Test method of detection device and detection device

Abstract

The invention discloses a test method of a detection device and the detection device, and the test method comprises the steps: enabling a plurality of test chips to be plugged into a socket of the detection device; wherein the test chips and the sockets are plugged in a one-to-one correspondence manner to obtain a plurality of test communication groups; sequentially connecting the test communication groups in parallel to obtain a test circuit; and a feedback signal of the test circuit is sampled, and the working state of each socket is determined based on the feedback signal. Through the mode, the working state of the socket can be rapidly and effectively monitored, the efficiency and accuracy of the detection device in the detection process are greatly improved, the principle is simple, practicability and convenience are achieved, and the production requirement is met.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to a testing method and a testing device. Background Art

[0002] During the chip production and manufacturing process, in order to ensure the reliability and stability of the chip, it is necessary to use detection devices to simulate stress conditions such as high temperature, low temperature, high pressure, and low pressure to test various extreme conditions and load conditions that the chip may encounter during actual use.

[0003] As product demand continues to increase, how to ensure chip detection efficiency and accuracy, the detection device needs further improvement. Summary of the invention

[0004] The present application provides a testing method and a testing device for a detection device, which can quickly and effectively monitor the working status of a socket, greatly improve the efficiency and accuracy of the detection process of the detection device, have a simple principle, are practical and convenient, and meet production needs.

[0005] In order to solve the above technical problems, the first aspect of the present application provides a testing method for a detection device, wherein the testing method comprises:

[0006] Insert multiple test chips into the sockets of the detection device; wherein the test chips and the sockets are inserted one by one to obtain multiple test connection groups; the test connection groups are connected in parallel in sequence to obtain a test circuit; sample the feedback signal of the test circuit, and determine the working status of each socket based on the feedback signal.

[0007] Among them, the sockets are distributed in an array; the steps of sampling the feedback signal of the test circuit and determining the working state of each socket based on the feedback signal include: dividing multiple test connection groups into multiple circuit units; respectively collecting the feedback signal of each circuit unit, and determining the working state of the circuit based on the feedback signal; determining the working state of each socket in the corresponding circuit unit based on the feedback signal of each circuit unit.

[0008] Among them, the step of determining the working status of each socket in the corresponding circuit unit based on the feedback signal of each circuit unit includes: in response to determining that there is an abnormality in the working status of the circuit unit based on the feedback signal, detecting each socket in the circuit unit in turn to determine the position of the abnormal socket.

[0009] The steps of respectively collecting the feedback signals of each circuit unit and determining the working state of the test circuit unit based on the feedback signals include: respectively collecting the feedback signals of each circuit unit through a four-wire method.

[0010] Among them, the steps of respectively collecting the feedback signal of each circuit unit and determining the working state of the circuit unit based on the feedback signal include: collecting the electrical signal of each test connection group in the circuit unit after being connected in parallel; using the electrical signal to obtain the resistance value of the resistor after each test connection group in the circuit unit is connected in parallel; if the resistance value of the resistor exceeds the preset threshold range, it is determined that the circuit unit is abnormal.

[0011] Among them, multiple test chips are plugged into the sockets of the detection device; wherein the test chips are plugged into the sockets one by one, and the steps of obtaining multiple test connection groups include: selecting the corresponding test chip according to the probe structure of the socket; and short-circuiting the inside of the test chip.

[0012] Among them, the step of connecting the test connection groups in parallel in sequence to obtain the test circuit includes: the socket is installed on the detection device through the installation point.

[0013] The step of inserting a plurality of test chips into the socket of the detection device includes: performing a leakage current test on the detection device; in response to a qualified test result of the leakage current test, inserting a plurality of test chips into the socket of the detection device.

[0014] In order to solve the above technical problems, the second aspect of the present application provides a detection device. The detection device includes: a socket, the socket is used to install a test chip;

[0015] Among them, the detection device is used to form multiple test connection groups by plugging the test chips into the sockets one by one; the test connection groups are connected in parallel to form a test circuit; the feedback signal of the test circuit is sampled, and the working status of each socket is determined based on the feedback signal.

[0016] Among them, the sockets are distributed in an array and arranged on the detection device through mounting points.

