Wafer position detecting and adjusting device and vertical furnace

Abstract

The invention relates to the technical field of wafer position detection, in particular to a wafer position detection and adjustment device and a vertical furnace, and the wafer position detection and adjustment device comprises a wafer boat, a lifting mechanism, a detection assembly and a deviation correction mechanism; the wafer boat is used for bearing multiple layers of wafers. The detection assembly can move from bottom to top along with the lifting platform in the vertical direction and is used for detecting whether the circle center of each layer of wafer is located on the axis of the wafer boat. The deviation rectifying mechanism can move along with the lifting table in the vertical direction and is used for driving each layer of wafers to move so that the circle centers of the wafers can be located on the axis of the wafer boat. By arranging the detection assembly, whether the circle center of a wafer of a certain layer or some layers deviates from the axis of the wafer boat or not can be judged before the coating process is carried out. By arranging the deviation correcting mechanism, the position of the wafer with the circle center deviating from the axis of the wafer boat can be adjusted before the coating process is carried out. And on the whole, the uniformity of the film thickness is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer position detection, and in particular to a wafer position detection and adjustment device and a vertical furnace. Background Art

[0002] In a vertical furnace, the relative position of the wafer and the wafer boat is very important. If the center of a certain layer of wafers is not on the axis of the wafer boat, it will affect the subsequent coating process and cause poor uniformity of film thickness.

[0003] At present, it can only be inferred indirectly through the deviation of film thickness after the coating process is completed that the center of a certain layer or some layers of wafers is not on the axis of the wafer boat. It is impossible to judge whether the center of a certain layer or some layers of wafers deviates from the axis of the wafer boat before the coating process is carried out.

[0004] Therefore, how to determine whether the center of a certain layer or certain layers of wafers deviates from the axis of the wafer boat before the coating process is carried out becomes a technical problem that needs to be solved urgently by those skilled in the art. Summary of the invention

[0005] The invention provides a wafer position detection and adjustment device and a vertical furnace, which are used to solve the problem of how to judge whether the center of a certain layer or some layers of wafers deviates from the axis of a wafer boat before the coating process is carried out.

[0006] In one aspect, the present invention provides a wafer position detection and adjustment device, comprising: Wafer boat, used to carry multiple layers of wafers; The lifting mechanism is arranged on one side of the crystal boat; the lifting mechanism is provided with a lifting platform; the lifting platform can move in a vertical direction; A detection component is installed on the lifting platform; the detection component can move along the vertical direction with the lifting platform to detect whether the center of each layer of wafers is on the axis of the wafer boat; The deflection correction mechanism is installed on the lifting platform; the deflection correction mechanism can move along the vertical direction with the lifting platform, and is used to drive each layer of wafers to move so that the center of the wafer is on the axis of the wafer boat.

[0007] In some of the embodiments, the vertical projection of the lifting platform from top to bottom is an arc-shaped structure; The detection components include: A first distance detection sensor is installed at one end of the lifting platform; The second distance detection sensor is installed in the middle of the lifting platform; The third distance detection sensor is installed at the other end of the lifting platform.

[0008] In some embodiments, the correction mechanism includes: The first deflection correcting part is installed at one end of the lifting platform; the first deflection correcting part can move up and down to lift the wafer or detach the wafer; when the first deflection correcting part lifts the wafer, it can drive the wafer to move along the radial direction of the wafer boat; The second deflection correcting part is installed in the middle of the lifting platform; the second deflection correcting part can move up and down to lift the wafer or detach from the wafer; when the second deflection correcting part lifts the wafer, it can drive the wafer to move along the radial direction of the wafer boat; The third deflection correcting part is installed at the other end of the lifting platform; the third deflection correcting part can move up and down to lift the wafer or detach from the wafer; when the third deflection correcting part lifts the wafer, it can drive the wafer to move radially along the wafer boat.

