Method and device for processing abnormity of small wire bow, storage medium and electronic equipment

Abstract

The invention relates to the technical field of wire net monitoring, and particularly provides a method and device for processing small wire bow abnormity, a storage medium and electronic equipment. The method can comprise the steps that in the process that a cutting machine cuts a workpiece, the real-time wire bow value of a cutting head arc line area is obtained; the real-time wire bow value is compared with a wire bow threshold value, and whether wire bow abnormity exists or not is determined; and under the condition that the wire bow is abnormal, based on the type of a cutting wire, cutting parameters for adjusting the cutting machine are obtained, so that the cutting machine automatically adjusts the cutting process through the cutting parameters, the cutting parameters comprise at least one of a pay-off quantity parameter, a take-up quantity parameter, a take-up and pay-off speed parameter and a silicon rod speed parameter of the cutting wire. According to some embodiments of the invention, accurate detection and processing of the small wire bow can be realized, and normal work of the cutting machine is guaranteed.

Description

Technical Field

[0001] The present application relates to the field of wire network monitoring technology, and in particular to a method, device, storage medium and electronic device for processing small wire bow anomalies. Background Art

[0002] A saw is a machine commonly used for cutting silicon rods, often using diamond wire as a cutting tool.

[0003] At present, in order to ensure the normal operation of the cutting machine, the wire mesh is usually detected during the cutting process to avoid wire breakage caused by excessive wire bow. However, in actual applications, when the cutting machine uses a new wire, since the surface of the diamond wire is plated with a metal layer (for example, nickel), the metal layer does not have cutting ability, so small wire bows are prone to occur when using new wires for cutting. The current existing technology only accurately detects wire bows during the cutting process, and is unable to detect small wire bows in time, which in turn affects the cutting effect of the silicon rod head.

[0004] Therefore, how to provide a more efficient technical solution for handling small line bow anomalies has become a technical problem that needs to be solved urgently. Summary of the invention

[0005] The purpose of some embodiments of the present application is to provide a method, device, storage medium and electronic device for processing small line bow abnormalities. Through the technical solutions of the embodiments of the present application, accurate and timely detection of small line bows in the arc area of ​​the cutting head can be achieved, thereby ensuring the cutting effect and efficiency.

[0006] In a first aspect, some embodiments of the present application provide a method for handling small wire bow anomalies, comprising: obtaining a real-time wire bow value of an arc area of ​​a cutting head during a process in which a cutting machine cuts a workpiece; comparing the real-time wire bow value with a wire bow threshold to confirm whether there is a wire bow anomaly; in the case of the wire bow anomaly, based on the type of cutting wire, obtaining and adjusting cutting parameters of the cutting machine, so that the cutting machine automatically adjusts the cutting process through the cutting parameters, wherein the cutting parameters include: at least one of a wire release parameter, a wire reeling parameter, a reeling and releasing speed parameter, and a silicon rod speed parameter of the cutting wire.

[0007] Some embodiments of the present application detect the real-time wire bow value of the arc area of ​​the cutting head, and then compare it with the wire bow threshold to determine whether there is a wire bow abnormality. If there is, relevant cutting parameters are obtained based on the type of cutting line to adjust the cutting process of the cutting machine. Some embodiments of the present application can achieve accurate and timely detection of small wire bows in the arc area of ​​the cutting head, ensuring cutting effect and efficiency.

[0008] In some embodiments, obtaining the real-time line bow value of the arc area of ​​the cutting head includes: when detecting the cutting line of the arc area of ​​the cutting head, obtaining the detection angle between the detection device and the cutting line; obtaining the distance parameter by calculating the wear rate of the coating material on the cutting line and the normal force exerted on the coating material at different positions; and calculating the detection angle, the standard reference point and the distance parameter to obtain the real-time line bow value.

[0009] Some embodiments of the present application can achieve accurate calculation of the line bow value by obtaining the detection angle, calculating the distance parameter through the parameters related to the coating material and the standard reference point, and determining the real-time line bow value.

