Component cleaning apparatus and method

Abstract

Disclosed is an apparatus for cleaning a component, the apparatus comprising: a cleaning liquid supply; a supply line for receiving a cleaning liquid from a cleaning liquid supply and connected to a first port of the component; a drain line connected with a second port of the component; and a circulation line branched from the discharge line and connected with a third port of the component.

Description

Technical Field

[0001] The present invention relates to an apparatus for processing a substrate. Background Art

[0002] The semiconductor device manufacturing process is a process of forming a circuit pattern on a substrate (such as a wafer) to complete a chip. The semiconductor device manufacturing process includes: a deposition process to form a thin film on a substrate; a photolithography process to transfer the circuit pattern to the thin film using a photomask; an etching process to selectively remove unnecessary parts using chemicals or active gases to form the desired circuit pattern on the substrate; an ashing process to remove the remaining photoresist after etching; and an ion implantation process to implant ions into the part connected to the circuit pattern to give the electronic device characteristics. In each process and between processes, a cleaning process is implemented to remove contaminants on the substrate.

[0003] Each process requires a supply line for the chemical solution or gas, which is equipped with components such as valves and filters. Over time, foreign matter may accumulate in these components, requiring regular cleaning. Summary of the invention

[0004] The present invention aims to provide a component cleaning device and method which can effectively remove foreign matter in a component.

[0005] The present invention also aims to provide a component cleaning device and method that can effectively remove foreign matter in each port of a three-way valve.

[0006] The present invention also aims to provide a component cleaning device and method capable of simultaneously removing foreign matter in different types of components such as filters and valves.

[0007] The purpose of the present invention is not limited thereto, and a person skilled in the art can clearly understand other purposes not mentioned from the following description.

[0008] An exemplary embodiment of the present invention provides an apparatus for cleaning a component, the apparatus comprising: a cleaning liquid supply source; a supply line for receiving cleaning liquid from the cleaning liquid supply source and connected to a first port of the component; a discharge line connected to a second port of the component; and a circulation line branched from the discharge line and connected to a third port of the component.

[0009] According to an exemplary embodiment, the apparatus may further include: a supply valve installed in the supply line; and a regulating valve unit configured to selectively regulate discharge from the discharge line to the outside and circulation to the circulation line. The regulating valve unit may include a three-way valve installed at a point where the circulation line branches from the discharge line.

[0010] According to an exemplary embodiment, the apparatus may further include: a controller for controlling the supply valve and the regulating valve unit, wherein the controller may control the supply valve and the regulating valve unit so that the cleaning liquid supplied from the supply line passes through the first port, the second port, the discharge line, the circulation line, the third port, the second port and the discharge line in sequence.

[0011] According to an exemplary embodiment, the cleaning solution supply source may include: a cleaning solution supply unit that supplies a cleaning solution to the supply line; and a rinsing solution supply unit that supplies a rinsing solution to the supply line. The cleaning solution supply unit may include: a first supply unit that supplies a rinsing solution at a first temperature; and a second supply unit that supplies a rinsing solution at a second temperature lower than the first temperature.

[0012] According to an exemplary embodiment, the cleaning liquid supply source may further include a gas supply unit that supplies a dry gas to the supply line. The gas supply unit may include: a first supply unit that supplies a dry gas at a first temperature; and a second supply unit that supplies a dry gas at a second temperature higher than the first temperature. The gas supply unit may include: a first gas pipeline that is connected to the supply line and supplies the dry gas to the supply line; and a second gas pipeline that is connected to the circulation line and supplies the dry gas to the circulation line.

[0013] According to an exemplary embodiment, the supply line may include: a first line connected to a first port of another component; and a second line connected to a second port of another component, and the second line is connected to the first port of the component. The other component is a filter, and the component is a three-way valve.

[0014] According to another exemplary embodiment of the present invention, there is provided a method for cleaning a component by using a component cleaning device, the component cleaning device comprising: a cleaning liquid supply source; a supply line for receiving the cleaning liquid from the cleaning liquid supply source and connected to a first port of the component; a discharge line connected to a second port of the component; and a circulation line branched from the discharge line and connected to a third port of the component; the method comprising: a cleaning preparation operation, in which the component is connected to the supply line, the discharge line, and the circulation line; and a cleaning operation, in which the cleaning solution supplied from the supply line is passed through the first port, the second port, the discharge line, the circulation line, the third port, the second port, and the discharge line in sequence to clean the component.

