Transmission device and transmission method

Abstract

The invention relates to transmission equipment and a transmission method, the transmission equipment is used for transmitting a carrier plate disc, a carrier plate ring and a substrate, and the transmission equipment comprises a stock bin used for placing the carrier plate disc and the carrier plate ring; the material box is used for placing a substrate; the combining and splitting device is used for combining and splitting the carrier plate disc, the carrier plate ring and the substrate; the substrate calibrator is used for adjusting the position posture of the substrate; the carrying manipulator is used for conveying the carrier plate and the carrier ring between the stock bin and the combination and splitting device, conveying the substrate between the material box and the substrate calibrator and conveying the substrate between the substrate calibrator and the combination and splitting device; and the stock bin, the material box, the combined splitting device and the substrate calibrator are arranged around the carrying manipulator. According to the conveying equipment, high-precision and accurate automatic combination, splitting and conveying of the carrier plate disc, the carrier plate ring and the substrate can be achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor preparation, and in particular to a transmission device and a transmission method. Background Art

[0002] The epitaxial growth of silicon carbide is to generate epitaxial materials with a certain thickness and concentration on a crystal substrate under a process environment. This process generally uses a graphite disk as a carrier and heat conduction platform. The substrate is usually carried by a carrier ring and a carrier plate, and then placed in an epitaxial reaction chamber for epitaxial growth. During this process, if there is an assembly error between the carrier ring, the carrier plate and the substrate, it will affect the quality of epitaxial growth and cause product defects.

[0003] The existing methods for transporting carrier rings, carrier plates and substrates in the assembly and disassembly process are mainly manual assembly and transportation and automated assembly and disassembly transportation. Manual assembly will cause contamination of the substrate and is also prone to touch damage during transportation; the existing automated assembly and disassembly has the problems of low assembly accuracy and low efficiency. Summary of the invention

[0004] The present application proposes a transmission device and a transmission method to solve the problem of low automation and low efficiency in the assembly and transmission of a carrier ring, a carrier plate and a substrate in the prior art.

[0005] In order to solve the above technical problems, the present application proposes a transmission device for transmitting a carrier plate, a carrier ring and a substrate, comprising: a material bin for placing the carrier plate and the carrier ring; a material box for placing the substrate; a combination and splitting device for combining and splitting the carrier plate, the carrier ring and the substrate; a substrate calibrator for adjusting the position and posture of the substrate; a transport robot for transmitting the carrier plate and the carrier ring between the material bin and the combination and splitting device, for transmitting the substrate between the material box and the substrate calibrator, and for transmitting the substrate between the substrate calibrator and the combination and splitting device; the material bin, the material box, the combination and splitting device, and the substrate calibrator are arranged around the transport robot.

[0006] In one embodiment, the combined splitting device includes a ring carrier and a lifting platform. The ring carrier is formed with a through hole, and the lifting platform can be movably arranged in the through hole in the vertical direction; the size of the through hole is larger than the size of the carrier plate, smaller than the outer ring size of the carrier ring, and smaller than the size of the substrate; the size of the substrate is larger than the inner ring size of the carrier ring.

[0007] In one embodiment, the combined splitting device also includes a position identifier, which is arranged in the vertical direction relative to the ring-carrying platform and the lifting platform, and is used to identify the center position of the ring-carrying platform and the lifting platform, and is also used to identify the center position of the plate carrier, plate carrier ring or substrate on the ring-carrying platform and the lifting platform.

[0008] In one embodiment, the assembly and separation device further comprises a height measuring sensor, which is arranged in a vertical direction relative to the ring carrier platform and the lifting platform, and is used to identify the upper surface height of the carrier ring and the upper surface height of the substrate.

[0009] In one embodiment, the combination and splitting device also includes a reaction chamber for reacting the combined carrier plate, carrier ring and substrate; the transport robot is used to transfer the combined carrier plate, carrier ring and substrate between the combination and splitting device and the reaction chamber.

[0010] In order to solve the above technical problems, the present application proposes a transmission method for transmitting a carrier plate, a carrier ring and a substrate through a transmission device, the transmission device comprising: a material bin for placing the carrier plate and the carrier ring; a material box for placing the substrate; a combination and splitting device for combining and splitting the carrier plate, the carrier ring and the substrate; a substrate calibrator for adjusting the position and posture of the substrate; a handling robot for transmitting the carrier plate and the carrier ring between the material bin and the combination and splitting device, for transmitting the substrate between the material box and the substrate calibrator, and for transmitting the substrate between the substrate calibrator and the combination and splitting device; the material bin, the material box , a combination and splitting device, and a substrate calibrator are arranged around a transport robot; the transmission method includes: the transport robot takes out a combination of a carrier plate and a carrier ring from a silo and places it on the combination and splitting device; the combination and splitting device separates the carrier plate and the carrier ring, and the transport robot transfers the carrier plate to the silo; the transport robot takes out a substrate from a material box and places it on the substrate calibrator; the substrate calibrator adjusts the position and posture of the substrate, and the transport robot transfers the substrate to the combination and splitting device; the transport robot takes out a carrier plate from the silo and places it on the combination and splitting device; the combination and splitting device combines the carrier plate, the carrier ring and the substrate from bottom to top.

