Light and thin semiconductor packaging device

Abstract

The invention relates to a light and thin semiconductor packaging device, and belongs to the technical field of semiconductor packaging, the light and thin semiconductor packaging device comprises a mounting base, a uniform smearing assembly, a dust removal assembly, an exhaust assembly and a cooling assembly, mounting plates are fixedly mounted on two sides of the upper end of a first workbench, the uniform smearing assembly is fixedly mounted at one end of each mounting plate, and the dust removal assembly is mounted on one side of a second U-shaped plate; the exhaust assembly is installed on the other side of the second U-shaped plate, a third U-shaped plate is fixedly installed at the upper end of the third working table, an upper mold is installed at one end of the third U-shaped plate, the cooling assembly is installed in the upper mold, a base plate can be evenly coated with glue by moving a baffle and moving an L-shaped scraper in a reciprocating mode at the same time, and the sealing performance of the light and thin semiconductor is improved; according to the chip welding device, the chip can be welded, dust, dust and other impurities attached to the surface of the chip can be sucked through the dust suction pipe, the welding effect is improved, meanwhile, harmful gas generated by welding is sucked and purified through the air suction pipe, plastic-packaged light and thin semiconductors can be rapidly cooled, and therefore the working efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a light and thin semiconductor packaging device. Background Art

[0002] Semiconductor packaging refers to the process of connecting the pins of the semiconductor chip to the external protection box. Generally, the wafer is cut into small chips first, and then the cut chips are glued to the corresponding substrate frame, and then the bonding pads of the chips are connected to the corresponding pins of the substrate using metal wires to form the required circuit; then the independent chips are plastic-sealed, and the finished products are tested after packaging, and finally put into storage for shipment. The packaged chip can better resist the influence of the external environment and connect with other circuits. It plays a vital role in semiconductor manufacturing. It not only protects the chip from mechanical and environmental damage, but also provides electrical connection and heat dissipation.

[0003] For example, the announcement number is: CN221157434U, a semiconductor packaging device, including: a workbench, and a first threaded screw, and the surface of the first threaded screw is provided with a first slider, a top plate is added to the top center of the workbench and connected to the first slider; a second threaded screw, and the surface is provided with a second slider, the bottom of the second slider is installed with an electric telescopic rod; a U-shaped frame, and the front and rear ends of the bottom are provided with a dispensing head. The semiconductor packaging device drives the top plate and its connecting structure to reciprocate left and right through the first threaded screw and the first slider, the second threaded screw and the second slider drive the U-shaped frame and the dispensing head to reciprocate back and forth, and the electric telescopic rod drives the dispensing head to descend to dispense glue to the semiconductor. In this way, the semiconductor can be fully dispensed without moving the semiconductor.

[0004] Common semiconductor packaging devices can be used to package semiconductors, but when dispensing glue, it is difficult for the glue dispenser to evenly apply glue to the edges of the substrate, which leads to gaps after packaging and reduces the sealing of the semiconductor. During the welding operation, the workpiece is easily attached to dust, dirt and other impurities on the surface during movement, affecting the welding effect. In addition, when the chip is plastic-sealed, the cooling effect is poor and the effect is low. Summary of the invention

[0005] In order to overcome the technical defects of the prior art, the present invention provides a light and thin semiconductor packaging device, which can achieve the purpose of evenly coating glue on the edge of the substrate, improving the sealing of the semiconductor and improving the cooling effect during plastic sealing.