[0010] In some embodiments, obtaining the real-time line bow value of the arc area of ​​the cutting head includes: obtaining cutting parameters of the arc area of ​​the cutting head; inputting the cutting parameters into a pre-acquired line bow detection model, and outputting the real-time line bow value.

[0011] Some embodiments of the present application output real-time wire bow values ​​through wire bow detection models and cutting parameters, which is both efficient and convenient.

[0012] In some embodiments, the wire bow threshold is related to relevant parameters of the cutting wire, workpiece length, workpiece feed speed, groove wheel diameter and other parameters.

[0013] In some embodiments, the real-time line bow value is compared with the line bow threshold to confirm whether there is a line bow abnormality, including: if the real-time line bow value is less than or equal to the line bow threshold, then the line bow abnormality does not exist; if the real-time line bow value is greater than the line bow threshold, then the line bow abnormality exists.

[0014] Some embodiments of the present application compare the real-time line bow value with the line bow threshold to determine whether there is a line bow abnormality, thereby achieving accurate detection of line bow abnormalities.

[0015] In some embodiments, after obtaining and adjusting the cutting parameters of the cutting machine, the method further includes: sending a first signal value indicating the wire bow abnormality and the cutting parameters to the cutting machine, so that the cutting machine automatically adjusts to the cutting parameters; the method further includes: when the wire bow abnormality is restored, sending a second signal value and normal cutting parameters to the cutting machine, so that the cutting machine automatically adjusts to the normal cutting parameters.

[0016] Some embodiments of the present application send corresponding cutting parameters to the cutting machine so that the cutting machine can adjust the cutting process in time to reduce the impact of small wire bow on the cutting effect; at the same time, when the small wire bow no longer exists, the cutting machine can be controlled to return to normal cutting parameters, which has high flexibility.

[0017] In a second aspect, some embodiments of the present application provide a device for processing small wire bow anomalies, including: a wire bow acquisition module, used to obtain a real-time wire bow value of an arc area of ​​a cutting head during a process in which a cutting machine cuts a workpiece; an abnormality judgment module, used to compare the real-time wire bow value with a wire bow threshold to confirm whether there is a wire bow anomaly; a parameter acquisition module, used to, in the case of the wire bow anomaly, obtain and adjust the cutting parameters of the cutting machine based on the type of cutting line, wherein the cutting parameters include: at least one of a wire release amount parameter, a wire retracting amount parameter, a retracting and releasing speed parameter, and a silicon rod speed parameter of the cutting line.

[0018] In a third aspect, some embodiments of the present application provide a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, can implement the method described in any embodiment of the first aspect.

[0019] In a fourth aspect, some embodiments of the present application provide an electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor can implement a method as described in any embodiment of the first aspect when executing the program.

[0020] In a fifth aspect, some embodiments of the present application provide a computer program product, wherein the computer program product comprises a computer program, wherein the computer program, when executed by a processor, can implement the method described in any embodiment of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of some embodiments of the present application, the drawings required for use in some embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A schematic diagram of a wire mesh cutting structure provided for some embodiments of the present application;

[0023] Figure 2 A system diagram for processing small line bow anomalies provided for some embodiments of the present application;

[0024] Figure 3 One of the flow charts of the method for processing small line bow abnormality provided in some embodiments of the present application;

[0025] Figure 4 A schematic diagram of the arc area of ​​a cutting head provided for some embodiments of the present application;

[0026] Figure 5 A second flow chart of a method for processing small line bow abnormality provided in some embodiments of the present application;

[0027] Figure 6 A block diagram of a device for processing small line bow abnormalities provided in some embodiments of the present application;

[0028] Figure 7 A schematic diagram of an electronic device is provided for some embodiments of the present application. DETAILED DESCRIPTION

[0029] The technical solutions in some embodiments of the present application will be described below in conjunction with the drawings in some embodiments of the present application.

