Server

Abstract

The embodiment of the invention provides a server, and relates to the technical field of computing equipment. The server comprises a case, a management board, at least one node board and at least one function module. The chassis includes a first zone and a second zone. In the first direction, the first region is closer to the first side of the chassis than the second region. The management board is arranged in the second area. And the management board is provided with a management module for managing the work of the server. The node plate is provided with a business processing module used for processing business, and the function module is used for cooperating with the business processing module to realize data transmission or processing. Wherein the at least one node plate and / or the at least one function module are / is arranged in the first area and can be pulled out or pushed in from the first side of the case through pluggable connection with the management plate. Therefore, maintenance and replacement of the node plate and / or the function module can be realized without opening a cover plate of the case, the maintenance convenience of the server is improved, and the operation and maintenance convenience is also improved.

Description

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on July 15, 2024, with application number 202410950428.6 and application name “Server”, the entire contents of which are incorporated by reference in this application. Technical Field

[0002] The present application relates to the technical field of computing devices, and in particular to a server. Background Art

[0003] The server includes a chassis, which may include a cover plate, a bottom plate and side walls, wherein the side walls are arranged between the bottom plate and the cover plate and are respectively connected to the bottom plate and the cover plate, so that the cover plate, the bottom plate and the side walls can enclose a receiving cavity. Hardware units of the server, such as node boards and functional modules, are arranged in the receiving cavity.

[0004] Usually, when the hardware unit of the server is inspected, the cover of the chassis needs to be opened so that the hardware unit inside the chassis can be exposed, which affects the convenience of server inspection and causes inconvenience in operation and maintenance. In addition, rack-mounted servers are usually placed in a cabinet. When the server is a rack-mounted server, the server needs to be taken out of the cabinet first, and then the cover needs to be removed, which affects the convenience of server inspection and causes inconvenience in operation and maintenance. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a server for improving the convenience of server maintenance, thereby improving the convenience of operation and maintenance.

[0006] The embodiments of the present application provide the following technical solutions:

[0007] On the one hand, an embodiment of the present application provides a server. The server includes a chassis, a management board, at least one node board and at least one functional module. The chassis includes a first area and a second area. Along the first direction, the first area is closer to the first side of the chassis relative to the second area. The management board is arranged in the second area. A management module for managing the work of the server is arranged on the management board. A business processing module for processing business is arranged on the node board, and the functional module is used to cooperate with the business processing module to realize data transmission or processing. Among them, at least one node board and / or at least one functional module are arranged in the first area and are pluggable and connected to the management board. Such an arrangement enables at least one node board and / or at least one functional module to be pulled out or pushed in from the first side of the chassis.

[0008] In the embodiment of the present application, the node board and / or the functional module are pluggable and connected to the management board, so that the management board, the node board and the functional module can be physically independent of each other, and they are electrically connected through connectors or cable connections to achieve communication between each other. In this way, the node board and / or the functional module can be decoupled from the management board separately.

[0009] The first area is close to the first side of the chassis, so that at least one node board and / or at least one functional module can be pulled out or pushed in from the first side of the chassis. For example, by pulling out, at least one node board and / or at least one functional module arranged in the first area can be decoupled from the management board, and at this time, at least one node board and / or at least one functional module arranged in the first area can be separated from the chassis and exposed; by pushing in, at least one node board and / or at least one functional module can be arranged in the first area and plugged into the management board.

[0010] When it is necessary to inspect or replace at least one node plate and / or at least one functional module arranged in the first zone, there is no need to open the upper cover of the chassis. Instead, the at least one node plate and / or at least one functional module can be inspected and replaced by pulling out and pushing in, thereby improving the convenience of operation and maintenance, thereby improving the operation and maintenance efficiency.

[0011] In addition, for rack-mounted servers, maintenance of at least one node board and / or at least one functional module can be completed by pulling out and pushing in, without taking the server out of the cabinet, thereby improving operation and maintenance convenience and thus improving operation and maintenance efficiency.

[0012] In some possible implementations, the chassis further includes a third zone, and along the first direction, the second zone is arranged between the first zone and the third zone, and the third zone is closer to the second side of the chassis relative to the second zone. At least one node plate is arranged in the first zone and / or the third zone. And / or, at least one functional module is arranged in the first zone and / or the third zone. When the node plate is arranged in the first zone, it can be pulled out or pushed in from the first side of the chassis by pluggable connection with the management board. When the node plate is arranged in the third zone, it can be pulled out or pushed in from the second side of the chassis by pluggable connection with the management board. When the functional module is arranged in the first zone, it can be pulled out or pushed in from the first side of the chassis by pluggable connection with the management board. When the functional module is arranged in the third zone, it can be pulled out or pushed in from the second side of the chassis by pluggable connection with the management board. This arrangement enables at least one node plate and / or at least one functional module to be pulled out or pushed in from the first side of the chassis, and enables at least one node plate and / or at least one functional module to be pulled out or pushed in from the second side of the chassis. In this way, when at least one node board and / or at least one functional module arranged in the first zone and the third zone needs to be repaired, there is no need to open the upper cover of the chassis, but at least one node board and / or at least one functional module can be repaired by pulling out and pushing in, so that the server can be repaired on both sides (front and rear) of the server, which improves the convenience of operation and maintenance, thereby improving the efficiency of operation and maintenance. In addition, for rack-mounted servers, at least one node board and / or at least one functional module can be repaired by pulling out and pushing in, without taking the server out of the cabinet, which improves the convenience of operation and maintenance, thereby improving the efficiency of operation and maintenance.

[0013] In some possible implementations, the length of the first zone along the first direction is equal to the length of the third zone along the first direction. This arrangement reduces the restrictions on the node plates and functional modules caused by the physical space of the first zone and the third zone, so that the node plates and / or functional modules can be flexibly set in the first zone and the third zone. In this way, by adjusting the specifications, types and quantities of the node plates and functional modules set in the first zone and / or the third zone, the server can achieve different configurations without replacing the chassis, thereby improving the adaptability of the chassis, realizing converged production, meeting different needs, and reducing production costs. It can be understood that the outgoing side of the server is usually close to the side where the functional module is located. The functional module is flexibly arranged in the first zone and / or the third zone, so that the server can achieve first side outgoing, second side outgoing, and first side and second side outgoing, meeting different needs and improving the applicability and flexibility of the chassis.

[0014] In some possible implementations, a first opening is formed on the first side of the chassis, and the node plate and / or the functional module disposed in the first zone is configured to be pulled out or pushed in from the first opening. A second opening is formed on the second side of the chassis, and the node plate and / or the functional module disposed in the third zone is configured to be pulled out or pushed in from the second opening. It can be understood that the first zone is in communication with the first opening, so that the node plate and / or the functional module disposed in the first zone can be pulled out or pushed in from the first opening. The third zone is in communication with the second opening, so that the node plate and / or the functional module disposed in the third zone can be pulled out or pushed in from the second opening.

[0015] In some possible implementations, the chassis further includes a first protective plate, which is close to an opening of the chassis relative to the node plate and connected to the node plate. A first handle bar is provided on the first protective plate, and the first handle bar is used to pull out or push in the node plate. Such a configuration can improve the convenience of pulling out and pushing in the node plate, thereby improving the convenience of operation and maintenance. In addition, the first protective plate can serve as a false panel of the chassis to protect the node plate, and can also improve the aesthetics of the chassis.

[0016] In some possible implementations, an indicator board is provided on the first protection plate, and an indicator light and / or a control button corresponding to the working state of the node board are provided on the indicator board. It can be understood that the indicator light can display the working state of the node board connected to the first protection plate, and the control button can control the node board connected to the first protection plate, thereby improving the convenience of operation and maintenance.

[0017] In some possible implementations, the chassis further includes a plurality of partitions extending along a first direction. The plurality of partitions include a first partition and a second partition. The first partition is disposed in the first zone and divides the first zone into a plurality of first sub-zones. The second partition is disposed in the third zone and divides the third zone into a plurality of third sub-zones. The position of the partition along the second direction is adjustable. The second direction intersects with the first direction. With such a configuration, the space within the chassis can be divided, the rational use of the entire internal space of the chassis can be achieved, and the space utilization rate within the chassis can be improved. Furthermore, the position of the partitions (including the first partition and the second partition) along the second direction is adjustable, which improves the flexibility of the space division within the chassis, meets different needs, and enables the chassis to support different configurations of the server.

[0018] In some possible implementations, the management board includes a management board body and a connector module, the management board body and the connector module are electrically connected, and the management module is arranged on the management board body. The connector module is arranged on the management board body, or the connector module is arranged on one side of the management board body along the first direction and is adjacent to the management board body. The connector module includes a fixed plate and a connector mounted on the surface of the fixed plate. The number of connectors is multiple, and the node board / or the functional module is configured to be plugged with at least one connector. The number of connector modules is two, and the two connector modules are arranged at intervals along the first direction. Among the two connector modules, the connector module close to the first side of the chassis is the first connector module, and the connector module close to the second side of the chassis is the second connector module. The connector opening of the first connector module faces the first side of the chassis, and the connector opening of the second connector module faces the second side of the chassis. It can be understood that the connector module is provided to include a connector so that the node board and / or the functional module can support hot plugging with the connector module, thereby enabling hot plugging maintenance of the node board and / or the functional module, improving the convenience of maintenance, and thus improving the operation and maintenance efficiency. In addition, the use of a plug-in method can reduce the number of cables and improve the convenience of operation and maintenance. The connector opening of the first connector module faces the first side of the chassis, which improves the convenience of plugging and separating the node board and / or functional module arranged in the first zone with the connector of the first connector module, thereby improving the convenience of operation and maintenance. The connector opening of the second connector module faces the second side of the chassis, which improves the convenience of plugging and separating the node board and / or functional module arranged in the third zone with the connector of the second connector module, thereby improving the convenience of operation and maintenance. Providing a connector module including a first connector module and a second connector module can reduce the mutual influence between the node board and / or functional module arranged in the first zone and the node board and / or functional module arranged in the third zone.

[0019] In some possible implementations, the connector includes a high-speed connector, and at least one of the node board and the functional module is electrically connected to the high-speed connector for transmitting high-speed signals. This configuration enables high-speed signals to be transmitted between the node board and the connector module, and enables high-speed signals to be transmitted between the functional module and the connector module.

[0020] In some possible implementations, the high-speed connector of the first connector module and the high-speed connector of the second connector module are electrically connected via a high-speed cable, and the high-speed cable is routed along the surface of the management board body. It can be understood that the high-speed connector of the first connector module and the high-speed connector of the second connector module are electrically connected via a high-speed cable, so that high-speed signals can be transmitted between the first connector module and the second connector module. Arranging the high-speed cable to route along the surface of the management board body can reduce the interference of the management board body to the high-speed signal, reduce the loss of the high-speed signal, and improve the quality of the high-speed signal. In addition, the high-speed cable can be routed obliquely along the surface of the management board body without having to be routed along the edge of the bottom plate of the chassis, thereby shortening the length of the high-speed cable, thereby shortening the transmission path of the high-speed signal, and facilitating shortening the transmission time of the high-speed signal.

[0021] In some possible implementations, the server further includes a fan, and the fan discharges air along a first direction. The fan is fixed on the management board body, and there is a gap between the bottom of the fan and the surface of the management board body, and the gap is for high-speed cable routing. It can be understood that the management board body is arranged in the second zone, and the fan is fixed on the management board body, so that the fan can be arranged in the second zone, that is, the fan can be arranged between the first zone and the third zone. The fan discharges air along the first direction, so that the fan can dissipate heat for the node plate and / or functional module arranged in the first zone, and the node plate and / or functional module arranged in the third zone, thereby reducing the risk of the server not being able to work normally due to excessive temperature. There is a gap between the bottom of the fan and the surface of the management board body, and the gap is for high-speed cable routing, which can reduce the mutual influence between the fan and the high-speed cable, and improve the space utilization rate in the chassis.

[0022] In some possible implementations, the connector includes a low-speed connector, the low-speed connector is electrically connected to the management board body, and at least one of the node board and the functional module is pluggably connected to the low-speed connector for transmitting low-speed signals. This configuration enables low-speed signals to be transmitted between the management module (BMC) and the node board, and enables low-speed signals to be transmitted between the BMC and the functional module, thereby achieving communication between the BMC and the node board and the functional module, and enabling the BMC to manage and monitor the node board and the functional module.

[0023] In some possible implementations, the connector includes a first connector and a second connector, and the first connector and the second connector are spaced apart along the height direction of the chassis. Such an arrangement enables the stacked node plates to be electrically connected to the first connector and the second connector, respectively, thereby improving the convenience of electrically connecting the node plates to the connectors and improving the space utilization of the chassis.

[0024] In some possible implementations, the management board includes a management board body and a connector module, the management board body and the connector module are electrically connected, and the management module is arranged on the management board body. The connector module is arranged on the management board body, or the connector module is arranged on one side of the management board body along the first direction and is adjacent to the management board body. The connector module includes a fixed plate and a connector mounted on the surface of the fixed plate. The connector is configured to be plugged with at least one node board and / or at least one functional module. The number of connectors is multiple, and the node board / or the functional module is configured to be plugged with at least one connector. Among the multiple connectors, the openings of some connectors are facing the first side of the chassis, and the openings of other connectors are facing the second side of the chassis. It can be understood that the connector module is provided to include a connector so that the node board and / or the functional module can support hot plugging with the connector module, thereby enabling hot plugging maintenance of the node board and / or the functional module, improving the convenience of maintenance, and thus improving the efficiency of operation and maintenance. In addition, the use of a plug-in method can reduce the number of cables and improve the convenience of operation and maintenance. The openings of a portion (one, two or more) of the connectors are oriented toward the first side of the chassis, which improves the convenience of plugging and detaching the connectors of the node board and / or functional module disposed in the first zone with the connector module, thereby improving the convenience of operation and maintenance. The openings of another portion of the connectors are oriented toward the second side of the chassis, which improves the convenience of plugging and detaching the connectors of the node board and / or functional module disposed in the third zone with the connector module, thereby improving the convenience of operation and maintenance. In addition, setting the number of connector modules to one can simplify the structure of the connector module and reduce the cost of the server.

[0025] In some possible implementations, the server also includes a power module, and the power module includes a power output interface. The node board includes a first power input interface, and the functional module includes a second power input interface. The connector includes a first power connector, a second power connector, and a third power connector. The third power connector is electrically connected to the power output interface, the first power connector is electrically connected to one of the first power input interface and the second power input interface, and the second power connector is electrically connected to the other of the first power input interface and the second power input interface. In this way, the power module can supply power to the node board and the functional module through the management board. In addition, the power module can be decoupled from the management board, which improves the convenience of maintenance of the power module. In addition, different power modules can be replaced according to different configurations of the server, which improves the flexibility of use of the server.

[0026] In some possible implementations, the node plate includes a first node plate and a second node plate. One of the first node plate and the second node plate is arranged in the first zone, and the other is arranged in the third zone. One of the power module and the functional module is arranged in the first zone, and is spaced apart from the node plate arranged in the first zone along the second direction. The other of the power module and the functional module is arranged in the third zone, and is spaced apart from the node plate arranged in the third zone along the second direction. The second direction intersects with the first direction. It can be understood that the node plate includes a first node plate and a second node plate, and by changing the electrical connection relationship between the two node plates, the server can have different working modes, can meet different needs, and improve the flexibility of the server. In addition, the operation is simple, there is no need to set up structures such as a central backplane, and there is no need to open the cover of the chassis, which improves the convenience of operation and maintenance.

[0027] In some possible implementations, the first node plate and the second node plate are staggered in the first direction. Such an arrangement can reduce the risk of heat accumulation in the chassis, so that the heat can be evenly distributed in the chassis, which is beneficial to the heat dissipation of the chassis.

[0028] In some possible implementations, there are multiple first node plates, and multiple first node plates are stacked. There are multiple second node plates, and multiple second node plates are stacked. Such an arrangement can improve the computing performance of the server, and by changing the electrical connection relationship (series or parallel) between multiple node plates, the server can work in different modes to meet different needs, thereby improving the flexibility of the server. Multiple first node plates are stacked, and multiple second node plates are stacked, which can improve the space utilization of the chassis.

[0029] In some possible implementations, the number of the first node boards is two, and the number of the second node boards is two. This configuration enables the server to meet data processing requirements.

