Chip upside-down mounting device and system and chip upside-down mounting method

Abstract

The invention provides a flip chip mounting device, which comprises a linear module, a flip chip mounting module and a flip chip mounting module, a rotating motor is mounted on the linear module; the rotating motor is connected with an overturning head through a rotating shaft; the overturning head at least comprises a voice coil motor fixing seat, an air tap lifting plate and an air tap fixing seat; the voice coil motor fixing seat is fixed with the rotating shaft, the voice coil motor fixing seat is connected with the air tap lifting plate through a crossed roller linear guide rail, and the air tap lifting plate is fixed with the air tap fixing seat; a voice coil motor is mounted in the voice coil motor fixing seat; a moving head of the voice coil motor is fixed with the air tap lifting plate; an air tap extending in the height direction is mounted in the air tap fixing seat; when the moving head of the voice coil motor drives the air tap lifting plate to reciprocate along the height direction, the air tap lifting plate drives the air tap fixing seat and the air tap to reciprocate along the height direction. According to the invention, the control precision of the chip mounting force is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a chip flip mounting device, a chip flip mounting system and a chip flip mounting method. Background Art

[0002] Chip mounting in the semiconductor industry's packaging and testing process is a key step in chip packaging. Common chip mounting methods include chip mounting and chip flipping.

[0003] Chip mounting is to mount the back of the chip on the PCB board. Figure 1 As shown, a pin J is punched on the front of the chip D, and the back of the chip D is mounted on the PCB board P with the front of the chip D facing upward, and the pin J is connected to the PCB board P through a wiring W.

[0004] Flip chip is to mount the front side of the chip on the PCB board. Figure 2 As shown, a pin J is punched on the front of the chip D, and the back of the chip D is facing upwards to mount the front of the chip D on the PCB board P, and the pin J is connected to the PCB board P through a solder point S.

[0005] Regardless of whether the chip is mounted upright or flipped, it is usually necessary to use a mounting device to adsorb the chip and then place the chip on a PCB for mounting.

[0006] In the prior art, the chip flipping mounting device adsorbs the chip and then flips it 180 degrees, and then places the chip on the PCB. However, in the process of placing the chip on the PCB, the nozzle stroke of the adsorbing chip is difficult to control, and the mounting force is uncontrollable, which can easily cause damage to the chip during mounting, and the mounting accuracy is not high.

[0007] Moreover, the existing flip-chip mounting device has a large structure volume and a large mass, which affects the running speed of the mounting device, thereby affecting the chip mounting speed, resulting in low chip mounting efficiency. Summary of the invention

[0008] The present invention proposes a chip flip mounting device, a system and a chip flip mounting method to solve the technical problems of the existing chip flip mounting device, such as the air nozzle stroke for adsorbing the chip is difficult to control, the mounting force is uncontrollable, the chip is easily damaged during mounting, and the mounting accuracy is low.

[0009] One aspect of the present invention is to provide a flip chip mounting device, the mounting device comprising a linear module extending along a length direction;

[0010] A rotary motor is installed on one side of the linear module along the width direction; the rotary motor is connected to a flip head via a rotary shaft;

[0011] The linear module is used to drive the rotary motor and the flip head to reciprocate along the length direction; the rotary motor is used to drive the flip head to rotate around the axis of the rotating shaft;

[0012] Wherein, the flip head at least includes a voice coil motor fixing seat, an air nozzle lifting plate and an air nozzle fixing seat;

[0013] The voice coil motor fixing seat is fixed to the rotating shaft, the voice coil motor fixing seat is connected to the air nozzle lifting plate through a cross roller linear guide rail, and the air nozzle lifting plate is fixed to the air nozzle fixing seat;

[0014] A voice coil motor is installed in the voice coil motor fixing seat; the moving head of the voice coil motor is fixed to the air nozzle lifting plate to drive the air nozzle lifting plate to reciprocate along the height direction;

[0015] An air nozzle extending in the height direction is installed in the air nozzle fixing seat; when the moving head of the voice coil motor drives the air nozzle lifting plate to reciprocate in the height direction, the air nozzle lifting plate drives the air nozzle fixing seat and the air nozzle to reciprocate in the height direction.

[0016] In a preferred embodiment, a first air extraction channel is provided in the voice coil motor fixing seat, one end of the first air extraction channel is connected to the air extraction port, and the other end of the first air extraction channel is provided with a first air port;

[0017] A second air extraction channel is provided in the air nozzle fixing seat, one end of the second air extraction channel is connected to the air nozzle, and a second air port is installed at the other end of the second air extraction channel;

[0018] The first air port and the second air port are connected via a ventilation hose.