[0006] The technical solution adopted by the present invention is: it includes a mounting base with support columns distributed in a rectangular shape installed at the lower end, a uniform coating component, a dust removal component, an exhaust component and a cooling component, a first workbench is fixedly installed on one side of the upper end of the mounting base, mounting plates are fixedly installed on both sides of the upper end of the first workbench, the uniform coating component is fixedly installed on one end of the mounting plate, a first U-shaped plate is fixedly installed on the upper end of the mounting plate, a dispensing machine is fixedly installed on one end of the first U-shaped plate, a second workbench is fixedly installed at the middle position of the upper end of the mounting base, a conveyor belt is fixedly installed at the middle position of the upper end of the second workbench, movable limiting plates are installed on both sides of the upper end of the second workbench through driving members, a second U-shaped plate is fixedly installed on the upper end of the second workbench, a welding head is installed at one end of the second U-shaped plate, the dust removal component is installed on one side of the second U-shaped plate, the exhaust component is installed on the other side of the second U-shaped plate, the dust removal component is linked to the exhaust component, a third workbench is fixedly installed on the other side of the upper end of the mounting base, a third U-shaped plate is fixedly installed on the upper end of the third workbench, and the third U-shaped plate is fixedly installed on one side of the third U-shaped plate. An upper mold is installed at the end, a lower mold is fixedly installed at the middle position of the upper end of the third workbench, the cooling assembly is installed inside the upper mold, the upper mold is linked to the exhaust assembly, an integrated control panel is fixedly installed at one end of the second U-shaped plate, the welding head and the glue dispenser are electrically connected to the integrated control panel, when in use, the integrated control panel is an existing device, a controller is arranged inside, which is used to control each component, the welding head and the glue dispenser are both existing structures, which are used to weld and dispense glue on the wafer, the upper mold and the lower mold are used to plastic seal the semiconductor, an injection hole is opened at the upper end of the upper mold, the upper mold is driven by a cylinder, the cooling assembly is used to quickly cool the plastic-sealed semiconductor, the dust removal assembly is used to clean dust and other impurities attached to the surface of the wafer, the exhaust assembly is used to absorb harmful gases generated during welding, the driving member is used to move the limit plate, the limit plate is used to limit the wafer, the conveyor belt is an existing device, which is used to move the wafer, and the uniform coating assembly is used to evenly coat glue on the substrate.

[0007] Preferably, in order to enable the baffle to move, the uniform smearing assembly includes a first threaded rod, a round rod and a symmetrically arranged round tube, the round tube is fixedly mounted on one end of the mounting plate, a moving rod is inserted inside the round tube, a baffle is fixedly mounted on one end of the moving rod, a lead screw driven by a first motor is rotatably mounted on one end of the mounting plate, the lead screw is threadedly connected to the moving rod, guide rods are inserted on both sides of one end of the mounting plate, and the guide rods are fixedly connected to the baffle, the first motor is a servo motor, fixedly mounted on one end of the mounting plate, the first motor is electrically connected to the integrated control panel, the moving rod can move in the round tube, and the guide rods play a limiting role.

[0008] Preferably, in order to enable the L-shaped scraper to move smoothly, a square groove is provided on the upper end of the baffle, the first threaded rod is rotatably installed in the square groove, the L-shaped scraper is clamped in the square groove, the first threaded rod is threadedly connected to the L-shaped scraper, the round rod is fixedly installed in the square groove, the L-shaped scraper is sleeved on the outside of the round rod, a second motor is fixedly installed at one end of the L-shaped scraper, the output end of the second motor is fixedly connected to the first threaded rod, the second motor is used to drive the first threaded rod, the second motor is a servo motor, the second motor is electrically connected to the integrated control panel, the L-shaped scraper can move in the square groove, and the round rod plays a guiding role.

[0009] Preferably, in order to enable the L-shaped scrapers to move simultaneously, a slot is provided at one end of the L-shaped scraper, and a block is fixedly installed at one end of the other side of the L-shaped scraper, and the size of the block matches the size of the slot.

[0010] Preferably, in order to enable the limit plate to move, the driving member includes a second threaded rod with a handwheel installed at one end, sliding grooves are opened on both sides of the upper end of the second workbench, sliding blocks are clamped in the sliding grooves, the sliding blocks are fixedly connected to the limit plate, the second threaded rod is rotatably installed in the sliding groove, and the sliding block is threadedly connected to the second threaded rod, and the handwheel is fixedly installed at one end of the second threaded rod for rotating the second threaded rod.

[0011] Preferably, in order to absorb harmful gases generated by welding, the exhaust assembly includes a meandering ventilation plate, a fan and a dust screen, the meandering ventilation plate is fixedly mounted on one end of the second U-shaped plate, the dust screen and the fan are installed in the meandering ventilation plate in a front-to-back distribution, the fan is electrically connected to the integrated control panel, a first collecting box is installed on one side of the second U-shaped plate, an activated carbon adsorption net is installed inside the first collecting box, one end of the first collecting box is connected to the meandering ventilation plate through a first air supply pipe, a first solenoid valve is installed at one end of the first air supply pipe, the first solenoid valve is electrically connected to the integrated control panel, the integrated control panel is used to control the fan switch, and the activated carbon adsorption net is used to purify harmful gases.