[0030] In some possible implementations, there are multiple node boards, which are stacked and arranged in the first zone or the third zone. The power supply module and the node board are arranged in the same zone, and the power supply module and the node board are arranged at intervals along the second direction. The second direction intersects with the first direction. There are multiple functional modules, and multiple functional modules and node boards are arranged in different zones, and multiple functional modules are arranged along the second direction. In this way, by adjusting the type of functional module (such as a hard disk or a board), the server can achieve different configurations (such as storage configuration or AI reasoning configuration), thereby improving the flexibility of the server. In addition, by changing the electrical connection relationship between the two stacked node boards and the electrical connection relationship between the multiple high-speed connectors, the working mode of the server can be changed, and the operation is simple. There is no need to set up structures such as a central backplane, and there is no need to open the cover of the chassis, thereby improving the convenience of operation and maintenance.

[0031] In some possible implementations, the functional module includes at least one of a hard disk, a graphics card, and a data processing unit card. This configuration enables the node board to be equipped with different types of functional modules, thereby achieving different server configurations to meet different needs.

[0032] In some possible implementations, the number of node boards is two, so that the server can meet the data processing requirements.

[0033] In some possible implementations, the chassis further includes a mounting ear module. The mounting ear module includes a first mounting ear and a second mounting ear, and the first mounting ear and the second mounting ear are arranged on both sides of the chassis along the second direction and are respectively connected to the chassis. The second direction intersects with the first direction. The position of the mounting ear module along the first direction is adjustable. With such an arrangement, the installation position of the mounting ear module can be adjusted according to the application scenario, so that the chassis can meet different configurations of the server, thereby improving the adaptability and use flexibility of the chassis.

[0034] In some possible implementations, the management module includes a baseboard management controller. It can be understood that the management controller is set on the management board body of the management board, so that the management module can be decoupled from the node board and the functional module. In this way, multiple node boards are respectively connected to the management board in a pluggable manner, and multiple functional modules are respectively connected to the management board in a pluggable manner, so that each node board can be maintained separately, and each functional module can be maintained separately, which improves the convenience and flexibility of operation and maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the present application, the following briefly introduces the drawings required to be used in some embodiments of the present application. Obviously, the drawings described below are only drawings of some embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the products involved in the embodiments of the present application, the actual process of the method, the actual timing of the signal, etc.

[0036] Figure 1 A top view of a server provided for some embodiments of the present application;

[0037] Figure 2 A top view of a server provided for some other embodiments of the present application;

[0038] Figure 3 A top view of a server provided for some other embodiments of the present application;

[0039] Figure 4 A top view of a server provided for some other embodiments of the present application;

[0040] Figure 5 A top view of a server provided for some other embodiments of the present application;

[0041] Figure 6 A schematic diagram of the structure of a server provided in some embodiments of the present application;

[0042] Figure 7 A schematic diagram of the structure of a connector module provided in some embodiments of the present application;

[0043] Figure 8 A schematic block diagram of the structure of a power supply module provided in some embodiments of the present application;

[0044] Fig. 9 A schematic diagram of the structure of a server provided in some embodiments of the present application;

[0045] Fig.10 A schematic diagram of the structure of a node plate provided in some embodiments of the present application;

[0046] Fig.11 A schematic diagram of the structure of a server provided in some embodiments of the present application;

[0047] Fig.12 A schematic diagram of the structure of a server provided in some embodiments of the present application;

[0048] Fig.13 A schematic diagram of the structure of a server provided for some further embodiments of the present application. DETAILED DESCRIPTION

[0049] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments provided by the present application, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present application.

[0050] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present application. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics described may be included in any one or more embodiments or examples in any appropriate manner.

[0051] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, "plurality" means two or more.

[0052] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0053] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0054] It should be understood that when a layer or an element is referred to as being on another layer or main board, it may be directly on the other layer or main board, or there may be an intervening layer between the layer or element and the other layer or main board.

[0055] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of the layers and the area of ​​the zones are exaggerated for clarity. Therefore, variations in the shapes relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the zones shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched area shown as a rectangle will typically have curved features. Therefore, the zones shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the zones of the device, and are not intended to limit the scope of the exemplary embodiments.

[0056] Figure 1 A top view of a server 1000 provided in some embodiments of the present application. Figure 1 , an embodiment of the present application provides a server 1000. For example, the type of the server 1000 may be a cabinet server, a rack server, a high-density server, etc., and the embodiment of the present application does not specifically limit the type of the server 1000.

[0057] The server 1000 may include a chassis 1001, and the chassis 1001 is used to accommodate the hardware units of the server 1000. For example, Figure 1 As shown, the server 1000 may include hardware units such as a node board 1002, a function module 1003, a fan 1004, a power module 1005, an input / output interface (IO interface) 1007, and a management module 1008. It is understandable that the server 1000 may also include other hardware units in addition to the above hardware units.

[0058] Depending on the configuration of the server 1000, the height of the chassis 1001 can be divided into 1U, 2U, 4U, etc. Among them, the U digit is used to indicate the size of the chassis 1001 and the number of hardware units that can be accommodated. A lower U digit means that the chassis 1001 is smaller, while a higher U digit means that the chassis 1001 is larger. For example, the height of one U is approximately equal to 44.45 mm (1.75 inches). That is, the height of a 1U chassis is approximately 44.45 mm, the height of a 2U chassis is approximately 88.9 mm, and the height of a 3U chassis is approximately 133.5 mm.

[0059] For example, the chassis 1001 may include a cover plate, a bottom plate and a side wall, wherein the side wall is disposed between the bottom plate and the cover plate and is respectively connected to the bottom plate and the cover plate, so that the cover plate, the bottom plate and the side wall can enclose a receiving cavity. The hardware unit of the server 1000 is disposed in the receiving cavity, so that the chassis 1001 can protect the hardware unit.

[0060] Generally, when the hardware units of the server 1000 need to be inspected, the cover of the chassis 1001 needs to be opened to expose the hardware units in the chassis 1001, which causes inconvenience in operation and maintenance. A rack-mounted server is usually placed in a cabinet. When the server 1000 is a rack-mounted server, the server 1000 needs to be taken out of the cabinet first, and then the cover needs to be removed, which further causes inconvenience in operation and maintenance.

[0061] Figure 2 A top view of a server 1000 provided for some other embodiments of the present application. Figure 3 The top view of the server 1000 provided in some embodiments of the present application is shown in FIG.

[0062] In some examples, such as Figure 1 , Figure 2 and Figure 3 As shown, the server 1000 includes a chassis 1001, a management board 1100, at least one node board 1002 and at least one functional module 1003. The chassis 1001 includes a first area A and a second area B. Along a first direction X, the first area A is closer to a first side 1001a of the chassis 1001 than the second area B.

[0063] For example, the chassis 1001 may include a first side 1001a and a second side 1001b that are arranged opposite to each other along a first direction X. The first direction X may be a length direction of the chassis 1001. One of the first side 1001a and the second side 1001b may be understood as the front side of the chassis 1001 (server 1000), and the other may be understood as the rear side of the chassis 1001 (server 1000).

[0064] It can be understood that the first area A and the second area B are virtual areas of the chassis 1001. Figure 1 , Figure 2 and Figure 3 As shown, the first area A and the second area B may be arranged along the first direction X, so that the first area A can be closer to the first side 1001 a of the chassis 1001 than the second area B.

[0065] For example, the chassis 1001 may include a partition structure to separate the first area A and the second area B, or the chassis 1001 may not include a structure to separate the first area A and the second area B. The first area A and the second area B may be regular shapes, such as a rectangle or a square. Alternatively, the first area A and the second area B may also be irregular structures. The shapes and areas of the first area A and the second area B may be the same or different.

[0066] like Figure 1 , Figure 2 and Figure 3As shown, the management board 1100 is disposed in the second zone B. The management board 1100 is provided with a management module 1008 for managing the server 1000 .

[0067] For example, the management board 1100 may be fixedly connected to the bottom plate of the chassis 1001 , or the management board 1100 may be detachably connected to the bottom plate of the chassis 1001 .

[0068] In some examples, such as Figure 1 , Figure 2 and Figure 3 As shown, the management board 1100 may include a management board body 1110, the management board body 1110 may be a printed circuit board (PCB), and the management module 1008 is disposed on the management board body 1110. For example, the management module 1008 may be a baseboard management controller (BMC). Alternatively, the management module 1008 may also be other managers. The embodiment of the present application takes the management module 1008 as a BMC as an example, and continues to illustrate.

[0069] The management module 1008 is used to manage the hardware units of the server 1000. Taking the management module 1008 as a BMC as an example, the BMC can monitor the temperature and voltage of important hardware of the server 1000, and can provide a remote management interface for the hardware of the server 1000.

[0070] For example, one management module 1008 may be provided on the management board body 1110, or a plurality of management modules 1008 may be provided on the management board body 1110. The management module 1008 may be snap-connected to the management board body 1110. Alternatively, the management module 1008 may be provided on the management board body 1110 by welding or plugging. When there are multiple management modules 1008, the connection methods of the multiple management modules 1008 to the management board body 1110 may be the same or different. The embodiment of the present application does not further limit the connection method of the management module 1008 and the management board body 1110.

[0071] The server 1000 may include one node board 1002, or may include multiple node boards 1002. It is understandable that when the server 100 includes multiple node boards 1002, a multi-node server configuration can be formed. The server 1000 may include one functional module 1003, or may include multiple functional modules 1003. The number of node boards 1002 and functional modules 1003 may be the same or different. The embodiments of the present application do not further limit the number of node boards 1002 and functional modules 1003.

[0072] like Figure 1 , Figure 2 and Figure 3 As shown, a business processing module 1201 for processing business is provided on the node board 1002, and the function module 1003 is used to cooperate with the business processing module 1201 to realize data transmission or processing.

[0073] For example, the node board 1002 may be a PCB, the number of the business processing modules 1201 may be multiple, and the multiple business processing modules 1201 are arranged on the PCB at intervals. It can be understood that the business processing module 1201 is hardware for processing business, and the hardware includes at least a central processing unit (CPU), a memory (such as a dual inline memory module, DIMM), etc., and may also include some chips, such as a platform controller hub (PCH) chip or other chips.

[0074] like Figure 1 , Figure 2 and Figure 3 As shown, the service processing module 1201 may include a CPU and a registered dual inline memory module (registered DIMM, RDIMM), and a plurality of RDIMMs may be arranged along the second direction Y on both sides of the CPU.

[0075] The second direction Y intersects with the first direction X. For example, the second direction Y is perpendicular to the first direction Y. The second direction Y may be a width direction of the chassis 1001. The height direction Z of the chassis 1001 intersects with the plane where the first direction X and the second direction Y are located. For example, the height direction Z of the chassis 1001 is perpendicular to the plane where the first direction X and the second direction Y are located.

[0076] For example, the service processing module 1201 may include 8 RDIMMs, or may include 16 or 24 RDIMMs. The embodiment of the present application does not further limit the number of RDIMMs.

[0077] Functional module 1003 is hardware for cooperating with business processing module 1201 to realize data transmission or processing. In some examples, functional module 1003 includes at least one of a hard disk, a graphics processing unit (GPU), and a data processing unit (DPU).

[0078] The number of function modules 1003 may be multiple, and the types of the multiple function modules 1003 may be the same or different. For example, the function module 1003 may also include an IO expansion card, a disk array card (raid card), and other network cards (such as OCP network cards) other than the DPU card.

[0079] In some examples, the functional module 1003 may include an adapter card (riser card) and a hard disk backplane, and the riser card and the hard disk backplane are pluggable and connected to the management board 1100. Graphics cards, DPU cards, IO expansion cards, disk array cards (raid cards), other network cards (such as OCP network cards), etc. can be plugged into the riser card. The hard disk is plugged into the hard disk backplane.

[0080] It can be understood that the node board 1002 is electrically connected to the function module 1003, so that the function module 1003 can complete data transmission or processing with the business processing module 1201 of the node board 1002. By matching different types of function modules 1003, the node board 1002 can realize different server 1000 configurations to meet different needs.

[0081] Figure 4 A top view of a server 1000 provided for some further embodiments of the present application. Figure 5 FIG. 1 is a top view of a server 1000 provided in some embodiments of the present application. For example, Figure 4 As shown, when the functional module 1003 includes a large number of hard disks, the server 1000 can be a storage server; Figure 5 As shown, when the functional module 1003 includes a DPU network card, the server 1000 may be an artificial intelligence (AI) server.

[0082] In some examples, at least one node board 1002 and / or at least one functional module 1003 are disposed in the first zone A and are pluggably connected to the management board 1100. In this way, at least one node board 1002 and / or at least one functional module 1003 can be pulled out or pushed in from the first side 1001a of the chassis 1001.

[0083] For example, the first zone A may be provided with at least one node plate 1002 , or the first zone A may be provided with at least one functional module 1003 , or the first zone A may be provided with at least one node plate 1002 and at least one functional module 1003 .

[0084] When there are multiple gusset plates 1002, the multiple gusset plates 1002 may all be arranged in the first zone A, or one part (one, two or more) of the multiple gusset plates 1002 may be arranged in the first zone A, and another part may be arranged in other zones (for example, the third zone C). When there are multiple functional modules 1003, the multiple functional modules 1003 may all be arranged in the first zone A, or one part (one, two or more) of the multiple functional modules 1003 may be arranged in the first zone A, and another part may be arranged in other zones (for example, the third zone C).

[0085] like Figure 3 As shown, when a plurality of node plates 1002 are provided in the first area A, the plurality of node plates 1002 in the first area A can be stacked to improve the space utilization in the chassis 1001. When a node plate 1002 and a functional module 1003 are provided in the first area A, the node plate 1002 and the functional module 1003 can be spaced apart along the second direction Y.

[0086] In the embodiment of the present application, the node board 1002 and / or the functional module 1003 are pluggable and connected to the management board 1100, so that the management board 1100, the node board 1002 and the functional module 1003 can be physically independent of each other, and they are electrically connected through connectors or cable connections to achieve communication between each other. In this way, the node board 1002 and / or the functional module 1003 can be decoupled from the management board 1100 separately.

[0087] The first area A is close to the first side 1001a of the chassis 1001, so that at least one node plate 1002 and / or at least one functional module 1003 can be pulled out or pushed in from the first side 1001a of the chassis 1001. For example, by pulling out, at least one node plate 1002 and / or at least one functional module 1003 arranged in the first area A can be decoupled from the management board 1100, and at this time, at least one node plate 1002 and / or at least one functional module 1003 arranged in the first area A can be separated from the chassis 1001, so as to be exposed; by pushing in, at least one node plate 1002 and / or at least one functional module 1003 can be arranged in the first area A and plugged into the management board 1100.

[0088] When it is necessary to inspect and repair at least one node plate 1002 and / or at least one functional module 1003 arranged in the first zone A, there is no need to open the upper cover of the chassis 1001. Instead, the inspection and repair of at least one node plate 1002 and / or at least one functional module 1003 can be achieved by pulling out and pushing in, thereby improving the convenience of operation and maintenance, thereby improving the operation and maintenance efficiency.

[0089] In addition, for rack-mounted servers, maintenance of at least one node board 1002 and / or at least one functional module 1003 can be completed by pulling out and pushing in, without removing the server 1000 from the cabinet, thereby improving operation and maintenance convenience and thus improving operation and maintenance efficiency.

[0090] In some examples, such as Figure 4 and Figure 5 As shown, the chassis 1001 further includes a third area C. Along the first direction X, the second area B is disposed between the first area A and the third area C, and the third area C is closer to the second side 1001 b of the chassis 1001 than the second area B.

[0091] It can be understood that the third zone C is a virtual zone of the chassis 1001. Figure 4 and Figure 5 As shown, along the first direction X, the first zone A, the second zone B and the third zone C are arranged in sequence, and the first zone A is closer to the first side 1001a of the chassis 1001, the third zone C is closer to the second side 1001b of the chassis 1001, and the second zone B is arranged between the first zone A and the third zone C.

[0092] For example, the chassis 1001 may include a partition structure to separate the second area B and the third area C, or the chassis 1001 may not include a structure to separate the second area B and the third area C. The third area C may be a regular shape, such as a rectangle or a square. Alternatively, the third area C may also be an irregular structure. The shapes and areas of the first area A, the second area B, and the third area C may be the same or different.

