the figure from the stage control part 49, and the wafer W held on the mounting table 45 is lifted and lowered accordingly.

[0054] The mounting table 45 is a device for directly mounting the wafer W, and holds the wafer W on the mounting surface 45s by an appropriate holding unit. For example, when the wafer W is vacuum-adsorbed, the holding unit has a suction passage in the mounting table 45, and a pipe connected to the suction passage and a suction pump at an appropriate position.

[0055] The workbench control unit 49 is connected to the control device 90, and controls the movement of the workbench 40 based on the instructions of the control device 90. The workbench control unit 49 includes an integrated control unit for controlling the overall movement of the workbench 40, a PLC for controlling the movement of the moving unit 41, a motor driver, a lighting control unit, a power supply unit, etc. (all not shown).

[0056] The control device 90 can be implemented as a general-purpose computer including a control body 91 for controlling the entire inspection device 10 and a display input device 92 (user interface) connected to the control body 91 .

[0057] The inspection device 10 configured as described above performs electrical inspection of the wafer W under the control of the control device 90. First, the inspection device 10 sends a command for moving the loader 11 and the stage 40 to the stage control unit 49, transfers the wafer W from the loader 11 to the mounting table 45, and transports the wafer W in the inspection space 21. At this time, the stage control unit 49 moves the mounting table 45 in the horizontal direction through the X-axis moving mechanism 42 and the Y-axis moving mechanism 43 so that the contact position of the wafer W is opposite to each probe 33, and then raises the mounting table 45 in the vertical direction (Z-axis direction) through the Z-axis moving mechanism 44.

[0058] When the stage 45 rises, each probe 33 contacts the wafer W, thereby the tester 30 is connected to the wafer W. After that, the tester 30 sends an electrical signal from the test head to each DUT of the wafer W, receives a corresponding device signal from each DUT, and determines the presence or absence of abnormality, electrical characteristics, etc. of each DUT. In addition, the inspection device 10 repeatedly inspects each DUT in sequence while shifting the position on the wafer W by moving the worktable 40 in the X-axis direction, the Y-axis direction, and the Z-axis direction, thereby inspecting all DUTs.

[0059] After inspecting all the DUTs, the inspection apparatus 10 lowers the mounting table 45 to detach the wafer W from each prober 33, and transfers the wafer W to the loader 11. The loader 11 receives the inspected wafer W from the stage 40 and stores it in the FOUP.

[0060] In addition, the inspection device 10 involved in the present embodiment may have a situation where foreign matter is attached to a part of each probe 33 or each probe 33 is partially worn during the inspection. Therefore, during the maintenance of the inspection device 10, a needle grinding process is performed to grind each probe 33 of the probe card 32 as described above. For example, in the needle grinding process, the user arranges the grinding member PM on the mounting surface 45s of the workbench 40. Then, the control device 90 moves the workbench 40 having the grinding member PM based on the plan of the needle grinding process (grinding content). As the workbench 40 moves, the grinding member PM contacts each probe 33 and then moves relative to each probe 33 in the horizontal direction (X-axis-Y-axis direction), thereby grinding each probe 33.

[0061] The processing system 1 having the above inspection device 10 can arbitrarily set the polishing content of the needle polishing process for polishing each probe 33 by the user. Figure 2 A processing system 1 including the inspection device 10 will be described, and settings of the pin grinding process in the processing system 1 will be described in detail.

[0062] A processing system 1 according to one embodiment includes: a plurality of factories 2 each having one or more inspection devices 10 ; an external network 3 such as the Internet connected to each of the factories 2 ; and a server device 4 connected via the external network 3 .

[0063] As described above, the factory 2 is a manufacturing site for manufacturing wafers W, and by installing the inspection device 10, the manufactured wafers W can be immediately inspected. The server device 4 is a computer that uniformly manages the manufacturing status of wafers W in multiple factories 2, the status of the installed equipment, etc. The server device 4 can use a computer owned by the user. Alternatively, the server device 4 can also be a computer on the provider side of the inspection device 10. In addition, the processing system 1 can of course be only one factory 2, and it can also be a system structure that does not use the external network 3 and the server device 4.

[0064] In the factory 2, in addition to the plurality of inspection devices 10, an internal network 60 such as a LAN connected to each of the plurality of inspection devices 10 and a management computer 70 connected to each of the inspection devices 10 via the internal network 60 are provided. In addition, the processing system 1 includes a setting computer 80 for setting the functions of various devices provided in the factory 2. In the present embodiment, as described above, the grinding contents of the pin grinding process of the inspection device 10 are set by the setting computer 80, and the information is sent to the control device 90.

[0065] In addition, the setting of the grinding content of the pin grinding process may also be performed using the management computer 70 connected to the inspection device 10 in a communicable manner. Alternatively, the processing system 1 may be configured so that the grinding content is set in the server device 4 connected to the factory 2 in a communicable manner, and the grinding content is sent to the control device 90 of the inspection device 10. In addition, the grinding content can also be set in the control device 90 of the inspection device 10 itself. In other words, the information processing device that sets the grinding content of the inspection device 10 may use any one of the server device 4, the management computer 70, the setting computer 80, and the control device 90.

