Temperature monitoring method, equipment, medium, computer program product and device

Abstract

The invention relates to a temperature monitoring method. The method comprises the following steps: detecting the average temperature of a plurality of detection areas of a detected device; and when the temperature abnormality occurs in the first detection area, determining the device with the abnormal temperature in the first detection area according to the change of the average temperature of the first detection area and the average temperature of other detection areas along with time. The invention also relates to a temperature monitoring device, a medium, a computer program product and an arrangement.

Description

Technical Field

[0001] The present invention relates to the field of computer technology, and in particular to a temperature monitoring method, device, medium, computer program product and apparatus. Background Art

[0002] With the rapid development of automotive electronic technology, the degree of electrification of automobiles is increasing, and the market's requirements for the reliability and safety of their functions are becoming more and more stringent. Among the many types of failures in electronic equipment, thermal failure is a common form of failure, which is mainly manifested in the impedance abnormality caused by short circuit or device failure during circuit operation, which in turn causes electronic devices to overheat or local temperature to rise rapidly. In order to ensure the normal operation of the vehicle, it is particularly important to detect and report these abnormal temperature changes in a timely manner and take appropriate measures to deal with them.

[0003] In the prior art, the commonly used temperature detection method is the negative temperature coefficient thermistor (NTC thermistor), whose resistance value decreases as the temperature increases. Through the voltage divider circuit and the temperature-resistance relationship curve, the temperature change at the corresponding position can be detected. However, this method can only detect the temperature of a single position, and when the temperature rise point is far away from the thermistor, the detection accuracy and response speed will be significantly reduced. Therefore, when faced with the need for faster and more accurate temperature monitoring, the prior art has certain limitations. Summary of the invention

[0004] The purpose of the present invention is to provide a temperature monitoring method, equipment, medium, computer program product and device to solve the technical problem of being unable to quickly and accurately locate temperature abnormal points.

[0005] A first embodiment of the present invention discloses a temperature monitoring method, comprising:

[0006] Detecting the average temperature of multiple detection areas of the device under test;

[0007] When a temperature abnormality occurs in the first detection area, a device having a temperature abnormality in the first detection area is determined according to changes in an average temperature of the first detection area and average temperatures of other detection areas over time.

[0008] According to the temperature monitoring method of the first embodiment of the present invention, the relationship between the average temperature of the detection area and the temperature of the device under test is expressed as follows: Where t represents time, U m (t) represents the average temperature of the detection area marked by m, η nm represents the weight of the device identified by n to the detection area identified by m, u n(t; x n ,y n ,z n ) represents the temperature function of the device identified by n;

[0009] The device for determining the temperature abnormality in the first detection area includes: a device for determining the temperature abnormality in the first detection area based on the formula.

[0010] According to the temperature monitoring method of the first embodiment of the present invention, η nm Calibration based on big data analysis.

[0011] According to the temperature monitoring method of the first embodiment of the present invention, each of the detection areas has a predetermined corresponding normal temperature range; the method further comprises:

[0012] Monitoring whether the average temperature of each detection area exceeds the corresponding normal temperature range;

[0013] When the average temperature of the first detection area exceeds the corresponding normal temperature range, it is determined that a temperature abnormality occurs in the first detection area.

[0014] According to the temperature monitoring method of the first embodiment of the present invention, different detection areas overlap.

[0015] A second embodiment of the present invention discloses an electronic device, which includes a memory storing computer executable instructions and a processor. When the instructions are executed by the processor, the electronic device implements the temperature monitoring method according to the first embodiment of the present invention.

[0016] The third embodiment of the present invention discloses a computer storage medium, on which instructions are stored. When the instructions are executed on a computer, the computer is enabled to execute the temperature monitoring method according to the first embodiment of the present invention.

[0017] A fourth embodiment of the present invention discloses a computer program product, comprising computer executable instructions, wherein the instructions are executed by a processor to implement the temperature monitoring method according to the first embodiment of the present invention.

[0018] A fifth embodiment of the present invention discloses a temperature monitoring device, comprising:

[0019] A plurality of non-contact temperature sensors, each of which detects an average temperature of a corresponding detection area of ​​the device under test;

[0020] A control unit, when a temperature abnormality occurs in the first detection area, the control unit determines the device with temperature abnormality in the first detection area according to the change of the average temperature of the first detection area and the average temperature of other detection areas over time.

