Refrigeration equipment

Abstract

The invention relates to the technical field of refrigeration of electronic equipment, and discloses refrigeration equipment. The refrigeration equipment comprises a shell, an electrocaloric refrigeration assembly and a heat dissipation device. A storage space is defined in the shell, the shell comprises a back plate and side plates, and the face, back to the storage space, of the back plate and the side plates define a refrigeration heat transfer space. The electrocaloric refrigeration assembly is arranged in the refrigeration heat transfer space and comprises a cold end heat exchanger, and the cold end heat exchanger is arranged close to the back plate. The heat dissipation device is arranged in the refrigeration heat transfer space and used for dissipating heat of the electrocaloric refrigeration assembly. The electrocaloric refrigeration assembly is used for refrigeration and combined with the heat dissipation device for heat dissipation, so that the refrigeration equipment is low in noise and vibration in the operation process.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment refrigeration, for example, to a refrigeration device. Background Art

[0002] At present, refrigeration equipment refers to equipment mainly used for refrigerating food and various types of goods. It is mainly composed of a compressor, an expansion valve, an evaporator, a condenser, accessories, and pipelines.

[0003] In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art:

[0004] However, most refrigeration equipment uses the steam compression method, and the compressor produces loud noise and vibration, which is not conducive to the storage of delicate products.

[0005] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0006] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0007] The embodiment of the present disclosure provides a refrigeration device, which uses an electric card refrigeration component for refrigeration and combines it with a heat dissipation device for heat dissipation, so that the refrigeration device operates with low noise and low vibration.

[0008] In some embodiments, the refrigeration device includes a housing, an electric card refrigeration assembly, and a heat dissipation device. The storage space is defined inside the housing, and the housing includes a back plate and a side plate. The back plate faces away from the storage space and is enclosed with the side plate to form a refrigeration heat transfer space. The electric card refrigeration assembly is arranged in the refrigeration heat transfer space, and the electric card refrigeration assembly includes a cold end heat exchanger, and the cold end heat exchanger is arranged close to the back plate. The heat dissipation device is arranged in the refrigeration heat transfer space, and the heat dissipation device is used to dissipate the heat of the electric card refrigeration assembly.

[0009] Optionally, the heat dissipation device includes an air inlet fan and an air outlet fan, and the electric card refrigeration component is vertically arranged between the air inlet fan and the air outlet fan. The air inlet fan is arranged at the lower part of the back plate, and the air outlet fan is arranged at the upper part of the back plate, or the air inlet fan is arranged at the upper part of the back plate, and the air outlet fan is arranged at the lower part of the back plate.

[0010] Optionally, the refrigeration device further comprises a plurality of air outlet converging parts and a plurality of air inlet dispersing parts. The plurality of air outlet converging parts are arranged on both sides of the air outlet fan, and one end of each air outlet converging part is connected to the air outlet fan, and the other end is connected to the side plate. The plurality of air inlet dispersing parts are arranged on both sides of the air inlet fan, and one end of each air inlet dispersing part is connected to the air inlet fan, and the other end is connected to the side plate. The air outlet converging parts and / or the air inlet dispersing parts are arc-shaped, and the arc faces the electric card refrigeration assembly.

[0011] Optionally, the heat dissipation device includes a heat dissipation fan. The heat dissipation fan is arranged on the upper side or the lower side of the electric card refrigeration component to dissipate the heat of the electric card refrigeration component from the lower end or the upper end of the back plate.

[0012] Optionally, the heat dissipation device includes an air inlet fan and an air outlet fan, and the air inlet fan and the air outlet fan are arranged on both sides of the lower part or the upper part of the back plate, so that the refrigeration equipment can take in air and exhaust air from both sides of the lower part or the upper part of the back plate.

[0013] Optionally, the shell includes a bottom plate and a top plate. The refrigeration device further includes a barrier, which includes a vertical barrier portion and a horizontal barrier portion connected to each other. The vertical barrier portion is arranged between the air inlet fan and the air outlet fan. When the air inlet fan and the air outlet fan are arranged on both sides of the lower part of the back plate, the horizontal barrier portion is arranged on the outer surface of the bottom plate of the refrigeration device; when the air inlet fan and the air outlet fan are arranged on both sides of the upper part of the back plate, the horizontal barrier portion is arranged on the outer surface of the top plate of the refrigeration device. The barrier and the shell form a separated air inlet duct and air outlet duct.

[0014] Optionally, the refrigeration device further comprises one or more partitions, which divide the storage space into a plurality of sub-storage spaces. There are a plurality of electric card refrigeration components, which are respectively arranged in part or all of the sub-storage spaces, and a separator is arranged between adjacent electric card refrigeration components.

[0015] Optionally, the electric card refrigeration assembly further includes an electric card refrigeration chip and a hot end heat exchanger. The electric card refrigeration chip includes an electric card element, a heat receiving end and a cold receiving end, the heat receiving end is used to receive the heat of the electric card element, and the cold receiving end is used to receive the cold of the electric card element. The hot end heat exchanger is thermally connected to the heat receiving end of the electric card refrigeration chip. Among them, the cold end heat exchanger is thermally connected to the cold receiving end of the electric card refrigeration chip.

[0016] Optionally, the electric card refrigeration chip further includes a clamping frame. The clamping frame includes a first clamping frame clamped on a first side of a first end of the electric card element, and a second clamping frame clamped on a second side of the first end of the electric card element. The heat receiving end is arranged on the side of the first clamping frame for receiving heat from the electric card element, and the cold receiving end is arranged on the side of the second clamping frame for receiving cold from the electric card element.

[0017] Optionally, the electric card element includes a first electrode layer, a second electrode layer and a piezoelectric functional film layer. The piezoelectric functional film layer is arranged between the first electrode layer and the second electrode layer, and the piezoelectric functional film layer includes a piezoelectric cooling area and a piezoelectric displacement area formed by partitioning the piezoelectric film layer, wherein the piezoelectric displacement area is used to drive the piezoelectric cooling area to generate displacement.