[0066] like Figure 1 and Figure 3 As shown, the setting computer 80 involved in this embodiment is detachably connected to the control device 90 of the inspection device 10 through the communication line 61, and information is communicated between the control device 90. The setting computer 80 is mounted on a trolley 62, etc., for example, and can be freely moved in the factory 2. Therefore, even if a plurality of inspection devices 10A, 10B, ..., 10N are installed in the factory 2, the user can use one setting computer 80 to perform settings for each inspection device 10. In addition, the setting computer 80 can also be connected to the control device 90 in a communicable manner through a communication unit such as a wireless LAN instead of the communication line 61.

[0067] The control body 91 of the control device 90 has one or more processors 96, a memory 97, an input / output interface 98, a communication interface 99, and an electronic circuit not shown. The processor 96 is a combination of one or more of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an ASIC (Application Specific Integrated Circuit), an FPGA (Field-Programmable Gate Array), a circuit composed of a plurality of discrete semiconductors, etc. The memory 97 is a combination of volatile memory, non-volatile memory (such as an optical disk, a DVD (Digital Versatile Disc), a hard disk, a flash memory, etc.) as appropriate. The processor 96 controls the operation of the inspection device 10 by reading and executing a program 97p stored in the memory 97.

[0068] On the other hand, the display input device 92 of the control device 90 can apply a touch panel 93 that can visually display the operating status of the inspection device 10 and can be operated by the user. Alternatively, the display input device 92 is not limited to the touch panel 93, and a display, keyboard, mouse, etc. can also be applied.

[0069] The setting computer 80 can also adopt the same configuration as the control device 90. That is, the setting computer 80 can be a general-purpose computer including a control body 81 and a display input device 82 connected to the control body 81.

[0070] The display input device 82 of the setting computer 80 is configured to include a display 83, a keyboard 84, a mouse 85, etc. In addition, the display input device 82 can also be applied to a device having a touch panel. The control body 81 of the setting computer 80 has one or more processors 86, a memory 87, an input / output interface 88, a communication interface 89, and an electronic circuit (not shown) in the same manner as the control body 91. In addition, the processor 86 reads and executes the program 87p (application) stored in the memory 87, thereby internally constructing a functional unit for setting the grinding content of the needle grinding process.

[0071] like Figure 4 As shown, an input information acquisition unit 801, a display control unit 802, a display screen generation unit 803, and a grinding content transmission unit 804 are formed in the control body 81. The input information acquisition unit 801 receives the user's operation content (input information OI) on the display input device 82, and transmits the input information OI to the display screen generation unit 803. On the other hand, the display control unit 802 transmits the upper part of the display screen 100 generated by the display screen generation unit 803 to the display input device 82, and displays it on the display input device 82.

[0072] The display screen generation unit 803 performs appropriate processing based on the input information OI, generates a display screen 100 corresponding to the operation, and stores the input information OI required for the grinding content of the needle grinding process in the memory 87. On the other hand, after the user sets the grinding content, the grinding content transmission unit 804 generates setting information SI that can be transmitted to the inspection device 10. Then, the grinding content transmission unit 804 monitors the connection between the setting computer 80 and the inspection device 10, and transmits the setting information SI to the control device 90 based on the user's operation when connected to the inspection device 10.

[0073] Specifically, the display screen generator 803 includes a region setting unit 805, a mode setting unit 806, and a simulation unit 807. The functions of each unit will be described in detail below together with various display screens 100 displayed on the display 83 of the display input device 82 by the control body 81.

[0074] When the setting of the grinding contents is started (when the program 87p is activated), the display screen generating unit 803 generates the following as the display screen 100: Figure 5 The main screen 110 for editing the polishing content is shown. The main screen 110 includes: an area setting display group 111 for setting the polishing area of ​​the probe 33; a simulation display group 141 for simulating the set polishing content; and a simulation display screen 140 for displaying the simulation result.

[0075] In order to make it easier for the user to visually recognize the simulation result, the main screen 110 according to the present embodiment provides a simulation display screen 140 in an area of ​​about 70% from the left side of the main screen 110 including the central portion. In addition, the main screen 110 arranges the area setting display group 111 on the right and upper side of the simulation display screen 140, and arranges the simulation display group 141 on the right and lower side of the simulation display screen 140.

[0076] The area setting display group 111 has a plurality of button images for the user to perform a given operation. The plurality of button images include, for example, a grinding medium selection button 112, an input button 113, a detailed setting button 114, and a data button 115. The grinding medium selection button 112 is a button for the user to set the grinding member PM for grinding the probe 33. The input button 113 is a button for the user to set the grinding area of ​​the grinding member PM in more detail. The detailed setting button 114 is a button for making various setting changes to the application for editing the grinding. The data button 115 is a button for displaying the history of the grinding contents set in the past and reading the past grinding contents selected by the user.

[0077] When receiving the user's pressing of the polishing medium selection button 112 as input information OI, the display screen generator 803 activates the region setting unit 805. The region setting unit 805 displays a plurality of polishing members PM and allows the user to select a polishing member PM.

[0078] The grinding medium selection button 112 is, for example, Fig. 6A As shown, a pull-down screen 112A having a plurality of pull-down options 200 can be displayed. Alternatively, the polishing medium selection button 112 can also be a structure in which other images representing various polishing members PM are popped up when the user presses it. The pull-down screen 112A can be arranged on the mounting surface 45s of the workbench 40, and various polishing members PM sold and used are displayed as options 200 at a glance.