[0015] According to an exemplary embodiment, the method may further include a flushing operation in which the component is flushed using a flushing solution supplied from the supply line. The flushing operation may include a first operation in which the component is flushed using a flushing solution at a first temperature; and a second operation, after the first operation, in which the component is cooled using a flushing solution at a second temperature lower than the first temperature.

[0016] According to an exemplary embodiment, the method may further include a drying operation in which the component is dried using the drying gas supplied from the supply line. The drying operation may include a first operation in which the component is dried using the drying gas at a first temperature; and a second operation, which is after the first operation, in which the component is dried using the drying gas at a second temperature higher than the first temperature.

[0017] According to an exemplary embodiment, in the drying operation, the drying gas may be supplied to each of the circulation line and the supply line.

[0018] According to the exemplary embodiments, foreign matter within a component may be effectively removed.

[0019] The effects of the present invention are not limited to the above-mentioned effects, and those skilled in the art can clearly understand the unmentioned effects from this specification and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The various features and advantages of the non-limiting exemplary embodiments of the present specification may become apparent upon reading the detailed description in conjunction with the accompanying drawings. The drawings are for illustration purposes only and should not be construed as limiting the scope of the claims. Unless explicitly stated, the drawings are not to be considered drawn to scale. Various dimensions in the drawings may be exaggerated for clarity.

[0021] Figure 1 is a schematic diagram schematically illustrating a parts cleaning apparatus according to an exemplary embodiment of the present invention.

[0022] Figure 2 This means that the cleaning target parts are installed in Figure 1 Schematic diagram of the parts cleaning equipment.

[0023] Figure 3 is a schematic diagram schematically illustrating a parts cleaning apparatus according to another exemplary embodiment of the present invention.

[0024] Figure 4 is a schematic diagram schematically illustrating a parts cleaning apparatus according to still another exemplary embodiment of the present invention.

[0025] Figure 5is a flow chart schematically illustrating a component cleaning method according to an exemplary embodiment of the present invention.

[0026] Figure 6 and Figure 7 It is explained in Figure 1 Schematic diagram of supplying cleaning fluid to components in a component cleaning device.

[0027] Figure 8 It is explained in Figure 1 Schematic diagram of supplying drying gas to components in a component cleaning device.

[0028] Fig. 9 is a schematic diagram schematically illustrating a parts cleaning apparatus according to still another exemplary embodiment of the present invention.

[0029] Fig.10 and Fig.11 It is explained in Fig. 9 Schematic diagram of supplying cleaning fluid to components in a component cleaning device.

[0030] Fig.12 It is explained in Fig. 9 Schematic diagram of supplying drying gas to components in a component cleaning device. DETAILED DESCRIPTION

[0031] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. Exemplary embodiments are provided to make the present disclosure comprehensive and fully convey the scope of the present disclosure to those skilled in the art. Many specific details, such as examples of specific components, devices, and methods, are listed to provide a comprehensive understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that exemplary embodiments may be embodied in a variety of different forms without the need to employ specific details, and neither of these should be construed as limiting the scope of the present disclosure. In some exemplary embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.

[0032] The terms used herein are only used to describe specific exemplary embodiments and are not restrictive. In this article, unless the context clearly states otherwise, singular and plural forms are included when the number is not specified. The terms "including", "comprising", and "having" are open, and therefore indicate the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or increase of one or more other features, integers, steps, operations, elements, parts and / or groups thereof. The method steps, processes and operations described herein should not be understood as having to be performed in the specific order discussed or described, unless the execution order is specifically specified. It should also be understood that other steps or alternative steps can also be used.

[0033] When an element or layer is referred to as being "on," "engaged to," "connected to," or "coupled to" another element or layer, it may be directly on, directly engaged to, connected to, or coupled to another element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," or "directly coupled to" another element or layer, there may be no intervening elements or layers. Other words used to describe the relationship between elements should also be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). The term "and / or" as used herein includes any and all combinations of one or more of the relevant listed items.