[0011] In one embodiment, the combined splitting device includes a ring-carrying platform and a lifting platform, the ring-carrying platform is formed with a through hole, and the lifting platform can be movably arranged in the through hole in the vertical direction; the size of the through hole is larger than the size of the plate-carrying plate, smaller than the outer ring size of the plate-carrying ring, and smaller than the size of the substrate; the size of the substrate is larger than the inner ring size of the plate-carrying ring; the transmission method includes: a handling robot takes out a combination of the plate-carrying plate and the plate-carrying ring from a material bin and places it before the combined splitting device, and controls the lifting platform to pass through the through hole and rise on the ring-carrying platform, so that the combination of the plate-carrying plate and the plate-carrying ring is placed on the lifting platform; The control lifting platform passes through the through hole and descends to the ring-carrying platform, the board-carrying ring remains on the ring-carrying platform, and the board-carrying plate follows the lifting platform to descend, so as to separate the board-carrying plate and the board-carrying ring; after the handling robot transfers the board-carrying plate to the silo, the control lifting platform passes through the through hole and rises on the ring-carrying platform; after the handling robot transfers the substrate to the lifting platform of the combination and splitting device, the control lifting platform passes through the through hole and descends to the ring-carrying platform, and the substrate remains on the board-carrying ring; the handling robot places the board-carrying plate on the lifting platform, and the control lifting platform passes through the through hole and rises on the ring-carrying platform to combine the board-carrying plate, the board-carrying ring and the substrate.

[0012] In one embodiment, the combination and disassembly device also includes a position identifier, which is arranged in a vertical direction relative to the carrier ring platform and the lifting platform. The combination and disassembly method also includes: before placing the combination of the carrier plate and the carrier ring on the lifting platform, identifying the through-hole center coordinates of the through hole by the position identifier; after placing the combination of the carrier plate and the carrier ring on the lifting platform, identifying the combination center coordinates of the combination of the carrier plate and the carrier ring by the position identifier; adjusting the position of the combination of the carrier plate and the carrier ring to control the deviation between the through-hole center coordinates and the combination center coordinates within an allowable range.

[0013] In one embodiment, the combination and separation device also includes a height measuring sensor, which is arranged in the vertical direction relative to the carrier ring table and the lifting platform. The transmission method also includes: after controlling the lifting platform to pass through the through hole and descend to the carrier ring table, and the substrate remains on the carrier ring, identifying the center coordinates of the carrier ring and the center coordinates of the substrate through a position identifier; identifying the upper surface height of the carrier ring and the upper surface height of the substrate through a height measuring sensor; if the deviation between the center coordinates of the carrier ring and the center coordinates of the substrate is within an allowable range, and the height difference between the upper surfaces of the carrier ring and the substrate is within an allowable range; then placing the carrier plate on the lifting platform, controlling the lifting platform to pass through the through hole and rise to the carrier ring table to combine the carrier plate, the carrier ring and the substrate; if the deviation between the center coordinates of the carrier ring and the center coordinates of the substrate is not within the allowable range, or the height difference between the upper surfaces of the carrier ring and the substrate is not within the allowable range; then putting the substrate back into the substrate calibrator through the handling robot to re-calibrate the position and posture.

[0014] In one embodiment, the assembly and separation device further includes a reaction chamber for reacting the assembled carrier plate, carrier ring and substrate; the transmission method further includes: a transport robot places the assembly of the carrier plate, carrier ring and substrate into the reaction chamber.

[0015] The transmission equipment of the present application includes a material bin for placing a carrier plate and a carrier ring, a material box for placing a substrate, a combination and splitting device for combining and splitting the carrier plate, the carrier ring and the substrate, a reference calibrator for adjusting the position and posture of the substrate, and a transport robot for transmitting the carrier plate and the carrier ring between the material bin and the combination and splitting device, for transmitting the substrate between the material box and the substrate calibrator, and for transmitting the substrate between the substrate calibrator and the combination and splitting device; the transport robot is used to perform all transport actions, so the transport robot is set in the middle, and other components, the material bin, the material box, the combination and splitting device and the substrate calibrator are all set around the transport robot to improve the transport efficiency, and the accuracy of the combination is achieved through the substrate calibrator and the combination and splitting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present disclosure will become readily understood. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0017] Figure 1 It is a structural schematic diagram of an embodiment of a transmission device of the present application;

[0018] Figure 2 It is a structural schematic diagram of a combination and splitting device in an embodiment of a transmission device of the present application;

[0019] Figure 3 It is a schematic diagram of the combined structure of the carrier plate, the carrier ring and the base plate in the present application;