[0079] For example, as a variety of grinding components PM, square grinding sheets, horizontally long grinding sheets, large grinding sheets, grinding wafers, etc. can be cited. The horizontally long grinding sheet is formed into a rectangular sheet whose long side is longer than one side of the square grinding sheet. The large grinding sheet is a square sheet larger than the square grinding sheet. The grinding wafer uses a grindstone formed in the shape of a wafer or set as a simulated wafer. In addition, in addition to configuring the grinding component PM on the workbench 40, the inspection device 10 can also be configured to have a probe device (not shown) having a grinding stone for grinding that is a different device from the workbench 40, so that the probe device operates in the same way as the workbench 40 to grind each probe 33. In this case, the area setting unit 805 can select the grindstone set on the probe device as the grinding component PM.

[0080] The area setting unit 805 automatically sets the size of the grinding member PM that is pre-stored together with the information of the grinding member PM as the user selects the grinding member PM. However, the size of the grinding member PM can be arbitrarily changed by the user when the grinding member PM is arranged on the mounting surface 45s. Therefore, the area setting unit 805 can also be configured to allow the user to input the size of the grinding member PM. For example, Figure 6B As shown, the area setting unit 805 can also display a size input screen 112B (area setting screen) where the user can input the size of the grinding member PM in numerical values. The size input screen 112B has a plurality of input fields 201 for inputting the horizontal plane shape of the grinding member PM, i.e., the size of the X axis and the size of the Y axis.

[0081] In addition, if Figure 6C As shown, the area setting unit 805 may also display a size input screen 112C (area setting screen) in which the size of the polishing member PM can be input by the drag and drop operation of the user's mouse 85. For example, the size input screen 112C includes an operation screen 202 for performing a drag and drop operation, and an input field 201 in which the size of the X axis and the size of the Y axis of the polishing member PM can be input along the horizontal direction of the operation screen 202. The input field 201 may be configured to automatically display the size of the X axis and the size of the Y axis accompanying the drag and drop operation in addition to the manual input by the user.

[0082] The operation screen 202 is configured by the user to place the pointer 203 linked to the operation of the mouse 85 at an appropriate position to perform a drag-and-drop operation, thereby displaying the square grinding member PM. In addition, the drag-and-drop operation in this specification is not limited to the operation of continuing and moving the click of the mouse 85 and releasing the click. For example, when a touch panel is used as the display input device 82, it can also be an operation of sliding on the panel after touching the panel to release the touch. In this case, the drag point and the drop point can also use mechanical buttons. In short, the drag-and-drop operation can adopt various user operations in which the user can arbitrarily specify the range on the display screen in the input of the information processing device.

[0083] When setting the size of the grinding member PM (grinding area), the area setting unit 805 can set the effective range MM of actual grinding in the grinding member PM inside the outer edge MO in addition to setting the outer edge MO of the grinding member PM. In addition, the area setting unit 805 can also set the outer edge MO and effective range MM of the grinding member PM by a single drag-and-drop operation, or by different drag-and-drop operations. In addition, the shape of the grinding member PM formed on the operation screen 202 is not limited to a square, and can preferably be changed to a circle, other polygons, etc. by performing an appropriate selection operation.

[0084] Furthermore, the area setting unit 805 may be configured to set the number of polishing sheets, the conduction area, etc. when the polishing sheets as the polishing members PM are attached to the mounting surface 45s. In the needle grinding process, by using a plurality of polishing members PM, for example, it is possible to implement polishing for different purposes, such as first roughly grinding the probe 33 and then finely grinding the probe 33.

[0085] To set the number of grinding members PM, Fig. 7A As shown, the area setting unit 805 may display a setting quantity selection button 112D having a plurality of drop-down options 210. Figure 7B As shown, the area setting unit 805 may display a conduction area selection button 112E having a plurality of drop-down options 211 in order to set the number of conduction areas (zero means none). For example, the number selection button 112D and the conduction area selection button 112E may be provided on the main screen 110 or the setting input screen 120 described later. Alternatively, the area setting unit 805 is not limited to the drop-down type, and may be a structure that displays an input field (not shown) for the user to manually input the number of polishing members PM and the number of conduction areas.

[0086] In addition, for example, Figure 7CAs shown, the area setting unit 805 may also display a multi-area input screen 112F (area setting screen) in which a plurality of grinding components PM and / or conductive areas can be input by dragging and dropping the mouse 85 of the user. As an example, the multi-area input screen 112F displays a grinding setting box 212 indicating the size of the overall grinding area set on the mounting surface 45s. In the grinding setting box 212, the user creates a layout of a plurality of divided areas according to the number and shape of the grinding components PM, conductive areas, etc. by performing a drag and drop operation of the pointer 213 in conjunction with the operation of the mouse 85. Figure 7C , an example is shown in which three divided areas (area A, area B, area C) and one conductive area are formed in the multi-area input screen 112F.