[0093] like Figure 2 and Figure 3 As shown, at least one node plate 1002 is arranged in the first zone A and / or the third zone C; and / or, at least one functional module 1003 is arranged in the first zone A and / or the third zone C.

[0094] It can be understood that when there are multiple gusset plates 1002, the multiple gusset plates 1002 can all be arranged in the first zone A, or the multiple gusset plates 1002 can also be arranged in the third zone C, or a part (one, two or more) of the multiple gusset plates 1002 can be arranged in the first zone A, and the other part can be arranged in the third zone C. When the multiple gusset plates 1002 are respectively arranged in the first zone A and the third zone C, the number of gusset plates 1002 in the first zone A and the number of gusset plates 1002 in the third zone C can be the same or different.

[0095] When there are multiple functional modules 1003, the multiple functional modules 1003 may all be arranged in the first area A, or the multiple functional modules 1003 may all be arranged in the third area C, or a part (one, two or more) of the multiple functional modules 1003 may be arranged in the first area A, and the other part may be arranged in the third area C. When the multiple functional modules 1003 are arranged in the first area A and the third area C, respectively, the number of the functional modules 1003 in the first area A and the number of the functional modules 1003 in the third area C may be the same or different.

[0096] That is, the first zone A may be provided with one or more node plates 1002, may be provided with one or more functional modules 1003, or may be provided with one or more node plates 1002 and one or more functional modules 1003. Similarly, the third zone C may be provided with one or more node plates 1002, may be provided with one or more functional modules 1003, or may be provided with one or more node plates 1002 and one or more functional modules 1003.

[0097] When the node board 1002 is arranged in the first zone A, it can be pulled out from or pushed into the first side 1001a of the chassis 1001 by pluggable connection with the management board 1100. When the node board 1002 is arranged in the third zone C, it can be pulled out from or pushed into the second side 1001b of the chassis 1001 by pluggable connection with the management board 1100.

[0098] When the function module 1003 is arranged in the first zone A, it can be pulled out from or pushed into the first side 1001a of the chassis 1001 by being pluggable connected to the management board 1100. When the function module 1003 is arranged in the third zone C, it can be pulled out from or pushed into the second side 1001b of the chassis 1001 by being pluggable connected to the management board 1100.

[0099] It can be understood that the first zone A is close to the first side 1001a of the chassis 1001, and at least one node board 1002 and / or at least one functional module 1003 arranged in the first zone A are connected to the management board 1100 in a pluggable manner, so that at least one node board 1002 and / or at least one functional module 1003 can be pulled out or pushed in from the first side 1001a of the chassis 1001. The third zone C is close to the second side 1001b of the chassis 1001, and at least one node board 1002 and / or at least one functional module 1003 arranged in the third zone C are connected to the management board 1100 in a pluggable manner, so that at least one node board 1002 and / or at least one functional module 1003 can be pulled out or pushed in from the second side 1001b of the chassis 1001.

[0100] For example, by pulling out, at least one node plate 1002 and / or at least one functional module 1003 arranged in the first zone A can be decoupled from the management board 1100, and at this time, at least one node plate 1002 and / or at least one functional module 1003 arranged in the first zone A can be separated from the chassis 1001, thereby being exposed; by pushing in, at least one node plate 1002 and / or at least one functional module 1003 can be arranged in the first zone A and plugged into the management board 1100.

[0101] Similarly, by pulling out, at least one node plate 1002 and / or at least one functional module 1003 arranged in the third zone C can be decoupled from the management board 1100, and at this time, at least one node plate 1002 and / or at least one functional module 1003 arranged in the third zone C can be separated from the chassis 1001, thereby being exposed; by pushing in, at least one node plate 1002 and / or at least one functional module 1003 can be arranged in the third zone C and plugged into the management board 1100.

[0102] When it is necessary to inspect and repair at least one node board 1002 and / or at least one functional module 1003 arranged in the first zone A and the third zone C, there is no need to open the upper cover of the chassis 1001. Instead, the at least one node board 1002 and / or at least one functional module 1003 can be inspected and repaired by pulling out and pushing in, thereby realizing the inspection and repair of the server 1000 on both sides (front and rear sides) of the server 1000, thereby improving the convenience of operation and maintenance, thereby improving the operation and maintenance efficiency.

[0103] In addition, for rack-mounted servers, maintenance of at least one node board 1002 and / or at least one functional module 1003 can be completed by pulling out and pushing in, without removing the server 1000 from the cabinet, thereby improving operation and maintenance convenience and thus improving operation and maintenance efficiency.

[0104] For example, Figure 3 As shown, when multiple node boards 1002 are arranged in the first zone A (or the third zone C), the multiple node boards 1002 can be stacked and respectively connected to the management board 1100 in a pluggable manner. Figure 4 and Figure 5 As shown, when a plurality of functional modules 1003 are arranged in the first area A (or the third area C), the plurality of functional modules 1003 can be arranged at intervals along the second direction Y and are respectively pluggably connected to the management board 1100 .

[0105] The management module 1008 (BMC) is set on the management board body 1110 of the management board 1100, so that a part (one, two or more) of the multiple node boards 1002 is decoupled from the management board 1100, which will not affect the communication between another part of the node boards 1002 and the multiple functional modules 1003 and the management module 1008. Similarly, a part (one, two or more) of the multiple functional modules 1003 is decoupled from the management board 1100, which will not affect the communication between another part of the functional modules 1003 and the multiple node boards 1002 and the management module 1008.

[0106] That is, the management module 1008 is set on the management board body 1110 of the management board 1100, so that the management module 1008 can be decoupled from the node board 1002 and the functional module 1003. In this way, multiple node boards 1002 are respectively plugged into the management board 1100, and multiple functional modules 1003 are respectively plugged into the management board 1100, so that each node board 1002 can be maintained separately, and each functional module 1003 (such as an IO card, a GPU card, or a DPU card, etc.) can be maintained separately, which improves the convenience and flexibility of operation and maintenance.

[0107] Taking the case where the functional module 1003 includes a DPU card as an example, when a part (one, two or more) of the plurality of node boards 1002 is decoupled from the management board 1100 , the multi-host function of the DPU card will not be affected.

[0108] In some examples, a first opening (not shown in the figure) is formed on the first side 1001a of the chassis 1001, and the node plate 1002 and / or the functional module 1003 disposed in the first zone A are configured to be pulled out from or pushed in through the first opening. A second opening (not shown in the figure) is formed on the second side 1001b of the chassis 1001, and the node plate 1002 and / or the functional module 1003 disposed in the third zone C are configured to be pulled out from or pushed in through the second opening.

[0109] It can be understood that the first zone A is in communication with the first opening, so that the node plate 1002 and / or the functional module 1003 disposed in the first zone A can be pulled out from the first opening or pushed in. The third zone C is in communication with the second opening, so that the node plate 1002 and / or the functional module 1003 disposed in the third zone C can be pulled out from the second opening or pushed in.

[0110] In some examples, a detachable first panel is provided at the first opening, and the first panel closes the first opening. By removing the first panel, the node plate 1002 and / or the functional module 1003 provided in the first zone A can be exposed. A detachable second panel may be provided at the second opening, and the second panel closes the second opening. By removing the second panel, the node plate 1002 and / or the functional module 1003 provided in the third zone C can be exposed.

[0111] Figure 6 The schematic diagram of the structure of the server 1000 provided in some embodiments of the present application. In other examples, such as Figure 6 As shown, the chassis 1001 further includes a first protection plate 1301 . The first protection plate 1301 is close to an opening (one of the first opening and the second opening) of the chassis 1001 relative to the node plate 1002 , and is connected to the node plate 1002 .

[0112] The first protective plate 1301 is erected on one side of the node plate 1002. For example, the first protective plate 1301 is perpendicular or approximately perpendicular to the node plate 1002, so that the first protective plate 1301 can close the opening (one of the first opening and the second opening) of the chassis 1001. The first protective plate 1301 can completely close the opening of the chassis 1001, or the first protective plate 1301 can also close a part of the opening of the chassis 1001. The first protective plate 1301 and the node plate 1002 can be connected by bolts, or can be connected by a clamping method or the like.

[0113] It can be understood that when the node plate 1002 is arranged in the first zone A, the first protection plate 1301 is close to the first opening of the chassis 1001 relative to the node plate 1002. When the node plate 1002 is arranged in the third zone C, the first protection plate 1301 is close to the second opening of the chassis 1001 relative to the node plate 1002. When multiple node plates 1002 are respectively arranged in the first zone A and the third zone C, as shown in FIG. Figure 6 As shown, there are two first protective plates 1301, one of which is close to the first opening of the chassis 1001 relative to the node plate 1002 set in the first zone A, and the other first protective plate 1301 is close to the second opening of the chassis 1001 relative to the node plate 1002 set in the third zone C.

[0114] A first handle bar (not shown in the figure) is provided on the first protective plate 1301 , and the first handle bar is used for pulling out or pushing in the node plate 1002 .

[0115] It can be understood that the first protective plate 1301 is connected to the first node plate 1002, and the first handle bar is set on the first protective plate 1301. By pulling the first handle bar, the node plate 1002 can be pulled out; by pushing the first handle bar, the node plate 1002 can be pushed in, which improves the convenience of pulling out and pushing in the node plate 1002, thereby improving the convenience of operation and maintenance. In addition, the first protective plate 1301 can be used as a false panel of the chassis 1001 to protect the node plate 1002, and can also improve the aesthetics of the chassis 1001.

[0116] For example, when a plurality of node plates 1002 are provided in the first zone A (or the third zone C), the first protective plate 1301 may include a plurality of sub-protective plates, and the plurality of sub-protective plates are connected to the plurality of node plates 1002 in a one-to-one correspondence. A first handle bar is provided on any of the sub-protective plates. In this way, any one of the plurality of node plates 1002 can be pulled out and pushed in respectively, thereby improving the convenience of operation and maintenance.

[0117] For example, when the node plate 1002 and the functional module 1003 are arranged in the same zone (for example, the first zone A or the third zone C), the first protective plate 1301 can be connected to the node plate 1002 and the functional module 1003 arranged in the same zone. At this time, the node plate 1002 and the functional module 1003 can be pulled out by pulling the first handle bar; the node plate 1002 and the functional module 1003 can be pushed in by pushing the first handle bar.

[0118] When the node plate 1002 and the functional module 1003 are arranged in the same zone (for example, the first zone A or the third zone C), the first protective plate 1301 is only connected to the node plate 1002 but not to the functional module 1003, or when the node plate 1002 and the functional module 1003 are arranged in different zones, the chassis 1001 may include a second protective plate (not shown in the figure).

[0119] The second protective plate is erected on one side of the functional module 1003 close to the opening (one of the first opening and the second opening), and for example, the second protective plate is perpendicular or approximately perpendicular to the functional module 1003. The second protective plate is connected to the functional module 1003, and for example, the second protective plate and the functional module 1003 can be connected by bolts, or by clamping or the like.

[0120] When the node plate 1002 and the functional module 1003 are arranged in the same zone (e.g., the first zone A or the third zone C), the first protective plate 1301 and the second protective plate jointly close the opening of the chassis 1001. When the node plate 1002 and the functional module 1003 are arranged in different zones, the first protective plate 1301 closes one of the first opening and the second opening, and the second protective plate closes the other of the first opening and the second opening.

[0121] The second protective plate may be provided with a second handle bar. By pulling the second handle bar, the functional module 1003 can be pulled out; by pushing the second handle bar, the functional module 1003 can be pushed in.

[0122] In some examples, continue to refer to Figure 6 The first protection plate 1301 is provided with an indicator plate 1302 , and the indicator plate 1302 is provided with indicator lights and / or control buttons corresponding to the working status of the node plate 1002 .

[0123] It can be understood that the indicator light can display the working status of the node plate 1002 connected to the first protective plate 1301, and the control button can control the node plate 1002 connected to the first protective plate 1301, thereby improving the convenience of operation and maintenance.

[0124] When the first protective plate 1301 includes multiple sub-protective plates, an indicator panel 1302 may be provided on each sub-protective plate, so that the working status of each node panel 1002 may be obtained according to the indicator lights on different indicator panels 1302, and each node panel 1002 may be controlled through the control buttons on different indicator panels 1302, thereby improving the convenience of operation and maintenance.

[0125] Depending on the usage scenario, the server 1000 can have different configurations, such as AI reasoning servers, storage servers, etc. Here, "different configurations" are reflected in at least one dimension, such as the number of CPUs, the number of memories, the number of hard disks, the number of power modules 1005, the number of DPUs, the number of node boards 1002, and the connection relationship between multiple node boards 1002. Due to the different number of hardware caused by different configurations, it is usually necessary to match chassis 1001 of different sizes for assembly. As a result, the chassis 1001 of servers 1000 with different configurations are basically unable to be interchanged, which increases the cost of the server 1000.

[0126] Based on this, in some examples of the present application, the length of the first region A along the first direction X is equal to the length of the third region C along the first direction X.

[0127] It can be understood that setting the first zone A and the third zone C to have the same size in the first direction X reduces the restrictions on the node plate 1002 and the functional module 1003 caused by the physical space of the first zone A and the third zone C, so that the node plate 1002 and / or the functional module 1003 can be flexibly set in the first zone A and the third zone C.

[0128] For example, in one configuration of the server 1000, at least one node board 1002 may be placed in the first zone A, and at least one functional module 1003 may be placed in the third zone C. In another configuration of the server 1000, at least one node board 1002 may be placed in both the first zone A and the third zone C, and at least one functional module 1003 may be placed in one of the first zone A and the third zone C.

[0129] By adjusting the specifications, types and quantity of the node boards 1002 and functional modules 1003 arranged in the first zone A and / or the third zone C, the server 1000 can achieve different configurations without replacing the chassis 1001, thereby improving the adaptability of the chassis 1001, achieving production convergence, meeting different needs and reducing production costs.

[0130] It can be understood that the outgoing line side of the server 1000 is usually close to the side where the functional module 1003 is located. The functional module 1003 is flexibly arranged in the first area A and / or the third area C, so that the server 1000 can realize the outgoing line of the first side 1001a, the outgoing line of the second side 1001b, and the outgoing line of the first side 1001a and the second side 1001b, so as to meet different needs and improve the applicability and flexibility of the chassis 1001.

[0131] In some examples, a length of the first region A along the second direction Y and a length of the third region C along the second direction Y are equal.

[0132] In some examples, such as Figure 6 As shown, the chassis 1001 further includes a plurality of partitions 1303, and the partitions 1303 extend along the first direction X. The plurality of partitions 1303 include a first partition 1303a and a second partition 1303b. The first partition 1303a is disposed in the first area A, and divides the first area A into a plurality of first sub-areas. The second partition 1303b is disposed in the third area C, and divides the third area C into a plurality of third sub-areas. The position of the partition 1303 along the second direction Y is adjustable.

[0133] For example, the number of the first partitions 1303a may be one or more, and when the number of the first partitions 1303a is multiple, the multiple first partitions 1303a are spaced apart in the first zone A along the second direction Y. The number of the second partitions 1303b may be one or more, and when the number of the second partitions 1303b is multiple, the multiple second partitions 1303b are spaced apart in the third zone C along the second direction Y. The number of the first partitions 1303a and the number of the second partitions 1303b may be the same or different.

[0134] It can be understood that the first partition 1303a divides the first area A into multiple first sub-areas, and the second partition 1303b divides the third area C into multiple third sub-areas, thereby dividing the space inside the chassis 1001, realizing the rational use of the internal space of the entire chassis 1001, and improving the space utilization rate inside the chassis 1001.

[0135] In addition, the position of the partition 1303 (including the first partition 1303a and the second partition 1303b) along the second direction Y is adjustable, which improves the flexibility of space division within the chassis 1001 and meets different needs, so that the chassis 1001 can support different configurations of the server 1000.

[0136] It can be understood that multiple node plates 1002 of the first zone A can be set in the same first sub-zone, and multiple functional modules 1003 of the first zone A can be set in the same first sub-zone. Multiple node plates 1002 of the third zone C can be set in the same third sub-zone, and multiple functional modules 1003 of the third zone C can be set in the same third sub-zone. By adjusting the partition 1303, the setting position of the node plate 1002 and / or the functional module 1003 in the first zone A and the third zone C can be adjusted, so that the chassis 1001 can support a higher opening rate and meet the heat dissipation requirements.