[0017] Different from the prior art, the present application provides a testing method and a testing device for a detection device, which can determine the working status of the detection device and greatly improve the efficiency and accuracy of the detection process of the detection device. The principle is simple and practical, which can speed up the completion of product testing and delivery, reduce the cost of product early research and development testing, and meet production needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the connection structure of an implementation method of a testing device of the present application;

[0019] Figure 2 It is a schematic diagram of the structure of a test chip of an embodiment of the detection device of the present application;

[0020] Figure 3 It is a structural schematic diagram of a test connectivity group of an implementation mode of a detection device of the present application;

[0021] Figure 4 It is a flow chart of the test steps of the test method of the detection device of the present application in an implementation manner;

[0022] Figure 5 It is a schematic diagram of the connection structure of another implementation method of the testing method of the detection device of the present application;

[0023] Figure 6 It is a flow chart of the test steps of another implementation method of the test method of the detection device of the present application;

[0024] Figure 7 It is a schematic diagram of the connection structure of another implementation method of the testing method of the detection device of the present application;

[0025] Figure 8 yes Figure 7 A schematic structural diagram of a detection board according to another embodiment of the test method of the detection device of the present application;

[0026] Fig. 9 It is a flow chart of the test steps of another implementation method of the test method of the detection device of the present application;

[0027] Fig.10 It is a structural schematic diagram of an implementation method of the detection device of the present application. DETAILED DESCRIPTION

[0028] The present application is described in detail below with reference to the accompanying drawings and implementation methods.

[0029] Figure 1 , Figure 5 and Figure 7 A schematic diagram of the connection structure of the test method implementation method in Fig.10 The structural schematic diagrams of the detection device implementation methods are all structural logic diagrams, and the specific structure is referenced by the test method and detection device used in actual production.

[0030] In the product chip test, the product chip to be tested is installed in the detection device through the socket. When the product chip is inserted into the socket, the socket will be electrically connected to the pins of the product chip. The detection device sends a test signal to the product chip through the socket, or reads the test signal output by the product chip, and transmits the test signal to the detection device for analysis to determine the function and performance of the product chip. Therefore, the working state of the detection device, especially the working state of the socket, and the good contact between the socket and the detection device and chip are crucial to the accuracy of the product chip test. The testing process of the detection device has also become a necessary link in the product chip test.

[0031] This application first provides a testing method for a detection device, see Figure 1 , Figure 2 , Figure 3 and Figure 4 , Figure 1 It is a schematic diagram of the connection structure of an implementation method of a testing device of the present application; Figure 2 It is a schematic diagram of the structure of a fake film in one embodiment of the detection device of the present application; Figure 3 It is a structural schematic diagram of a test connectivity group of an implementation mode of a detection device of the present application; Figure 4 It is a flowchart of the test steps of an implementation method of the test device of the present application.

[0032] like Figure 1 As shown, the socket 22 is arranged on the detection device 21, wherein the test method comprises:

[0033] S101: plugging a plurality of test chips into sockets of a detection device; wherein the test chips are plugged into the sockets in a one-to-one correspondence to obtain a plurality of test connection groups.

[0034] like Figure 1 As shown, the test chip 11 is a device used to replace the product chip in production. Figure 2 As shown in the structure diagram of the test chip 11, in a specific embodiment, the test chip 11 has the same structure as the product chip, and a key electrical connection relationship is set between the pins of the test chip 11 or the chip pins are short-circuited.

[0035] The test chip 11 and the socket 22 are plugged in one by one to form a Figure 3 The structure of the test connection group 31 shown can test the conductivity and working state between the probe of the socket 22 and the internal circuit of the probe by inserting the test chip 11 for testing, and test the conductivity between the socket 22 and the detection device 21.

[0036] like Figure 3 As shown, the socket 22 is provided with a probe and a fixing spring sheet, and the test chip 11 is correspondingly mounted on the spring sheet through the fixing spring sheet. The structure of the probe of the socket 22 is designed according to the pin structure of the product chip, so the pin structure of the corresponding test chip 11 is also designed according to the probe of the socket 22. In a specific embodiment, the monitoring device is an aging test board, the socket 22 is provided on the aging test board, and the test chip 11 is electrically connected to the aging test board through the socket 22 to implement the test method of the detection device 21.