[0034] Although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms may only be used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Unless the context clearly states, the "first", "second" and other numerical terms used herein do not mean order or sequence. Therefore, without departing from the teaching of the exemplary embodiment, the first element, component, region, layer or part discussed below may be referred to as the second element, component, region, layer or part.

[0035] For ease of description, spatially relative terms such as "inside," "outside," "below," "beneath," "lower," "above," "upper," etc. may be used herein to describe the relationship between one element or feature and another element or feature shown in the figures. In addition to the orientations described in the figures, spatially relative terms may also include different orientations of the device in use or operation. For example, if the device in the figure is turned over, then elements described as being "below" or "beneath" other elements or features would be oriented as being "above" the other elements or features. Thus, the exemplary term "below" may include both "above" and "below" orientations. The device may be oriented in other ways (rotated 90 degrees or other orientations), and the spatially relative descriptors used herein may be interpreted accordingly.

[0036] When the terms "same" or "identical" are used in the description of exemplary embodiments, it should be understood that some imprecision may exist. Therefore, when one element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within a manufacturing or operating tolerance range (e.g., ±10%).

[0037] When the term "approximately" or "substantially" is used in connection with a numerical value, it should be understood that the relevant numerical value includes the manufacturing or operating tolerance (e.g., ±10%) around the numerical value. In addition, when "generally" and "substantially" are used in connection with geometric shapes, it should be understood that the accuracy of the geometric shape is not required, and the latitude of the shape belongs to the scope of the present disclosure.

[0038] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by ordinary technicians in the technical field to which the exemplary embodiments belong. It should be further understood that terms (including terms defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and unless explicitly defined in this article, they will not be interpreted as idealized or overly formal meanings.

[0039] Figure 1 is a schematic diagram schematically illustrating a parts cleaning apparatus according to an exemplary embodiment of the present invention.

[0040] Figure 2 This means that the cleaning target parts are installed in Figure 1 Schematic diagram of the parts cleaning equipment.

[0041] Reference Figure 1 and Figure 2 , the parts cleaning apparatus 100 includes a cleaning liquid supply source 110 , a supply line 120 , a discharge line 130 , a circulation line 140 , and a controller 150 .

[0042] The component cleaning apparatus 100 cleans the inside of the component A and the component B.

[0043] The cleaning liquid supply source 110 may include a cleaning solution supply unit 111, a rinsing solution supply unit 112, and a gas supply unit 113. The cleaning liquid supplied from the cleaning liquid supply source 110 may be a cleaning solution for component cleaning, a rinsing solution for component rinsing, a gas for component drying, and the like.

[0044] The cleaning solution supply device 111 supplies a cleaning solution to the supply line 120 for cleaning the inside of the parts A and B. The cleaning solution is not limited to any particular type and may be Standard Clean-1 (SC1), as shown in the accompanying drawings as an example. SC1 is a mixture of ammonia, hydrogen peroxide, and water in a ratio of 1:1:5 and is used to remove particles and organic contaminants at a temperature of 75°C to 90°C.

[0045] The rinsing solution supply unit 112 supplies a rinsing solution to the supply line 120 for rinsing the inside of the component A and the component B. The rinsing solution is not limited to any particular type and may be deionized water (DIW), as shown in one example. The rinsing solution supply unit 112 may be configured to supply rinsing solutions of various temperatures. For example, the rinsing solution supply unit 112 may include a heater and may be configured to supply a rinsing solution at a first temperature and a rinsing solution at a second temperature lower than the first temperature.

[0046] When the rinse solution is deionized water, the first temperature may range from 30° C. to 70° C. or higher, and the second temperature may range from 10° C. to 30° C. or lower.

[0047] Optionally, the flushing solution supply unit 112 may include a first supply unit 1121 and a second supply unit 1122, wherein the first supply unit is used to supply the flushing solution at a first temperature, and the second supply unit is used to supply the flushing solution at a second temperature lower than the first temperature, such as Figure 4 shown.