[0137] For example, a plurality of slide grooves may be provided on the side wall of the chassis 1001, and the plurality of slide grooves are arranged at intervals along the second direction Y. The partition 1303 (including the first partition 1303a and the second partition 1303b) is arranged in different slide grooves, so that the position of the partition 1303 along the second direction Y is adjustable. Alternatively, a plurality of screw holes may be provided on the side wall of the chassis 1001, and the plurality of screw holes are arranged at intervals along the second direction Y. The partition 1303 is connected to different screw holes by bolts, so that the position of the partition 1303 along the second direction Y is adjustable.

[0138] In some examples, such as Figure 5 and Figure 6 As shown, the chassis 1001 also includes a mounting ear module 1400. It can be understood that the mounting ear module 1400 is used to fix the chassis 1001 to the cabinet. Figure 5 and Figure 6 As shown, the ear module 1400 includes a first ear 1401 and a second ear 1402 . The first ear 1401 and the second ear 1402 are arranged on both sides of the chassis 1001 along the second direction Y and are respectively connected to the chassis 1001 .

[0139] For example, the first hanging ear 1401 and the second hanging ear 1402 can be connected to the chassis 1001 by bolt connection, riveting or clamping. The connection mode between the first hanging ear 1401 and the chassis 1001 and the connection mode between the second hanging ear 1402 and the chassis 1001 can be the same or different.

[0140] For example, Figure 6 As shown, the chassis 1001 may include two mounting ear modules 1400, and the two mounting ear modules 1400 may be spaced apart along the first direction X. For example, the two mounting ear modules 1400 may be close to the first side 1001a and the second side 1001b of the chassis 1001, respectively. Figure 5 As shown, the chassis 1001 may also include only one mounting ear module 1400. In this case, the mounting ear module 1400 may be close to the first side 1001a of the chassis 1001 or the second side 1001b of the chassis 1001 along the first direction X.

[0141] When the chassis 1001 includes a mounting ear module 1400, the side (the first side 1001a or the second side 1001b) to which the mounting ear module 1400 is close is the front side of the chassis 1001. That is, along the first direction X, when the mounting ear module 1400 is installed close to the first side 1001a of the chassis 1001 (see Figure 1 ), the first side 1001a of the chassis 1001 is the front side; when the ear mounting module 1400 is installed close to the second side 1001b of the chassis 1001 (see Figure 2 ), the second side 1001b of the chassis 1001 is the front side.

[0142] In some examples, the position of the ear module 1400 along the first direction X is adjustable. In this way, the installation position of the ear module 1400 can be adjusted according to the application scenario, so that the chassis 1001 can meet different configurations of the server 1000, thereby improving the adaptability and use flexibility of the chassis 1001.

[0143] For some examples, see Figure 2 and Figure 3 The ear-hanging module 1400 is arranged close to the functional module 1003. That is, Figure 3 As shown, when the functional module 1003 is arranged in the first zone A, the ear module 1400 is installed close to the first side 1001a of the chassis 1001. At this time, the first side 1001a of the chassis 1001 is the front side of the server 1000. Figure 2 As shown, when the functional module 1003 is arranged in the third zone C, the ear module 1400 is installed close to the second side 1001 b of the chassis 1001 . At this time, the second side 1001 b of the chassis 1001 is the front side of the server 1000 .

[0144] It can be understood that the front side of the server 1000 is closer to the operation and maintenance personnel than the rear side of the server 1000, that is, the operation and maintenance personnel usually maintain the server 1000 at the front side of the server 1000. The outgoing line side of the server 1000 is usually close to the side where the functional module 1003 is located. In this way, the ear mounting module 1400 is arranged close to the functional module 1003, so that the server 1000 can achieve the outgoing line from the front side, which improves the convenience of operation and maintenance.

[0145] In some examples, at least one of the first hanging ear 1401 and the second hanging ear 1402 may also be provided with a switch for controlling the entire server 1000, an indicator light indicating the entire server 1000, a network interface, a universal serial bus (USB) interface, a display interface, a debugging interface, etc.

[0146] In some examples, such as Figure 4 and Figure 5 As shown, the server 1000 further includes a fan 1004 , and the fan 1004 blows air along a first direction X. The fan 1004 is fixed on the management board body 1110 .

[0147] For example, the fan 1004 can adopt an integrated fan to support the evolution of higher power heat dissipation, thereby improving the overall heat dissipation efficiency of the server 1000. Among them, the integrated fan refers to the integration of multiple separate fans, which has good integrity and compactness, and has lower losses and better heat dissipation performance. For example, the fan 1004 can be an integrated maintenance-free 6056 fan, which has a heat dissipation efficiency of about 10% compared to the separate 6056 fan.

[0148] The fan 1004 can be fixed to the management board body 1110 by plugging or welding. The management module 1008 can control the rotation speed and air volume of the fan 1004, and the management module 1008 can monitor and manage the fan 1004.

[0149] It can be understood that the management board body 1110 is arranged in the second zone B, and the fan 1004 is fixed on the management board body 1110, so that the fan 1004 can be arranged in the second zone B, that is, the fan 1004 can be arranged between the first zone A and the third zone C. The fan 1004 discharges air along the first direction X, so that the fan 1004 can dissipate heat for the node board 1002 and / or the functional module 1003 arranged in the first zone A, and the node board 1002 and / or the functional module 1003 arranged in the third zone C, thereby reducing the risk of the server 1000 not being able to work normally due to excessive temperature.

[0150] For example, the fan 1004 may discharge air in a direction from the first side 1001a of the chassis 1001 to the second side 1001b of the chassis 1001 , or the fan 1004 may discharge air in a direction from the second side 1001b of the chassis 1001 to the first side 1001a of the chassis 1001 .

[0151] In some examples, when the mounting ear module 1400 is disposed at different positions, the air outlet direction of the fan 1004 is different. For example, when the mounting ear module 1400 is disposed close to the first side 1001a of the chassis 1001 along the first direction X, the fan 1004 discharges air in a direction from the first side 1001a of the chassis 1001 to the second side 1001b of the chassis 1001. On the contrary, when the mounting ear module 1400 is disposed close to the second side 1001b of the chassis 1001 along the first direction X, the fan 1004 discharges air in a direction from the second side 1001b of the chassis 1001 to the first side 1001a of the chassis 1001. That is, the side that the mounting ear module 1400 is close to along the first direction X is the air inlet side of the fan 1004.

[0152] It can be understood that the side close to the ear module 1400 is the front side of the server 1000, and the operation and maintenance personnel usually stand in front of the server 1000 for maintenance. Therefore, setting the side close to the ear module 1400 (i.e., the front side of the server 1000) as the air inlet side of the fan 1004 can prevent the wind from the fan 1004 from blowing towards the operation and maintenance personnel, reduce the impact of the wind blown by the fan 1004 on the operation and maintenance personnel, and improve the user experience of the server 1000.

[0153] In some examples, the fan 1004 can be rotated 180° to adjust the air inlet and outlet directions of the fan 1004, or the air inlet and outlet directions of the fan 1004 can be adjusted by changing the rotation direction, tilt angle, etc. of the fan blades.

[0154] In some examples, such as Figure 5 and Figure 6 As shown, the management board 1100 further includes a connector module (cable tray) 1120. The management board body 1110 and the connector module 1120 are electrically connected. It can be understood that the connector module 1120 and the management board body 1110 are both arranged in the second zone B. The management module 1008 is arranged on the management board body 1110, so that the management module 1008 can be electrically connected to the connector module 1120.

[0155] The connector module 1120 is disposed on the management board body 1110; or, the connector module 1120 is disposed on one side of the management board body 1110 along the first direction X and is adjacent to the management board body 1110. In this way, the flexibility of the location of the connector module 1120 can be improved to meet different needs.

[0156] It is understandable that the connector module 1120 and the management board body 1110 can be electrically connected via a cable or in a pluggable manner. The embodiment of the present application does not further limit the manner in which the connector module 1120 and the management board body 1110 are electrically connected.

[0157] For example, the connector module 1120 and the management board body 1110 can be decoupled. By replacing different connector modules 1120, different configurations of the server 1000 can be met, supporting the evolution of the server 1000 to a higher rate.

[0158] Figure 7 A schematic diagram of the structure of the connector module 1120 provided in some embodiments of the present application.

[0159] In some examples, such as Figure 7 As shown, the connector module 1120 includes a fixing plate 1121 and a connector 1122 mounted on the surface of the fixing plate 1121. For example, the fixing plate 1121 may be a PCB. When the connector module 1120 is disposed on the management board body 1110, the fixing plate 1121 may be connected to the management board body 1110; when the connector module 1120 is disposed on one side of the management board body 1110 along the first direction X, the fixing plate 1121 may be connected to the cover plate or the bottom plate of the chassis 1001; so as to reduce the risk of the fixing plate 1121 shaking or offsetting relative to the chassis 1001.

[0160] There may be a plurality of connectors 1122, and the plurality of connectors 1122 are disposed at intervals on the fixing plate 1121. The plurality of connectors 1122 may be used to transmit different types of signals, such as high-speed signals, low-speed signals, and power signals.

[0161] The node board 1002 and / or the functional module 1003 are configured to be plugged into at least one connector 1122. For example, the node board 1002 can be plugged into one or more connectors 1122, and the functional module 1003 can also be plugged into one or more connectors 1122.

[0162] It can be understood that the node board 1002 and / or the functional module 1003 and at least one connector 1122 can support hot plugging, so that the node board 1002 and / or the functional module 1003 can be hot plugged and maintained, which improves the convenience of maintenance and thus improves the efficiency of operation and maintenance. In addition, the use of plug-in can reduce the number of cables and improve the convenience of operation and maintenance.

[0163] In some examples, such as Figure 6As shown, the number of the connector modules 1120 is two, and the two connector modules 1120 are arranged at intervals along the first direction X. For example, the two connector modules 1120 can be arranged at intervals along the first direction X on the management board body 1110, or the two connector modules 1120 can also be arranged on both sides of the management board body 1110 along the first direction X. The two connector modules 1120 are electrically connected to the management board body 1110 respectively.

[0164] Continue to refer to Figure 6 Among the two connector modules 1120, the connector module 1120 close to the first side 1001a of the chassis 1001 is the first connector module 1120a, and the connector module 1120 close to the second side 1001b of the chassis 1001 is the second connector module 1120b.

[0165] It can be understood that the first connector module 1120a and the second connector module 1120b are only used to distinguish two different connector modules 1120, and do not further limit the structures of the two connector modules 1120. The number and arrangement positions of the connectors 1122 of the first connector module 1120a can be the same as or different from the number and arrangement positions of the connectors 1122 of the second connector module 1120b.

[0166] The connector 1122 of the first connector module 1120 a opens toward the first side 1001 a of the chassis 1001 , and the connector 1122 of the second connector module 1120 b opens toward the second side 1001 b of the chassis 1001 .

[0167] The connector 1122 of the first connector module 1120a opens toward the first side 1001a of the chassis 1001, and when the node plate 1002 and / or the functional module 1003 arranged in the first zone A are pulled out, the node plate 1002 and / or the functional module 1003 arranged in the first zone A can be driven to separate from the connector 1122 of the first connector module 1120a; when the node plate 1002 and / or the functional module 1003 are pushed into the first zone A, the node plate 1002 and / or the functional module 1003 can be plugged into the connector 1122 of the first connector module 1120a, which improves the convenience of plugging and separating the node plate 1002 and / or the functional module 1003 arranged in the first zone A and the connector 1122 of the first connector module 1120a, thereby improving the convenience of operation and maintenance.

[0168] The connector 1122 of the second connector module 1120b opens toward the second side 1001b of the chassis 1001. When the node plate 1002 and / or the functional module 1003 arranged in the third zone C are pulled out, the node plate 1002 and / or the functional module 1003 arranged in the third zone C can be driven to separate from the connector 1122 of the second connector module 1120b; when the node plate 1002 and / or the functional module 1003 are pushed into the third zone C, the node plate 1002 and / or the functional module 1003 can be plugged into the connector 1122 of the second connector module 1120b, thereby improving the convenience of plugging and separating the node plate 1002 and / or the functional module 1003 arranged in the third zone C and the connector 1122 of the second connector module 1120b, thereby improving the convenience of operation and maintenance.

[0169] It can be understood that the connector module 1120 is provided to include a first connector module 1120a and a second connector module 1120b, and the node plate 1002 and / or the functional module 1003 arranged in the first zone A and the node plate 1002 and / or the functional module 1003 arranged in the third zone C are respectively plugged into or separated from the first connector module 1120a and the second connector module 1120b, which can reduce the mutual influence between the node plate 1002 and / or the functional module 1003 arranged in the first zone A and the node plate 1002 and / or the functional module 1003 arranged in the third zone C.

[0170] In some other examples, the number of connector modules 1120 is one. In this case, among the multiple connectors 1122, the openings of a portion (one, two or more) of the connectors 1122 face the first side 1001a of the chassis 1001, and the openings of another portion of the connectors 1122 face the second side 1001b of the chassis 1001.

[0171] The openings of a portion (one, two or more) of the connectors 1122 are facing the first side 1001a of the chassis 1001. When the node plate 1002 and / or the functional module 1003 arranged in the first zone A are pulled out, the node plate 1002 and / or the functional module 1003 arranged in the first zone A can be driven to separate from the connector 1122 of the connector module 1120; when the node plate 1002 and / or the functional module 1003 are pushed into the first zone A, the node plate 1002 and / or the functional module 1003 can be plugged into the connector 1122 of the connector module 1120, which improves the convenience of plugging and separating the node plate 1002 and / or the functional module 1003 arranged in the first zone A and the connector 1122 of the connector module 1120, thereby improving the convenience of operation and maintenance.

[0172] The opening of another part of the connector 1122 faces the second side 1001b of the chassis 1001. When the node plate 1002 and / or the functional module 1003 arranged in the third zone C are pulled out, the node plate 1002 and / or the functional module 1003 arranged in the third zone C can be driven to separate from the connector 1122 of the connector module 1120; when the node plate 1002 and / or the functional module 1003 are pushed into the third zone C, the node plate 1002 and / or the functional module 1003 can be plugged into the connector 1122 of the connector module 1120, which improves the convenience of plugging and separating the node plate 1002 and / or the functional module 1003 arranged in the third zone C and the connector 1122 of the connector module 1120, thereby improving the convenience of operation and maintenance.

[0173] It can be understood that setting the number of connector modules 1120 to one can simplify the structure of the connector module 1120 and reduce the cost of the server 1000.

[0174] The embodiment of the present application takes the example that the connector module 1120 includes a first connector module 1120a and a second connector module 1120b as an example, and continues to illustrate.

[0175] In some examples, such as Figure 7 As shown, the connector 1122 includes a high-speed connector 1122a, and at least one of the node board 1002 and the functional module 1003 is electrically connected to the high-speed connector 1122a for transmitting high-speed signals.

[0176] The number of high-speed connectors 1122a may be one or more. The number of high-speed connectors 1122a of the first connector module 1120a and the number of high-speed connectors 1122a of the second connector module 1120b may be the same or different. The node board 1002 is electrically connected to the high-speed connector 1122a, so that high-speed signals can be transmitted between the node board 1002 and the connector module 1120. The function module 1003 is electrically connected to the high-speed connector 1122a, so that high-speed signals can be transmitted between the function module 1003 and the connector module 1120.

[0177] For example, the node board 1002 and the functional module 1003 can be electrically connected to the high-speed connector 1122a through a high-speed cable (such as a PCIE high-speed cable). In this way, the loss caused by the PCB board during high-speed signal transmission can be reduced, and the connection relationship between the node board 1002 and / or the functional module 1003 and the connector module 1120 can be changed by plugging and unplugging the cable, meeting different configurations of the server 1000, and enabling the server 1000 to have different working modes.

[0178] It can be understood that a node board 1002 can be electrically connected to one or more high-speed connectors 1122a, and a functional module 1003 can be electrically connected to one or more high-speed connectors 1122a. Different high-speed connectors 1122a can transmit the same high-speed signal or different high-speed signals. For example, the high-speed connector 1122a can be a surelink high-speed connector, which supports the sixth generation of the peripheral component interconnect express standard (Peripheral Component Interconnect Express Generation 6, PCIE Gen6), and can support evolution to 112G.