[0037] The test chip 11 and the socket 22 are plugged in one by one so that each socket 22 of the detection device 21 can simulate the working state during the product chip test. It can also simulate the elasticity and pressure bearing of the detection socket 22 when the product chip is installed on the socket 22, and can also detect the connection status of each probe of the socket 22 to the line in the detection device 21.

[0038] S102: Connect the test connection groups in parallel in sequence to obtain a test circuit.

[0039] During the test process, the same signal of the sockets 22 in the same row or two adjacent rows can be tested as a test circuit 32. The parallel test can increase the test capacity and efficiency by many times. If a short circuit or open circuit occurs in a test connection group 31, the overall resistance of the test circuit 32 will be affected, thereby affecting the overall current and voltage of the test circuit 32.

[0040] S103: sampling a feedback signal of the test circuit, and determining a working state of each socket based on the feedback signal.

[0041] The feedback signal can be the resistance value of the test circuit 32, or the magnitude of the current or voltage. If the value represented by the feedback signal is consistent with the value of the normal operation of the socket 22, it is determined that the working state of each socket 22 is normal. Otherwise, it is an abnormal state and the circuit of the socket 22 or the detection device 21 needs to be debugged.

[0042] See also Figure 5 and Figure 6 , Figure 5 It is a schematic diagram of the connection structure of another implementation method of the testing method of the detection device of the present application; Figure 6 It is a flowchart of the testing steps of another implementation method of the testing method of the detection device of the present application.

[0043] like Figure 5 As shown, the socket 22 is arranged on the detection device 21. The dummy piece structure and the socket 22 structure in the connection structure diagram of another embodiment of the test method of the detection device 21 of the present application can refer to Figure 2 , Figure 3 The corresponding fake piece structure and test connectivity group 31 structure. Figure 2 As shown in the structure diagram of the test chip 11, in a specific embodiment, the test chip 11 has the same structure as the product chip, and the pins of the test chip 11 are provided with a key electrical connection relationship or the chip pins are short-circuited. Figure 3 The socket 22 shown is provided with probes and fixing springs, and the test chip 11 is correspondingly mounted on the springs through the fixing springs.

[0044] This is to prevent the chip mounted on the detection device 21 from being damaged during the test due to potential defects or damages of the detection device 21 when it is not in operation.

[0045] In an optional implementation, S201: performing a leakage current test on a detection device; in response to a qualified test result of the leakage current test, inserting a plurality of test chips into sockets of the detection device.

[0046] In the absence of a workload, the test detection device 21 includes a situation where current flows through an unexpected path (such as poor insulation or a tiny conductive path) in the socket 22. When this situation occurs, the leakage current test is considered to be unqualified.

[0047] A plurality of test chips 11 are plugged into the sockets 22 of the detection device 21 ; wherein the test chips 11 are plugged into the sockets 22 in a one-to-one correspondence, thereby obtaining a plurality of test connection groups 31 .

[0048] By inserting the test chip 11 to perform testing, the conductivity and working state between the probe of the socket 22 and the internal circuit of the probe can be tested, and the conductivity between the socket 22 and the detection device 21 can be tested.

[0049] The structure of the probe of the socket 22 is designed according to the pin structure of the product chip, so the pin structure of the corresponding test chip 11 is also designed according to the probe of the socket 22. In a specific embodiment, the monitoring device is an aging test device, the socket 22 is set on the aging test device, and the test chip 11 is electrically connected to the aging test device through the socket 22 to implement the test method of the detection device 21.

[0050] The test chip 11 and the socket 22 are plugged in one by one so that each socket 22 of the detection device 21 can simulate the working state during the product chip test. It can also simulate the elasticity and pressure bearing of the detection socket 22 when the product chip is installed on the socket 22, and can also detect the connection status of each probe of the socket 22 to the line in the detection device 21.

[0051] S202: Connect the test connectivity groups in parallel in sequence to obtain a test circuit.

[0052] During the test process, the same signal of the sockets 22 in the same row or two adjacent rows can be tested as a test circuit 32. The parallel test can increase the test capacity and efficiency by many times. If a short circuit or open circuit occurs in a test connection group 31, the overall resistance of the test circuit 32 will be affected, thereby affecting the overall current and voltage of the test circuit 32.