[0087] Or, if Fig. 8A As shown, the region setting unit 805 may also be a structure that displays a multi-region input screen 112G (region setting screen) having a table 220 in which the size of the X axis and the size of the Y axis can be input for a plurality of divided regions (regions A, B, ..., N). The table 220 of the multi-region input screen 112G has an input field 221 for the user to manually input a numerical value for each X axis and Y axis in the plurality of divided regions. Then, when the user inputs a numerical value in the input field 221, a divided region corresponding to the input size is displayed. Thus, the user can smoothly arrange the polishing member PM at the same position as the polishing member PM arranged on the mounting surface 45s.

[0088] In addition, when multiple segmentation areas are set, Figure 8B and Figure 8C As shown, the region setting unit 805 can set the outer edge MO and the effective range MM for each segmented area. For example, the region setting unit 805 displays the multi-area input screen 112H (region setting screen), and first generates the outer contours 222 of multiple segmented areas (the outer edges MO1, MO2 of the grinding member PM) by dragging and dropping. Furthermore, after setting the outer contours 222 of multiple segmented areas, the region setting unit 805 generates effective ranges MM1, MM2 by dragging and dropping inside each segmented area. That is, each segmented area has an effective range MM1, MM2, and a blank area outside the effective range MM1, MM2 that is not used for grinding each probe 33. In this way, the region setting unit 805 can simply set the effective ranges MM1, MM2 even when setting multiple segmented areas.

[0089] return Figure 5 The input button 113 of the area setting display group 111 of the main screen 110 is a button image for setting the size and number of the grinding member PM and the operation mode of the workbench 40 during the needle grinding process. Fig. 9As shown, when the user presses the input button 113, the display screen 100 pops up a setting input screen 120 as other screen information (window). Then, the display screen 100 allows the user to input various information related to the grinding content of the pin grinding process through the setting input screen 120.

[0090] In addition, the setting input screen 120 has a mode setting item group 124 for setting the operation mode of the needle grinding process. For example, the mode setting item group 124 includes a setting button 127. When the user presses the setting button 127, a mode setting screen 130 as other screen information pops up. The mode setting screen 130 allows the user to set various information related to the operation mode.

[0091] like Fig.10 As shown, the setting input screen 120 has a plurality of setting items 121 such as the size of the polishing member PM, and a plurality of input fields 125 arranged horizontally to each setting item 121 and for user input. The plurality of setting items 121 are divided into a polishing member PM setting item group 122, a probe card 32 setting item group 123, and the above-mentioned mode setting item group 124.

[0092] The setting item group 122 of the polishing member PM includes, for example, a medium size (size of the polishing member PM), an index size, a position in the Z-axis direction, an effective range, etc. The medium size can basically be set by the polishing medium selection button 112 (see Figure 5 ) is pressed, but the user can also input in the setting input screen 120. Therefore, the setting input screen 120 is also one of the area setting screens for setting the polishing area. Fig.10 In the example, an input field 125 is provided for inputting a numerical value, but the above-mentioned items may be displayed selectively or in an appropriate order instead of the input field 125. Figure 6A to Figure 9 Each screen of C.

[0093] The indexing dimension of the setting item group 122 of the polishing member PM is a numerical value indicating the offset (indexing amount) between the target position (new surface not used for polishing) on ​​the polishing member PM arranged on the mounting surface 45s and the probe 33. The polishing member PM is arbitrarily arranged on the mounting surface 45s of the table 40 by the user. Fig.11A As shown in FIG. 1 , if the indexing amount is not set, the needle grinding process is performed in a state where the target position on the grinding member PM and each probe 33 of the probe card 32 are offset from each other. The indexing size setting item 121 allows the user who has set the grinding member PM on the mounting surface 45s to input the indexing amount. Thus, the inspection device 10 can move the grinding member PM based on the indexing amount and make the probe 33 contact the new surface of the grinding member PM to perform grinding.

[0094] Specifically, the inspection device 10 that has set the polishing content of the needle polishing process based on the setting information SI controls the moving position of the worktable 40 based on the set indexing amount, and adjusts the relative position of the polishing member PM with respect to each probe 33 of the probe card 32. For example, Fig. 11B As shown, the inspection apparatus 10 can make the center of the polishing member PM and the center of each probe 33 of the probe card 32 coincide with each other based on the displacement amount D (a vector synthesized by the displacement about the X axis and the displacement about the Y axis).

[0095] return Fig.10 The position in the Z-axis direction in the setting item group 122 of the grinding member PM is an item for setting the contact state of each probe 33 and the grinding member PM in the Z-axis direction during the pin grinding process. During the pin grinding process, the inspection device 10 raises the workbench 40 so that each probe 33 is in contact with the surface of the grinding member PM. The area setting unit 805 can change the position of the grinding member PM in the Z-axis direction (overdrive), thereby allowing the user to adjust the contact pressure between the grinding member PM and each probe 33 during the pin grinding process, the bending state of each probe 33, etc.

[0096] also, Fig.10 The input column 125 of the effective range in the setting item group 122 of the polishing member PM is consistent with the setting of the above-mentioned effective range MM (refer to Figure 6C , Figure 8C ) Similarly, the user can also input in the setting input screen 120.

[0097] On the other hand, as the setting item group 123 of the probe card 32, setting items such as bare chip size and bare chip number can be cited. The bare chip size is the interval between each semiconductor device set in order to make each probe 33 contact each semiconductor device (DUT) of the wafer W. The bare chip number is the number of each semiconductor device that each probe 33 can contact. In addition, the bare chip size and bare chip number setting can also be configured to be automatically set by the setting computer 80 by inputting the identification number of the probe card.