[0020] Figure 4 This is a schematic diagram of the structure of the first working state of an embodiment of the assembly and separation device of the present application;

[0021] Figure 5 This is a schematic diagram of the structure of the second working state of an embodiment of the combined splitting device of the present application;

[0022] Figure 6 This is a schematic diagram of the third working state structure of an embodiment of the combined splitting device of the present application. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0024] The specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0025] The transmission device of the present application is used for transporting the carrier plate 23, the carrier ring 22 and the substrate 21 in combination and disassembly, such as Figure 3The three are detachable independent structures. After the three are assembled, the carrier plate 23 is embedded in the lower side of the carrier ring 22, and the substrate 21 is embedded in the upper side of the carrier ring 22. In the epitaxial reaction process, the substrate 21 is the workpiece to be reacted, which is a crystalline silicon material; the carrier plate 23 and the carrier ring 22 are used to carry the substrate 21. The carrier plate 23 is made of graphite material and can be used as a heat conductor. The carrier ring 22 is made of quartz material to improve the bearing stability. In this embodiment, all three are circular, and a step is formed in the carrier ring 22 for embedding the substrate 21 and the carrier plate 23. Among them, the size of the substrate 21 is larger than the inner ring size of the carrier ring 22, and the outer ring diameter of the substrate 21 is larger than the inner ring diameter of the carrier ring 22.

[0026] like Figure 1 The conveying device 100 includes a material bin 44 for placing a carrier plate 23 and a carrier ring 22, a material box 42 for placing a substrate 21, a combination and splitting device 49 for combining and splitting the carrier plate 23, the carrier ring 22 and the substrate 21, a reference calibrator 41 for adjusting the position and posture of the substrate 21, and a transport robot 30 for transporting the carrier plate 23 and the carrier ring 22 between the material bin 44 and the combination and splitting device 47, for transporting the substrate 21 between the material box 42 and the substrate calibrator 41, and for transporting the substrate 21 between the substrate calibrator 41 and the combination and splitting device 49; the transport robot 30 is used to perform all transport actions, so the transport robot 30 is set in the middle, and other components, the material bin 44, the material box 42, the combination and splitting device 49 and the substrate calibrator 41 are all set around the transport robot 30 to improve the transportation efficiency, and the accuracy of the combination is achieved through the substrate calibrator 41 and the combination and splitting device 47.

[0027] Specifically, the handling robot 30 can be a 4-axis single-arm single-finger horizontal multi-joint SCARA (Selective Compliance Assembly Robot Arm) type robot, equipped with a linear joint for lifting in the Z direction, 3 rotating joints with rotation axes perpendicular to the horizontal plane, and 4 degrees of freedom of movement in four directions. It can also be a 5-axis single-arm double-finger horizontal multi-joint SCARA (Selective Compliance Assembly Robot Arm) type robot, equipped with a linear joint for lifting in the Z direction, 4 rotating joints with rotation axes perpendicular to the horizontal plane, and the robot has 2 end grippers that can rotate freely, both with 4 degrees of freedom of movement in four directions.

[0028] The substrate calibrator 41 is used to adjust the position and posture of the substrate 21 so that the substrate 21 can be accurately assembled on the carrier ring 22. The function of the substrate calibrator 41 is to calibrate the center position and angle of the substrate 21. It has an identification module that can accurately calculate and identify the center position (x, y) and angle θ of the substrate 21; it has a substrate fixing part and a rotating mechanism that can fix the substrate 21 and rotate with the substrate 21, and can cooperate with the identification module to calculate and identify the center position (x, y) and angle θ of the substrate, and can also adjust the angle θ of the substrate to a specified angle; it has a substrate center position positioning module that can drive the substrate to move and adjust the center position (x, y) of the substrate to a specified position. The substrate center position positioning module can be replaced by a handling robot, and the handling robot 30 adjusts the center position (x, y) of the substrate 21 to a specified value according to the recognition result of the center position (x, y) of the substrate 21.

[0029] Combination and separation device 49 as Figure 2 , including a ring-carrying platform 133 and a lifting platform 140. The ring-carrying platform 133 is formed with a through hole, and the lifting platform 140 can be movably arranged in the through hole in the vertical direction; the size of the through hole is larger than the size of the carrier plate 23, smaller than the outer ring size of the carrier ring 22, and smaller than the size of the substrate 21. Corresponding to the circular carrier plate 23, carrier ring 22 and substrate 21, the through hole is also designed to be circular, and the diameter of the through hole is larger than the outer ring diameter of the carrier plate 23, smaller than the outer ring diameter of the carrier ring 22, and smaller than the outer ring diameter of the substrate 21.