[0053] In an optional embodiment, the socket 22 is mounted to the detection device 21 via a mounting point 23 .

[0054] The socket 22 can be installed on the installation point 23 of the detection device 21 by welding or snapping. By testing the connectivity test group composed of the test chip 11 and the socket 22, the connectivity between the installation point 23 and the socket 22 can be tested, and the connectivity between the installation point 23 and the circuit in the detection device 21 can be tested. Not only can the working status of the socket 22 be determined, but also the location of the abnormality can be determined.

[0055] In an optional embodiment, the sockets 22 are distributed in an array.

[0056] The detection device 21 is provided with sockets 22 distributed in an array, which is convenient for integrated testing and maintenance of the detection device 21 and effectively improves the detection efficiency of the detection device 21. In a specific embodiment, the sockets 22 form an array of 12 columns and 12 rows on the detection device 21. In other embodiments, it can also be 10 columns and 10 rows or 15 columns and 15 rows, which is set according to the requirements of product testing.

[0057] The feedback signal of the sampling test circuit 32 is used to determine the working state of each socket 22 based on the feedback signal.

[0058] S203: Divide the multiple test connectivity groups into multiple circuit units; collect feedback signals of each circuit unit respectively, and determine the working state of the test circuit based on the feedback signals.

[0059] The feedback signal in the circuit unit 33 can be the resistance value of each circuit unit 33, or the magnitude of the current or voltage. If the value represented by the feedback signal is consistent with the value of the normal operation of the socket 22, it is determined that the working state of each socket 22 is normal, otherwise it is an abnormal state.

[0060] Corresponding to the array structure of the sockets 22, one or two columns of test connection groups 31 are set as a circuit unit 33. After the sockets 22 are mounted on the detection device 21 to form the mounting points 23 by welding or clamping, the internal circuits connected to the detection device 21 are connected to each mounting point 23, so that each socket 22 is connected in series to form a plurality of circuit units 33. In a specific embodiment, two columns, i.e., 24 test connection groups, are connected in series to form a circuit unit 33, and 6 circuit units 33 connected in parallel are formed on the test circuit 32.

[0061] S204: Determine the working status of each socket in the corresponding circuit unit based on the feedback signal of each circuit unit.

[0062] When it is determined that a circuit unit 33 has an abnormality, the test connectivity group 31 on the circuit unit 33 is tested separately to determine the test connectivity group 31 with the abnormality, or the test connectivity group 31 on the circuit unit 33 can be grouped to determine multiple sub-circuit units 33. For example, there are 24 test connectivity groups 31 on a circuit unit 33, and after grouping, there are 12 test connectivity groups 31 on a sub-circuit unit 33. By gradually narrowing the scope through half-grouping or multiple-grouping, the existing test connectivity groups 31 are determined, thereby determining the socket 22 whose working status is abnormal.

[0063] When the leakage current test fails or it is determined that the circuit unit 33 is abnormal, it is necessary to debug the circuit of the socket 22 or the detection device 21 and retest to ensure that the equipment to be detected can perform product testing normally.

[0064] See also Figure 7 , Figure 8 and Fig. 9 , Figure 7 It is a schematic diagram of the connection structure of another implementation method of the testing method of the detection device of the present application; Figure 8 yes Figure 7 A schematic structural diagram of a detection board according to another embodiment of the test method of the detection device of the present application; Fig. 9 It is a flowchart of the testing steps of another implementation method of the testing method of the detection device of the present application.

[0065] like Figure 7 As shown, Figure 7 The detection device 21 includes a control circuit 213, a tester 212 and a detection board 211 which are coupled to each other. The detection device 21 is arranged on the detection board 211 through a socket 22, and is connected to the tester 212 and the control circuit 213 through the detection board 211.

[0066] The dummy chip structure and the socket structure in the connection structure diagram of another embodiment of the test method of the detection device of the present application can refer to Figure 2 , Figure 3 Corresponding fake piece structure and test connectivity group structure. Figure 2 As shown in the test chip structure diagram, in a specific embodiment, the test chip has the same structure as the product chip, and the test chip pins are set with a key electrical connection relationship or the chip pins are short-circuited. Figure 3 The socket shown is provided with probes and fixing springs, and the test chip is correspondingly mounted on the springs through the fixing springs.

