Injection mold of silicon wafer carrier

Abstract

The injection mold of the silicon wafer carrier comprises an upper mold and a lower mold, the upper mold sequentially comprises an upper mold bottom plate, a runner plate and an upper mold fixing plate from top to bottom, a plurality of glue injection holes are formed in the upper mold fixing plate and used for injecting glue into the lower mold, and the lower mold sequentially comprises a lower mold bottom plate, an ejector pin mechanism and a lower mold fixing plate from bottom to top. A lower mold core is mounted in the lower mold fixing plate, a forming part matched with a finished product structure of a carrier is arranged on the lower mold core, the forming part comprises a storage groove used for storing the carrier, three protruding circular truncated cones are arranged on the forming part and correspond to corresponding holding holes in the carrier in position, the structures of the three circular truncated cones are the same, and the three circular truncated cones correspond to the holding holes in the carrier in position. According to the injection mold used in the invention, the overall structure is compact and simple, a plurality of glue injection parts are adopted to synchronously form a rubber ring structure, and a built-in bent runner of an ox horn-shaped structure is used for glue injection, so that no sprue trace is left on a product.

Description

Technical Field

[0001] The invention relates to the technical field of injection molds, in particular to an injection mold for a silicon wafer carrier. Background Art

[0002] With the development of semiconductor technology, semiconductor silicon wafers are gradually developing towards larger sizes and thinner slices. The production of silicon wafers involves grinding and polishing, and grinding and polishing requires the use of special placement carriers. Fig.12 and 13 The main material of the carrier (11) shown is sheet metal, and a retaining hole (12) with internal teeth (1201) is processed in the carrier (11), and a rubber ring (13) structure needs to be injection-molded in the retaining hole, so a corresponding mold needs to be designed for processing and manufacturing. Summary of the invention

[0003] The purpose of the present invention is to provide an injection mold for a silicon wafer carrier to solve the technical problems in the background technology.

[0004] To achieve the aforementioned purpose, the present invention provides the following technical solutions:

[0005] A silicon wafer carrier injection mold, comprising an upper mold and a lower mold, wherein the upper mold comprises, from top to bottom, an upper mold bottom plate, a runner plate and an upper mold fixing plate, the upper mold fixing plate is provided with a plurality of injection holes for injecting glue into the lower mold, and the lower mold comprises, from bottom to top, a lower mold bottom plate, an ejector mechanism and a lower mold fixing plate, a lower mold core is installed in the lower mold fixing plate, the lower mold core is provided with a molding portion that matches the finished product structure of the carrier, the molding portion comprises a storage groove for placing the carrier, the molding portion is provided with three raised frustums corresponding to the positions of corresponding retaining holes on the carrier, and the three frustums have the same structure.

[0006] A single truncated table has several groups of injection parts with the same structure in a circular array along its axis, and the injection parts include two insert grooves with the same structure, a first flow channel is provided between the two insert grooves for connecting the two insert grooves, an insert is embedded in the insert groove, a second flow channel is provided in the insert, and a glue outlet is provided on the side of the insert, and the glue outlet is on the outer end face of the truncated table.

[0007] A glue inlet channel is arranged above the insert, a longitudinal section of a second flow channel in the insert is in a curved horn shape, and the glue inlet channel and the glue outlet are communicated through the second flow channel.

[0008] The insert includes a first insert and a second insert, wherein a first concave through groove is provided on the top of the first insert, and a second concave through groove is provided on the top of the second insert, and the first through groove and the second through groove are spliced ​​to form a glue entry channel; the first insert is provided with a third concave through groove toward the second insert, and the second insert is correspondingly provided with a fourth through groove, and the third through groove and the fourth through groove are spliced ​​to form a second horn-shaped flow channel; a first concave groove is provided below the first insert, and a first protrusion extending toward the first insert is provided below the second insert, and the first protrusion is in the first groove, and a mounting hole is provided on the first insert for mounting screws to fix it to the round table.

[0009] The ejector mechanism includes an ejector base plate, an ejector panel, a plurality of ejectors and two spacer blocks. The ejector base plate is below the ejector panel. One end of the ejector is mounted on the ejector panel, and the other end is inserted into the lower die core. A plurality of guide rods are also mounted on the ejector panel. The guide rods are inserted into the lower die fixing plate. Compression springs are sleeved on the guide rods. The compression springs are squeezed between the lower die plate and the ejector panel. The two spacer blocks are respectively on the left and right sides of the ejector base plate and between the lower die fixing plate and the lower die base plate.

