Miniaturized efficient refrigeration device for ICP spectrum analyzer glass rotational flow fog chamber

By using a combination of semiconductor refrigeration sheet and thermal grease layer in the glass cyclone mist chamber, the problems of large volume, high energy consumption and low refrigeration efficiency in the prior art are solved, and small-scale, high-efficiency refrigeration and precise control are achieved The temperature improves the accuracy and reliability of the analysis results.

CN119309373APending Publication Date: 2025-01-14NCS JIANGSU TESTING TECH CO LTD
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Patent Information

Application Number
CN202411689940.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-25
Publication Date
2025-01-14

AI Technical Summary

Technical Problem

The existing glass cyclone mist chamber refrigeration equipment has large volume, high energy consumption, high noise and low refrigeration efficiency, which affects the accuracy and reliability of the analysis results.

Method used

The semiconductor refrigeration sheet and thermal grease layer are combined with a radiator and fan to control the temperature in real time through a platinum resistor, and the insulation cotton is used to isolate the external heat, so as to achieve rapid cooling and precise temperature control.

Benefits of technology

It realizes miniaturization and efficient refrigeration, reduces noise, improves refrigeration efficiency and equipment stability, and ensures the accuracy and reliability of analysis results.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a miniaturized efficient refrigerating device for a glass rotational flow fog chamber of an ICP spectrum analyzer. The miniaturized efficient refrigerating device comprises a box body, and the box body is provided with a bearing area used for containing a rotational flow fog chamber vessel and a refrigerating area used for dissipating heat of the bearing area; the bearing area comprises a fog chamber support, an opening is formed in the upper end of the fog chamber support and used for containing the vessel, and the side, close to the refrigeration area, of the fog chamber support is of a vertical face structure. The refrigeration area is provided with a semiconductor refrigeration sheet used in cooperation with the vertical face, and the semiconductor refrigeration sheet is connected to a radiator. The control panel is connected to the semiconductor chilling plate, the semiconductor chilling plate is adopted as a refrigeration source, and compared with a traditional compressor type refrigerator, the size is smaller, occupied space is small, and space layout and equipment management of a laboratory are facilitated.
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Description

Technical Field

[0001] The invention relates to the application field of ICP spectrum analysis technology, and in particular to a miniaturized high-efficiency refrigeration device for a glass cyclonic flow mist chamber of an ICP spectrum analyzer. Background Art

[0002] In the field of inductively coupled plasma spectrometry, the analysis and injection of organic samples sometimes need to be carried out in a low temperature environment to ensure the accuracy and reliability of the analysis results. In this process, the glass cyclone spray chamber is a key device, which is responsible for separating large droplets in the aerosol, thereby ensuring the stability of the analysis results. At the same time, the glass cyclone spray chamber is also the last injection processing unit before combustion. When low-temperature injection at minus 5 degrees to minus 15 degrees is required, the glass cyclone spray chamber must be quickly cooled.

[0003] The existing solution is usually to use large refrigeration equipment, such as compressor refrigerators, to provide a low temperature environment for the glass cyclonic mist chamber. These devices are usually large in size, high in energy consumption, and produce loud noise during operation. In addition, due to their relatively low refrigeration efficiency, it often takes a long time to reach the required low temperature state.

[0004] The problems existing in the prior art in this field are mainly as follows:

[0005] First, the existing refrigeration equipment is large in size and occupies a lot of space, which is not conducive to the laboratory's space layout and equipment management.

[0006] Secondly, these devices have high energy consumption, which increases the cost of the experiment.

[0007] Thirdly, the existing equipment will generate a lot of noise during operation, affecting the working environment of the laboratory.

[0008] Finally, the refrigeration efficiency of existing equipment is relatively low and cannot quickly reach the required low temperature state, which may affect the accuracy and reliability of the analysis results.

[0009] Therefore, there is an urgent need to provide a miniaturized and efficient refrigeration device for the glass cyclonic spray chamber of an ICP spectrometer. Summary of the invention

[0010] In order to solve the above technical problems, the present invention provides a miniaturized and efficient refrigeration device for the glass cyclone mist chamber of an ICP spectrometer, which adopts a semiconductor refrigeration sheet as a refrigeration source. Compared with traditional compressor-type refrigerators, it has a smaller size and occupies less space, which is beneficial to the spatial layout and equipment management of the laboratory.