[0030] The present embodiment can utilize the relative movable relationship between the ring carrier platform 133 and the lifting platform 140. After the carrier ring 22 is placed on the ring carrier platform 133, the lifting platform 140 can be lifted and lowered to the upper and lower sides of the ring carrier platform 133 respectively to realize the assembly of the substrate 21 and the carrier plate 23 on the upper and lower sides of the carrier ring 22. In addition, under this assembly structure, the carrier plate 23, the carrier ring 22 and the substrate 21 can be adjusted separately based on the ring carrier platform 133 and the lifting platform 140 to improve the precision and accuracy of the combination.

[0031] Specifically, the assembly and separation device 49 also includes a position identifier 48, which is arranged relative to the ring-carrying platform 133 and the lifting platform 140 in the vertical direction, and is used to identify the center position of the ring-carrying platform 133 and the lifting platform 140, and is also used to identify the center position of the plate-carrying plate 23, the plate-carrying plate ring 22 and the substrate 21 on the ring-carrying platform 133 and the lifting platform 140. The center position is determined by the position identifier 48, and then the position and posture of the plate-carrying plate 23, the plate-carrying plate ring 22 and the substrate 21 can be controlled and adjusted. In this embodiment, the position identifier 48 is an industrial camera, and the position coordinates are obtained by shooting.

[0032] The combined splitting device 49 also includes a height measuring sensor 131, which is also arranged in the vertical direction relative to the carrier ring platform 133 and the lifting platform 140, and is used to identify the upper surface height of the carrier ring 22 and the upper surface height of the substrate 21. When the substrate 21 is embedded and installed on the upper side of the carrier ring 22, it can be judged whether the substrate 21 and the carrier ring 22 are accurately installed. Installation positioning parts, such as installation notches or installation protrusions, can be set on the substrate 21 and the carrier ring 22. Since it is automatically installed, it is easy for the positioning part to be inaccurately positioned. At this time, the accurate positioning can be judged by detecting the upper surface heights of the two. If the height difference between the two upper surface heights is large, it means that it is not accurately positioned. If the height difference is small and within the preset range, it means that it is accurately positioned.

[0033] The assembly and separation device 49 is mainly used to realize the assembly and separation of the carrier plate 23, the carrier ring 22 and the base plate 21. In addition to the above structure, the assembly and separation device 49 also includes a ring light source 132, which can be used for lighting when the industrial camera is shooting and positioning, so as to improve the accuracy of shooting and positioning; a linear module 134, a linear module fixing plate 135, and a linear module driving motor 137, which are used to drive the lifting platform 140 to move in the vertical direction; and also includes a split assembly mechanism bottom plate 136 and an exhaust fan 10 arranged on the bottom plate, which are used for exhausting and dissipating heat to ensure the stability of the environment.

[0034] The transmission device 100 also includes a reaction chamber 46 for reacting the combined carrier plate 23 , carrier ring 22 and substrate 21 , and also includes a dust adsorption device 45 and a monitoring camera 47 , which are also arranged around the transport robot 30 .

[0035] Based on the above structure, the transmission method of this embodiment includes the following steps.

[0036] T1: The handling robot takes out the combination of the carrier plate and the carrier ring from the silo and places it in the combination and separation device.

[0037] According to the points taught in advance, the transport robot 30 takes out the combination of the carrier ring 22 and the carrier plate 23 that have been manually assembled and placed in the silo 44 from the silo 44 , and places it on the assembly and separation device 49 .

[0038] T2: The combined splitting device separates the carrier plate and the carrier ring, and the handling robot transfers the carrier plate to the silo.

[0039] The combined splitting device 49 separates the carrier ring 22 and the carrier plate 23 , and the transport robot 30 takes away the carrier plate 22 and puts it into the silo 44 according to the points taught in advance.

[0040] T3: The transport robot takes out the substrate from the material box and places it on the substrate calibrator.

[0041] According to the previously taught points, the transport robot 30 takes the substrate 21 that has been manually placed in advance into the substrate material box 42 and places it into the substrate aligner 41 .

[0042] T4: The substrate calibrator adjusts the position and posture of the substrate, and the handling robot transfers the substrate to the assembly and splitting device.

[0043] The substrate calibrator 41 adjusts the center position and angle of the substrate 21 to a preset value. According to the previously taught point, the transport robot 30 takes the substrate 21 from the substrate calibrator 41 and places it on the assembly and separation device 49.

[0044] T5: The handling robot takes out the carrier plate from the silo and places it in the combined splitting device.

[0045] According to the points taught in advance, the transport robot 30 takes the plate carrier 23 from the silo 44 and puts it into the assembly and separation device 49.

[0046] T6: The assembly and separation device assembles the carrier plate, the carrier ring and the base plate from bottom to top.

[0047] The assembly and separation device 49 assembles the substrate 21, the carrier ring 22 assembly and the carrier plate 23 from top to bottom to form an assembly of the three.

[0048] After the assembly is completed, the transport robot 30 can also take the assembly of the substrate 21 , the carrier ring 22 and the carrier plate 23 from the assembly and separation mechanism 49 according to the previously taught points and put it into the reaction chamber 46 .