[0048] The gas supply unit 113 supplies gas to the supply line 120 to dry the inside of the parts A and B. The gas is not limited to any particular type and may be nitrogen, as shown in the accompanying drawings as an example. The gas supply unit 113 may be configured to supply gas at various temperatures. For example, the gas supply unit 113 may include a heater and may be configured to supply gas at a first gas temperature and gas at a second gas temperature higher than the first temperature.

[0049] When the drying gas is nitrogen, the first temperature may be 50°C or less, and the second temperature may be 50°C to 110°C.

[0050] Optionally, the gas supply unit 113 may include a first supply unit 1133 and a second supply unit 1134, wherein the first supply unit supplies gas at a first temperature and the second supply unit supplies gas at a second temperature lower than the first temperature. Figure 4 shown.

[0051] The gas supply unit 113 may include a first gas line 1131 that supplies gas to the supply line 120 and a second gas line 1132 that supplies gas to the circulation line 140 .

[0052] In one example, two different types of components A and B may be installed at the same time so that the two components can be cleaned at the same time.

[0053] Between the two components, one component A has a first port PA1, a second port PA2 and a third port PA3, and the other component B has a first port PB1 and a second port PB2. Hereinafter, one component A is referred to as a first component, and the other component B is referred to as a second component.

[0054] The first component A may be a three-way valve. The second component B may be a filter.

[0055] The supply line 120 receives the cleaning liquid from the cleaning liquid supply source 210 and leads to the first port P1 of the first component A.

[0056] The supply line 120 is provided with a second component B. The supply line 120 includes a first line 123 and a second line 124. The first line 123 is provided upstream of the second line 124. The first line 123 may be provided to be connectable to a first port PB1 of another component B. The second line 124 may be provided to be connectable to each of a second port PB2 of the second component B and a first port PA1 of the first component A. The discharge line 130 may be provided to be connectable to a second port PA2 of the first component A.

[0057] The circulation line 140 may be branched from the exhaust line 130 , and may be disposed to be connectable to the third port PA3 of the first component A. As shown in FIG.

[0058] The supply line 120 is equipped with a supply valve 121 for opening and closing the supply line 120. A regulating valve unit 122 is installed in the discharge line 130 and the circulation line 140. The supply valve 121 is located near the cleaning liquid supply source 110 and is used to control whether to supply the cleaning liquid and the supply amount of the cleaning liquid.

[0059] The regulating valve unit 122 regulates the cleaning liquid entering the first port PA1 of the three-way valve (i.e., the first component A) to flow in a direction selected between being discharged from the discharge line 130 to the outside and circulating to the circulation line 140. The regulating valve unit 122 may be a three-way valve 1221 installed at a position point where the circulation line 140 branches from the discharge line 130.

[0060] At a connection point of the second gas line 1132 and the circulation line 140 , a three-way valve 141 may be provided to selectively adjust the circulation of the cleaning liquid and the supply of the gas.

[0061] Optionally, instead of the three-way valve 1221 , the regulating valve unit 122 may include a two-way valve (not shown) installed in the discharge line 130 , and a two-way valve (not shown) installed in the circulation line 140 .

[0062] The controller 150 controls operations of the cleaning liquid supply source 110 and various valves 121 , 122 , and 141 .

[0063] In the above example, the case where two parts are cleaned simultaneously has been described. Figure 3 As shown, the component cleaning apparatus 100 may be configured to clean only the first component A having three ports.

[0064] Figure 5 is a flow chart schematically illustrating a component cleaning method according to an exemplary embodiment of the present invention. Figure 6 and Figure 7 It is explained in Figure 1 Schematic diagram of supplying cleaning fluid to a component in a component cleaning device. Figure 8 It is explained in Figure 1 Schematic diagram of supplying drying gas to components in a component cleaning device.

[0065] Reference Figures 5 to 8 , the component cleaning method S100 includes a cleaning preparation operation S110 , a cleaning operation S120 , a rinsing operation 130 , and a drying operation S140 .

[0066] In the cleaning preparation operation S110, the first component A to be cleaned is mounted on the supply line 120, the exhaust line 130, and the circulation line 140. The first port PA1 of the first component A is connected to the supply line 120, the second port PA2 of the first component A is connected to the exhaust line 130, and the third port PA3 of the first component A is connected to the circulation line 140.