[0098] The mode setting item group 124 operates the mode setting unit 806 based on the user's operation to set the operation mode of the table 40 having the grinding member PM during the pin grinding process. As the mode setting item group 124 of the setting input screen 120, a pull-down mode selection button 126 for selecting the operation mode and a setting button 127 for displaying the above-mentioned mode setting screen 130 can be cited. Next, the setting of the operation mode during the pin grinding process will be described in detail.

[0099] like Fig. 12AAs shown, the mode selection button 126 of the mode setting item group 124 allows the user to select the action mode of the workbench 40 equipped with the grinding member PM during the pin grinding process. As options of the mode selection button 126, there can be cited an up-down option 230, a left-right option 231, a tilt option 232, a hexagonal option 233, and a square option 234. The up-down option 230 sets the up-down action mode (first direction mode) in which the grinding member PM moves back and forth in the up-down direction (X-axis direction). The left-right option 231 sets the left-right action mode (second direction mode) in which the grinding member PM moves back and forth in the left-right direction (Y-axis direction). The tilt option 232 sets the tilt action mode (tilted direction mode) in which the grinding member PM moves back and forth in a direction tilted relative to the X-axis and the Y-axis. The hexagonal option 233 sets the hexagonal action mode (circling direction mode) in which the grinding member PM moves in a circular manner in a hexagonal manner. The square option 234 sets the quadrilateral action mode (circling direction mode) in which the grinding member PM moves in a circular manner in a quadrilateral manner.

[0100] like Fig. 12B As shown, the mode setting screen 130 has a plurality of parameters 131 of the operation mode of the polishing member PM, and a plurality of input fields 132 arranged below each parameter 131 and for the user to input. Examples of the plurality of parameters 131 include speed, X-axis dimension, Y-axis dimension, line dimension, angle, and the like.

[0101] The speed input column 132 is a column for setting the moving speed of the action mode selected by the mode selection button 126. The X-axis size input column 132 is a column for setting the amount of movement in the X-axis direction in the action mode selected by the mode selection button 126. Similarly, the Y-axis size input column 132 is a column for setting the amount of movement in the Y-axis direction in the action mode selected by the mode selection button 126. The line size is a column for setting the length of the trajectory (the length of the entire amount of movement) of the action mode selected by the mode selection button 126. The angle is a column for setting the angle of inclination relative to the X-axis or Y-axis in the action mode set by the mode selection button 126. In this way, the mode setting unit 806 allows the user to set various parameters of the action mode, thereby grinding the grinding member PM in contact with each probe 33 according to the desired action mode during the needle grinding process.

[0102] In addition, the setting of the operation mode of the polishing member PM is not limited to the setting via the mode selection button 126 and the mode setting screen 130, and various setting methods can be adopted. Fig.13A as well as Fig. 13BAs shown, the mode setting unit 806 may be configured to display a free mode setting screen 130A on which the user manually draws an operation mode. Thus, during the pin grinding process, the inspection device 10 can operate the grinding member PM according to the operation mode drawn by the user.

[0103] Specifically, the free mode setting screen 130A displays a handwriting section 133 having a grid in a square shape on the substantially entire free mode setting screen 130A. On the free mode setting screen 130A, for example, the user directs the pointer 134 to any grid and performs a drag-and-drop operation, thereby generating an operation mode of the polishing member PM. In addition, the handwriting section 133 is not limited to a grid, and the user may also draw a free line.

[0104] As an example, the user places the pointer 134 at the start position of grinding, and moves the pointer 134 in a given direction (in Figure 8B The pointer 134 is moved to the desired position and released at the desired position. Thus, a trajectory 135 of the grinding member PM in the upward direction can be set. In addition, the mode setting unit 806 can set a non-contact action in which the grinding member PM moves in a non-contact (separated state) manner with each probe 33 in the action mode. For example, after drawing the trajectory of the action mode and releasing it, the pointer 134 is moved to the desired position and the mouse 85 is dragged and dropped again. Thus, the interval from release to dragging again can be set as a trajectory 136 of the non-contact action of the grinding member PM leaving each probe 33. Furthermore, the user can draw the trajectory 137 of the action mode by dragging and dropping again.

[0105] As described above, the operation mode of the polishing member PM is freely designed using the handwriting unit 133, and the control device 90 that sets the polishing content can operate the polishing member PM according to the user's operation mode during the needle polishing process.

[0106] The polishing content of the pin grinding process is completed by setting the area and the operation mode. Before sending the setting information SI of the polishing content to the inspection device 10, the setting computer 80 can simulate the set polishing content. Figure 4 The simulation unit 807 shown in FIG. 1 performs a simulation of grinding based on the set grinding content based on the user's operation to perform the simulation. Specifically, the user operation Figure 5 The simulated display group 141 of the main screen 110 is shown.

[0107] The simulation display group 141 includes a start button 142 for starting simulation, an actual status graph 143 showing the execution status of the simulation, a reset button 144, and a stop and play button 145. When the user presses the start button 142, the simulation unit 807 starts simulation according to the set grinding content.