[0049] Based on the structure of the above-mentioned transmission device, in the above-mentioned transmission method, a high-precision combination of the carrier plate 23, the carrier ring 22 and the substrate 21 can be achieved, and the combination and separation method includes the following steps.

[0050] S1: Calibrate the relative position and attitude angle relationship between the transport robot 30 and the substrate aligner 41 , and calibrate the relative position and attitude angle relationship between the transport robot 30 and the position identifier 48 .

[0051] S2: Calibrate the relative position and attitude angle relationship between the substrate calibrator 41 and the position identifier 48.

[0052] In steps S1 and S2, the positions of the various components are confirmed, and accurate transportation can then be achieved.

[0053] S3: Identify the through hole center coordinates of the through hole through a position identifier.

[0054] In this step, the ring carrier 133 is photographed by an industrial camera to identify the center coordinates (x1, y1) of the through hole.

[0055] S4: Control the lifting platform to pass through the through hole and rise to the ring-carrying platform.

[0056] Generally, the lifting platform 140 is raised to a height higher than the top surface of the ring-carrying platform 133 by a certain distance, such as Figure 4 .

[0057] S5: placing the assembly of the carrier plate and the carrier ring on the lifting platform.

[0058] Specifically, according to the pre-calibrated and taught points, the transport robot 30 takes out the combination of the carrier ring 22 and the carrier plate 23 that was pre-assembled manually and placed in the silo 44 from the silo 44 and places it on the lifting platform 140 of the assembly and separation device 49.

[0059] S6: Identify the combined center coordinates of the combination of the carrier plate and the carrier ring through a position identifier.

[0060] Specifically, the industrial camera 48 takes a picture of the combination of the carrier ring 22 and the carrier plate 23 on the lifting platform 140, identifies the coordinates (x2, y2) of the camera coordinate system of the center of the center hole of the carrier ring 22, and the posture angle θ2 of the carrier ring 22.

[0061] S7: Adjust the position of the assembly of the carrier plate and the carrier ring to control the deviation between the through hole center coordinate and the assembly center coordinate to be within an allowable range.

[0062] Calculate the deviation between the coordinates (x1, y1) and the coordinates (x2, y2), dx1=x1-x2, dy1=y1-y2, according to the previously taught points and the deviation calculation results (dx1, dy1, the handling robot 30 picks up the carrier ring 22 and carrier plate 23 assembly from the lifting platform 140, and after adjusting the placement point of the assembly according to the deviation calculation results (dx1, dy1), the handling robot 30 puts the carrier ring 22 and carrier plate 23 assembly back to the lifting platform 140, so that the deviation (dx1, dy1) of the coordinates of the center point of the center hole of the carrier ring 22 (x2, y2) and the coordinates of the center point of the center circular hole of the ring carrier platform 133 (x1, y1) is within the allowable error range.

[0063] S8: Control the lifting platform to pass through the through hole and descend to the ring-carrying platform, the plate-carrying ring remains on the ring-carrying platform, and the plate-carrying plate descends with the lifting platform.

[0064] The lifting platform 140 is lowered until the height of the lifting platform is lower than the top surface of the ring-carrying platform 133 by a certain distance. Figure 5 Since the outer diameter of the plate carrier ring 22 is larger than the diameter of the central hole of the ring carrier platform 133 and the outer diameter of the plate carrier plate 22 is smaller than the diameter of the central hole of the ring carrier platform 133 , the plate carrier plate 22 descends with the lifting platform 140 and the plate carrier ring 22 remains on the ring carrier platform 133 .

[0065] S9: Move the plate carrier out, and control the lifting platform to pass through the through hole and rise to the ring carrier.

[0066] According to the previously taught points, the handling robot 30 takes the plate carrier 22 from the lifting platform 140 and puts it into the silo 44. The lifting platform 140 rises until the height of the lifting platform is higher than the top surface of the ring carrier 133 by a certain distance. Figure 6 .

[0067] S10: Place the substrate into the substrate calibrator to calibrate its position and posture.

[0068] According to the points taught in advance, the handling robot 30 takes the substrate 21 that was manually placed in the material box from the substrate material box 42 and puts it into the substrate calibrator 41. According to the pre-set center position and attitude angle θ3 of the substrate 42, the substrate calibrator 41 identifies and adjusts the center position and attitude angle θ3 of the substrate 42 to the set values ​​to ensure that when the substrate 21 and the carrier ring 22 form a combination in the subsequent steps, the deviation between the center coordinates (x3, y3) of the substrate 21 and the center coordinates (x2, y2) of the center hole of the carrier ring 22 is within the allowable range, and the deviation between the attitude angle θ3 of the substrate 21 and the attitude angle θ2 of the carrier ring 22 is within the allowable range.

[0069] S11: placing the substrate on the lifting platform, controlling the lifting platform to pass through the through hole and descend to the ring carrier, and the substrate remains on the plate carrier ring.