[0018] The refrigeration equipment provided by the embodiments of the present disclosure can achieve the following technical effects:

[0019] The refrigeration equipment includes a shell, an electric card refrigeration component and a heat dissipation device. The electric card refrigeration component periodically dissipates heat or absorbs heat through the electric card effect, that is, releases heat or cold. The cold end heat exchanger in the electric card component is arranged close to the back plate, and the cold energy emitted by the electric card refrigeration component is transferred to the refrigeration equipment to achieve cooling of the internal storage space of the refrigeration equipment. The heat dissipation device dissipates the heat emitted by the electric card refrigeration component. Compared with the high vibration and high noise caused by compressor refrigeration, the refrigeration method in which the electric card refrigeration component and the heat dissipation device cooperate has low vibration, low noise, and occupies a small space. Furthermore, after the electric card refrigeration component and the heat dissipation device are arranged on the back plate of the shell, the heat dissipation device dissipates heat from the upper or lower end of the shell, and the heat dissipation has no effect on the side plate of the refrigeration equipment, that is, the heat dissipation of the refrigeration equipment has no requirements for the side space. In particular, when the refrigeration equipment is an embedded refrigeration equipment, there is no need to consider the left and right directions to reserve heat dissipation space during embedded installation, which can improve the home decoration integration effect.

[0020] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a scale limitation, and wherein:

[0022] Figure 1 is a structural schematic diagram of a refrigeration device provided by an embodiment of the present disclosure;

[0023] Figure 2 is a structural schematic diagram of another refrigeration device provided by an embodiment of the present disclosure;

[0024] Figure 3 is a structural schematic diagram of another refrigeration device provided by an embodiment of the present disclosure;

[0025] Figure 4 is a structural schematic diagram of another refrigeration device provided by an embodiment of the present disclosure;

[0026] Figure 5 is a structural schematic diagram of another refrigeration device provided by an embodiment of the present disclosure;

[0027] Figure 6 is a structural schematic diagram of another refrigeration device provided by an embodiment of the present disclosure;

[0028] Figure 7 It is a structural schematic diagram of an electric card refrigeration component in a refrigeration device provided in an embodiment of the present disclosure;

[0029] Figure 8 It is a schematic diagram of the structure of an electric card refrigeration chip in a refrigeration device provided by an embodiment of the present disclosure;

[0030] Fig. 9 is a schematic diagram of the structure of an electric card refrigeration chip in another refrigeration device provided by an embodiment of the present disclosure;

[0031] Fig.10 is a schematic diagram of the structure of an electric card refrigeration chip in another refrigeration device provided by an embodiment of the present disclosure;

[0032] Fig.11 is a schematic diagram of the structure of an electric card element in a refrigeration device provided by an embodiment of the present disclosure;

[0033] Fig.12 is a schematic diagram of the structure of an electric card element in another refrigeration device provided by an embodiment of the present disclosure;

[0034] Fig.13 It is a schematic diagram of the structure of an electric card element in another refrigeration device provided in an embodiment of the present disclosure.

[0035] Reference numerals:

[0036] 1: first electrode layer; 11: electric card cooling electrode area; 12: piezoelectric drive electrode area; 13: electrode gap;

[0037] 2: second electrode layer;

[0038] 3: the third electrode layer;

[0039] 4: piezoelectric functional film layer; 41: piezoelectric displacement unit; 42: piezoelectric refrigeration unit; 431: first through-division gap; 432: first through-division piezoelectric displacement unit; 433: second through-division gap; 441: first inlay division gap; 442: first inlay piezoelectric displacement unit; 443: second inlay division gap;

[0040] 5: basal layer;

[0041] 100: electric card components;

[0042] 201: first clamping frame; 202: second clamping frame; 203: first bending gap; 204: second bending gap; 205: supporting frame;

[0043] 300: heat receiving end;

[0044] 400: cold receiving end;

[0045] 500: housing; 501: back plate; 502: side plate; 503: bottom plate; 504: top plate; 505: partition plate; 506: spacer;

[0046] 600: electric card refrigeration component; 601: cold end heat exchanger; 602: electric card refrigeration chip; 603: hot end heat exchanger;

[0047] 701: air inlet fan; 702: air outlet fan; 703: cooling fan;

[0048] 801: air inlet dispersion component; 802: air outlet collection component;

[0049] 901: vertical barrier; 902: horizontal barrier. DETAILED DESCRIPTION

[0050] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0051] The terms "first", "second", etc. in the specification and claims of the disclosed embodiments and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate to describe the disclosed embodiments here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0052] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0053] In addition, the terms "disposed", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0054] Unless otherwise stated, the term "plurality" means two or more.

[0055] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B indicates: A or B.

[0056] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.

[0057] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

[0058] At present, refrigeration equipment refers to equipment mainly used for refrigerating food and various types of goods. It is mainly composed of compressors, expansion valves, evaporators, condensers, accessories, and pipelines. However, most refrigeration equipment uses the steam compression method, and the compressor has high noise and vibration during operation, which is not conducive to the storage of delicate products.

[0059] The disclosed embodiment of the present invention discloses a refrigeration device, which uses an electric card refrigeration assembly 600 for refrigeration and combines it with a heat dissipation device for heat dissipation, so that the refrigeration device operates with low noise and low vibration.

[0060] Combination Figure 1-13 As shown, the embodiment of the present disclosure provides a refrigeration device, including a shell 500, an electric card refrigeration assembly 600 and a heat dissipation device. The shell 500 defines a storage space inside, and the shell 500 includes a back plate 501 and a side plate 502. The back plate 501 faces away from the storage space and is enclosed with the side plate 502 to form a refrigeration heat transfer space. The electric card refrigeration assembly 600 is arranged in the refrigeration heat transfer space, and the electric card refrigeration assembly 600 includes a cold end heat exchanger 601, and the cold end heat exchanger 601 is arranged close to the back plate 501. The heat dissipation device is arranged in the refrigeration heat transfer space, and the heat dissipation device is used to dissipate the heat of the electric card refrigeration assembly 600.