[0012] Preferably, in order to facilitate the absorption of harmful gases, an air suction box with an air storage cavity opened inside is fixedly installed on the outside of the welding head, and air suction pipes are installed in a circular array at one end of the air suction box, one end of the air suction pipe is connected to the air storage cavity, and the air storage cavity is connected to the first collecting box through a pipe.

[0013] Preferably, in order to clean dust and other impurities attached to the surface of the chip, the dust removal assembly includes a second collecting box and a dust conveying pipe, the second collecting box is fixedly mounted on one side of the second U-shaped plate, a dust collecting plate is plugged into one end of the second collecting box, one end of the second collecting box is connected to the circular ventilation plate through a second air conveying pipe, a second solenoid valve is installed at one end of the second air conveying pipe, the second solenoid valve is electrically connected to the integrated control panel, the dust conveying pipe is connected to the second collecting box through a pipeline, one end of the dust conveying pipe is fixedly connected to the second U-shaped plate, and a dust suction plate with a dust storage cavity is fixedly mounted on the other end of the dust conveying pipe, a dust suction plate with a dust storage cavity is opened in a linear array at one end of the dust suction plate, one end of the dust suction pipe is connected with the dust storage cavity, the dust suction pipe is used to absorb impurities, a dust collecting net is arranged inside the dust collecting plate for collecting dust, and the integrated control panel can control the switch of the second solenoid valve.

[0014] Preferably, in order to quickly cool the plastic-sealed semiconductor, the cooling assembly includes a third air duct, ventilation grooves are provided at one end of the upper mold and the lower mold, the ventilation grooves are connected to the circular ventilation plate through the third air duct, air inlet holes are provided on one side of the upper mold and the lower mold, a third solenoid valve is installed at one end of the third air duct, the third solenoid valve is electrically connected to the integrated control panel, and the integrated control panel can control the switch of the third solenoid valve.

[0015] The beneficial effects of the present invention are: 1. The present invention limits the glue dispensing position by simultaneously moving the baffle, and then reciprocates the L-shaped scraper to evenly coat the substrate with glue, thereby avoiding gaps after packaging and improving the sealing of thin semiconductors.

[0016] 2. The present invention starts the fan and first absorbs impurities such as dust and dirt attached to the surface of the chip through the suction pipe, so that the surface of the chip remains clean and tidy, improving the welding effect. At the same time, the harmful gas generated by welding is absorbed and purified through the suction pipe to avoid damage to the health of the workers.

[0017] 3. The present invention conveys external air into the ventilation slots through the air inlet holes, quickly cooling down the plastic-sealed thin semiconductor, thereby improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 It is a schematic diagram of the connection structure of the first workbench of the present invention.

[0020] Figure 3 It is a schematic diagram of the connection structure of the uniform coating component of the present invention.

[0021] Figure 4 It is a schematic diagram of the baffle connection structure of the present invention.

[0022] Figure 5 It is a schematic diagram of the connection structure of the third workbench of the present invention.

[0023] Figure 6 It is a schematic diagram of the connection structure of the second workbench of the present invention.

[0024] Figure 7 It is a schematic diagram of the second threaded rod connection structure of the present invention.

[0025] Figure 8 It is a schematic diagram of the connection structure of the dust removal component of the present invention.

[0026] Fig. 9 It is a schematic diagram of the exhaust assembly connection structure of the present invention.

[0027] Fig.10 It is a schematic diagram of the connection structure of the cooling assembly of the present invention.