[0021] Compared with the prior art, the main differences and effects of the embodiments of the present invention are:

[0022] In the present invention, the principle of heat conduction is combined, the influence of space and time factors on temperature is taken into consideration, and the weighted proportion of the factors affecting temperature rise of each device under test is obtained through big data analysis based on the calibration data. The fault point can be accurately located in combination with a specific layout. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A simplified layout diagram of a three-phase full-bridge drive circuit according to an embodiment of the present application is shown.

[0024] Figure 2 A schematic diagram showing a temperature monitoring device according to an embodiment of the present application.

[0025] Figure 3 Show Figure 1 The detection area of ​​the device in the three-phase full-bridge drive circuit.

[0026] Figure 4 A flow chart of a temperature monitoring method according to an embodiment of the present application is shown.

[0027] Figure 5 A hardware structure block diagram of an electronic device implementing a temperature monitoring method according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0028] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0029] As an example of electronic devices in cars, Figure 1 A simplified layout diagram of a three-phase full-bridge drive circuit is shown. Figure 1 The various devices in the figure represent the IGBT (Insulated Gate Bipolar Transistor, IGBT) and drive circuit used in the automotive motor drive module, which are used to control the upper and lower bridge switching operations of the three-phase motor respectively. The specific explanation is as follows:

[0030] UVW three-phase upper three-bridge IGBT:

[0031] UH5, VH5, WH5: upper bridge IGBTs of U phase, V phase, and W phase respectively.

[0032] UVW three-phase lower three-bridge IGBT:

[0033] UL5, VL5, WL5: are the lower bridge IGBTs of U phase, V phase, and W phase respectively.

[0034] U-phase upper bridge driver:

[0035] UH1, UH2, UH3, UH4, UH6, UH7, UH8, UH9, UH10, UH11: These are the drive circuits used to drive the U-phase upper bridge IGBT (i.e. UH5).

[0036] Driver device for V phase upper bridge:

[0037] VH1, VH2, VH3, VH4, VH6, VH7, VH8, VH9, VH10, VH11: These are the drive circuits used to drive the V-phase upper bridge IGBT (i.e. VH5).

[0038] Driver device for W phase upper bridge:

[0039] WH1, WH2, WH3, WH4, WH6, WH7, WH8, WH9, WH10, WH11:

[0040] These are the drive circuits used to drive the W-phase upper bridge IGBT (ie WH5).

[0041] U phase lower bridge driver:

[0042] UL1, UL2, UL3, UL4, UL6, UL7, UL8, UL9, UL10, UL11: These are the drive circuits used to drive the U-phase lower bridge IGBT (i.e. UL5).

[0043] Driver of V phase lower bridge:

[0044] VL1, VL2, VL3, VL4, VL6, VL7, VL8, VL9, VL10, VL11: These are the drive circuits used to drive the V-phase lower bridge IGBT (i.e. VL5).

[0045] Driver device of W phase lower bridge:

[0046] WL1, WL2, WL3, WL4, WL6, WL7, WL8, WL9, WL10, WL11: These are the driving circuits for driving the W-phase lower bridge IGBT (i.e. WL5).

[0047] The upper and lower IGBTs of each phase work together with the corresponding driving devices to achieve current control of each phase of the automobile motor, thereby driving the automobile motor to operate normally.

[0048] For such a three-phase full-bridge drive circuit, the prior art using NTC thermistors for temperature detection can only detect the temperature of a single location, and when the temperature rise point is far away from the thermistor, the detection accuracy and response speed will be significantly reduced. In order to solve this problem, an embodiment of the present application proposes a temperature monitoring device, including: multiple non-contact temperature sensors and a control unit.