[0010] Compared with the prior art, the injection mold for a silicon wafer carrier provided by the present invention has a compact and simple overall structure. It adopts several injection parts to synchronously mold the rubber ring structure, thereby improving the injection efficiency of the rubber ring and the uniformity of the molding surface. The built-in curved horn-shaped structure runner is used for injection, so that the product does not have any remaining gate marks. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 : The structural diagram of this application;

[0012] Figure 2 : Three-dimensional structure diagram of the lower mold;

[0013] Figure 3 : Three-dimensional structure diagram of upper mold;

[0014] Figure 4 : Three-dimensional structure diagram of the lower mold core;

[0015] Figure 5 : Figure 4 A magnified image of point A;

[0016] Figure 6 : Bottom structure diagram of lower mold core;

[0017] Figure 7 : Three-dimensional structure diagram of insert;

[0018] Figure 8 : Three-dimensional structure diagram of the insert from another direction;

[0019] Fig. 9 : A three-dimensional structural diagram of the first inlay block;

[0020] Fig.10 : The third block structure diagram;

[0021] Fig.11 : Three-dimensional structure diagram of the lower mold fixing plate;

[0022] Fig.12 : The front view of the carrier processed in this application;

[0023] Fig.13 : Fig.12 Enlarged view of point B. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0025] Specific embodiment 1: Please refer to Figures 1 to 13 In the present embodiment, an injection mold for a silicon wafer carrier comprises an upper mold and a lower mold. The upper mold comprises, from top to bottom, an upper mold bottom plate 1, a runner plate 2 and an upper mold fixing plate 3. The upper mold fixing plate 3 is provided with a plurality of injection holes 301 for injecting glue into the lower mold. The lower mold comprises, from bottom to top, a lower mold bottom plate 4, an ejector mechanism 5 and a lower mold fixing plate 6. A lower mold core 7 is installed in the lower mold fixing plate 6. Three positioning grooves 701 are provided below the lower mold core 7. The lower mold fixing plate 6 is provided with a raised positioning block 601 which is plugged into the positioning groove 701 for positioning and installation. The lower mold core 7 in the present embodiment is a regular octagonal structure.

[0026] The lower mold core 7 is provided with a forming part that matches the finished product structure of the carrier 11. The forming part includes a storage groove 8 for placing the carrier 11. The forming part is provided with three raised round cones 9 corresponding to the positions of the corresponding retaining holes 12 on the carrier 11. The structures of the three round cones 9 are the same.

[0027] A single truncated cone 9 has several groups of injection parts with the same structure in a circular array along its axis. In the present embodiment, six groups of injection parts are provided on a single truncated cone 9 to perform injection molding of the rubber ring 13. The injection parts include two insert 10 grooves 902 with the same structure. A first flow channel 901 is provided between the two insert 10 grooves 902 for connecting the two insert 10 grooves 902. An insert 10 is embedded in the insert 10 groove 902. A second flow channel is provided in the insert 10. A glue outlet 1004 is provided on the side of the insert 10. The glue outlet 1004 is on the outer end face of the truncated cone 9.

[0028] A glue inlet channel 1003 is provided above the insert 10. When the mold is closed, the glue injection hole 301 of the upper mold is connected to the glue inlet channel 1003 for injecting glue into the lower mold. The longitudinal cross-section of the second flow channel in the insert 10 is a curved horn shape, and the glue inlet channel 1003 and the glue outlet 1004 are connected through the second flow channel.

[0029] The insert 10 includes a first insert 1001 and a second insert 1002, wherein the first insert 1001 is provided with a first concave through groove 1001-1, and the second insert 1002 is provided with a second concave through groove 1002-1, and the first through groove 1001-1 and the second through groove 1002-1 are spliced ​​to form a glue entry channel 1003; the first insert 1001 is provided with a third concave through groove 1001-2 toward the second insert 1002, and the second insert 1002 is provided with a fourth through groove 1002-2 correspondingly, and the third through groove 1001-2 and the fourth through groove 1002-2 are spliced ​​to each other to form a horn-shaped third through groove 1001-2. Second flow channel; a first concave groove 1001-3 is provided under the first insert 1001, and a first protrusion 1002-3 extending toward the first insert 1001 is provided under the second insert 1002. The first protrusion 1002-3 is in the first groove 1001-3. The first insert 1001 is provided with a mounting hole 1001-4 for mounting screws and fixedly connected to the round table 9. In the present application, the insert 10 adopts a split mounting structure, which can effectively reduce the difficulty of processing the shape of the second flow channel. At the same time, when the insert 10 is partially damaged, the damaged insert can be replaced separately, thereby reducing the mold maintenance cost.