[0028] Explanation of the accompanying drawings: In the figure: 1, mounting base; 2, uniform smearing assembly; 201, first threaded rod; 202, round rod; 203, round tube; 204, moving rod; 205, baffle; 206, first motor; 207, lead screw; 208, guide rod; 209, square groove; 210, L-shaped scraper; 211, second motor; 212, slot; 213, block; 3, dust removal assembly; 301, second collection box; 302, dust conveying pipe; 303, second air conveying pipe; 304, dust storage chamber; 305, dust suction plate; 306, dust suction pipe; 4, exhaust assembly; 401, round ventilating plate; 402, fan ;403, dustproof net;404, first collecting box;405, first air duct;406, air storage chamber;407, air suction box;408, air suction pipe;5, cooling assembly;501, third air duct;502, ventilation slot;503, air inlet;6, first workbench;7, mounting plate;8, first U-shaped plate;9, dispensing machine;10, second workbench;11, conveyor belt;12, limit plate;13, second U-shaped plate;14, welding head;15, third workbench;16, third U-shaped plate;17, upper mold;18, lower mold;19, integrated control panel;20, second threaded rod;21, sliding block. DETAILED DESCRIPTION

[0029] The present invention is further described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] like Figure 1-Figure 10As shown, the present embodiment provides a thin and light semiconductor packaging device, including a mounting base 1 with support columns distributed in a rectangular shape installed at the lower end, a uniform coating component 2, a dust removal component 3, an exhaust component 4 and a cooling component 5, a first workbench 6 is fixedly installed on one side of the upper end of the mounting base 1, mounting plates 7 are fixedly installed on both sides of the upper end of the first workbench 6, the uniform coating component 2 is fixedly installed on one end of the mounting plate 7, a first U-shaped plate 8 is fixedly installed on the upper end of the mounting plate 7, a glue dispenser 9 is fixedly installed on one end of the first U-shaped plate 8, a second workbench 10 is fixedly installed at the middle position of the upper end of the mounting base 1, a conveyor belt 11 is fixedly installed at the middle position of the upper end of the second workbench 10, movable limit plates 12 are installed on both sides of the upper end of the second workbench 10 through driving members, and the second workbench 10 A second U-shaped plate 13 is fixedly installed on the upper end, a welding head 14 is installed on one end of the second U-shaped plate 13, a dust removal component 3 is installed on one side of the second U-shaped plate 13, an exhaust component 4 is installed on the other side of the second U-shaped plate 13, the dust removal component 3 is linked with the exhaust component 4, a third workbench 15 is fixedly installed on the other side of the upper end of the mounting seat 1, a third U-shaped plate 16 is fixedly installed on the upper end of the third workbench 15, an upper mold 17 is installed on one end of the third U-shaped plate 16, a lower mold 18 is fixedly installed in the middle position of the upper end of the third workbench 15, a cooling component 5 is installed inside the upper mold 17, the upper mold 17 is linked with the exhaust component 4, an integrated control panel 19 is fixedly installed on one end of the second U-shaped plate 13, and the welding head 14 and the dispensing machine 9 are both electrically connected to the integrated control panel 19 The second workbench 10 is provided with a sliding groove on both sides of the upper end thereof, and a sliding block 21 is clamped in the sliding groove. The sliding block 21 is fixedly connected to the limiting plate 12, and the second threaded rod 20 is rotatably installed in the sliding groove, and the sliding block 21 is threadedly connected to the second threaded rod 20. When in use, the cut wafer is first placed on the first workbench 6, and the glue dispenser 9 is started through the integrated control panel 19 to apply glue to the substrate. At the same time, the glue is evenly applied to the substrate through the uniform application component 2 to avoid gaps after packaging and improve the sealing of thin semiconductors. After pasting, heating is performed. After heating, the substrate and the wafer are placed on the second workbench 10, and the first workbench 10 is manually rotated through the handwheel. The second threaded rod 20 enables the sliding block 21 to move in the sliding groove, and the limiting plate 12 moves accordingly to limit the substrate and the chip, and then the conveyor belt 11 is started to move the substrate and the chip. The dust removal component 3 absorbs impurities such as dust and dust attached to the surface of the chip to keep the surface of the chip clean and tidy to improve the welding effect. Then the welding head 14 is started through the integrated control panel 19 to weld it. At the same time, the harmful gas generated by the welding is absorbed and purified through the exhaust component 4 to avoid damage to the body of the staff. After the welding is completed, it is moved to the lower mold 18 on the third workbench 15, and the upper mold 17 is moved by the cylinder for injection molding. After the injection molding is completed, the semiconductor is quickly cooled by the cooling component 5 to improve the work efficiency.