[0049] Each non-contact temperature sensor detects the average temperature of a corresponding detection area of ​​the device under test, and there is overlap between different detection areas. Figure 2 As shown, the temperature monitoring device 20 includes an MCU 21 (Microcontroller Unit, i.e., a control unit), a plurality of signal conditioning circuits 221-22n, and a plurality of infrared receivers (non-contact temperature sensors) 231-23n. There is a height h between each infrared receiver and the surface of the detected device. By adjusting the height h, the detection area of ​​the infrared receiver on the surface of the corresponding detected device can be adjusted. The detection area can be any shape such as a circle, an ellipse, a rectangle, etc. Figure 2 A circle with a radius of R is taken as an example. Different infrared receivers correspond to the height h between each and the surface of the detected device and the radius R of the detection area, that is, the infrared receiver 231 corresponds to the height h1 and the radius R1, the infrared receiver 232 corresponds to the height h2 and the radius R2, the infrared receiver 231 corresponds to the height h3 and the radius R3, and the infrared receiver 23n corresponds to the height hn and the radius Rn. The average temperature of each detection area will be transmitted to the corresponding infrared receiver, and can be transmitted to the MCU through the filtering and amplification processing of the corresponding signal conditioning circuit; for example, the average temperature of the detection area n will be transmitted to the infrared receiver 23n, and can be transmitted to the MCU21 through the filtering and amplification processing of the corresponding signal conditioning circuit 22n. The same applies to other detection areas. The number of detection areas, conditioning circuits, and infrared receivers in this application can be any suitable number.

[0050] Figure 3 Shown as Figure 1The devices of the three-phase full-bridge drive circuit are divided into 8 detection areas. In addition to detecting the devices of the U-phase upper bridge, detection area 1 also needs to detect some devices of the V-phase upper bridge: VH1, VH2, VH3, and VH4; in addition to detecting the devices of the V-phase upper bridge, detection area 3 also needs to detect some devices of the U-phase upper bridge: UH8, UH9, UH10, and UH11, and some devices of the W-phase upper bridge: WH1, WH2, WH3, and WH4; in addition to detecting the devices of the W-phase upper bridge, detection area 5 also needs to detect some devices of the V-phase upper bridge: VH8, VH9, VH10, and VH11; in addition to detecting the devices of the U-phase lower bridge, detection area 2 also needs to detect some devices of the V-phase lower bridge: VL1, VL2, VL3, and VL4; detection area 4 In addition to detecting the devices of the V-phase lower bridge, it is also necessary to detect some devices of the U-phase lower bridge: UL8, UL9, UL10, UL11, and some devices of the W-phase lower bridge: WL1, WL2, WL3, WL4; In addition to detecting the devices of the W-phase lower bridge, detection area 6 also needs to detect some devices of the V-phase lower bridge: VL8, VL9, VL10, VL11; detection area 7 detects some devices of the U-phase upper and lower bridges: UH1, UH2, UH3, UH4, UL1, UL2, UL3, UL4; detection area 8 detects some devices of the W-phase upper and lower bridges: WH8, WH9, WH10, WH11, WL8, WL9, WL10, WL11.

[0051] The temperature at any location on the device under test is affected not only by the temperature of the device at that location, but also by the temperature of the device at other locations. The influence of the device temperature at other locations is determined by the temperature of the device at the other location, the distance of the other location, and the conduction time. This influence can be described by the following heat conduction equation (or heat equation) (1), which describes how the temperature in a region changes with time.

[0052]

[0053] u=u(t,x,y,z) represents the temperature of an object, which is a function of time t and spatial variables (x,y,z); is the rate of change of temperature at a point in space with respect to time; u xx ,u yy ,u zz It is the second derivative of temperature with respect to the three spatial coordinate axes; k is the thermal diffusivity, which is determined by the thermal conductivity, density and heat capacity of the material.

[0054] In the present application, the detection area is divided, and the average temperature of each detection area is detected by the corresponding non-contact temperature sensor. Combined with the above heat conduction principle, the temperature detected by the non-contact temperature sensor is determined by the temperature of the device in the detection area it is responsible for, and the temperature of the device in the detection area is affected by the temperature of the device in other detection areas, or will affect the temperature of the device in other detection areas. Therefore, in theory, when a temperature abnormality occurs in any detection area (the first detection area), the MCU can determine the device with temperature abnormality in the first detection area based on the change of the average temperature of the detection area and the average temperature of other detection areas over time.