[0009] In some embodiments, the second correcting unit includes: A first servo motor is slidably mounted in the lifting platform in a vertical direction; A first fixing seat is fixedly installed in the lifting platform and is located above the first servo motor; a first threaded hole is formed on the first fixing seat; The first movable seat is slidably installed in the lifting platform along the vertical direction and is located above the first fixed seat; a second threaded hole is formed on the first movable seat; the pitch of the second threaded hole is smaller than the pitch of the first threaded hole; The first transmission shaft has a vertically arranged axis and a bottom end fixedly connected to the output shaft of the first servo motor; a first threaded section is arranged at the bottom of the first transmission shaft and a second threaded section is arranged at the top; the first threaded section is matched with the first threaded hole; and the second threaded section is matched with the second threaded hole; A first bearing seat, the bottom surface of which is fixedly connected to the top surface of the first movable seat; A second servo motor is slidably mounted on the top surface of the first bearing seat in a horizontal direction; The second fixing seat is fixedly mounted on the top surface of the first bearing seat; a third threaded hole is formed on the second fixing seat; The second movable seat can be slidably installed on the top surface of the first bearing seat in the horizontal direction; a fourth threaded hole is formed on the second movable seat; the pitch of the fourth threaded hole is smaller than the pitch of the third threaded hole; The second transmission shaft has a horizontal axis and one end is fixedly connected to the output shaft of the second servo motor; one end of the second transmission shaft is provided with a third thread segment, and the other end is provided with a fourth thread segment; the third thread segment is adapted to the third threaded hole; and the fourth thread segment is adapted to the fourth threaded hole; A second bearing seat is fixedly mounted on an end of the second transmission shaft away from the second servo motor; The structure of the first deviation-correcting portion is the same as that of the second deviation-correcting portion; the structure of the third deviation-correcting portion is the same as that of the second deviation-correcting portion.

[0010] In some embodiments, the lifting mechanism further comprises: The guide column has a vertical axis; a lifting platform movable in a vertical direction is installed on the guide column.

[0011] In some of the embodiments, a wafer entry and exit port is formed on one side of the wafer boat.

[0012] On the other hand, the present invention further provides a vertical furnace, comprising a wafer loading and unloading chamber, a robot, and a wafer position detection and adjustment device provided in any embodiment; The wafer loading and unloading chamber is equipped with a robot, a wafer boat, a lifting mechanism, a detection component and a correction mechanism; The robot is used to transfer the wafers to the wafer boat.

[0013] In some embodiments, it also includes: The rotating mechanism is arranged in the wafer loading and unloading chamber and connected with the wafer boat, and can drive the wafer boat to rotate around the axis.

[0014] In some embodiments, it also includes: The filter is arranged in the wafer loading and unloading chamber and is located on one side of the wafer boat; a nitrogen outflow hole is formed on the filter, and nitrogen is blown toward the wafer boat through the nitrogen outflow hole; The heat exchanger is arranged in the wafer loading and unloading chamber and is located on the other side of the wafer boat; a nitrogen recovery hole is formed on the heat exchanger; The reflux pipe is arranged at the bottom of the wafer loading and unloading chamber and is communicated with the filter and the heat exchanger respectively.

[0015] In some embodiments, it also includes: The fan is installed in the return duct.