[0030] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0031] For an understanding of the application scenarios of this application, please refer to the attached Figure 1 The wire mesh cutting structure diagram of the cutting machine shown in FIG. Figure 1 The wire mesh 20 includes a workpiece 10, a wire mesh 20 (i.e., a cutting wire), and a monitoring unit 30 (as an example of a detection device). The wire mesh 20 reciprocates to cut the workpiece 10, and its operation mainly has two rotation directions, namely, the forward rotation when the wire mesh 20 feeds the wire and the reverse rotation when the wire mesh 20 retracts the wire, wherein the first rotation direction is the forward rotation when the wire mesh 20 feeds the wire, and the second rotation direction is the reverse rotation when the wire mesh 20 retracts the wire. When the wire mesh 20 cuts the workpiece 10, a wire bow is easily generated. When the wire bow exceeds the set threshold, there is a risk of wire breakage.

[0032] In the related art, when the cutting machine is actually working, when using a new diamond yarn (or called a new wire, i.e., the wire mesh 20) for cutting, in order to protect the new wire, a layer of nickel is plated on the diamond yarn used for cutting for the first time. However, nickel has no cutting ability. When cutting a new wire, a small wire bow is prone to occur in the arc area of ​​the cutting head. However, the situation that causes this small wire bow is relatively special compared to the wire bow anomaly generated during other cutting processes. The current prior art can detect the wire bow value of the old wire during the cutting process, but for the situation where a small wire bow exists during the cutting process of the wire cutting machine (i.e., the cutting machine) using a new wire, the prior art cannot identify and handle it in time, and there is a risk of wire breakage, which affects the cutting effect.

[0033] In view of this, some embodiments of the present application provide a method for handling small line bow anomalies. When using a new line for cutting, the method can calculate the line bow value of the arc area of ​​the cutting head in real time during the process of using the new line for cutting, and then compare it with the line bow threshold to determine whether there is a small line bow (i.e., line bow anomaly). In the case of a small line bow, the corresponding cutting parameters can be obtained based on the type of cutting line, so that the cutting machine can automatically adjust the cutting parameters to eliminate the influence of the small line bow. Some embodiments of the present application can identify and handle small line bows in a timely manner, reduce the risk of line breakage, and ensure the cutting effect.

[0034] The following is combined with Figure 2 The overall composition structure of the system for processing small line bow abnormalities provided by some embodiments of the present application is exemplified.

[0035] like Figure 2 As shown, some embodiments of the present application provide a system for processing small line bow anomalies, and the system for processing small line bow anomalies includes a terminal 100 and a cutting machine 200. The terminal 100 can establish a communication connection with the detection device of the cutting machine 200. The detection device can collect the wire mesh data of the arc area of ​​the cutting head during the operation of the cutting machine 200 and send it to the terminal 100. The terminal 100 can process the wire mesh data to obtain a real-time wire bow value; then compare the real-time wire bow value with the wire bow threshold to determine whether there is a wire bow anomaly. In the case of a wire bow anomaly, the cutting parameters can be determined based on the type of cutting line and sent to the cutting machine 200. The cutting machine 200 can automatically adjust the cutting process based on the cutting parameters to eliminate the influence of the small line bow. Among them, the detection device can be a sensor, and the type of the sensor can include radar, laser, ultrasound, etc. For example, the radar monitors the position of the wire bow here by emitting electromagnetic waves and receiving the reflected waves of the wire bow in the head area of ​​the cutting machine, and then determines whether a small line bow occurs.

[0036] In some embodiments of the present application, the terminal 100 may be a mobile device or a non-portable computer device; the terminal 100 may also be a controller, a control module or a control unit connected to the cutting machine 200, which is not specifically limited in the embodiments of the present application. If a module in the cutting machine 200 can achieve the same function as the terminal 100, the terminal 100 may not be provided. The specific adjustment may be made according to the actual situation, and the embodiments of the present application are not limited thereto.

[0037] The following is combined with Figure 3 The implementation process of handling small line bow anomalies performed by the terminal 100 provided in some embodiments of the present application is exemplified.

[0038] Please see attached Figure 3 , Figure 3A flow chart of a method for processing a small line bow abnormality is provided for some embodiments of the present application. The method for processing a small line bow abnormality may include:

[0039] S210, when the cutting machine is cutting a workpiece, obtaining a real-time line bow value of the arc area of ​​the cutting head.