[0067] This is to prevent the chip mounted on the detection device 21 from being damaged during the test due to potential defects or damages of the detection device 21 when it is not in operation.

[0068] In an optional implementation, S301: selecting a corresponding test chip according to a probe structure of a socket; and short-circuiting the inside of the test chip.

[0069] During the production process, there are multiple product chips with different internal circuits but the same pin structure. The probe structure of the socket 22 is made according to the pin structure of the product chip, so that the socket 22 can be used for testing multiple product chips. However, if the same test chip 11 is made according to the product chip, it is necessary to make multiple test chips 11. The appearance and size of the multiple test chips 11 are consistent, which is easy to confuse and difficult to manage. In addition, due to the different internal circuits, it is impossible to fully test all the probes in the socket 22. Therefore, by short-circuiting the inside of the chip, it is possible to use one test chip 11 to test the socket 22 for product chips with the same pin structure.

[0070] S302: Perform a leakage current test on the detection device; in response to a qualified test result of the leakage current test, insert a plurality of test chips into the sockets of the detection device.

[0071] In the absence of a workload, the test detection device 21 includes a situation where current flows through an unexpected path (such as poor insulation or a tiny conductive path) in the socket 22. When this situation occurs, the leakage current test is considered to be unqualified.

[0072] A plurality of test chips 11 are plugged into the sockets 22 of the detection device 21 ; wherein the test chips 11 are plugged into the sockets 22 in a one-to-one correspondence, thereby obtaining a plurality of test connection groups 31 .

[0073] By inserting the test chip 11 to perform testing, the conductivity and working state between the probe of the socket 22 and the internal circuit of the probe can be tested, and the conductivity between the socket 22 and the detection device 21 can be tested.

[0074] The structure of the probe of the socket 22 is designed according to the pin structure of the product chip, so the pin structure of the corresponding test chip 11 is also designed according to the probe of the socket 22. In a specific embodiment, the detection device is an aging test board, the socket 22 is set on the aging test board, and the test chip 11 is electrically connected to the aging test board through the socket 22 to implement the test method of the detection device 21.

[0075] The test chip 11 and the socket 22 are plugged in one by one so that each socket 22 of the detection device 21 can simulate the working state during the product chip test. It can also simulate the elasticity and pressure bearing of the detection socket 22 when the product chip is installed on the socket 22, and can also detect the connection status of each probe of the socket 22 to the line in the detection device 21.

[0076] S303: Connect the test connection groups in parallel in sequence to obtain a test circuit.

[0077] During the test process, the same signal of the sockets 22 in the same row or two adjacent rows can be tested as a test circuit 32. The parallel test can increase the test capacity and efficiency by many times. If a short circuit or open circuit occurs in a test connection group 31, the overall resistance of the test circuit 32 will be affected, thereby affecting the overall current and voltage of the test circuit 32.

[0078] In an optional embodiment, the socket 22 is mounted to the detection device 21 via a mounting point 23 .

[0079] The socket 22 can be installed on the installation point 23 of the detection device 21 by welding or snapping. By testing the connectivity test group composed of the test chip 11 and the socket 22, the connectivity between the installation point 23 and the socket 22 can be tested, and the connectivity between the installation point 23 and the circuit in the detection device 21 can be tested. Not only can the working status of the socket 22 be determined, but also the location of the abnormality can be determined.

[0080] In an optional embodiment, the sockets 22 are distributed in an array.

[0081] The sockets 22 are distributed in an array on the detection board 211, which facilitates the detection device 21 to replace the detection board 211 according to the product chip testing requirements, integrate testing and maintenance, and effectively improve the detection efficiency of the detection device 21. In a specific embodiment, the sockets 22 form an array of 12 columns and 12 rows on the detection device 21. In other embodiments, it can also be 10 columns and 10 rows or 15 columns and 15 rows, which can be set according to the product testing requirements.

[0082] S304: Divide the multiple test connectivity groups into multiple circuit units.