[0011] The technical solution of the present invention is: a miniaturized high-efficiency refrigeration device for a glass cyclonic mist chamber of an ICP spectrometer, comprising a box body, wherein the box body has a supporting area for placing a cyclonic mist chamber vessel and a refrigeration area for dissipating heat from the supporting area;

[0012] The supporting area includes a mist chamber support, an upper end of the mist chamber support is provided with an opening for placing the vessel, and a side of the mist chamber support close to the refrigeration area is a vertical surface structure;

[0013] The refrigeration zone has a semiconductor refrigeration sheet used in conjunction with the vertical surface, and the semiconductor refrigeration sheet is connected to a radiator;

[0014] It also includes a control board connected to the semiconductor refrigeration plate.

[0015] Furthermore, the box body is provided with a bottom plate, and the mist chamber support is connected to the bottom plate through a receiving block.

[0016] Furthermore, the inner cavity of the mist chamber support is a shape structure for use with the vessel, and a through hole is provided at the bottom of the mist chamber support, and the bottom plate and the receiving block are provided with a through groove for use with the through hole, and one end of the vessel passes through the through hole and extends out of the mist chamber support.

[0017] Furthermore, the mist chamber support is wrapped with thermal insulation cotton all around.

[0018] Furthermore, the supporting area is provided with a heat-insulating cover plate used in conjunction with the mist chamber support.

[0019] Furthermore, a heat-conducting layer is provided between the vertical surface of the mist chamber support and the semiconductor refrigeration sheet.

[0020] Furthermore, the heat-conducting layer is a thermally conductive silicone grease layer, and the thickness of the thermally conductive silicone grease layer is 0.01 mm.

[0021] Furthermore, the radiator is composed of heat pipes and fins, and the fins are provided in two groups.

[0022] Furthermore, the box body is provided with a heat dissipation fan, and the side wall of the box body is provided with heat dissipation holes used in conjunction with the heat dissipation fan.

[0023] Furthermore, the mist chamber support is provided with a platinum resistor, and the platinum resistor is connected to the control board.

[0024] The beneficial technical effects of the present invention are:

[0025] 1. The present invention provides an aluminum mist chamber support that can wrap the glass cyclone mist chamber. One side of the mist chamber support is provided with a vertical surface, and the vertical surface is in contact with the cooling surface of the semiconductor cooling sheet. The contact surface between the mist chamber support and the semiconductor cooling sheet is filled with a thermal conductive silicone grease layer. This design can effectively transfer the cooling energy of the semiconductor cooling sheet to the mist chamber support, thereby reducing the temperature of the glass cyclone mist chamber.

[0026] 2. The heat dissipation surface of the semiconductor cooling chip is attached to the radiator, and the attached surface is filled with a thermal conductive silicone grease layer. The radiator is composed of a heat pipe and aluminum fins. This design can effectively dissipate the heat generated by the semiconductor cooling chip, thereby improving the cooling efficiency.

[0027] 3. There are two cooling fans on both sides of the radiator. The two cooling fans form a horizontal flow. This design can speed up the air flow, thereby further improving the heat dissipation efficiency, and also reduce the operating noise of the equipment.

[0028] 4. A platinum resistor is installed on the spray chamber support. The resistance value maps the temperature value. The temperature is controlled and monitored in real time through the control panel, and the target temperature can be quickly reached and maintained. This design can achieve precise temperature control of the equipment, thereby ensuring the accuracy and reliability of the analysis results.

[0029] 5. The mist chamber is wrapped with thermal insulation cotton to isolate the outside temperature. This design can effectively prevent the influence of external heat on the equipment, thereby improving the stability and reliability of the equipment.

[0030] 6. Through the heat insulation treatment of heat pipes, fins, fans and thermal insulation cotton, the temperature of the fog chamber can be reduced to minus 20 degrees within 30 minutes, which can meet the needs of testing in more scenarios.

[0031] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0033] Figure 2 It is a schematic diagram of the internal structure of the present invention;

[0034] Figure 3 It is a schematic diagram of the connection structure of the mist chamber support, the semiconductor refrigeration sheet and the heat sink of the present invention;

[0035] Figure 4 It is a schematic diagram of the connection structure of the mist chamber support, the receiving block and the bottom plate of the present invention;

[0036] Figure 5It is a schematic structural diagram of the mist chamber support of the present invention.

[0037] The accompanying drawings are marked as follows:

[0038] 100, box body; 110, supporting area; 111, receiving block; 112, mist chamber support; 1121, vertical surface; 120, cooling area; 121, heat pipe; 122, fin; 123, cooling fan; 124, semiconductor cooling sheet; 130, bottom plate; 200, container; 300, thermal insulation cotton; 400, control board. DETAILED DESCRIPTION

[0039] In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the specific implementation methods of the present invention are further described in detail below in conjunction with the drawings and examples. The following examples are used to illustrate the present invention but are not used to limit the scope of the present invention.

