Sensor package, sensor package mounting method, kit including sensor package and curing agent, and adhesive structure

Abstract

A sensor package, a method for mounting the sensor package, a kit containing a curing agent and the sensor package, and an adhesive structure, the sensor package being provided with a first base material and an optical fiber disposed on the first base material and having an FBG sensor section, the sensor package having: a resin section positioned on the first base material; a first adhesive layer which is positioned on the first base material and which adheres the first base material to a target object; and an adhesive layer located on a surface of the resin portion on the opposite side from the first substrate, in which the FBG sensor portion of the optical fiber is in contact with the resin portion and held by the adhesive layer.

Description

Technical Field

[0001] The present invention relates to a sensor package, a method for installing the sensor package, a kit including the sensor package and a curing agent, and a bonding structure including the sensor package. Background Art

[0002] Conventionally, sensors are used that are installed on a target object and measure physical changes such as vibration and deformation of the target object and various information.

[0003] For example, Patent Document 1 discloses a sensor package comprising a first substrate, an FBG sensor, a resin portion and a first adhesive layer located on the first substrate, and a bonding adhesive layer located on a surface of the resin portion opposite to the first substrate, wherein the FBG sensor is held by the resin portion, and describes excellent operability when mounted on a target object without significantly reducing the sensitivity of the sensor.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: International Publication No. 2021 / 054350 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, it has been found that there is still room for further improvement in the detection accuracy of FBG sensors in conventional sensor packages.

[0009] In the sensor package having the structure specifically shown in Patent Document 1, the FBG sensor detects information of the target object through the resin portion and the adhesive layer. Here, among the resins used for the resin portion in Patent Document 1, there is a resin having an elastic modulus greater than a specified value, which causes curing shrinkage and stress relaxation over time. Such changes in the resin portion affect the FBG sensor, causing a wavelength shift of the peak wavelength in the wavelength spectrum measured by the interrogator before and after the manufacture of the sensor package and over time after manufacture. This means that the initial value of the detection system using the FBG sensor changes.

[0010] In view of the above, an object of the present invention is to provide a sensor package that can sense with high accuracy and has excellent workability during installation. Another object of the present invention is to provide a sensor package that can be used outdoors and has high durability.

[0011] Means for solving problems

[0012] The inventors of the present application have repeatedly conducted in-depth research and found that the above-mentioned problem can be solved by providing a sensor package in which an adhesive layer and a resin portion are provided on a substrate and an adhesive layer is provided on the surface of the resin portion opposite to the substrate, and by providing an FBG sensor portion in a manner that is in contact with the resin portion and retained by the adhesive layer.

[0013] In order to solve the above problems and achieve the purpose, the present invention has the following structures [1] to

[17] . [1]

[0015] A sensor package comprising a first substrate and an optical fiber disposed on the first substrate and having an FBG sensor portion, and is intended to be attached to a target object.

[0016] The sensor package has:

[0017] A resin portion, which is located on the first substrate;

[0018] a first adhesive layer, which is located on the first substrate and is used to adhere the first substrate to the target object; and

[0019] an adhesive layer located on the surface of the resin portion opposite to the first substrate,

[0020] Here, the FBG sensor portion in the optical fiber is in contact with the resin portion and is held by the adhesive layer. [2]

[0022] In the sensor package described in the above-mentioned [1], the resin portion has adhesiveness. [3]

[0024] The sensor package according to [1] or [2], wherein the elastic modulus of the resin portion is less than 1.0×10 7 Pa. [4]

[0026] The sensor package according to any one of [1] to [3] above, wherein the adhesive layer is cured at room temperature. [5]

[0028] The sensor package according to any one of [1] to [4] above, wherein the adhesive layer is cured by a curing agent. [6]

[0030] The sensor package as described in any one of [1] to [5] above, wherein at least a portion of the entire periphery of the resin portion except for a surface on the adhesive layer side is covered with the first adhesive layer. [7]

[0032] The sensor package as described in any one of [1] to [6] above, wherein the first adhesive layer has an opening penetrating in the thickness direction.

[0033] The resin portion is provided in the opening portion. [8]

[0035] The sensor package according to any one of [1] to [7] above, wherein the surfaces of the first pressure-sensitive adhesive layer and the tackiness adhesive layer that are to be attached to the target object are protected by a first release liner. [9]

[0037] The sensor package according to any one of [1] to [8] above, wherein the first substrate is transparent or translucent.

[10]

[0039] The sensor package according to any one of [1] to [9] above, wherein a second adhesive layer and a second substrate are sequentially provided on a surface of the first substrate opposite to a surface on the first adhesive layer side.

[11]

[0041] In the sensor package described in

[10] above, the second substrate is a weather-resistant substrate.

[12]

[0043] The sensor package according to the above

[10] or

[11] further comprises a second release liner at a portion between the first substrate and the second pressure-sensitive adhesive layer.

[13]

[0045] A method for mounting a sensor package, which is the method for mounting a sensor package according to any one of [1] to

[12] above,

[0046] wherein the adhesive layer in the sensor package is cured by a curing agent,

[0047] The method for installing the sensor package comprises:

[0048] a step of applying the curing agent to at least one of the adhesive layer and the target object; and

[0049] A step of attaching the sensor package to the target object via the adhesive layer.

[14]

[0051] A method for mounting a sensor package, which is the method for mounting a sensor package according to any one of [1] to

[12] above,

[0052] wherein the adhesive layer in the sensor package is cured by a curing agent,

[0053] The method for installing the sensor package comprises:

[0054] A step of applying the curing agent to the adhesive layer;

[0055] a step of applying the curing agent to the target object; and

[0056] A step of attaching the sensor package to the target object such that the curing agent applied to the adhesive layer is in contact with the curing agent applied to the target object.

[15]

[0058] A sensor package mounting method, comprising mounting the sensor package according to any one of [1] to [5] on the target object.

[0059] The first adhesive layer and the adhesive layer in the sensor package have their surfaces on the side to be attached to the target object protected by a first release liner.

[0060] The sensor package includes the first substrate, the second adhesive layer, and the second substrate in this order on the surface of the first adhesive layer opposite to the surface to be attached to the target object.

[0061] A second release liner is provided at a portion between the first substrate and the second adhesive layer.

[0062] The method for installing the sensor package comprises:

[0063] The first release liner is peeled off and a curing agent is applied to the adhesive layer;

[0064] A step of attaching the release surface of the sensor package from which the first release liner has been peeled off to the target object; and

[0065] The second release liner is peeled off, and the release surface of the second pressure-sensitive adhesive layer from which the second release liner has been peeled off is adhered to the first substrate.

[16]

[0067] A kit comprising a curing agent and the sensor package according to any one of [1] to

[12] above.

[17]

[0069] A bonding structure is a bonding structure in which a sensor package and a target object are bonded via a cured layer, wherein the sensor package comprises a first substrate and an optical fiber disposed on the first substrate and having an FBG sensor portion.

[0070] The aforementioned bonding structure has:

[0071] A resin portion, which is located on the first substrate;

[0072] a first adhesive layer located on the first substrate; and

[0073] The cured layer is located on a surface of the resin portion that is opposite to the first substrate.

[0074] wherein the first substrate is adhered to the target object via the first adhesive layer.

[0075] The FBG sensor portion in the optical fiber is in contact with the resin portion and is held by the cured layer.

[0076] Effects of the Invention

[0077] A sensor package according to one embodiment of the present invention can sense with high accuracy, can be easily mounted and positioned, and has excellent operability. In addition, it has excellent durability and can be used outdoors. BRIEF DESCRIPTION OF THE DRAWINGS

[0078] [ Figure 1 ] Figure 1 This is a schematic diagram of a configuration example of a sensor package.

[0079] [ Figure 2 ] Figure 2 yes Figure 1 Schematic II cross-sectional view.

[0080] [ Figure 3 ] Figure 3 yes Figure 1 Schematic II-II cross-sectional view.

[0081] [ Figure 4 ] Figure 4 yes Figure 1 Schematic III-III cross-sectional view.

[0082] [ Figure 5 ] Figure 5 It is a schematic cross-sectional view of a configuration example of a sensor package.

[0083] [ Figure 6 ] Figure 6It is a schematic cross-sectional view of a configuration example of a sensor package.

[0084] [ Figure 7 ] Figure 7 It is a schematic cross-sectional view of a configuration example of a sensor package.

[0085] [ Figure 8 ] Figure 8 (a) and (b) are schematic cross-sectional views of a configuration example of a sensor package.

[0086] [ Fig. 9 ] Fig. 9 It is a schematic cross-sectional view of a configuration example of a sensor package.

[0087] [ Fig.10 ] Fig.10 It is a schematic cross-sectional view of a configuration example of a bonded structure. DETAILED DESCRIPTION

[0088] Hereinafter, embodiments of the present invention will be described in detail.

[0089] In this specification, the range "A to B" means "A or more and B or less". In this specification, "weight" and "mass", "weight %" and "mass %", and "weight part" and "mass part" are used as synonyms, respectively.

[0090] In addition, in this specification, "adhesive" refers to a substance that exhibits peel resistance without curing. Specifically, adhesives are also called pressure-sensitive adhesives (pressure-sensitive adhesives), which are materials that appear in a soft solid (viscoelastic) state in a temperature range near room temperature and have the property of simply adhering to the adherend by pressure. The adhesive mentioned here is defined as in "CADahlquist, "Adhesion: Fundamentals and Practice", McLaren & Sons, (1966) P.143", and can generally be a material that satisfies the complex tensile elastic modulus E * (1Hz)<10 7 dyne / cm 2 The term "adhesive layer" refers to a layer formed of an adhesive. The term "adhesiveness" refers to the above-mentioned property of an adhesive.

[0091] In the present specification, the term "adhesive adhesive" refers to a material having the function of the above-mentioned adhesive and having increased peeling resistance by curing. In addition, the term "adhesive adhesive layer" refers to a layer formed of an adhesive adhesive.

[0092] It should be noted that, in the following drawings, the same reference numerals are sometimes used to mark the components and parts that play the same role for description, and the repeated description is sometimes omitted or simplified. In addition, the embodiments described in the drawings are schematically illustrated for the purpose of clearly describing the present invention, and do not necessarily accurately represent the size and scale of the actual product.

[0093] 〔Sensor package〕

[0094] A sensor package according to an embodiment of the present invention is characterized in that it is a sensor package for being attached to a target object, comprising a first substrate and an optical fiber having an FBG sensor portion disposed on the first substrate.

[0095] The sensor package has:

[0096] A resin portion, which is located on the first substrate;

[0097] a first adhesive layer, which is located on the first substrate and is used to adhere the first substrate to the target object; and

[0098] an adhesive layer located on the surface of the resin portion opposite to the first substrate,

[0099] The FBG sensor portion in the optical fiber is in contact with the resin portion and is held by the adhesive layer.

[0100] In the sensor package according to the embodiment of the present invention, the FBG sensor unit is held by the adhesive layer and attached to the target object via the adhesive layer. That is, the FBG sensor unit can detect information of the target object only via the adhesive layer without being separated by the first adhesive layer and the resin unit, thereby improving the accuracy of sensing.