[0070] According to the previously taught points, the transport robot 30 takes the substrate 21 from the substrate calibrator 41 and places it on the lifting platform 140. The lifting platform 140 descends until the height of the lifting platform 140 is a certain distance below the top surface of the carrier ring platform 133. Since the outer diameter of the substrate 21 is larger than the diameter of the central hole of the carrier ring 22, the substrate 21 falls on the carrier ring 22, thereby completing the combination of the substrate 21 and the carrier ring 22.

[0071] S12: Identify the center coordinates of the carrier ring and the center coordinates of the substrate through a position identifier, and identify the upper surface height of the carrier ring and the upper surface height of the substrate through a height measuring sensor.

[0072] If the deviation between the center coordinates of the carrier ring and the center coordinates of the substrate is within the allowable range, and the height difference between the upper surfaces of the carrier ring and the substrate is within the allowable range; then the carrier plate is placed on the lifting platform, and the lifting platform is controlled to rise through the through hole to the carrier ring platform to combine the carrier plate, the carrier ring and the substrate.

[0073] If the deviation between the center coordinates of the carrier ring and the center coordinates of the substrate is not within the allowable range, or the height difference between the carrier ring and the upper surface of the substrate is not within the allowable range, the substrate is placed back into the substrate calibrator by the handling robot to re-calibrate the position and posture.

[0074] If multiple calibrations are unsuccessful, the clearing action is performed. According to the previously taught points, the transport robot 30 takes the plate carrier 22 from the lifting platform 140 and puts it into the silo 44, and an alarm is sounded.

[0075] Specifically, the industrial camera 48 takes a picture of the combination of the substrate 21 and the carrier ring 22 on the carrier ring table 133, identifies the center coordinates (x3, y3) and the attitude angle θ3 of the substrate 21, identifies the center coordinates (x2, y2) and the attitude angle θ2 of the center hole of the carrier ring 22, and determines whether the deviation between the center coordinates (x3, y3) of the substrate 21 and the center coordinates (x2, y2) of the center hole of the carrier ring 22 is within the allowable range, and whether the deviation between the attitude angle θ3 of the substrate 21 and the attitude angle θ2 of the carrier ring 22 is within the allowable range. At the same time, a laser altimeter is used to detect whether the deviation between the upper surface plane height h3 of the substrate 21 and the upper surface plane height h2 of the carrier ring 22 is within the allowable range.

[0076] S13: placing the carrier plate on the lifting platform, and controlling the lifting platform to rise to the carrier ring platform through the through hole to combine the carrier plate, the carrier ring and the substrate.

[0077] According to the previously taught points, the handling robot 30 takes the plate carrier 23 from the silo 44 and places it on the lifting platform 140. The lifting platform 140 of the assembly and separation device 49 is raised until the height of the lifting platform is higher than the top surface of the ring carrier 133 by a certain distance. Since the outer diameter of the plate carrier 22 is smaller than the diameter of the central hole of the ring carrier 133, the plate carrier 22 lifts up the combination of the substrate 21 and the plate carrier ring 22 as the lifting platform 140 is raised, thereby completing the combination of the substrate 21, the plate carrier ring 22 and the plate carrier 23.

[0078] The combined carrier plate 23, carrier ring 22 and substrate 21 are transported by the transport robot 30 to the reaction chamber 46 for reaction. After the reaction is completed, they are transported to the assembly and disassembly device 49 for disassembly. The specific disassembly steps are as follows.

[0079] S14: The lifting platform 140 of the combined splitting device 49 rises until the height of the lifting platform is a certain distance higher than the top surface of the carrier ring platform 133. According to the previously taught points, the transport robot 30 takes the combination of the substrate 21, the carrier ring 22 and the carrier plate 23 from the reaction chamber 46 and places it on the lifting platform 140.

[0080] S15: The lifting platform 140 of the combined splitting device 49 descends until the height of the lifting platform is a certain distance lower than the top surface of the ring-carrying platform 133. Since the outer diameter of the carrier ring 22 is larger than the diameter of the central circular hole of the ring-carrying platform 133, and the outer diameter of the carrier plate 22 is smaller than the diameter of the central circular hole of the ring-carrying platform 133, the carrier plate 22 descends with the lifting platform 140, and the combination of the substrate 21 and the carrier ring 22 remains on the ring-carrying platform 133, thereby completing the splitting of the combination of the carrier plate 22 and the substrate 21 and the carrier ring 22.

[0081] S16 : According to the previously taught points, the transport robot 30 takes the plate carrier 22 from the lifting platform 140 and puts it into the silo 44 .

[0082] S17: The lifting platform 140 of the combined splitting device 49 is raised until the height of the lifting platform is higher than the top surface of the carrier ring platform 133 by a certain distance. The substrate 21 is lifted up with the lifting platform 140 and is pushed away from the carrier ring 22, thereby completing the splitting of the substrate 21 and the carrier ring 22.