[0019] In a preferred embodiment, a connecting plate is provided on one side of the linear module along the width direction, and the rotary motor is fixed on the connecting plate of the linear module;

[0020] A flip head detection sensor is installed on the connection plate of the linear module; the flip head detection sensor is used to detect the rotation angle of the rotation shaft, thereby detecting the rotation angle of the flip head.

[0021] In a preferred embodiment, the output shaft of the rotating motor is connected to a coupling, the coupling is fixed to one end of the rotating shaft, and the other end of the rotating shaft is connected to the flip head; a bearing is installed on the outer periphery of the rotating shaft.

[0022] Another aspect of the present invention is to provide a flip chip mounting system, the mounting system comprising an upper mounting device and a lower mounting device arranged in a height direction;

[0023] The upper layer mounting device and the lower layer mounting device have the same structure, and both are a chip flip mounting device provided by the present invention.

[0024] Another aspect of the present invention is to provide a chip flipping method, using a chip flipping mounting system provided by the present invention to perform flip-chip mounting, comprising:

[0025] S1, the air nozzle of the lower layer mounting device moves along the length direction to the top of the chip front side;

[0026] S2, the air nozzle of the lower layer mounting device moves downward in the height direction so that the air nozzle contacts the front side of the chip, and the air nozzle of the lower layer mounting device is vacuumed to adsorb the front side of the chip;

[0027] S3, the nozzle of the lower placement device rotates 180°, driving the chip to rotate 180°;

[0028] S4, the air nozzle of the upper mounting device moves along the length direction to above the back side of the chip;

[0029] S5, the air nozzle of the upper mounting device moves downward in the height direction so that the air nozzle contacts the back side of the chip;

[0030] The air nozzle of the upper placement device draws a vacuum to adsorb the back of the chip; the air nozzle of the lower placement device breaks the vacuum to release the adsorption on the front of the chip;

[0031] S6, the air nozzle of the upper mounting device moves upward in the height direction to drive the chip upward, so that the chip leaves the air nozzle of the lower mounting device;

[0032] S7, the air nozzle of the upper placement device moves along the length direction to the top of the PCB board, so that the front of the chip faces the PCB board;

[0033] The air nozzle of the upper mounting device moves downward in the height direction to drive the chip downward so that the front side of the chip can be mounted on the PCB board.

[0034] In a preferred embodiment, in step S1, the linear module of the lower layer mounting device drives the rotary motor and the flip head of the lower layer mounting device to move along the length direction, so that the air nozzle of the lower layer mounting device moves along the length direction to above the front side of the chip;

[0035] In step S2, the flip head of the lower layer mounting device drives the air nozzle of the lower layer mounting device to move downward in the height direction through the moving head of the voice coil motor, so that the air nozzle of the lower layer mounting device contacts the front side of the chip;

[0036] The vacuum generator evacuates the exhaust port of the lower mounting device, and evacuates the air nozzle of the lower mounting device through the first exhaust channel, the first air port, the ventilation hose, the second air port and the second exhaust channel. The air nozzle of the lower mounting device adsorbs the front side of the chip.

[0037] In a preferred embodiment, in step S3, the rotating motor of the lower layer mounting device drives the flip head of the lower layer mounting device to rotate 180° around the axis of the rotating shaft, and the flip head of the lower layer mounting device drives the air nozzle of the lower layer mounting device to rotate 180°, so that the chip rotates 180°.

[0038] In a preferred embodiment, in step S4, the linear module of the upper layer mounting device drives the rotary motor and the flip head of the upper layer mounting device to move along the length direction, so that the air nozzle of the upper layer mounting device moves along the length direction to above the back side of the chip;

[0039] In step S5, the flip head of the upper mounting device drives the air nozzle of the upper mounting device to move downward in the height direction through the moving head of the voice coil motor, so that the air nozzle of the upper mounting device contacts the back side of the chip;

[0040] The vacuum generator evacuates the air outlet of the upper mounting device, and evacuates the air nozzle of the upper mounting device through the first air extraction channel, the first air outlet, the ventilation hose, the second air outlet, and the second air extraction channel, and the air nozzle of the upper mounting device adsorbs the back of the chip;

[0041] The vacuum generator breaks the vacuum at the exhaust port of the lower mounting device, and the air nozzle of the lower mounting device breaks the vacuum to release the adsorption on the front side of the chip.