[0101] In addition, as described below, the FBG sensor unit and the target object can be more firmly bonded by curing the adhesive layer, and the detection accuracy can be further improved.

[0102] (First Embodiment)

[0103] Figure 1 It is a schematic diagram of a configuration example of the sensor package 100 according to the first embodiment of the present invention. Figure 2 yes Figure 1 Schematic II cross-sectional view. Figure 3 yes Figure 1 Schematic II-II cross-sectional view. Figure 4 yes Figure 1 Schematic III-III cross-sectional view.

[0104] Figures 1 to 4 The sensor package 100 shown includes a first substrate 20, an optical fiber 15 having a FBG (Fiber Bragg Grating) sensor portion 10 arranged on the first substrate, a resin portion 12 located on the first substrate 20, a first adhesive layer 11 located on the first substrate 20 and used to adhere the first substrate to a target object, and a bonding adhesive layer 14 located on a surface of the resin portion 12 that is opposite to the first substrate 20, wherein the FBG sensor portion 10 is in contact with the resin portion 12 and is retained by the bonding adhesive layer 14.

[0105] In the sensor package 100, the FBG sensor unit 10 is in contact with the resin unit and is held by the adhesive layer 14. The FBG sensor unit 10 is not completely embedded in the resin unit, so it is less affected by the curing shrinkage of the resin unit 12, and the detection accuracy of the FBG sensor is also less affected. In addition, the FBG sensor unit 10 is held by the adhesive layer 14, so when the module is set on the target object, the FBG sensor unit and the target object can be more firmly bonded by curing the adhesive layer, which can further improve the detection accuracy.

[0106] In the sensor package 100 , at least a portion of the entire periphery of the resin portion 12 in contact with the FBG sensor portion 10 excluding the surface on the adhesive layer side may be covered with the first adhesive layer 11 . Figures 1 to 4 In the illustrated sensor package 100 , the surface on which the adhesive layer 14 is provided is the surface to be attached to the target object.

[0107] The FBG sensor unit 10 is formed by engraving a periodic diffraction grating in the core of the optical fiber 15 , and a detection signal of the FBG sensor unit 10 is output to the outside of the sensor package 100 .

[0108] In addition, the optical fiber 15 may be coated with a coating material 13 .

[0109] When the optical fiber 15 is coated with the coating material 13, it is preferable to use a coating material 13 having a high elastic modulus from the viewpoint of preventing the signal from the target object from being moderated by the coating material and improving the detection accuracy of the FBG sensor. Specific materials are described below.

[0110] In addition, the coating material 13 can be a single layer or a multilayer. In the case of a multilayer, for example, a coating layer with a high elastic modulus can be provided, and other coating layers can be further provided on the outside thereof. By providing other coating layers, durability is improved, so that it can also be appropriately used outdoors.

[0111] However, from the viewpoint of improving the detection accuracy of the FBG sensor, it is preferred to use only a coating layer made of a high elastic modulus material or to provide no coating material 13 at the portion where the optical fiber 15 and the adhesive layer 14 are in contact.

[0112] The outer diameter of the optical fiber is preferably 0.125 mm to 1 mm.

[0113] The thickness of the coating material 13 coating the optical fiber 15 is not particularly limited, but is usually 10 μm to 1 mm.

[0114] For example, an optical fiber having an outer diameter of 0.125 mm to 1 mm can be coated with a resin coating material, and the outer diameter of the coating material including the optical fiber is preferably 0.145 mm to 3 mm.

[0115] However, from the viewpoint of improving the detection accuracy of the FBG sensor, the thickness of the covering material 13 in the portion in contact with the adhesive layer 14 is preferably 0.5 mm or less, more preferably 0.2 mm or less, and even more preferably 0.05 mm or less.

[0116] The first adhesive layer 11 is provided on the first substrate. By providing the first adhesive layer 11, when the sensor package is provided on the target object, it can be temporarily fixed by the first adhesive layer 11 and firmly bonded by curing of the adhesive layer, thereby providing excellent operability. In addition, the first adhesive layer 11 eliminates the gap between the sensor package 100 and the target object, and can also prevent external air and moisture from invading the FBG sensor unit 10, so that it can be a sensor package with excellent durability.

[0117] The first adhesive layer preferably covers at least a portion of the entire periphery of the resin portion except for the surface on the side to be attached to the target object. This is because when the FBG sensor detects information from the target object, if there is an adhesive layer between the FBG sensor and the target object, the resulting deformation is mitigated by the adhesive layer, thereby significantly reducing the detection sensitivity.

[0118] The first adhesive layer 11 may be formed of a plurality of adhesive layers.

[0119] When the covering material 13 is provided on the optical fiber 15, the first adhesive layer 11 can also be provided with a cutout at a position corresponding to the covering material 13, depending on the thickness thereof. By providing the cutout, the sensor package can be mounted on the target object with almost no gap between the first adhesive layer 11 and the target object, thereby preventing the intrusion of external air and moisture into the FBG sensor unit 10, and achieving excellent durability.

[0120] When the maximum diameter of the coating material 13 (the outer diameter of the coating material 13 including the optical fiber 15) is small relative to the thickness of the first adhesive layer 11, it is not necessarily necessary to provide an incision in the first adhesive layer 11. The coating material 13 is buried in the first adhesive layer 11, which can prevent the intrusion of external air and moisture and has excellent durability.

[0121] When the coating material 13 is provided on the optical fiber 15 , the thickness of the first adhesive layer 11 is preferably the same as the maximum diameter (outer diameter) of the coating material 13 , or preferably larger than the maximum diameter.

[0122] The first pressure-sensitive adhesive layer 11 may have an opening that penetrates in the thickness direction (hereinafter, sometimes simply referred to as an opening).

[0123] When the resin portion 12 is provided in the opening and the FBG sensor portion 10 is arranged in contact with the resin portion 12 and held by the adhesive layer 14 , the FBG sensor does not contact the first adhesive layer, thereby making it easier to obtain accurate information on the target object.

[0124] That is, it is preferred that the first adhesive layer 11 has an opening that penetrates in the thickness direction, and the resin portion 12 is provided in the opening.

[0125] Note that the FBG sensor unit 10 being held by the adhesive layer 14 means that the FBG sensor unit 10 in contact with the adhesive layer 14 is fixed to the adhesive layer 14 due to the adhesiveness of the adhesive layer 14 .

[0126] Furthermore, by arranging the FBG sensor in the opening, the position of the FBG sensor can be visually confirmed, and positioning during mounting work can be easily performed.

[0127] The shape of the opening is not particularly limited, and may be any of circular, elliptical, polygonal, square, and rectangular shapes.

[0128] The resin portion 12 is located on the first base material and is in contact with the FBG sensor portion 10 .

[0129] At least a portion of the entire periphery of the resin portion 12 excluding the surface to be attached to the target object may be covered with the first adhesive layer 11 .

[0130] When the first adhesive layer 11 has an opening that penetrates in the thickness direction, the resin portion 12 is provided in the opening.

[0131] In order to improve the detection sensitivity of the FBG sensor unit 10 , the resin unit 12 is preferably formed so that the surface of the resin unit 12 opposite to the first substrate and the surface (adhesion surface) of the first adhesive layer 11 opposite to the first substrate are flush with each other.

[0132] The resin portion 12 and the first adhesive layer 11 are located on the first base material 20 , and the sensor package 100 includes a tacky adhesive layer 14 located on the surface of the resin portion 12 opposite to the first base material 20 .

[0133] The FBG sensor portion 10 is preferably protected by the resin portion 12 and the adhesive layer 14 so as not to be exposed to the outside air.

[0134] like Figures 1 to 4 As shown, when the sensor package 100 is attached to the target object, the adhesive layer 14 can be provided in a manner that the sensor package 100 is attached to the target object via the adhesive layer 14. The FBG sensor unit 10 held by the adhesive layer 14 is attached to the target object via the adhesive layer 14. That is, the FBG sensor unit 10 detects information of the target object via the adhesive layer 14 instead of the first adhesive layer 11 and the resin unit 12, thereby improving detection accuracy.

[0135] (Second Embodiment)

[0136] In the second embodiment, the same reference numerals are used for the same components as those in the above-described embodiment, and detailed description thereof will be omitted.

[0137] Figure 5 is a schematic cross-sectional view of a sensor package 200 according to a second embodiment of the present invention, and is a schematic cross-sectional view of a sensor package 100. Figure 4 The sectional view shown corresponds to the sectional view.

[0138] Figure 5 The sensor package 200 shown is Figure 1 The modification of the sensor package 100 shown shows an embodiment in which the FBG sensor portion 10 is located in contact with the resin portion 12 and is held by the adhesive layer 14 while being located closer to the adhesive layer 14 .

[0139] Specifically, in the sensor package 100, the FBG sensor unit 10 is arranged in the opening of the first adhesive layer, whereas in the sensor package 200, the FBG sensor unit 10 is arranged above the opening and protruding toward the area of ​​the opening on the opposite side to the first substrate side.

[0140] The FBG sensor unit 10 may be protected by the resin unit 12 and the adhesive layer 14, or may be Figure 5As shown, a part thereof protrudes and is exposed from the tackiness adhesive layer 14. In the latter case, it is preferable that the sensor package is protected by a first release liner described later before being mounted on a target object.

[0141] In the sensor package 200 , it is preferable to dispose the FBG sensor unit 10 at a position closer to the target object because the information of the target object can be detected with higher accuracy.

[0142] (Third Embodiment)

[0143] In the third embodiment, the same reference numerals are used for the same components as those in the above-described embodiment, and detailed description thereof will be omitted.

[0144] Figure 6 is a schematic cross-sectional view of a configuration example of a sensor package according to a third embodiment of the present invention, and is a schematic cross-sectional view of a sensor package 100 and Figure 2 The sectional view shown corresponds to the sectional view.

[0145] like Figure 6 As shown, in the sensor package 300 a , the surfaces of the first pressure-sensitive adhesive layer 11 and the adhesive layer 14 that are to be attached to the target object may be protected by the first release liner.

[0146] In addition, if Figure 6 As shown, the sensor package 300 a may include the second adhesive layer 16 and the second base material 17 in this order on the surface of the first base material 20 opposite to the surface on the first adhesive layer 11 side.

[0147] In addition, the sensor package 300a may include a second release liner 19 at a portion between the first substrate 20 and the second adhesive layer 16. By including the second release liner 19 at a portion between the first substrate 20 and the second adhesive layer 16, the second substrate 17 can be stacked on the first substrate 20 at any time. After the sensor package 300a is attached to the target object, the second release liner 19 is peeled off and the second substrate 17 is stacked on the first substrate 20. The FBG sensor unit 10 is easy to visually see when attaching, so that positioning is easy and the operability is excellent.

[0148] A cleavage portion may be provided on the second release liner 19. The cleavage portion is formed by forming a cut line on the surface of the second release liner 19 opposite to the surface in contact with the pressure-sensitive adhesive layer.

[0149] The shape of the aforementioned cutting line can be a straight line, a curved line, for example a wave-shaped line, or a combination thereof. In addition, the cutting line can be a solid line, a dotted line, or a combination thereof. By providing the cleavage portion on the second release liner 19, the second release liner 19 can be easily removed.