[0040] For example, in some embodiments of the present application, when a cutting machine uses a new wire to cut a silicon rod (as a specific example of a workpiece), the terminal 100 can obtain the real-time wire bow value of the wire mesh in real time. Figure 4 The circled area shown is the location where the small wire bow appears. During detection, the circled area in the figure can be regarded as the cutting head arc area, that is, the area where the small wire bow abnormality is prone to occur. The cutting head arc area can be selected according to actual needs, and the embodiments of the present application are not limited to this. Among them, the coating material of the new wire can be nickel, and diamond particles are distributed on the coating material.

[0041] In some embodiments of the present application, S210 may include: when detecting the cutting line in the arc area of ​​the cutting head, obtaining the detection angle between the detection device and the cutting line; obtaining the distance parameter by calculating the wear rate of the coating material on the cutting line and the normal force exerted on the coating material at different positions; calculating the detection angle, the standard reference point and the distance parameter to obtain the real-time line bow value.

[0042] For example, in some embodiments of the present application, the terminal 100 can obtain the detection angle between the sensor and the cutting line collected by the sensor (or calculate the detection angle through the relevant parameters collected by the sensor), and then calculate the real-time line bow value by performing trigonometric function calculation on the calculated distance parameter and the standard reference point.

[0043] The distance parameter is obtained by the following formula:

[0044]

[0045] Where L0 is the distance parameter, K is the wear rate (or wear coefficient) of the coating material on the cutting line, and F n is the normal force on a single diamond coating, i.e., the normal sawing force on a single abrasive grain at the θ position on the wire saw (as a specific example of a standard reference point). T is the wear time, h is the wear height of the coating material, V s is the speed of the cutting wire; h0 is the coating thickness on the surface of the diamond wire (i.e., the cutting wire), d is the width of the silicon rod (e.g., d = 210 mm), w is the slot pitch of the cutting machine, l0 is the thickness of each silicon wafer after the silicon rod is cut, and β is the semi-cone angle of the diamond abrasive; σ xyis the average contact stress between the abrasive and the workpiece material, which is a constant and is proportional to the hardness of the workpiece material; v s is the axial speed of the diamond wire saw during cutting, v w is the downward feed speed of single crystal silicon during cutting; θ is the angle between the radius of the abrasive grain and the Y axis; c is the number of abrasive grains per unit area of ​​the cylindrical surface of the wire saw, that is, the abrasive surface density; μ is the friction coefficient between the abrasive grain and the workpiece surface, and μ=1.

[0046] In some embodiments of the present application, S210 may include: acquiring cutting parameters of the arc area of ​​the cutting head; inputting the cutting parameters into a pre-acquired line bow detection model, and outputting the real-time line bow value.

[0047] For example, in some embodiments of the present application, the initial detection model is trained by historical cutting parameters related to small wire bows and corresponding wire bow values ​​to obtain an AI detection model (as a specific example of a wire bow detection model). In actual applications, the cutting parameters of the cutting line collected in real time are input into the AI ​​detection model to output the real-time wire bow value.

[0048] In other embodiments, it is also possible to capture images of the cutting line and input them into an AI detection model trained with an image data set to output a real-time line bow value.

[0049] In some embodiments of the present application, the line bow threshold is obtained by the following method:

[0050]

[0051] In the formula, v w is the downward feed speed of the single crystal silicon rod during cutting; m is the number of abrasive grains per unit area on the coating material; l is the length of the workpiece; L is half of the distance between the groove wheel axes; r is the saw wire radius; D is the groove wheel diameter; λ is the proportion of abrasive grains involved in cutting; ξ is the safety factor, δ b is the tensile strength of the cutting wire; E is the elastic modulus of the cutting wire; g is the acceleration of gravity, A and B are coefficients, which are related to the workpiece (such as silicon rod), grinding fluid and saw wire; S is the cross-sectional area of ​​the saw wire; γ is the unit volume mass of the workpiece.

[0052] S220, comparing the real-time line bow value with the line bow threshold to confirm whether there is a line bow abnormality.