[0061] The refrigeration device includes a housing 500, an electric card refrigeration component 600 and a heat dissipation device. The electric card refrigeration component 600 periodically dissipates heat or absorbs heat through the electric card effect, that is, releases heat or cold. The cold end heat exchanger 601 in the electric card component is arranged close to the back plate 501, and transfers the cold energy emitted by the electric card refrigeration component 600 to the refrigeration device to achieve cooling of the internal storage space of the refrigeration device. The heat dissipation device dissipates the heat emitted by the electric card refrigeration component 600. Compared with the high vibration and high noise caused by compressor refrigeration, the refrigeration method in which the electric card refrigeration component 600 and the heat dissipation device cooperate has low vibration, low noise, and occupies a small space. Furthermore, after the electric card refrigeration component 600 and the heat dissipation device are arranged on the back plate 501 of the housing 500, the heat dissipation device dissipates heat from the upper end or lower end of the housing 500, and the heat dissipation has no effect on the side plate 502 of the refrigeration device, that is, the heat dissipation of the refrigeration device has no requirements for the side space. Especially when the refrigeration equipment is an embedded refrigeration equipment, there is no need to consider reserving heat dissipation space in the left and right directions when the refrigeration equipment is embedded and installed, which can improve the integrated effect of home decoration.

[0062] Optionally, the heat dissipation device includes an air inlet fan 701 and an air outlet fan 702, and the electric card refrigeration assembly 600 is vertically arranged between the air inlet fan 701 and the air outlet fan 702. The air inlet fan 701 is arranged at the lower part of the back plate 501, and the air outlet fan 702 is arranged at the upper part of the back plate 501, or the air inlet fan 701 is arranged at the upper part of the back plate 501, and the air outlet fan 702 is arranged at the lower part of the back plate 501.

[0063] The heat dissipation device includes an air inlet fan 701 and an air outlet fan 702, which are respectively arranged at the upper part or the lower part of the back plate 501 to realize air inlet and outlet from the upper and lower parts of the back plate 501. The electric card cooling assembly 600 is arranged between the air inlet fan 701 and the air outlet fan 702, so that the airflow formed by the heat dissipation device flows through the electric card cooling assembly 600 to remove the heat of the electric card cooling assembly 600. Specifically, the air inlet fan 701 is arranged at the lower part of the back plate 501, and the air outlet fan 702 is arranged at the upper part of the back plate 501. Figure 1 As shown. At this time, the incoming air flows into the cooling and heat transfer space from the air inlet fan 701 at the bottom, and after flowing through the electric card refrigeration component 600, it flows out from the top under the action of the top air outlet fan 702 to dissipate heat. Alternatively, the air inlet fan 701 is arranged at the upper part of the back plate 501, and the air outlet fan 702 is arranged at the lower part of the back plate 501. At this time, the incoming air flows into the cooling and heat transfer space from the air inlet fan 701 at the top, and after flowing through the electric card refrigeration component 600, it flows out from the bottom under the action of the bottom air outlet fan 702 to dissipate heat. In order to make the inlet and outlet air flow smoothly, a distance can be set between the top plate 504 and the bottom plate 503 of the shell 500 and the top and bottom ends of the side plate 502, that is, Figure 1 As shown in FIG, air ducts are provided at the upper and lower ends of the refrigeration equipment to facilitate air flow.

[0064] Optionally, the refrigeration device further includes a plurality of air outlet converging members 802 and a plurality of air inlet dispersing members 801. The plurality of air outlet converging members 802 are arranged on both sides of the air outlet fan 702, and one end of each air outlet converging member 802 is connected to the air outlet fan 702, and the other end is connected to the side plate 502. The plurality of air inlet dispersing members 801 are arranged on both sides of the air inlet fan 701, and one end of each air inlet dispersing member 801 is connected to the air inlet fan 701, and the other end is connected to the side plate 502. The air outlet converging member 802 and / or the air inlet dispersing member 801 are arc-shaped, and the arc faces the electric card refrigeration assembly 600.

[0065] In order to improve the heat dissipation efficiency, arc-shaped air outlet collecting parts 802 are arranged on both sides of the air outlet fan 702, and the arc is facing the electric card refrigeration component 600, so that the airflow flowing through the electric card refrigeration component 600 is collected at the air outlet fan 702, which is convenient for the air outlet fan 702 to guide the air. Arc-shaped air inlet dispersing parts 801 are arranged on both sides of the air inlet fan 701. When the refrigeration equipment includes multiple temperature zones and each temperature zone is correspondingly provided with an electric card refrigeration component 600, the air inlet dispersing parts 801 guide the incoming air to multiple electric card refrigeration components 600, so that multiple temperature zones can achieve cooling.

[0066] Optionally, the heat dissipation device includes a heat dissipation fan 703. The heat dissipation fan 703 is disposed on the upper side or the lower side of the electric card cooling assembly 600 to dissipate the heat of the electric card cooling assembly 600 from the lower end or the upper end of the back plate 501.

[0067] Combination Figure 2 As shown, the heat dissipation device can also be provided in the form of multiple heat dissipation fans 703, which are provided on the upper side or the lower side of the electric card cooling assembly 600, that is, a single fan corresponds to a single electric card cooling assembly 600, so as to dissipate the heat of the electric card cooling assembly 600 from the lower end or the upper end of the back plate 501. Similarly, in order to make the inlet and outlet air flow smooth, the top plate 504 and the bottom plate 503 of the housing 500 can be provided with a spacing from the top and bottom ends of the side plates 502, that is, Figure 2 As shown in FIG, air ducts are provided at the upper and lower ends of the refrigeration equipment to facilitate air flow.

[0068] Optionally, the heat dissipation device includes an air inlet fan 701 and an air outlet fan 702, and the air inlet fan 701 and the air outlet fan 702 are arranged on both sides of the lower or upper part of the back plate 501, so that the refrigeration equipment can take in and out air from both sides of the lower or upper part of the back plate 501.