[0083] S18: The industrial camera 48 detects whether the substrate 21 on the lifting platform 140 is successfully separated from the substrate carrier ring 22. If yes, step S19 is executed, otherwise, an alarm is issued to prompt manual intervention.

[0084] S19 : According to the previously taught points, the transport robot 30 takes the substrate 21 from the lifting platform 140 and puts it into the substrate material box 42 .

[0085] The present application includes multiple embodiments of simple structures and relatively complex structures. The above-mentioned transmission method is based on the steps of the relatively complex structure. For the combination and splitting device of the simple structure, the process of the splitting method is similar and can be directly determined based on the above-mentioned splitting method. It also belongs to the protection scope of the present application and will not be repeated here.

[0086] The present application uses vision to accurately locate the center position and angular direction of the carrier plate, carrier ring, and substrate. Through vision and the robot's hand-eye calibration, the robot can perform position correction based on the visually identified positions of the carrier plate, carrier ring, and substrate, and complete the alignment of the carrier plate, carrier ring, and substrate with high precision, thereby ensuring that the assembly accuracy of the combination is improved.

[0087] In the above description of this specification, unless otherwise clearly specified and limited, the terms "fixed", "installed", "connected" or "connected" should be understood in a broad sense. For example, with regard to the term "connection", it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. Therefore, unless otherwise clearly defined in this specification, those skilled in the art can understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0088] According to the above description of this specification, those skilled in the art may also understand that the terms used below, such as "up", "down", "front", "back", "left", "right", "length", "width", "thickness", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential", "center", "longitudinal", "lateral", "clockwise" or "counterclockwise", etc., which indicate the orientation or position relationship, are based on the orientation or position relationship shown in the drawings of this specification, and are only for the purpose of facilitating the explanation of the scheme of the present invention and simplifying the description, rather than explicitly or implicitly indicating that the device or element involved must have the specific orientation, be constructed and operate in a specific orientation. Therefore, the above-mentioned orientation or position relationship terms cannot be understood or interpreted as limitations on the scheme of the present invention.

[0089] In addition, the terms "first" or "second" used in this specification to refer to numbers or ordinals are only used for descriptive purposes and cannot be understood as explicitly or implicitly indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this specification, the meaning of "plurality" is at least two, such as two, three or more, etc., unless otherwise clearly and specifically defined.

[0090] Although this specification has shown and described a plurality of embodiments of the present invention, it is apparent to those skilled in the art that such embodiments are provided by way of example only. Those skilled in the art will think of many changes, modifications and alternatives without departing from the thought and spirit of the present invention. It should be understood that in the process of practicing the present invention, various alternatives to the embodiments of the present invention described herein may be adopted. The attached claims are intended to define the scope of protection of the present invention, and therefore cover the modular composition, equivalent or alternatives within the scope of these claims.

Claims

1. A transmission device, characterized in that: The transmission device is used to transmit a carrier plate, a carrier ring and a substrate, and includes: A silo for placing the plate carrier tray and the plate carrier ring; A material box, used for placing a substrate; A combination and disassembly device, used for combining and disassembling the carrier plate, the carrier ring and the base plate; A substrate calibrator, used for adjusting the position and posture of the substrate; A handling robot, used for transferring the plate carrier plate and the plate carrier ring between the material bin and the combination and splitting device, for transferring the substrate between the material box and the substrate calibrator, and for transferring the substrate between the substrate calibrator and the combination and splitting device; The material bin, material box, combination and separation device, and substrate calibrator are arranged around the transport robot.

2. The transmission device according to claim 1, characterized in that: The combined splitting device includes a ring carrier and a lifting platform. The ring carrier is formed with a through hole, and the lifting platform can be movably arranged in the through hole in the vertical direction; the size of the through hole is larger than the size of the carrier plate, smaller than the outer ring size of the carrier ring, and smaller than the size of the substrate; the size of the substrate is larger than the inner ring size of the carrier ring.

3. The transmission device according to claim 2, characterized in that: The combined splitting device also includes a position identifier, which is arranged relative to the ring-carrying platform and the lifting platform in the vertical direction, and is used to identify the center position of the ring-carrying platform and the lifting platform, and is also used to identify the center position of the plate carrier, plate carrier ring or substrate on the ring-carrying platform and the lifting platform.

4. The transmission device according to claim 2, characterized in that: The combined disassembly device further comprises a height measuring sensor, which is arranged relative to the ring-carrying platform and the lifting platform in the vertical direction and is used to identify the upper surface height of the plate-carrying ring and the upper surface height of the substrate.

5. The transmission device according to claim 1, characterized in that: The assembly and separation device also includes a reaction chamber for reacting the assembled carrier plate, carrier ring and substrate; the transport robot is used to transfer the assembled carrier plate, carrier ring and substrate between the assembly and separation device and the reaction chamber.