[0150] In addition, the sensor package 300a may include a second release liner 19 at a portion between the first substrate 20 and the second adhesive layer 16, wherein the second release liner 19 has an extended portion that is extended and exposed beyond the second adhesive layer 16 in the surface extension direction of the second release liner 19. If the second release liner 19 has the extended portion, the extended portion serves as a gripping portion, and a sensor package with excellent operability can be obtained.

[0151] There is no particular limitation on the shape of the extension, and any appropriate shape can be adopted according to the purpose. As specific examples of the visual shape of the extension, a quadrilateral (including a trapezoid), a semi-ellipse, etc. can be cited. In addition, the end of the extension can be a wave shape, etc.

[0152] The length of the extension portion in the peeling direction is preferably 1 mm to 30 mm, more preferably 5 mm to 20 mm. If the length of the extension portion in the peeling direction is within such a range, a sensor package having excellent peeling workability and good workability can be obtained.

[0153] In addition, as a sensor package according to a third embodiment of the present invention, Figure 7 The sensor package 300b shown in the figure may be a form in which the extension portion of the second release liner 19 in the sensor package 300a is not provided. That is, the second release liner 19 may be provided at a portion between the first substrate 20 and the second adhesive layer 16. Furthermore, the second release liner 19 may not be provided with an extension portion.

[0154] In addition, as a sensor package according to a third embodiment of the present invention, Figure 8 As in the sensor package 300c shown in (a) and (b), the wing 19c may be provided by folding a portion of the front end of the inner side of the sensor package in the second release liner 19 toward the first substrate 20. According to this method, Figure 8 As shown in (b), when the second release liner 19 is lifted in the peeling direction, the wing 19c is lifted up, so the wing 19c becomes a gripping portion, and the second release liner 19 can be easily peeled off from the second adhesive layer 16. Figure 8 In the sensor package 300c shown in (a) and (b), no second release liner is provided. Figure 6 The extension portion shown in the figure can also be provided in the present embodiment.

[0155] Next, a method for manufacturing the sensor package according to the embodiment of the present invention will be described.

[0156] [Method for manufacturing sensor package]

[0157] A method for manufacturing a sensor package according to an embodiment of the present invention includes:

[0158] (I) a step of providing a first adhesive layer 11 on a first substrate 20;

[0159] (II) a step of providing the resin portion 12 on the first substrate 20;

[0160] (III) a step of providing the optical fiber 15 so as to arrange the FBG sensor unit 10 on the first substrate 20; and

[0161] (IV) A step of providing the adhesive layer 14 on the surface of the resin portion 12 which is opposite to the first base material 20 .

[0162] The above steps (I) to (IV) are performed so that the FBG sensor portion 10 and the resin portion 12 are in contact with each other and are held by the adhesive layer 14 in the obtained sensor package.

[0163] <Step (I)>

[0164] In the process of providing the first adhesive layer 11, the first adhesive layer 11 may be directly formed on the first substrate by coating and curing the adhesive composition, or a preformed adhesive layer may be attached. When the first adhesive layer 11 is composed of a plurality of adhesive layers, the process of providing the first adhesive layer 11 may be performed in a plurality of times.

[0165] When the optical fiber 15 with the FBG sensor unit 10 is covered with the covering material 13 , the first adhesive layer 11 may be provided with cuts at positions corresponding to the covering material 13 .

[0166] <Step (II)>

[0167] When the first adhesive layer 11 has an opening, the resin portion 12 can be provided by filling the opening with a resin composition forming the resin portion 12 and curing the resin composition, or by placing an adhesive such as an adhesive sheet in the opening.

[0168] <Step (III)>

[0169] In the case where the first adhesive layer 11 has an opening in the FBG sensor unit 10, Figure 4As shown in FIG. 5 , the adhesive layer 11 can be disposed in or on the opening of the first adhesive layer 11 and protruded toward the region of the opening opposite to the first substrate side.

[0170] In the case where the first adhesive layer 11 has an opening in the FBG sensor unit 10, Figure 4 As shown in FIG. 5 , it can be arranged so as to be in contact with the resin portion 12 provided in the opening of the first adhesive layer 11 .

[0171] In the method for manufacturing a sensor package, the above steps (I) to (III) may be sequentially performed, or the order may be changed.

[0172] For example, the resin portion 12 including the adhesive sheet and the FBG sensor portion 10 may be sequentially placed on the first substrate 20 , and at least a portion of the entire periphery of the resin portion 12 excluding the surface to be attached to the target object may be covered with the first adhesive layer 11 .

[0173] Alternatively, for example, after the first adhesive layer 11 is provided on the first base material 20 , the FBG sensor portion 10 may be provided, and then the resin portion may be provided by filling the resin composition and curing the resin composition.

[0174] Alternatively, the step of providing the first adhesive layer 11 on the first base material 20 , the step of providing the resin portion 12 , and the step of providing the optical fiber 15 with the FBG sensor portion 10 may be performed simultaneously.

[0175] For example, the FBG sensor unit 10 is placed on an arbitrary release film 30 , and the first adhesive layer 11 is disposed so that the opening is located on the FBG sensor unit 10 , and the resin portion 12 is formed in the opening of the first adhesive layer 11 .

[0176] Next, by laminating the first substrate 20 on the side of the first adhesive layer 11 opposite to the release film 30 and peeling off the release film 30 , the first adhesive layer 11 , the resin portion 12 , and the FBG sensor portion 10 in contact with the resin portion 12 can be simultaneously provided on the first substrate 20 .

[0177] <Step (IV)>

[0178] The adhesive layer 14 can be provided on the surface of the resin portion 12 opposite to the first substrate 20. The adhesive layer 14 can be directly formed by applying and curing the adhesive composition, or a pre-formed adhesive layer 14 can be attached to the resin portion 12.

[0179] The step of providing the adhesive layer 14 may be performed after the FBG sensor unit 10 is arranged in contact with the resin unit 12 , after the resin unit 12 is arranged on the first base material 20 , or before the resin unit 12 is arranged on the first base material 20 .

[0180] The method for manufacturing a sensor package may include steps other than the above steps (I) to (IV).

[0181] For example, the method may include a step of attaching the first release liner 18 to the surface of the first pressure-sensitive adhesive layer and the adhesive layer that is to be attached to the target object.

[0182] Furthermore, the process may include providing the second adhesive layer 16 and the second base material 17 on the surface of the first base material 20 opposite to the surface on the first adhesive layer 11 side.

[0183] Furthermore, the method may include a step of providing a second release liner 19 at a portion between the first substrate 20 and the second pressure-sensitive adhesive layer 16 .

[0184] The second release liner 19 can be laminated on a portion of the surface of the first substrate 20 opposite to the surface on the first adhesive layer 11 side, and the second adhesive layer 16 and the second substrate 17 can be provided on the first substrate 20 and the second release liner. The second adhesive layer 16 and the second substrate 17 can be formed by coating and curing the material forming the second adhesive layer 16 or the second substrate 17, or by pasting a preformed material.

[0185] In addition, the second substrate may be a weather-resistant substrate.

[0186] [Sensor package installation method]

[0187] Next, a method of mounting the sensor package according to the present embodiment will be described.

[0188] The sensor package mounting method of the present embodiment includes a step of attaching the sensor package to a target object. Before the adhesive layer is cured, the target object and the sensor package are attached to each other via the adhesive layer and the first adhesive layer.

[0189] In addition, before the adhesive layer is cured, the target object and the FGB sensor held by the adhesive layer are bonded by the adhesive layer, and the target object and the FBG sensor are firmly bonded by curing the adhesive layer. Therefore, the FBG sensor can detect the signal of the target object only through the adhesive layer without the first adhesive layer and the resin part, and the detection accuracy of the sensor can be improved.

[0190] The adhesive layer in the sensor package is preferably cured by a curing agent. In the case where the adhesive layer in the sensor package is cured by a curing agent, a process of bringing the adhesive layer into contact with the curing agent is required. The adhesive layer reacts by contacting with the curing agent. The process of bringing the adhesive layer into contact with the curing agent may include: a process of applying a curing agent to at least one of the adhesive layer and the target object, and a process of attaching the sensor package to the aforementioned target object via the adhesive layer.

[0191] That is, the sensor package mounting method according to the present embodiment is the sensor package mounting method described above.

[0192] wherein the adhesive layer in the sensor package is cured by a curing agent,

[0193] The method for installing the sensor package comprises:

[0194] a step of applying the curing agent to at least one of the adhesive layer and the target object; and

[0195] A step of attaching the sensor package to the target object via the adhesive layer.

[0196] For example, the process of bringing the adhesive layer into contact with the curing agent may include the process of applying the curing agent to the adhesive layer and the process of affixing the sensor package to the aforementioned target object, or it may include the process of applying the curing agent to the target object and the process of affixing the sensor package to the aforementioned target object in a manner that the adhesive layer is in contact with the applied curing agent.

[0197] In addition, the process of bringing the adhesive layer into contact with the curing agent may include a process of applying the curing agent to the adhesive layer, a process of applying the aforementioned curing agent to the target object, and a process of adhering the sensor package to the aforementioned target object in a manner such that the curing agent applied to the adhesive layer is in contact with the curing agent applied to the target object.

[0198] That is, a sensor package mounting method according to another embodiment is the sensor package mounting method described above.

[0199] wherein the adhesive layer in the sensor package is cured by a curing agent,

[0200] The method for installing the sensor package comprises:

[0201] A step of applying the curing agent to the adhesive layer;

[0202] a step of applying the curing agent to the target object; and

[0203] A step of attaching the sensor package to the target object such that the curing agent applied to the adhesive layer is in contact with the curing agent applied to the target object.

[0204] Furthermore, the adhesive layer and the curing agent may be heated as necessary, and the heating temperature is, for example, preferably 50° C. or higher, more preferably 70° C. or higher, and, for example, preferably 130° C. or lower, more preferably 110° C. or lower.

[0205] The reaction temperature is preferably room temperature, which is a temperature at which the heating (for example, heating at 50° C. or higher) for reacting the adhesive layer with the curing agent is not performed, and is, for example, lower than 50° C., preferably lower than 40° C., and, for example, higher than 10° C., preferably higher than 20° C.

[0206] When the reaction temperature is room temperature, heating for reacting the adhesive layer and the curing agent is not required, and the sensor package can be bonded to the target object more easily, thereby achieving excellent workability.

[0207] The reaction time is, for example, 30 minutes or more, preferably 12 hours or more, and, for example, 96 hours or less, preferably 48 hours or less.

[0208] Thereby, the adhesive layer is cured to form a cured layer. In particular, the adhesive layer is preferably cured under room temperature conditions.

[0209] The solidified layer allows the target object and the FBG sensor to be firmly bonded together, thereby improving the detection accuracy of the FBG sensor.

[0210] The shear adhesive strength of the cured layer is, for example, 0.1 MPa or more, preferably 0.4 MPa or more, more preferably 0.6 MPa or more, further preferably 0.7 MPa or more, particularly preferably 1.0 MPa or more, further preferably 2.3 MPa or more, further preferably 2.5 MPa or more, further preferably 3.5 MPa or more.

[0211] When the shear adhesive strength of the cured layer is equal to or greater than the above lower limit, the adhesive layer has excellent adhesiveness, and the target object and the FBG sensor can be reliably bonded to each other.