[0053] For example, in some embodiments of the present application, the real-time line bow value calculated above is compared with the line bow threshold to confirm whether there is a small line bow.

[0054] In some embodiments of the present application, S220 may include: if the real-time line bow value is less than or equal to the line bow threshold, the line bow abnormality does not exist; if the real-time line bow value is greater than the line bow threshold, the line bow abnormality exists.

[0055] For example, in some embodiments of the present application, since the line bow threshold is the critical point for cutting the line, the risk of line breakage is greater after exceeding the line bow threshold. Therefore, by comparing the real-time line bow value and the line bow threshold, it can be confirmed whether there is a small line bow.

[0056] S230, in the case of an abnormal wire bow, based on the type of cutting wire, obtain and adjust the cutting parameters of the cutting machine, so that the cutting machine automatically adjusts the cutting process through the cutting parameters, wherein the cutting parameters include: at least one of a wire release amount parameter, a wire take-up amount parameter, a wire take-up and release speed parameter, and a silicon rod speed parameter of the cutting wire.

[0057] For example, in some embodiments of the present application, in the presence of a small wire bow, different cutting parameters are matched according to different types of steel wires (as a specific example of cutting wires); for example, different wire retracting and releasing parameters, different retracting and releasing speeds, time parameters, different silicon rod lifting speeds, etc. are matched. The cutting parameters are sent to the cutting machine so that the cutting machine can automatically adjust the process.

[0058] In some embodiments of the present application, S230 may include: sending a first signal value indicating the wire bow abnormality and the cutting parameters to the cutting machine so that the cutting machine automatically adjusts to the cutting parameters.

[0059] For example, in some embodiments of the present application, after the wire cutting machine receives a small wire bow signal, for example, the signal value is 1 (as a specific example of the first signal value), it automatically changes to the wire release value (that is, the wire release parameter) and the wire take-up value (that is, the wire take-up parameter) set in the cutting parameters without stopping the machine. For example, the specific adjustment method is: reduce the wire take-up and pay-off amount, keep the take-up and release speed and time unchanged, reduce the amplitude, and keep the silicon rod lifting speed unchanged.

[0060] In some embodiments of the present application, S230 may further include: when the wire bow abnormality is restored, sending a second signal value and normal cutting parameters to the cutting machine, so that the cutting machine automatically adjusts to the normal cutting parameters.

[0061] For example, in some embodiments of the present application, when it is detected that there is no small wire bow, the latest small wire bow signal can be sent to the wire cutting machine, for example, the signal value is 0. After the wire cutting machine receives the signal value, it can restore to the normal wire release and wire reeling amounts (that is, normal cutting parameters).

[0062] In the above embodiment, the corresponding relationship between the cutting parameters corresponding to different signal values ​​can be stored on the terminal 100 side, and when the signal value is sent to the cutting machine, it can be sent together with the cutting parameters so that the cutting machine can automatically adjust the cutting process.

[0063] In other embodiments, the matching relationship between the cutting parameters and the signal values ​​can be stored on the cutting machine 200 side. After receiving different signal values ​​sent by the terminal 100, the cutting machine 200 can search for the corresponding cutting parameters to automatically adjust the cutting process.

[0064] Both of the above two methods can realize automatic adjustment of the cutting process. In practical applications, they can be selected according to the actual situation. The embodiments of the present application are not specifically limited here.

[0065] The following is combined with Figure 5 The specific process of handling small line bow abnormalities provided by some embodiments of the present application is exemplified.

[0066] Please see attached Figure 5 , Figure 5 A flow chart of a method for processing small line bow abnormalities is provided for some embodiments of the present application.

[0067] The above process is explained below as an example.

[0068] S410, obtaining a line bow threshold.

[0069] S420, obtaining the real-time line bow value of the arc area of ​​the cutting head.

[0070] S430, determine whether the real-time line bow value exceeds the line bow threshold, if so, execute S440, if not, return to S460.

[0071] S440, based on the type of the cutting line, obtain and adjust cutting parameters of the cutting machine.

[0072] S450, the cutting machine automatically adjusts the cutting process according to the cutting parameters and returns to S420.