[0042] In a preferred embodiment, in step S6, the flip head of the upper mounting device drives the air nozzle of the upper mounting device to move upward in the height direction through the moving head of the voice coil motor, driving the chip to move upward, so that the chip leaves the air nozzle of the lower mounting device;

[0043] In step S7, the linear module of the upper placement device drives the rotary motor and the flip head of the upper placement device to move along the length direction, and drives the air nozzle of the upper placement device to move along the length direction to above the PCB board, so that the front side of the chip faces the PCB board;

[0044] The flip head of the upper mounting device drives the air nozzle of the upper mounting device to move downward in the height direction through the moving head of the voice coil motor, driving the chip to move downward, so that the front side of the chip can be mounted on the PCB board.

[0045] Compared with the prior art, the present invention has the following beneficial effects:

[0046] The present invention proposes a chip flip mounting device, system and chip flip mounting method, wherein a flip head adopts a voice coil motor fixing seat, and an air nozzle lifting plate is connected through a cross roller linear guide rail, the air nozzle lifting plate is fixed to the air nozzle fixing seat, a voice coil motor is installed in the voice coil motor fixing seat of the flip head, a moving head of the voice coil motor is fixed to the air nozzle lifting plate, and an air nozzle is installed in the air nozzle fixing seat, the movement stroke of the air nozzle in the height direction is controlled by the voice coil motor, the movement stroke of the air nozzle in the height direction is reduced, thereby reducing the movement space of the air nozzle in the height direction, improving the control accuracy of the chip mounting force, reducing the damage of the chip during mounting, and at the same time making the overall structure of the mounting device smaller and more compact, the mounting device runs fast, the chip mounting speed is fast, and the chip mounting efficiency is high.

[0047] The present invention proposes a chip flip mounting device, system and chip flip mounting method. Since a voice coil motor is used to control the movement stroke of an air nozzle in the height direction, the movement space of the air nozzle in the height direction is relatively small. A first air suction channel is opened in a voice coil motor fixing seat, and a second air suction channel is opened in the air nozzle fixing seat. The first air suction channel and the second air suction channel are connected through a first air port, a second air port, and a ventilation hose between the first air port and the second air port. A gas passage is cleverly arranged between the voice coil motor fixing seat and the air nozzle fixing seat to avoid adding an additional gas pipeline for vacuuming the air nozzle, thereby effectively avoiding interference between the gas pipeline of the lower mounting device and the flip head of the upper mounting device during the rotation of the flip head of the lower mounting device.

[0048] The present invention proposes a chip flip mounting device, system and chip flip mounting method, wherein the air nozzle stroke for adsorbing the chip is controllable and the mounting force is controllable, thereby effectively reducing chip damage during mounting, having high mounting accuracy and making the overall structure of the mounting device more compact. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the specific implementation of the present invention or the technical solution in the prior art, the following briefly introduces the drawings required for use in the specific implementation or the prior art description. Obviously, the drawings described below are some implementations of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0050] Figure 1 This is a schematic diagram of the chip structure.

[0051] Figure 2 It is a schematic diagram of the structure of a flip chip.

[0052] Figure 3 It is a front schematic diagram of the arrangement of an upper layer mounting device and a lower layer mounting device of a chip flip mounting system of the present invention.

[0053] Figure 4 It is a structural schematic diagram of a chip flip mounting device of the present invention.

[0054] Figure 5 yes Figure 4 Cross-sectional view along the AA direction.

[0055] Figure 6 It is an enlarged view of the flip head of the present invention ( Figure 5 (enlarged view of the dashed circle in the middle).

[0056] Figure 7 It is a schematic diagram showing that the air nozzle of the lower layer mounting device of the present invention moves to the top of the front surface of the chip.

[0057] Figure 8 It is a schematic diagram of the front side of the chip being adsorbed by the air nozzle of the lower layer mounting device of the present invention.

[0058] Fig. 9 It is a schematic diagram of the air nozzle of the lower layer mounting device of the present invention driving the chip to rotate 180 degrees.

[0059] Fig.10 It is a schematic diagram showing that the air nozzle of the upper mounting device of the present invention moves to the upper side of the back side of the chip.

[0060] Fig.11 It is a schematic diagram of the air nozzle of the upper mounting device of the present invention adsorbing the back side of the chip.

[0061] Fig.12 It is a schematic diagram of the air nozzle of the chip leaving the lower layer mounting device of the present invention.

[0062] Fig.13 It is a schematic diagram of mounting the front side of the chip of the present invention on the PCB board. DETAILED DESCRIPTION

[0063] In order to make the above and other features and advantages of the present invention more clear, the present invention is further described below in conjunction with the accompanying drawings. It should be understood that the specific embodiments given herein are for the purpose of explaining to those skilled in the art and are only exemplary and not restrictive.