[0040] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so as to describe the embodiments of the present application described herein.

[0041] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships described in the embodiments and shown in the accompanying drawings, or are directions or positional relationships in which the inventive product is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0042] like Figure 1-Figure 5 As shown, the present invention specifically relates to a miniaturized and efficient refrigeration device for a glass cyclonic mist chamber of an ICP spectrometer, comprising a housing 100, wherein the housing 100 has a supporting area 110 for placing a cyclonic mist chamber vessel 200 and a refrigeration area 120 for dissipating heat from the supporting area 110;

[0043] The supporting area 110 includes a mist chamber support 112. The upper end of the mist chamber support 112 is provided with an opening for placing the vessel 200. The side of the mist chamber support 112 close to the refrigeration area 120 is a vertical surface 1121 structure.

[0044] The refrigeration zone 120 has a semiconductor refrigeration sheet 124 used in conjunction with the vertical surface 1121, and the semiconductor refrigeration sheet 124 is connected to a radiator;

[0045] The device also includes a control board 400 connected to the semiconductor cooling plate 124 .

[0046] It should be noted that the box body 100 is a whole, and is divided into a supporting area 110 for placing the container 200 and a refrigeration area 120 for dissipating heat from the supporting area 110 according to different functions.

[0047] The vessel 200 is responsible for atomizing the sample and reacting with the plasma to generate a spectral signal for analysis. In ICP analysis, some solutions require analysis at -5 to -15 degrees Celsius, while the instrument is in a room temperature environment, so the glass cyclonic spray chamber must be quickly cooled.

[0048] The interior of the mist chamber support 112 is a shape structure that matches the vessel 200 so as to fix the vessel 200. In addition, the mist chamber support 112 is made of aluminum, and one side of the mist chamber support 112 is a vertical surface 1121 structure, through which the vertical surface 1121 of the mist chamber support 112 is attached to one end of the semiconductor cooling sheet 124, and the other end of the semiconductor cooling sheet 124 is attached to the heat sink, wherein the heat sink is a heat pipe 121 connected to the semiconductor cooling sheet 124 and a fin 122 connected to the heat pipe 121.

[0049] The semiconductor cooling plate 124 is started by controlling the control board 400 to absorb the temperature of the mist chamber support 112 and dissipate the absorbed temperature through the heat pipe 121 and the fins 122 , thereby achieving the purpose of cooling the mist chamber support 112 .

[0050] The box body 100 is provided with a bottom plate 130 , and the mist chamber support 112 is connected to the bottom plate 130 via a receiving block 111 .

[0051] The receiving block 111 is connected to the bottom plate 130 by bolts, a positioning hole is provided on the upper end surface of the receiving block 111, and a positioning groove is provided on the bottom of the mist chamber support 112. The positioning hole is connected to the positioning groove to fix the position of the mist chamber support 112, thereby ensuring the stability of the mist chamber support 112.

[0052] The inner cavity of the mist chamber support 112 is a shape structure used in conjunction with the vessel 200, and a through hole is provided at the bottom of the mist chamber support 112, and the bottom plate 130 and the receiving block 111 are provided with a through groove used in conjunction with the through hole, and one end of the vessel 200 passes through the through hole and extends out of the mist chamber support 112. This ensures the stability of the placement of the vessel 200 and facilitates the connection of one end of the vessel 200 with external equipment.

[0053] The mist chamber support 112 is wrapped with heat-insulating cotton 300 on all sides, and the mist chamber support 112 is completely covered by the heat-insulating cotton 300 to isolate the external temperature. This design can effectively prevent the influence of external heat on the device, thereby improving the stability and reliability of the device.

[0054] The supporting area 110 is provided with a heat-insulating cover plate (not shown) used in conjunction with the mist chamber support 112, which not only ensures the stability of the vessel 200 in the mist chamber support 112, but also isolates the vessel 200 from the external temperature.

[0055] A heat-conducting layer (not shown in the figure) is provided between the vertical surface 1121 of the mist chamber support 112 and the semiconductor cooling sheet 124 to improve the heat dissipation efficiency.

[0056] Furthermore, the heat-conducting layer is a thermally conductive silicone grease layer, and the thickness of the thermally conductive silicone grease layer is 0.01 mm.