[0067] The second component B to be cleaned is installed on the first pipeline 123 and the second pipeline 124 of the supply pipeline 120. The first port PB1 of the second component B is connected to the first pipeline 123, and the second port PB2 of the second component B is connected to the second pipeline 124.

[0068] In the cleaning operation S120, a cleaning solution is supplied from the cleaning solution supply source 110 for cleaning the inside of the components A and B. The valve unit is controlled so that the cleaning solution flows sequentially through the first port PB1 of the second component B, the second port PB2 of the second component B, the first port PA1 of the first component A, the second port PA2 of the first component A, the discharge line 130, the circulation line 140, the third port PA3 of the first component A, the second port PA2 of the first component A, and the discharge line 130. This makes it possible to clean all three ports PA1, PA2, and PA3 of the first component A. In addition, the two ports PB1 and PB2 of the second component B can also be cleaned. Cleaning using the cleaning solution can be performed for a set time.

[0069] In the flushing operation S130, a flushing solution is provided from the cleaning liquid supply source 110 to flush the inside of the components A and B. The valve unit is controlled so that the flushing solution flows sequentially through the first port PB1 of the second component B, the second port PB2 of the second component B, the first port PA1 of the first component A, the second port PA2 of the first component A, the discharge line 130, the circulation line 140, the third port PA3 of the first component A, the second port PA2 of the first component A, and the discharge line 130. This makes it possible to flush all three ports PA1, PA2, and PA3 of the first component A. In addition, the two ports PB1 and PB2 of the second component B can also be flushed. Flushing with the flushing solution can be implemented for a set time.

[0070] The rinsing operation S130 may include a first operation of rinsing the parts A and B with a rinsing solution at a first temperature, and a second operation of cooling the parts A and B with the rinsing solution at a second temperature lower than the first temperature. In this case, the cooling may restore the states of the parts A and B, thereby reducing damage to the product in the drying operation S140 and improving the drying effect.

[0071] When the rinse solution is deionized water, the first temperature may range from 30° C. to 70° C. or higher, and the second temperature may range from 10° C. to 30° C. or lower.

[0072] In the drying operation S140, a drying gas is supplied from the cleaning liquid supply source 110 to dry the inside of the components A and B. The drying gas may be supplied to each of the supply line 120 and the circulation line 130. Specifically, the drying gas may be supplied to the first gas line 1131 and the second gas line 1132. In this case, the drying gas flow inside the first component A is improved. Specifically, the vortex generated inside the first component A prevents the formation of a dead zone where the gas flow stagnates, and thus the first component A is completely dried.

[0073] The drying operation S140 may include a first operation of drying the components A and B with a drying gas at a first temperature, and a second operation of cooling the components A and B with the drying gas at a second temperature higher than the first temperature.

[0074] When the drying gas is nitrogen, the first temperature may be 50°C or less, and the second temperature may range from 50°C to 110°C.

[0075] Fig. 9 is a schematic diagram schematically illustrating a parts cleaning apparatus according to another exemplary embodiment of the present invention.

[0076] Reference Fig. 9The part cleaning apparatus 200 includes a cleaning liquid supply source 210 , a first supply line 220 , a first discharge line 230 , a second supply line 240 , a second discharge line 250 , a first circulation line 260 , a second circulation line 270 , and a controller 280 .

[0077] The component cleaning device 200 cleans the inside of components C, D, E, F, and the like.

[0078] Two of the four components, C and D, have first ports PC1 and PD1, second ports PC2 and PD2, and third ports PC3 and PD3, and the other two components, D and F, have first ports PD1 and PF1, and second ports PD2 and PF2.

[0079] Hereinafter, the two components C and D are referred to as a third component C and a fourth component D, and the other two components E and F are referred to as a fifth component E and a sixth component F.

[0080] The third component C and the fourth component D may be three-way valves, and the fifth component E and the sixth component F may be filters.

[0081] The cleaning liquid supply source 210 may include a cleaning solution supply unit 211, a rinsing solution supply unit 212, and a gas supply unit 213. The cleaning liquid supplied from the cleaning liquid supply source 210 may be a cleaning solution for component cleaning, a rinsing solution for component rinsing, a gas for component drying, and the like.