[0064] Combination Figures 1 to 6 According to an embodiment of the present invention, a flip chip mounting system includes an upper mounting device T1 and a lower mounting device T2 arranged along a height direction.

[0065] like Figure 3 As shown, a chip flip mounting system of the present invention arranges an upper mounting device T1 and a lower mounting device T2 along the height direction. The upper mounting device T1 is fixed on the mounting board M, and the lower mounting device T2 is fixed on the mounting board M. The upper mounting device T1 is located directly above the lower mounting device T2.

[0066] The upper mounting device T1 and the lower mounting device T2 of a chip flip mounting mounting system of the present invention have the same structure, and both use a chip flip mounting mounting device provided by the present invention. The upper mounting device T1 and the lower mounting device T2 have the same structure, and the chip flip mounting mounting device provided by the present invention is described below using the lower mounting device T2 as an example.

[0067] Combination Figures 4 to 6 According to an embodiment of the present invention, a flip chip mounting device is provided. In order to make the present invention more clearly described, the length direction, width direction and height direction which are orthogonal to each other are defined, such as Figure 4 and Figure 5 shown.

[0068] The present invention discloses a flip chip mounting device, comprising a linear module 1 extending in the length direction. A rotary motor 3 is mounted on the linear module 1 on one side in the width direction. The rotary motor 3 is connected to a flip head 7 via a rotary shaft 6.

[0069] The linear module 1 is used to drive the rotary motor 3 and the flip head 7 to reciprocate along the length direction. The rotary motor 3 is used to drive the flip head 7 to rotate around the axis of the rotating shaft 6 (such as Figure 4 (indicated by arrow a).

[0070] Specifically, a connection plate 2 is provided on one side of the linear module 1 along the width direction, and the rotary motor 3 (rotary motor 3 body) is fixed on the connection plate 2 of the linear module 1 .

[0071] The output shaft of the rotating motor 3 is connected to the coupling 4 , the coupling 4 is fixed to one end of the rotating shaft 6 , and the other end of the rotating shaft 6 is connected to the flip head 7 .

[0072] Furthermore, a bearing 8 is installed on the outer periphery of the rotating shaft 6 , and the bearing 8 is fixed on the connecting plate 2 of the linear module 1 through a bearing seat 5 .

[0073] The connection plate 2 of the linear module 1 is provided with a flip head detection sensor 9. The flip head detection sensor 9 is used to detect the rotation angle of the rotating shaft 6, thereby detecting the rotation angle of the flip head 7.

[0074] Combination Figures 4 to 6 According to an embodiment of the present invention, the flip head 7 at least includes a voice coil motor fixing seat 701 , an air nozzle lifting plate 702 and an air nozzle fixing seat 704 .

[0075] The voice coil motor fixing seat 701 is fixed to the rotating shaft 6 , so that the rotating motor 3 is connected to the flip head 7 through the rotating shaft 6 .

[0076] The voice coil motor fixing seat 701 is connected to the air nozzle lifting plate 702 through a cross roller linear guide 703. Figure 4 The air nozzle lifting plate 702 is fixed to the air nozzle fixing seat 704, as shown. Figure 4 , Figure 5 and Figure 6 shown.

[0077] like Figure 5 and Figure 6 As shown, according to an embodiment of the present invention, a voice coil motor 707 is installed in a voice coil motor fixing seat 701; a moving head 7071 of the voice coil motor 707 is fixed to the air nozzle lifting plate 702 to drive the air nozzle lifting plate 702 to reciprocate along the height direction.

[0078] Specifically, the base of the voice coil motor 707 is fixed to the voice coil motor fixing seat 701 , and the moving head 7071 of the voice coil motor 707 is fixed to the air nozzle lifting plate 702 .

[0079] According to an embodiment of the present invention, an air nozzle 705 extending in the height direction is installed in the air nozzle fixing seat 704. When the moving head 7071 of the voice coil motor 707 drives the air nozzle lifting plate 702 to reciprocate in the height direction, the air nozzle lifting plate 702 drives the air nozzle fixing seat 704 and the air nozzle 705 to reciprocate in the height direction. Figure 6 shown.