[0055] refer to Figure 2 and Figure 3 For example, when device UH5 is overheated, the average temperature of detection area 1 where it is located rises, and the corresponding infrared receiver 231 can immediately recognize it, and this moment is recorded as t1; at t1, the temperature changes in other detection areas are not obvious, and other infrared receivers detect that the temperature is normal, because UH5 only belongs to detection area 1, and it takes time to affect other detection areas. The temperature anomaly of some devices can immediately affect multiple detection areas at the same time. For example, if device UH10 is overheated, the infrared receivers in detection areas 1 and 3 can immediately recognize it.

[0056] The MCU receives the fault condition at time t1, that is, only the average temperature of detection area 1 is detected to be increased, so the faulty device can be quickly locked as one or more of UH5, UH6, and UH7, because only the temperature abnormality of these devices will immediately affect, and only immediately affect, detection area 1.

[0057] As time goes by, the temperature of UH5 increases, and through heat conduction, detection areas 3 and 7, which are closer to UH5, are successively identified as over-temperature, and this moment is recorded as t2; as time goes by, detection area 2 is also identified as over-temperature, that is, this moment is t3; and so on for other detection areas. The order in which over-temperature is detected is determined by the positive correlation between the length of time required for heat conduction and the distance. Based on this order, the MCU can further narrow the scope of faulty devices to UH5, and exclude the other two devices. For example, UH7 is excluded because the over-temperature of UH7 will first affect detection area 2.

[0058] Therefore, compared with the traditional NTC solution, the embodiment of the present application can quickly and accurately identify temperature abnormal points.

[0059] In the present application, each detection area has a predetermined corresponding normal temperature range; the control unit monitors whether the average temperature of each detection area exceeds the corresponding normal temperature range; when the average temperature of the first detection area exceeds the corresponding normal temperature range, it is determined that a temperature abnormality occurs in the first detection area. For example, the normal temperature range of detection area 1 is (a1, b1). When the MCU recognizes that the actual average temperature of detection area 1 is T1≤a1 or T1≥b1, it can be determined that there are abnormal devices in detection area 1; wherein, if T1≤a1, it may be that one of the devices is not working properly, so there is no normal heating, and if T1≥b1, it may be that one of the devices is overheating. Other detection areas are similar, for example, the normal temperature range of detection area 2 is (a2, b2), the normal temperature range of detection area 3 is (a3, b3)... The normal temperature range of detection area 8 is (a8, b8).

[0060] Furthermore, in order to provide a temperature monitoring method that can be accurately executed by the MCU, the relationship between the temperature sensed by the non-contact temperature sensor and the temperature of the device under test can be expressed as follows:

[0061]

[0062] Where t represents time, U m (t) represents the temperature sensed by the non-contact temperature sensor denoted by m, η nm represents the weight of the device identified by n to the non-contact temperature sensor identified by m, u n (t; x n ,y n ,z n ) represents the temperature function of the device identified by n. nm It can be calibrated based on big data analysis.

[0063] The embodiment of the present application provides a temperature monitoring method for an electronic device, including an MCU used in the embodiment of the present application. The flow chart is as follows: Figure 4 As shown, including:

[0064] S202, detecting average temperatures of multiple detection areas of the device under test.

[0065] S204, when a temperature abnormality occurs in the first detection area, in S206, the device with temperature abnormality in the first detection area is determined according to the change of the average temperature of the first detection area and the average temperature of other detection areas over time.

[0066] Determining the device with abnormal temperature in the first detection area includes: determining the device with abnormal temperature in the first detection area based on a formula. For example, Figure 2The MCU 21 in the detection area determines the device with abnormal temperature in the first detection area based on the change of temperature sensed by multiple non-contact temperature sensors over time based on formula (2). Specifically, the temperature detected by the infrared temperature receiver 231 (labeled as 1) in the detection area 1 is:

[0067] u1=u(t,x1,y1,z1)*η 11 +u(t,x2,y2,z2)*η 21 …+u(t,x n ,y n ,z n )*η n1 ,

[0068] That is, the weight η of the device at position 1 relative to the infrared temperature receiver marked as 1 (infrared temperature receiver 231) at the current moment is 11 The product of the function of its temperature, plus the weight η of the device at position 2 relative to the infrared temperature receiver marked as 1 at the current moment 21 The product of the function of its temperature is added to the weighted η of the infrared temperature receiver of the device at position n relative to the infrared temperature receiver marked as 1 at the current moment. n1 and its temperature.