[0082] The first supply line 220 receives the cleaning liquid from the cleaning liquid supply source 210 and is connected to the first port PC1 of the third component C. The first supply line 220 may be provided with a supply valve 221 for opening or closing the first supply line 220 .

[0083] The first discharge line 230 is connected to the second port PC2 of the third component C.

[0084] The second supply line 240 receives the cleaning liquid from the cleaning liquid supply source 210 and is connected to the first port PD1 of the fourth member D. The second supply line 240 may be provided with a supply valve 241 for opening or closing the second supply line 240 .

[0085] The second discharge line 250 is connected to the second port PD2 of the fourth member D.

[0086] The first circulation line 260 branches from the first discharge line 230 and is connected to the third port PD3 of the fourth part D. At a point where the first circulation line 260 branches from the first discharge line 230, a regulating valve unit 222 may be provided. The regulating valve unit 222 may include a three-way valve.

[0087] The second circulation line 270 branches from the second discharge line 250 and is connected to the third port PC3 of the third component C. At a position where the second circulation line 270 branches from the second discharge line 250, a regulating valve unit 242 may be provided. The regulating valve unit 242 may include a three-way valve.

[0088] Optionally, the first supply line 220 and the second supply line 240 may be provided for installing the fifth component E and the sixth component F.

[0089] Optionally, the gas supply unit 213 may include a first gas line 2131 supplying dry gas to the first and second supply lines 220 and 240 , a second gas line 2132 supplying dry gas to the first circulation line 260 , and a third gas line 2133 supplying dry gas to the second circulation line 270 .

[0090] Three-way valves 261 and 271 may be provided at a point where the first circulation line 260 and the second gas line 2132 are connected and at a point where the second circulation line 270 and the third gas line 2133 are connected.

[0091] The controller 280 controls operations of the cleaning liquid supply source 210 and various valves 221 , 222 , 241 , 242 , 261 , and 271 .

[0092] Reference Fig.10 and Fig.11 , the cleaning liquid supplied by the cleaning liquid supply source 210 may be discharged while passing through the first supply line 220, the first port PC1 of the third component C, the second port PC2 of the third component C, the first discharge line 230, and the first circulation line 260, the third port PD3 of the fourth component D, the second port PD2 of the fourth component D, the second discharge line 250, the second circulation line 270, the third port PC3 of the third component C, the second port PC2 of the third component C, and the first discharge line 230 and the first circulation line 260. In this case, the flow path of the cleaning liquid increases, so only a small amount of cleaning liquid is needed to effectively clean the components C and D. In this case, the flow path of the cleaning liquid increases, so only a small amount of cleaning liquid is needed to effectively clean the components C and D.

[0093] Reference Fig.12 , the gas supply unit 213 may be configured to simultaneously supply drying gas to the first gas line 2131, the second gas line 2132, and the third gas line 2133. In this case, the drying gas flow inside the third component C and the fourth component D is improved. Specifically, the vortex generated inside the components C and D prevents the formation of a dead zone where the gas flow stagnates, so that the third component C and the fourth component D are completely dried.

[0094] It should be understood that exemplary embodiments are disclosed herein and that other variations are possible. Even if not specifically stated or described, individual elements or features of a particular exemplary embodiment are generally not limited to the particular exemplary embodiment, but are interchangeable and can be used in selected exemplary embodiments where applicable. These modifications should not be considered as departing from the spirit and scope of the present invention, and all such modifications that are obvious to a person of ordinary skill in the art should be included within the scope of the appended claims.

Claims

1. A device for cleaning parts, the device comprising: Cleaning fluid supply source; a supply line for receiving cleaning fluid from the cleaning fluid supply source and connected to the first port of the component; a discharge line connected to the second port of the component; and A circulation line is branched from the discharge line and connected to the third port of the component.

2. The device according to claim 1, further comprising: a supply valve installed in the supply line; as well as A regulating valve unit is provided for selectively regulating discharge from the discharge line to the outside and circulation to the circulation line. 3 . The apparatus according to claim 2 , wherein the regulating valve unit comprises a three-way valve installed at a position point where the circulation line branches from the discharge line.