[0031] like Figure 3 As shown, the uniform smearing assembly 2 includes a first threaded rod 201, a round rod 202 and a symmetrically arranged round tube 203, the round tube 203 is fixedly mounted at one end of the mounting plate 7, a moving rod 204 is inserted inside the round tube 203, a baffle 205 is fixedly mounted at one end of the moving rod 204, a lead screw 207 driven by a first motor 206 is rotatably mounted at one end of the mounting plate 7, the lead screw 207 is threadedly connected to the moving rod 204, and guide rods 204 are inserted on both sides of one end of the mounting plate 7 08, and the guide rod 208 is fixedly connected to the baffle 205, a square groove 209 is opened at the upper end of the baffle 205, the first threaded rod 201 is rotatably installed in the square groove 209, an L-shaped scraper 210 is clamped in the square groove 209, the first threaded rod 201 is threadedly connected with the L-shaped scraper 210, the round rod 202 is fixedly installed in the square groove 209, the L-shaped scraper 210 is sleeved on the outside of the round rod 202, and a second motor is fixedly installed at one end of the L-shaped scraper 210 211, the output end of the second motor 211 is fixedly connected to the first threaded rod 201, a slot 212 is provided at one end of the L-shaped scraper 210, and a block 213 is fixedly installed at one end of the L-shaped scraper 210 on the other side. When in use, the L-shaped scraper 210 and the baffle 205 are both made of plastic. First, the first motor 206 is started through the integrated control panel 19 to drive the lead screw 207 to rotate, so that the moving rod 204 moves in the round tube 203, and the baffle 205 moves toward each other accordingly. The guide rod 208 plays a limiting role to limit the dispensing position. At this time, the block 213 moves into the slot 212, and then dispensing is performed. After the dispensing is completed, the second motor 211 is started through the integrated control panel 19 to drive the first threaded rod 201 to rotate, so that the L-shaped scraper 210 moves back and forth in the square groove 209, so that the glue is evenly coated on the substrate, and then the wafer is adhered to the substrate. After completion, the L-shaped scraper 210 and the baffle 205 can be reset.

[0032] like Figure 8As shown, the dust removal component 3 includes a second collection box 301 and a dust conveying pipe 302, the second collection box 301 is fixedly installed on one side of the second U-shaped plate 13, one end of the second collection box 301 is plugged with a dust collecting plate, one end of the second collection box 301 is connected to the circular ventilation plate 401 through a second air conveying pipe 303, one end of the second air conveying pipe 303 is installed with a second solenoid valve, the second solenoid valve is electrically connected to the integrated control panel 19, the dust conveying pipe 302 is connected to the second collection box 301 through a pipeline, one end of the dust conveying pipe 302 is fixedly connected to the second U-shaped plate 13, and the other end of the dust conveying pipe 302 is fixedly installed with a dust storage chamber 3 provided inside 04, one end of the dust suction plate 305 is provided with a dust suction pipe 306 in a linear array, one end of the dust suction pipe 306 is connected with the dust storage chamber 304, when in use, the fan 402 is started by the integrated control panel 19, the second solenoid valve is opened, and the dust and other impurities attached to the surface of the chip are absorbed through the dust suction pipe 306, the impurities enter the dust storage chamber 304 through the dust suction pipe 306, and then are transported to the second collection box 301 through the dust conveying pipe 302, the internal dust collecting plate adsorbs the impurities, and the gas is transported to the circular ventilation plate 401 through the second air conveying pipe 303, and then discharged to the external environment.