[0016] The beneficial effects of the present invention are as follows: The wafer position detection and adjustment device of the present invention is provided by setting a wafer boat, and the wafer boat is used to carry multiple layers of wafers arranged in sequence from top to bottom. The detection component can move from bottom to top along the vertical direction with the lifting platform, and is used to detect whether the center of each layer of wafers is on the axis of the wafer boat. The correction mechanism can move along the vertical direction with the lifting platform, and is used to drive each layer of wafers to move so that the center of the wafer is on the axis of the wafer boat. By setting the detection component, it is possible to determine whether the center of a certain layer or some layers of wafers deviates from the axis of the wafer boat before the coating process is carried out. By setting the correction mechanism, the position of the wafer whose center deviates from the axis of the wafer boat can be adjusted in time before the coating process is carried out, so that the center of the deviated wafer moves to the axis of the wafer boat. On the whole, it is conducive to ensuring the uniformity of the film thickness. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a top view of a wafer position detection and adjustment device of the present invention; Figure 2 yes Figure 1A schematic diagram of the combined structure of the lifting mechanism, the detection component and the correction mechanism in the wafer position detection and adjustment device shown; Figure 3 yes Figure 2 A partial enlarged view of the middle A area; Figure 4 yes Figure 1 A cross-sectional view of the wafer position detection and adjustment device along CC is shown; Figure 5 yes Figure 4 A partial enlarged view of the middle B area; Figure 6 yes Figure 1 A front view of the wafer position detection and adjustment device is shown.

[0018] In the accompanying drawings, 110, crystal boat; 120, lifting mechanism; 121, guide column; 122, lifting platform; 130, detection assembly; 131, first distance detection sensor; 132, second distance detection sensor; 133, third distance detection sensor; 140, correction mechanism; 141, first correction part; 142, second correction part; 1421, first servo motor; 1422, first fixed seat; 1423, first movable seat; 1424, first transmission shaft; 14241, first thread segment; 14242, second thread segment; 1 425, first bearing seat; 1426, second servo motor; 1427, second fixed seat; 1428, second movable seat; 1429, second transmission shaft; 14291, third thread segment; 14292, fourth thread segment; 14293, second bearing seat; 143, third deviation correction unit; 210, wafer loading and unloading chamber; 220, robot; 230, rotating mechanism; 231, third servo motor; 232, turntable; 240, filter; 250, heat exchanger; 260, reflux pipe; 270, fan; 300, wafer. DETAILED DESCRIPTION

[0019] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] As described in the background technology, currently, it is only possible to indirectly infer that the center of a certain layer or certain layers of wafers is not on the axis of the wafer boat through the deviation of the film thickness after the coating process is completed, and it is not possible to judge whether the center of a certain layer or certain layers of wafers deviates from the axis of the wafer boat before the coating process is carried out. Therefore, how to judge whether the center of a certain layer or certain layers of wafers deviates from the axis of the wafer boat before the coating process is carried out has become a technical problem that needs to be solved urgently by those skilled in the art.

[0021] To solve the above problems, refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 On the one hand, the present invention provides a wafer position detection and adjustment device, including a wafer boat 110, a lifting mechanism 120, a detection component 130 and a correction mechanism 140. The wafer boat 110 is used to carry multiple layers of wafers 300 arranged in sequence from top to bottom. The lifting mechanism 120 is arranged on one side of the wafer boat 110. The lifting mechanism 120 is provided with a lifting platform 122, and the lifting platform 122 can move in a vertical direction. The detection component 130 is installed on the lifting platform 122. The detection component 130 can move from bottom to top in the vertical direction with the lifting platform 122, and is used to detect whether the center of each layer of wafers 300 is on the axis of the wafer boat 110. The correction mechanism 140 is installed on the lifting platform 122. The correction mechanism 140 can move in the vertical direction with the lifting platform 122, and is used to drive each layer of wafers 300 to move so that the center of the wafer 300 is on the axis of the wafer boat 110. By setting up the detection component 130, it is possible to determine whether the center of a certain layer or certain layers of the wafer 300 deviates from the axis of the wafer boat 110 before the coating process is carried out. By setting up the correction mechanism 140, it is possible to adjust the position of the wafer 300 whose center deviates from the axis of the wafer boat 110 before the coating process is carried out, so that the center of the deviated wafer 300 moves to the axis of the wafer boat 110. Of course, before the coating process is carried out, when the detection component 130 determines that the center of a certain layer or certain layers of the wafer 300 deviates from the axis of the wafer boat 110, it is also possible to choose to reload the wafer 300 of this layer or these layers with the help of the robot 220, which makes the position adjustment efficiency slightly lower than the form of directly adjusting the position of the wafer 300 with the help of the correction mechanism 140. On the whole, it is conducive to ensuring the uniformity of the film thickness.