[0212] The shear bonding strength of the solidified layer is measured by the following method. That is, the adhesive layer is sandwiched between two polyethylene terephthalate films that have been peeled off, one polyethylene terephthalate film is peeled off from the adhesive layer, the peeled adhesive layer is arranged on the first slate board, and then the other polyethylene terephthalate film is torn off from the adhesive layer. Separately, the curing agent is arranged on the second slate. Next, the adhesive layer and the curing agent are brought into contact in a manner of being sandwiched between the first slate and the second slate, and are left for 24 hours to form a solidified layer, and then the first slate and the second slate are stretched in the shear direction at a speed of 5 mm / minute, and the strength when the two slates are peeled off is obtained as the shear bonding strength.

[0213] In another embodiment of the sensor package mounting method,

[0214] The surfaces of the first pressure-sensitive adhesive layer and the adhesive layer in the sensor package that are to be attached to the target object are protected by a first release liner.

[0215] The sensor package includes the first substrate, the second adhesive layer, and the second substrate in this order on the surface of the first adhesive layer opposite to the surface to be attached to the target object.

[0216] A second release liner is provided at a portion between the first substrate and the second adhesive layer.

[0217] The method for installing the sensor package comprises:

[0218] The step of peeling off the first release liner and bringing the curing agent into contact with the adhesive layer;

[0219] A step of attaching the release surface of the sensor package from which the first release liner has been peeled off to the target object; and

[0220] The second release liner is peeled off, and the release surface of the second pressure-sensitive adhesive layer from which the second release liner has been peeled off is adhered to the first substrate.

[0221] As described above, the second release liner may include an extended portion that is extended and exposed beyond the second pressure-sensitive adhesive layer in the surface extension direction of the second release liner.

[0222] Furthermore, as described above, the flap may be provided by folding a portion of the front end on the inner side of the sensor package in the second release liner toward the first base material.

[0223] The step of bringing the adhesive layer into contact with the curing agent is the same as described above.

[0224] like Figures 6 to 8 As shown, the sensor package includes a second release liner at a portion between the first substrate and the second adhesive layer, so that when the release surface after the first release liner is peeled off is attached to the target object, the FBG sensor can be visually seen. Therefore, the positioning of the FBG sensor when attached to the target object becomes easy, and the operability is excellent.

[0225] Next, if Fig. 9 As shown in the figure, the second adhesive layer and the second substrate are sequentially laminated on the surface of the first substrate opposite to the resin portion by peeling off the second release liner and pasting the release surface of the second adhesive layer from which the second release liner is peeled off to the first substrate. Thus, the first adhesive layer, the FBG sensor, the resin portion, and the first substrate are protected by the second adhesive layer and the second substrate, and thus the weather resistance of the sensor package is improved.

[0226] [Kit including sensor package and curing agent]

[0227] The sensor package according to the embodiment of the present invention can be formed into a kit together with a curing agent. That is, the kit according to the embodiment of the present invention includes a curing agent and the sensor package according to the embodiment of the present invention.

[0228] The sensor package and the curing agent in the kit according to the embodiment of the present invention have the same meanings as the sensor package and the curing agent described above, and the preferred contents are also the same.

[0229] According to the kit according to the embodiment of the present invention, a sensor package and a target object can be bonded together easily and firmly, and the workability is excellent.

[0230] 〔Adhesive structures〕

[0231] The bonding structure according to the embodiment of the present invention is a bonding structure in which a sensor package and a target object are bonded via a cured layer, wherein the sensor package comprises a first substrate and an optical fiber disposed on the first substrate and having an FBG sensor portion.

[0232] The aforementioned bonding structure has:

[0233] A resin portion, which is located on the first substrate;

[0234] a first adhesive layer located on the first substrate; and

[0235] The cured layer is located on a surface of the resin portion that is opposite to the first substrate.

[0236] The first substrate is adhered to the target object via the first adhesive layer.

[0237] The FBG sensor portion in the optical fiber is in contact with the resin portion and is held by the cured layer.

[0238] Fig.10 It is a schematic cross-sectional view of an adhesive structure 400 according to an embodiment of the present invention.

[0239] The same components as those in the above-described embodiment of the sensor package are denoted by the same reference numerals, and detailed description thereof is omitted.

[0240] Fig.10 The bonding structure 400 shown is a bonding structure formed by bonding a sensor package and a target object 40 via a cured layer 30 formed by curing the above-mentioned adhesive layer. The above-mentioned sensor package has a first substrate 20 and an optical fiber 15 arranged on the above-mentioned first substrate and having an FBG sensor part 10. The above-mentioned bonding structure has a resin part 12 located on the above-mentioned first substrate 20, a first adhesive layer 11 located on the above-mentioned first substrate 20, and the above-mentioned cured layer 30 located on the surface of the above-mentioned resin part 12 on the opposite side to the above-mentioned first substrate 20. The above-mentioned first substrate 20 is adhered to the above-mentioned target object 40 via the above-mentioned first adhesive layer 11, and the above-mentioned FBG sensor part 10 in the above-mentioned optical fiber 15 is in contact with the above-mentioned resin part 12 and is retained by the above-mentioned cured layer 30.

[0241] Fig.10 The bonding structure 400 shown is a Figure 4 The sensor package shown is attached to a structure of a target object 40 by bonding the adhesive layer 14 and the first adhesive layer 11 , and the adhesive layer 14 is cured to form a cured layer 30 , thereby bonding the sensor package and the target object via the cured layer.

[0242] In the above instructions, you can also use Figure 5 The sensor package shown replaces Figure 4 Specifically, the FBG sensor portion 10 may be located in contact with the resin portion 12 and may be located closer to the cured layer 30 while being held by the cured layer 30 formed by bonding the adhesive layer and curing the cured layer.

[0243] The adhesive structure may include a second adhesive layer and a second substrate in this order on a surface of the first substrate opposite to the surface on the first adhesive layer side.

[0244] The bonded structure is obtained by bonding the sensor package and the target object using the above-mentioned sensor package mounting method.

[0245] Next, materials and the like constituting the sensor package according to the embodiment of the present invention will be described.

[0246] [First base material]

[0247] As the first substrate, various substrates can be preferably used. As the first substrate, for example, resin film, paper, cloth, rubber film, foam film, metal foil, their composites, laminates, etc. can be used. Among them, from the viewpoints of adhesiveness and appearance, a film substrate containing a resin film is preferred. For containing a resin film, it is also advantageous from the viewpoints of dimensional stability, thickness accuracy, processability, tensile strength, etc. As examples of resin films, polyolefin resin films such as PE, PP, and ethylene-propylene copolymers; polyester resin films such as PET, polybutylene terephthalate, and polyethylene terephthalate; vinyl chloride resin films; vinyl acetate resin films; polyimide resin films; polyamide resin films; fluorine resin films; celluloid; and so on. As preferred examples, resin films formed by PE, PP, and PET can be cited.

[0248] Among the resin films, polyester films are more preferred, and PET films are more preferred. The film substrate may have a single-layer structure or a multilayer structure of two or three or more layers.

[0249] The first substrate is preferably transparent or translucent.

[0250] In order to accurately obtain information about the target object, the installation position of the FBG sensor is important when the sensor package is installed on the target object. By making the first substrate transparent or translucent, the position of the FBG sensor in the sensor package can be grasped, so positioning when installing on the target object becomes easy and the operability is excellent.

[0251] Specifically, the first substrate preferably has a total light transmittance of 80% or more (eg, 90% or more, typically 95% or more). In addition, the first substrate preferably has a haze of 10% or less (eg, 5% or less).

[0252] From the viewpoint of ensuring the strength for the first substrate to function as a support body in the sensor package, the thickness of the first substrate is preferably 5 μm or more, more preferably 10 μm or more. In addition, from the viewpoint of achieving appropriate flexibility in the sensor package, the thickness of the first substrate is preferably 300 μm or less, more preferably 200 μm or less.

[0253] [First adhesive layer]

[0254] The first adhesive layer can be composed of an adhesive, and the adhesive is preferably a pressure-sensitive adhesive.

[0255] As the adhesive (adhesive composition) constituting the first adhesive layer, for example, one or a combination of two or more of a rubber adhesive, an acrylic adhesive, a vinyl alkyl ether adhesive, a silicone adhesive, a polyester adhesive, a polyamide adhesive, a urethane adhesive, a fluorine adhesive, a styrene-diene block copolymer adhesive, an epoxy adhesive, etc. can be used. In addition, a light-curing adhesive (ultraviolet curing adhesive, etc.) can also be used as the adhesive.

[0256] The thickness of the first adhesive layer is preferably 50 μm or more, more preferably 100 μm or more, and even more preferably 300 μm or more, and is preferably 2 mm or less, more preferably 1.5 mm or less, and even more preferably 1 mm or less.

[0257] When preparing the adhesive composition, in the case of using a curing reaction based on heat or active energy rays, the adhesive composition preferably contains a polymerization initiator such as a thermal polymerization initiator or a photopolymerization initiator. As the polymerization initiator, a photopolymerization initiator can be preferably used from the advantages of being able to shorten the polymerization time. The polymerization initiator can be used alone or in combination of two or more.

[0258] The first adhesive layer may further have a bubble structure. The "bubble structure" may be any structure having a gas component, and may be a "bubble" having a structure formed only by a gas component without an outer shell, or a "hollow microsphere" having a structure in which a gas component is sealed in an outer shell, such as glass microbubbles.

[0259] The first adhesive layer (or adhesive composition) may contain appropriate additives. Examples of such additives include crosslinking agents (e.g., polyisocyanate crosslinking agents, silicone crosslinking agents, epoxy crosslinking agents, alkyl etherified melamine crosslinking agents, etc.), tackifiers (e.g., rosin derivative resins, polyterpene resins, petroleum resins, oil-soluble phenolic resins, etc., which are solid, semi-solid or liquid at room temperature), plasticizers, fillers, anti-aging agents, antioxidants, colorants (pigments, dyes, etc.), etc.

[0260] The adhesive composition forming the first adhesive layer can be prepared by mixing the monomer components (e.g., (meth) alkyl acrylate, etc.) forming the base polymer using a known method, hollow microspheres as required, a polymerization initiator, various additives, etc. In addition, a part of the monomer components can also be polymerized as required for viscosity adjustment, etc.

[0261] As a specific example of the production method, for example, the following steps can be mentioned.

[0262] (i) preparing a monomer mixture by mixing monomer components for forming a base polymer (e.g., alkyl (meth)acrylate, other comonomers) and a polymerization initiator (e.g., a photopolymerization initiator),

[0263] (ii) subjecting the monomer mixture to a polymerization reaction (e.g., ultraviolet polymerization) corresponding to the type of polymerization initiator to prepare a composition (syrup) in which only a portion of the monomer components are polymerized.

[0264] (iii) hollow microspheres, fluorine-based surfactants, and other additives are added to the obtained slurry as required.

[0265] (iv) By introducing bubbles into the mixture obtained in (iii) and mixing, a pressure-sensitive adhesive composition can be obtained.

[0266] It should be noted that the method for preparing the adhesive composition is not limited thereto, and for example, a method in which a fluorine-based surfactant and hollow microspheres are preliminarily blended with monomers and mixed when preparing the slurry may be used.