[0179] When both the node board 1002 and the functional module 1003 are electrically connected to the connector module 1120, high-speed signals can be transmitted between the node board 1002 and the functional module 1003 through the connector module 1120, so that the functional module 1003 can cooperate with the business processing module 1201 of the node board 1002 to complete data transmission or processing.

[0180] In some examples, the high-speed connector 1122a of the first connector module 1120a and the high-speed connector 1122a of the second connector module 1120b are electrically connected via a high-speed cable, and the high-speed cable is routed along the surface of the management board body 1110 .

[0181] It can be understood that the high-speed cable electrically connects the high-speed connector 1122a of the first connector module 1120a and the high-speed connector 1122a of the second connector module 1120b, so that high-speed signals can be transmitted between the first connector module 1120a and the second connector module 1120b.

[0182] In this way, the node plate 1002 and / or the functional module 1003 arranged in the first zone A can be electrically connected to the node plate 1002 and / or the functional module 1003 arranged in the third zone C through the connector module 1120 .

[0183] The high-speed cable is routed along the surface of the management board body 1110, which can reduce the interference of the management board body 1110 on the high-speed signal, reduce the loss of the high-speed signal, and improve the quality of the signal. In addition, the high-speed cable can be routed obliquely along the surface of the management board body 1110, without having to be routed along the edge of the bottom plate of the chassis 1001, which shortens the length of the high-speed cable, thereby shortening the transmission path of the high-speed signal, which is conducive to shortening the transmission time of the high-speed signal.

[0184] In some examples, there is a gap between the bottom of the fan 1004 and the surface of the management board body 1110, and the gap is used for high-speed cable routing. This arrangement can reduce the mutual influence between the fan 1004 and the high-speed cable, and improve the space utilization rate in the chassis 1001.

[0185] In some examples, such as Figure 7 As shown, the connector 1122 includes a low-speed connector 1122b, which is electrically connected to the management board body 1110, and at least one of the node board 1002 and the functional module 1003 is pluggably connected to the low-speed connector 1122b for transmitting low-speed signals.

[0186] For example, the number of low-speed connectors 1122b can be one or more. The number of low-speed connectors 1122b of the first connector module 1120a and the number of low-speed connectors 1122b of the second connector module 1120b can be the same or different. The node board 1002 is plugged with the low-speed connector 1122b, so that the low-speed signal can be transmitted between the node board 1002 and the connector module 1120. The function module 1003 is plugged with the low-speed connector 1122b, so that the low-speed signal can be transmitted between the function module 1003 and the connector module 1120.

[0187] A node board 1002 can be pluggably connected to one or more low-speed connectors 1122b, and a functional module 1003 can be pluggably connected to one or more low-speed connectors 1122b. Different low-speed connectors 1122b can transmit the same low-speed signal or different low-speed signals. The low-speed signal includes one or more of I2C, SPI, I3C, and GPIO. It can be understood that the embodiments of the present application do not further limit the types of low-speed signals transmitted between the node board 1002 and the connector module 1120, and between the functional module 1003 and the connector module 1120. For example, the low-speed connector 1122b can be an exmax low-speed connector.

[0188] It can be understood that the management module 1008 can be a BMC, which is arranged on the management board body 1110, and the low-speed connector 1122b is electrically connected to the management board body 1110, so that the low-speed signal can be transmitted between the BMC and the low-speed connector 1122b. In this way, when the node board 1002 is pluggably connected to the low-speed connector 1122b, the node board 1002 and the BMC can communicate through the low-speed signal, so that the BMC can monitor and manage the node board 1002.

[0189] Similarly, when the function module 1003 is pluggably connected to the low-speed connector 1122b, the function module 1003 and the BMC can communicate via low-speed signals, so that the BMC can monitor and manage the function module 1003. In this way, the BMC can monitor and manage the node board 1002 and the function module 1003.

[0190] In some examples, such as Figure 7 As shown, the connector 1122 includes a first connector 11221 and a second connector 11222 , and the first connector 11221 and the second connector 11222 are spaced apart along a height direction Z of the chassis 1001 .

[0191] The first connector 11221 and the second connector 11222 may be high-speed connectors 1122a or low-speed connectors 1122b. Taking the first connector 11221 and the second connector 11222 as high-speed connectors 1122a as an example, the two high-speed connectors 1122a are spaced apart along the height direction Z of the chassis 1001. Taking the first connector 11221 and the second connector 11222 as low-speed connectors 1122b as an example, the two low-speed connectors 1122b are spaced apart along the height direction Z of the chassis 1001.

[0192] The number of node plates 1002 arranged in the first zone A is two. When the two node plates 1002 are stacked, the first connector module 1120a may include two high-speed connectors 1122a and two low-speed connectors 1122b.

[0193] The two high-speed connectors 1122a are spaced apart along the height direction Z of the chassis 1001. For example, the high-speed connector 1122a close to the bottom plate of the chassis 1001 can be called a "lower high-speed connector", and the high-speed connector close to the cover plate of the chassis 1001 can be called an "upper high-speed connector". The two low-speed connectors 1122b are spaced apart along the height direction Z of the chassis 1001. For example, the low-speed connector 1122b close to the bottom plate of the chassis 1001 can be called a "lower low-speed connector", and the low-speed connector close to the cover plate of the chassis 1001 can be called an "upper low-speed connector".

[0194] The node plate 1002 close to the bottom plate of the chassis 1001 may be called the node plate 1002 set in the lower 1U, and the node plate 1002 set close to the cover plate of the chassis 1001 may be called the node plate 1002 set in the upper 1U. The node plate 1002 set in the lower 1U may be electrically connected to the lower high-speed connector through a cable, and the node plate 1002 set in the lower 1U may be electrically connected to the lower low-speed connector through plugging. The node plate 1002 set in the upper 1U may be electrically connected to the upper high-speed connector and the upper low-speed connector through a cable.

[0195] It can be understood that the upper high-speed connector and the lower high-speed connector can be integrated or separated, and the upper low-speed connector and the lower low-speed connector can be integrated or separated.

[0196] The first connector 11221 and the second connector 11222 are spaced apart along the height direction Z of the chassis 1001, so that the stacked node plates 1002 can be electrically connected to the first connector 11221 and the second connector 11222, respectively, thereby improving the convenience of electrically connecting the node plates 1002 and the connectors 1122 and improving the space utilization of the chassis 1001.

[0197] Figure 8 This is a schematic block diagram of the structure of the power module 1005 provided in some embodiments of the present application. Fig. 9 This is a schematic diagram of the structure of the server 1000 provided in some embodiments of the present application. In some examples, such as Figure 8 and Fig. 9 As shown, the server 1000 further includes a power module 1005 , and the power module 1005 includes a power output interface 1005 c .

[0198] For example, the power module 1005 can be arranged in the first area A and / or the third area C. Figure 8 As shown, the power module 1005 may include a power body 1005a and a power distribution board (PDB) 1005b. The power body 1005a is used to provide electrical energy. For example, the power body 1005a may be a power supply unit (PSU). The power distribution board 1005b may be a PCB, and the power output interface 1005c is provided on the power distribution board 1005b.

[0199] The node board 1002 includes a first power supply input interface, and the functional module 1003 includes a second power supply input interface. Fig. 9 As shown, the connector 1122 includes a first power connector 1122c, a second power connector 1122d, and a third power connector 1122e. The third power connector 1122e is electrically connected to the power output interface 1005c, the first power connector 1122c is electrically connected to one of the first power input interface and the second power input interface, and the second power connector 1122d is electrically connected to the other of the first power input interface and the second power input interface. In this way, the power module 1005 can supply power to the node board 1002 and the function module 1003 through the management board 1100.

[0200] For example, Fig. 9As shown, the first power connector 1122c can be electrically connected to the first power input interface, so that the power module 1005 can supply power to the node board 1002 through the management board 1100. The second power connector 1122d can be electrically connected to the second power input interface, so that the power module 1005 can supply power to the functional module 1003 through the management board 1100. Alternatively, the first power connector 1122c can be electrically connected to the second power input interface, and the second power connector 1122d can be electrically connected to the first power input interface.

[0201] The embodiment of the present application takes the example that the first power connector 1122c is electrically connected to the first power input interface, and the second power connector 1122d is electrically connected to the second power input interface as an example, and continues to illustrate.

[0202] In some examples, the power output interface 1005c can be electrically connected to the third power connector 1122e through a power cable. In some examples, the third power connector 1122e can be set on the management board body 1110, and a notch is opened on the fixing plate 1121, and the power cable passes through the notch opened on the fixing plate 1121 to electrically connect the power output interface 1005c and the third power connector 1122e.

[0203] The first power supply input interface can be electrically connected to the first power connector 1122c by plugging. For example, the node board 1002 may include multiple first power supply input interfaces, and the multiple first power supply input interfaces can be plugged in one-to-one with the multiple first power connectors 1122c. The second power supply input interface can be electrically connected to the second power connector 1122d by plugging. For example, the functional module 1003 may include multiple second power supply input interfaces, and the multiple second power supply input interfaces can be plugged in one-to-one with the multiple second power connectors 1122d.

[0204] For example, the first power connector 1122c and the second power connector 1122d may be PWR (power) power connectors, and the third power connector 1122e may be a CST power connector.

[0205] In some examples, such as Fig. 9 As shown, the power module 1005 may further include a power low-speed interface 1005d, which may be provided on the power distribution board 1005b. The power low-speed interface 1005d is electrically connected to the low-speed connector 1122b via a low-speed cable, and the low-speed connector 1122b is electrically connected to the BMC, so that the BMC and the power module 1005 can communicate with each other, thereby enabling the BMC to monitor and manage the power module 1005. For example, the power low-speed interface 1005d may be a PDB low-speed connector.

[0206] For example, in the 2U chassis 1001 space, the power module 1005 supports the modular hardware system universal redundant power supply (MCRPS). For example, the power module 1005 supports 1+1 redundancy (one for use and one for backup), 2+2 redundancy (two for use and two for backup), and can support up to 6kW (kilowatt) power supply.

[0207] It can be understood that the power module 1005 and the management board 1100 can be decoupled, which improves the convenience of maintenance of the power module 1005. In addition, different power modules 1005 can be replaced according to different configurations of the server 1000, which improves the flexibility of use of the server 1000.

[0208] The fan 1004 is disposed on the management board body 1110 , and the power module 1005 can supply power to the fan 1004 through the management board body 1110 , so that the fan 1004 can work normally.

[0209] It is understandable that the server 1000 can be applicable to different configurations. Four different configurations of the server 1000 are illustrated below.

[0210] In the first configuration of the server 1000, such as Fig. 9 As shown, the gusset plate 1002 includes a first gusset plate 1002a and a second gusset plate 1002b. One of the first gusset plate 1002a and the second gusset plate 1002b is disposed in the first region A, and the other is disposed in the third region C.

[0211] For example, the first node board 1002a may be arranged in the first zone A, and the second node board 1002b may be arranged in the third zone C. Alternatively, the first node board 1002a may be arranged in the third zone C, and the second node board 1002b may be arranged in the first zone A. The embodiment of the present application takes the first node board 1002a arranged in the first zone A, and the second node board 1002b arranged in the third zone C as an example, and continues to illustrate the first configuration of the server 1000.

[0212] like Fig. 9 As shown, one of the power module 1005 and the functional module 1003 is arranged in the first zone A, and is spaced apart from the node plate 1002 (the first node plate 1002a or the second node plate 1002b) arranged in the first zone A along the second direction Y. The other of the power module 1005 and the functional module 1003 is arranged in the third zone C, and is spaced apart from the node plate 1002 (the first node plate 1002a or the second node plate 1002b) arranged in the third zone C along the second direction Y.

[0213] like Fig. 9As shown, the functional module 1003 may include a riser card 1003a and a board card 1003c. The riser card 1003a is provided with a slot 1003b. For example, the riser card 1003a may be provided with four slots 1003b. The board card 1003c may be a GPU card or a DPU card, etc., and the board card 1003c can be plugged into the slot 1003b.

[0214] It can be understood that in the drawings of the specification of this application, Fig. 9 For example, in order to clearly illustrate the slot 1003b and the board 1003c, the plug-in relationship between the slot 1003b and the board 1003c is not shown, which does not mean that the board 1003c cannot be inserted into the slot 1003b.

[0215] In the first configuration of the server 1000, the height of the chassis 1001 may be 2U. Fig. 9 As shown, the functional module 1003 and the first node board 1002a are arranged at intervals along the second direction Y, and are arranged in the first zone A. For example, the first zone A can be called a computing storage zone. The management board 1100 and the fan 1004 are arranged in the second zone B. For example, the second zone B can be called a fan management zone. The power module 1005 and the second node board 1002b are arranged at intervals along the second direction Y, and are arranged in the third zone C. For example, the third zone C can be called a computing power zone. The ear module 1400 is arranged along the first direction X close to the first side 1001a of the chassis 1001, that is, the first side 1001a of the chassis 1001 is the front side of the server 1000, and the second side 1001b of the chassis 1001 is the back side of the server 1000.

[0216] Along the second direction Y, the first area A and the third area C are divided into three equal parts, that is, the first area A and the third area C include three cages respectively. Fig. 9 As shown, the first node board 1002a occupies 2 cages of the first zone A, and the riser card 1003a and the board card 1003c occupy 1 cage of the first zone A. By way of example, the riser card 1003a supports double-width full-height full-length (FHFL) boards. The second node board 1002b occupies 2 cages of the third zone C, and the power module 1005 occupies 1 cage of the third zone C. By way of example, the power module 1005 can be 2PSUs, supporting 1+1 (one in use and one in standby) redundancy.

[0217] It can be understood that the node board 1002 (the first node board 1002a or the second node board 1002b) occupies 2 cages, and each node board 1002 can support 24 RDIMMs. Compared with setting 8 RDIMMs, 16 more RDIMMs can be expanded. The first node board 1002a and the second node board 1002b can expand 32 more RDIMMs in total.

[0218] For the transmission of low-speed signals, the first node plate 1002a and the second node plate 1002b may be connected to the low-speed connector 1122b by hard connection (i.e., plugging). For example, the first node plate 1002a and the second node plate 1002b may include a bent male for transmitting low-speed signals, and the low-speed connector 1122b may include a bent female for transmitting low-speed signals, and the bent male for transmitting low-speed signals and the bent female for transmitting low-speed signals are plugged.

[0219] Riser card 1003a may also be connected to low-speed connector 1122b by hard connection (i.e. plug-in). For example, riser card 1003a may include an orthogonal male bend for transmitting low-speed signals, and low-speed connector 1122b may include a female bend for transmitting low-speed signals, and the orthogonal male bend for transmitting low-speed signals is plugged with the female bend for transmitting low-speed signals.

[0220] For high-speed signals, the first node board 1002a, the second node board 1002b and the riser card 1003a can be connected by a soft connection (high-speed cable 1006, see Fig. 9 ) is connected to the high-speed connector 1122a.

[0221] For power supply signals, Fig. 9 As shown, the power output interface 1005 c of the power module 1005 is electrically connected to the third power connector 1122 e through a power cable, and supplies power to the node board 1002 and the functional module 1003 through the management board 1100 .

[0222] For example, the first node plate 1002a and the second node plate 1002 may include a bent male for transmitting a power signal, the first power connector 1122c may be a bent female for transmitting a power signal, and the bent male for transmitting a power signal and the bent female for transmitting a power signal are plugged in. The functional module 1003 may include a bent male for transmitting a power signal, the third power connector 1122e may be a bent female for transmitting a power signal, and the bent male for transmitting a power signal and the bent female for transmitting a power signal are plugged in. For example, the bent male for transmitting a power signal of the functional module 1003 may be an orthogonal bent male.

[0223] like Fig. 9As shown, the power signal transmission male of the functional module 1003 can be electrically connected to the riser card 1003a and the board card 1003c through the power cable, so that the power module 1005 can supply power to the riser card 1003a and the board card 1003c. For example, the riser card 1003a can use a 2*2 power connector, and the board card 1003c can use a 2*6 power connector to meet the needs of a 650W (watt) GPU card.

[0224] In the first configuration of the server 1000, the chassis 1001 supports double-width, full-height, full-length DPU cards. In addition, both the node board 1002 and the functional module 1003 support cable-free hot maintenance. The node board 1002 and the functional module 1003 transmit low-speed signals and power signals by plugging with the connector 1122, reducing the number of low-speed cables and power cables. High-speed signals are softly connected through the high-speed cable 1006. By plugging and unplugging the high-speed cable 1006, the electrical connection relationship between different node boards 1002 can be changed, so that the server 1000 can have different working modes.