[0057] The radiator is composed of a heat pipe 121 and fins 122, and the fins 122 are provided with two groups. One end of the heat pipe 121 is connected to the semiconductor refrigeration sheet 124, and the other end of the heat pipe 121 is connected to the fins 122, so as to improve the heat dissipation efficiency. In combination with the heat insulation treatment of the mist chamber support 112 by the thermal insulation cotton 300, the ambient temperature of the mist chamber support 112 can be reduced to minus 20 degrees.

[0058] The box body 100 is provided with a heat dissipation fan 123 , and the side wall of the box body 100 is provided with heat dissipation holes used in conjunction with the heat dissipation fan 123 .

[0059] The mist chamber support 112 is provided with a platinum resistor (not shown in the figure), which is connected to the control board 400. The resistance value maps the temperature value, and the temperature is controlled and monitored in real time by the circuit board, so that the target temperature can be quickly reached and maintained. This design can achieve precise temperature control of the device, thereby ensuring the accuracy and reliability of the analysis results.

[0060] The above embodiments are only specific implementation methods of the present invention, which are used to illustrate the technical solutions of the present invention rather than to limit them. The protection scope of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the aforementioned embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the aforementioned embodiments within the technical scope disclosed by the present invention, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be covered within the protection scope of the present invention.

Claims

1. A miniaturized and highly efficient refrigeration device for a glass cyclonic spray chamber of an ICP spectrometer, characterized in that: The invention comprises a box (100), wherein the box (100) has a supporting area (110) for placing a cyclonic mist chamber vessel (200) and a refrigeration area (120) for dissipating heat from the supporting area (110); The supporting area (110) comprises a mist chamber support (112), the upper end of the mist chamber support (112) is provided with an opening for placing the vessel (200), and the side of the mist chamber support (112) close to the refrigeration area (120) is a vertical surface (1121) structure; The refrigeration zone (120) has a semiconductor refrigeration sheet (124) used in conjunction with the vertical surface (1121), and the semiconductor refrigeration sheet (124) is connected to a radiator; It also includes a control board (400) connected to the semiconductor cooling plate (124).

2. The miniaturized and efficient refrigeration device for the glass cyclonic spray chamber of an ICP spectrometer according to claim 1, characterized in that: The box body (100) is provided with a bottom plate (130), and the mist chamber support (112) is connected to the bottom plate (130) via a receiving block (111).

3. The miniaturized and efficient refrigeration device for the glass cyclonic spray chamber of the ICP spectrometer according to claim 2, characterized in that: The inner cavity of the mist chamber support (112) is of a shape structure suitable for use with the vessel (200), and a through hole is provided at the bottom of the mist chamber support (112), and the bottom plate (130) and the receiving block (111) are provided with a through groove suitable for use with the through hole, and one end of the vessel (200) passes through the through hole and extends out of the mist chamber support (112).

4. The miniaturized and efficient refrigeration device for the glass cyclonic spray chamber of an ICP spectrometer according to claim 3, characterized in that: The mist chamber support (112) is wrapped with heat-insulating cotton (300) on all sides.

5. The miniaturized and efficient refrigeration device for the glass cyclonic spray chamber of an ICP spectrometer according to claim 1, characterized in that: The supporting area (110) is provided with a heat-insulating cover plate used in conjunction with the mist chamber support (112).

6. The miniaturized and highly efficient refrigeration device for the glass cyclonic spray chamber of an ICP spectrometer according to claim 1, characterized in that: A heat-conducting layer is provided between the vertical surface (1121) of the mist chamber support (112) and the semiconductor cooling sheet (124).

7. The miniaturized high-efficiency refrigeration device for the glass cyclonic spray chamber of the ICP spectrometer according to claim 6, characterized in that: The heat-conducting layer is a heat-conducting silicone grease layer, and the thickness of the heat-conducting silicone grease layer is 0.01 mm.

8. The miniaturized and highly efficient refrigeration device for the glass cyclonic spray chamber of an ICP spectrometer according to claim 1, characterized in that: The heat sink is composed of a heat pipe (121) and fins (122), and the fins (122) are provided in two groups.

9. The miniaturized and highly efficient refrigeration device for the glass cyclonic spray chamber of an ICP spectrometer according to claim 1, characterized in that: The box body (100) is provided with a heat dissipation fan (123), and the side wall of the box body (100) is provided with heat dissipation holes used in conjunction with the heat dissipation fan (123).

10. The miniaturized and highly efficient refrigeration device for the glass cyclonic spray chamber of an ICP spectrometer according to claim 1, characterized in that: The mist chamber support (112) is provided with a platinum resistor, and the platinum resistor is connected to the control board (400).