[0083] Corresponding to the array structure of the sockets 22, one or two columns of test connection groups 31 are set as a circuit unit 33. After the sockets 22 are mounted on the detection device 21 to form the mounting points 23 by welding or clamping, the internal circuit of the detection device 21 is connected to each mounting point 23, so that each socket 22 is connected in series to form a plurality of circuit units 33. In a specific embodiment, two columns, i.e., 24 test connection groups, are connected in series to form a circuit unit 33, and six circuit units 33 connected in parallel are formed on the test circuit 32.

[0084] In an optional implementation, S305: collecting electrical signals of the test connection groups in the circuit unit after being connected in parallel.

[0085] In this embodiment, the test connection group 31 on the test board is connected in parallel with the tester 212, so that the tester 212 can obtain feedback signals of multiple circuit units 33. In a specific embodiment, the edge connector of the test board is inserted into the detection device 21 to achieve coupling with the tester 212 through the edge connector.

[0086] The feedback signal in the circuit unit 33 can be the resistance value of the test circuit 32, or the magnitude of the current or voltage. In an optional manner, the feedback signals of each circuit unit 33 are collected separately by a four-wire method. Specifically, in the detection step of the four-wire method, the excitation line and the detection line are connected to the two ends of the resistor to be measured, the excitation line is used to apply current, and the detection line is used to measure the voltage across the component to be measured, wherein the detection line has a voltage measurement function with high input impedance, and the shunt effect on the circuit can be ignored. According to Ohm's law (R=V / I), the resistance value of the resistor to be measured can be calculated, so the measurement result is more accurate.

[0087] S306: using the electrical signal to obtain the resistance value of the resistors of each test connection group in the circuit unit in parallel; if the resistance value of the resistor exceeds a preset threshold range, it is determined that the circuit unit is abnormal.

[0088] If the value indicated by the feedback signal is consistent with the value of the normal operation of the socket 22, it is determined that the working state of each socket 22 is normal; otherwise, it is an abnormal state. For example, when a test connection group 31 of a circuit unit 33 has a short circuit or an open circuit in the internal circuit of the socket 22, or between the installation point 23 and the socket 22, or between the installation point 23 and the detection device 21, the resistance value of the circuit unit 33 is much lower than the normal value, which may be a short circuit; or the resistance value is infinite or very high, which may be an open circuit, that is, the resistance value of the resistor exceeds the preset threshold range, it can be determined that the circuit unit 33 is abnormal.

[0089] S307: Determine the working status of each socket in the corresponding circuit unit based on the feedback signal of each circuit unit.

[0090] When it is determined that a circuit unit 33 has an abnormality, the test connectivity group 31 on the circuit unit 33 is tested separately to determine the test connectivity group 31 with the abnormality, or the test connectivity group 31 on the circuit unit 33 can be grouped to determine multiple sub-circuit units 33 (not shown). For example, there are 24 test connectivity groups 31 on a circuit unit 33, and after grouping, there are 12 test connectivity groups 31 on a sub-circuit unit 33. By gradually narrowing the scope through half-grouping or multiple-grouping, the existing test connectivity groups 31 are determined, thereby determining the socket 22 whose working status is abnormal.

[0091] When the leakage current test fails or it is determined that the circuit unit 33 is abnormal, it is necessary to debug the circuit of the socket 22 or the detection device 21 and retest to ensure that the equipment to be detected can perform product testing normally.

[0092] The testing method of the detection device 21 provided in the above embodiment can determine the working status of the detection device 21 and debug the circuit of the socket 22 or the detection device 21 in time, which can greatly improve the efficiency and accuracy of the detection process of the detection device 21. The principle is simple, practical and convenient, which can speed up the completion of product testing and delivery, reduce the early research and development testing costs of the product, and meet production needs.

[0093] The present application also provides a detection device, which can implement the testing method of any of the above-mentioned detection devices and perform product chip testing.

[0094] See also Fig.10 , Fig.10 It is a schematic structural diagram of an implementation method of the detection device of the present application.

[0095] Wherein, the detection device 21 comprises:

[0096] Socket 22, socket 22 is used to install the test chip 11. In the product chip test, the product chip to be tested is installed in the detection device 21 through the socket 22. When the product chip is inserted into the socket 22, the socket 22 is electrically connected to the pins of the product chip. The detection device 21 sends a test signal to the product chip through the socket 22, or reads the test signal output by the product chip, and transmits the test signal to the detection device 21 for analysis to determine the function and performance of the product chip.