[0225] Furthermore, the connector module 1120 can be decoupled from the node board 1002 and the functional module 1003, so that the node board 1002 and the functional module 1003 can be plugged and unplugged independently. Taking the board 1003c including the DPU card as an example, when one of the first node board 1002a and the second node board 1002b works abnormally, it does not affect the signal transmission between the other node board 1002 and the DPU card, thus realizing the multi-host function and increasing maintainability.

[0226] In the first configuration of the server 1000, the first node board 1002a and the second node board 1002b can be connected in series to form a node, and the server 1000 works in a single P mode. Alternatively, the first node board 1002a and the second node board 1002b can also work separately as two nodes, and the server 1000 works in a 2P mode.

[0227] Fig.10 This is a schematic diagram of the structure of the node plate 1002 provided in some embodiments of the present application. For example, Fig.10 As shown, the node board 1002 is provided with an MCIO connector 1202, and the MCIO connector 1202 is connected to the CPU signal. There may be multiple MCIO connectors 1202, and the multiple MCIO connectors 1202 are provided on both sides of the service processing module 1201 along the first direction X.

[0228] For example, the number of MCIO connectors 1202 may be 16, of which 8 MCIO connectors 1202 are arranged at intervals along the second direction Y and are arranged at one side of the service processing module 1201 along the first direction X. Another 8 service processing modules 1201 are arranged at intervals along the second direction Y and are arranged at the other side of the service processing module 1201 along the first direction X. Each MCIO connector 1202 may be allocated a bandwidth of X8.

[0229] For ease of description, Fig. 9 and Fig.10 As shown, the eight MCIO connectors 1202 arranged in the first direction X on one side of the service processing module 1201 (CPU) may be referred to as a first MCIO connector group 1202a, and the eight MCIO connectors 1202 arranged in the first direction X on the other side of the service processing module 1201 (CPU) may be referred to as a second connector group 1202b. Fig. 9 As shown, along the first direction X, the second MCIO connector group 1202 b is closer to the connector module 1120 than the first MCIO connector group 1202 a .

[0230] When the server 1000 works in a single P mode, the first node board 1002a and the second node board 1002b may be interconnected via a unified parallel interface (UPI).

[0231] Taking the bandwidth supported by the single P mode as X48 and the bandwidth supported by the high-speed connector 1122a as X24 as an example, in the first MCIO connector group 1202a of the first node board 1002a, three MCIO connectors 1202 are electrically connected to a high-speed connector 1122a of the first connector module 1120a through the high-speed cable 1006. In the second MCIO connector group 1202b of the first node board 1002a, three MCIO connectors 1202 are electrically connected to another high-speed connector 1122a of the first connector module 1120a through the high-speed cable 1006. That is, the six MCIO connectors 1202 of the first node board 1002a are electrically connected to the two high-speed connectors 1122a of the first connector module 1120a through the high-speed cable 1006.

[0232] The two high-speed connectors 1122a electrically connected to the first node plate 1002a may be spaced apart along the height direction Z of the chassis 1001 , thereby reducing the space occupied by the connector module 1120 in the first direction X.

[0233] Similarly, in the first MCIO connector group 1202a of the second node board 1002b, three MCIO connectors 1202 are electrically connected to one high-speed connector 1122a of the second connector module 1120b through the high-speed cable 1006. In the second MCIO connector group 1202b of the second node board 1002b, three MCIO connectors 1202 are electrically connected to another high-speed connector 1122a of the second connector module 1120b through the high-speed cable 1006. That is, the six MCIO connectors 1202 of the second node board 1002b are electrically connected to the two high-speed connectors 1122a of the second connector module 1120b through the cables.

[0234] The two high-speed connectors 1122a electrically connected to the second node plate 1002b may be spaced apart along the height direction Z of the chassis 1001 , so as to reduce the space occupied by the connector module 1120 in the first direction X.

[0235] The two high-speed connectors 1122a electrically connected to the first node board 1002a can be electrically connected to the two high-speed connectors 1122a electrically connected to the second node board 1002b through two x24 bandwidth (lane) high-speed cables 1006, so that the first node board 1002a and the second node board 1002b can be connected in series to form a node, thereby making the server 1000 have stronger data processing capabilities. For example, the two x24 bandwidth high-speed cables 1006 are routed between the fan 1004 and the management board body 1110, shortening the length of the high-speed cables 1006 and improving the transmission speed of high-speed signals.

[0236] It can be understood that the function module 1003 is electrically connected to the high-speed connector 1122a, so that after the first node board 1002a and the second node board 1002b are connected in series to form a node, the function module 1003 can be accessed.

[0237] When the server 1000 works in the 2P mode, in the second MCIO connector group 1202b (or the first MCIO connector group 1202a) of the first node board 1002a, two MCIO connectors 1202 are electrically connected to a high-speed connector 1122a of the first connector module 1120a through the high-speed cable 1006. In the second MCIO connector group 1202b (or the second MCIO connector group 1202b) of the second node board 1002b, two MCIO connectors 1202 are electrically connected to a high-speed connector 1122a of the second connector module 1120b through the high-speed cable 1006.

[0238] The high-speed connector 1122a electrically connected to the first node board 1002a and the high-speed connector 1122a electrically connected to the second node board 1002b can be electrically connected to the high-speed connector 1122a with x32 bandwidth through two x16 bandwidth high-speed cables 1006. For example, the two x16 bandwidth high-speed cables 1006 are routed between the fan 1004 and the management board body 1110, which shortens the length of the high-speed cable and improves the transmission speed of the high-speed signal.

[0239] The x32 bandwidth high-speed connector 1122a is electrically connected to the riser card 1003a, so that the first node board 1002a and the second node board 1002b can respectively provide PCIE x16 resources to the riser card 1003a.

[0240] For example, the riser card 1003a includes four slots 1003b, and each slot 1003b is in the form of a PCIE CEM (Card Electromechanical, PCIE card electromechanical specification) direct cable to a high-speed connector 1122a with a bandwidth of x32.

[0241] In the first configuration of the server 1000, the node board 1002 includes a first node board 1002a and a second node board 1002b. The first node board 1002a and the second node board 1002b can be connected in series as a node, and the server 1000 works in a single P mode, with stronger data processing capabilities; or, the first node board 1002a and the second node board 1002b can also work separately, and the server 1000 works in a 2P mode. That is, the node board 1002 includes a first node board 1002a and a second node board 1002b. By changing the electrical connection relationship between the two node boards 1002, the server 1000 can have different working modes, can meet different needs, and improve the use flexibility of the server 1000. In addition, the operation is simple, there is no need to set up a structure such as a central backplane, and there is no need to open the cover of the chassis 1001, which improves the convenience of operation and maintenance.

[0242] In some examples, such as Fig. 9 As shown, the first node plate 1002a and the second node plate 1002b are staggered in the first direction X. It can be understood that the node plate 1002 generates a large amount of heat when working. The first node plate 1002a and the second node plate 1002b are staggered in the first direction X, which can reduce the risk of heat accumulation in the chassis 1001, so that the heat can be evenly distributed in the chassis 1001, which is beneficial to the heat dissipation of the chassis 1001.

[0243] Fig.11FIG. 1 is a schematic diagram of the structure of the server 1000 provided in some embodiments of the present application. In the second configuration of the server 1000, as shown in FIG. Fig.11 As shown, based on the first configuration, there are multiple first gusset plates 1002a, and the multiple first gusset plates 1002a are stacked. There are multiple second gusset plates 1002b, and the multiple second gusset plates 1002b are stacked.

[0244] It can be understood that the plurality of first node plates 1002a are stacked along the height direction Z of the chassis 1001, and the plurality of second node plates 1002b are stacked along the height direction Z of the chassis 1001. The number of the first node plates 1002a and the number of the second node plates 1002b may be the same or different.

[0245] The number of the first node board 1002a and the second node board 1002b is set to be multiple, which can improve the computing performance of the server 1000. For example, the second configuration of the server 1000 can be called a high computing performance configuration. By changing the electrical connection relationship (series or parallel) between the multiple node boards 1002, the server 1000 can work in different modes to meet different needs, thereby improving the flexibility of use of the server 1000. Multiple first node boards 1002a are stacked and multiple second node boards 1002b are stacked, which can improve the space utilization of the chassis 1001.

[0246] In some examples, the number of first node boards 1002a is two, and the number of second node boards 1002b is two. This configuration enables the server 1000 to meet data processing requirements. For example, in the second configuration of the server 1000, the height of the chassis 1001 can be 2U.

[0247] The following takes the case where the number of the first node boards 1002 is two and the number of the second node boards 1002 is two as an example to further illustrate the second configuration of the server 1000 .

[0248] Continue to refer to Fig.11, the functional module 1003 and the two first node plates 1002a stacked are spaced apart along the second direction Y, and are arranged in the first zone A. For example, the first zone A can be called a computing storage zone. The management board 1100 and the fan 1004 are arranged in the second zone B. For example, the second zone B can be called a fan management zone. The power module 1005 and the two second node plates 1002b stacked are spaced apart along the second direction Y, and are arranged in the third zone C. For example, the third zone C can be called a computing power zone. The ear module 1400 is arranged along the first direction X close to the first side 1001a of the chassis 1001, that is, the first side 1001a of the chassis 1001 is the front side of the server 1000, and the second side 1001b of the chassis 1001 is the back side of the server 1000.

[0249] Along the second direction Y, the first area A and the third area C are divided into three equal parts, that is, the first area A and the third area C include three cages respectively. Fig.11 As shown, the two stacked first node boards 1002a occupy 2 cages of the first zone A, and the riser card 1003a and the board card 1003c occupy 1 cage of the first zone A. For example, the riser card 1003a supports double-width full-height full-length cards. The two stacked second node boards 1002b occupy 2 cages of the third zone C, and the power module 1005 occupies 1 cage of the third zone C. For example, the power module 1005 supports 4 PSUs and supports 2+2 redundancy.

[0250] It can be understood that, in the two stacked first node plates 1002a, each first node plate 1002a occupies 1U of space. In the two stacked second node plates 1002b, each second node plate 1002b occupies 1U of space. Taking the first node plate 1002a as an example, the first node plate 1002a disposed close to the bottom plate of the chassis 1001 can be referred to as the first node plate 1002a disposed in the lower 1U, and the first node plate 1002a disposed close to the cover plate of the chassis 1001 can be referred to as the first node plate 1002a disposed in the upper 1U.

[0251] The node board 1002 (the first node board 1002a or the second node board 1002b) occupies 2 cages, and each node board 1002 can support the expansion of 24 RDIMMs. Compared with setting 8 RDIMMs, 16 more RDIMMs can be expanded. Two first node boards 1002a and two second node boards 1002b can expand 64 more RDIMMs in total.

[0252] like Fig.11As shown, there are two management modules 1008 (BMCs), and the two BMCs are arranged at intervals on the management board body 1110. One of the BMCs is used to monitor and manage the first node board 1002a and the second node board 1002b arranged in the lower 1U, and the other BMC is used to monitor and manage the first node board 1002a and the second node board 1002b arranged in the upper 1U. The function module 1003, the power module 1005, the fan 1004, etc. are monitored and managed by at least one of the two BMCs.

[0253] For low-speed signals, the first node board 1002a and the second node board 1002b arranged in the lower 1U can be connected to the low-speed connector 1122b by hard connection (i.e., plugging). For example, the first node board 1002a and the second node board 1002b arranged in the lower 1U can include a bent male for transmitting low-speed signals, and the low-speed connector 1122b can include a bent female for transmitting low-speed signals, and the bent male for transmitting low-speed signals and the bent female for transmitting low-speed signals are plugged.

[0254] The first node board 1002a and the second node board 1002b arranged on the upper 1U may be connected to the low-speed connector 1122b by means of a soft connection (low-speed cable). For example, the first node board 1002a and the second node board 1002b arranged on the upper 1U may include a bent male for transmitting a low-speed signal, the low-speed connector 1122b may include a straight female for transmitting a low-speed signal, and the low-speed cable electrically connects the bent male for transmitting the low-speed signal and the straight female for transmitting the low-speed signal. For example, the low-speed cable electrically connecting the bent male for transmitting the low-speed signal and the straight female for transmitting the low-speed signal may include a bent female-straight male connector. Alternatively, the first node board 1002a and the second node board 1002b arranged on the upper 1U may also be connected to the low-speed connector 1122b by means of a hard connection (i.e., plugging).

[0255] Riser card 1003a may also be connected to low-speed connector 1122b by hard connection (i.e. plug-in). For example, riser card 1003a may include an orthogonal male bend for transmitting low-speed signals, and low-speed connector 1122b may include a female bend for transmitting low-speed signals, and the orthogonal male bend for transmitting low-speed signals is plugged with the female bend for transmitting low-speed signals.

[0256] For high-speed signals, the two stacked first node boards 1002a, the two stacked second node boards 1002b and the riser card 1003a can be connected by a soft connection (high-speed cable 1006, see Fig.11 ) is connected to the high-speed connector 1122a.

[0257] For power supply signals, Fig.11As shown, the power output interface 1005c of the power module 1005 is electrically connected to the third power connector 1122e through a power cable, and supplies power to the node board 1002 and the functional module 1003 through the management board 1100. For example, the number of the third power connectors 1122e can be two.

[0258] There are two first power connectors 1122c, and the two first power connectors 1122c are stacked along the height direction Z of the chassis 1001. The first node board 1002a and the second node board 1002b arranged in the lower 1U include a bent male for transmitting a power signal, and the first power connector 1122c can be a bent female for transmitting a power signal, and the bent male for transmitting a power signal and the bent female for transmitting a power signal are plugged in. The first node board 1002a and the second node board 1002b arranged in the upper 1U can include a bent male for transmitting a power signal, and the first power connector 1122c can be a bent female for transmitting a power signal, and the bent male for transmitting a power signal and the bent female for transmitting a power signal are plugged in.

[0259] Functional module 1003 (including riser card 1003a and board card 1003c) may include a bent male for transmitting a power signal, and third power connector 1122e may include a bent female for transmitting a power signal, and the bent male for transmitting a power signal and the bent female for transmitting a power signal are plugged in. For example, the bent male for transmitting a power signal of functional module 1003 may be an orthogonal bent male.

[0260] like Fig.11 As shown, the power signal transmission male of the functional module 1003 can be electrically connected to the riser card 1003a and the board card 1003c through the power cable, so that the power module 1005 can supply power to the riser card 1003a and the board card 1003c. For example, the riser card 1003a can use a 2*2 power connector, and the board card 1003c can use a 2*6 power connector to meet the needs of a 650W (watt) GPU card.

[0261] In the second configuration of the server 1000, the chassis 1001 supports double-width, full-height, full-length DPU cards. In addition, both the node board 1002 and the functional module 1003 support cable-free hot maintenance. The node board 1002 and the functional module 1003 transmit low-speed signals and power signals by plugging with the connector 1122, reducing the number of low-speed cables and power cables. High-speed signals are softly connected through the high-speed cable 1006. By plugging and unplugging the high-speed cable 1006, the electrical connection relationship between different node boards 1002 can be changed, so that the server 1000 can have different working modes.

[0262] Furthermore, the connector module 1120 can be decoupled from the node board 1002 and the functional module 1003, so that the node board 1002 and the functional module 1003 can be plugged and unplugged independently. Taking the board 1003c including the DPU card as an example, when one of the first node board 1002a and the second node board 1002b works abnormally, it does not affect the signal transmission between the other node board 1002 and the DPU card, thus realizing the multi-host function and increasing maintainability.

[0263] In the second configuration of the server 1000, the two first node boards 1002a can be connected in series to form a node, and the two second node boards 1002b can be connected in series to form a node, and the server 1000 works in a 2P mode. Alternatively, the two first node boards 1002a can work alone, and the two second node boards 1002b can also work alone, and the server 1000 works in a 4P mode.

[0264] When the server 1000 works in the 2P mode, the two first node boards 1002a can be interconnected via UPI, and the two second node boards 1002b can be interconnected via UPI.

[0265] Take the two first node plates 1002a stacked as an example. Fig.11 As shown, three MCIO connectors 1202 in a first MCIO connector group 1202a on a first node board 1002a in the lower 1U are electrically connected to three MCIO connectors in a first MCIO connector group 1202a on a first node board 1002a in the upper 1U through high-speed cables 1006 .