[0069] Combination Figure 3 As shown, when the heat dissipation device is configured as an air inlet fan 701 and an air outlet fan 702, it can also be configured as a form of air inlet and outlet on both sides. Specifically, the air inlet fan 701 can be arranged on the left side of the back plate 501, and the air outlet fan 702 can be arranged on the right side of the back plate 501, such as Figure 3, at this time, the air enters from the left bottom side, flows through the electric card refrigeration component 600 and is discharged from the right bottom side. Alternatively, the air inlet fan 701 can be set on the right side of the back plate 501, and the air outlet fan 702 can be set on the left side of the back plate 501. At this time, the air enters from the right bottom side, flows through the electric card refrigeration component 600 and is discharged from the left bottom side. In order to make the air in and out flow smoothly, a gap can be set between the bottom plate 503 of the housing 500 and the bottom end of the side plate 502, and an air duct is left at the lower end of the refrigeration device to facilitate air flow.

[0070] It is understandable that in the air inlet and outlet form on both sides, the air inlet fan 701 and the air outlet fan 702 can also be arranged on both sides of the upper part of the back plate 501. At the same time, an air duct is left at the upper end of the refrigeration equipment to facilitate air flow.

[0071] Optionally, the shell 500 includes a bottom plate 503 and a top plate. The refrigeration device also includes a barrier, which includes a vertical barrier portion 901 and a horizontal barrier portion 902 connected to each other. The vertical barrier portion 901 is arranged between the air inlet fan 701 and the air outlet fan 702. When the air inlet fan 701 and the air outlet fan 702 are arranged on both sides of the lower part of the back plate 501, the horizontal barrier portion 902 is arranged on the outer surface of the bottom plate 503 of the refrigeration device; when the air inlet fan 701 and the air outlet fan 702 are arranged on both sides of the upper part of the back plate 501, the horizontal barrier portion 902 is arranged on the outer surface of the top plate of the refrigeration device. The barrier and the shell 500 form a separated air inlet duct and air outlet duct.

[0072] Since the air inlet fan 701 and the air outlet fan 702 are in the same plane when the air is in and out from both sides, a blocking member is provided to prevent the air inlet and the air outlet from interfering with each other. Figure 3 As shown, the air inlet fan 701 and the air outlet fan 702 are arranged on both sides of the lower part of the back plate 501, and the barrier includes a vertical barrier portion 901 arranged between the air inlet fan 701 and the air outlet fan 702 and a horizontal barrier portion 902 arranged on the outer surface of the bottom plate 503. The barrier, the side plate 502 and the back plate 501 are enclosed to form a separate air inlet duct and air outlet duct, which can reduce the mutual interference between the air inlet and the air outlet. Similarly, when the air inlet fan 701 and the air outlet fan 702 are arranged on both sides of the upper part of the back plate 501, the barrier includes a vertical barrier portion 901 arranged between the air inlet fan 701 and the air outlet fan 702 and a horizontal barrier portion 902 arranged on the outer surface of the top plate. The barrier, the side plate 502 and the back plate 501 are enclosed to form a separate air inlet duct and air outlet duct, which can reduce the mutual interference between the air inlet and the air outlet.

[0073] Optionally, the refrigeration device further includes one or more partitions 505, and the one or more partitions 505 divide the storage space into multiple sub-storage spaces. There are multiple electric card refrigeration components 600, which are respectively arranged in part or all of the sub-storage spaces, and isolation members 506 are arranged between adjacent electric card refrigeration components 600.

[0074] Combination Figures 4 to 6 As shown, the refrigeration equipment can be a single temperature zone or can be set to multiple temperature zones. Multiple temperature zones can meet the needs of zoned storage of multiple items. Specifically, one or more partitions 505 are provided to divide the storage space into multiple sub-storage spaces. At the same time, corresponding to the multiple temperature zones, the electric card refrigeration component 600 also needs to be provided in multiple locations, which are respectively provided in part or all of the sub-storage spaces. And in order to achieve the correspondence between the electric card refrigeration component 600 and the temperature zone, different electric card refrigeration components 600 need to be separated by an isolator 506. The specific shape of the isolator 506 is not limited. For example, Figure 1 and Figure 2 As shown, the isolation member 506 is a vertical plate structure, which is used to separate each electric card cooling assembly 600. In another exemplary embodiment, Figure 3 As shown, the isolation member 506 is a flat plate structure, and is disposed between adjacent electric card cooling components 600. While separating the electric card cooling components 600, the isolation member 506 also cooperates with the back plate 501 to form an air duct so that the incoming air flows to each electric card cooling component 600.

[0075] Optionally, the electric card refrigeration component 600 further includes an electric card refrigeration chip 602 and a hot end heat exchanger 603. The electric card refrigeration chip 602 includes an electric card element 100, a heat receiving end 300 and a cold receiving end 400, wherein the heat receiving end 300 is used to receive heat from the electric card element 100, and the cold receiving end 400 is used to receive cold from the electric card element 100. The hot end heat exchanger 603 is thermally connected to the heat receiving end 300 of the electric card refrigeration chip 602. Among them, the cold end heat exchanger 601 is thermally connected to the cold receiving end 400 of the electric card refrigeration chip 602.

[0076] Combination Figure 7 As shown, the electric card refrigeration assembly 600 includes an electric card element 100, a heat receiving end 300 and a cold receiving end 400, and is thermally connected in a sandwich structure. Optionally, it also includes a heat dissipation fin, which is arranged on the hot end heat exchanger 603 and / or the cold end radiator side. Optionally, the hot end heat exchanger 603 and the cold end heat exchanger 601 include a phase change heat exchanger. The phase change heat exchanger uses the principle of gravity heat pipe to quickly separate the cold and heat generated by the electric card module to the phase change heat exchanger. When the electric field is applied, the electric card element 100 heats up, and the heat is transferred to the hot end heat exchanger 603. The refrigerant in the phase change heat exchanger is heated and vaporized (evaporation end), and the gas rises rapidly, and heat exchange is performed at the upper part of the heat exchanger (condensation end). After condensing into liquid, it returns to the lower part of the heat exchanger due to gravity. This cycle is repeated to achieve efficient heat dissipation at the hot end. When the electric field is removed, the temperature of the electric card element 100 decreases. At this time, the temperature in the refrigeration device is higher than the temperature of the electric card refrigeration assembly 600. Therefore, the heat in the refrigeration device is exchanged with the electric card module through the cold end phase change heat exchanger, so that the temperature in the refrigeration device decreases rapidly.