[0097] In order to prevent the chip mounted on the detection device 21 from being damaged due to potential defects or damage in the non-working state of the detection device 21 during the test process, it is necessary to test the working state of the detection device 21, especially the working state of the socket 22, and the good contact between the socket 22, the detection device 21 and the chip, which is crucial to the accuracy of the product chip test. The test process of the detection device 21 has also become a necessary link in the product chip test.

[0098] Among them, the detection device 21 is used to form multiple test connection groups 31 by plugging the test chip 11 into the socket 22 one by one; the test connection groups 31 are connected in parallel to form a test circuit 32; the feedback signal of the sample test circuit 32 is sampled, and the working status of each socket 22 is determined based on the feedback signal.

[0099] The feedback signal sampled by the detection device 21 can be the resistance value of the test circuit 32, or the magnitude of the current and voltage. If the value represented by the feedback signal is consistent with the value of the normal operation of the socket 22, it is determined that the working state of each socket 22 is normal, otherwise it is an abnormal state.

[0100] The present application also provides another embodiment of the detection device. Specifically, the structural schematic diagram of another embodiment of the detection device of the present application can be referred to respectively. Fig.10 and Figure 7 A schematic structural diagram of an embodiment of the detection device of the present application; and a schematic connection structural diagram of another embodiment of the test method of the detection device of the present application.

[0101] Wherein, the detection device 21 comprises:

[0102] Socket 22, socket 22 is used to install the test chip 11. In the product chip test, the product chip to be tested is installed in the detection device 21 through the socket 22. When the product chip is inserted into the socket 22, the socket 22 is electrically connected to the pins of the product chip. The detection device 21 sends a test signal to the product chip through the socket 22, or reads the test signal output by the product chip, and transmits the test signal to the detection device 21 for analysis to determine the function and performance of the product chip.

[0103] In order to prevent the chip mounted on the detection device 21 from being damaged due to potential defects or damage in the non-working state of the detection device 21 during the test process, it is necessary to test the working state of the detection device 21, especially the working state of the socket 22, and the good contact between the socket 22, the detection device 21 and the chip, which is crucial to the accuracy of the product chip test. The test process of the detection device 21 has also become a necessary link in the product chip test.

[0104] Among them, the detection device 21 is used to form multiple test connection groups 31 by plugging the test chip 11 into the socket 22 one by one; the test connection groups 31 are connected in parallel to form a test circuit 32; the feedback signal of the sample test circuit 32 is sampled, and the working status of each socket 22 is determined based on the feedback signal.

[0105] The feedback signal sampled by the detection device 21 can be the resistance value of the test circuit 32, or the magnitude of the current and voltage. If the value represented by the feedback signal is consistent with the value of the normal operation of the socket 22, it is determined that the working state of each socket 22 is normal, otherwise it is an abnormal state.

[0106] In an optional embodiment, the sockets 22 are distributed in an array and are arranged on the detection device 21 via mounting points 23 .

[0107] Corresponding to the array structure of the sockets 22, one or two columns of test connection groups 31 are set as a circuit unit 33. After the sockets 22 are mounted on the detection device 21 to form the mounting points 23 by welding or clamping, the internal circuit of the detection device 21 is connected to each mounting point 23, so that each socket 22 is connected in series to form a plurality of circuit units 33. In a specific embodiment, two columns, i.e., 24 test connection groups, are connected in series to form a circuit unit 33, and six circuit units 33 connected in parallel are formed on the test circuit 32.

[0108] The socket 22 can be installed on the installation point 23 of the detection device 21 by welding or snapping. By testing the connectivity test group composed of the test chip 11 and the socket 22, the connectivity between the installation point 23 and the socket 22 can be tested, and the connectivity between the installation point 23 and the circuit in the detection device 21 can be tested. Not only can the working status of the socket 22 be determined, but also the location of the abnormality can be determined.

[0109] In an optional embodiment, the socket 22 is arranged on the aging test board, and the test chip 11 is electrically connected to the aging test board through the socket 22 to realize the detection device 21. The detection device 21 includes a control circuit 213, a tester 212 and a detection board 211 coupled to each other, and is arranged on the detection board 211 through the socket 22, and is connected to the tester 212 and the control circuit 213 through the detection board 211. In a specific embodiment, the test board of the monitoring device is an aging test board.