[0108] like Fig.14A As shown, in the simulation based on the simulation unit 807, a plurality of frames 241 are formed in units of semiconductor devices of the wafer W inspected by each probe 33, and the plurality of frames 241 are moved along the set action pattern. In addition, in the needle grinding process, while grinding along the set action pattern, the action of changing the position of the grinding member PM contacted by each probe 33 is performed. Therefore, the simulation unit 807 calculates the movement area of ​​the plurality of frames 241 that move relative to the grinding member PM based on the action pattern corresponding to the grinding content and the movement of the position of the grinding member PM.

[0109] Then, the simulation unit 807 displays the calculated trajectory of the moving area on the simulation display screen 140 in real time. Fig. 14B As shown, the simulation unit 807 can allow the user to visually confirm the use range 242 actually used in the polishing member PM, that is, the movement area of ​​the plurality of frames 241 .

[0110] More specifically, if Fig.15 As shown, the simulation display screen 140 displays a grinding area frame 243 representing the grinding member PM in advance in the simulation, and forms a plurality of grids 244 corresponding to the units of the chips (semiconductor devices of the wafer W) of each probe 33. The inside of the grinding area frame 243 is a display format in which a plurality of square areas 245 are arranged in a matrix shape by a plurality of grids 244. The simulation unit 807 performs a plurality of frames 241 (see FIG. 1 ) based on the action mode corresponding to the grinding content and the movement of the position of the grinding member PM. Fig.14A ) of the moving area, and fills the grid area 245 according to the trajectory calculated by simulation. Thus, the simulation display screen 140 can display the range actually used in the polishing member PM in real time.

[0111] For example, immediately after the simulation starts, a smaller number of grid areas 245 are filled as the polishing member PM initially polishes each probe 33. In addition, during the simulation, the actual status chart 143 displays the progress of the simulation by horizontal bars extending in the transverse direction, and immediately after the simulation starts, the horizontal bars become shorter.

[0112] As the simulation progresses, Fig.16As shown, as the grinding member PM moves, each probe 33 contacts the entire grinding member PM. Therefore, a large number of grid areas 245 are filled. When the simulation ends, the simulation display screen 140 can indicate the use range 242 of the grinding member PM for grinding (the range of contact of each probe 33) through the range in which multiple grid areas 245 are filled. In addition, as described above, the grinding member PM arranged on the workbench 40 repeatedly moves back and forth based on the set action mode while changing the position of the grinding member PM. Therefore, the simulation display screen 140 can also change the filling state of each grid area 245 according to the contact frequency with the grinding member PM. For example, the following situation can be cited: when the contact frequency is low, the filled color is displayed lighter, and on the other hand, as the contact frequency increases, the filled color is displayed darker.

[0113] As described above, the simulation unit 807 forms a plurality of frames 241 (see FIG. 24A ) that move relative to the polishing member PM in units of semiconductor devices of the wafer W in the simulation. Fig.17A ). However, each frame 241 is larger in size than each probe 33 that is actually polished, and when simulating the movement of each frame 241, the trajectory is drawn in an area larger than the trajectory of each probe 33 being polished.

[0114] Therefore, if Fig. 17B As shown, the simulation unit 807 may calculate the trajectory corresponding to each probe 33 instead of using the frame 241 of the semiconductor device unit of the wafer W. For example, in the simulation display screen 140A, a plurality of plotted points 250 corresponding to each probe 33 are arranged instead of the frame 241. The simulation unit 807 calculates the trajectory of each plotted point 250 in the simulation. Therefore, the use range of the polishing member PM is different when the simulation is performed by arranging a plurality of frames 241 and when the simulation is performed by arranging a plurality of plotted points 250.

[0115] That is, Fig.17A As shown in FIG. 1 , when a plurality of frames 241 are used, even if the frame 241 is moved to the outer edge of the polishing member PM, the actual probe 33 may be located at a position inside the outer edge of the polishing member PM. Fig. 17B As shown, when using a plurality of plotted points 250, the plurality of plotted points 250 can be moved to the vicinity of the outer edge of the polishing member PM, and simulation can be performed from this position. Thus, the setting computer 80 can generate setting information SI for polishing until the vicinity of the outer edge of the polishing member PM, and by using this setting information SI, the polishing member PM can be used efficiently.

[0116] In addition, the simulation unit 807 may also be configured to determine whether there is an abnormality in the grinding content set by the user based on the use state of the grinding member PM calculated accompanying the simulation. For example, the following case can be cited: in the simulation, when the use range 242 used for grinding exceeds the set grinding area, the grinding content is determined to be abnormal. Alternatively, the simulation unit 807 may also determine the grinding content to be abnormal when the use range 242 is too concentrated in a part of the grinding member PM. This is because, when the use range 242 is too concentrated, the life of the grinding member PM will be shortened.

[0117] Furthermore, the user can stop the simulation at an appropriate timing by operating the stop and play button 145 while watching the simulation display screen 140, and can also restart the simulation after stopping. In addition, for example, when the user himself determines that an abnormality occurs during the simulation, the simulation can be terminated by operating the reset button 144.

[0118] Then, the user can reset the grinding area or reset the action mode by operating the area setting display group 111 based on the result or process of the simulation. By simulating again with the reset grinding content, it is possible to adjust to the grinding content more desired by the user. That is, in the setting computer 80, the setting of the grinding area, the setting of the action mode, and the simulation can be repeated multiple times. In this way, the setting computer 80, as an external device different from the inspection device 10, can set the grinding content of the needle grinding process to the user's inherent settings, and set the grinding content (scheme) to the inspection device 10.