[0266] On the first node board 1002a of the lower 1U, three MCIO connectors 1202 in the second MCIO connector group 1202b are electrically connected to a high-speed connector 1122a of the first connector module 1120a through a high-speed cable 1006. On the first node board 1002a of the upper 1U, three MCIO connectors 1202 in the second MCIO connector group 1202b are electrically connected to another high-speed connector 1122a of the first connector module 1120a through a high-speed cable 1006.

[0267] The two high-speed connectors 1122a electrically connected to the two first node boards 1002a are arranged along the height direction Z of the chassis 1001 to reduce the space occupied by the connector module 1120 in the first direction X. In addition, the high-speed connectors 1122a electrically connected to the two first node boards 1002a are electrically connected through the high-speed cable 1006, so that the two stacked first node boards 1002a can be connected in series, so that the server 1000 has stronger data processing capabilities.

[0268] Likewise, if Fig.11 As shown, among the two stacked second node boards 1002b, the three MCIO connectors 1202 in the first MCIO connector group 1202a on the second node board 1002b arranged in the lower 1U are electrically connected to the three MCIO connectors in the first MCIO connector group 1202a on the second node board 1002b arranged in the upper 1U through the high-speed cable 1006 in a one-to-one correspondence.

[0269] On the second node board 1002b of the lower 1U, three MCIO connectors 1202 in the second MCIO connector group 1202b are electrically connected to a high-speed connector 1122a of the second connector module 1120b via a high-speed cable 1006. On the second node board 1002b of the upper 1U, three MCIO connectors 1202 in the second MCIO connector group 1202b are electrically connected to another high-speed connector 1122a of the second connector module 1120b via a high-speed cable 1006.

[0270] The two high-speed connectors 1122a electrically connected to the two second node boards 1002b are arranged along the height direction Z of the chassis 1001 to reduce the space occupied by the connector module 1120 in the first direction X. In addition, the high-speed connectors 1122a electrically connected to the two second node boards 1002b are electrically connected through the high-speed cable 1006, so that the two stacked second node boards 1002b can be connected in series, so that the server 1000 has a stronger data processing capability.

[0271] It can be understood that the function module 1003 is electrically connected to the high-speed connector 1122a, so that after the two stacked first node plates 1002a are connected in series as one node and the two stacked second node plates 1002b are connected in series as one node, the function module 1003 can be accessed respectively.

[0272] When the server 1000 operates in the 4P mode, Fig.11 As shown, in the two first node boards 1002a, one MCIO connector 1202 in the second MCIO connector group 1202b of each first node board 1002a is electrically connected to a high-speed connector 1122a of the first connector module 1120a through a high-speed cable 1006. It can be understood that the two first node boards 1002a are electrically connected to the two high-speed connectors 1122a of the first connector module 1120a respectively. The two high-speed connectors 1122a electrically connected to the two first node boards 1002a can be arranged at intervals along the height direction Z of the chassis 1001.

[0273] In the two second node boards 1002b, one MCIO connector 1202 in the second MCIO connector group 1202b of each second node board 1002b is electrically connected to a high-speed connector 1122a of the second connector module 1120b through a high-speed cable 1006. It can be understood that the two second node boards 1002b are electrically connected to the two high-speed connectors 1122a of the second connector module 1120b respectively. The two high-speed connectors 1122a electrically connected to the two second node boards 1002b can be spaced apart along the height direction Z of the chassis 1001.

[0274] The two high-speed connectors 1122a electrically connected to the two first node boards 1002a and the two high-speed connectors 1122a electrically connected to the second node board 1002b are electrically connected to the high-speed connectors 1122a with x32 bandwidth through four high-speed cables with x8 bandwidth.

[0275] The x32 bandwidth high-speed connector 1122a is electrically connected to the riser card 1003a, so that the two first node boards 1002a and the two second node boards 1002b can respectively provide PCIE x8 resources to the riser card 1003a. For example, four x8 bandwidth high-speed cables are routed between the fan 1004 and the management board body 1110, shortening the length of the high-speed cables and improving the transmission speed of high-speed signals.

[0276] For example, the riser card 1003a includes four slots 1003b, and each slot 1003b is in the form of a PCIE CEM (Card Electromechanical, PCIE card electromechanical specification) direct cable to a high-speed connector 1122a with a bandwidth of x32.

[0277] Fig.12 A schematic diagram of the structure of the server 1000 provided for some further embodiments of the present application. Fig.13 This is a schematic diagram of the structure of the server 1000 provided in some embodiments of the present application. Fig.12 and Fig.13 As shown, there are multiple node plates 1002, which are stacked and arranged in the first zone A or the third zone C. The power supply module 1005 and the node plate 1002 are arranged in the same zone (the first zone A or the third zone C), and the power supply module 1005 and the node plate 1002 are arranged at intervals along the second direction Y. There are multiple function modules 1003, which are arranged in different zones from the node plate 1002, and the multiple function modules 1003 are arranged along the second direction Y.

[0278] It can be understood that when the node plate 1002 and the battery module 1005 are arranged in the first zone A, the plurality of functional modules 1003 are arranged in the third zone C. When the node plate 1002 and the functional module 1005 are arranged in the third zone C, the plurality of functional modules 1003 are arranged in the first zone A. For example, Fig.12 and Fig.13 As shown, the number of the functional modules 1003 may be three.

[0279] In some examples, such as Fig.12 and Fig.13 As shown, there are two node plates 1002. For example, the height of the chassis 1001 may be 2U, and the two node plates 1002 are stacked along the height direction Z of the chassis 1001 to improve the space utilization in the chassis 1001.

[0280] In the third configuration of the server 1000, if Fig.12 As shown, the functional module 1003 may include a hard disk backplane 1003d and a hard disk 1003e, and the hard disk 1003e is plugged into the hard disk backplane 1003d. For example, the third configuration of the server 1000 may be a storage configuration.

[0281] like Fig.12 As shown, a plurality of functional modules 1003 are arranged in the first zone A along the second direction Y at intervals. For example, the first zone A can be referred to as a storage zone. The management board 1100 and the fan 1004 are arranged in the second zone B. For example, the second zone B can be referred to as a fan management zone. The power module 1005 and the two stacked node boards 1002 are arranged along the second direction Y at intervals and in the third zone C. For example, the third zone C can be referred to as a computing power zone. The ear module 1400 is arranged along the first direction X close to the first side 1001a of the chassis 1001, that is, the first side 1001a of the chassis 1001 is the front side of the server 1000, and the second side 1001b of the chassis 1001 is the back side of the server 1000.

[0282] Along the second direction Y, the first area A and the third area C are divided into three equal parts, that is, the first area A and the third area C include three cages respectively. Fig.12 As shown, each functional module 1003 occupies 1 cage space of the first zone A. Each cage space can support 8 NVME 2.5-inch hard disks, and a total of 24 NVME 2.5-inch hard disks (3*8) can be supported. The two stacked node boards 1002 occupy 2 cage spaces of the third zone C. The power module 1005 occupies 1 cage space of the third zone C. For example, the power module 1005 supports 4 PSUs and supports 2+2 redundancy.

[0283] It can be understood that the node board 1002 occupies 2 cages, and each node board 1002 can support the expansion of 24 RDIMMs. Compared with setting 8 RDIMMs, 16 more RDIMMs can be expanded. Two node boards 1002 can expand 32 more RDIMMs in total.

[0284] In the two stacked node plates 1002, each node plate 1002 occupies 1U of space. For example, the node plate 1002 disposed close to the bottom plate of the chassis 1001 may be referred to as the node plate 1002 disposed in the lower 1U, and the node plate 1002 disposed close to the cover plate of the chassis 1001 may be referred to as the node plate 1002 disposed in the upper 1U.

[0285] For low-speed signals, the node board 1002 disposed in the lower 1U can be connected to the low-speed connector 1122b by hard connection (i.e., plugging). For example, the node board 1002 disposed in the lower 1U may include a bent male for transmitting low-speed signals, and the low-speed connector 1122b may include a bent female for transmitting low-speed signals, and the bent male for transmitting low-speed signals and the bent female for transmitting low-speed signals are plugged.

[0286] The node board 1002 disposed on the upper 1U may be connected to the low-speed connector 1122b by means of a soft connection (low-speed cable). For example, the node board 1002 disposed on the upper 1U may include a bent male for transmitting a low-speed signal, the low-speed connector 1122b may include a straight female for transmitting a low-speed signal, and the low-speed cable may electrically connect the bent male for transmitting the low-speed signal and the straight female for transmitting the low-speed signal. For example, the low-speed cable electrically connecting the bent male for transmitting the low-speed signal and the straight female for transmitting the low-speed signal may include a bent female-straight male connector. Alternatively, the node board 1002 disposed on the upper 1U may also be connected to the low-speed connector 1122b by means of a hard connection (i.e., plugging).

[0287] The hard disk backplane 1003d can be connected to the low-speed connector 1122b by means of a soft connection (low-speed cable). For example, the hard disk backplane 1003d may include a straight female for transmitting a low-speed signal, the low-speed connector 1122b may include a bent female for transmitting a low-speed signal, and the low-speed cable electrically connects the straight female for transmitting a low-speed signal and the bent female for transmitting a low-speed signal. For example, the low-speed cable electrically connecting the straight female for transmitting a low-speed signal and the bent female for transmitting a low-speed signal may include a straight male-straight male connector.

[0288] For high-speed signals, the two stacked node boards 1002 and the hard disk backplane 1003d can be connected by a soft connection (high-speed cable 1006, see Fig.12 ) is connected to the high-speed connector 1122a.

[0289] For power supply signals, Fig.12As shown, the power output interface 1005c of the power module 1005 is electrically connected to the third power connector 1122e through a power cable, and supplies power to the node board 1002 and the functional module 1003 through the management board 1100. For example, the number of the third power connectors 1122e can be two.

[0290] There are two first power connectors 1122c, which are stacked along the height direction Z of the chassis 1001. The lower node plate 1002 includes a bent male for transmitting a power signal, and the first power connector 1122c may be a bent female for transmitting a power signal, and the bent male for transmitting a power signal and the bent female for transmitting a power signal are plugged.

[0291] Functional module 1003 (including hard disk backplane 1003d and hard disk 1003e) may include a bent male for transmitting power signals, and third power connector 1122e may include a bent female for transmitting power signals, and the bent male for transmitting power signals and the bent female for transmitting power signals are plugged. For example, hard disk backplane 1003d may use a 2*6 power connector.

[0292] In the third configuration of the server 1000, both the node board 1002 and the functional module 1003 support hot-swap maintenance. The node board 1002 transmits low-speed signals and power signals by plugging with the connector 1122, which reduces the number of low-speed cables and power cables. The high-speed signal is softly connected through the high-speed cable 1006. By plugging and unplugging the high-speed cable 1006, the electrical connection relationship between different node boards 1002 can be changed, so that the server 1000 can have different working modes.

[0293] Furthermore, the connector module 1120 can be decoupled from the node board 1002 and the functional module 1003, so that the node board 1002 and the functional module 1003 can be plugged and unplugged independently. When a node board 1002 works abnormally, it does not affect the signal transmission between other node boards 1002 and the hard disk 1003e, thereby improving maintainability.

[0294] In the third configuration of the server 1000, the two node boards 1002a can work independently, and the server 1000 works in the 2P mode.

[0295] like Fig.12 As shown, in the node board 1002 of the upper 1U, the six MCIO connectors 1202 of the second MCIO connector group 1202b are electrically connected to the two high-speed connectors 1122a of the second connector module 1120b. It can be understood that each MCIO connector 1202 has a bandwidth of x8, and the six MCIO connectors 1202 have a total bandwidth of x48. One of the two high-speed connectors 1122a has a bandwidth of x16, and the other has a bandwidth of x32.

[0296] In the node board 1002 of the lower 1U, the six MCIO connectors 1202 of the second MCIO connector group 1202b are electrically connected to the two high-speed connectors 1122a of the second connector module 1120b. It can be understood that each MCIO connector 1202 has a bandwidth of x8, and the six MCIO connectors 1202 have a total bandwidth of x48. One of the two high-speed connectors 1122a has a bandwidth of x16, and the other has a bandwidth of x32.

[0297] It can be understood that the two high-speed connectors 1122a electrically connected to the node plate 1002 set in the upper 1U and the two high-speed connectors 1122a electrically connected to the node plate 1002 set in the lower 1U are arranged in an array along the second direction Y and the height direction Z of the chassis 1001.

[0298] The first connector module 1120a is provided with three x32 bandwidth high-speed connectors 1122a for electrically connecting to the three hard disk backplanes 1003d. In the second connector module 1120b, every two x16 resources from different node boards 1002 are converged to one x32 bandwidth high-speed connector 1122a, so that the PCIE resources of each hard disk 1003e can come from two different node boards 1002, thereby improving the uniformity of resource allocation.

[0299] In the fourth configuration of the server 1000, if Fig.13 As shown, the functional module 1003 may include a riser card 1003a and a board card 1003c, and the board card 1003c is a double-width full-height full-length DPU card and a double-width full-height full-length GPU card. The riser card 1003a includes two slots 1003b, and the three riser cards 1003a support a total of 4 double-width full-height full-length GPU cards and 2 double-width full-height full-length DPU cards. For example, the fourth configuration of the server 1000 can be an AI reasoning configuration.

[0300] like Fig.13As shown, multiple functional modules 1003 (riser cards 1003a and boards 1003c) are arranged in the first zone A along the second direction Y. For example, the first zone A can be called an AI reasoning calculation zone. The management board 1100 and the fan 1004 are arranged in the second zone B. For example, the second zone B can be called a fan management zone. The power module 1005 and the two stacked node boards 1002b are arranged along the second direction Y and arranged in the third zone C. For example, the third zone C can be called a computing power supply zone. The ear module 1400 is arranged along the first direction X close to the first side 1001a of the chassis 1001, that is, the first side 1001a of the chassis 1001 is the front side of the server 1000, and the second side 1001b of the chassis 1001 is the back side of the server 1000.

[0301] Along the second direction Y, the first area A and the third area C are divided into three equal parts, that is, the first area A and the third area C include three cages respectively. Fig.13 As shown, each functional module 1003 (riser card 1003a and board card 1003c) occupies 1 cage space of the first zone A, each cage space supports 2 board cards 1003c, and 3 cage spaces are used to support 4 double-width full-height full-length GPU cards and 2 double-width full-height full-length DPU cards.

[0302] The two stacked node boards 1002 occupy 2 cages of the third zone C. The power module 1005 occupies 1 cage of the third zone C. For example, the power module 1005 supports 4 PSUs and 2+2 redundancy.

[0303] It can be understood that the node board 1002 occupies 2 cages, and each node board 1002 can support the expansion of 24 RDIMMs. Compared with setting 8 RDIMMs, 16 more RDIMMs can be expanded. Two node boards 1002 can expand 32 more RDIMMs in total.

[0304] For low-speed signals, the node board 1002 disposed in the lower 1U may be connected to the low-speed connector 1122b by hard connection (i.e., plugging). For example, the node board 1002 disposed in the lower 1U may include a bent male for transmitting low-speed signals, and the low-speed connector 1122b may include a bent female for transmitting low-speed signals, and the bent male for transmitting low-speed signals and the bent female for transmitting low-speed signals are plugged.

[0305] The node board 1002 disposed on the upper 1U may be connected to the low-speed connector 1122b by means of a soft connection (low-speed cable). For example, the node board 1002 disposed on the upper 1U may include a bent male for transmitting a low-speed signal, the low-speed connector 1122b may include a straight female for transmitting a low-speed signal, and the low-speed cable may electrically connect the bent male for transmitting the low-speed signal and the straight female for transmitting the low-speed signal. For example, the low-speed cable electrically connecting the bent male for transmitting the low-speed signal and the straight female for transmitting the low-speed signal may include a bent female-straight male connector. Alternatively, the node board 1002 disposed on the upper 1U may also be connected to the low-speed connector 1122b by means of a hard connection (i.e., plugging).

[0306] Riser card 1003a may also be connected to low-speed connector 1122b by hard connection (i.e. plug-in). For example, riser card 1003a may include an orthogonal male bend for transmitting low-speed signals, and low-speed connector 1122b may include a female bend for transmitting low-speed signals, and the orthogonal male bend for transmitting low-speed signals is plugged with the female bend for transmitting low-speed signals.