[0080] The flip head 7 of the present invention adopts a voice coil motor fixing seat 701 and an air nozzle lifting plate 702 connected by a cross roller linear guide 703, the air nozzle lifting plate 702 is fixed to the air nozzle fixing seat 704, a voice coil motor 707 is installed in the voice coil motor fixing seat 701, a moving head 7071 of the voice coil motor 707 is fixed to the air nozzle lifting plate 702, an air nozzle 705 is installed in the air nozzle fixing seat 704, and the moving head 7071 of the voice coil motor 707 controls the movement stroke of the air nozzle 705 in the height direction. Since the moving head 7071 of the voice coil motor 707 has a small stroke, the movement stroke of the air nozzle 705 in the height direction is reduced, and the movement space of the air nozzle 705 in the height direction is reduced. The present invention utilizes the small stroke of the moving head 7071 of the voice coil motor 707 to reduce the movement stroke of the air nozzle 705 in the height direction, reduce the pressing force of the air nozzle 705 on the chip, improve the control accuracy of the chip mounting force, and reduce the damage to the chip during mounting.

[0081] The flip head 7 of the present invention adopts a voice coil motor fixing seat 701 and an air nozzle lifting plate 702 which are connected by a cross roller linear guide 703. The air nozzle lifting plate 702 is fixed to the air nozzle fixing seat 704. A voice coil motor 707 is installed in the voice coil motor fixing seat 701. A moving head 7071 of the voice coil motor 707 is fixed to the air nozzle lifting plate 702. An air nozzle 705 is installed in the air nozzle fixing seat 704. The moving head 7071 of the voice coil motor 707 controls the movement stroke of the air nozzle 705 in the height direction, thereby reducing the overall structure of the mounting device and making the overall structure of the mounting device more compact.

[0082] like Figure 4 and Figure 6 As shown, according to an embodiment of the present invention, a first air extraction channel 7011 is opened in the voice coil motor fixing seat 701 , one end of the first air extraction channel 7011 is connected to the air extraction port 706 , and the other end of the first air extraction channel 7011 is installed with a first air port 708 .

[0083] A second air extraction channel 7041 is provided in the air nozzle fixing seat 704. One end of the second air extraction channel 7041 is connected to the air nozzle 705, and the other end of the second air extraction channel 7041 is provided with a second air port 709. The first air port 708 and the second air port 709 are connected via a ventilation hose (not shown).

[0084] When the moving head 7071 of the voice coil motor 707 drives the air nozzle lifting plate 702 to reciprocate in the height direction, the air nozzle lifting plate 702 drives the air nozzle fixing seat 704 and the air nozzle 705 to reciprocate in the height direction. During the reciprocating movement of the air nozzle fixing seat 704 in the height direction, relative movement occurs between the first air port 708 and the second air port 709.

[0085] When the vacuum port 706 is evacuated, the air nozzle 705 is evacuated through the first air suction channel 7011, the first air port 708, the ventilation hose (not shown in the figure), the second air port 709 and the second air suction channel 704, so that the air nozzle 705 adsorbs the chip.

[0086] Since the present invention adopts the voice coil motor 707 to control the movement stroke of the air nozzle 705 in the height direction, the movement space of the air nozzle 705 in the height direction is relatively small. By opening a first air suction channel 7011 in the voice coil motor fixing seat 701, and opening a second air suction channel 7041 in the air nozzle fixing seat 704, the first air suction channel 7011 and the second air suction channel 7041 are connected through the first air port 708, the second air port 709, and the ventilation hose between the first air port 708 and the second air port 709. A gas passage is cleverly set between the voice coil motor fixing seat 701 and the air nozzle fixing seat 704 to avoid adding an additional gas pipeline for vacuuming the air nozzle 705, thereby effectively avoiding the gas pipeline of the lower mounting device T2 from interfering with the flip head 7 of the upper mounting device T1 during the rotation of the flip head 7 of the lower mounting device T2.

[0087] Combination Figure 3 , Figures 7 to 13 According to an embodiment of the present invention, a method for flip-chip mounting is provided, and a flip-chip mounting system provided by the present invention is used to perform flip-chip mounting, comprising:

[0088] Step S1: The air nozzle 705 of the lower layer mounting device T2 moves along the length direction to above the front surface of the chip D.

[0089] Specifically, the pin J is punched on the front of the chip D. The linear module 1 of the lower mounting device T2 drives the rotary motor 3 and the flip head 7 of the lower mounting device T2 to move along the length direction, so that the air nozzle 705 of the lower mounting device T2 moves along the length direction to the top of the front of the chip D, as shown in FIG. Figure 7 Shown

[0090] Step S2, the air nozzle 705 of the lower layer mounting device T2 moves downward in the height direction so that the air nozzle 705 contacts the front surface of the chip D, and the air nozzle 705 of the lower layer mounting device T2 is evacuated to adsorb the front surface of the chip D.