[0077] Optionally, the electric card element 100 includes a first electrode layer 1, a second electrode layer 2 and a piezoelectric functional film layer 4. The piezoelectric functional film layer 4 is disposed between the first electrode layer 1 and the second electrode layer 2, and the piezoelectric functional film layer 4 includes a piezoelectric refrigeration zone and a piezoelectric displacement zone formed by partitioning the piezoelectric film layer, wherein the piezoelectric displacement zone is used to drive the piezoelectric refrigeration zone to generate displacement.

[0078] The electrocaloric element 100 includes a first electrode layer 1, a second electrode layer 2, and a piezoelectric functional film layer 4 disposed between the first electrode layer 1 and the second electrode layer 2. The piezoelectric functional film layer 4 includes a piezoelectric refrigeration zone and a piezoelectric displacement zone. By applying a voltage to the first electrode layer 1 and the second electrode layer 2, an electric field is formed between the first electrode layer 1 and the second electrode layer 2, and different functional zones of the piezoelectric functional film layer 4 correspondingly realize different functional effects. When a positive electric field is applied to the piezoelectric refrigeration zone and the piezoelectric displacement zone at the same time, the piezoelectric functional film layer 4 simultaneously excites the piezoelectric effect and the electrocaloric effect, and a positive displacement and heat release occur; when the piezoelectric refrigeration zone stops applying an electric field and the piezoelectric displacement zone applies a reverse electric field, the piezoelectric refrigeration zone absorbs heat due to the electrocaloric effect, and the piezoelectric displacement zone reversely displaces due to the piezoelectric effect, thereby driving the piezoelectric functional film layer 4 to reversely displace. Through the different functional partitions of the piezoelectric functional film layer 4, the electrocaloric effect releases heat and absorbs heat in opposite directions, effectively realizing the separation of heat and improving the heat exchange efficiency. The piezoelectric functional film layer 4 of the electric card element 100 includes a piezoelectric displacement zone, so that the electric card element 100 integrates a thermal switch form, avoiding a large resistance caused by a movable heat transfer structure of an external device.

[0079] Optionally, the piezoelectric refrigeration zone includes one or more piezoelectric refrigeration units 42; the piezoelectric displacement zone includes one or more piezoelectric displacement units 41. By setting the relative positions of the multiple piezoelectric refrigeration units 42 and the piezoelectric displacement units 41, the piezoelectric displacement zone can better drive the piezoelectric functional film layer 4 to reversely displace when the piezoelectric refrigeration zone absorbs heat, thereby realizing the separation of the positions of heat release and heat absorption of the electric card element 100.

[0080] Optionally, the piezoelectric refrigeration zone includes a plurality of piezoelectric refrigeration units 42, and the plurality of piezoelectric refrigeration units 42 are arranged in an array. And / or, the piezoelectric displacement zone includes a plurality of piezoelectric displacement units 41, and the plurality of piezoelectric displacement units 41 are arranged in an array. The plurality of piezoelectric refrigeration units 42 are arranged in an array so that the heat release or heat absorption of each part of the electric card element 100 is balanced, which is convenient for heat dissipation during heat release or heat entry during heat absorption. The plurality of piezoelectric displacement units 41 are arranged in an array so that when the electric card element 100 absorbs heat in the piezoelectric refrigeration zone, the force of the piezoelectric displacement zone driving the electric card element 100 to displace in the opposite direction is evenly applied to the electric card element 100, so that each part of the electric card element 100 is synchronously displaced in the opposite direction, which is convenient for the electric card element 100 to fit the heat transfer medium.

[0081] Optionally, the piezoelectric refrigeration zone includes a plurality of piezoelectric refrigeration units 42, and two adjacent piezoelectric refrigeration units 42 are arranged at intervals. The piezoelectric displacement zone includes a plurality of piezoelectric displacement units 41, and two adjacent piezoelectric displacement units 41 are arranged at intervals. Two adjacent piezoelectric refrigeration units 42 among the plurality of piezoelectric refrigeration units 42 are arranged at intervals, and other functional modules, such as a piezoelectric displacement unit 41, can be arranged between two adjacent piezoelectric refrigeration units 42 on the basis of balanced heat release or heat absorption of various parts of the electric card element 100, which is convenient for heat dissipation during heat release or heat entry during heat absorption. Similarly, two adjacent piezoelectric displacement units 41 among the plurality of piezoelectric displacement units 41 are arranged at intervals, and other functional modules, such as a piezoelectric refrigeration unit 42, can be arranged between two adjacent piezoelectric displacement units 41 on the basis of balanced application of the force of the piezoelectric displacement zone to drive the electric card element 100 to reverse displacement when the electric card element 100 absorbs heat in the piezoelectric refrigeration zone.

[0082] Optionally, the piezoelectric cooling units 42 and the piezoelectric displacement units 41 are arranged alternately and spaced apart from each other. When the piezoelectric cooling area absorbs heat due to the electrocaloric effect, the piezoelectric displacement unit 41 can reversely displace and drive the adjacent piezoelectric cooling unit 42 to reversely displace, thereby causing the electrocaloric element 100 to reversely displace and have a high flatness after displacement, so that the electrocaloric element 100 can be attached to the heat transfer medium for heat transfer.

[0083] Optionally, a separation gap for separating the two functional unit areas is provided between adjacent piezoelectric cooling units 42 and piezoelectric displacement units 41. Providing the separation gap can partition the functional unit area so that the piezoelectric cooling unit 42 can excite the electrocaloric effect and the piezoelectric displacement unit 41 can excite the piezoelectric effect without affecting each other.