[0267] The first adhesive layer can be formed by a known or customary method. For example, the first adhesive layer is formed by applying the above-mentioned adhesive composition to the first substrate, and then, as required, the first adhesive layer is cured (for example, by heat curing, by active energy line curing), dried, etc. Among them, as mentioned above, curing by irradiation with active energy line is preferred.

[0268] Alternatively, the pressure-sensitive adhesive composition may be applied onto a supporting substrate, cured and dried to produce a pressure-sensitive adhesive sheet, which may be bonded to a first substrate and the supporting substrate may be peeled off to form a first pressure-sensitive adhesive layer.

[0269] As the pressure-sensitive adhesive sheet, commercially available products may be used. For example, “Hyper Joint H7004, H7008, H7012, H8004, H8008, H8012, H9004, H9008, H9012” (substrate-less double-sided pressure-sensitive adhesive sheet) manufactured by Nitto Denko Corporation may be used.

[0270] 〔Resin Department〕

[0271] The resin part is preferably transparent or translucent. By making the resin part transparent or translucent, the position of the FBG sensor in contact with the resin part can be grasped more accurately, so positioning when mounting on a target object becomes easy.

[0272] The resin portion preferably has adhesiveness. Specifically, the peeling adhesion of the resin portion to the aluminum plate is preferably 0.5N / 20mm or more, more preferably 1.0N / 20mm or more, and further preferably 2.0N / 20mm or more. By making the resin portion adhesive, the optical fiber can be fixed when manufacturing the sensor package, and the manufacturability is excellent. In addition, in the obtained sensor package, no gap is formed between the resin portion and the optical fiber, so it is also possible to prevent external air and moisture from intruding into the FBG sensor portion 10, and a sensor package with excellent durability can be made.

[0273] Here, the peeling strength of the resin portion was determined by attaching a resin portion having a width of 20 mm to an aluminum plate and then peeling the resin portion from the aluminum plate at 90 degrees at a speed of 300 mm / min.

[0274] The elastic modulus of the resin portion is preferably less than 1.0×10 7 Pa, more preferably 5.0×10 6 Pa or less, more preferably 1.0×10 6 Pa or less. In addition, the lower limit of the elastic modulus of the resin portion is not particularly limited, but is usually 1.0×10 4 Pa or above.

[0275] By making the elastic modulus of the resin portion less than 1.0×10 7 Pa, thereby achieving excellent fixation of the optical fiber. In addition, since curing shrinkage and stress relaxation of the resin are less likely to occur, the initial value of the FBG sensor is less likely to change, and the detection accuracy is further improved.

[0276] In addition, the elastic modulus of the resin part can be measured as an initial tensile elastic modulus at 25° C. by the method described later in Examples.

[0277] The thickness of the resin portion is preferably 50 μm or more, more preferably 100 μm or more, and further preferably 300 μm or more. The thickness of the resin portion is preferably 2 mm or less, more preferably 1.5 mm or less, and further preferably 1 mm or less.

[0278] The resin portion can be formed of an adhesive.

[0279] As the adhesive (adhesive composition) constituting the resin part, for example, one or more of rubber-based adhesives, acrylic adhesives, vinyl alkyl ether-based adhesives, silicone-based adhesives, polyester-based adhesives, polyamide-based adhesives, urethane-based adhesives, fluorine-based adhesives, styrene-diene block copolymer-based adhesives, epoxy-based adhesives, etc. can be used in combination.

[0280] The resin portion may also be provided using a commercially available adhesive sheet, for example, as an adhesive sheet using an acrylic adhesive, "CS9918U" manufactured by Nitto Denko Co., Ltd. may be used. The adhesive sheet may be used as a single body, or a resin portion formed by laminating a plurality of adhesive sheets may be used in order to obtain a desired thickness of the resin portion.

[0281] The resin portion can also be formed from a resin composition. The resin composition preferably contains a liquid curable resin composition of a curable resin, preferably a resin that cures at room temperature. A resin that cures at room temperature can be obtained by appropriately combining a curable resin and a curing agent.

[0282] Examples of the curable resin include phenol resins, amino resins, unsaturated polyester resins, polyurethane resins, silicone resins, epoxy resins, and thermosetting polyimide resins, and polyurethane resins are preferred.

[0283] From the viewpoint of appropriately curing the resin portion, the content of the curable resin in the resin portion is preferably 5 to 60% by mass, more preferably 10 to 50% by mass.

[0284] The resin portion can also be formed using a commercially available liquid curable resin composition. For example, as a commercially available product containing a silylated urethane resin, "Ultra Versatile SU Soft" manufactured by Konishi Corporation can be used.

[0285] [Coating material]

[0286] The optical fiber may be coated with a coating material.

[0287] Examples of the material of the coating material include metal materials such as gold coating and resin materials such as polyimide, silicone, nylon, acrylic, and vinyl chloride.

[0288] The coating material may be a resin coating material for coating the optical fiber with resin, or may be a sheath material or the like.

[0289] From the viewpoint of improving the detection accuracy of the FBG sensor, the elastic modulus of the coating material is preferably a material having a high elastic modulus.

[0290] The elastic modulus of the coating material is preferably 1.0×10 8 Pa or more, more preferably 3.0×10 8 Pa or more, more preferably 5.0×10 8 Pa or above.

[0291] As a material with a high elastic modulus, polyimide is preferably used.

[0292] [Adhesive layer]

[0293] The adhesive layer of this embodiment is located on the surface of the resin portion opposite to the first substrate. The FBG sensor is provided in contact with the resin portion and is held by the adhesive layer. Thus, the FBG sensor is attached to the target object via the adhesive layer.

[0294] The adhesive layer according to the present embodiment bonds the target object and the FBG sensor together before the adhesive layer is cured, and the target object and the FBG sensor are firmly bonded together by the curing of the adhesive layer.

[0295] In order to detect information from the target object at a high level and prevent the sensitivity of the FBG sensor from being greatly reduced, the elastic modulus of the cured layer formed by curing the adhesive layer is preferably 1.0×10 8 Pa or more, more preferably 3.0×10 8 Pa or more, more preferably 5.0×10 8 Pa or above.

[0296] The adhesive layer is a layer (sheet) that is cured by contacting and reacting with a curing agent, and has a generally flat plate shape extending in a plane direction (a direction perpendicular to the thickness direction) and having a flat front and back surface. The curing agent that cures the adhesive layer is described below.

[0297] The adhesive layer is formed in a layered form by the adhesive component.

[0298] The adhesive component is not particularly limited as long as it is a main component of a two-component adhesive capable of forming a layer, and examples thereof include silicone compounds, polyol compounds such as polypropylene glycol, urethane resins, epoxy resins, etc. The adhesive component preferably contains epoxy resin as a main component. Thus, the FBG sensor and the resin portion can be bonded to the target object simply and firmly.

[0299] Examples of the epoxy resin include bisphenol-based epoxy resins such as bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, and hydrogenated bisphenol A epoxy resin, naphthalene epoxy resins, biphenyl epoxy resins, dicyclic epoxy resins, alicyclic epoxy resins, triglycidyl isocyanurate epoxy resins, hydantoin epoxy resins, glycidyl ether epoxy resins, and glycidyl amino epoxy resins.

[0300] As the epoxy resin, preferably, a bisphenol epoxy resin is used. The epoxy resin may be used alone or in combination of two or more.

[0301] The epoxy resin can be in any form of liquid, semi-solid and solid at room temperature, and preferably, a semi-solid epoxy resin can be used alone, or a liquid epoxy resin and a solid epoxy resin can be used in combination. Thus, a viscous layered adhesive layer can be reliably formed from the adhesive component.

[0302] Specifically, the epoxy resin that is liquid at room temperature is liquid at 25° C. The viscosity of the liquid epoxy resin at 25° C. is, for example, 3 Pa·s or more, preferably 8 Pa·s or more, for example, 50 Pa·s or less, preferably 30 Pa·s or less.

[0303] Specifically, the epoxy resin that is solid at room temperature is solid at 25° C. The softening point of the solid epoxy resin is, for example, 70° C. or higher, preferably 75° C. or higher.

[0304] The mixing ratio of the liquid epoxy resin to the solid epoxy resin (liquid epoxy resin / solid epoxy resin (mass ratio)) is, for example, 1.0 or more, preferably 1.5 or more, and for example, 4.0 or less, preferably 3.0 or less.

[0305] If the proportion of the liquid epoxy resin to the solid epoxy resin is above the lower limit, the viscosity of the adhesive component can be reduced, uneven coating can be prevented, and a uniform adhesive layer can be obtained. If the proportion of the liquid epoxy resin to the solid epoxy resin is below the upper limit, a sticky layered adhesive layer can be obtained.

[0306] The mixing ratio of the epoxy resin is set to a ratio in which the epoxy resin becomes the main component in the adhesive component. Specifically, it is, for example, 70% by mass or more, preferably 75% by mass or more, more preferably 80% by mass or more, further preferably 90% by mass or more, and for example, 100% by mass or less, relative to the adhesive component.

[0307] It is preferred that the adhesive component contains only the epoxy resin, that is, the mixing ratio of the epoxy resin is 100% by mass relative to the adhesive component.

[0308] If necessary, an acrylic polymer may be added to the adhesive component, thereby increasing the cohesive force of the adhesive component.

[0309] The acrylic polymer is obtained by reacting a monomer component containing a (meth)acrylate. The (meth)acrylate is an alkyl methacrylate and / or an alkyl acrylate, and specifically, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, n-butyl (meth)acrylate, pentyl (meth)acrylate, isopentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and (meth)acrylate. Alkyl (meth)acrylates having 1 to 20 carbon atoms, such as isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, heptadecyl (meth)acrylate, octadecyl (meth)acrylate, nonadecyl (meth)acrylate, eicosyl (meth)acrylate, and the like.

[0310] As the (meth)acrylate, preferably, an alkyl (meth)acrylate having 2 to 14 carbon atoms is used, and more preferably, an alkyl (meth)acrylate having 4 to 9 carbon atoms is used.

[0311] The (meth)acrylate may be used alone or in combination of two or more.

[0312] The mixing ratio of the (meth)acrylic acid ester relative to the monomer component is, for example, 70 mass % or more, preferably 80 mass % or more, and for example, 99 mass % or less, preferably 98 mass % or less.

[0313] The monomer component may further contain a copolymerizable monomer copolymerizable with the (meth)acrylic acid ester.

[0314] Examples of the copolymerizable monomer include carboxyl group-containing monomers such as (meth)acrylic acid, itaconic acid, maleic acid, crotonic acid, and maleic anhydride, or their anhydrides; hydroxyl group-containing (meth)acrylates such as 2-hydroxyethyl (meth)acrylate and 3-hydroxypropyl (meth)acrylate; amide group-containing monomers such as (meth)acrylamide, N,N-dimethyl (meth)acrylamide, N-hydroxymethyl (meth)acrylamide, N-methoxymethyl (meth)acrylamide, and N-butoxymethyl (meth)acrylamide; vinyl esters such as vinyl acetate; aromatic vinyl compounds such as styrene and vinyltoluene; (meth)acrylonitrile; N-(meth)acryloylmorphine; and N-vinyl-2-pyrrolidone.