[0091] Specifically, the flip head 7 of the lower layer mounting device T2 drives the air nozzle fixing seat 704 and the air nozzle 705 of the lower layer mounting device T2 to move downward in the height direction through the moving head 7071 of the voice coil motor 707, so that the air nozzle 705 of the lower layer mounting device T2 contacts the front side of the chip D.

[0092] The vacuum generator (not shown in the figure) evacuates the exhaust port 706 of the lower mounting device T2, and evacuates the air nozzle 705 of the lower mounting device T2 through the first exhaust channel 7011, the first air port 708, the ventilation hose, the second air port 709 and the second exhaust channel 7041 of the lower mounting device T2. The air nozzle 705 of the lower mounting device T2 adsorbs the front side of the chip D, as shown in FIG. Figure 8 shown.

[0093] Step S3: The air nozzle 705 of the lower layer mounting device T2 rotates 180°, driving the chip D to rotate 180°.

[0094] Specifically, the rotary motor 3 of the lower mounting device T2 drives the flip head 7 of the lower mounting device T2 to rotate 180° around the axis of the rotating shaft 6, and the flip head 7 of the lower mounting device T2 drives the air nozzle 705 of the lower mounting device T2 to rotate 180°, so that the chip D rotates 180°. Fig. 9 shown.

[0095] When the flip head 7 of the lower layer mounting device T2 drives the air nozzle 705 of the lower layer mounting device T2 to rotate 180°, the flip head detection sensor 9 of the lower layer mounting device T2 detects the rotation angle of the rotating shaft 6 of the lower layer mounting device T2, thereby detecting the rotation angle of the flip head 7, and further detecting the rotation angle of the air nozzle 705.

[0096] Step S4: The air nozzle 705 of the upper mounting device T1 moves along the length direction to above the back side of the chip D.

[0097] Specifically, the linear module 1 of the upper placement device T1 drives the rotary motor 3 and the flip head 7 of the upper placement device T1 to move along the length direction, so that the air nozzle 705 of the upper placement device T1 moves along the length direction to the top of the back of the chip D, as shown in FIG. Fig.10 shown.

[0098] Step S5, the air nozzle 705 of the upper mounting device T1 moves downward in the height direction so that the air nozzle 705 contacts the back side of the chip D;

[0099] The air nozzle 705 of the upper mounting device T1 draws a vacuum to adsorb the back side of the chip D; the air nozzle 705 of the lower mounting device T2 breaks the vacuum to release the adsorption on the front side of the chip D.

[0100] Specifically, the flip head 7 of the upper mounting device T1 drives the air nozzle fixing seat 704 and the air nozzle 705 of the upper mounting device T1 to move downward in the height direction through the moving head 7071 of the voice coil motor 707, so that the air nozzle 705 of the upper mounting device T1 contacts the back of the chip D.

[0101] The vacuum generator (not shown in the figure) evacuates the air outlet 706 of the upper mounting device T1, and evacuates the air nozzle 705 of the upper mounting device T1 through the first air outlet 7011, the first air outlet 708, the ventilation hose, the second air outlet 709 and the second air outlet 7041 of the upper mounting device T1. The air nozzle 705 of the upper mounting device T1 adsorbs the back of the chip D. Fig.11 shown.

[0102] The vacuum generator (not shown) breaks the vacuum at the exhaust port 706 of the lower mounting device T2, and the air nozzle 705 of the lower mounting device T2 breaks the vacuum, releasing the adsorption on the front side of the chip D.

[0103] Step S6: The air nozzle 705 of the upper mounting device T1 moves upward in the height direction to drive the chip D to move upward, so that the chip D leaves the air nozzle 705 of the lower mounting device T2.

[0104] Specifically, the flip head 7 of the upper mounting device T1 drives the air nozzle fixing seat 704 and the air nozzle 705 of the upper mounting device T1 to move upward in the height direction through the moving head 7071 of the voice coil motor 707, so as to drive the chip D to move upward, so that the chip D leaves the air nozzle 705 of the lower mounting device T2. Fig.12 shown.

[0105] After the chip D leaves the air nozzle 705 of the lower layer mounting device T2, the flip head 7 of the lower layer mounting device T2 is reset.

[0106] Specifically, the rotating motor 3 of the lower layer mounting device T2 drives the flip head 7 of the lower layer mounting device T2 to rotate 180° in the opposite direction around the axis of the rotating shaft 6, and the flip head 7 of the lower layer mounting device T2 drives the air nozzle 705 of the lower layer mounting device T2 to rotate 180° in the opposite direction.