[0084] Optionally, the piezoelectric displacement zone includes a through-type piezoelectric displacement unit 41, wherein the through-type piezoelectric displacement unit 41 includes a first through-type partition gap 431 and a second through-type partition gap 433, wherein the first through-type partition gap 431 and the second through-type partition gap 433 both penetrate the piezoelectric film layer; and, a first through-type piezoelectric displacement unit 432 is arranged between the first through-type partition gap 431 and the second through-type partition gap 433.

[0085] Fig.12 FIG. 1 shows an electric card element 100 including a through-type piezoelectric displacement unit 41. The through-type piezoelectric displacement unit 41 includes a first through-type partition gap 431, a first through-type piezoelectric displacement unit 432, and a second through-type partition gap 433, which are arranged in sequence. Figure 2As shown in , the first through-division gap 431 and the second through-division gap 433 are at the same height as the first through-division gap 432, that is, the first through-division gap 431 and the second through-division gap 433 both penetrate the piezoelectric film layer. This arrangement can avoid the first through-division gap 432 from interfering with the piezoelectric refrigeration units 42 adjacent on both sides. In addition, by setting the piezoelectric displacement zone as the through-type piezoelectric displacement unit 41, the piezoelectric displacement zone and the piezoelectric refrigeration zone can share the second electrode layer 2. In the preparation method, the preparation of the electrode layer only requires etching the first electrode layer 1, and no secondary etching of the electrode layer is required.

[0086] Specifically, a forward voltage is applied to the first electrode layer 1 and the second electrode layer 2, and a forward electric field is formed between the first electrode layer 1 and the second electrode layer 2. At this time, the piezoelectric displacement zone and the piezoelectric refrigeration zone of the piezoelectric functional film layer 4 simultaneously stimulate the electrocaloric effect and the piezoelectric effect, and the electrocaloric element 100 displaces forward and releases heat. Afterwards, the electrocaloric refrigeration electrode zone 11 in the first electrode layer 1 is powered off, that is, the corresponding electric field of the piezoelectric refrigeration zone is removed, and the piezoelectric refrigeration zone stimulates the electrocaloric effect to absorb heat; a reverse voltage is applied to the piezoelectric driving electrode zone 12 in the first electrode layer 1 and the second electrode layer 2, and a reverse electric field is formed between the first electrode layer 1 and the second electrode layer 2, and the piezoelectric displacement zone stimulates the piezoelectric effect to reversely displace. The electrocaloric element 100 releases heat and displaces forward, and absorbs heat and displaces reversely, realizing heat separation.

[0087] Optionally, the electric card element 100 further includes a base layer 5. The base layer 5 is disposed at the lower part of the second electrode layer 2. The piezoelectric functional film layer 4, the first electrode layer 1 and the second electrode layer 2 are combined to form a thin film structure. The base layer 5 is disposed at the lower part of the second electrode layer 2 of the electric card element 100 to support the thin film structure and provide an operating platform during preparation. The provision of the base layer 5 can also maintain the flatness of the electric card element 100, so that the electric card element 100 can be close to the heat transfer medium when transferring heat.

[0088] Optionally, the first electrode layer 1 is provided with an electrode gap 13, and the electrode gap 13 divides the first electrode layer 1 into an electric card cooling electrode area 11 and a piezoelectric driving electrode area 12. Among them, the electric card cooling electrode area 11 corresponds to the piezoelectric cooling area, and the piezoelectric driving electrode area 12 corresponds to the piezoelectric displacement area. A positive electric field is applied to the electric card cooling electrode area 11 and the piezoelectric driving electrode area 12, so that the piezoelectric displacement area and the piezoelectric cooling area produce displacement in the first direction; or, the electric field of the electric card cooling motor area is removed, and the piezoelectric cooling area of ​​the piezoelectric functional film layer 4 absorbs heat. At the same time, a reverse electric field is applied to the piezoelectric driving electrode area 12, so that the piezoelectric displacement area drives the heat-absorbing piezoelectric cooling area to produce displacement in the second direction.

[0089] Corresponding to the two different functional units of the piezoelectric refrigeration area and the piezoelectric displacement area, different electric fields need to be applied to the electrodes to stimulate different functional effects. Therefore, the first electrode layer 1 is provided with an electrode gap 13, so that the first electrode layer 1 is separated to form an electric card refrigeration electrode area 11 corresponding to the piezoelectric refrigeration area and a piezoelectric driving electrode area 12 corresponding to the piezoelectric displacement area, and different electric fields are applied to the electric card refrigeration electrode area 11 and the second electrode layer 2 and the piezoelectric driving electrode area 12 and the second electrode layer 2 to achieve the stimulation of different functional effects.

[0090] Optionally, the electrode gap 13 is arranged corresponding to the partition gap.

[0091] Optionally, the electrode gap 13 is connected to the partition gap to form a through gap. The electrode gap 13 corresponds to the partition gap, and when different electric fields are applied to different areas of the first electrode layer 1, different functional effects can be stimulated in the functional areas corresponding to the electrode areas. Furthermore, the electrode gap 13 is connected to the partition gap so that adjacent different functional units do not affect each other.

[0092] Optionally, the thickness of the deposited piezoelectric film layer is greater than or equal to 8 μm and less than or equal to 20 μm. Specifically, the thickness of the piezoelectric film layer can be 8 μm, 10 μm, 12 μm, 14 μm, 16 μm, 18 μm or 20 μm.

[0093] Combination Fig.13 As shown, the embodiment of the present disclosure also provides an electric card element 100, which includes a first electrode layer 1, a second electrode layer 2 and a piezoelectric functional film layer 4. The piezoelectric functional film layer 4 is arranged between the first electrode layer 1 and the second electrode layer 2, and the piezoelectric functional film layer 4 includes a piezoelectric refrigeration zone and a piezoelectric displacement zone formed by partitioning the piezoelectric film layer. The piezoelectric displacement zone is used to drive the piezoelectric refrigeration zone to generate displacement, and a distinction gap is provided between adjacent piezoelectric refrigeration units 42 and piezoelectric displacement units 41 for distinguishing the two functional unit areas. Among them, the piezoelectric displacement zone includes an inlaid piezoelectric displacement unit 41, and the inlaid piezoelectric displacement unit 41 includes: a first inlaid distinction gap 441 and a second inlaid distinction gap 443, wherein the gap depths of the first inlaid distinction gap 441 and the second inlaid distinction gap 443 are both less than the thickness of the piezoelectric film layer; and, a first inlaid piezoelectric displacement unit 442 is arranged between the first inlaid distinction gap 441 and the second inlaid distinction gap 443. The electric card element 100 including the embedded piezoelectric displacement unit 41 has a larger electric card refrigeration medium volume and a higher refrigeration density, that is, a larger amount of heat release or heat absorption.