[0022] Specifically, in the example, Figure 1 , Figure 2 and Figure 3As shown, the orthographic projection of the lifting platform 122 from top to bottom is an arc-shaped structure. The detection component 130 includes a first distance detection sensor 131, a second distance detection sensor 132 and a third distance detection sensor 133. The first distance detection sensor 131, the second distance detection sensor 132 and the third distance detection sensor 133 are distributed in a triangular shape. Specifically, the first distance detection sensor 131 is fixedly mounted on the inner wall of one end of the lifting platform 122, and the detection head faces the wafer 300, for detecting the distance between it and the edge of the wafer 300. The second distance detection sensor 132 is fixedly mounted on the inner wall of the middle part of the lifting platform 122, and the detection head faces the wafer 300, for detecting the distance between it and the edge of the wafer 300. The third distance detection sensor 133 is fixedly mounted on the other end of the lifting platform 122, and the detection head faces the wafer 300, for detecting the distance between it and the edge of the wafer 300.

[0023] The principle of the detection component 130 determining whether the center of a certain layer of wafers 300 deviates from the axis of the wafer boat 110 is as follows: like Figure 1 As shown, the distance between the first distance detection sensor 131 and the axis of the wafer boat 110 is a constant value L1, the distance between the second distance detection sensor 132 and the axis of the wafer boat 110 is a constant value L2, and the distance between the third distance detection sensor 133 and the axis of the wafer boat 110 is a constant value L3. The radius of the wafer 300 is a constant value R. Therefore, in theory, the distance between the first distance detection sensor 131 and the edge of the wafer boat 110 is l1=L1-R. The distance between the second distance detection sensor 132 and the edge of the wafer boat 110 is l2=L2-R. The distance between the third distance detection sensor 133 and the edge of the wafer boat 110 is l3=L3-R. In fact, the distance between the first distance detection sensor 131 and the edge of the wafer boat 110 is l1', the distance between the second distance detection sensor 132 and the edge of the wafer boat 110 is l2', and the distance between the third distance detection sensor 133 and the edge of the wafer boat 110 is l3'. When l1'=l1, l2'=l2 and l3'=l3, it is considered that the center of the layer of wafers 300 is located on the axis of the wafer boat 110. The three-point detection method greatly improves the accuracy and precision of the detection. When l1'≠l1 or l2'≠l2 or l3'≠l3, it is considered that the center of the layer of wafers 300 deviates from the axis of the wafer boat 110. The judgment process is completed by a controller electrically connected to the detection component 130.

[0024] Specifically, in the example, Figure 1 , Figure 2 and Figure 3As shown, the deflection correction mechanism 140 includes a first deflection correction part 141, a second deflection correction part 142 and a third deflection correction part 143. The first deflection correction part 141 is installed at one end of the lifting platform 122. The first deflection correction part 141 can move up and down to lift the wafer 300 or detach from the wafer 300. The second deflection correction part 142 is installed at the middle of the lifting platform 122. The second deflection correction part 142 can move up and down to lift the wafer 300 or detach from the wafer 300. The third deflection correction part 143 is installed at the other end of the lifting platform 122. The third deflection correction part 143 can move up and down to lift the wafer 300 or detach from the wafer 300. When the first deflection correction part 141 lifts the wafer 300, it can drive the wafer 300 to move along the radial direction of the wafer boat 110. When the second deflection correction part 142 lifts the wafer 300, it can also drive the wafer 300 to move along the radial direction of the wafer boat 110. When the third deflection correcting unit 143 lifts the wafer 300, it can also drive the wafer 300 to move along the radial direction of the wafer boat 110. When it is necessary to move a certain layer of wafers 300 with the aid of the deflection correcting mechanism 140, first, the first deflection correcting unit 141, the second deflection correcting unit 142 and the third deflection correcting unit 143 move upward, and cooperate with each other to make the wafers 300 of this layer no longer contact the wafer boat 110, so as to avoid the wafers 300 from being worn during the movement. Then, the first deflection correcting unit 141, the second deflection correcting unit 142 and the third deflection correcting unit 143 cooperate with each other to move the wafer 300, so as to adjust the position of the center of the wafer 300, so that the center of the wafer 300 returns to the axis of the wafer boat 110. When the wafer 300 has completed the movement, the first deflection correcting unit 141, the second deflection correcting unit 142 and the third deflection correcting unit 143 move downward, and cooperate with each other to make the wafers 300 of this layer contact the wafer boat 110.