[0119] In addition, the setting computer 80 can also read (import) the data of the grinding content generated in the past and use the past grinding content to perform editing. Figure 5 The data button 115 of the main screen 110 shown in the figure can display a screen (not shown) for accessing a folder storing data of past grinding contents, so that the user can select past grinding contents. Alternatively, the display screen generator 803 can also display simplified versions of a plurality of past grinding contents at a glance based on the operation of the data button 115, so that the user can select grinding contents.

[0120] In addition, in the above-mentioned embodiment, the inspection device 10 having one tester 30 and one workbench 40 is described. However, as long as it is a device capable of performing the pin grinding process, its structure is not particularly limited, and for example, it may be an inspection device having a plurality of testers 30 (not shown). In this case, by sending the grinding content set in the setting computer 80 to the inspection device, the inspection device can perform the pin grinding process according to the grinding content on each probe 33 of the probe card 32 installed in each tester 30. Alternatively, the processing system 1 may also be configured to have a dedicated device that only performs the pin grinding process on each probe 33, and the setting computer 80 sets the grinding content for the dedicated device.

[0121] The technical ideas and effects of the present invention described in the above embodiments are described below.

[0122] [1]: An information processing device (setting computer 80) which sets the grinding content of a probe 33 in contact with an object to be inspected, the information processing device comprising: an area setting unit 805 which sets the grinding area in a grinding member PM for grinding the probe 33; a mode setting unit 806 which sets the action mode of the probe 33 during grinding; and a simulation unit 807 which calculates the relative trajectory of the grinding member PM and the probe 33 based on the set grinding area and the set action mode.

[0123] According to the above content, the information processing device (setting computer 80) can simply and in detail set the grinding content in the needle grinding process for grinding the probe 33. In particular, the information processing device prepared outside the control device 90 can suppress the restriction of the setting method of each device and the increase of the man-hour caused by developing each device by setting the grinding content of the needle grinding process, and can realize a design with a high degree of freedom. That is, the information processing device can make the setting of the grinding content of the probe common, and can realize the shortening of the man-hour.

[0124] [2]: The information processing device (setting computer 80) based on [1] includes a table 40 that moves the polishing member PM in three-dimensional directions and a control device that controls the movement of the table 40. The information processing device is connected to the inspection device 10 that actually polishes the probe 33, and sends the setting information SI set by the area setting unit 405 and the mode setting unit 406 to the inspection device 10. Thus, after the information processing device sets the polishing content of the needle polishing process for each of the plurality of inspection devices 10, the setting information of the polishing content is sent to the inspection device 10, so that the inspection device 10 can smoothly perform the needle polishing process of polishing the probe.

[0125] [3]: In the information processing device (setting computer 80) based on [1] or [2], the area setting unit 805 can set a plurality of divided areas that divide the polishing area. Thus, even when a plurality of polishing members PM are used to polish the probe, the areas of the plurality of polishing members PM can be set in detail.

[0126] [4]: In the information processing device (setting computer 80) based on any one of [1] to [3], the area setting unit 805 can set the effective range of the polishing member PM that is effective for polishing the probe 33 to the inside of the polishing area. In this way, the effective range of the polishing member PM can be appropriately set, and the entire polishing member PM can be effectively used in the needle polishing process.

[0127] [5]: In the information processing device (setting computer 80) based on any one of [1] to [4], the area setting unit 805 can set the polishing area by dragging and dropping the display input device 82 connected to the information processing device. Thus, the information processing device can easily set the polishing area.

[0128] [6]: In the information processing device (setting computer 80) based on any one of [1] to [5], the mode setting unit 806 allows the user to select a plurality of operation modes. Thus, the information processing device can easily set the operation mode of the polishing process.

[0129] [7]: In the information processing device (setting computer 80) based on [6], the multiple action modes include: a first direction mode (up-down action mode) in which the grinding member PM moves back and forth in a first direction; a second direction mode (left-right action mode) in which the grinding member PM moves back and forth in a second direction orthogonal to the first direction; an inclined direction mode in which the grinding member PM moves back and forth in a direction inclined relative to the first direction and the second direction; and a circumferential direction mode (hexagonal action mode, square action mode) in which the grinding member PM moves circumferentially along a polygonal shape. Thus, the information processing device can selectively perform various action modes in the needle grinding process.

[0130] [8]: In the information processing device (setting computer 80) based on any one of [1] to [7], the mode setting unit 806 can set the operation mode by dragging and dropping the display input device 82 connected to the information processing device. Thus, the information processing device can easily set the operation mode desired by the user.

[0131] [9]: In the information processing device (setting computer 80) based on any one of [1] to [8], the simulation unit 807 forms a plurality of frames 241 corresponding to the object to be inspected, calculates the trajectories of the plurality of frames 241 that move relatively with the movement of the polishing member PM, and displays the calculated trajectories of the plurality of frames 241 on the display input device 82 connected to the information processing device. Thus, a user who visually confirms the result of the simulation can easily understand the portion of the polishing member PM that is actually being polished.