[0033] like Fig. 9As shown, the exhaust assembly 4 includes a circular ventilation plate 401, a fan 402 and a dust screen 403. The circular ventilation plate 401 is fixedly mounted on one end of the second U-shaped plate 13. The dust screen 403 and the fan 402 are arranged front and back in the circular ventilation plate 401. The fan 402 is electrically connected to the integrated control panel 19. A first collecting box 404 is installed on one side of the second U-shaped plate 13. An activated carbon adsorption net is installed inside the first collecting box 404. One end of the first collecting box 404 is connected to the circular ventilation plate 401 through a first air duct 405. One end of the first air duct 405 A first solenoid valve is installed, and the first solenoid valve is electrically connected to the integrated control panel 19. An air suction box 407 with an air storage cavity 406 is fixedly installed on the outside of the welding head 14. An air suction pipe 408 is installed in a circumferential array at one end of the air suction box 407. One end of the air suction pipe 408 is connected to the air storage cavity 406. The air storage cavity 406 is connected to the first collecting box 404 through a pipeline. The cooling component 5 includes a third air supply pipe 501. Ventilation slots 502 are opened at one end of the upper mold 17 and the lower mold 18. The ventilation slots 502 are connected to the round-shaped ventilation plate 401 through the third air supply pipe 501. The upper mold 17 and the lower mold 18 are connected, and an air inlet hole 503 is opened on one side of the upper mold 17 and the lower mold 18. A third solenoid valve is installed at one end of the third air delivery pipe 501. The third solenoid valve is electrically connected to the integrated control panel 19. When in use, the fan 402 is started through the integrated control panel 19, and the first solenoid valve is opened. The harmful gas generated by welding is sucked into the gas storage chamber 406 through the suction pipe 408, and then transported to the first collection box 404 through the pipeline. The activated carbon adsorption net adsorbs the harmful substances in the gas. Multiple activated carbon adsorption nets can be set to improve the adsorption effect. The gas is transported to the circular ventilation plate 401 through the first air duct 405 and then discharged into the air to avoid damage to the body of the staff. When the injection-molded semiconductor needs to be cooled, the first solenoid valve and the second solenoid valve are closed through the integrated control panel 19, and the third solenoid valve is opened to transport the external cold air into the ventilation slot 502 through the air inlet hole 503. The generated hot air is transported to the circular ventilation plate 401 through the third air duct 501 and then discharged into the external environment, thereby completing the rapid cooling of the plastic-sealed thin semiconductor and improving work efficiency.

[0034] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for illustrating the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which shall fall within the scope of the present invention to be protected. The scope of protection of the present invention shall be defined by the attached claims and their equivalents.

Claims

1. A thin semiconductor packaging device, comprising a mounting base (1) with support columns arranged in a rectangular shape mounted at the lower end, a uniform coating component (2), a dust removal component (3), an exhaust component (4) and a cooling component (5), wherein a first workbench (6) is fixedly mounted on one side of the upper end of the mounting base (1), characterized in that: Mounting plates (7) are fixedly mounted on both sides of the upper end of the first workbench (6); the uniform smearing assembly (2) is fixedly mounted on one end of the mounting plate (7); a first U-shaped plate (8) is fixedly mounted on the upper end of the mounting plate (7); a glue dispenser (9) is fixedly mounted on one end of the first U-shaped plate (8); a second workbench (10) is fixedly mounted on the middle position of the upper end of the mounting seat (1); a conveyor belt (11) is fixedly mounted on the middle position of the upper end of the second workbench (10); movable limit plates (12) are mounted on both sides of the upper end of the second workbench (10) through a driving member; a second U-shaped plate (13) is fixedly mounted on the upper end of the second workbench (10); a welding head (14) is mounted on one end of the second U-shaped plate (13); and the dust removal assembly (3) is mounted on one side of the second U-shaped plate (13). The exhaust component (4) is mounted on the other side of the second U-shaped plate (13); the dust removal component (3) is linked to the exhaust component (4); a third workbench (15) is fixedly mounted on the other side of the upper end of the mounting seat (1); a third U-shaped plate (16) is fixedly mounted on the upper end of the third workbench (15); an upper mold (17) is mounted on one end of the third U-shaped plate (16); a lower mold (18) is fixedly mounted at the middle position of the upper end of the third workbench (15); the cooling component (5) is mounted inside the upper mold (17); the upper mold (17) is linked to the exhaust component (4); an integrated control panel (19) is fixedly mounted on one end of the second U-shaped plate (13); the welding head (14) and the dispensing machine (9) are both electrically connected to the integrated control panel (19).

2. The thin and light semiconductor package device according to claim 1, wherein: The uniform smearing assembly (2) comprises a first threaded rod (201), a round rod (202) and a symmetrically arranged round tube (203); the round tube (203) is fixedly mounted on one end of the mounting plate (7); a moving rod (204) is inserted into the inside of the round tube (203); a baffle (205) is fixedly mounted on one end of the moving rod (204); a lead screw (207) driven by a first motor (206) is rotatably mounted on one end of the mounting plate (7); the lead screw (207) is threadedly connected to the moving rod (204); guide rods (208) are inserted into both sides of one end of the mounting plate (7); and the guide rods (208) are fixedly connected to the baffle (205).