[0025] It should be noted that, for each layer of wafers 300 carried on the wafer boat 110 , the vertical movement range thereof is only 2 mm to 10 mm, and the radial movement range thereof is also only 2 mm to 10 mm.

[0026] In some embodiments, such as Figure 1 , Figure 2 , Figure 4 and Figure 5As shown, the second deviation correcting part 142 includes a first servo motor 1421, a first fixed seat 1422, a first movable seat 1423, a first transmission shaft 1424, a first bearing seat 1425, a second servo motor 1426, a second fixed seat 1427, a second movable seat 1428, a second transmission shaft 1429 and a second bearing seat 14293. The first servo motor 1421 can be slidably installed in the lifting platform 122 along the vertical direction. The first fixed seat 1422 is fixedly installed in the lifting platform 122 and is located above the first servo motor 1421. A first threaded hole is formed on the first fixed seat 1422. The first movable seat 1423 can be slidably installed in the lifting platform 122 along the vertical direction and is located above the first fixed seat 1422. A second threaded hole is formed on the first movable seat 1423. The pitch of the second threaded hole is smaller than the pitch of the first threaded hole. The axis of the first transmission shaft 1424 is arranged vertically, and the bottom end is fixedly connected to the output shaft of the first servo motor 1421. A first threaded section 14241 is arranged at the bottom of the first transmission shaft 1424, and a second threaded section 14242 is arranged at the top. The first threaded section 14241 is adapted to the first threaded hole, and the second threaded section 14242 is adapted to the second threaded hole. The bottom surface of the first bearing seat 1425 is fixedly connected to the top surface of the first movable seat 1423. The second servo motor 1426 can be slidably mounted on the top surface of the first bearing seat 1425 in the horizontal direction. The second fixed seat 1427 is fixedly mounted on the top surface of the first bearing seat 1425. A third threaded hole is formed on the second fixed seat 1427. The second movable seat 1428 can be slidably mounted on the top surface of the first bearing seat 1425 in the horizontal direction. A fourth threaded hole is formed on the second movable seat 1428. The pitch of the fourth threaded hole is smaller than the pitch of the third threaded hole. The axis of the second transmission shaft 1429 is arranged horizontally, and one end is fixedly connected to the output shaft of the second servo motor 1426. A third threaded section 14291 is arranged at one end of the second transmission shaft 1429, and a fourth threaded section 14292 is arranged at the other end. The third threaded section 14291 is adapted to the third threaded hole, and the fourth threaded section 14292 is adapted to the fourth threaded hole. The second bearing seat 14293 is in an "L" shape as a whole, and is fixedly installed at one end of the second transmission shaft 1429 away from the second servo motor 1426. The first servo motor 1421 can drive the first transmission shaft 1424 to rotate, thereby driving the first movable seat 1423 to move up and down, thereby driving the first bearing seat 1425 to move up and down, thereby driving the second servo motor 1426, the second fixed seat 1427, the second movable seat 1428, the second transmission shaft 1429 and the second bearing seat 14293 to move up and down, so that the second bearing seat 14293 can lift the wafer 300 or detach from the wafer 300.It should be noted that the pitch of the second threaded hole is smaller than the pitch of the first threaded hole. For example, the pitch of the second threaded hole is 1.4 mm, and the pitch of the first threaded hole is 1.5 mm, so that the second bearing seat 14293 and the wafer 300 move up and down with an accuracy of up to 0.1 mm, so as to meet the needs of small movements in the vertical direction. The second servo motor 1426 can drive the second transmission shaft 1429 to rotate, and then drive the second movable seat 1428 to move horizontally, thereby driving the second bearing seat 14293 and the wafer 300 to move horizontally. It should be noted that the pitch of the fourth threaded hole is smaller than the pitch of the third threaded hole. For example, the pitch of the fourth threaded hole is 1.4 mm, and the pitch of the third threaded hole is 1.5 mm, so that the second bearing seat 14293 and the wafer 300 move horizontally with an accuracy of up to 0.1 mm, so as to meet the needs of small movements in the horizontal direction. The structure of the first deviation-correcting portion 141 is the same as that of the second deviation-correcting portion 142 , and the structure of the third deviation-correcting portion 143 is the same as that of the second deviation-correcting portion 142 .