[0069] Similarly, the infrared temperature receiver 232 (labeled as 2) in detection area 2 detects a temperature of

[0070] u2=u(t,x1,y1,z1)*η 12 +u(t,x2,y2,z2)*η 22 …+u(t,x n ,y n ,z n )*η n2 ,

[0071] The infrared temperature receiver 233 (labeled as 3) in the detection area 3 detects the temperature as follows:

[0072] u3=u(t,x1,y1,z1)*η 13 +u(t,x2,y2,z2)*η 23 …+u(t,x n ,y n ,z n )*η n3 ,

[0073] Similarly, the temperature detected by other infrared temperature receivers can also be obtained;

[0074] u4=u(t,x1,y1,z1)*η 14 +u(t,x2,y2,z2)*η 24…+u(t,x n ,y n ,z n )*η n4

[0075] u5=u(t,x1,y1,z1)*η 15 +u(t,x2,y2,z2)*η 25 …+u(t,x n ,y n ,z n )*η n5

[0076] u6=u(t,x1,y1,z1)*η 16 +u(t,x2,y2,z2)*η 26 …+u(t,x n ,y n ,z n )*η n6

[0077] u7=u(t,x1,y1,z1)*η 17 +u(t,x2,y2,z2)*η 27 …+u(t,x n ,y n ,z n )*η n7

[0078] u8=u(t,x1,y1,z1)*η 18 +u(t,x2,y2,z2)*η 28 …+u(t,x n ,y n ,z n )*η n8

[0079] Combined with the temperature data detected by the infrared temperature receivers in the above-mentioned areas at different times, the corresponding abnormal temperature points can be quickly and accurately located. When applied to the field of electric control, the specific temperature rise point of the three-phase full bridge can be accurately located. From the perspective of the whole machine strategy, whether to protect the IGBT and driver components by accelerating the water circulation and closing the bridge arm can be considered; when applied to the field of BMS, the abnormal position of the balancing resistor can be quickly located to determine whether the battery cell is abnormal; in addition, it can also be applied to other fields to detect related thermal failure scenarios, adjust the control strategy in time, and protect the circuit in time.

[0080] Compared with the NTC in the prior art, take the overheating of a single device UH5 as an example. If the NTC collection point is placed exactly at the position of the device VH6, the temperature collection point at the VH6 position cannot be collected at the first time. Only when UH5 heats up for a period of time and the temperature is transmitted to the position of VH6, will VH6 be identified as overheated. At this time, the overheating of VH6 identified may not be accurate, and it can only feedback that there is a device abnormality but cannot identify the location of the abnormal point. In addition, the heat of UH5 may not be transmitted to the position of VH6, so UH5, which is already abnormal at this time, cannot be identified.

[0081] Therefore, compared with the traditional NTC solution, the embodiment of the present application can quickly and accurately identify temperature abnormal points.

[0082] Figure 5 It is a hardware structure block diagram of an electronic device that implements the temperature monitoring method according to an embodiment of the present application.

[0083] like Figure 5 As shown, the electronic device 500 may include one or more processors 502, a system motherboard 508 connected to at least one of the processors 502, a system memory 504 connected to the system motherboard 508, a non-volatile memory (NVM) 506 connected to the system motherboard 508, and a network interface 510 connected to the system motherboard 508.

[0084] The processor 502 may include one or more single-core or multi-core processors. The processor 502 may include any combination of a general-purpose processor and a dedicated processor (e.g., a graphics processor, an application processor, a baseband processor, etc.). In an embodiment of the present invention, the processor 502 may be configured to execute one or more embodiments according to various embodiments such as the first embodiment of the present application.

[0085] In some embodiments, system board 508 may include any suitable interface controller to provide any suitable interface to at least one of processors 502 and / or any suitable device or component in communication with system board 508 .

[0086] In some embodiments, the system board 508 may include one or more memory controllers to provide an interface to the system memory 504. The system memory 504 may be used to load and store data and / or instructions. In some embodiments, the system memory 504 of the electronic device 500 may include any suitable volatile memory, such as a suitable dynamic random access memory (DRAM).