6. A transmission method, characterized in that: The transmission method is used to transmit the carrier plate, the carrier ring and the substrate through the transmission equipment, and the transmission equipment includes: a material bin for placing the carrier plate and the carrier ring; a material box for placing the substrate; a combination and splitting device for the combination and splitting of the carrier plate, the carrier ring and the substrate; a substrate calibrator for adjusting the position and posture of the substrate; a handling robot for transmitting the carrier plate and the carrier ring between the material bin and the combination and splitting device, for transmitting the substrate between the material box and the substrate calibrator, and for transmitting the substrate between the substrate calibrator and the combination and splitting device; the material bin, the material box, the combination and splitting device, and the substrate calibrator are arranged around the handling robot; the transmission method includes: The transport robot takes out the combination of the carrier plate and the carrier ring from the silo and places it on the combination and separation device; The combined splitting device separates the plate carrier plate and the plate carrier ring, and the transport robot transfers the plate carrier plate to the silo; The transport robot takes out the substrate from the material box and places it on the substrate calibrator; The substrate calibrator adjusts the position and posture of the substrate, and the transport robot transfers the substrate to the assembly and separation device; The transport robot takes out the plate carrier from the silo and places it on the assembly and separation device; The assembly and separation device assembles the carrier plate, the carrier ring and the base plate together from bottom to top.

7. The transmission method according to claim 6, characterized in that: The combined splitting device comprises a ring-carrying platform and a lifting platform, wherein the ring-carrying platform is formed with a through hole, and the lifting platform can be movably arranged in the through hole in the vertical direction; the size of the through hole is larger than the size of the carrier plate, smaller than the size of the outer ring of the carrier ring, and smaller than the size of the substrate; The size of the substrate is larger than the inner ring size of the carrier ring; the transmission method comprises: The handling robot takes out the combination of the plate carrier plate and the plate carrier ring from the silo and places it before the assembly and separation device, and controls the lifting platform to pass through the through hole and rise to the ring carrier platform, so that the combination of the plate carrier plate and the plate carrier ring is placed on the lifting platform; Control the lifting platform to pass through the through hole and descend to the ring-carrying platform, the plate-carrying ring remains on the ring-carrying platform, and the plate-carrying plate follows the lifting platform to descend, so as to separate the plate-carrying plate and the plate-carrying ring; After the transport robot transfers the plate carrier to the material bin, the lifting platform is controlled to pass through the through hole and rise to the ring carrier platform; After the transport robot transfers the substrate to the lifting platform of the assembly and separation device, the lifting platform is controlled to pass through the through hole and descend to the ring-carrying platform, and the substrate remains on the plate-carrying ring; The transport robot places the plate carrier on the lifting platform, and controls the lifting platform to pass through the through hole and rise on the ring carrier platform to combine the plate carrier, the plate carrier ring and the substrate.

8. The transmission method according to claim 7, characterized in that: The assembly and disassembly device further includes a position identifier, which is arranged relative to the ring-carrying platform and the lifting platform in the vertical direction. The assembly and disassembly method further includes: Before placing the combination of the carrier plate and the carrier ring on the lifting platform, identifying the through hole center coordinates of the through hole by a position identifier; After placing the combination of the plate carrier plate and the plate carrier ring on the lifting platform, identifying the combination center coordinates of the combination of the plate carrier plate and the plate carrier ring by a position identifier; The position of the combination of the carrier plate and the carrier ring is adjusted to control the deviation between the center coordinate of the through hole and the center coordinate of the combination within an allowable range.

9. The transmission method according to claim 8, characterized in that: The combined disassembly device further includes a height measuring sensor, which is arranged relative to the ring-carrying platform and the lifting platform in the vertical direction. The transmission method further includes: After the lifting platform is controlled to pass through the through hole and descend to the carrier ring platform and the substrate remains on the carrier ring, the center coordinates of the carrier ring and the center coordinates of the substrate are identified by a position identifier; the height of the upper surface of the carrier ring and the height of the upper surface of the substrate are identified by a height measuring sensor; If the deviation between the center coordinates of the carrier ring and the center coordinates of the substrate is within the allowable range, and the height difference between the upper surface of the carrier ring and the substrate is within the allowable range; Then, the plate carrier plate is placed on the lifting platform, and the lifting platform is controlled to pass through the through hole and rise to the ring carrier platform to combine the plate carrier plate, the plate carrier ring and the substrate; If the deviation between the center coordinates of the carrier ring and the center coordinates of the substrate is not within the allowable range, or the height difference between the upper surface of the carrier ring and the substrate is not within the allowable range; The substrate is then placed back into the substrate calibrator by the transport robot to recalibrate the position and posture.

10. The transmission method according to claim 6, characterized in that: The assembly and separation device further comprises a reaction chamber for reacting the assembled carrier plate, carrier ring and substrate; The transmission method further comprises: The transport robot puts the assembly of the carrier plate, the carrier ring and the substrate into the reaction chamber.

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