[0030] The ejector mechanism 5 includes an ejector base plate 501, an ejector panel 502, a plurality of ejectors 503 and two spacer blocks 504. The ejector base plate 501 is below the ejector panel 502. One end of the ejector 503 is mounted on the ejector panel 502, and the other end thereof is inserted into the lower die core 7. A plurality of guide rods are also mounted on the ejector panel 502. The guide rods are inserted into the lower die fixing plate 6. Compression springs 505 are sleeved on the guide rods. The compression springs 505 are squeezed between the lower die fixing plate 6 and the ejector panel 502. The two spacer blocks 504 are respectively on the left and right sides of the ejector base plate 501 and between the lower die fixing plate 6 and the lower die base plate 4. The ejector is arranged at the position of the storage slot 8 for ejecting products.

[0031] The carrier 11 formed by the mold of the present application has a rubber ring 13 injected into the retaining hole 12. The rubber ring 13 is made of PVDF material and covers the inner tooth 1201 structure of the retaining hole, that is, a dovetail groove 1301 is formed on the rubber ring, and the rubber ring and the inner tooth 1201 of the retaining hole 12 are mutually interlocking structures.

[0032] The present invention provides an injection mold for a silicon wafer carrier, which has a compact and simple overall structure. It adopts several injection parts to synchronously mold a rubber ring structure, thereby improving the injection efficiency of the rubber ring and the uniformity of the molding surface. The built-in curved horn-shaped structure runner is used for injection, so that the product does not have any gate marks left.

[0033] It will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered in all respects as exemplary and non-restrictive, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0034] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An injection mold for a silicon wafer carrier, characterized in that: It includes an upper mold and a lower mold, wherein the upper mold is composed of an upper mold bottom plate, a runner plate and an upper mold fixing plate from top to bottom, and a plurality of glue injection holes are provided on the upper mold fixing plate for injecting glue into the lower mold, and the lower mold is composed of a lower mold bottom plate, an ejector mechanism and a lower mold fixing plate from bottom to top, and a lower mold core is installed in the lower mold fixing plate, and a molding part matching the finished product structure of the carrier is provided on the lower mold core, and the molding part includes a storage groove for placing the carrier, and three raised frustums are provided on the molding part corresponding to the corresponding retaining hole positions on the carrier, and the structures of the three frustums are the same.

2. The injection mold of a silicon wafer carrier according to claim 1, characterized in that: A single truncated table has several groups of injection parts with the same structure in a circular array along its axis, and the injection parts include two insert grooves with the same structure, a first flow channel is provided between the two insert grooves for connecting the two insert grooves, an insert is embedded in the insert groove, a second flow channel is provided in the insert, and a glue outlet is provided on the side of the insert, and the glue outlet is on the outer end face of the truncated table.

3. The injection mold of a silicon wafer carrier according to claim 2, characterized in that: A glue inlet channel is arranged above the insert, a longitudinal section of a second flow channel in the insert is in a curved horn shape, and the glue inlet channel and the glue outlet are communicated through the second flow channel.

4. The injection mold of a silicon wafer carrier according to claim 3, characterized in that: The insert includes a first insert and a second insert, wherein a first concave through groove is provided on the top of the first insert, and a second concave through groove is provided on the top of the second insert, and the first through groove and the second through groove are spliced ​​to form a glue entry channel; the first insert is provided with a third concave through groove toward the second insert, and the second insert is correspondingly provided with a fourth through groove, and the third through groove and the fourth through groove are spliced ​​to form a second horn-shaped flow channel; a first concave groove is provided below the first insert, and a first protrusion extending toward the first insert is provided below the second insert, and the first protrusion is in the first groove, and a mounting hole is provided on the first insert for mounting screws to fix it to the round table.

5. The injection mold of a silicon wafer carrier according to claim 4, characterized in that: The ejector mechanism includes an ejector base plate, an ejector panel, a plurality of ejectors and two spacer blocks. The ejector base plate is below the ejector panel. One end of the ejector is mounted on the ejector panel, and the other end is inserted into the lower die core. A plurality of guide rods are also mounted on the ejector panel. The guide rods are inserted into the lower die fixing plate. Compression springs are sleeved on the guide rods. The compression springs are squeezed between the lower die plate and the ejector panel. The two spacer blocks are respectively on the left and right sides of the ejector base plate and between the lower die fixing plate and the lower die base plate.

Images