[0087] NVM 506 may include one or more tangible, non-transitory computer-readable media for storing data and / or instructions. In some embodiments, NVM 506 may include any suitable non-volatile memory such as flash memory and / or any suitable non-volatile storage device, such as at least one of a HDD (Hard Disk Drive), a CD (CompactDisc) drive, and a DVD (Digital Versatile Disc) drive.

[0088] NVM 506 may include a portion of storage resources installed on a device of electronic device 500, or it may be accessible by the device but not necessarily a portion of the device. For example, NVM 506 may be accessed over a network via network interface 510.

[0089] In particular, the system memory 504 and the NVM 506 may include: a temporary copy and a permanent copy of the instruction 520, respectively. The instruction 520 may include: an instruction that causes the electronic device 500 to implement the method of the first embodiment of the present application when executed by at least one of the processors 502. In some embodiments, the instruction 520, hardware, firmware and / or its software components may be additionally / alternatively placed in the system motherboard 508, the network interface 510 and / or the processor 502.

[0090] The network interface 510 may include a transceiver for providing a radio interface for the electronic device 500, thereby communicating with any other suitable device (e.g., a front-end module, an antenna, etc.) through one or more networks. In some embodiments, the network interface 510 may be integrated with other components of the electronic device 500. For example, the network interface 510 may be integrated with at least one of the processor 502, the system memory 504, the NVM 506, and a firmware device (not shown) having instructions. When at least one of the processors 502 executes the instructions, the electronic device 500 implements one or more embodiments of the various embodiments according to the first embodiment of the present application.

[0091] The network interface 510 may further include any suitable hardware and / or firmware to provide a multiple-input multiple-output radio interface. For example, the network interface 510 may be a network adapter, a wireless network adapter, a telephone modem, and / or a wireless modem.

[0092] In one embodiment, at least one of the processors 502 may be packaged together with one or more controllers for the system motherboard 508 to form a system in package (SiP). In one embodiment, at least one of the processors 502 may be integrated on the same die with one or more controllers for the system motherboard 508 to form a system on a chip (SoC).

[0093] The electronic device 500 may further include an input / output (I / O) device 512 connected to the system motherboard 508. The I / O device 512 may include a user interface to enable a user to interact with the electronic device 500; the design of the peripheral component interface enables the peripheral components to interact with the electronic device 500. In some embodiments, the electronic device 500 further includes a sensor for determining at least one of an environmental condition and location information related to the electronic device 500.

[0094] In some embodiments, I / O device 512 may include, but is not limited to, a display (e.g., a liquid crystal display, a touch screen display, etc.), a speaker, a microphone, one or more cameras (e.g., a still image camera and / or a video camera), a flashlight (e.g., an LED flash), and a keyboard.

[0095] In some embodiments, the peripheral component interface may include, but is not limited to, a non-volatile memory port, an audio jack, and a power interface.

[0096] In some embodiments, the sensors may include, but are not limited to, gyroscope sensors, accelerometers, proximity sensors, ambient light sensors, and positioning units. The positioning unit may also be part of or interact with the network interface 510 to communicate with components of a positioning network (e.g., global positioning system (GPS) satellites).

[0097] It is to be understood that the structure illustrated in the embodiment of the present invention does not constitute a specific limitation on the electronic device 500. In other embodiments of the present application, the electronic device 500 may include more or fewer components than shown in the figure, or combine some components, or split some components, or arrange the components differently. The components shown in the figure may be implemented in hardware, software, or a combination of software and hardware.

[0098] Program code can be applied to input instructions to perform the functions described in the present invention and generate output information. The output information can be applied to one or more output devices in a known manner. For the purposes of this application, a system for processing instructions including processor 502 includes any system having a processor such as a digital signal processor (DSP), a microcontroller, an application specific integrated circuit (ASIC), or a microprocessor.

[0099] Program code can be implemented with high-level programming language or object-oriented programming language to communicate with the processing system. When necessary, program code can also be implemented with assembly language or machine language. In fact, the mechanism described in the present invention is not limited to the scope of any specific programming language. In either case, the language can be a compiled language or an interpreted language.