[0027] Specifically, in the exemplary embodiment, the lifting mechanism 120 further includes a guide column 121 and a driver. The axis of the guide column 121 is vertically arranged, and a lifting platform 122 movable in the vertical direction is mounted on the guide column 121. The guide column 121 guides the up and down movement of the lifting platform 122. The driver can be a linear driver such as an electric push rod or a cylinder or a hydraulic cylinder, and the output shaft is connected to the lifting platform 122 to drive the lifting platform 122 to move up and down. The driver can also be a rotary driver such as a servo motor or a stepper motor, which drives the lifting platform 122 to move up and down through a belt or a chain.

[0028] Specifically, in the example, Figure 1 and Figure 6 As shown, a wafer entry and exit port is formed on one side of the wafer boat 110 to facilitate the wafer 300 to enter and exit the wafer boat 110 .

[0029] On the other hand, referring to Figure 1 and Figure 6The present invention also provides a vertical furnace, including a wafer loading and unloading chamber 210, a robot 220 and a wafer position detection and adjustment device provided in any embodiment. The wafer loading and unloading chamber 210 is provided with a robot 220, a wafer boat 110, a lifting mechanism 120, a detection component 130 and a correction mechanism 140. The robot 220 is used to transfer the wafer 300 to the wafer boat 110. After the robot 220 installs the wafer 300 layer by layer on the wafer boat 110, by setting the detection component 130, it can be determined whether the center of a certain layer or some layers of the wafer 300 deviates from the axis of the wafer boat 110 before the coating process is carried out. By setting the correction mechanism 140, the position of the wafer 300 whose center deviates from the axis of the wafer boat 110 can be adjusted before the coating process is carried out, so that the center of the deviated wafer 300 moves to the axis of the wafer boat 110. Of course, before the coating process is performed, when the detection component 130 determines that the center of a certain layer or some layers of wafers 300 deviates from the axis of the wafer boat 110, the robot 220 can be used to reload the wafers 300 of the layer or layers. Overall, it is beneficial to ensure the uniformity of the film thickness.

[0030] Specifically, in the example, Figure 6 As shown, the vertical furnace also includes a rotating mechanism 230. The rotating mechanism 230 is disposed in the wafer loading and unloading chamber 210, connected to the wafer boat 110, and can drive the wafer boat 110 to rotate around an axis. When the wafer 300 is loaded into the wafer boat 110 with the help of the manipulator 220, the rotating mechanism 230 drives the wafer boat 110 to rotate around its own axis so that the wafer entry and exit is facing the manipulator 220, so as to facilitate the installation of the wafer 300. After the wafer 300 is installed, the rotating mechanism 230 drives the wafer boat 110 to rotate around its own axis so that the wafer entry and exit is no longer facing the manipulator 220. Among them, the rotating mechanism 230 includes a third servo motor 231 and a turntable 232. The bottom surface of the turntable 232 is connected to the output shaft of the third servo motor 231, and the top surface can be connected to the bottom surface of the wafer boat 110. The third servo motor 231 drives the turntable 232 to rotate, so as to drive the wafer boat 110 and the wafers 300 to rotate around the axis of the wafer boat 110 .