[0094] Optionally, a third electrode layer 3 is further disposed at the lower portion of the first embedded piezoelectric displacement unit 442 .

[0095] The third electrode layer 3 is disposed at the lower part of the first embedded piezoelectric displacement unit 442, and a voltage is applied to the first electrode layer 1 and the third electrode layer 3 to form an electric field to stimulate the functional effect of the first embedded piezoelectric displacement unit 442. A voltage is applied to the first electrode layer 1 and the second electrode layer 2 to form an electric field to stimulate the functional effect of the piezoelectric refrigeration unit 42.

[0096] Specifically, a forward voltage is applied to the first electrode layer 1 and the second electrode layer 2, and the first electrode layer 1 and the third electrode layer 3, and a forward electric field is formed between the first electrode layer 1 and the second electrode layer 2, and between the first electrode layer 1 and the third electrode layer 3. At this time, the piezoelectric displacement zone and the piezoelectric refrigeration zone of the piezoelectric functional film layer 4 simultaneously stimulate the electrocaloric effect and the piezoelectric effect, and the electrocaloric element 100 displaces forward and releases heat. Afterwards, the electrocaloric refrigeration electrode zone 11 in the first electrode layer 1 and the second electrode layer 2 are powered off, that is, the corresponding electric field of the piezoelectric refrigeration zone is removed, and the piezoelectric refrigeration zone stimulates the electrocaloric effect to absorb heat; a reverse voltage is applied to the piezoelectric driving electrode zone 12 in the first electrode layer 1 and the third electrode layer 3, and a reverse electric field is formed between the first electrode layer 1 and the third electrode layer 3, and the piezoelectric displacement zone stimulates the piezoelectric effect to reversely displace. The electrocaloric element 100 releases heat and displaces forward, and absorbs heat and displaces reversely, realizing heat separation.

[0097] Optionally, the electric card cooling chip 602 further includes a clamping frame. The clamping frame includes a first clamping frame 201 clamped on a first side of a first end of the electric card element 100, and a second clamping frame 202 clamped on a second side of the first end of the electric card element 100. The heat receiving end 300 is arranged on the side of the first clamping frame 201 for receiving heat from the electric card element 100, and the cold receiving end 400 is arranged on the side of the second clamping frame 202 for receiving cold from the electric card element 100.

[0098] The electric card cooling chip 602 includes an electric card element 100. The piezoelectric film layer of the electric card element 100 is directly partitioned to form a piezoelectric displacement zone, and the piezoelectric displacement zone drives the electric card element 100 to move. At the same time, a heat receiving end 300 and a cold receiving end 400 are respectively arranged on both sides of the electric card element 100, and the first end of the electric card element 100 is clamped in a clamping frame. When a positive electric field is applied to the piezoelectric cooling zone and the piezoelectric displacement zone at the same time, the piezoelectric functional film layer 4 synchronously excites the piezoelectric effect and the electrocaloric effect, and a positive displacement and heat release occur. The clamping frame clamps the electric card element 100 so that the electric card element 100 fits the heat receiving end 300, as shown in FIG. Fig. 9 When the piezoelectric cooling area stops applying the electric field and the piezoelectric displacement area applies the reverse electric field, the piezoelectric cooling area absorbs heat due to the electrocaloric effect, and the piezoelectric displacement area reversely displaces due to the piezoelectric effect, thereby driving the piezoelectric functional film layer 4 to reversely displace, and the clamping frame clamps the electrocaloric element 100 so that the electrocaloric element 100 fits the cold receiving end 400. Fig.10 The electric card refrigeration chip 602 has a self-integrated cold and hot separation structure, which enhances stability.

[0099] Optionally, the electric card element 100 also includes a base layer 5, which is arranged at the bottom of the second electrode layer 2. Among them, the first clamping frame 201 is arranged on the first electrode layer 1 of the electric card element 100, and the second clamping frame 202 is arranged on the base layer 5 of the electric card element 100. The piezoelectric functional film layer 4, the first electrode layer 1 and the second electrode layer 2 are combined to form a thin film structure, and the base layer 5 is arranged at the bottom of the second electrode layer 2 of the electric card element 100 to support the thin film structure. The setting of the base layer 5 can also maintain the flatness of the electric card element 100, so that the electric card element 100 can be close to the heat transfer medium when transferring heat. Correspondingly, the first clamping frame 201 is arranged above the first electrode layer 1 of the electric card element 100, and the second clamping frame 202 is arranged below the base layer 5 of the electric card element 100.

[0100] Optionally, a first bending gap 203 is provided between the first side of the electric card element 100 and the heat receiving end 300. The first bending gap 203 is used to bend the first side of the electric card element 100 toward the heat receiving end 300 and fit with the heat receiving end 300. And / or, a second bending gap 204 is provided between the second side of the electric card element 100 and the cold receiving end 400. The second bending gap 204 is used to bend the second side of the electric card element 100 toward the cold receiving end 400 and fit with the cold receiving end 400. Increase the cold and hot separation distance of the electric card element 100.

[0101] Optionally, the electric card refrigeration chip 602 further includes a support frame 205. The support frame 205 is supported between the heat receiving end 300 and the cold receiving end 400, and the support frame 205 is disposed at the second end of the electric card element 100.