[0100] One or more aspects of at least one embodiment may be implemented by instructions stored on a computer-readable storage medium, which, when read and executed by a processor, enables an electronic device to implement the method of the embodiment described in the present invention.

[0101] According to some embodiments of the present application, a computer storage medium is disclosed. Instructions are stored on the computer storage medium. When the instructions are executed on a computer, the computer executes the temperature monitoring method according to the embodiments of the present application.

[0102] The method embodiment of the present application corresponds to this embodiment, and this embodiment can be implemented in conjunction with the method embodiment of the present application. The relevant technical details mentioned in the method embodiment of the present application are still valid in the present embodiment, and are not repeated here to reduce repetition. Accordingly, the relevant technical details mentioned in this embodiment can also be applied in the method embodiment of the present application.

[0103] According to some embodiments of the present application, a computer program product is disclosed, including computer executable instructions, where the instructions are executed by a processor to implement a temperature monitoring method according to an embodiment of the present application.

[0104] The method embodiment of the present application corresponds to this embodiment, and this embodiment can be implemented in conjunction with the method embodiment of the present application. The relevant technical details mentioned in the method embodiment of the present application are still valid in the present embodiment, and are not repeated here to reduce repetition. Accordingly, the relevant technical details mentioned in this embodiment can also be applied in the method embodiment of the present application.

[0105] It is to be understood that the specific embodiments described herein are only for explaining the present application, rather than limiting the present application. In addition, for ease of description, only some but not all structures or processes related to the present application are shown in the accompanying drawings. It should be noted that in this specification, similar reference numerals and letters represent similar items in the accompanying drawings.

[0106] It should be understood that although the terms "first", "second", etc. may be used herein to describe various features, these features should not be limited by these terms. These terms are used only to distinguish and should not be understood as indicating or implying relative importance. For example, a first feature may be referred to as a second feature, and similarly a second feature may be referred to as a first feature without departing from the scope of the exemplary embodiments.

[0107] In the description of this application, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this embodiment can be understood according to specific circumstances.

[0108] Illustrative embodiments of the present application include, but are not limited to, temperature monitoring methods, apparatus, media, computer program products, and devices.

[0109] The various aspects of the illustrative embodiments will be described using terms commonly used by those skilled in the art to convey the essence of their work to other persons skilled in the art. However, it is apparent to those skilled in the art that some alternative embodiments may be implemented using the features described in part. For purposes of explanation, specific numbers and configurations are set forth to provide a more thorough understanding of the illustrative embodiments. However, it is apparent to those skilled in the art that alternative embodiments may be implemented without the specific details. In some other cases, some well-known features are omitted or simplified herein to avoid obscuring the illustrative embodiments of the present application.

[0110] In addition, various operations will be described as multiple separate operations in a manner that is most helpful for understanding the illustrative embodiments; however, the order of description should not be interpreted as implying that these operations must rely on the order of description, and many of the operations can be implemented in parallel, concurrently, or simultaneously. In addition, the order of the operations can also be rearranged. When the described operations are completed, the process can be terminated, but can also have additional steps not included in the drawings. The process can correspond to a method, function, procedure, subroutine, subprogram, etc.

[0111] References in the specification to "one embodiment," "an embodiment," "an illustrative embodiment," etc., indicate that the described embodiment may include a particular feature, structure, or property, but each embodiment may or may not necessarily include the particular feature, structure, or property. Moreover, these phrases are not necessarily referring to the same embodiment. In addition, when particular features are described in conjunction with a specific embodiment, the knowledge of those skilled in the art can affect the combination of these features with other embodiments, whether or not these embodiments are explicitly described.

[0112] Unless the context dictates otherwise, the terms "comprising," "having," and "including" are synonymous. The phrase "A and / or B" means "(A), (B), or (A and B)."

[0113] As used herein, the term "module" may refer to, be part of, or include: memory (shared, dedicated, or group) for running one or more software or firmware programs, application-specific integrated circuits (ASICs), electronic circuits and / or processors (shared, dedicated, or group), combinational logic circuits, and / or other suitable components that provide the described functionality.