[0031] Specifically, in the example, Figure 1 and Figure 6As shown, the vertical furnace also includes a filter 240, a heat exchanger 250, a reflux pipe 260 and a fan 270. The filter 240 is arranged in the wafer loading and unloading chamber 210 and is located on one side of the wafer boat 110. The filter 240 is used to filter the nitrogen to prevent the nitrogen blown to the wafer boat 110 from being mixed with foreign matter. A nitrogen outflow hole is formed on the filter 240, and low-temperature nitrogen is blown to the wafer boat 110 through the nitrogen outflow hole. The heat exchanger 250 is arranged in the wafer loading and unloading chamber 210 and is located on the other side of the wafer boat 110. A nitrogen recovery hole is formed on the heat exchanger 250. The heat exchanger 250 is used to cool the high-temperature nitrogen. The reflux pipe 260 is arranged at the bottom of the wafer loading and unloading chamber 210, and is connected to the filter 240 and the heat exchanger 250 respectively. The fan 270 is installed in the reflux pipe 260 to provide assistance for the flow of nitrogen, so as to promote the nitrogen to flow faster, thereby increasing the cooling rate of the environment in the wafer boat 110 , the wafers 300 and the wafer loading and unloading chamber 210 .

[0032] The nitrogen cooling working principle is as follows: When the wafer 300 is lowered into the wafer loading and unloading chamber 210 along with the wafer boat 110, Figure 6 The direction of the middle arrow is the flow direction of nitrogen. Low-temperature nitrogen flows out from the nitrogen outflow hole of the filter 240 and flows to the wafer boat 110 and the wafer 300. The wafer boat 110 and the wafer 300 are cooled by the low-temperature nitrogen. After that, the high-temperature nitrogen flows into the heat exchanger 250 through the nitrogen recovery hole, and the heat exchanger 250 cools the high-temperature nitrogen. The nitrogen that has been cooled flows to the filter 240 again through the return pipe 260 under the action of the fan 270 and is reused.

[0033] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0035] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In the present invention, the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0037] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A wafer position detection and adjustment device, characterized in that: include: Wafer boat, used to carry multiple layers of wafers; A lifting mechanism is arranged on one side of the wafer boat; the lifting mechanism is provided with a lifting platform; the lifting platform can move in a vertical direction; A detection component is installed on the lifting platform; the detection component can move along the vertical direction with the lifting platform, and is used to detect whether the center of each layer of the wafer is on the axis of the wafer boat; A deflection correction mechanism is installed on the lifting platform; the deflection correction mechanism can move along the vertical direction with the lifting platform, and is used to drive each layer of the wafer to move so that the center of the wafer is on the axis of the wafer boat; The vertical projection of the lifting platform from top to bottom is an arc-shaped structure; The detection component comprises: A first distance detection sensor is installed at one end of the lifting platform; A second distance detection sensor is installed in the middle of the lifting platform; A third distance detection sensor is installed at the other end of the lifting platform; The deviation correction mechanism comprises: A first deflection correcting part is installed at one end of the lifting platform; the first deflection correcting part can move up and down to lift the wafer or detach from the wafer; when the first deflection correcting part lifts the wafer, it can drive the wafer to move along the radial direction of the wafer boat; A second deflection correcting part is installed in the middle of the lifting platform; the second deflection correcting part can move up and down to lift the wafer or detach from the wafer; when the second deflection correcting part lifts the wafer, it can drive the wafer to move along the radial direction of the wafer boat; The third deflection correcting part is installed at the other end of the lifting platform; the third deflection correcting part can move up and down to lift the wafer or detach from the wafer; when the third deflection correcting part lifts the wafer, it can drive the wafer to move radially along the wafer boat.