[0307] For high-speed signals, the two stacked node boards 1002 and the riser card 1003a can be connected by a soft connection (high-speed cable 1006, see Fig.13 ) is connected to the high-speed connector 1122a.

[0308] For power supply signals, Fig.13 As shown, the power output interface 1005c of the power module 1005 is electrically connected to the third power connector 1122e through a power cable, and supplies power to the node board 1002 and the functional module 1003 through the management board 1100. For example, the number of the third power connectors 1122e can be two.

[0309] There are two first power connectors 1122c, and the two first power connectors 1122c are stacked along the height direction Z of the chassis 1001. The node board 1002 includes a bent male for transmitting a power signal, and the first power connector 1122c may be a bent female for transmitting a power signal, and the bent male for transmitting a power signal and the bent female for transmitting a power signal are plugged.

[0310] Functional module 1003 (including riser card 1003a and board card 1003c) may include a bent male for transmitting a power signal, and third power connector 1122e may include a bent female for transmitting a power signal, and the bent male for transmitting a power signal and the bent female for transmitting a power signal are plugged in. For example, the bent male for transmitting a power signal of functional module 1003 may be an orthogonal bent male.

[0311] like Fig.13As shown, the power signal transmission male of the functional module 1003 can be electrically connected to the riser card 1003a and the board card 1003c through the power cable, so that the power module 1005 can supply power to the riser card 1003a and the board card 1003c. For example, the riser card 1003a can use a 2*2 power connector, and the board card 1003c can use a 2*6 power connector to meet the needs of a 650W (watt) GPU card.

[0312] In the fourth configuration of the server 1000, the chassis 1001 supports double-width, full-height, full-length DPU cards. In addition, both the node board 1002 and the functional module 1003 support cable-free hot maintenance. The node board 1002 and the functional module 1003 transmit low-speed signals and power signals by plugging with the connector 1122, reducing the number of low-speed cables and power cables. High-speed signals are softly connected through the high-speed cable 1006. By plugging and unplugging the high-speed cable 1006, the electrical connection relationship between different node boards 1002 can be changed, so that the server 1000 can have different working modes.

[0313] Furthermore, the connector module 1120 can be decoupled from the node board 1002 and the functional module 1003, so that the node board 1002 and the functional module 1003 can be plugged and unplugged independently. Taking the board 1003c including the DPU card as an example, when one of the first node board 1002a and the second node board 1002b works abnormally, it does not affect the signal transmission between the other node board 1002 and the DPU card, thus realizing the multi-host function and increasing maintainability.

[0314] In the fourth configuration of the server 1000, two node boards 1002 can be connected in series to form a node, and the server 1000 works in a single P mode. Alternatively, the two node boards 1002 can also work independently, and the server 1000 works in a 2P mode.

[0315] When the server 1000 works in single P mode, the two node boards 1002 can be interconnected via UPI.

[0316] For example, Fig.13 As shown, three MCIO connectors 1202 in a first MCIO connector group 1202a on a node board 1002 in the lower 1U are electrically connected to three MCIO connectors 1202 in a first MCIO connector group 1202a on a node board 1002 in the upper 1U through high-speed cables 1006 .

[0317] Furthermore, in the second MCIO connector group 1202b of the node board 1002 of the lower 1U, three MCIO connectors 1202 are electrically connected to the two high-speed connectors 1122a of the second connector module 1120b through the high-speed cable 1006. In the second MCIO connector group 1202b of the node board 1002 of the upper 1U, three MCIO connectors 1202 are electrically connected to the two high-speed connectors 1122a of the second connector module 1120b through the high-speed cable 1006.

[0318] Two high-speed connectors 1122a electrically connected to the node plate 1002 arranged in the lower 1U and two high-speed connectors 1122a electrically connected to the node plate 1002 arranged in the upper 1U are arranged in an array along the second direction Y and the height direction Z of the chassis 1001.

[0319] For example, four high-speed connectors 1122a electrically connected to the node board 1002 are arranged in two rows along the second direction Y. One row is a high-speed connector 1122a with x8 bandwidth, and the two high-speed connectors 1122a with x8 bandwidth are electrically connected through a high-speed cable 1006; the other row is a high-speed connector 1122a with x16 bandwidth, and the two high-speed connectors 1122a with x16 bandwidth are electrically connected through a high-speed cable 1006. The two stacked node boards 1002 can be connected in series, so that the server 1000 can work in a single P mode, and the data processing capability of the server 1000 is improved.

[0320] When the server 1000 works in 2P mode, the five MCIO connectors 1202 in the second MCIO connector group 1202b are arranged on the upper 1U node board 1002 and are electrically connected to the two high-speed connectors 1122a of the second connector module 1120b through the high-speed cable 1006. One high-speed connector 1122a has a x24 bandwidth, and the other high-speed connector 1122a has a x16 bandwidth.

[0321] Set on the lower 1U node board 1002, the five MCIO connectors 1202 in the second MCIO connector group 1202b are electrically connected to the two high-speed connectors 1122a of the second connector module 1120b through the high-speed cable 1006. One high-speed connector 1122a has a x24 bandwidth, and the other high-speed connector 1122a has a x16 bandwidth.

[0322] Two high-speed connectors 1122a electrically connected to the node board 1002 arranged in the upper 1U and two high-speed connectors 1122a electrically connected to the node board 1002 arranged in the lower 1U are arranged in an array along the second direction Y and the height direction Z of the chassis 1001 .

[0323] The first connector module 1120a is provided with two x32 bandwidth high-speed connectors 1122a and one x16 bandwidth high-speed connector 1122a, and each high-speed connector 1122a is electrically connected to a riser card 1003a. Every two x16 resources from different node boards 1002 converge on one x32 bandwidth high-speed connector 1122a, and each x32 bandwidth high-speed connector 1122a is respectively connected to two x16 resources from different node boards 1002. Every two x8 resources from different node boards 1002 converge on one x16 bandwidth high-speed connector 1122a, so that the x16 bandwidth high-speed connector 1122a can connect two x8 resources from different node boards 1002. Such a configuration can improve the uniformity of resource allocation.

[0324] For example, the riser card 1003a includes two slots 1003b, and each slot 1003b is a high-speed connector 1122a for resources in the form of a PCIE CEM (Card Electromechanical, PCIE card electromechanical specification) direct cable.

[0325] In the third and fourth configurations of the server 1000, three functional modules 1003 are arranged in the first zone A, and two node boards 1002 are stacked in the third zone C. By adjusting the type of the functional module 1003 (for example, the hard disk 1003e or the board 1003c), the server 1000 can achieve different configurations (for example, storage configuration or AI reasoning configuration), thereby improving the flexibility of use of the server 1000.

[0326] Moreover, by changing the electrical connection relationship between the two stacked node plates 1002 and the electrical connection relationship between the multiple high-speed connectors 1122a, the working mode of the server 1000 can be changed. The operation is simple, and there is no need to set up a central backplane or other structures, nor to open the cover of the chassis 1001, thereby improving the convenience of operation and maintenance.

[0327] In the embodiment of the present application, the server 1000 can be configured differently by adjusting the node board 1002 and the functional module 1003 arranged in the first zone A and / or the third zone C. For example, in the configuration of high computing performance, the server 1000 is suitable for scenes such as scientific simulation and big data analysis. In addition, the server 1000 has a large memory, a strong data processing capability, and a strong heat dissipation performance, and is suitable for a cloud computing data center, which helps to improve the overall operation efficiency of the cloud computing data center.

[0328] Moreover, the server 1000 has flexible memory capacity and hardware configuration, and can also meet application scenarios such as artificial intelligence and machine learning. In addition, the server 1000 also supports running a large number of concurrent tasks, has strong heat dissipation performance, and meets virtualization and containerization application scenarios. In addition, through more memory and optimized heat dissipation, the server 1000 can handle a large amount of network traffic, support multiple network functions, and meet network function virtualization (NFV) scenarios.

[0329] In summary, the embodiments of the present application have at least the following beneficial effects:

[0330] In the embodiment of the present application, the node board 1002 and / or the functional module 1003 are pluggable and connected to the management board 1100, so that the management board 1100, the node board 1002 and the functional module 1003 can be physically independent of each other, and they are electrically connected through connectors or cable connections to achieve communication between each other. In this way, the node board 1002 and / or the functional module 1003 can be decoupled from the management board 1100 separately.

[0331] The first zone A is close to the first side 1001a of the chassis 1001, and at least one node board 1002 and / or at least one functional module 1003 arranged in the first zone A are connected to the management board 1100 in a pluggable manner, so that at least one node board 1002 and / or at least one functional module 1003 can be pulled out or pushed in from the first side 1001a of the chassis 1001. The third zone C is close to the second side 1001b of the chassis 1001, and at least one node board 1002 and / or at least one functional module 1003 arranged in the third zone C are connected to the management board 1100 in a pluggable manner, so that at least one node board 1002 and / or at least one functional module 1003 can be pulled out or pushed in from the second side 1001b of the chassis 1001.

[0332] For example, by pulling out, at least one node plate 1002 and / or at least one functional module 1003 arranged in the first zone A can be decoupled from the management board 1100, and at this time, at least one node plate 1002 and / or at least one functional module 1003 arranged in the first zone A can be separated from the chassis 1001, thereby being exposed; by pushing in, at least one node plate 1002 and / or at least one functional module 1003 can be arranged in the first zone A and plugged into the management board 1100.

[0333] Similarly, by pulling out, at least one node plate 1002 and / or at least one functional module 1003 arranged in the third zone C can be decoupled from the management board 1100, and at this time, at least one node plate 1002 and / or at least one functional module 1003 arranged in the third zone C can be separated from the chassis 1001, thereby being exposed; by pushing in, at least one node plate 1002 and / or at least one functional module 1003 can be arranged in the third zone C and plugged into the management board 1100.

[0334] When it is necessary to inspect or replace at least one node board 1002 and / or at least one functional module 1003 arranged in the first zone A and the third zone C, there is no need to open the upper cover of the chassis 1001, but the inspection of at least one node board 1002 and / or at least one functional module 1003 can be achieved by pulling out and pushing in, thereby realizing the inspection of the server 1000 on both sides (front and rear sides) of the server 1000, thereby improving the convenience of operation and maintenance, thereby improving the operation and maintenance efficiency.

[0335] In addition, for rack-mounted servers, maintenance of at least one node board 1002 and / or at least one functional module 1003 can be completed by pulling out and pushing in, without removing the server 1000 from the cabinet, thereby improving operation and maintenance convenience and thus improving operation and maintenance efficiency.

[0336] The management module 1008 is arranged on the management board body 1110 of the management board 1100, and multiple node boards 1002 are respectively plugged into the management board 1100, and multiple functional modules 1003 are respectively plugged into the management board 1100, so that each node board 1002 can be maintained separately, and each functional module 1003 (such as IO card, GPU card or DPU card, etc.) can be maintained separately, thereby improving the convenience and flexibility of operation and maintenance.

[0337] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that a person skilled in the art can think of within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A server, characterized in that: include: A chassis, comprising a first area and a second area; along a first direction, the first area is closer to a first side of the chassis than the second area; A management board is arranged in the second area; the management board is provided with a management module for managing the operation of the server; and At least one node board and at least one functional module; the node board is provided with a business processing module for processing business, and the functional module is used to cooperate with the business processing module to realize data transmission or processing; At least one of the node boards and / or at least one of the functional modules is arranged in the first area and is pluggably connected to the management board.

2. The server according to claim 1, characterized in that: The chassis further includes a third area, and along the first direction, the second area is arranged between the first area and the third area, and the third area is closer to the second side of the chassis than the second area; At least one of the node plates is arranged in the first area and / or the third area; when the node plate is arranged in the first area, it can be pulled out or pushed in from the first side of the chassis through a pluggable connection with the management board; when the node plate is arranged in the third area, it can be pulled out or pushed in from the second side of the chassis through a pluggable connection with the management board; and / or, At least one of the functional modules is arranged in the first area and / or the third area; when the functional module is arranged in the first area, it can be pulled out or pushed in from the first side of the chassis through a pluggable connection with the management board; when the functional module is arranged in the third area, it can be pulled out or pushed in from the second side of the chassis through a pluggable connection with the management board.

3. The server according to claim 2, characterized in that: A length of the first region along the first direction is equal to a length of the third region along the first direction.

4. The server according to claim 2 or 3, characterized in that: A first opening is formed on the first side of the chassis, and the node plate and / or the functional module arranged in the first area are configured to be pulled out or pushed in from the first opening; A second opening is formed on the second side of the chassis, and the node plate and / or the functional module disposed in the third area are configured to be pulled out or pushed in from the second opening.

5. The server according to claim 4, characterized in that: The chassis further comprises a first protection plate, the first protection plate being close to the opening of the chassis relative to the node plate and connected to the node plate; The first protective plate is provided with a first handle bar, and the first handle bar is used for pulling out or pushing in the node plate.

6. The server according to any one of claims 2 to 5, characterized in that: The chassis further comprises a plurality of partitions, wherein the partitions extend along the first direction; The plurality of partitions include a first partition and a second partition; the first partition is disposed in the first region and divides the first region into a plurality of first sub-regions; the second partition is disposed in the third region and divides the third region into a plurality of third sub-regions; Wherein, the position of the partition along the second direction is adjustable; the second direction intersects with the first direction.

7. The server according to any one of claims 2 to 6, characterized in that: The management board comprises a management board body and a connector module, the management board body and the connector module are electrically connected, and the management module is arranged on the management board body; The connector module is arranged on the management board body; or, the connector module is arranged on one side of the management board body along the first direction and is adjacent to the management board body; The connector module comprises a fixing plate and a connector mounted on the surface of the fixing plate; the number of the connectors is multiple, and the node plate / or the functional module is configured to be plugged with at least one of the connectors; The number of the connector modules is two, and the two connector modules are spaced apart along the first direction; Of the two connector modules, the connector module close to the first side of the chassis is the first connector module, and the connector module close to the second side of the chassis is the second connector module; The connector opening of the first connector module faces the first side of the chassis, and the connector opening of the second connector module faces the second side of the chassis.

8. The server according to claim 7, characterized in that: The connector includes a high-speed connector, and at least one of the node board and the functional module is electrically connected to the high-speed connector for transmitting high-speed signals.

9. The server according to claim 8, characterized in that: The high-speed connector of the first connector module and the high-speed connector of the second connector module are electrically connected via a high-speed cable, and the high-speed cable is routed along the surface of the management board body.

10. The server according to any one of claims 7 to 9, characterized in that: The connector comprises a low-speed connector, the low-speed connector is electrically connected to the management board body, and at least one of the node board and the functional module is pluggably connected to the low-speed connector for transmitting low-speed signals.

11. The server according to any one of claims 7 to 10, characterized in that: It also includes a power supply module, the power supply module includes a power supply output interface; the node board includes a first power supply input interface, and the functional module includes a second power supply input interface; The connector includes a first power connector, a second power connector and a third power connector; the third power connector is electrically connected to the power output interface, the first power connector is electrically connected to one of the first power input interface and the second power input interface, and the second power connector is electrically connected to the other of the first power input interface and the second power input interface.

12. The server according to claim 11, characterized in that The node plate comprises a first node plate and a second node plate; one of the first node plate and the second node plate is arranged in the first region, and the other is arranged in the third region; One of the power module and the functional module is arranged in the first area and is spaced apart from the node plate arranged in the first area along the second direction; the other of the power module and the functional module is arranged in the third area and is spaced apart from the node plate arranged in the third area along the second direction; wherein the second direction intersects with the first direction.

13. The server according to claim 12, characterized in that: There are a plurality of first node plates, and the plurality of first node plates are stacked; there are a plurality of second node plates, and the plurality of second node plates are stacked.

14. The server according to claim 11, characterized in that: The number of the node plates is multiple, the multiple node plates are stacked and arranged in the first area or the third area; the power supply module and the node plate are arranged in the same area, and the power supply module and the node plate are arranged at intervals along the second direction; the second direction intersects with the first direction; There are multiple functional modules, the multiple functional modules and the node plate are arranged in different areas, and the multiple functional modules are arranged along the second direction.

15. The server according to any one of claims 1 to 14, characterized in that: The management module includes a baseboard management controller.

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