[0110] When the leakage current test fails or it is determined that the circuit unit 33 is abnormal, it is necessary to debug the circuit of the socket 22 or the detection device 21 and retest to ensure that the equipment to be detected can perform product testing normally.

[0111] Through the above method, a testing method and a testing device for a detection device are provided, which can determine the working status of the detection device and debug the circuit of the socket or the detection device in time, which can greatly improve the efficiency and accuracy of the detection process of the detection device. The principle is simple, practical and convenient, which can speed up the completion of product testing and delivery, reduce the early research and development testing costs of the product, and meet production needs.

[0112] In the several embodiments provided in the present application, it should be understood that the disclosed systems and devices can be implemented in other ways. For the technical solutions in the embodiments of the present application, it is obvious that the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application. For example, the device implementation described above is only schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0113] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0114] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "coupled", "connected", "connected", "set", and "installed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0115] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0116] In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0117] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A testing method for a detection device, characterized in that: The test method includes: Inserting a plurality of test chips into the sockets of the detection device; wherein the test chips are inserted into the sockets in a one-to-one correspondence to obtain a plurality of test connection groups; Connecting the test connection groups in parallel sequentially to obtain a test circuit; The test circuit is sampled to obtain a feedback signal, and the working state of each of the sockets is determined based on the feedback signal.

2. The testing method according to claim 1, characterized in that: in, The sockets are distributed in an array; the step of sampling the feedback signal of the test circuit and determining the working state of each of the sockets based on the feedback signal comprises: Dividing the plurality of test connectivity groups to form a plurality of circuit units; respectively collecting feedback signals of the circuit units, and determining the working state of the circuit units based on the feedback signals; The working state of each socket in the corresponding circuit unit is determined based on the feedback signal of each circuit unit.

3. The testing method according to claim 2, characterized in that: The step of determining the working state of each socket in the corresponding circuit unit based on the feedback signal of each circuit unit comprises: In response to determining that the working state of the circuit unit is abnormal based on the feedback signal, each socket in the circuit unit is detected in turn to determine the position of the abnormal socket.

4. The testing method according to claim 2 or 3, characterized in that: The step of respectively collecting the feedback signals of the circuit units and determining the working state of the circuit units based on the feedback signals comprises: The feedback signals of the circuit units are collected respectively by a four-wire method.

5. The testing method according to claim 2 or 3, characterized in that: The step of respectively collecting the feedback signals of the circuit units and determining the working state of the circuit units based on the feedback signals comprises: Collecting electrical signals of the test connection groups in the circuit unit after being connected in parallel; Using the electrical signal, obtain the resistance value of the resistors of the test connection groups in the circuit unit after being connected in parallel; If the resistance value of the resistor exceeds a preset threshold range, it is determined that an abnormality exists in the circuit unit.

6. The testing method according to claim 1, characterized in that: The step of plugging a plurality of test chips into the sockets of the detection device, wherein the test chips are plugged into the sockets in a one-to-one correspondence to obtain a plurality of test connectivity groups comprises: The corresponding test chip is selected according to the probe structure of the socket; and the inside of the test chip is short-circuited.

7. The testing method according to claim 1, characterized in that: The step of sequentially connecting the test connection groups in parallel to obtain a test circuit comprises: The socket is mounted to the detection device via a mounting point.

8. The testing method according to claim 1, characterized in that: The step of inserting a plurality of test chips into the sockets of the detection device comprises: Performing a leakage current test on the detection device; In response to the leakage current test result being qualified, a plurality of test chips are plugged into the sockets of the detection device.

9. A detection device, comprising a socket, wherein the socket is used to install a test chip; in, The detection device is used to form a plurality of test connection groups by plugging the test chips into the sockets in a one-to-one correspondence; the test connection groups are sequentially connected in parallel to form a test circuit; A feedback signal of the test circuit is sampled, and a working state of each of the sockets is determined based on the feedback signal.

10. The detection device according to claim 9, characterized in that: The sockets are distributed in an array and are arranged on the detection device through mounting points.

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