[0107] When the flip head 7 of the lower layer mounting device T2 drives the air nozzle 705 of the lower layer mounting device T2 to rotate 180° in the opposite direction, the flip head detection sensor 9 of the lower layer mounting device T2 detects the rotation angle of the rotating shaft 6 of the lower layer mounting device T2, thereby detecting the rotation angle of the flip head 7, and further detecting the rotation angle of the air nozzle 705.

[0108] Afterwards, the flip head 7 of the lower layer mounting device T2 drives the air nozzle fixing seat 704 and the air nozzle 705 of the lower layer mounting device T2 to move upward in the height direction through the moving head 7071 of the voice coil motor 707, so as to reset the air nozzle fixing seat 704 and the air nozzle 705 of the lower layer mounting device T2.

[0109] Step S7 : The air nozzle 705 of the upper placement device T1 moves along the length direction to above the PCB board P, so that the front side of the chip D faces the PCB board P.

[0110] The air nozzle 705 of the upper mounting device T1 moves downward in the height direction to drive the chip D to move downward, so that the front side of the chip D is mounted on the PCB board P.

[0111] Specifically, the linear module 1 of the upper placement device T1 drives the rotary motor 3 and the flip head 7 of the upper placement device T1 to move along the length direction, and drives the air nozzle 705 of the upper placement device T1 to move along the length direction to above the PCB board P, so that the front of the chip D faces the PCB board P.

[0112] The flip head 7 of the upper mounting device T1 drives the air nozzle fixing seat 704 and the air nozzle 705 of the upper mounting device T1 to move downward in the height direction through the moving head 7071 of the voice coil motor 707, driving the chip D to move downward, so that the front side of the chip D is mounted on the PCB board P.

[0113] When the front side of chip D is mounted on PCB board P, the flip head 7 of the upper mounting device T1 applies mounting force to the chip D adsorbed by the air nozzle 705 of the upper mounting device T1 through the moving head 7071 of the voice coil motor 707, so that the pin J on the front side of chip D is connected to the solder joint S of PCB board P, thereby completing the flip-chip mounting of chip D.

[0114] In the above embodiment, a chip flip-chip mounting system has two layers of mounting devices arranged along the height direction, namely, an upper mounting device T1 and a lower mounting device T2. It should be understood that the above embodiment is merely exemplary. In some embodiments, a chip flip-chip mounting system of the present invention has more layers of mounting devices arranged along the height direction. After the mounting device on the lower layer rotates the adsorbed chip D 180° and transfers it to the mounting device on the upper layer, the mounting device on the upper layer mounts the front side of the chip D to the PCB board P.

[0115] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A chip flip placement device, characterized in that: The mounting device comprises a linear module extending along the length direction; A rotary motor is installed on one side of the linear module along the width direction; the rotary motor is connected to a flip head via a rotary shaft; The linear module is used to drive the rotary motor and the flip head to reciprocate along the length direction; the rotary motor is used to drive the flip head to rotate around the axis of the rotating shaft; Wherein, the flip head at least includes a voice coil motor fixing seat, an air nozzle lifting plate and an air nozzle fixing seat; The voice coil motor fixing seat is fixed to the rotating shaft, the voice coil motor fixing seat is connected to the air nozzle lifting plate through a cross roller linear guide rail, and the air nozzle lifting plate is fixed to the air nozzle fixing seat; A voice coil motor is installed in the voice coil motor fixing seat; the moving head of the voice coil motor is fixed to the air nozzle lifting plate to drive the air nozzle lifting plate to reciprocate along the height direction; An air nozzle extending in the height direction is installed in the air nozzle fixing seat; when the moving head of the voice coil motor drives the air nozzle lifting plate to reciprocate in the height direction, the air nozzle lifting plate drives the air nozzle fixing seat and the air nozzle to reciprocate in the height direction.

2. The mounting device according to claim 1, characterized in that: A first air extraction channel is provided in the voice coil motor fixing seat, one end of the first air extraction channel is connected to the air extraction port, and the other end of the first air extraction channel is provided with a first air port; A second air extraction channel is provided in the air nozzle fixing seat, one end of the second air extraction channel is connected to the air nozzle, and a second air port is installed at the other end of the second air extraction channel; The first air port and the second air port are connected via a ventilation hose.

3. The mounting device according to claim 1, characterized in that: A connecting plate is provided on one side of the linear module along the width direction, and the rotary motor is fixed on the connecting plate of the linear module; A flip head detection sensor is installed on the connection plate of the linear module; the flip head detection sensor is used to detect the rotation angle of the rotating shaft, thereby detecting the rotation angle of the flip head.