[0073] S460, the cutting machine works with normal cutting parameters.

[0074] It should be noted that the determination of whether there is a small wire bow can be performed periodically according to a preset time, and the above embodiment only involves the steps that need to be performed within a cycle. The preset time can be limited according to the actual application scenario, and the embodiment of the present application is not specifically limited here. It can be understood that the specific implementation process of S410~S460 can refer to the method embodiment provided above. In order to avoid repetition, the detailed description is appropriately omitted here.

[0075] Through some of the above-mentioned embodiments of the present application, it can be seen that the method for detecting small wire bows provided in the present application can timely and accurately detect whether there are small wire bows during the new wire cutting process, avoid the risk of wire breakage, and reduce the abnormality rate.

[0076] Please refer to Figure 6 , Figure 6 The block diagram of the composition of the device for processing small line bow abnormality provided by some embodiments of the present application is shown. It should be understood that the device for processing small line bow abnormality corresponds to the above method embodiment and can execute each step involved in the above method embodiment. The specific functions of the device for processing small line bow abnormality can be found in the description above. To avoid repetition, the detailed description is appropriately omitted here.

[0077] Figure 6 The device for processing small wire bow abnormalities includes at least one software function module that can be stored in a memory in the form of software or firmware or solidified in the device for processing small wire bow abnormalities, and the device for processing small wire bow abnormalities includes: a wire bow acquisition module 510, which is used to obtain the real-time wire bow value of the arc area of ​​the cutting head during the process of the cutting machine cutting the workpiece; an abnormality judgment module 520, which is used to compare the real-time wire bow value with the wire bow threshold to confirm whether there is a wire bow abnormality; a parameter acquisition module 530, which is used to obtain and adjust the cutting parameters of the cutting machine based on the type of cutting line in the case of the wire bow abnormality, wherein the cutting parameters include: at least one of the wire release amount parameter, wire retracting amount parameter, retracting and releasing speed parameter and silicon rod speed parameter of the cutting line.

[0078] In some embodiments of the present application, the line bow acquisition module 510 is used to obtain the detection angle between the detection device and the cutting line when detecting the cutting line in the arc area of ​​the cutting head; obtain the distance parameter by calculating the wear rate of the coating material on the cutting line and the normal force exerted on the coating material at different positions; calculate the detection angle, the standard reference point and the distance parameter to obtain the real-time line bow value.

[0079] In some embodiments of the present application, the line bow acquisition module 510 is used to obtain the cutting parameters of the arc area of ​​the cutting head; input the cutting parameters into a pre-acquired line bow detection model, and output the real-time line bow value.

[0080] In some embodiments of the present application, the abnormality judgment module 520 is used to determine that if the real-time line bow value is less than or equal to the line bow threshold, the line bow abnormality does not exist; if the real-time line bow value is greater than the line bow threshold, the line bow abnormality exists.

[0081] In some embodiments of the present application, the parameter acquisition module 530 is used to send the first signal value and the cutting parameters when the wire bow abnormality exists to the cutting machine, so that the cutting machine automatically adjusts to the cutting parameters; when the wire bow abnormality is restored, the second signal value and normal cutting parameters are sent to the cutting machine, so that the cutting machine automatically adjusts to the normal cutting parameters.

[0082] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the device described above can refer to the corresponding process in the aforementioned method, and will not be described in detail here.

[0083] Some embodiments of the present application further provide a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, can implement the operations of the method corresponding to any of the above methods provided in the above embodiments.

[0084] Some embodiments of the present application further provide a computer program product, which includes a computer program, wherein when the computer program is executed by a processor, it can implement the operations corresponding to any of the above methods provided in the above embodiments.

[0085] like Figure 7 As shown, some embodiments of the present application provide an electronic device 600, which includes: a memory 610, a processor 620, and a computer program stored in the memory 610 and executable on the processor 620, wherein the processor 620 can implement a method as described in any of the above embodiments when reading the program from the memory 610 through a bus 630 and executing the program.