[0315] As the copolymerizable monomer, preferably, a carboxyl group-containing monomer and a hydroxyl group-containing (meth)acrylate are mentioned, and more preferably, (meth)acrylic acid and 2-hydroxyethyl (meth)acrylate are mentioned.

[0316] These copolymerizable monomers may be used alone or in combination of two or more thereof. Preferably, a carboxyl group-containing monomer and a hydroxyl group-containing (meth)acrylate are used in combination, and more preferably, (meth)acrylic acid and 2-hydroxyethyl (meth)acrylate are used in combination.

[0317] The mixing ratio of the copolymerizable monomer is, for example, 0.1 parts by mass or more, preferably 0.3 parts by mass or more, and for example, 15 parts by mass or less, preferably 10 parts by mass or less, based on 100 parts by mass of the (meth)acrylate.

[0318] In order to react the monomer components, for example, a (meth)acrylic acid ester and a copolymerizable monomer as required are mixed to prepare the monomer components, and these are prepared by a known polymerization method.

[0319] As the polymerization method, preferably, solution polymerization is used.

[0320] In solution polymerization, for example, monomer components and a polymerization initiator are mixed in a solvent to prepare a monomer solution, and then the monomer solution is heated.

[0321] As the solvent, for example, an organic solvent can be mentioned. As the organic solvent, for example, aromatic solvents such as toluene, benzene, and xylene, ether solvents such as ethyl acetate, ketone solvents such as acetone and methyl ethyl ketone, ester solvents such as ethyl acetate, and amide solvents such as N,N-dimethylformamide can be mentioned. The solvent can be used alone or in combination of two or more, and preferably an aromatic solvent and an ether solvent can be used in combination. Relative to 100 parts by mass of the monomer component, the mixing ratio of the solvent is, for example, 10 parts by mass or more, preferably 50 parts by mass or more, and for example, 1000 parts by mass or less, preferably 500 parts by mass or less.

[0322] Examples of the polymerization initiator include peroxide-based polymerization initiators and azo-based polymerization initiators.

[0323] Examples of the peroxide-based polymerization initiator include organic peroxides such as peroxycarbonate, ketone peroxide, peroxyketal, hydroperoxide, dialkyl peroxide, diacyl peroxide, and peroxyester.

[0324] Examples of the azo polymerization initiator include azo compounds such as 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), 2,2'-azobis(2,4-dimethylvaleronitrile) and dimethyl 2,2'-azobisisobutyrate.

[0325] As the polymerization initiator, preferably, an azo polymerization initiator is used.

[0326] The mixing ratio of the polymerization initiator relative to 100 parts by mass of the monomer component is, for example, 0.01 parts by mass or more, preferably 0.05 parts by mass or more, and for example, 5 parts by mass or less, preferably 3 parts by mass or less.

[0327] The heating temperature is, for example, 50° C. or higher and 80° C. or lower, and the heating time is, for example, 1 hour or higher and 24 hours or lower.

[0328] Thus, the monomer components are polymerized to obtain an acrylic polymer solution containing an acrylic polymer.

[0329] The acrylic polymer solution is mixed with the epoxy resin in a mixing ratio of, for example, 1 part by mass or more, preferably 2 parts by mass or more, and for example, 50 parts by mass or less, preferably 30 parts by mass or less, relative to 100 parts by mass of the adhesive component. In addition, the mixing ratio of the acrylic polymer is, for example, 1 part by mass or more, preferably 2 parts by mass or more, and for example, 43 parts by mass or less, preferably 35 parts by mass or less, relative to 100 parts by mass of the epoxy resin.

[0330] When the blending ratio of the acrylic polymer is not less than the above lower limit, the cohesive force of the adhesive component is improved, and the adhesive force is further improved, and the peel adhesive force of the adhesive layer can be improved.

[0331] When the mixing ratio of the acrylic polymer is equal to or less than the above upper limit, curing is possible.

[0332] A small amount of a curing agent may be added to the adhesive component. This can increase the cohesive force of the adhesive layer. Examples of curing agents are described below.

[0333] The mixing ratio of the curing agent is adjusted to a ratio that improves the peeling adhesive strength of the adhesive layer and slightly cures the adhesive component (incompletely cures).

[0334] In order to obtain the adhesive component, for example, an epoxy resin and, if necessary, an acrylic polymer (acrylic polymer solution) and / or a curing agent are mixed, and if necessary, the mixture is diluted with a solvent to prepare a varnish.

[0335] The solvent may be any solvent as long as it can dissolve the adhesive component, and examples thereof include the above-mentioned solvents. Preferably, a ketone solvent is used as the solvent.

[0336] The concentration of the adhesive component in the varnish is, for example, 20 mass % or more, preferably 40 mass % or more, and for example, 80 mass % or less, preferably 70 mass % or less.

[0337] Furthermore, when an acrylic polymer is added to the adhesive component, a crosslinking agent may also be added when preparing the adhesive component.

[0338] Examples of the crosslinking agent include isocyanate crosslinking agents, aziridine crosslinking agents, epoxy crosslinking agents, and metal chelate crosslinking agents. Preferably, an isocyanate crosslinking agent is used.

[0339] Examples of the isocyanate crosslinking agent include aromatic diisocyanates such as tolylene diisocyanate and xylene diisocyanate, alicyclic diisocyanates such as isophorone diisocyanate, aliphatic diisocyanates such as hexamethylene diisocyanate, and modified products of these isocyanates (specifically, toluene diisocyanate adducts of trimethylolpropane, etc.).

[0340] As the cross-linking agent, preferably, a modified product of isocyanate is used.

[0341] The mixing ratio of the crosslinking agent is, for example, 1 part by mass or more, preferably 5 parts by mass or more, and for example, 20 parts by mass or less, preferably 15 parts by mass or less, based on 100 parts by mass of the acrylic polymer.

[0342] As described below, the adhesive layer is formed to a predetermined thickness by applying an adhesive component onto a substrate and drying it.

[0343] The thickness of the adhesive layer is, for example, 1 μm or more, preferably 5 μm or more, more preferably 10 μm or more, and, for example, 1000 μm or less, preferably 500 μm or less, more preferably 100 μm or less.

[0344] The curing agent can cure the adhesive layer by contacting and reacting with the adhesive layer, and can also be set as a curing agent layer (sheet). In this case, it has a roughly flat plate shape extending along the surface direction (direction perpendicular to the thickness direction) and having a flat surface and back.

[0345] The curing agent layer is formed in a layer form by a curing component, and the curing component contains a curing agent.

[0346] The curing agent is not particularly limited as long as it is a curing agent for a two-component adhesive. When the adhesive component contains an epoxy resin, examples thereof include epoxy resin curing agents such as imidazole compounds, amine compounds, and amide compounds.

[0347] Examples of the imidazole compound include methylimidazole, 2-ethyl-4-methylimidazole, 1-isobutyl-2-methylimidazole, 1-benzyl-2-methylimidazole, 2-ethyl-4-methylimidazole, ethylimidazole, isopropylimidazole, 1,2-dimethylimidazole, 2,4-dimethylimidazole, phenylimidazole, undecylimidazole, heptadecylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole. Preferred examples include 1-isobutyl-2-methylimidazole, 1-benzyl-2-methylimidazole, and 2-ethyl-4-methylimidazole. More preferred examples include 1-isobutyl-2-methylimidazole and 1-benzyl-2-methylimidazole. Further preferred examples include 1-isobutyl-2-methylimidazole and 1-benzyl-2-methylimidazole. Further preferred examples include 1-isobutyl-2-methylimidazole and 1-benzyl-2-methylimidazole.

[0348] Examples of the amine compound include ethylenediamine, propylenediamine, diethylenetriamine, triethylenetetramine, amine adducts thereof, metaphenylenediamine, diaminodiphenylmethane, and diaminodiphenylsulfone.

[0349] Examples of the amide compound include dicyandiamide and polyamide, and preferably dicyandiamide is used.

[0350] As the curing agent, preferably, an imidazole compound is used.

[0351] The curing agent may be used alone or in combination of two or more.

[0352] The proportion of the curing agent relative to the curing component is, for example, 10% by mass or more, preferably 30% by mass or more, more preferably 50% by mass or more, further preferably 80% by mass or more, particularly preferably 90% by mass or more, and, for example, 100% by mass or less. If the proportion of the curing agent is above the lower limit, the adhesive layer has excellent adhesion.

[0353] It is preferred that the curing component contains only the curing agent, that is, the ratio of the curing agent to the curing component is 100% by mass.

[0354] If necessary, a curing accelerator may be blended into the curing component.

[0355] Examples of the curing accelerator include urea compounds such as 3-(3,4-dichlorophenyl)-1,1-dimethylurea (DCMU), N'-phenyl-N,N-dimethylurea, and 1,1'-(methyl-m-phenylene)bis(3,3'-dimethylurea); tertiary amine compounds such as triethylenediamine and tri-2,4,6-dimethylaminomethylphenol; phosphorus compounds such as triphenylphosphine, tetraphenylphosphonium tetraphenylborate, and tetra-n-butylphosphonium-o,o-diethyldithiophosphate; quaternary ammonium salt compounds; and organic metal salt compounds. Preferably, a urea compound is used, and more preferably, 3-(3,4-dichlorophenyl)-1,1-dimethylurea is used.

[0356] The curing accelerator may be used alone or in combination of two or more.

[0357] The proportion of the curing accelerator relative to the curing component is, for example, 10% by mass or more, preferably 15% by mass or more, more preferably 25% by mass or more, and, for example, 40% by mass or less. The proportion of the curing accelerator relative to 100 parts by mass of the curing agent is, for example, 10 parts by mass or more, preferably 25 parts by mass or more, and, for example, 60 parts by mass or less, preferably 50 parts by mass or less.

[0358] When preparing the curing component, the curing agent and, if necessary, the curing accelerator are mixed.

[0359] If the curing agent is in a solid state, the curing agent is dissolved in a solvent as needed to prepare a varnish.

[0360] The solvent may be any solvent as long as it can dissolve the curing component, and examples thereof include the solvents described above.

[0361] The concentration of the curing component in the varnish is, for example, 10 mass % or more, preferably 20 mass % or more, and for example, 90 mass % or less, preferably 50 mass % or less.

[0362] Thus, a curing component was prepared.

[0363] The curing agent is formed to a predetermined thickness by applying a curing component onto the adhesive layer or the substrate and drying it.

[0364] The thickness when the curing agent is applied is, for example, 1 μm or more, preferably 5 μm or more, more preferably 10 μm or more, and, for example, 1000 μm or less, preferably 800 μm or less, more preferably 500 μm or less.

[0365] Furthermore, the adhesive layer is interposed between the target object and the FBG sensor in such a manner that the adhesive layer is in contact with the FBG sensor and the curing agent is in contact with the adhesive layer.

[0366] In the adhesive layer, the adhesive component has pressure-sensitive adhesive properties before curing.

[0367] It should be noted that the pressure-sensitive adhesive property before curing refers to the pressure-sensitive adhesive property of the adhesive component before the adhesive component reacts with the curing component to completely cure the adhesive component. Specifically, it refers to the pressure-sensitive adhesive property from before the adhesive component and the curing component are mixed until the adhesive component is completely cured after mixing.