4. The mounting device according to claim 1, characterized in that: The output shaft of the rotating motor is connected to a coupling, the coupling is fixed to one end of the rotating shaft, and the other end of the rotating shaft is connected to the flip head; a bearing is installed on the outer periphery of the rotating shaft.

5. A flip chip mounting system, characterized in that: The mounting system comprises an upper mounting device and a lower mounting device arranged in a height direction; The upper layer mounting device and the lower layer mounting device have the same structure, and both are a chip flip mounting device as described in any one of claims 1 to 4.

6. A chip flipping method, characterized in that: The method uses the chip flip mounting system of claim 5 to perform flip-chip mounting, comprising: S1, the air nozzle of the lower layer mounting device moves along the length direction to the top of the chip front side; S2, the air nozzle of the lower layer mounting device moves downward in the height direction so that the air nozzle contacts the front side of the chip, and the air nozzle of the lower layer mounting device is vacuumed to adsorb the front side of the chip; S3, the nozzle of the lower placement device rotates 180°, driving the chip to rotate 180°; S4, the air nozzle of the upper mounting device moves along the length direction to above the back side of the chip; S5, the air nozzle of the upper mounting device moves downward in the height direction so that the air nozzle contacts the back side of the chip; The air nozzle of the upper placement device draws a vacuum to adsorb the back of the chip; the air nozzle of the lower placement device breaks the vacuum to release the adsorption on the front of the chip; S6, the air nozzle of the upper mounting device moves upward in the height direction to drive the chip upward, so that the chip leaves the air nozzle of the lower mounting device; S7, the air nozzle of the upper placement device moves along the length direction to the top of the PCB board, so that the front of the chip faces the PCB board; The air nozzle of the upper mounting device moves downward in the height direction to drive the chip downward so that the front side of the chip can be mounted on the PCB board.

7. The method according to claim 6, characterized in that In step S1, the linear module of the lower layer mounting device drives the rotary motor and the flip head of the lower layer mounting device to move along the length direction, so that the air nozzle of the lower layer mounting device moves along the length direction to above the front side of the chip; In step S2, the flip head of the lower layer mounting device drives the air nozzle of the lower layer mounting device to move downward in the height direction through the moving head of the voice coil motor, so that the air nozzle of the lower layer mounting device contacts the front side of the chip; The vacuum generator evacuates the exhaust port of the lower mounting device, and evacuates the air nozzle of the lower mounting device through the first exhaust channel, the first air port, the ventilation hose, the second air port and the second exhaust channel. The air nozzle of the lower mounting device adsorbs the front side of the chip.

8. The method according to claim 6, characterized in that In step S3, the rotating motor of the lower layer mounting device drives the flip head of the lower layer mounting device to rotate 180° around the axis of the rotating shaft, and the flip head of the lower layer mounting device drives the air nozzle of the lower layer mounting device to rotate 180°, so that the chip rotates 180°.

9. The method according to claim 6, characterized in that In step S4, the linear module of the upper layer mounting device drives the rotary motor and the flip head of the upper layer mounting device to move along the length direction, so that the air nozzle of the upper layer mounting device moves along the length direction to above the back side of the chip; In step S5, the flip head of the upper mounting device drives the air nozzle of the upper mounting device to move downward in the height direction through the moving head of the voice coil motor, so that the air nozzle of the upper mounting device contacts the back side of the chip; The vacuum generator evacuates the air outlet of the upper mounting device, and evacuates the air nozzle of the upper mounting device through the first air extraction channel, the first air outlet, the ventilation hose, the second air outlet, and the second air extraction channel, and the air nozzle of the upper mounting device adsorbs the back of the chip; The vacuum generator breaks the vacuum at the exhaust port of the lower mounting device, and the air nozzle of the lower mounting device breaks the vacuum to release the adsorption on the front side of the chip.

10. The method according to claim 6, characterized in that In step S6, the flip head of the upper mounting device drives the air nozzle of the upper mounting device to move upward in the height direction through the moving head of the voice coil motor, driving the chip to move upward, so that the chip leaves the air nozzle of the lower mounting device; In step S7, the linear module of the upper placement device drives the rotary motor and the flip head of the upper placement device to move along the length direction, and drives the air nozzle of the upper placement device to move along the length direction to above the PCB board, so that the front side of the chip faces the PCB board; The flip head of the upper mounting device drives the air nozzle of the upper mounting device to move downward in the height direction through the moving head of the voice coil motor, driving the chip to move downward, so that the front side of the chip can be mounted on the PCB board.

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