[0086] Processor 620 can process digital signals and can include various computing structures, such as complex instruction set computer structure, reduced instruction set computer structure, or a structure that implements a combination of multiple instruction sets. In some examples, processor 620 can be a microprocessor.

[0087] The memory 610 may be used to store instructions executed by the processor 620 or data related to the execution of instructions. These instructions and / or data may include codes for implementing some or all functions of one or more modules described in the embodiments of the present application. The processor 620 of the disclosed embodiment may be used to execute instructions in the memory 610 to implement the method shown above. The memory 610 includes a dynamic random access memory, a static random access memory, a flash memory, an optical memory, or other memory known to those skilled in the art.

[0088] The above description is only an embodiment of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0089] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

[0090] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

Claims

1. A method for processing small line bow abnormality, characterized in that: include: When the cutting machine is cutting a workpiece, the real-time line bow value of the arc area of ​​the cutting head is obtained; Comparing the real-time line bow value with the line bow threshold value to confirm whether there is a line bow abnormality; In case of the wire bow abnormality, the cutting parameters of the cutting machine are obtained and adjusted based on the type of cutting wire, so that the cutting machine automatically adjusts the cutting process through the cutting parameters, wherein the cutting parameters include: at least one of the wire pay-off parameter, wire take-up parameter, pay-off and take-up speed parameter and silicon rod speed parameter of the cutting wire.

2. The method according to claim 1, characterized in that The step of obtaining the real-time line bow value of the arc area of ​​the cutting head includes: When detecting the cutting line of the arc area of ​​the cutting head, obtaining a detection angle between the detection device and the cutting line; The distance parameter is obtained by calculating the wear rate of the coating material on the cutting line and the normal force exerted on the coating material at different positions; The detection angle, the standard reference point and the distance parameter are calculated to obtain the real-time line bow value.

3. The method according to claim 1, characterized in that The step of obtaining the real-time line bow value of the arc area of ​​the cutting head includes: Obtain cutting parameters of the arc area of ​​the cutting head; The cutting parameters are input into a pre-acquired wire bow detection model, and the real-time wire bow value is output.

4. The method according to any one of claims 1 to 3, characterized in that The wire bow threshold is related to the relevant parameters of the cutting wire, the workpiece length, the workpiece feed speed, the groove wheel diameter and other parameters.

5. The method according to any one of claims 1 to 3, characterized in that The comparing the real-time line bow value with the line bow threshold to confirm whether there is a line bow abnormality includes: If the real-time line bow value is less than or equal to the line bow threshold, the line bow abnormality does not exist; If the real-time line bow value is greater than the line bow threshold, the line bow abnormality exists.

6. The method according to any one of claims 1 to 3, characterized in that After obtaining and adjusting the cutting parameters of the cutting machine, the method further includes: Sending a first signal value indicating the wire bow abnormality and the cutting parameter to the cutting machine so that the cutting machine automatically adjusts to the cutting parameter; The method further comprises: When the wire bow recovers from the abnormality, a second signal value and normal cutting parameters are sent to the cutting machine so that the cutting machine automatically adjusts to the normal cutting parameters.

7. A device for processing small line bow abnormality, characterized in that: include: The line bow acquisition module is used to obtain the real-time line bow value of the arc area of ​​the cutting head during the process of the cutting machine cutting the workpiece; An abnormality judgment module, used for comparing the real-time line bow value with the line bow threshold value to confirm whether there is a line bow abnormality; A parameter acquisition module is used to obtain and adjust the cutting parameters of the cutting machine based on the type of cutting wire when the wire bow is abnormal, wherein the cutting parameters include: at least one of the wire release amount parameter, wire rewinding amount parameter, wire rewinding speed parameter and silicon rod speed parameter of the cutting wire.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein the computer program executes the method according to any one of claims 1 to 6 when executed by a processor.

9. An electronic device, characterized in that: The method comprises a memory, a processor, and a computer program stored in the memory and running on the processor, wherein the computer program executes the method according to any one of claims 1 to 6 when being run by the processor.

10. A computer program product, characterized in that The computer program product comprises a computer program, wherein the computer program executes the method according to any one of claims 1 to 6 when executed by a processor.

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