[0368] That is, the adhesive layer containing the adhesive component has pressure-sensitive adhesive properties.

[0369] Specifically, the peel adhesion of the adhesive layer to the aluminum plate is, for example, 0.5 N / 20 mm or more, preferably 1.0 N / 20 mm or more, more preferably 2.0 N / 20 mm or more, further preferably 3.0 N / 20 mm or more, particularly preferably 3.5 N / 20 mm or more, and, for example, 10 N / 20 mm or less.

[0370] When the peel adhesion of the adhesive layer to the aluminum plate is not less than the above lower limit, the adhesive layer has excellent pressure-sensitive adhesiveness, and the FBG sensor and the target object can be bonded and positioned.

[0371] The peel strength of the adhesive layer was determined by attaching a 20 mm wide adhesive layer to an aluminum plate and then peeling the adhesive layer 90 degrees from the aluminum plate at a speed of 300 mm / min.

[0372] As described above, the adhesive layer preferably has pressure-sensitive adhesiveness, so that the target object and the FBG sensor are bonded to each other via the adhesive layer and the first adhesive layer before the adhesive layer is cured. Therefore, it becomes easy to reliably position the FBG sensor to the target object.

[0373] Then, the adhesive layer reacts with the curing agent and is cured.

[0374] The reaction temperature is, for example, room temperature.

[0375] Furthermore, the adhesive layer and the curing agent may be heated as necessary, and the heating temperature is, for example, 50° C. or higher, preferably 70° C. or higher, and for example, 160° C. or lower, preferably 110° C. or lower.

[0376] The reaction temperature is preferably room temperature, which is a temperature at which the heating (for example, heating at 50° C. or higher) for reacting the adhesive layer with the curing agent is not performed, for example, less than 50° C., preferably 40° C. or lower, and for example, 10° C. or higher, preferably 20° C. or higher.

[0377] If the reaction temperature is room temperature, heating for reacting the adhesive layer and the curing agent is not required, and the FBG sensor unit 10 can be more easily bonded to the target object. In addition, the FBG sensor unit 10 can be prevented from being damaged by heating.

[0378] The reaction time is, for example, 15 minutes or more, preferably 1 hour or more, more preferably 12 hours or more, and, for example, 96 hours or less, preferably 48 hours or less. Thus, the adhesive layer is cured. Preferably, the adhesive layer is cured at room temperature.

[0379] The thickness of the adhesive layer after curing is, for example, 1 μm or more, preferably 5 μm or more, more preferably 30 μm or more, and, for example, 2000 μm or less, preferably 1000 μm or less, more preferably 500 μm or less, further preferably 100 μm or less.

[0380] The FBG sensor and the resin portion are bonded to the target object via the cured adhesive layer.

[0381] [Second base material]

[0382] The second substrate is preferably a film, preferably a resin film for protection and decoration. As the second substrate, for example, it can be a surface protection film such as a weather-resistant film such as a moisture-resistant film, a light-resistant film, a design film, a decorative film, an anti-damage film, etc. From the viewpoint of outdoor use, a weather-resistant film is preferred.

[0383] The resin constituting the resin film includes, for example, polyimide, polyethylene (PE), polypropylene (PP), fluorinated ethylene propylene copolymer (FEP), ethylene tetrafluoroethylene copolymer (ETFE), polytetrafluoroethylene (PTFE), polyethylene terephthalate (PET), tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), or polyvinylidene fluoride (PVDF), preferably polyvinylidene fluoride (PVDF).

[0384] [Second adhesive layer]

[0385] As the second adhesive layer, any adhesive layer can be used without particular limitation. For example, an adhesive layer using an acrylic polymer, silicone polymer, polyester, polyurethane, polyamide, polyvinyl ether, vinyl acetate / vinyl chloride copolymer, modified polyolefin, epoxy, fluorine, natural rubber, synthetic rubber and other rubber-based polymers as the base polymer can be appropriately selected. From the perspective of showing appropriate wettability, cohesion and adhesion, and also excellent weather resistance, heat resistance, etc., an acrylic adhesive is preferably used.

[0386] 〔Release liner〕

[0387] The first release liner and the second release liner which protect the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer until use will be described.

[0388] As the first release liner and the second release liner, conventional release papers can be used without particular limitation. For example, a substrate having a release treatment layer, a low-adhesive substrate formed of a fluorine-based polymer, a low-adhesive substrate formed of a nonpolar polymer, etc. can be used.

[0389] Examples of the substrate having a release-treated layer include plastic films and papers that have been surface-treated with a release-treating agent such as a silicone-based, long-chain alkyl-based, fluorine-based, or molybdenum sulfide-based release-treating agent.

[0390] Examples of the fluorine-based polymer of the low-adhesive substrate include polytetrafluoroethylene, polychlorotrifluoroethylene, polyethylene fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, and chlorofluoroethylene-vinylidene fluoride copolymer.

[0391] As the non-polar polymer of the low-adhesive substrate formed by the non-polar polymer, for example, olefin resins (for example, polyethylene, polypropylene, etc.) can be cited. It should be noted that the release liner can be formed by a known or conventional method. In addition, the thickness of the release liner is not particularly limited.

[0392] 〔Target object〕

[0393] There are no particular restrictions on the target object to which the FBG sensor is attached as long as it can be an object to be measured by the FBG sensor, and examples thereof include various structures such as metal products, wood products, plastic products, glass products, buildings (inner and outer walls, floors, and ceilings, roads, railways, bridges, tunnels, etc.), electronic equipment, and transportation equipment (for example, vehicles such as automobiles, two-wheeled vehicles and railways, and ships, etc.).

[0394] As described above, the following matters are disclosed in this specification. [1]

[0396] A sensor package comprising a first substrate and an optical fiber disposed on the first substrate and having an FBG sensor portion, and is intended to be attached to a target object.

[0397] The sensor package has:

[0398] A resin portion, which is located on the first substrate;

[0399] a first adhesive layer, which is located on the first substrate and is used to adhere the first substrate to the target object; and

[0400] an adhesive layer located on the surface of the resin portion opposite to the first substrate,

[0401] Here, the FBG sensor portion in the optical fiber is in contact with the resin portion and is held by the adhesive layer. [2]

[0403] In the sensor package described in the above-mentioned [1], the resin portion has adhesiveness. [3]

[0405] The sensor package according to [1] or [2], wherein the elastic modulus of the resin portion is less than 1.0×10 7 Pa. [4]

[0407] The sensor package according to any one of [1] to [3] above, wherein the adhesive layer is cured at room temperature. [5]

[0409] The sensor package according to any one of [1] to [4] above, wherein the adhesive layer is cured by a curing agent. [6]

[0411] The sensor package as described in any one of [1] to [5] above, wherein at least a portion of the entire periphery of the resin portion except for a surface on the adhesive layer side is covered with the first adhesive layer. [7]

[0413] The sensor package as described in any one of [1] to [6] above, wherein the first adhesive layer has an opening penetrating in the thickness direction.

[0414] The resin portion is provided in the opening portion. [8]

[0416] The sensor package according to any one of [1] to [7] above, wherein the surfaces of the first pressure-sensitive adhesive layer and the tackiness adhesive layer that are to be attached to the target object are protected by a first release liner. [9]

[0418] The sensor package according to any one of [1] to [8] above, wherein the first substrate is transparent or translucent.

[10]

[0420] The sensor package according to any one of [1] to [9] above, wherein a second adhesive layer and a second substrate are sequentially provided on a surface of the first substrate opposite to a surface on the first adhesive layer side.

[11]

[0422] In the sensor package described in

[10] above, the second substrate is a weather-resistant substrate.

[12]

[0424] The sensor package according to the above

[10] or

[11] further comprises a second release liner at a portion between the first substrate and the second pressure-sensitive adhesive layer.

[13]

[0426] A method for mounting a sensor package, which is the method for mounting a sensor package according to any one of [1] to

[12] above,

[0427] wherein the adhesive layer in the sensor package is cured by a curing agent,

[0428] The method for installing the sensor package comprises:

[0429] a step of applying the curing agent to at least one of the adhesive layer and the target object; and

[0430] A step of attaching the sensor package to the target object via the adhesive layer.

[14]

[0432] A method for mounting a sensor package, which is the method for mounting a sensor package according to any one of [1] to

[12] above,

[0433] wherein the adhesive layer in the sensor package is cured by a curing agent,

[0434] The method for installing the sensor package comprises:

[0435] A step of applying the curing agent to the adhesive layer;

[0436] a step of applying the curing agent to the target object; and

[0437] A step of attaching the sensor package to the target object such that the curing agent applied to the adhesive layer is in contact with the curing agent applied to the target object.

[15]

[0439] A sensor package mounting method, comprising mounting the sensor package according to any one of [1] to [5] on the target object.

[0440] The first adhesive layer and the adhesive layer in the sensor package have their surfaces on the side to be attached to the target object protected by a first release liner.

[0441] The sensor package includes the first substrate, the second adhesive layer, and the second substrate in this order on the surface of the first adhesive layer opposite to the surface to be attached to the target object.

[0442] A second release liner is provided at a portion between the first substrate and the second adhesive layer.

[0443] The method for installing the sensor package comprises:

[0444] The first release liner is peeled off and a curing agent is applied to the adhesive layer;

[0445] A step of attaching the release surface of the sensor package from which the first release liner has been peeled off to the target object; and

[0446] The second release liner is peeled off, and the release surface of the second pressure-sensitive adhesive layer from which the second release liner has been peeled off is adhered to the first substrate.

[16]

[0448] A kit comprising a curing agent and the sensor package according to any one of [1] to

[12] above.

[17]

[0450] A bonding structure is a bonding structure in which a sensor package and a target object are bonded via a cured layer, wherein the sensor package comprises a first substrate and an optical fiber disposed on the first substrate and having an FBG sensor portion.

[0451] The aforementioned bonding structure has:

[0452] A resin portion, which is located on the first substrate;

[0453] a first adhesive layer located on the first substrate; and

[0454] The cured layer is located on a surface of the resin portion that is opposite to the first substrate.

[0455] wherein the first substrate is adhered to the target object via the first adhesive layer.

[0456] The FBG sensor portion in the optical fiber is in contact with the resin portion and is held by the cured layer.

[0457] Example

[0458] Hereinafter, the present invention will be specifically described by way of Examples, but the present invention is not limited to these Examples.

[0459] [Preparation of adhesive layer]

[0460] 69 parts by mass of liquid bisphenol A epoxy resin (trade name "jER828", manufactured by Mitsubishi Chemical), 30 parts by mass of solid bisphenol A epoxy resin (trade name "jER1256", manufactured by Mitsubishi Chemical), and 1 part by mass of solid special Novolac epoxy resin (trade name "jER157S70", manufactured by Mitsubishi Chemical) are mixed. Methyl ethyl ketone is added and diluted so that the epoxy resin concentration becomes 65% by mass to prepare a varnish. It is applied to the peeling-treated surface of a peeling-treated polyethylene terephthalate film (trade name "Diafoil MRF#38", manufactured by Mitsubishi Resins Co., Ltd.) in a manner such that the thickness after drying becomes 50 μm, and heated and dried at 80°C for 3 minutes to obtain an adhesive layer. Then, the adhesive layer is brought into contact with another polyethylene terephthalate film in such a manner that the adhesive layer is sandwiched between two polyethylene terephthalate films.