[0132]

[10] : In the information processing device (setting computer 80) based on any one of [1] to [8], the simulation unit 807 forms a plurality of plotted points 250 corresponding to the plurality of probes 33, calculates the trajectories of the plurality of plotted points 250 that move relatively with the movement of the polishing member PM, and displays the calculated trajectories of the plurality of plotted points 250 on the display input device 82 connected to the information processing device. Thus, the information processing device can perform a simulation corresponding to the polishing of the plurality of probes. In addition, in the setting, the range of contact between the polishing member PM and each probe can be expanded, and the polishing member PM can be effectively used.

[0133]

[11] : A display input device 82, which has a display screen 100 for displaying the grinding content of the probe 33 in contact with the inspection object, and the grinding content is set by user operation based on the display screen 100, wherein the display screen 100 includes: an area setting screen (setting input screen 120), which sets the grinding area in the grinding member PM for grinding the probe 33; a mode setting screen 130, which sets the action mode of the probe 33 during grinding; and a simulation display screen 140, which displays the relative trajectory of the grinding member PM and the probe 33 calculated based on the set grinding area and the set action mode.

[0134]

[12] : A program 87p for setting the grinding content of a probe 33 in contact with an object to be inspected, the program causing an information processing device (setting computer 80) to perform the following steps: a step of setting a grinding area in a grinding member PM for grinding the probe 33; a step of setting an action mode for grinding the probe 33; and a step of calculating the relative trajectory of the grinding member PM and the probe 33 based on the set grinding area and the set action mode.

[0135] The information processing device, display input device, and program involved in the embodiments disclosed herein are illustrative in all respects and are not restrictive. The embodiments can be modified and improved in various ways without departing from the scope of the attached claims and their gist. The matters described in the above-mentioned multiple embodiments can adopt other structures within the scope of non-contradiction, and can also be combined within the scope of non-contradiction.

[0136] This application claims the priority of basic application No. 2022-091873 filed in the Japan Patent Office on June 6, 2022, the entire contents of which are incorporated herein by reference.

[0137] Explanation of symbols

[0138] 10: Check the device

[0139] 33: Probe

[0140] 80: Setting computer

[0141] 805: Area Setting Department

[0142] 806: Mode setting unit 806

[0143] 807: Simulation Department

[0144] PM: grinding member.

Claims

1. An information processing device for setting polishing contents of a probe in contact with an object to be inspected, comprising: an area setting unit for setting a polishing area in a polishing member for polishing the probe; A mode setting unit for setting an operation mode of the probe during grinding; as well as A simulation unit calculates a relative trajectory between the polishing member and the probe based on the set polishing area and the set operation mode.

2. The information processing device according to claim 1, wherein: The information processing device comprises: a worktable that moves the grinding member in three dimensions; and A control device, which controls the movement of the workbench, The information processing device is connected to an inspection device that actually grinds the probe, and transmits setting information set by the area setting unit and the mode setting unit to the inspection device.

3. The information processing device according to claim 1, wherein: The region setting unit can set a plurality of divided regions obtained by dividing the polishing region.

4. The information processing device according to claim 1, wherein: The region setting unit can set an effective range of the polishing member that is effective for polishing the probe inside the polishing region.

5. The information processing device according to claim 1, wherein: The region setting unit can set the polishing region by a drag-and-drop operation of a display input device connected to the information processing device.

6. The information processing device according to any one of claims 1 to 5, wherein: The mode setting unit allows a user to select a plurality of the operation modes.

7. The information processing device according to claim 6, wherein: The various action modes include: A first direction mode causes the grinding member to reciprocate in a first direction; a second direction mode, causing the grinding member to reciprocate in a second direction orthogonal to the first direction; an inclined direction mode, causing the polishing member to reciprocate in a direction inclined relative to the first direction and the second direction; and The circumferential direction mode causes the grinding member to move circumferentially along a polygonal shape.

8. The information processing device according to any one of claims 1 to 5, wherein: The mode setting unit can set the operation mode by a drag-and-drop operation of a display input device connected to the information processing device.

9. The information processing device according to any one of claims 1 to 5, wherein: The simulation unit forms a plurality of frames corresponding to the inspection object, calculates trajectories of the plurality of frames that relatively move along with the operation of the polishing member, and displays the calculated trajectories of the plurality of frames on a display input device connected to the information processing device.

10. The information processing device according to any one of claims 1 to 5, wherein: The simulation unit forms a plurality of plot points corresponding to the plurality of probes, calculates trajectories of the plurality of plot points that relatively move with the movement of the polishing member, and displays the calculated trajectories of the plurality of plot points on a display input device connected to the information processing device.

11. A display input device having a display screen for displaying grinding contents of a probe in contact with a subject, wherein the grinding contents are set by a user's operation based on the display screen, The display screen includes: An area setting screen for setting a grinding area in a grinding member for grinding the probe; A mode setting screen is used to set the operation mode of the probe during grinding; as well as The simulation display screen displays the relative trajectory of the polishing member and the probe calculated based on the set polishing area and the set operation mode.

12. A program for setting polishing contents of a probe in contact with an object to be inspected, the program causing an information processing device to execute the following steps: a step of setting a grinding area in a grinding member for grinding the probe; The step of setting the operation mode of the probe during grinding; as well as The step of calculating a relative trajectory between the polishing member and the probe based on the set polishing area and the set operation mode.

Images