2. The wafer position detection and adjustment device according to claim 1, characterized in that: The second deviation correcting unit comprises: A first servo motor is slidably mounted in the lifting platform in a vertical direction; A first fixing seat is fixedly installed in the lifting platform and is located above the first servo motor; a first threaded hole is formed on the first fixing seat; A first movable seat is slidably installed in the lifting platform along a vertical direction and is located above the first fixed seat; a second threaded hole is formed on the first movable seat; the pitch of the second threaded hole is smaller than the pitch of the first threaded hole; A first transmission shaft, with an axis arranged vertically, and a bottom end fixedly connected to an output shaft of the first servo motor; a first threaded section is arranged at the bottom of the first transmission shaft, and a second threaded section is arranged at the top; the first threaded section is adapted to the first threaded hole; and the second threaded section is adapted to the second threaded hole; A first bearing seat, the bottom surface of which is fixedly connected to the top surface of the first movable seat; A second servo motor is slidably mounted on the top surface of the first bearing seat in a horizontal direction; A second fixing seat is fixedly mounted on the top surface of the first bearing seat; a third threaded hole is formed on the second fixing seat; The second movable seat is slidably mounted on the top surface of the first bearing seat in a horizontal direction; a fourth threaded hole is formed on the second movable seat; the pitch of the fourth threaded hole is smaller than the pitch of the third threaded hole; A second transmission shaft, the axis of which is horizontally arranged, and one end of which is fixedly connected to the output shaft of the second servo motor; a third thread segment is arranged at one end of the second transmission shaft, and a fourth thread segment is arranged at the other end; the third thread segment is adapted to the third threaded hole; and the fourth thread segment is adapted to the fourth threaded hole; A second bearing seat, fixedly mounted on an end of the second transmission shaft away from the second servo motor; The structure of the first deflection correcting portion is the same as that of the second deflection correcting portion; the structure of the third deflection correcting portion is the same as that of the second deflection correcting portion.

3. The wafer position detection and adjustment device according to claim 1, characterized in that: The lifting mechanism also includes: A guide column, with an axis arranged vertically; a lifting platform movable in a vertical direction is installed on the guide column.

4. The wafer position detection and adjustment device according to claim 1, characterized in that: A wafer entry and exit is formed on one side of the wafer boat.

5. A vertical furnace, characterized in that: It comprises a wafer loading and unloading chamber, a robot and a wafer position detection and adjustment device as claimed in any one of claims 1 to 4; The wafer loading and unloading chamber is provided with the robot, the wafer boat, the lifting mechanism, the detection component and the deviation correction mechanism; The robot is used to transfer the wafer to the wafer boat.

6. The vertical furnace according to claim 5, characterized in that: Also includes: The rotating mechanism is arranged in the wafer loading and unloading chamber and connected to the wafer boat, and can drive the wafer boat to rotate around an axis.

7. The vertical furnace according to claim 5, characterized in that: Also includes: A filter is disposed in the wafer loading and unloading chamber and is located on one side of the wafer boat; a nitrogen outflow hole is formed on the filter, and nitrogen is blown toward the wafer boat through the nitrogen outflow hole; A heat exchanger is disposed in the wafer loading and unloading chamber and is located on the other side of the wafer boat; a nitrogen recovery hole is formed on the heat exchanger; A reflux pipe is arranged at the bottom of the wafer loading and unloading chamber and is communicated with the filter and the heat exchanger respectively.

8. The vertical furnace according to claim 7, characterized in that: Also includes: The fan is installed in the return pipe.

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