3. The thin and light semiconductor package device according to claim 2, wherein: A square groove (209) is provided at the upper end of the baffle (205); the first threaded rod (201) is rotatably mounted in the square groove (209); an L-shaped scraper (210) is clamped in the square groove (209); the first threaded rod (201) and the L-shaped scraper (210) are threadedly connected; the round rod (202) is fixedly mounted in the square groove (209); the L-shaped scraper (210) is sleeved on the outside of the round rod (202); a second motor (211) is fixedly mounted on one end of the L-shaped scraper (210); and an output end of the second motor (211) is fixedly connected to the first threaded rod (201).

4. The thin and light semiconductor package device according to claim 3, wherein: A clamping groove (212) is provided at one end of the L-shaped scraper (210), and a clamping block (213) is fixedly mounted at one end of the L-shaped scraper (210) on the other side.

5. The thin and light semiconductor package device according to claim 1, wherein: The driving member comprises a second threaded rod (20) with a hand wheel mounted on one end, sliding grooves are provided on both sides of the upper end of the second workbench (10), a sliding block (21) is clamped in the sliding groove, the sliding block (21) is fixedly connected to the limiting plate (12), the second threaded rod (20) is rotatably mounted in the sliding groove, and the sliding block (21) is threadedly connected to the second threaded rod (20).

6. The thin and light semiconductor package device according to claim 1, wherein: The exhaust assembly (4) comprises a circular ventilation plate (401), a fan (402) and a dust screen (403); the circular ventilation plate (401) is fixedly mounted on one end of the second U-shaped plate (13); the dust screen (403) and the fan (402) are mounted in the circular ventilation plate (401) in a front-to-rear arrangement; the fan (402) is electrically connected to the integrated control panel (19); a first collection box (404) is mounted on one side of the second U-shaped plate (13); an activated carbon adsorption net is mounted inside the first collection box (404); one end of the first collection box (404) is connected to the circular ventilation plate (401) via a first air supply pipe (405); a first solenoid valve is mounted on one end of the first air supply pipe (405); the first solenoid valve is electrically connected to the integrated control panel (19).

7. The thin and light semiconductor package device according to claim 6, wherein: An air suction box (407) with an air storage cavity (406) provided therein is fixedly mounted on the outside of the welding head (14); air suction pipes (408) are mounted in a circular array at one end of the air suction box (407); one end of the air suction pipes (408) is connected to the air storage cavity (406); and the air storage cavity (406) is connected to the first collecting box (404) via a pipeline.

8. The thin and light semiconductor package device according to claim 7, wherein: The dust removal assembly (3) comprises a second collection box (301) and a dust conveying pipe (302); the second collection box (301) is fixedly mounted on one side of the second U-shaped plate (13); a dust collecting plate is plugged into one end of the second collection box (301); one end of the second collection box (301) is connected to the meandering ventilation plate (401) via a second air conveying pipe (303); a second solenoid valve is mounted on one end of the second air conveying pipe (303); the second solenoid valve is connected to the integrated control panel ( 19), the dust conveying pipe (302) is connected to the second collecting box (301) through a pipeline, one end of the dust conveying pipe (302) is fixedly connected to the second U-shaped plate (13), and the other end of the dust conveying pipe (302) is fixedly installed with a dust collecting plate (305) with a dust storage cavity (304) therein, one end of the dust collecting plate (305) is provided with dust collecting pipes (306) in a linear array, and one end of the dust collecting pipe (306) is connected to the dust storage cavity (304).

9. The thin and light semiconductor package device according to claim 8, wherein: The cooling assembly (5) includes a third air duct (501), one end of the upper mold (17) and the lower mold (18) are provided with ventilation grooves (502), the ventilation grooves (502) are connected to the circular ventilation plate (401) through the third air duct (501), one side of the upper mold (17) and the lower mold (18) are provided with air inlet holes (503), one end of the third air duct (501) is installed with a third solenoid valve, and the third solenoid valve is electrically connected to the integrated control panel (19).

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