[0114] In the accompanying drawings, some structural or method features may be shown in a specific arrangement and / or order. However, it should be understood that such a specific arrangement and / or order is not necessary. Instead, in some embodiments, these features may be described in a manner and / or order different from that shown in the illustrative drawings. In addition, the structural or method features included in a specific figure do not mean that all embodiments need to include such features. In some embodiments, these features may not be included or may be combined with other features.

[0115] In some cases, the disclosed embodiments may be implemented in hardware, firmware, software, or any combination thereof. The disclosed embodiments may also be implemented in the form of instructions or programs carried or stored on one or more transient or non-transient machine-readable (e.g., computer-readable) storage media, which may be read and executed by one or more processors, etc. When the instructions or programs are run by the machine, the machine may perform the aforementioned various methods. For example, the instructions may be distributed via a network or other computer-readable medium. Therefore, the machine-readable medium may include, but is not limited to, any mechanism for storing or transmitting information in a machine (e.g., computer) readable form, such as a floppy disk, an optical disk, a compact disk read-only memory (CD-ROMs), a magneto-optical disk, a read-only memory (ROM), a random access memory (RAM), an erasable programmable read-only memory (EPROM), an electronically erasable programmable read-only memory (EEPROM), a magnetic card or an optical card, or a flash memory or a tangible machine-readable memory for transmitting network information via electrical, optical, acoustic, or other forms of signals (e.g., carrier waves, infrared signals, digital signals, etc.). Accordingly, machine-readable media includes any form of machine-readable media suitable for storing or transmitting electronic instructions or information readable by a machine (eg, a computer).

[0116] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the use of the technical solution of the present application is not limited to the various applications mentioned in the embodiments of the present application. Various structures and modifications can be easily implemented with reference to the technical solution of the present application to achieve the various beneficial effects mentioned herein. Various changes made within the knowledge of ordinary technicians in the field without departing from the purpose of the present application should all fall within the scope of the patent coverage of the present application.

Claims

1. A temperature monitoring method, characterized in that: include: Detecting the average temperature of multiple detection areas of the device under test; When a temperature abnormality occurs in the first detection area, a device having a temperature abnormality in the first detection area is determined according to changes in an average temperature of the first detection area and average temperatures of other detection areas over time.

2. The temperature monitoring method according to claim 1, characterized in that: The relationship between the average temperature of the detection area and the temperature of the device under test is expressed as follows: Where t represents time, U m (t) represents the average temperature of the detection area marked by m, η nm represents the weight of the device identified by n to the detection area identified by m, u n (t; x n ,y n ,z n ) represents the temperature function of the device identified by n; The device for determining the temperature abnormality in the first detection area includes: a device for determining the temperature abnormality in the first detection area based on the formula.

3. The temperature monitoring method according to claim 2, characterized in that: η nm Calibration based on big data analysis.

4. The temperature monitoring method according to claim 1, characterized in that: Each of the detection areas has a predetermined corresponding normal temperature range; the method further comprises: Monitoring whether the average temperature of each detection area exceeds the corresponding normal temperature range; When the average temperature of the first detection area exceeds the corresponding normal temperature range, it is determined that a temperature abnormality occurs in the first detection area.

5. The temperature monitoring method according to claim 1, characterized in that: There is overlap between the different detection areas.

6. An electronic device, characterized in that: The electronic device comprises a memory storing computer executable instructions and a processor. When the instructions are executed by the processor, the electronic device implements the temperature monitoring method according to any one of claims 1 to 5.

7. A computer storage medium, characterized in that: Instructions are stored on the computer storage medium. When the instructions are executed on a computer, the computer is enabled to execute the temperature monitoring method according to any one of claims 1 to 5.

8. A computer program product, characterized in that The method comprises computer executable instructions, wherein the instructions are executed by a processor to implement the temperature monitoring method according to any one of claims 1 to 5.

9. A temperature monitoring device, characterized in that: include: A plurality of non-contact temperature sensors, each of which detects an average temperature of a corresponding detection area of ​​the device under test; A control unit, when a temperature abnormality occurs in the first detection area, the control unit determines the device with temperature abnormality in the first detection area according to the change of the average temperature of the first detection area and the average temperature of other detection areas over time.

10. The temperature monitoring device according to claim 9, characterized in that: The detection area is adjusted by the height between the receiver of the non-contact temperature sensor and the surface to be measured.

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