4. The device according to claim 2, further comprising: a controller for controlling the supply valve and the regulating valve unit, The controller controls the supply valve and the regulating valve unit so that the cleaning liquid supplied from the supply line passes through the first port, the second port, the discharge line, the circulation line, the third port, the second port and the discharge line in sequence.

5. The apparatus of claim 1, wherein the cleaning fluid supply source comprises: a cleaning solution supply unit that supplies a cleaning solution to the supply line; as well as A flushing solution supply unit supplies flushing solution to the supply line.

6. The apparatus according to claim 5, wherein the cleaning solution supply unit comprises: a first supply unit that supplies a rinse solution at a first temperature; as well as A second supply unit supplies a rinsing solution at a second temperature lower than the first temperature. 7 . The apparatus according to claim 5 , wherein the cleaning liquid supply source further comprises a gas supply unit which supplies a drying gas to the supply line.

8. The apparatus according to claim 7, wherein the gas supply unit comprises: a first supply unit that supplies a dry gas at a first temperature; as well as A second supply unit supplies a drying gas at a second temperature higher than the first temperature.

9. The apparatus according to claim 7, wherein the gas supply unit comprises: a first gas pipeline connected to the supply pipeline and providing a dry gas to the supply pipeline; as well as A second gas pipeline is connected to the circulation pipeline and provides dry gas to the circulation pipeline.

10. The apparatus of claim 1, wherein the supply line comprises: a first pipeline connected to a first port of another component; as well as a second pipeline connected to a second port of another component, and The second pipeline is connected to the first port of the component.

11. The apparatus of claim 10, wherein the other component is a filter and the component is a three-way valve.

12. A method for cleaning a component by using a component cleaning device, the component cleaning device comprising: Cleaning fluid supply source; a supply line for receiving cleaning fluid from the cleaning fluid supply source and connected to the first port of the component; a discharge line connected to the second port of the component; and a circulation line branched from the discharge line and connected to a third port of the component; The method comprises: a cleaning preparation operation, wherein the component is connected to the supply line, the discharge line, and the circulation line; as well as A cleaning operation in which a cleaning solution supplied from the supply line is sequentially passed through the first port, the second port, the discharge line, the circulation line, the third port, the second port, and the discharge line to clean the component.

13. The method according to claim 12, further comprising: A flushing operation wherein the component is flushed using a flushing solution supplied from the supply line.

14. The method according to claim 13, wherein the flushing operation comprises: a first operation in which the component is rinsed using a rinse solution at a first temperature; as well as A second operation, which follows the first operation, cools the component using a rinse solution at a second temperature lower than the first temperature.

15. The method according to claim 12, further comprising: A drying operation in which the component is dried using the drying gas supplied from the supply line.

16. The method according to claim 15, wherein the drying operation comprises: a first operation in which the component is dried using a drying gas at a first temperature; as well as A second operation, which is subsequent to the first operation, wherein the component is dried using a drying gas at a second temperature higher than the first temperature. 17 . The method according to claim 15 , wherein in the drying operation, the drying gas is supplied to each of the circulation line and the supply line.

18. An apparatus for cleaning a first component and a second component, each of the first component and the second component having a first port, a second port and a third port, the apparatus comprising: Cleaning fluid supply source; a first supply line for receiving cleaning fluid from the cleaning fluid supply source and connected to the first port of the first component; a first exhaust line connected to the second port of the first component; a second supply line for receiving cleaning fluid from the cleaning fluid supply source and connected to the first port of the second component; a second exhaust line connected to the second port of the second component; a first circulation line branched from the first discharge line and connected to the third port of the second member; as well as A second circulation line is branched from the second discharge line and connected to the third port of the first member.

19. The apparatus of claim 18, wherein the cleaning fluid supply comprises: a cleaning solution supply unit that supplies a cleaning solution to the supply line; as well as A flushing solution supply unit supplies a flushing solution to the water supply line.

20. The apparatus according to claim 18, wherein the cleaning liquid supply source comprises an air supply unit, and the air supply unit comprises: a first gas line that supplies dry gas to the first supply line and the second supply line; a second gas pipeline supplying dry gas to the first circulation pipeline; as well as A third gas pipeline supplies dry gas to the second circulation pipeline.

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