[0461] [Production Example 1]

[0462] As the first adhesive layer, an adhesive layer (Hyper Joint H9004 manufactured by Nitto Denko Corporation) was cut into a size of 50 mm×30 mm, and the center portion was cut to provide an opening of 20 mm×10 mm.

[0463] The above-mentioned adhesive layer was bonded to a PET substrate (Lumirror S-10#188, manufactured by Toray Industries, Inc.) as a first substrate cut into a size of 50 mm×30 mm.

[0464] As the resin part, two adhesive sheets (CS9918U manufactured by Nitto Denko Corporation) were stacked and cut into 20 mm×10 mm, and the resin part was fitted into the opening of the adhesive layer and laminated on the PET substrate.

[0465] Furthermore, an optical fiber with a FBG sensor (the outer diameter of the optical fiber is 0.125 mm, and the outer diameter of the coating material including the optical fiber is 0.155 mm) covered with a polyimide coating material with an outer diameter of 0.155 mm is arranged in parallel with the long side of the PET substrate so that the FBG sensor is located on the resin part.

[0466] An adhesive layer cut into 20 mm×10 mm was bonded to the resin portion from above the optical fiber.

[0467] Then, a release film as the first release liner 18 is applied to produce a sensor package.

[0468] [Production Example 2]

[0469] A sensor package was manufactured in the same manner as in Manufacturing Example 1 except that the resin portion was changed to a liquid resin of silylated urethane resin (UltraVersatile SU Soft, manufactured by Konishi Corporation), poured into the opening of the adhesive layer, and cured at room temperature (25° C.) for 24 hours.

[0470] [Comparative Production Example 1]

[0471] As the first adhesive layer, two adhesive layers were prepared which were obtained by cutting an adhesive layer (Hyper Joint H9004, manufactured by Nitto Denko Corporation) into a size of 50 mm×30 mm and having an opening of 20 mm×10 mm in the center.

[0472] The first adhesive layer was placed on a release film (Diafoil MRF#38 manufactured by Mitsubishi Resins). An optical fiber with an outer diameter of 0.155 mm and an FBG sensor was placed on the release film so that the FBG sensor was located in the opening. Next, the second adhesive layer was attached from above. Thus, the gap between the optical fiber and the two adhesive layers was filled, and the FBG sensor was placed in the opening of the two adhesive layers.

[0473] Next, a room temperature curing resin obtained by mixing an epoxy resin (jER827 manufactured by Mitsubishi Chemical Corporation) and a curing agent (IBMI12 manufactured by Mitsubishi Chemical Corporation) at a mass ratio of 100:20 was filled into the opening and cured at 80°C for 30 minutes to form a resin portion.

[0474] A PET substrate (manufactured by Toray Industries, Inc., Lumirror S-10#188) as a first substrate was laminated on the adhesive layer to prepare a laminate.

[0475] The adhesive layer cut into 20 mm×10 mm was prepared. The release film was peeled off from the laminate, and the adhesive layer was bonded to the resin portion.

[0476] Then, a release film as the first release liner 18 is applied to produce a sensor package.

[0477] 〔evaluate〕

[0478] <Fixation of optical fiber>

[0479] Prepare a resin part that is cut and molded into 20mm×10mm, set a 5cm long optical fiber from the top, cover it with a release liner, and press it with a manual roller. Then, when the release liner is peeled off and turned upside down, if the fiber does not fall within 1 minute, it is considered to be fixed, and if the fiber falls within 1 minute, it is considered to be not fixed. It should be noted that since the adhesive layer is soft and the optical fiber is thin, the adhesive layer will crack due to the pressure during bonding, so if Figure 5 As shown in FIG. 1 , in the obtained sensor package, the optical fiber is partially exposed and protrudes from the adhesive layer.

[0480] <Elastic modulus of resin portion>

[0481] The elastic modulus of the resin portion is measured as follows. First, a 30 mm × 30 mm sample piece is cut from an adhesive sheet having a peel-treated PET film on both sides of the adhesive layer, one peel-treated PET film is peeled off, and the exposed adhesive layer is rolled into a cylindrical shape to prepare a sample for measurement. Then, a tensile test is performed on the prepared sample for measurement at a distance of 10 mm between chucks and a tensile speed of 50 mm / min, and the initial tensile elastic modulus (Pa) is calculated based on the slope of the initial part (tangent) of the obtained stress-strain curve.

[0482] The elastic modulus of the liquid resin is measured as follows. First, the liquid resin is applied to a PET film that has been subjected to a peeling treatment, and then covered with another PET film that has been subjected to a peeling treatment, and cured under arbitrary conditions. The PET film is peeled off from the obtained sheet, and the sheet is cut into a width of 10 mm × a length of 40 mm. A tensile test is performed with a chuck distance of 10 mm and a tensile speed of 50 mm / min, and the initial tensile elastic modulus (Pa) is obtained from the slope of the initial part (tangent) of the obtained stress-strain curve.

[0483] <Wavelength Shift>

[0484] The interrogator BraggMETER FS22 (HBM) was connected to the FBG sensor and used to measure the peak wavelength in the wavelength spectrum measured at a constant temperature (25°C). The initial wavelength before processing into a sensor package (before manufacturing) was set as (A), the wavelength after manufacturing was set as (B), and the wavelength 4 days after the sensor package was manufactured was set as (C).

[0485] Wavelength shift before and after manufacturing (nm) = BA

[0486] Wavelength shift 4 days after manufacturing (nm) = CB

[0487] [Table 1]

[0488] surface

[0489]

[0490] The results in Table 1 show that in the sensor package of the present invention, in the wavelength spectrum measured by the interrogator, there is no wavelength shift of the peak wavelength caused by the time before and after manufacturing and after manufacturing, and sensing can be performed with high accuracy. On the other hand, in the sensor package of the comparative example, the FBG sensor is embedded in the resin part, so the wavelength shift of the peak wavelength caused by the curing shrinkage and stress relaxation of the resin part can be seen.

[0491] In the above, various embodiments are described with reference to the accompanying drawings, but it goes without saying that the present invention is not limited to these examples. Obviously, those skilled in the art can think of various variations or modifications within the scope of the claims, which are also within the technical scope of the present invention. In addition, the various components in the above embodiments can also be combined arbitrarily without departing from the scope of the main purpose of the invention.

[0492] It should be noted that the present application is based on the Japanese patent application (Japanese Patent Application No. 2022-059637) filed on March 31, 2022, the contents of which are incorporated herein by reference.

[0493] Description of Reference Numerals

[0494] 100, 200, 300a, 300b, 300c sensor packages

[0495] 400 Bonding structure

[0496] 10 FBG sensor unit

[0497] 111st adhesive layer

[0498] 12 Resin Department

[0499] 13 Covering materials

[0500] 14. Bonding adhesive layer

[0501] 15. Fiber Optics

[0502] 16 2nd adhesive layer

[0503] 17 Second base material

[0504] 18 1st release liner

[0505] 19 No. 2 release liner

[0506] 19c wing

[0507] 201st base material

[0508] 30 Curing layer

[0509] 40 Target object

Claims

1. A sensor package comprising a first substrate and an optical fiber disposed on the first substrate and having an FBG sensor portion, the sensor package being intended to be attached to a target object, The sensor package has: A resin portion, which is located on the first substrate; a first adhesive layer, which is located on the first substrate and is used to adhere the first substrate to the target object; and an adhesive layer located on a surface of the resin portion opposite to the first substrate, in, The FBG sensor portion in the optical fiber is in contact with the resin portion and is held by the adhesive layer.

2. The sensor package according to claim 1, wherein: The resin portion has adhesiveness.

3. The sensor package according to claim 1, wherein: The elastic modulus of the resin portion is less than 1.0×10 7 Pa.

4. The sensor package according to claim 1, wherein: The adhesive layer is cured at room temperature.

5. The sensor package according to claim 1, wherein: The adhesive layer is cured by a curing agent.

6. The sensor package according to claim 1, wherein: At least a portion of the entire periphery of the resin portion except for the surface on the adhesive layer side is covered with the first adhesive layer.

7. The sensor package according to claim 1, wherein: The first adhesive layer has an opening penetrating in the thickness direction, The resin portion is provided in the opening portion.

8. The sensor package according to claim 1, wherein: The surfaces of the first pressure-sensitive adhesive layer and the tackiness adhesive layer that are to be attached to the target object are protected by a first release liner.

9. The sensor package according to claim 1, wherein: The first substrate is transparent or translucent.

10. The sensor package according to claim 1, wherein: The second pressure-sensitive adhesive layer and the second base material are sequentially provided on a surface of the first base material that is opposite to the surface on the first pressure-sensitive adhesive layer side.

11. The sensor package according to claim 10, wherein: The second substrate is a weather-resistant substrate.

12. The sensor package according to claim 10, wherein: A second release liner is provided at a portion between the first substrate and the second pressure-sensitive adhesive layer.

13. A method for mounting a sensor package, the method for mounting a sensor package according to any one of claims 1 to 12, in, The adhesive layer in the sensor package is cured by a curing agent, The method for installing the sensor package comprises: a step of applying the curing agent to at least one of the adhesive layer and the target object; and A step of attaching the sensor package to the target object via the adhesive layer.

14. A method for mounting a sensor package, the method for mounting a sensor package according to any one of claims 1 to 12, in, The adhesive layer in the sensor package is cured by a curing agent, The method for installing the sensor package comprises: The step of applying the curing agent to the adhesive layer; a step of applying the curing agent to the target object; and A step of attaching the sensor package to the target object such that the curing agent applied to the adhesive layer is in contact with the curing agent applied to the target object.

15. A sensor package mounting method, comprising mounting the sensor package according to any one of claims 1 to 5 on the target object, in, The surfaces of the first pressure-sensitive adhesive layer and the adhesive layer in the sensor package that are to be attached to the target object are protected by a first release liner. The sensor package includes the first substrate, the second adhesive layer, and the second substrate in this order on a surface of the first adhesive layer opposite to a surface to be attached to the target object. A second release liner is provided at a portion between the first substrate and the second adhesive layer, The method for installing the sensor package comprises: The step of peeling off the first release liner and applying a curing agent to the adhesive layer; A step of attaching the release surface of the sensor package from which the first release liner has been peeled off to the target object; and The second release liner is peeled off, and the release surface of the second pressure-sensitive adhesive layer from which the second release liner has been peeled off is adhered to the first substrate. 16 . A kit comprising a curing agent and the sensor package according to claim 1 .

17. A bonding structure, wherein a sensor package and a target object are bonded to each other via a cured layer, wherein the sensor package comprises a first substrate and an optical fiber disposed on the first substrate and having an FBG sensor portion. The bonding structure has: A resin portion, which is located on the first substrate; a first adhesive layer located on the first substrate; and The cured layer is located on a surface of the resin portion that is opposite to the first substrate. in, The first substrate is adhered to the target object via the first adhesive layer. The FBG sensor portion in the optical fiber is in contact with the resin portion and is held by the cured layer.

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