[0102] The first end of the electric card element 100 is clamped by the first clamping frame 201 and the second clamping frame 202, and the first clamping frame 201 and the second clamping frame 202 simultaneously support the first end of the electric card refrigeration chip 602. At the same time, the second end of the electric card refrigeration chip 602 also needs to be provided with a supporting frame 205 for support. One end of the supporting frame 205 abuts against the heat receiving end 300, and the other end abuts against the cold receiving end 400, thereby supporting the second end of the electric card refrigeration chip 602.

[0103] Optionally, the second end of the electric card element 100 abuts against the support frame 205 ; or, a gap is provided between the second end of the electric card element 100 and the support frame 205 .

[0104] The second end of the electric card element 100 may abut against the support frame 205, or a gap may be left. Fig. 9 and Fig.10As shown, the second end of the electric card element 100 in the electric card cooling chip 602 is not fixedly arranged, and the electric card element 100 is displaced to fit with the heat receiving end 300 when releasing heat, and is displaced to fit with the cold receiving end 400 when absorbing heat, forming a cantilever beam structure. Compared with the arrangement of the electric card element 100 with both ends clamped, the cantilever beam structure has a larger fitting area between the electric card element 100 and the heat receiving end 300 or the cold receiving end 400, and the heat transfer efficiency is improved.

[0105] The disclosed embodiment dissipates heat from both ends of the back plate, requiring little space behind and on the sides of the refrigeration device, and can be embedded in a small pitch, thereby improving the effect of home decoration integration. Using an electric card refrigeration component in conjunction with a heat dissipation device to replace a traditional compressor refrigeration system can effectively reduce vibration and noise during refrigeration operation, and the installation occupies a small volume, and the storage space is correspondingly increased.

[0106] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A refrigeration device, characterized in that: include: A shell defines a storage space inside, the shell includes a back plate and side plates, and the back plate is opposite to the storage space and is enclosed with the side plates to form a refrigeration and heat transfer space; The electric card refrigeration component is arranged in the refrigeration and heat transfer space. The electric card refrigeration component includes a cold end heat exchanger, and the cold end heat exchanger is arranged close to the back plate; The heat dissipation device is arranged in the refrigeration heat transfer space, and is used to dissipate the heat of the electric card refrigeration component.

2. The refrigeration equipment according to claim 1, characterized in that: The heat dissipation device includes an air inlet fan and an air outlet fan, and the electric card refrigeration component is arranged between the air inlet fan and the air outlet fan in the vertical direction. Among them, the air inlet fan is arranged at the lower part of the back plate, and the air outlet fan is arranged at the upper part of the back plate, or the air inlet fan is arranged at the upper part of the back plate, and the air outlet fan is arranged at the lower part of the back plate.

3. The refrigeration equipment according to claim 2, characterized in that: Also includes: A plurality of air outlet collecting pieces are arranged on both sides of the air outlet fan, and one end of each air outlet collecting piece is connected to the air outlet fan, and the other end is connected to the side plate; A plurality of air inlet dispersion members are arranged on both sides of the air inlet fan, and one end of each air inlet dispersion member is connected to the air inlet fan, and the other end is connected to the side plate. Among them, the air outlet converging component and / or the air inlet dispersing component are arc-shaped, and the arc faces the electric card refrigeration component.

4. The refrigeration equipment according to claim 1, characterized in that: The heat dissipation device includes a heat dissipation fan, which is arranged on the upper side or the lower side of the electric card refrigeration component to dissipate the heat of the electric card refrigeration component from the lower end or the upper end of the back plate.

5. The refrigeration equipment according to claim 1, characterized in that: The heat dissipation device comprises an air inlet fan and an air outlet fan, which are arranged on both sides of the lower part or the upper part of the back plate so that the refrigeration equipment can take in and out air from both sides of the lower part or the upper part of the back plate.

6. The refrigeration device according to claim 5, characterized in that: The housing also includes a bottom plate and a top plate. The refrigeration device also includes a barrier, which includes a vertical barrier part and a horizontal barrier part connected to each other. Among them, the vertical barrier part is arranged between the air inlet fan and the air outlet fan. When the air inlet fan and the air outlet fan are arranged on both sides of the lower part of the back plate, the horizontal barrier part is arranged on the outer surface of the bottom plate of the refrigeration equipment; when the air inlet fan and the air outlet fan are arranged on both sides of the upper part of the back plate, the horizontal barrier part is arranged on the outer surface of the top plate of the refrigeration equipment, and the barrier and the shell form separated air inlet duct and air outlet duct.

7. The refrigeration device according to any one of claims 1 to 6, characterized in that: The refrigeration device further comprises one or more partitions, wherein the one or more partitions divide the storage space into a plurality of sub-storage spaces; There are multiple electric card refrigeration components, which are respectively arranged in part or all of the sub-storage spaces, and isolation pieces are provided between adjacent electric card refrigeration components.

8. The refrigeration device according to any one of claims 1 to 6, characterized in that: The electric card refrigeration components also include: The electric card refrigeration chip comprises an electric card element, a heat receiving end and a cold receiving end, wherein the heat receiving end is used to receive heat from the electric card element, and the cold receiving end is used to receive cold from the electric card element; The hot end heat exchanger is thermally connected to the heat receiving end of the electric card refrigeration chip. Wherein, the cold end heat exchanger is thermally connected to the cold receiving end of the electric card refrigeration chip.

9. The refrigeration device according to claim 8, characterized in that: The electric card refrigeration chip also includes: A clamping frame, comprising a first clamping frame clamped on a first side of a first end of the electric card element, and a second clamping frame clamped on a second side of the first end of the electric card element; The heat receiving end is arranged on the first clamping frame side for receiving the heat of the electric card element, and the cold receiving end is arranged on the second clamping frame side for receiving the cold of the electric card element.

10. The refrigeration device according to claim 8, characterized in that: The electrical card components include: a first electrode layer; a second electrode layer; and, The piezoelectric functional film layer is arranged between the first electrode layer and the second electrode layer. The piezoelectric functional film layer includes a piezoelectric refrigeration zone and a piezoelectric displacement zone formed by partitioning the piezoelectric film layer. The piezoelectric displacement zone is used to drive the piezoelectric refrigeration zone to generate displacement.

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